CN102881599B - BGA plants ball technique - Google Patents
BGA plants ball technique Download PDFInfo
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- CN102881599B CN102881599B CN201210346219.8A CN201210346219A CN102881599B CN 102881599 B CN102881599 B CN 102881599B CN 201210346219 A CN201210346219 A CN 201210346219A CN 102881599 B CN102881599 B CN 102881599B
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- bga
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Abstract
The invention discloses a kind of BGA and plant ball technique, belong to microelectronics technology. It can hold BGA in bulk by carrier, then carrier is overlapped with steel mesh, carries out batch paste solder printing, and not only easy BGA reprocesses operation, has improved production efficiency; And without using the expensive ball chuck tool of planting, thereby reduce cost.
Description
Technical field
The present invention relates to a kind of BGA and plant ball technique, belong to microelectronics technology.
Background technology
Along with the IC(of ball grid array structure is hereinafter referred to as BGA) development and the extensive use of encapsulation, it will become the optimal selection of high density, high-performance, multi-functional encapsulation. Due to the special packing forms of BGA, solder joint is positioned at package bottom and for being hemispheric tin ball, the composition of tin ball is generally Sn/Ag/Cu, fusing point is 217 DEG C, in welding process, tin club and tin cream fuse into one, and packaging body and pcb board pad are connected together. If but welding appearance is bad, need to be disassembled to reprocess, BGA tin club after dismounting is peeled off by pcb board, leave solder joint not of uniform size, therefore, think that secondary uses BGA, just must plant ball processing to it, namely again on solder joint, add scolding tin, make the ball size on solder joint consistent.
Existing ball-establishing method has following two kinds, method one be with special plant ball chuck tool first paste solder printing on the pad of BGA, on pad, add again a certain size tin ball, tin cream plays the effect that sticks tin ball, heating in process subsequently, tin ball and tin cream are just fused together, thereby form new solder joint on BGA pad. Its specific operation process is: 1, be first ready to the special ball chuck tool of planting, clean and dry with alcohol, in order to avoid tin ball rolls and has some setbacks planting on ball chuck tool; 2, the chip that need to plant ball be placed on plant on ball chuck tool fixing; 3, tin cream naturally thawed and stirred, being then evenly coated onto on scraping blade; 4, on positioning pedestal, put paste solder printing frame print solder paste, and angle, the dynamics will as far as possible control good hand's tin scraping cream time and the speed pulling, after completing, throw off gently paste solder printing frame; 5, confirm that the each pad on BGA is evenly printed on after tin cream, then tin ball frame is put to location, then put into tin ball, ball chuck tool is planted in shake, allows tin ball roll into mesh, confirms just can keep tin ball de-plate well after each mesh has a tin ball; 6, the BGA that has just planted tin ball is taken out with Reflow Soldering baking from positioning pedestal, amount I is toasted with heat gun. So just complete and planted ball. This method operating procedure is many, and the production cycle is long, and production cost is high, the special ball chuck tool costliness of planting, and efficiency is low, is merely able to carry out one single chip operation at every turn.
Another method and first method are similar, just change tin cream into weld-aiding cream, and operating process is still very loaded down with trivial details, and the production cycle is long, and cost is high, efficiency is low, and production quality is unstable, and heating process is easily fallen tin ball.
Summary of the invention
For addressing the above problem, the invention provides one simple to operate, cost-effective BGA plants ball technique.
The present invention for the technical scheme that its problem of solution adopts is:
BGA plants ball technique, comprises the following steps:
1) steel mesh is installed to and on printing machine, carries out contraposition, printing machine is the printing machine of common production and application, steel mesh is with to be generally arranged on plate size on printing machine consistent, so other fixture need to be installed on printing machine again, can directly be installed on the installing rack of printing machine, difference is, steel mesh is provided with the through hole corresponding with phase of solder joint on BGA, so that tin cream can just be coated on solder joint;
2) tin cream thawed and stir, being then evenly coated on steel mesh;
3) several BGA are contained on carrier, described carrier is a flat board, which is provided with some width groove consistent with BGA width, and its length is just the length of several BGA after placed side by side, and its degree of depth is consistent with the height of BGA, 4) carrier is installed on the platform of printing machine, carries out paste solder printing. described steel mesh and carrier are provided with locating hole so that carrier is accurately positioned on steel mesh, through hole on steel mesh is just in time coordinated with the solder joint of BGA, this locating hole can be half-blind hole, printing machine is provided with two-way camera, two-way camera is between steel mesh and carrier, can be irradiated to locating hole on steel mesh and carrier simultaneously, then the position feedback of locating hole on steel mesh and carrier to the computer on printing machine, computer drives the motor on printing machine again, the platform of carrier has been placed in adjustment, make the position of positioning hole of steel mesh and carrier corresponding one by one, be reached for the object of carrier location, then two-way camera is removed, motor drives steel mesh to overlap with carrier again, print,
5), after being completed for printing, check whether the tin cream on each BGA pad prints evenly;
6) after confirming that printing is no problem, BGA is put into Reflow Soldering baking;
7) complete and plant ball.
The invention has the beneficial effects as follows: easy BGA reprocesses operation, has improved production efficiency; And without using the expensive ball chuck tool of planting, thereby reduce cost.
Brief description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is operational flowchart of the present invention;
Fig. 2 is the structural representation of carrier of the present invention;
Fig. 3 is that BGA is arranged on the schematic diagram on carrier;
Fig. 4 is the structural representation of steel mesh of the present invention;
Fig. 5 is the structure diagram of BGA of the present invention;
Fig. 6 is that carrier of the present invention is arranged on the schematic diagram on steel mesh.
Detailed description of the invention
As shown in Figure 1, BGA plants ball technique, comprises the following steps:
Step S1, installs to steel mesh 2 on the installing rack 4 of printing machine and carries out contraposition, and the printing machine that printing machine is common production and application can be full-automatic, semi-automaticly or manual, and the present invention adopts full automatic printing machine, to enhance productivity. Steel mesh 2 is with to be generally arranged on plate size on printing machine consistent, so other fixture need to be installed on printing machine again, difference is, as shown in Figure 4, steel mesh 2 is provided with the through hole 21 corresponding with phase of solder joint on BGA, so that tin cream can just be coated on solder joint.
It should be noted that, the diameter of described through hole 21 is through calculating, and below in conjunction with accompanying drawing 5, and BGA taking spot pitch as 0.5mm is example, computational methods is described: the distance that the center of BGA solder joint is adjacent the center of solder joint is d=0.5mm; The solder joint tin radius of a ball is R1=0.15mm; BGA gross thickness is h1=0.94mm, packaging body thickness is h2=0.74mm。
The principle equating with the volume of stanniferous amount in tin cream according to the tin sphere volume of device solder joint, the radius R of through hole 212Thickness h with steel mesh 23Can calculate by following formula:
Π×R1 2×（h1-h2-R1）+1/2×4/3×Π×R1 3=0.8×Π×R2 2×h3
Wherein Π is pi, and 0.8 is the volume ratio (when crossing Reflow Soldering, scaling powder can be lost) of metal in tin cream, obtains following formula after simplified formula:
15×R1 2×（h1-h2-R1）+10×R1 3=12×R2 2×h3
Substitution numerical value d=0.5, R1=0.15，h1=0.94，h2After=0.74, obtain following formula:
0.00421875=R2 2×h3
The thickness h of steel mesh 2 of the present invention3For 0.15mm, diameter R that can calculating place through hole 212=0.1677mm。
Step S2, thaws tin cream and stirs, and is then evenly coated on steel mesh 2.
Step S3, is contained in several BGA on carrier 1, as shown in accompanying drawing 2, accompanying drawing 3, described carrier 1 is a flat board, which is provided with some width groove consistent with BGA width 11, its length is just the length of several BGA after placed side by side, and its degree of depth is consistent with the height of BGA.
Step S4, as shown in Figure 6, is installed to carrier 1 on the platform 5 of printing machine, carries out paste solder printing. Described carrier 1 is provided with locating hole 12 so that carrier 1 is accurately positioned on steel mesh 2, and the through hole 21 on steel mesh 2 is just in time coordinated with the solder joint of BGA, and this locating hole 12 can be half-blind hole. Printing machine is provided with two-way camera 3, two-way camera 3 is between steel mesh 2 and carrier 1, can be irradiated to locating hole 12 on steel mesh 2 and carrier 1 simultaneously, then the position feedback of locating hole 12 on steel mesh 2 and carrier 1 to the computer on printing machine, computer drives the motor on printing machine again, the platform 5 of carrier 1 has been placed in adjustment, make locating hole 12 positions of steel mesh 2 and carrier 1 corresponding one by one, be reached for the object that carrier 1 is located, then two-way camera 3 is removed, motor drives steel mesh 2 to overlap with carrier 1 again, prints.
Step S5, after being completed for printing, checks whether the tin cream on each BGA pad prints evenly, if inhomogeneous, needs again to print.
Step S6, after the printing of confirming is no problem, is put into Reflow Soldering baking by BGA.
Step S7, completes and plants ball.
Described in above description, be only principle of the present invention and embodiment, everyly carry out any simple amendment and variation according to essence of the present invention, within all belonging to protection domain of the presently claimed invention.
Claims (3)
1.BGA plants ball technique, it is characterized in that, comprises the following steps:
1) steel mesh is installed to and on printing machine, carries out contraposition and fix;
2) tin cream is coated onto on steel mesh;
3) several BGA are contained on carrier;
4) carrier is installed on printing machine, irradiate by being arranged on printing machine and at the two-way camera between steel mesh and carrier the locating hole being arranged on steel mesh and carrier simultaneously, and the position feedback of locating hole on steel mesh and carrier to the computer on printing machine, computer drives the motor on printing machine again, the platform of carrier has been placed in adjustment, make the position of positioning hole of steel mesh and carrier corresponding one by one, then remove two-way camera, control motor and drive steel mesh to overlap with carrier, carry out paste solder printing;
5), after being completed for printing, check whether the tin cream on each BGA pad prints evenly;
6) after confirming that printing is no problem, be put into Reflow Soldering baking;
7) complete and plant ball.
2. BGA according to claim 1 plants ball technique, it is characterized in that, described carrier is a flat board, which is provided with some width groove consistent with BGA width.
3. BGA according to claim 1 plants ball technique, it is characterized in that, described steel mesh is provided with the through hole corresponding with phase of solder joint on BGA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210346219.8A CN102881599B (en) | 2012-09-18 | 2012-09-18 | BGA plants ball technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210346219.8A CN102881599B (en) | 2012-09-18 | 2012-09-18 | BGA plants ball technique |
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| Publication Number | Publication Date |
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| CN102881599A CN102881599A (en) | 2013-01-16 |
| CN102881599B true CN102881599B (en) | 2016-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210346219.8A Expired - Fee Related CN102881599B (en) | 2012-09-18 | 2012-09-18 | BGA plants ball technique |
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Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103252552B (en) * | 2013-04-02 | 2015-12-23 | 深圳市卓茂科技有限公司 | A kind of BGA automatic ball-embedding machine |
| CN103231138B (en) * | 2013-05-08 | 2015-10-07 | 无锡江南计算技术研究所 | BGA plants ball single-point repair method |
| CN105081497A (en) * | 2015-07-17 | 2015-11-25 | 伟创力电子技术(苏州)有限公司 | Preparation method for producing BGA plant balls in batches on basis of SMT process |
| CN106098575B (en) * | 2016-06-23 | 2018-11-09 | 宁波麦博韦尔移动电话有限公司 | A kind of chip repairing batch ball-establishing method |
| CN106236092A (en) * | 2016-08-22 | 2016-12-21 | 合肥芯福传感器技术有限公司 | EIT electrod-array and manufacture method thereof and device based on this electrod-array |
| CN110931372B (en) * | 2019-11-28 | 2021-08-10 | 廖文明 | Ball forming and ball planting method for BGA chip printing solder paste |
| CN115008878A (en) * | 2022-06-17 | 2022-09-06 | 西安微电子技术研究所 | Tin paste printing device and method for BTC packaging device for repair |
| CN115458420B (en) * | 2022-09-16 | 2024-04-02 | 惠州市则成技术有限公司 | Ball mounting process of IC carrier plate |
| CN115483111B (en) * | 2022-09-26 | 2024-08-27 | 上海美维科技有限公司 | FCBGA (ball grid array) ball-mounting and packaging substrate preparation method |
| CN118197928B (en) * | 2024-05-16 | 2024-07-30 | 清河电子科技(山东)有限责任公司 | Ball planting method, device, equipment and medium compatible with single Unit multi-size design |
Citations (3)
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| CN200993959Y (en) * | 2006-12-12 | 2007-12-19 | 英业达股份有限公司 | Device for planting solder balls |
| CN101150080A (en) * | 2006-09-21 | 2008-03-26 | 伟创力电子科技（上海）有限公司 | Ball replanting technology for global array encapsulation chip |
| CN101777503A (en) * | 2008-12-03 | 2010-07-14 | 株式会社日立工业设备技术 | Solder ball printer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5787580A (en) * | 1996-11-19 | 1998-08-04 | Lg Information & Communications, Ltd. | Method for making radio-frequency module by ball grid array package |
| CN102157403A (en) * | 2010-02-11 | 2011-08-17 | 芯讯通无线科技（上海）有限公司 | Multiple chip ball mounting device and method |
| CN102368472A (en) * | 2011-10-28 | 2012-03-07 | 三星半导体(中国)研究开发有限公司 | Ball placement equipment and ball placement method |
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- 2012-09-18 CN CN201210346219.8A patent/CN102881599B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101150080A (en) * | 2006-09-21 | 2008-03-26 | 伟创力电子科技（上海）有限公司 | Ball replanting technology for global array encapsulation chip |
| CN200993959Y (en) * | 2006-12-12 | 2007-12-19 | 英业达股份有限公司 | Device for planting solder balls |
| CN101777503A (en) * | 2008-12-03 | 2010-07-14 | 株式会社日立工业设备技术 | Solder ball printer |
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| CN102881599A (en) | 2013-01-16 |
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Inventor after: Liu Huimin Inventor after: Peng Yongqiang Inventor before: Huang Qinghua |
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Free format text: CORRECT: INVENTOR; FROM: HUANG QINGHUA TO: LIU HUIMIN PENG YONGQIANG |
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