CN116682774A - Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards - Google Patents
Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards Download PDFInfo
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- CN116682774A CN116682774A CN202310933586.6A CN202310933586A CN116682774A CN 116682774 A CN116682774 A CN 116682774A CN 202310933586 A CN202310933586 A CN 202310933586A CN 116682774 A CN116682774 A CN 116682774A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 38
- 238000012937 correction Methods 0.000 title claims abstract description 23
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 133
- 229910000679 solder Inorganic materials 0.000 claims abstract description 37
- 230000001502 supplementing effect Effects 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000008569 process Effects 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims abstract description 16
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 22
- 238000006073 displacement reaction Methods 0.000 claims description 14
- 230000001360 synchronised effect Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 6
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 13
- 230000000007 visual effect Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/20—Reduction of greenhouse gas [GHG] emissions in agriculture, e.g. CO2
- Y02P60/21—Dinitrogen oxide [N2O], e.g. using aquaponics, hydroponics or efficiency measures
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention belongs to the technical field of semiconductor production equipment, and discloses an optical automatic alignment correction system of an upper ball plate and a lower ball plate of a BGA (ball grid array) ball-planting device, which comprises the upper ball plate and the lower ball plate which are oppositely arranged up and down, wherein the lower ball plate is provided with a first solder ball hole, and a light source assembly is arranged below the lower ball plate; the upper ball plate is provided with a plurality of second tin ball holes distributed in a matrix, and is provided with a light source receiving assembly; one side of the lower ball plate is provided with a tin supplementing assembly in sliding connection, and the tin supplementing assembly comprises a tin supplementing plate and a tin outlet assembly arranged below the tin supplementing plate; a third tin ball hole matched with the second tin ball hole is formed in the tin supplementing plate, and a tin outlet for supplying tin balls to the third tin ball hole is formed in the tin outlet assembly; according to the scheme, the rapid detection of the solder ball condition can be realized through optical alignment, a complex processing process is not needed, and the solder ball identification efficiency is high; and can accomplish the tin function of mending through mending tin subassembly is automatic, realizes the detection and the tin of mending to the tin ball fast, is favorable to improving tin ball production efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor production equipment, in particular to an optical automatic alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards.
Background
BGA packages are a type of surface mount chip package, and are commonly used for packaging high performance integrated circuits such as CMOS image sensors and microprocessors, and in the field of semiconductor manufacturing, BGA soldering is generally used to package chips, where the process of placing solder balls into BGA is also called ball placement, and the device is also called a ball placement machine.
The ball planting machine in the prior art generally comprises an upper ball plate and a lower ball plate, wherein a chip to be processed is placed at a preset position of the lower ball plate, a tin ball is obtained through the upper ball plate and is placed on a welding spot of the chip, and a ball planting process is carried out; therefore, the positioning accuracy of solder ball placement can directly influence the accuracy and performance of a chip, and the conventional method for identifying the solder ball deviation and the solder deficiency of the upper ball plate by adopting visual identification has the defects that visual equipment is usually required to be installed outside the upper ball plate and the lower ball plate, the visual identification is limited by an installation angle and a visual angle range, dead angles are easy to exist, images are required to be processed in the visual identification process, the processing efficiency is limited, and the ball planting efficiency is influenced.
In view of this, there is a need to improve the visual recognition mechanism of the ball-planting plate in the prior art to solve the technical problem of low processing efficiency of the solder balls.
Disclosure of Invention
The invention aims to provide an optical automatic alignment correction system for upper and lower ball boards of a Ball Grid Array (BGA) ball-mounting, which solves the technical problems.
To achieve the purpose, the invention adopts the following technical scheme:
an optical automatic alignment correction system of Ball Grid Array (BGA) ball-mounting upper and lower ball plates comprises an upper ball plate and a lower ball plate which are arranged up and down oppositely, wherein the lower ball plate is provided with a plurality of first solder ball holes distributed in a matrix, and a light source assembly is arranged below the lower ball plate;
the upper ball plate is provided with a plurality of second tin ball holes distributed in a matrix, and a light source receiving assembly is arranged on the upper ball plate;
during detection, the light source assembly emits light rays to irradiate the upper ball plate from the first tin ball holes, the light rays irradiate the light source receiving assembly through the corresponding second tin ball holes, and the light source receiving assembly receives the light rays and recognizes the intensity of the light rays;
one side of the lower ball plate is provided with a tin supplementing assembly in a sliding connection manner, and the tin supplementing assembly comprises a tin supplementing plate and a tin outlet assembly arranged below the tin supplementing plate; and a third tin ball hole matched with the second tin ball hole is formed in the tin supplementing plate, and the tin outlet assembly is provided with a tin outlet for supplying tin balls to the third tin ball hole.
Optionally, the tin outlet assembly comprises an inner tray body and an outer tray body which are rotationally connected, an annular groove for accommodating a tin ball is formed in the outer periphery of the inner tray body, a through hole is formed in one end of the annular groove, and the tin outlet is formed in the upper end of the through hole;
an air outlet component is arranged at the lower end of the through hole, and an air outlet of the air outlet component is opposite to the through hole and is used for supplying wind power to the through hole so as to drive the tin balls in the annular groove to be sprayed out from the tin outlet;
the axle center department of interior disk body is connected with the drive shaft, the drive shaft is connected with the rotary driving piece, the rotary driving piece is used for driving interior disk body is around its axle center rotation.
Optionally, the automatic optical alignment correction system for the upper and lower ball boards of the BGA ball mounting device further comprises a support plate and a displacement driving assembly, wherein the support plate is slidably connected with a mounting platform along the length direction of the support plate, and the lower ball board and the light source assembly are respectively arranged on the mounting platform;
the driving end of the displacement driving assembly is connected with the mounting platform and used for driving the mounting platform to linearly move along the length direction of the supporting plate.
Optionally, the automatic optical alignment correction system for the upper and lower ball boards of the BGA ball mounting further comprises a base component, and an angle adjusting mechanism is arranged on the base component;
the angle adjusting mechanism comprises a rotating shaft capable of being driven to rotate, and the rotating shaft is connected with the mounting platform and used for adjusting the rotating angle of the mounting platform.
Optionally, the displacement driving assembly comprises a first motor installed on the base assembly, and an output shaft of the first motor is connected with a driving wheel;
a connecting plate is respectively arranged at two sides of the mounting platform, the lower end of the connecting plate is rotationally connected with a first driven wheel, and the first driven wheel is connected with the driving wheel through a synchronous belt; the synchronous belt is connected with the mounting platform and used for driving the mounting platform to move;
the synchronous belt is provided with avoidance spaces between the driving wheel and the two first driven wheels.
Optionally, the angle adjusting mechanism includes a second motor installed on the base component, an output shaft of the second motor is connected with a coupling, one end of the coupling is connected with the rotating shaft, and the second motor is used for driving the rotating shaft to rotate;
one end of the rotating shaft, which is far away from the coupler, is provided with a plurality of annular sensing pieces, and the annular sensing pieces are provided with notch parts;
the annular sensing piece is provided with an inductor correspondingly, and the inductor is used for sensing the positions of the annular sensing piece and the notch part so as to identify the rotation angle of the mounting platform.
Optionally, a first upright post is arranged on the lower end surface of the mounting platform, so that second upright posts are respectively arranged on two sides of the first upright post;
the lower end face of the first upright post is provided with a mounting groove, and the section of the mounting groove is square; the rotating shaft is sleeved with a square sleeve, and the square sleeve is arranged in the mounting groove, so that the rotating shaft is fixedly connected with the first upright column in the circumferential direction.
Optionally, the upper end surface of the base assembly is slidably connected with a supporting seat along the length direction of the base assembly, a third upright post is arranged on the upper end surface of the supporting seat, and a top wheel is arranged at the upper end part of the third upright post;
the pushing cylinder is arranged on the base assembly and used for pushing the supporting seat to linearly move along the length direction of the base assembly;
an arc curved surface part is arranged on the lower end surface of the second upright post, and the arc curved surface part is tangentially abutted against the top wheel; in the rotation process of the mounting platform, the arc curved surface part and the top wheel are always in a tangential state;
one side of the arc-shaped curved surface part is provided with a guide inclined plane, and the guide inclined plane is used for guiding the top wheel.
Optionally, the automatic optical alignment correction system for the upper ball board and the lower ball board of the BGA ball mounting further comprises a material taking mechanism, wherein the material taking mechanism comprises a first linear module, and a driving end of the first linear module is provided with a mounting frame;
the lifting device is characterized in that a lifting cylinder is arranged on the mounting frame, a piston rod of the lifting cylinder is connected with a sucker assembly, and the lifting cylinder is used for driving the sucker assembly to linearly move along the vertical direction.
Optionally, the sucker assembly comprises a sucker body, and a vacuum cavity is arranged in the sucker body; one end of the vacuum cavity is connected with a vacuum negative pressure component through an air pipe, and the other end of the vacuum cavity is communicated with the second tin ball hole;
the light source receiving assembly is arranged in the vacuum cavity and comprises two lenses which are arranged side by side, and a photosensitive chip is arranged above the lenses.
Compared with the prior art, the invention has the following beneficial effects: during detection, the upper ball plate is moved to a preset position above the lower ball plate through a second tin ball Kong Qude tin ball of the upper ball plate, the light source assembly operates to emit light to irradiate the upper ball plate from the first tin ball hole, the light irradiates the light source receiving assembly through the corresponding second tin ball hole, the light source receiving assembly receives the light and identifies the intensity of the light, and when the illumination intensity is towards the minimum value, the tin ball exists at the position; otherwise, when the tin is in a maximum value, the tin is lack at the position, the tin supplementing is needed to be carried out at the position, the upper ball plate is driven to move to the upper part of the tin supplementing assembly, the tin outlet of the tin supplementing assembly is moved to the upper part of the corresponding tin lack position, so that the tin is supplied to the third tin ball hole, and the tin ball is moved to the upper surface of the tin supplementing plate to be used for tin supplementing of the upper ball plate, so that the corresponding tin supplementing process is completed; according to the scheme, the rapid detection of the solder ball condition can be realized through optical alignment, a complex processing process is not needed, and the solder ball identification efficiency is high; and can accomplish the tin function of mending through mending tin subassembly is automatic, realizes the detection and the tin of mending to the tin ball fast, is favorable to improving tin ball production efficiency.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are not intended to limit the scope of the invention, since any modification, variation in proportions, or adjustment of the size, etc. of the structures, proportions, etc. should be considered as falling within the spirit and scope of the invention, without affecting the effect or achievement of the objective.
FIG. 1 is a schematic diagram of an optical auto-alignment system;
FIG. 2 is a second schematic diagram of the optical auto-alignment system;
FIG. 3 is a third schematic diagram of the automatic optical alignment system;
FIG. 4 is a schematic diagram of the optical auto-alignment system;
FIG. 5 is a schematic diagram of an automatic optical alignment system;
FIG. 6 is a schematic diagram of an optical auto-alignment system;
FIG. 7 is a schematic diagram of an automatic optical alignment system;
FIG. 8 is a schematic diagram of an optical auto-alignment system;
FIG. 9 is a diagram of a ninth embodiment of an automatic optical alignment system;
FIG. 10 is a schematic diagram of an optical auto-alignment system;
FIG. 11 is a diagram of an optical auto-alignment system;
FIG. 12 is a schematic diagram of an optical auto-alignment system;
FIG. 13 is a diagram showing thirteenth configuration of the system;
illustration of: the upper ball plate 1, the lower ball plate 2, the first tin ball hole 3, the light source assembly 4, the second tin ball hole 5, the light source receiving assembly 6, the tin supplementing assembly 7, the tin supplementing plate 8, the tin supplementing assembly 9, the third tin ball hole 10, the tin outlet 11, the inner disc 12, the outer disc 13, the annular groove 14, the through hole 15, the air outlet assembly 16, the driving shaft 17, the supporting plate 18, the displacement driving assembly 19, the mounting platform 20, the base assembly 21, the angle adjusting mechanism 22, the rotating shaft 23, the first motor 24, the driving wheel 25, the connecting plate 26, the first driven wheel 27, the synchronous belt 28, the second motor 29, the coupler 30, the annular sensing piece 31, the notch 32, the inductor 33, the first upright post 34, the second upright post 50, the mounting groove 35, the supporting seat 36, the third upright post 37, the top wheel 38, the arc curved surface 39, the guide inclined plane 40, the material taking mechanism 41, the first linear module 42, the mounting bracket 43, the lifting cylinder 44, the sucking disc assembly 45, the vacuum cavity 46, the air tube 47, the lens 48, the photosensitive chip 49, the light pushing cylinder 51, and the pushing chip 52.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. It is noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
The embodiment of the invention provides an optical automatic alignment correction system of an upper ball board and a lower ball board of a BGA ball-planting device, which comprises an upper ball board 1 and a lower ball board 2 which are arranged up and down oppositely, wherein the lower ball board 2 is provided with a plurality of first solder ball holes 3 distributed in a matrix, and a light source component 4 is arranged below the lower ball board 2; the upper ball plate 1 is provided with a plurality of second tin ball holes 5 distributed in a matrix, and the upper ball plate 1 is provided with a light source receiving assembly 6; during detection, the light source assembly 4 emits light rays 51 to irradiate the upper ball plate 1 from the first solder ball holes 3, the light rays 51 irradiate the light source receiving assembly 6 through the corresponding second solder ball holes 5, and the light source receiving assembly 6 receives the light rays 51 and identifies the intensity of the light rays 51;
one side of the lower ball plate 2 is provided with a tin supplementing assembly 7 in sliding connection, and the tin supplementing assembly 7 comprises a tin supplementing plate 8 and a tin outlet assembly 9 arranged below the tin supplementing plate 8; the tin supplementing plate 8 is provided with a third tin ball hole 10 matched with the second tin ball hole 5, and the tin outlet assembly 9 is provided with a tin outlet 11 for supplying tin balls to the third tin ball hole 10.
The working principle of the invention is as follows: during detection, a solder ball is obtained through the second solder ball hole 5 of the upper ball plate 1, the upper ball plate 1 is moved to a preset position above the lower ball plate 2, the light source assembly 4 operates to emit light rays 51 to irradiate the upper ball plate 1 from the first solder ball hole 3, the light rays 51 irradiate the light source receiving assembly 6 through the corresponding second solder ball hole 5, the light source receiving assembly 6 receives the light rays 51 and identifies the intensity of the light rays 51, and when the illumination intensity tends to the minimum value, the solder ball exists at the position; if the tin is not in the position, and the tin is required to be replenished to the position, the upper ball plate 1 is driven to move to the upper part of the tin replenishing assembly 7, the tin outlet 11 of the tin discharging assembly 9 is moved to the upper part of the corresponding tin deficiency position, so that the tin is supplied to the third tin ball hole 10, and the tin ball is moved to the upper surface of the tin replenishing plate 8 to be used for tin taking of the upper ball plate 1, and the corresponding tin replenishing process is completed; compared with a visual recognition mechanism in the prior art, the scheme can realize rapid detection of the solder ball condition through optical alignment, does not need a complex processing process, and has high solder ball recognition efficiency; and can accomplish the tin function of mending through mending tin subassembly 7 automatically, realize the detection and the tin of mending to the tin ball fast, be favorable to improving tin ball production efficiency.
In this embodiment, the tin outlet assembly 9 includes an inner tray body 12 and an outer tray body 13 which are rotatably connected, an annular groove 14 for accommodating a tin ball is arranged at the outer periphery of the inner tray body 12, a through hole 15 is arranged at one end of the annular groove 14, and a tin outlet 11 is formed at the upper end of the through hole 15;
an air outlet assembly 16 is arranged at the lower end of the through hole 15, and an air outlet of the air outlet assembly 16 is opposite to the through hole 15 and is used for supplying wind power to the through hole 15 so as to drive the tin balls in the annular groove 14 to be sprayed out from the tin outlet 11; the axle center of the inner disc body 12 is connected with a driving shaft 17, the driving shaft 17 is connected with a rotary driving piece, and the rotary driving piece is used for driving the inner disc body 12 to rotate around the axle center.
It should be noted that, in this solution, the working principle of the tin outlet assembly 9 is that the rotation driving member operates, and the driving shaft 17 drives the inner disc 12 to rotate around its axis, so that the annular groove 14 rotates relative to the outer disc 13 along a preset rotation direction, and the tin balls in the groove sequentially pass through the positions of the through holes 15 and drop into the through holes 15, so that the air outlet assembly 16 located below the through holes 15 can spray the tin balls of the through holes 15 from the tin outlet 11, thereby realizing the function of supplying the tin balls to the third tin ball holes 10;
in this embodiment, the optical automatic alignment correction system further includes a support plate 18 and a displacement driving assembly 19, the support plate 18 is slidably connected with a mounting platform 20 along the length direction thereof, and the lower sphere plate 2 and the light source assembly 4 are respectively disposed on the mounting platform 20; the driving end of the displacement driving assembly 19 is connected with the mounting platform 20, and is used for driving the mounting platform 20 to linearly move along the length direction of the supporting plate 18.
Referring to fig. 4, the lower ball board 2 in this scheme is correspondingly provided with a displacement driving component 19, and the displacement driving component 19 drives the mounting platform 20 to move so as to drive the lower ball board 2 to linearly move along the length direction of the supporting board 18, thereby playing a role in adjusting the light emitting position of the light source component 4 and adapting to different detection requirements.
It is easy to understand that in the detection process, it is required to determine whether the solder ball is offset, so when the light source receiving component 6 detects the intensity of the light ray 51, in order to further improve the accuracy of detection, the lower ball plate 2 is driven to move along the plane, and the light ray 51 of the light source receiving component 6 detects the change condition of the intensity in the moving process, and when the detected light intensity is between the maximum value and the minimum value, it is determined that the solder ball at the corresponding position is offset.
Further described, the optical automatic alignment correction system further comprises a base assembly 21, and an angle adjusting mechanism 22 is arranged on the base assembly 21; the angle adjusting mechanism 22 includes a rotation shaft 23 capable of being driven to rotate, and the rotation shaft 23 is connected to the mounting platform 20 for adjusting the rotation angle of the mounting platform 20.
It should be noted that, the lower ball board 2 in the present solution is further correspondingly provided with an angle adjusting mechanism 22, which plays a role in adjusting the angles of the mounting platform 20 and the lower ball board 2; in summary, the lower ball plate 2 in the scheme has the adjusting functions of plane displacement and angle rotation; in the process of sucking the solder balls by the upper ball plate 1, besides the condition of tin deficiency, the condition of solder ball deflection exists, and the solder ball deflection also affects the quality of chip production, so that the deflection condition of the solder balls needs to be detected by arranging a corresponding detection structure.
The specific detection process of the offset is that when the light source receiving component 6 receives the light ray 51 and recognizes that the intensity of the light ray 51 is between the maximum value and the minimum value, the solder ball is judged to be the offset; further, the light source receiving assembly 6 detects the change condition of the intensity of the light ray 51 in real time in the process by combining the irradiation distribution condition of the light spot formed by the light ray 51 detected on the light source receiving assembly 6 to drive the lower ball plate 2 to move along a preset path in a plane and rotate at a space angle, and the corresponding deviation condition of the solder ball is obtained by analyzing and processing the change condition, so that the adjustment of the deviation solder ball is facilitated.
Specifically, the displacement driving assembly 19 includes a first motor 24 mounted on the base assembly 21, and an output shaft of the first motor 24 is connected with a driving wheel 25; a connecting plate 26 is respectively arranged on two sides of the mounting platform 20, the lower end of the connecting plate 26 is rotatably connected with a first driven wheel 27, and the first driven wheel 27 is connected with the driving wheel 25 through a synchronous belt 28; the synchronous belt 28 is connected with the mounting platform 20 and is used for driving the mounting platform 20 to move; wherein, the synchronous belt 28 forms an avoidance space between the driving wheel 25 and the two first driven wheels 27; wherein the avoidance space functions as the avoidance ring-shaped sensing piece 31 and the sensor 33.
The displacement driving assembly 19 in the scheme is operated in the process that the first motor 24 drives the driving wheel 25 to rotate so as to drive the synchronous belt 28 to rotate, and the synchronous belt 28 can drive the mounting platform 20 to linearly move along the preset direction in the rotating process, so that the function of adjusting the plane position of the mounting platform 20 is achieved; the first driven wheels 27 arranged on the two sides are beneficial to improving the moving stability of the two sides of the mounting platform 20 and avoiding the deviation. While the timing belt 28 distribution is such that good engagement is maintained during rotation of the mounting platform 20, preventing jamming and removal.
Further, the angle adjusting mechanism 22 includes a second motor 29 mounted on the base assembly 21, an output shaft of the second motor 29 is connected with a coupling 30, one end of the coupling 30 is connected with the rotating shaft 23, and the second motor 29 is used for driving the rotating shaft 23 to rotate;
a plurality of annular sensing pieces 31 are arranged at one end of the rotating shaft 23 far away from the coupler 30, and a notch 32 is formed in each annular sensing piece 31; the annular sensing piece 31 is correspondingly provided with a sensor 33, and the sensor 33 is used for sensing the positions of the annular sensing piece 31 and the notch 32; the sensor 33 can accurately identify the rotation angle of the mounting platform 20 through the switching change condition of the annular sensing piece 31 and the notch portion 32, and the arrangement of the notch portion 32 is beneficial to improving the detection accuracy of the sensor 33.
The specific working process of the angle adjusting mechanism 22 in the scheme is that the second motor 29 operates, and the rotating shaft 23 is driven to rotate around the axis of the second motor by the action of the output shaft and the coupler 30, so that the function of adjusting the space angle of the lower ball plate 2 is achieved; meanwhile, one end of the rotating shaft 23 is provided with an annular sensing piece 31 and a sensor 33, and the rotating angle of the mounting platform 20 is identified through the functions of the annular sensing piece 31 and the sensor 33, so that the rotating angle identification device has high identification precision.
As a preferable scheme of the present embodiment, the lower end surface of the mounting platform 20 is provided with a first upright 34, so as to be respectively provided with second uprights 50 at two sides of the first upright 34; the lower end surface of the first upright post 34 is provided with a mounting groove 35, and the section of the mounting groove 35 is square; the rotating shaft 23 is sleeved with a square sleeve, and the square sleeve is arranged in the mounting groove 35, so that the rotating shaft 23 is fixedly connected with the first upright post 34 in the circumferential direction.
Referring to fig. 8, the mounting platform 20 in this embodiment is connected to the rotating shaft 23 through the first upright 34; for easy installation, a pin hole is formed through the mounting platform 20, and a pin is installed in the pin hole, and the first upright 34 and the rotating shaft 23 are connected by the pin.
As a preferable scheme of the present embodiment, the upper end surface of the base assembly 21 is slidably connected with a supporting seat 36 along the length direction thereof, the upper end surface of the supporting seat 36 is provided with a third upright post 37, and the upper end portion of the third upright post 37 is provided with a top wheel 38; a pushing cylinder 52 is arranged on the base assembly 21, and the pushing cylinder 52 is used for pushing the supporting seat 36 to linearly move along the length direction of the base assembly 21; the lower end surface of the second upright post 50 is provided with an arc curved surface part 39, and the arc curved surface part 39 tangentially collides with the top wheel 38; during the rotation of the mounting platform 20, the arc-shaped curved surface part 39 and the top wheel 38 are always in a tangential state; wherein, one side of the arc curved surface portion 39 is provided with a guiding inclined surface 40, and the guiding inclined surface 40 is used for guiding the top wheel 38.
It should be noted that, because the mounting platform 20 in the present embodiment is a rotatable structure, in order to improve the stability of the mounting platform 20 during rotation, a supporting seat 36 is disposed below the mounting platform 20, a third upright post 37 and a top wheel 38 are disposed on the supporting seat 36, and stable support on two sides of the mounting platform 20 is achieved through tangential cooperation of the top wheel 38 and the second upright post 50; and can function as the guide top wheel 38 through the guide inclined surface 40, that is, when the support base 36 moves linearly along the length direction of the base assembly 21, in order to avoid the second upright post 50 from seizing the support base 36, the guide inclined surface 40 is provided at one side of the arc-shaped curved surface portion 39, so that the top wheel 38 can move relative to the guide inclined surface 40.
In this embodiment, the optical automatic alignment correction system further includes a material taking mechanism 41, where the material taking mechanism includes a first linear module 42, and a mounting frame 43 is disposed at a driving end of the first linear module 42; the mounting frame 43 is provided with a lifting cylinder 44, a piston rod of the lifting cylinder 44 is connected with a sucker assembly 45, and the lifting cylinder is used for driving the sucker assembly 45 to linearly move along the vertical direction.
The material taking mechanism 41 in the scheme has the material taking effect on the solder balls through the vacuum adsorption effect of the sucker assembly 45; meanwhile, the solder ball sucking device has a left-right transverse movement function and a lifting function, and sucking balls are sucked by driving the sucking disc assembly 45 to move to a preset position.
Specifically, the sucker assembly 45 includes a sucker body, and a vacuum cavity 46 is disposed in the sucker body; one end of the vacuum cavity 46 is connected with a vacuum negative pressure component (not shown in the figure) through an air pipe 47, and the other end is communicated with the second solder ball hole 5; the light source receiving assembly 6 is installed in the vacuum cavity 46, the light source receiving assembly 6 comprises two lenses 48 arranged side by side, and a photosensitive chip 49 is arranged above the lenses 48.
It should be noted that, in this embodiment, the vacuum cavity 46 of the suction cup assembly 45 is communicated with the second solder ball hole 5, so that a vacuum adsorption force can be provided in the second solder ball hole 5, so as to facilitate the adsorption of solder balls; the light source receiving assembly 6 operates according to the principle that the light 51 irradiates the photosensitive chip 49 through the lens 48, the photosensitive chip 49 generates a corresponding electric signal, the basic principle is photoelectric conversion, and the electric signal is output and analyzed to finally obtain the intensity and distribution of the light 51.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. An optical automatic alignment correction system of upper and lower ball boards of a Ball Grid Array (BGA) comprises an upper ball board and a lower ball board which are oppositely arranged up and down, and is characterized in that the lower ball board is provided with a plurality of first solder ball holes distributed in a matrix, and a light source assembly is arranged below the lower ball board;
the upper ball plate is provided with a plurality of second tin ball holes distributed in a matrix, and a light source receiving assembly is arranged on the upper ball plate;
during detection, the light source assembly emits light rays to irradiate the upper ball plate from the first tin ball holes, the light rays irradiate the light source receiving assembly through the corresponding second tin ball holes, and the light source receiving assembly receives the light rays and recognizes the intensity of the light rays;
one side of the lower ball plate is provided with a tin supplementing assembly in a sliding connection manner, and the tin supplementing assembly comprises a tin supplementing plate and a tin outlet assembly arranged below the tin supplementing plate; and a third tin ball hole matched with the second tin ball hole is formed in the tin supplementing plate, and the tin outlet assembly is provided with a tin outlet for supplying tin balls to the third tin ball hole.
2. The automatic optical alignment correction system for the upper and lower ball boards of the BGA ball mounting device according to claim 1, wherein the tin outlet assembly comprises an inner disk body and an outer disk body which are rotationally connected, an annular groove for accommodating a tin ball is formed in the outer periphery of the inner disk body, a through hole is formed in one end of the annular groove, and the tin outlet is formed in the upper end of the through hole;
an air outlet component is arranged at the lower end of the through hole, and an air outlet of the air outlet component is opposite to the through hole and is used for supplying wind power to the through hole so as to drive the tin balls in the annular groove to be sprayed out from the tin outlet;
the axle center department of interior disk body is connected with the drive shaft, the drive shaft is connected with the rotary driving piece, the rotary driving piece is used for driving interior disk body is around its axle center rotation.
3. The automatic optical alignment correction system for the upper and lower ball boards of the BGA ball mounting of claim 1, further comprising a support plate and a displacement driving assembly, wherein the support plate is slidably connected with a mounting platform along the length direction thereof, and the lower ball board and the light source assembly are respectively arranged on the mounting platform;
the driving end of the displacement driving assembly is connected with the mounting platform and used for driving the mounting platform to linearly move along the length direction of the supporting plate.
4. The automatic optical alignment correction system for BGA ball mounting upper and lower ball plates according to claim 3, further comprising a base assembly, wherein the base assembly is provided with an angle adjusting mechanism;
the angle adjusting mechanism comprises a rotating shaft capable of being driven to rotate, and the rotating shaft is connected with the mounting platform and used for adjusting the rotating angle of the mounting platform.
5. The automatic optical alignment correction system for BGA ball mounting upper and lower ball plates according to claim 4, wherein said displacement driving assembly comprises a first motor mounted on said base assembly, an output shaft of said first motor being connected with a driving wheel;
a connecting plate is respectively arranged at two sides of the mounting platform, the lower end of the connecting plate is rotationally connected with a first driven wheel, and the first driven wheel is connected with the driving wheel through a synchronous belt; the synchronous belt is connected with the mounting platform and used for driving the mounting platform to move;
the synchronous belt is provided with avoidance spaces between the driving wheel and the two first driven wheels.
6. The automatic optical alignment correction system for BGA ball mounting upper and lower ball boards according to claim 5, wherein the angle adjusting mechanism comprises a second motor mounted on the base assembly, an output shaft of the second motor is connected with a coupling, one end of the coupling is connected with the rotating shaft, and the second motor is used for driving the rotating shaft to rotate;
one end of the rotating shaft, which is far away from the coupler, is provided with a plurality of annular sensing pieces, and the annular sensing pieces are provided with notch parts;
the annular sensing piece is provided with an inductor correspondingly, and the inductor is used for sensing the positions of the annular sensing piece and the notch part so as to identify the rotation angle of the mounting platform.
7. The automatic optical alignment correction system for upper and lower ball boards of a BGA ball mounting of claim 6, wherein a first pillar is provided on a lower end surface of the mounting platform, and second pillars are provided on both sides of the first pillar, respectively;
the lower end face of the first upright post is provided with a mounting groove, and the section of the mounting groove is square; the rotating shaft is sleeved with a square sleeve, and the square sleeve is arranged in the mounting groove, so that the rotating shaft is fixedly connected with the first upright column in the circumferential direction.
8. The automatic optical alignment correction system for the upper and lower ball boards of the BGA ball mounting assembly according to claim 7, wherein the upper end surface of the base assembly is slidably connected with a supporting seat along the length direction thereof, a third upright post is arranged on the upper end surface of the supporting seat, and a top wheel is arranged on the upper end part of the third upright post;
the pushing cylinder is arranged on the base assembly and used for pushing the supporting seat to linearly move along the length direction of the base assembly;
an arc curved surface part is arranged on the lower end surface of the second upright post, and the arc curved surface part is tangentially abutted against the top wheel; in the rotation process of the mounting platform, the arc curved surface part and the top wheel are always in a tangential state;
one side of the arc-shaped curved surface part is provided with a guide inclined plane, and the guide inclined plane is used for guiding the top wheel.
9. The automatic optical alignment correction system for the upper and lower ball boards of the Ball Grid Array (BGA) ball mounting device according to claim 1, further comprising a material taking mechanism, wherein the material taking mechanism comprises a first linear module, and a mounting frame is arranged at the driving end of the first linear module;
the lifting device is characterized in that a lifting cylinder is arranged on the mounting frame, a piston rod of the lifting cylinder is connected with a sucker assembly, and the lifting cylinder is used for driving the sucker assembly to linearly move along the vertical direction.
10. The automatic optical alignment correction system for BGA ball mounting upper and lower ball boards according to claim 9, wherein the suction cup assembly comprises a suction cup body, and a vacuum cavity is provided in the suction cup body; one end of the vacuum cavity is connected with a vacuum negative pressure component through an air pipe, and the other end of the vacuum cavity is communicated with the second tin ball hole;
the light source receiving assembly is arranged in the vacuum cavity and comprises two lenses which are arranged side by side, and a photosensitive chip is arranged above the lenses.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310933586.6A CN116682774B (en) | 2023-07-27 | 2023-07-27 | Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310933586.6A CN116682774B (en) | 2023-07-27 | 2023-07-27 | Automatic optical alignment correction system for Ball Grid Array (BGA) ball mounting upper and lower ball boards |
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| CN116682774A true CN116682774A (en) | 2023-09-01 |
| CN116682774B CN116682774B (en) | 2023-12-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118412313A (en) * | 2024-07-01 | 2024-07-30 | 上海陛通半导体能源科技股份有限公司 | Centering jig and method for semiconductor equipment |
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