CN203521378U - Reballing equipment used in ball grid array structure - Google Patents
Reballing equipment used in ball grid array structure Download PDFInfo
- Publication number
- CN203521378U CN203521378U CN201320620842.8U CN201320620842U CN203521378U CN 203521378 U CN203521378 U CN 203521378U CN 201320620842 U CN201320620842 U CN 201320620842U CN 203521378 U CN203521378 U CN 203521378U
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- Prior art keywords
- ball
- axis
- planting
- workbench
- transfer means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 62
- 239000003292 glue Substances 0.000 claims abstract description 42
- 230000033001 locomotion Effects 0.000 claims abstract description 24
- 230000007480 spreading Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000010023 transfer printing Methods 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Landscapes
- Cultivation Receptacles Or Flower-Pots, Or Pots For Seedlings (AREA)
Abstract
The utility model relates to reballing equipment used in a ball grid array structure. The reballing equipment comprises a glue supply mechanism (1), a transfer printing mechanism (2), a ball supply mechanism (3), a reballing mechanism (4), a workbench (5), a residual ball detection mechanism (6), an X, Z axis movement mechanism (7) and a bottom stand (8). The glue supply mechanism (1) and the ball supply mechanism (3) are correspondingly arranged on the top of the bottom stand (8). The transfer printing mechanism (2) is set up on the X, Z axis movement mechanism (7) and is positioned above the glue supply mechanism (1). The workbench (5) is arranged between the glue supply mechanism (1) and the ball supply mechanism (3). The reballing mechanism (4) is set up on the X, Z axis movement mechanism (7) and is positioned above the workbench (5). The residual ball detection mechanism (6) is arranged at one side of the workbench (5). In comparison with the prior art, mechanisms cooperate with each other in the utility model. Thus, production efficiency is raised.
Description
Technical field
The utility model relates to one kind and plants ball equipment, especially relates to the ball equipment of planting using in ball grid array structure.
Background technology
The wafer that semiconductor preceding working procedure produces needs packaging technology just can become final chip.BGA packaged type has become the market mainstream, and the advantages such as BGA encapsulation is little with its high density, volume, good heat dissipation, electrical property excellence are being widely applied aspect large scale integrated circuit.A core process of BGA encapsulation technology is planted ball exactly.At present domestic rework equipments of planting ball and one single chip for ceramic chip is all manual equipment or manual, adopts the mode of steel mesh brush scaling powder, tin cream and tin ball to plant ball.Such as the ball mode of planting of the employings such as patent CN200610087137.0, use and plant ball container or plant ball scraper plate exactly, tin ball is leaked down to be placed into from the web plate of porous the solder joint that chip is corresponding.
These manual equipments and manual have following inevitable shortcoming:
1, low precision, therefore once can only plant several chips, and negligible amounts, affects production capacity.
2, implant ball is consuming time longer, and product yield is low.
3, the manual ball of planting needs a large amount of operating personnel, and recruitment cost rises year by year, and very big normal the carrying out producing of impact of the fluctuation of the production capacity brought of flow of personnel and yield.
4, tin cream and tin ball contain heavy metal, and operating personnel's Long contact time also has certain injury to human body.
Utility model content
The purpose of this utility model is exactly in order to overcome the defect that above-mentioned prior art exists, to provide a kind of by each unit mechanisms cooperatively interacts, production efficiency the is high ball equipment of planting using in ball grid array structure.
The purpose of this utility model can be achieved through the following technical solutions:
The ball equipment of planting using in ball grid array structure, comprises glue feed mechanism, transfer means, and ball mechanism, ball attachment machine structure, workbench, remaining ball testing agency, X, Z axis motion, bottom pallet,
Described glue feed mechanism and ball mechanism correspondence are arranged on the top of bottom pallet, described transfer means is erected on X, Z axis motion and is positioned at the top of glue feed mechanism, described workbench is located between glue feed mechanism and ball mechanism, described ball attachment machine framework is located on X, Z axis motion and is positioned at the top of workbench, and described remaining ball testing agency is located at workbench one side.
Described workbench is for placing the carrier that chip is housed.
Described glue feed mechanism and transfer means carry out a glue to chip in pallet, and glue feed mechanism is provided with spreading knife and supplies glue box.
Described ball mechanism and ball attachment machine structure are planted ball to chip in pallet.
Described remaining ball detects and removes mechanism and detects and remove planting after ball remaining ball on ball attachment machine structure.
Described X, Z axis motion are comprised of transfer means Z axis, transfer means X-axis, ball attachment machine structure Z axis, ball attachment machine structure X-axis.
Described transfer means Z axis, transfer means X-axis are controlled the motion of transfer means in Z axis and X-direction.
Described ball attachment machine structure Z axis, ball attachment machine structure X-axis are controlled the motion of ball attachment machine structure in Z axis and X-direction.
Described workbench is set in workbench Y-axis, can move along Y direction.
The described ball equipment of planting comprises well safety top cover, is located on the pallet of bottom, and safety top cover consists of shell body division board, touch-screen, button and three look alarm lamps.
Compared with prior art, the utlity model has following advantage:
1, this equipment automatically completes and smears scaling powder and plant ball process, has improved production efficiency.
2, operating personnel of this device just can complete whole operation and have very high production capacity, have saved human cost.
3, can corresponding various forms of targets and various types of chip, different targets only needs more exchange device tool and carrier.
Accompanying drawing explanation
Main TV structure schematic diagram when Fig. 1 is the utility model work;
Plan structure schematic diagram when Fig. 2 is the utility model work;
Fig. 3 is structural representation of the present utility model.
In figure, 1 removes mechanism, 7 for X, Z axis motion, 8 are for bottom pallet, 9 is for transfer means Z axis, 10 is for transfer means X-axis, 11 is for ball attachment machine structure Z axis, 12 is for ball attachment machine structure X-axis, 13 is for workbench Y-axis, 14 is for chip tray mounting table, 15 is for useless ball box, 16 is for ball mechanism ball box, 17 is for spreading knife, 18 is for being safety top cover for glue box, 19 for remaining ball detects for workbench, 6 for ball attachment machine structure, 5 for ball mechanism, 4 for transfer means, 3 for glue feed mechanism, 2.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is elaborated.
Embodiment
The ball equipment of planting using in ball grid array structure, its structure as Figure 1-3, comprises glue feed mechanism 1, transfer means 2, ball mechanism 3, ball attachment machine structure 4, workbench, 5, remaining ball testing agency, 6, X, Z axis motion, 7, bottom pallet 8.
Workbench 5 is for placing the carrier that chip is housed, be set in workbench Y-axis 13, can move along Y direction, on workbench 5, be also provided with chip tray mounting table 14, useless ball box 15, in 2 pairs of pallets of glue feed mechanism 1 and transfer means, chip carries out a glue, and glue feed mechanism 1 is provided with spreading knife 17 and supplies glue box 18.In 4 pairs of pallets of ball mechanism 3 and ball attachment machine structure, chip is planted ball.Ball mechanism 3 is provided with ball mechanism ball box 16.Remaining ball detects and removes 6 pairs, mechanism and plants after ball remaining ball on ball attachment machine structure 4 and detect and remove.X, Z axis motion 7 are comprised of transfer means Z axis 9, transfer means X-axis 10, ball attachment machine structure Z axis 11, ball attachment machine structure X-axis 12, and transfer means Z axis 9 wherein, transfer means X-axis 10 are controlled the motion of transfer means 2 in Z axis and X-direction.Ball attachment machine structure Z axis 11, ball attachment machine structure X-axis 12 are controlled the motion of ball attachment machine structure 4 in Z axis and X-direction.In addition, plant ball equipment and comprise well safety top cover 19, be located on the pallet 8 of bottom, safety top cover 19 consists of shell body division board, touch-screen, button and three look alarm lamps.
During use, operator is placed on the pallet that chip is housed the feeding area of workbench 5, presses start button, and feeding area vacuum is opened with fixed chip.As fruit chip, place mistake and report to the police, remind operating personnel again to put chip.Spreading knife 17 reciprocating motions of glue feed mechanism 1, strike off for the scaling powder in glue box 18, complete for glue.Transfer means 2 is moved to and is dipped in glue position by transfer means X-axis 10, behind in-position, glue is dipped in 9 declines of transfer means Z axis, after transfer means dips in glue, by transfer means X-axis 10, move to chip point glue position, workbench 5 is also moved to and is dipped in glue position by workbench Y-axis 13 simultaneously, transfer means Z axis 9 starts to decline, and chip in pallet is carried out to a glue, and glue feed mechanism 1 also carries out the glue that supplies next time simultaneously.
After scaling powder transfer printing, transfer means Z axis 9 rises, and by transfer means X-axis 10, is moved to and is dipped in glue position.Ball attachment machine structure 4 moves to ball mechanism 3 by ball attachment machine structure X-axis 12 and dodges position for ball afterwards, ball mechanism 3 starts for ball operation, after ball operation, ball attachment machine structure 4 moves to suction ball position by ball attachment machine structure X-axis 12, ball attachment machine structure Z axis 11 declines, start to inhale ball action, after inhaling ball, ball attachment machine structure 4 rises, by ball attachment machine structure X-axis 12, move to and plant ball position, workbench 5 also moves to plants ball position, and ball attachment machine structure 4 starts to plant ball, and ball mechanism 3 starts to supply ball operation simultaneously.
After planting ball, ball attachment machine structure 4 rises to detection height and position, by ball attachment machine structure X-axis 12, moving to remaining ball testing agency 6 detects, if there is remaining ball, ball attachment machine structure 4 moves to useless ball box 15 places, remove on ball attachment machine structure 4 after remaining ball, workbench 5 moves to discharging area and reminds operating personnel to carry out blanking operation.If there is no remaining ball, workbench 5 first motions are to discharging area and remind operating personnel to carry out blanking operation.
Claims (9)
1. the ball equipment of planting using in ball grid array structure, it is characterized in that, comprise glue feed mechanism (1), transfer means (2), ball mechanism (3), ball attachment machine structure (4), workbench (5), remaining ball testing agency (6), X, Z axis motion (7), bottom pallet (8)
Described glue feed mechanism (1) and ball mechanism (3) correspondence are arranged on the top of bottom pallet (8), described transfer means (2) is erected at the top that X, Z axis motion (7) went up and be positioned at glue feed mechanism (1), described workbench (5) is located between glue feed mechanism (1) and ball mechanism (3), described ball attachment machine structure (4) is erected at the top that X, Z axis motion (7) went up and be positioned at workbench (5), and described remaining ball testing agency (6) is located at workbench (5) one sides.
2. the ball equipment of planting using in ball grid array structure according to claim 1, is characterized in that, described workbench (5) is placed the carrier that chip is housed, and is set in workbench Y-axis and along Y direction and moves.
3. the ball equipment of planting using in ball grid array structure according to claim 1, it is characterized in that, described glue feed mechanism (1) and transfer means (2) are to chip point glue in pallet, and glue feed mechanism (1) is provided with spreading knife (17) and supplies glue box (18).
4. the ball equipment of planting using in ball grid array structure according to claim 1, is characterized in that, described ball mechanism (3) and ball attachment machine structure (4) are to chip ball-planting in pallet.
5. the ball equipment of planting using in ball grid array structure according to claim 1, is characterized in that, described remaining ball detects and removes mechanism (6) the upper remaining ball of ball attachment machine structure (4) after planting ball is detected and removed.
6. the ball equipment of planting using in ball grid array structure according to claim 1, it is characterized in that, described X, Z axis motion (7) are comprised of transfer means Z axis (9), transfer means X-axis (10), ball attachment machine structure Z axis (11), ball attachment machine structure X-axis (12).
7. the ball equipment of planting using in ball grid array structure according to claim 6, is characterized in that, described transfer means Z axis (9), transfer means X-axis (10) are controlled the motion of transfer means (2) in Z axis and X-direction.
8. the ball equipment of planting using in ball grid array structure according to claim 6, is characterized in that, described ball attachment machine structure Z axis (11), ball attachment machine structure X-axis (12) are controlled the motion of ball attachment machine structure (4) in Z axis and X-direction.
9. the ball equipment of planting using in ball grid array structure according to claim 1, it is characterized in that, the described ball equipment of planting comprises well safety top cover, is located at bottom pallet (8) upper, and safety top cover consists of shell body division board, touch-screen, button and three look alarm lamps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320620842.8U CN203521378U (en) | 2013-10-09 | 2013-10-09 | Reballing equipment used in ball grid array structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320620842.8U CN203521378U (en) | 2013-10-09 | 2013-10-09 | Reballing equipment used in ball grid array structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203521378U true CN203521378U (en) | 2014-04-02 |
Family
ID=50380268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320620842.8U Expired - Lifetime CN203521378U (en) | 2013-10-09 | 2013-10-09 | Reballing equipment used in ball grid array structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203521378U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576415A (en) * | 2013-10-09 | 2015-04-29 | 上海微松工业自动化有限公司 | Bumping device with ball grid array structure |
| CN104701222A (en) * | 2015-03-12 | 2015-06-10 | 上海理工大学 | Ball adding device and method of area array bump ball implanting technology |
-
2013
- 2013-10-09 CN CN201320620842.8U patent/CN203521378U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576415A (en) * | 2013-10-09 | 2015-04-29 | 上海微松工业自动化有限公司 | Bumping device with ball grid array structure |
| CN104701222A (en) * | 2015-03-12 | 2015-06-10 | 上海理工大学 | Ball adding device and method of area array bump ball implanting technology |
| CN104701222B (en) * | 2015-03-12 | 2018-10-23 | 上海理工大学 | A kind of face battle array salient point plants the tip-in device and method of ball technique |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210203 Address after: 15-102, 188 Xinjun Ring Road, Minhang District, Shanghai, 201112 Patentee after: SHANGHAI WEISONG INDUSTRY AUTOMATION Co.,Ltd. Address before: 15-102, 188 Xinjun Ring Road, Minhang District, Shanghai, 201114 Patentee before: SHANGHAI WEISONG INDUSTRY AUTOMATION Co.,Ltd. Patentee before: University of Shanghai for Science and Technology |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140402 |
|
| CX01 | Expiry of patent term |