CN214392728U

CN214392728U - Tin ball feeding device of BGA automatic ball mounting machine

Info

Publication number: CN214392728U
Application number: CN202120480781.4U
Authority: CN
Inventors: 张敦勇; 徐文斌; 张明啸
Original assignee: Shenzhen Dinghua Science And Technology Development Co ltd
Current assignee: Shenzhen Dinghua Science And Technology Development Co ltd
Priority date: 2021-03-05
Filing date: 2021-03-05
Publication date: 2021-10-15
Anticipated expiration: 2031-03-05

Abstract

The utility model relates to an automatic ball machine technical field of planting, and disclose an automatic ball machine tin ball loading attachment that plants of BGA, including supporting platform. This automatic ball machine tin ball loading attachment of planting of BGA, through placing the tin ball in tin ball material loading platform left side, start second servo motor afterwards, make and sway the axle and control and rock, drive supporting platform and tin ball material loading platform can go on slope left or right afterwards, start vibrating motor afterwards, make front and back vibrating mechanism drive the interlock board and reciprocate, it reciprocates to drive tin ball material loading platform afterwards, the spout is injectd the slider, make the slider reciprocate, make inside the tin ball advance the tin ball otter board mould, through restart second servo motor afterwards, make tin ball material loading platform slope to the left side, start first servo motor afterwards and remove electric putter to rightmost side, overall structure is simple, the purpose of planting ball machine automated production has been realized, work efficiency is greatly improved, and the cost is saved.

Description

Tin ball feeding device of BGA automatic ball mounting machine

Technical Field

The utility model relates to an automatic ball machine technical field that plants specifically is an automatic ball machine tin ball loading attachment that plants of BGA.

Background

The BGA ball grid array package technology is an advanced high-performance package technology developed after the 90 s.20 th century, is a package technology for multi-pin devices and circuits, the external leads of which are solder balls or solder bumps distributed in an array on the bottom plane of a package substrate, and a large-scale integrated circuit chip is assembled on the substrate, is a surface assembly package type of LSI chips, does not need maintenance treatment, can avoid the process problems in the package with leads on four sides, and has the characteristics of large spacing, good lead hardness and high self-alignment property.

BGA plants the ball production early, whole ball process of planting is being accomplished by manual operation, the spend time is long, and off-the-shelf uniformity can not be guaranteed, along with BGA's demand is constantly growing, the market needs full-automatic production system, manual operation finally can't be competent at this work, efficient full-automatic BGA plants the ball system and is necessary to BGA's mass production, automatic ball machine of planting on the present market exists the shortcoming of unable automated production, generally plant the ball process and need the manual work to operate the completion, the spend time is long and off-the-shelf uniformity can not be guaranteed, so provide an automatic ball machine loading attachment that plants of BGA in order to solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides an automatic ball machine tin ball loading attachment of planting of BGA possesses advantages such as automated production, has solved and generally needs the manual work to operate the completion planting the ball process, and the problem that the long and off-the-shelf uniformity of cost time can not obtain the assurance.

(II) technical scheme

For the purpose of realizing above-mentioned automated production, the utility model provides a following technical scheme: a solder ball feeding device of a BGA automatic ball planting machine comprises a supporting platform, wherein a front and back vibrating mechanism is fixedly connected to the front of the supporting platform, a vibrating motor is fixedly connected to the front of the front and back vibrating mechanism, a linkage plate is fixedly connected to the bottom of the front and back vibrating mechanism, a slide rail is fixedly connected to the supporting platform, two slide blocks are movably connected to the inside of the slide rail, one end of each slide block penetrates through and extends to the outside of the slide rail, the front of each slide block is fixedly connected with a solder ball upper ball platform fixedly connected with the linkage plate, an ion cleaner is fixedly connected to the top of each solder ball upper ball platform, two heating pipes are fixedly connected to the front of each solder ball upper ball platform, a solder ball screen plate mold is fixedly connected to the front of each solder ball upper ball platform, a working box is fixedly connected to the front of each solder ball upper ball platform, a first servo motor is fixedly connected to the left side of the working box, the output shaft of the first servo motor is fixedly connected with a threaded rod, one end of the threaded rod penetrates through the working box and extends into the working box and is movably connected with the right side wall of the inner cavity of the working box, the outer surface of the threaded rod is in threaded connection with two electric push rods, the bottom of the electric push rod on the left side is fixedly connected with a baffle plate, the bottom of the electric push rod on the right side is fixedly connected with an anti-static brush, the back of the supporting platform is fixedly connected with two connecting plates, the bottom of the connecting plate at the bottom is fixedly connected with a swing shaft, one end of the swing shaft penetrates through the bottom connecting plate and the top connecting plate in sequence and extends to the top of the top connecting plate, the outer surface of the swing shaft is fixedly connected with a bearing, the top of the swing shaft is fixedly connected with a coupler, the top fixedly connected with second servo motor of shaft coupling, the back fixedly connected with of bearing and shaft coupling and second servo motor fixed connection's workstation.

Preferably, electric putter comprises fixed block and lift cylinder, the surface threaded connection of threaded rod has the fixed block, the bottom fixedly connected with lift cylinder of fixed block.

Preferably, the inside of fixed block is seted up threaded hole, threaded hole and threaded rod looks adaptation.

Preferably, nine communicating holes are formed in the tin ball screen plate die, and the nine communicating holes are symmetrically and equidistantly distributed around the central axis of the tin ball screen plate die.

Preferably, an output shaft of the vibration motor is fixedly connected with a cam, the vibration motor is fixedly connected with the front and rear vibration mechanisms through the cam, a sliding groove is formed in the sliding rail, and the sliding groove is matched with the sliding block.

Preferably, the outer surface of the first servo motor is fixedly connected with a protective cover, and the protective cover is fixedly connected with the working box.

(III) advantageous effects

Compared with the prior art, the utility model provides an automatic ball machine tin ball loading attachment of planting of BGA possesses following beneficial effect:

the solder ball feeding device of the BGA automatic ball planting machine is characterized in that a solder ball is placed on the left side of a solder ball feeding platform, then a second servo motor is started, a swing shaft is enabled to swing left and right, then a supporting platform and the solder ball feeding platform are driven to incline left or right, then a vibration motor is started, a front vibration mechanism and a rear vibration mechanism drive a linkage plate to move up and down, then the solder ball feeding platform is driven to move up and down, a sliding groove limits a sliding block, the sliding block moves up and down, the solder ball enters a solder ball screen plate die, then the second servo motor is started again, the solder ball feeding platform inclines to the left, then a first servo motor is started to move an electric push rod to the rightmost side, then an electric push rod is started, a baffle and an anti-static brush extend downwards, then the first servo motor is started, and the electric push rod moves to the left side, meanwhile, the solder balls are driven to move towards the left side, the influence of static electricity and water vapor generated in the ball planting process of the solder balls can be avoided by arranging the ion eliminator and the heating pipe, the yield of BGA ball planting is greatly improved, the whole structure is simple, the purpose of automatic production of the ball planting machine is realized, the working efficiency is greatly improved, and the cost is saved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a side view of the present invention.

In the figure: the device comprises a supporting platform 1, a front and back vibrating mechanism 2, a vibrating motor 3, a linkage plate 4, a working box 5, a sliding block 6, a tin ball feeding platform 7, an ion remover 8, a heating pipe 9, a tin ball screen plate mould 10, a first servo motor 11, a threaded rod 12, an electric push rod 13, a baffle 14, an anti-static brush 15, a swinging shaft 16, a bearing 17, a shaft coupling 18, a second servo motor 19, a working table 20, a sliding rail 21 and a connecting plate 22.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, a solder ball feeding device of a BGA automatic ball-planting machine comprises a supporting platform 1, a front and rear vibrating mechanism 2 fixedly connected to the front of the supporting platform 1, a vibrating motor 3 fixedly connected to the front of the front and rear vibrating mechanism 2, a cam fixedly connected to an output shaft of the vibrating motor 3, the vibrating motor 3 fixedly connected to the front and rear vibrating mechanism 2 through the cam, a sliding slot formed in the sliding slot 21 and adapted to the sliding block 6, a linkage plate 4 fixedly connected to the bottom of the front and rear vibrating mechanism 2, a sliding rail 21 fixedly connected to the supporting platform 1, two sliding blocks 6 having one end penetrating and extending to the outside of the sliding rail 21 and having a number of ends, a solder ball-loading platform 7 fixedly connected to the linkage plate 4 fixedly connected to the front of the two sliding blocks 6, and an ion cleaner 8 fixedly connected to the top of the solder ball-loading platform 7, the positive fixedly connected with quantity of ball platform 7 is two heating pipes 9 on the tin ball, the positive fixedly connected with tin ball otter board mould 10 of ball platform 7 on the tin ball, the back of tin ball otter board mould 10 has a portion and inhales the vacuum, fill the tin ball with BGA chip pad one-to-one in the mould, the platform is to opposite reverse swing this moment, the tin ball gets back to the initial position again because of gravity, the tin ball in the mould keeps unchangeable because the bottom inhales the vacuum, the inside of tin ball otter board mould 10 is seted up the intercommunicating pore that the quantity is nine, nine intercommunicating pores are symmetrical equidistance with the axis of tin ball otter board mould 10 and are distributed, the positive fixedly connected with work box 5 of ball platform 7 on the tin ball, the left side fixedly connected with first servo motor 11 of work box 5, the outer fixed surface of first servo motor 11 is connected with the safety cover, safety cover and work box 5 fixed connection, the output shaft fixedly connected with one end of first servo motor 11 runs through and extends to the inside of work box 5 and with the work box 5 in The cavity right side wall is movably connected with a threaded rod 12, the outer surface of the threaded rod 12 is in threaded connection with two electric push rods 13, each electric push rod 13 consists of a fixed block and a lifting cylinder, the outer surface of the threaded rod 12 is in threaded connection with the fixed block, the bottom of the fixed block is fixedly connected with the lifting cylinder, a threaded hole is formed in the fixed block and is matched with the threaded rod 12, the bottom of the left electric push rod 13 is fixedly connected with a baffle 14, the bottom of the right electric push rod 13 is fixedly connected with an antistatic brush 15, the back of the supporting platform 1 is fixedly connected with two connecting plates 22, one end of the bottom connecting plate 22 is fixedly connected with a swinging shaft 16 which sequentially penetrates through the bottom connecting plate 22 and the top connecting plate 22 and extends to the top of the top connecting plate 22, the outer surface of the swinging shaft 16 is fixedly connected with a bearing 17, and the top of the swinging shaft 16 is fixedly connected with a coupler 18, the top of the coupler 18 is fixedly connected with a second servo motor 19, the back of the bearing 17 is fixedly connected with a workbench 20 fixedly connected with the coupler 18 and the second servo motor 19, the solder balls are placed on the left side of the solder ball feeding platform 7, then the second servo motor 19 is started, the swing shaft 16 is rocked left and right, then the supporting platform 1 and the solder ball feeding platform 7 are driven to incline left or right, then the vibration motor 3 is started, the front and back vibration mechanism 2 drives the linkage plate 4 to move up and down, then the solder ball feeding platform 7 is driven to move up and down, the sliding chute limits the sliding block 6, the sliding block 6 is driven to move up and down, the solder balls enter the solder ball screen plate mould 10, then the redundant solder balls are started again by the second servo motor 19, the solder ball feeding platform 7 inclines to the left side, then the first servo motor 11 is started to move the electric push rod 13 to the rightmost side, start electric putter 13 afterwards, make baffle 14 and antistatic brush 15 downwardly extending, start first servo motor 11 afterwards, push away electric putter 13 to the left side removal, drive the tin ball simultaneously and remove to the left side, through setting up ion eliminator 8 and heating pipe 9, can avoid the influence of the static of tin ball planting ball in-process production and vapor, improve the yields that BGA planted the ball greatly, overall structure is simple, the purpose of ball machine planting automated production has been realized, the work efficiency is greatly improved, and the cost is saved.

In summary, the solder ball feeding device of the BGA automatic ball-planting machine is characterized in that the solder ball is placed on the left side of a solder ball feeding platform 7, then a second servo motor 19 is started to enable a swing shaft 16 to swing left and right, then a support platform 1 and the solder ball feeding platform 7 are driven to incline left or right, then a vibration motor 3 is started to enable a front and back vibration mechanism 2 to drive a linkage plate 4 to move up and down, then the solder ball feeding platform 7 is driven to move up and down, a sliding groove limits a sliding block 6 to enable the sliding block 6 to move up and down, so that the solder ball enters into a solder ball screen plate mold 10, then the second servo motor 19 is started again to enable the solder ball feeding platform 7 to incline left, then a first servo motor 11 is started to enable an electric push rod 13 to move to the rightmost side, then the electric push rod 13 is started, so that a baffle 14 and an anti-static brush 15 extend downwards, start first servo motor 11 afterwards, push away the electric push rod 13 to the left side removal, drive the tin ball simultaneously and remove to the left side, through setting up ionizer 8 and heating pipe 9, can avoid the influence of the static and the vapor that the tin ball planted the ball in-process and produce, improve the yields that BGA planted the ball greatly, overall structure is simple, the purpose of ball machine automated production has been realized planting, work efficiency is greatly improved, the cost is saved, it needs the manual work to operate the completion generally to have solved and plant the ball process, the long and off-the-shelf uniformity of cost can not obtain the problem of guaranteeing.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an automatic ball feeding device of Ball Grid Array (BGA), includes supporting platform (1), its characterized in that: the front side of the supporting platform (1) is fixedly connected with a front-back vibrating mechanism (2), the front side of the front-back vibrating mechanism (2) is fixedly connected with a vibrating motor (3), the bottom of the front-back vibrating mechanism (2) is fixedly connected with a linkage plate (4), the supporting platform (1) is fixedly connected with a slide rail (21), the inside of the slide rail (21) is movably connected with two slide blocks (6) of which one end penetrates through and extends to the outside of the slide rail (21), the front sides of the two slide blocks (6) are fixedly connected with a tin ball upper ball platform (7) fixedly connected with the linkage plate (4), the top of the tin ball upper ball platform (7) is fixedly connected with an ion cleaner (8), the front side of the tin ball upper ball platform (7) is fixedly connected with two heating pipes (9), and the front side of the tin ball upper ball platform (7) is fixedly connected with a tin ball screen mold (10), the front side of the tin ball feeding platform (7) is fixedly connected with a working box (5), the left side of the working box (5) is fixedly connected with a first servo motor (11), an output shaft of the first servo motor (11) is fixedly connected with a threaded rod (12) of which one end penetrates through the working box (5) and extends into the working box (5) and is movably connected with the right side wall of an inner cavity of the working box (5), the outer surface of the threaded rod (12) is in threaded connection with two electric push rods (13), the left side of the bottom of each electric push rod (13) is fixedly connected with a baffle plate (14), the right side of the bottom of each electric push rod (13) is fixedly connected with an anti-static brush (15), the back side of the supporting platform (1) is fixedly connected with two connecting plates (22), one end of the bottom of each connecting plate (22) is fixedly connected with a swing shaft (16) which penetrates through the bottom connecting plate (22) and the top connecting plate (22) in sequence and extends to the top of the top connecting plate (22), the outer fixed surface of rocking axle (16) is connected with bearing (17), the top fixedly connected with shaft coupling (18) of rocking axle (16), the top fixedly connected with second servo motor (19) of shaft coupling (18), back fixedly connected with and shaft coupling (18) and second servo motor (19) fixed connection's workstation (20) of bearing (17).

2. The solder ball feeding device of the BGA automatic ball mounting machine of claim 1, wherein: electric putter (13) comprise fixed block and lift cylinder, the surface threaded connection of threaded rod (12) has the fixed block, the bottom fixedly connected with lift cylinder of fixed block.

3. The solder ball feeding device of the BGA automatic ball mounting machine of claim 2, wherein: the inside of fixed block is seted up threaded hole, threaded hole and threaded rod (12) looks adaptation.

4. The solder ball feeding device of the BGA automatic ball mounting machine of claim 1, wherein: nine communicating holes are formed in the tin ball screen plate die (10), and the nine communicating holes are symmetrically distributed at equal intervals by using the central axis of the tin ball screen plate die (10).

5. The solder ball feeding device of the BGA automatic ball mounting machine of claim 1, wherein: the output shaft of the vibrating motor (3) is fixedly connected with a cam, the vibrating motor (3) is fixedly connected with the front and rear vibrating mechanism (2) through the cam, a sliding groove is formed in the sliding rail (21), and the sliding groove is matched with the sliding block (6).

6. The solder ball feeding device of the BGA automatic ball mounting machine of claim 1, wherein: the outer fixed surface of first servo motor (11) is connected with the safety cover, safety cover and work box (5) fixed connection.