CN210576014U - Double-head die bonder of mini-LED full-automatic die bonder - Google Patents
Double-head die bonder of mini-LED full-automatic die bonder Download PDFInfo
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- CN210576014U CN210576014U CN201921909775.5U CN201921909775U CN210576014U CN 210576014 U CN210576014 U CN 210576014U CN 201921909775 U CN201921909775 U CN 201921909775U CN 210576014 U CN210576014 U CN 210576014U
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Abstract
The utility model discloses a solid brilliant device of double-end of full-automatic solid brilliant machine of mini-LED, including the anchor clamps platform, both sides are equipped with a solid brilliant unit respectively about the anchor clamps platform, gu brilliant unit includes brilliant ring moving platform, thimble mechanism and solid brilliant mechanism, and the anchor clamps platform is used for bearing the LED support, and brilliant ring moving platform is used for bearing the LED chip, and thimble mechanism is used for absorbing appointed LED chip jack-up on the brilliant ring moving platform, and solid brilliant mechanism is used for absorbing appointed LED chip and fixes on the assigned position of LED support after 180. The die bonding mode that one clamp platform corresponds to two die bonding units is adopted, when the die bonding unit on one side is in die bonding, the die bonding unit on the other side is in die suction, and the two die bonding units work simultaneously, so that the die bonding efficiency is improved by nearly two times.
Description
Technical Field
The utility model relates to a belong to automation equipment technical field, relate to a solid brilliant machine of LED, concretely relates to solid brilliant device of double-end of mini-LED full-automatic solid brilliant machine.
Background
A Light Emitting Diode (LED) is a Light Emitting element that can convert electrical energy into Light energy. The LED product can be used in a plurality of fields such as illumination, display, signal indication and the like. In recent years, with the continuous improvement and perfection of LED packaging technology, the ultra-high-definition, high-density and small-pitch LED display screen has a trend of replacing the traditional LCD display screen with the advantages of high response, high brightness, low power consumption, good chromaticity, large visual angle and the like, and is widely applied indoors and outdoors.
The LED die bonder is equipment capable of fixing an LED chip on an LED bracket, and along with the continuous improvement and perfection of LED packaging technology, the competitive market is not eliminated, and only the continuous improvement of die bonding precision and die bonding speed is required to occupy the market. Therefore, the development of a high-precision and high-efficiency double-head die bonder of a mini-LED full-automatic die bonder is urgently needed.
SUMMERY OF THE UTILITY MODEL
To the deficiency in the prior art, the to-be-solved technical problem of the utility model lies in providing a high accuracy efficient mini-LED full-automatic solid brilliant machine's solid brilliant device of double-end.
In order to solve the technical problem, the utility model discloses a following scheme realizes: a double-head die bonder of a mini-LED full-automatic die bonder comprises:
the fixture platform is used for clamping the LED support and is provided with a first XY axial moving mechanism and a fixture component which is arranged on the first XY axial moving mechanism and driven by the first XY axial moving mechanism to move in the XY directions;
the die bonding unit comprises vertical mounting frames which are spliced together, die bonding lenses arranged in the middle of the vertical mounting frames, two groups of die absorbing lenses and two groups of die bonding heads which are arranged on the left side and the right side of the vertical mounting frames and are symmetrical with the die bonding lenses, the two groups of die bonding heads are arranged on the inner sides of the two groups of die absorbing lenses, 180-degree rotating mechanisms, lifting mechanisms arranged on the 180-degree rotating mechanisms and die bonding swing arms arranged on the lifting mechanisms are arranged on the die bonding swing arms, and suction nozzles used for sucking LED chips are arranged on the die bonding swing arms;
2 groups of wafer ring moving platforms used for bearing LED chips are respectively arranged on the left side and the right side of the clamp platform and below the crystal suction lens, and a second XY axial moving mechanism and a rotary wafer frame mechanism which is arranged on the second XY axial moving mechanism and driven by the second XY axial moving mechanism to move in XY directions are arranged on the wafer ring moving platforms;
and 2 groups of thimble mechanisms used for jacking the LED chips on the crystal ring moving platform are respectively arranged below the 2 groups of crystal ring moving platforms, and the solid crystal bonding heads suck the LED chips jacked by the thimble mechanisms and rotate 180 degrees to be sent into the LED supports on the clamp platform.
Further, the die bonding unit is provided with a die suction lens for searching the position of the LED chip, the die bonding lens for searching the die bonding position of the LED support, and the die bonding head for sucking the LED chip and rotating the LED chip by 180 degrees and fixing the LED chip at the LED chip fixing position of the LED support after rotation.
Further, the die bond head includes:
the first motor is fixed on the vertical mounting rack through a motor base, and the driving end of the first motor faces downwards;
the upper end of the rotating main shaft is fixed at the driving end of the first motor and is in sliding connection with a vertically arranged guide rail, and the vertically arranged guide rail is fixed on one side of a vertical mounting plate at the lower end of the motor base; the rotating main shaft is sleeved with a connecting rod adapter, and the connecting rod adapter is arranged between the rotating main shaft and a connecting rod;
the die bonding swing arm is horizontally fixed at one end of the connecting rod adapter;
the horizontal side of the second motor is fixed on the motor base, and the second motor is connected with the connecting rod through a cam and drives the connecting rod to do lifting action;
the other end of the die bonding swing arm, which is far away from the rotating main shaft, is provided with a suction nozzle, the rotating main shaft drives the die bonding swing arm to rotate for 180 degrees through a first motor to form a 180-degree rotating mechanism, and the connecting rod drives the die bonding swing arm to vertically move through a second motor to form a lifting mechanism.
Further, the fixture platform comprises a first Y-axis platform, a first X-axis platform and a fixture assembly, and the first Y-axis platform and the first X-axis platform form a first XY axial moving mechanism;
the first X-axis platform is arranged on the first Y-axis platform and driven by the first Y-axis platform to move in the Y axial direction, and the first X-axis platform is provided with a clamp assembly which moves in the X axial direction on the first X-axis platform.
Furthermore, the first Y-axis platform comprises a first longitudinal platform, a first longitudinal slide rail and a first Y-axis motor, wherein a first longitudinal slide rail in double rows is longitudinally arranged on the surface of the first longitudinal platform, the first Y-axis motor is arranged between the first longitudinal slide rails in double rows, and the first X-axis platform is connected to the first longitudinal slide rail in double rows in a sliding manner and driven by the first Y-axis motor;
the first X-axis platform comprises a first transverse platform, a first transverse slide rail and a first X-axis motor, wherein the surface of the first transverse platform is transversely provided with a double-row first transverse slide rail, the first X-axis motor is arranged between the double-row first transverse slide rail, and the clamp assembly is connected to the first transverse slide rail in a sliding mode and driven by the first X-axis motor.
Further, the clamp assembly comprises a clamp mounting base plate, a clamp positioning strip, a clamp driver, a clamp belt, a clamp double-cylinder, a lifting gear support and a support detection;
one side of the fixture mounting base plate is provided with a lifting gear support and is positioned at one end of the fixture positioning strip and is arranged adjacent to a fixture drive, the left side and the right side of the upper part of the fixture mounting base plate are respectively provided with a fixture positioning strip and a fixture double cylinder, the left side is movably connected, the right side is fixedly connected, the fixture double cylinder is positioned between the fixture positioning strip at the left side and the fixture positioning strip at the right side, one end of the fixture positioning strip is provided with the fixture drive, the fixture drive is sleeved with a fixture belt, the front end and the rear end of the fixture positioning strip are respectively provided with a support detection, a cover plate is arranged above the fixture positioning strip at the left side and the fixture positioning strip at the right side, the cover plate avoids a solid crystal position according to the design of a customer LED support, the fixture belt is used for bearing the LED support, the support detection is used for detecting, the lifting gear support rises to block the LED support, the double clamp cylinders receive information of the lifting gear support, and the double clamp cylinders jack the LED support to be matched with the cover plate.
Further, the crystal ring moving platform comprises a second Y-axis platform, a second X-axis platform and a rotary crystal frame mechanism, wherein the second Y-axis platform is provided with the second X-axis platform, and the second X-axis platform is provided with the rotary crystal frame mechanism.
Furthermore, the second Y-axis platform comprises a second longitudinal platform, a second longitudinal slide rail and a second Y-axis motor, wherein a double-row second longitudinal slide rail is longitudinally arranged on the plate surface of the second longitudinal platform, the second Y-axis motor is arranged between the double-row second longitudinal slide rails, and the second X-axis platform is connected to the double-row second longitudinal slide rail in a sliding manner and driven by the second Y-axis motor;
the second X-axis platform comprises a second transverse platform, a second transverse slide rail and a second X-axis motor, wherein the plate surface of the second transverse platform is transversely provided with double-row-direction second transverse slide rails, the second X-axis motor is arranged between the double-row-direction second transverse slide rails, and the rotary crystal frame mechanism is connected to the double-row-direction second transverse slide rails in a sliding manner and is driven by the second X-axis motor;
the second Y-axis platform is used for longitudinally moving the rotary crystal frame mechanism, the second X-axis platform is used for transversely moving the rotary crystal frame mechanism, and the rotary crystal frame mechanism is arranged below the crystal sucking lens.
Further, the rotating crystal frame mechanism comprises a rotating crystal frame base, a rotating crystal frame driving mechanism, a rotating crystal frame belt, a tensioning belt for adjusting the tensioning belt of the rotating crystal frame belt, a rotating crystal frame guide wheel for guiding the rotating crystal frame, an origin point photoelectric reset for detecting the origin point reset of the rotating crystal frame, an automatic ring-changing cylinder for jacking the crystal frame clamping block to loosen the crystal ring, a crystal ring photoelectric induction for detecting whether the crystal ring is arranged on the rotating crystal frame or not and a crystal frame clamping block;
the rotary crystal frame base is provided with a rotary crystal frame driving mechanism and a rotary crystal frame, a rotary crystal frame belt is sleeved between the rotary crystal frame and the rotary crystal frame driving mechanism, a crystal frame clamping block is arranged on the rotary crystal frame, three rotary crystal frame guide wheels, a crystal ring photoelectric induction cylinder, an automatic ring changing cylinder and an original point photoelectric reset are arranged on the periphery of the rotary crystal frame, equilateral triangles of the rotary crystal frame guide wheels are distributed on the periphery of the rotary crystal frame and support the rotary crystal frame, and belt tensioning wheels are respectively arranged on two sides of the rotary crystal frame belt;
and an ejector pin mechanism is arranged below the rotary crystal frame and is arranged below the crystal sucking lens, and the rotary crystal frame drive is used for driving a rotary crystal frame belt to rotate so as to drive the rotary crystal frame to rotate, so that the appointed LED chip on the crystal ring is corrected.
Further, thimble mechanism includes that the cross guide adjusts the seat, controls regulation pole, front and back regulation pole, thimble drive and thimble, the regulation pole about one side of cross guide adjusts the seat is equipped with, and its opposite side is equipped with front and back regulation pole, is equipped with the thimble on the cross guide adjusts the seat and is used for driving the thimble drive of thimble vertical movement, control regulation pole and front and back regulation pole and be used for adjusting the thimble, the thimble is used for the jack-up to be located the LED chip on the brilliant ring.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses an on the LED support was sent into to the automatic LED chip of getting, improve the solid brilliant efficiency of LED and solid brilliant quality. The utility model discloses a solid brilliant device of double-end of full-automatic solid brilliant machine of mini-LED, it adopts the solid brilliant mode of two solid brilliant units of a fixture platform correspondence, and the solid brilliant unit of another side is then inhaling the brilliant when solid brilliant unit on one side is solid brilliant, and two solid brilliant units simultaneous workings have then improved nearly twice solid brilliant efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a double-head die bonder of a mini-LED full-automatic die bonder according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a die bonding unit according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a die bond head according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a clamp platform according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of a clamp assembly according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a wafer ring moving platform according to an embodiment of the present invention.
Fig. 7 is a schematic structural diagram of a rotary crystal frame mechanism according to an embodiment of the present invention.
Fig. 8 is a schematic structural diagram of an ejector pin mechanism according to an embodiment of the present invention.
In the drawings, the reference numbers: 1 die bonding unit, 11 vertical mounting rack, 12 die bonding lens, 13 die bonding head, 131 connecting rod adapter, 132 rotating main shaft, 133 first motor, 134 connecting rod, 135 second motor, 136 die bonding swing arm, 137 suction nozzle and 14 die bonding lens;
2, detecting a clamp platform, a 21 first Y-axis platform, a 211 first longitudinal platform, a 212 first longitudinal slide rail, a 22 first X-axis platform, a 221 first transverse platform, a 222 first transverse slide rail, a 23 clamp assembly, a 231 clamp mounting base plate, a 232 clamp positioning strip, a 233 clamp drive, a 234 clamp belt, a 235 clamp double-cylinder, a 236 lifting gear support and a 237 support;
3 a crystal ring moving platform, 31 a second X-axis platform, 311 a second longitudinal platform, 312 a second longitudinal slide rail, 32 a second Y-axis platform, 321 a second transverse platform, 322 a second transverse slide rail, 33 a rotary crystal frame mechanism, 331 a rotary crystal frame base, 332 a rotary crystal frame drive, 333 a rotary crystal frame, 334 a rotary crystal frame belt, 335 a belt tension pulley, 336 a rotary crystal frame guide wheel, 337 origin photoelectric reset, 338 an automatic ring-changing cylinder, 339 crystal ring photoelectric induction and 3310 crystal frame clamping block;
4 thimble mechanism, 41 cross guide rail adjusting seat, 42 left and right adjusting rod, 43 front and back adjusting rod, 44 thimble drive, 45 thimble.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is obvious that the described embodiments of the invention are only some of the embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Embodiment 1, the utility model discloses a specific structure as follows:
referring to fig. 1-8, the utility model relates to a double-head die bonder of a mini-LED full-automatic die bonder, comprising:
the fixture platform 2 is used for clamping the LED bracket and is provided with a first XY axial moving mechanism and a fixture component 23 which is arranged on the first XY axial moving mechanism and driven by the first XY axial moving mechanism to move in XY directions;
the die bonding unit 1 comprises a vertical mounting frame 11 and die bonding lenses 12 arranged in the middle of the vertical mounting frame 11, and further comprises two sets of die suction lenses 14 and two sets of die bonding heads 13 which are arranged on the left side and the right side of the vertical mounting frame 11 and are symmetrical to the die bonding lenses 12, wherein the two sets of die bonding heads 13 are arranged on the inner sides of the two sets of die suction lenses 14, a 180-degree rotating mechanism, a lifting mechanism arranged on the 180-degree rotating mechanism and a die bonding swing arm 136 arranged on the lifting mechanism are arranged on the two sets of die suction lenses 14, and a suction nozzle 137 used for sucking an LED chip is arranged on the die bonding swing arm 136;
2 groups of wafer ring moving platforms 3 used for bearing LED chips, which are respectively arranged at the left side and the right side of the clamp platform 2 and below the crystal suction lens 14, and are provided with a second XY axial moving mechanism and a rotary wafer frame mechanism 33 which is arranged on the second XY axial moving mechanism and is driven by the second XY axial moving mechanism to move in XY directions;
and 2 groups of thimble mechanisms 4 used for jacking the LED chips on the crystal ring moving platform 3 are respectively arranged below the 2 groups of crystal ring moving platforms 3, and the solid crystal bonding heads 13 suck the LED chips jacked by the thimble mechanisms 4 and rotate 180 degrees to feed the LED chips into the LED supports on the clamp platform 2.
A preferred technical solution of this embodiment: the die bonding unit 1 is provided with a die absorption lens 14 for searching the position of an LED chip, a die bonding lens 12 for searching the die bonding position of the LED support, and a die bonding head 13 for absorbing the LED chip and rotating the LED chip by 180 degrees, and fixing the LED chip at the LED chip fixing position of the LED support after the rotation.
A preferred technical solution of this embodiment: the die bond head 13 includes:
the first motor 133 is fixed on the vertical mounting rack 11 through a motor base, and the driving end of the first motor faces downwards;
a rotating spindle 132, the upper end of which is fixed at the driving end of the first motor 133 and is slidably connected to a vertically arranged guide rail, and the vertically arranged guide rail is fixed at one side of a vertical mounting plate at the lower end of the motor base; a connecting rod adaptor 131 is sleeved on the rotating main shaft 132, and the connecting rod adaptor 131 is arranged between the rotating main shaft 132 and a connecting rod 134;
a die bonding swing arm 136 horizontally fixed at one end of the connecting rod adaptor 131;
the second motor 135, the horizontal side is fixed on the motor cabinet, it connects the said tie rod 134 and drives the said tie rod 134 to do the lifting movement through the cam;
the other end of the die bonding swing arm 136, which is far away from the rotating main shaft 132, is provided with a suction nozzle 137, the rotating main shaft 132 drives the die bonding swing arm 136 to rotate for 180 degrees through a first motor 133 to form a 180-degree rotating mechanism, and the connecting rod 134 drives the die bonding swing arm 136 to vertically move through a second motor 135 to form a lifting mechanism.
A preferred technical solution of this embodiment: the clamp platform 2 comprises a first Y-axis platform 21, a first X-axis platform 22 and a clamp assembly 23, wherein the first Y-axis platform 21 and the first X-axis platform 22 form a first XY axial moving mechanism;
the first X-axis platform 22 is disposed on the first Y-axis platform 21 and driven by the first Y-axis platform 21 to move in the Y-axis direction, the first X-axis platform 22 is provided with a clamp assembly 23, and the clamp assembly 23 moves in the X-axis direction on the first X-axis platform 22.
A preferred technical solution of this embodiment: the first Y-axis platform 21 comprises a first longitudinal platform 211, a first longitudinal slide rail 212 and a first Y-axis motor, wherein the plate surface of the first longitudinal platform 211 is longitudinally provided with double-row first longitudinal slide rails 212, the first Y-axis motor is arranged between the double-row first longitudinal slide rails 212, and the first X-axis platform 22 is connected to the double-row first longitudinal slide rails 212 in a sliding manner and driven by the first Y-axis motor;
the first X-axis platform 22 includes a first transverse platform 221, a first transverse slide rail 222 and a first X-axis motor, the first transverse slide rail 222 is transversely disposed on the plate surface of the first transverse platform 221 in two rows, the first X-axis motor is disposed between the first transverse slide rails 222 in two rows, and the clamp assembly 23 is slidably connected to the first transverse slide rail 222 and is driven by the first X-axis motor.
A preferred technical solution of this embodiment: the clamp assembly 23 comprises a clamp mounting base plate 231, a clamp positioning bar 232, a clamp driver 233, a clamp belt 234, a clamp double cylinder 235, a lifting gear bracket 236 and a bracket detector 237;
one side of the fixture mounting base plate 231 is provided with a shift-up and shift-down bracket 236, one end of the fixture positioning strip 232 is adjacent to the fixture driving 233, the left side and the right side of the upper portion of the fixture mounting base plate 231 are respectively provided with the fixture positioning strip 232 and the fixture double cylinder 235, the left side is movably connected, the right side is fixedly connected, the fixture double cylinder 235 is positioned between the fixture positioning strip 232 on the left side and the fixture positioning strip 232 on the right side, one end of the fixture positioning strip 232 is provided with the fixture driving 233, the fixture driving 233 is sleeved with a fixture belt 234, the front end and the rear end of the fixture positioning strip 232 are respectively provided with a bracket detection 237, a cover plate is arranged above the fixture positioning strip 232 on the left side and the fixture positioning strip 232 on the right side, the cover plate avoids a die bonding position according to the design of a customer LED bracket, the fixture belt 234 is used for, the bracket detection 237 detects that the LED bracket transmits information to the lifting gear bracket 236, the lifting gear bracket 236 rises to block the LED bracket, the double clamp cylinders 235 receive the information of the lifting gear bracket 236, and the double clamp cylinders 235 jack up the LED bracket to be matched with the cover plate.
A preferred technical solution of this embodiment: the crystal ring moving platform 3 comprises a second Y-axis platform 31, a second X-axis platform 32 and a rotary crystal frame mechanism 33, the second Y-axis platform 31 is provided with the second X-axis platform 32, and the second X-axis platform 32 is provided with the rotary crystal frame mechanism 33.
A preferred technical solution of this embodiment: the second Y-axis platform 31 comprises a second longitudinal platform 311, a second longitudinal slide rail 312 and a second Y-axis motor, wherein the plate surface of the second longitudinal platform 311 is longitudinally provided with two rows of second longitudinal slide rails 312, the second Y-axis motor is arranged between the two rows of second longitudinal slide rails 312, and the second X-axis platform 32 is connected to the two rows of second longitudinal slide rails 312 in a sliding manner and driven by the second Y-axis motor;
the second X-axis platform 32 includes a second transverse platform 321, a second transverse slide rail 322 and a second X-axis motor, the plate surface of the second transverse platform 321 is transversely provided with two rows of second transverse slide rails 322, a second X-axis motor is arranged between the two rows of second transverse slide rails 322, and the rotating crystal frame mechanism 33 is slidably connected to the two rows of second transverse slide rails 322 and driven by the second X-axis motor;
the second Y-axis platform 31 is used for moving the rotating crystal frame mechanism 33 longitudinally, the second X-axis platform 32 is used for moving the rotating crystal frame mechanism 33 transversely, and the rotating crystal frame mechanism 33 is arranged below the crystal-sucking lens 14.
A preferred technical solution of this embodiment: the rotary crystal frame mechanism 33 comprises a rotary crystal frame base 331, a rotary crystal frame driving mechanism 332, a rotary crystal frame 333, a rotary crystal frame belt 334, a tensioning belt 335 for adjusting the rotary crystal frame belt 334, a rotary crystal frame guide wheel 336 for guiding the rotary crystal frame 333, an origin point photoelectric reset 337 for detecting the origin point reset of the rotary crystal frame 333, an automatic ring-changing cylinder 338 for jacking the crystal frame clamping block 3310 to loosen a crystal ring, a crystal ring photoelectric sensor 339 for detecting whether the crystal ring is arranged on the rotary crystal frame 333, and a crystal frame clamping block 3310;
a rotary crystal frame driving mechanism 332 and a rotary crystal frame 333 are arranged on the rotary crystal frame base 331, a rotary crystal frame belt 334 is sleeved between the rotary crystal frame 333 and the rotary crystal frame driving mechanism 332, a crystal frame clamping block 3310 is arranged on the rotary crystal frame 333, three rotary crystal frame guide wheels 336, a crystal ring photoelectric induction 339, an automatic ring changing cylinder 338 and an original point photoelectric reset 337 are arranged on the periphery of the rotary crystal frame 333, equilateral triangles of the rotary crystal frame guide wheels 336 are distributed on the periphery of the rotary crystal frame 333 and support the rotary crystal frame 333, and belt tensioning wheels 335 are respectively arranged on two sides of the rotary crystal frame belt 334;
an ejector pin mechanism 4 is arranged below the rotary crystal frame 333 and below the crystal-absorbing lens 14, and the rotary crystal frame driver 332 is used for driving the rotary crystal frame belt 334 to rotate so as to drive the rotary crystal frame to rotate 333 and further correct the specified LED chip on the crystal ring.
A preferred technical solution of this embodiment: the thimble mechanism 4 includes that the guide rail that intersects adjusts seat 41, controls and adjusts pole 42, front and back regulation pole 43, thimble drive 44 and thimble 45, the pole 42 is adjusted about adjusting to one side of guide rail that intersects adjusts seat 41 is equipped with, and its opposite side is equipped with front and back regulation pole 43, is equipped with thimble 45 on the guide rail that intersects adjusts seat 41 and is used for driving thimble drive 44 of thimble 45 vertical movement, control and adjust pole 42 and front and back regulation pole 43 and be used for adjusting thimble 45, thimble 45 is used for the jack-up to be located the LED chip on the brilliant ring.
Embodiment 2, the utility model discloses solid brilliant device of double-end operation principle as follows, including following step:
(1) the crystal absorption lens 14 assists the crystal ring on the crystal ring moving platform 3 to move to a designated position and automatically correct;
(2) the thimble mechanism 4 jacks up the appointed LED chip on the crystal ring moving platform 3;
(3) the die bonding head 13 sucks the LED chip jacked up by the die bonding head and then rotates 180 degrees to move to the upper part of the clamp platform, and the clamp assembly 23 moves the LED support to the designated position with the assistance of the die bonding lens.
(4) And then, the die bond heads 13 drive the swing arms to move downwards to fix the LED chips on the positions appointed by the support, and meanwhile, the other die bond head just sucks the other LED chip jacked up by the thimble mechanism.
(5) And the two die bonding heads 13 alternately perform die bonding until the LED bracket is fully bonded with the required LED chip.
To sum up, the utility model discloses a solid brilliant device of double-end of full-automatic solid brilliant machine of mini-LED, it adopts the solid brilliant mode of two solid brilliant units of a fixture platform correspondence, and the solid brilliant unit of another side is then inhaling the brilliant when solid brilliant unit on one side is at solid brilliant, and two solid brilliant units simultaneous working have then improved nearly twice solid brilliant efficiency.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.
Claims (10)
1. The utility model provides a solid brilliant device of double-end of full-automatic solid brilliant machine of mini-LED which characterized in that includes:
the fixture platform (2) is used for clamping the LED support and is provided with a first XY axial moving mechanism and a fixture component (23) which is arranged on the first XY axial moving mechanism and driven by the first XY axial moving mechanism to move in the XY direction;
the die bonding unit (1) comprises a vertical mounting frame (11) spliced together, a die bonding lens (12) arranged in the middle of the vertical mounting frame (11), two groups of die suction lenses (14) and two groups of die bonding heads (13) which are arranged on the left side and the right side of the vertical mounting frame (11) and are symmetrical to the die bonding lens (12), wherein the two groups of die bonding heads (13) are arranged on the inner sides of the two groups of die suction lenses (14), a 180-degree rotating mechanism, a lifting mechanism arranged on the 180-degree rotating mechanism and a die bonding swing arm (136) arranged on the lifting mechanism are arranged on the two groups of die bonding heads, and a suction nozzle (137) used for sucking an LED chip is arranged on the die bonding swing arm (136);
2 groups of wafer ring moving platforms (3) used for bearing LED chips are respectively arranged on the left side and the right side of the clamp platform (2) and below the wafer suction lens (14), and a second XY axial moving mechanism and a rotary wafer frame mechanism (33) which is arranged on the second XY axial moving mechanism and driven by the second XY axial moving mechanism to move in XY directions are arranged on the wafer ring moving platforms;
2 sets of thimble mechanism (4) that are used for with LED chip jack-up on brilliant ring moving platform (3) set up respectively 2 the below of brilliant ring moving platform (3) of group, solid brilliant bonding head (13) will be by the LED chip of thimble mechanism (4) jack-up is sucked and is rotated 180 degrees and send into on the LED support on anchor clamps platform (2).
2. The double-head die bonder of a mini-LED full-automatic die bonder as claimed in claim 1, wherein: the die bonding unit (1) is characterized in that a die absorption lens (14) on the die bonding unit is used for searching the position of an LED chip, the die bonding lens (12) is used for searching the die bonding position of the LED bracket, the die bonding head (13) is used for absorbing the LED chip and rotating the LED chip by 180 degrees, and the LED chip is fixed at the LED chip fixing position of the LED bracket after the die bonding head rotates.
3. The double-head die bonder of a mini-LED full-automatic die bonder as claimed in claim 2, wherein: the die bond head (13) comprises:
the first motor (133) is fixed on the vertical mounting rack (11) through a motor base, and the driving end of the first motor faces downwards;
the upper end of the rotating main shaft (132) is fixed at the driving end of the first motor (133) and is in sliding connection with a vertically arranged guide rail, and the vertically arranged guide rail is fixed on one side of a vertical mounting plate at the lower end of the motor base; the rotating main shaft (132) is sleeved with a connecting rod adapter (131), and the connecting rod adapter (131) is arranged between the rotating main shaft (132) and a connecting rod (134);
the die bonding swing arm (136) is horizontally fixed at one end of the connecting rod adapter (131);
the horizontal side of the second motor (135) is fixed on the motor base, and the second motor is connected with the connecting rod (134) through a cam and drives the connecting rod (134) to do lifting action;
the other end of the die bonding swing arm (136), which is far away from the rotating main shaft (132), is provided with a suction nozzle (137), the rotating main shaft (132) drives the die bonding swing arm (136) to rotate for 180 degrees through a first motor (133) to form a 180-degree rotating mechanism, and the connecting rod (134) drives the die bonding swing arm (136) to vertically move through a second motor (135) to form a lifting mechanism.
4. The double-head die bonder of a mini-LED full-automatic die bonder as claimed in claim 1, wherein: the fixture platform (2) comprises a first Y-axis platform (21), a first X-axis platform (22) and a fixture assembly (23), and the first Y-axis platform (21) and the first X-axis platform (22) form a first XY axial moving mechanism;
the first X-axis platform (22) is arranged on the first Y-axis platform (21) and driven by the first Y-axis platform (21) to move in the Y-axis direction, a clamp assembly (23) is arranged on the first X-axis platform (22), and the clamp assembly (23) moves in the X-axis direction on the first X-axis platform (22).
5. The double-head die bonder of a mini-LED full-automatic die bonder as claimed in claim 4, wherein: the first Y-axis platform (21) comprises a first longitudinal platform (211), a first longitudinal slide rail (212) and a first Y-axis motor, wherein the plate surface of the first longitudinal platform (211) is longitudinally provided with double-row first longitudinal slide rails (212), the first Y-axis motor is arranged between the double-row first longitudinal slide rails (212), and the first X-axis platform (22) is connected to the double-row first longitudinal slide rails (212) in a sliding manner and driven by the first Y-axis motor;
the first X-axis platform (22) comprises a first transverse platform (221), a first transverse sliding rail (222) and a first X-axis motor, wherein a double-row first transverse sliding rail (222) is transversely arranged on the plate surface of the first transverse platform (221), the first X-axis motor is arranged between the double-row first transverse sliding rails (222), and the clamp assembly (23) is connected to the first transverse sliding rail (222) in a sliding mode and driven by the first X-axis motor.
6. The double-head die bonder of a mini-LED full-automatic die bonder according to claim 5, wherein the double-head die bonder is characterized in that: the clamp assembly (23) comprises a clamp mounting base plate (231), a clamp positioning strip (232), a clamp driver (233), a clamp belt (234), a clamp double-cylinder (235), a lifting gear bracket (236) and a bracket detector (237);
one side of the fixture installation bottom plate (231) is provided with a lifting gear support (236) and one end of the fixture positioning strip (232) is arranged adjacent to the fixture drive (233), the left side and the right side of the top of the fixture installation bottom plate (231) are respectively provided with the fixture positioning strip (232) and the fixture double cylinder (235), the left side is a movable connection, the right side is a fixed connection, the fixture double cylinder (235) is arranged between the fixture positioning strip (232) on the left side and the fixture positioning strip (232) on the right side, one end of the fixture positioning strip (232) is provided with the fixture drive (233), the fixture drive (233) is sleeved with a fixture belt (234), the front end and the rear end of the fixture positioning strip (232) are respectively provided with support detection (237), a cover plate is arranged above the fixture positioning strip (232) on the left side and the fixture positioning strip (232) on the right side, and the cover plate avoids a die, the LED support structure is characterized in that the clamp belt (234) is used for bearing an LED support, the support detection (237) is used for detecting whether the LED support is arranged on the clamp belt (234) or not, the support detection (237) detects that the LED support transmits information to the lifting gear support (236), the lifting gear support (236) is lifted up to block the LED support, the double clamp cylinders (235) receive the information of the lifting gear support (236), and the double clamp cylinders (235) jack up the LED support to be matched with the cover plate.
7. The double-head die bonder of a mini-LED full-automatic die bonder as claimed in claim 1, wherein: the crystal ring moving platform (3) comprises a second Y-axis platform (31), a second X-axis platform (32) and a rotary crystal frame mechanism (33), the second Y-axis platform (31) is provided with the second X-axis platform (32), and the second X-axis platform (32) is provided with the rotary crystal frame mechanism (33).
8. The double-head die bonder of a mini-LED full-automatic die bonder as claimed in claim 7, wherein: the second Y-axis platform (31) comprises a second longitudinal platform (311), a second longitudinal slide rail (312) and a second Y-axis motor, wherein the plate surface of the second longitudinal platform (311) is longitudinally provided with double-row second longitudinal slide rails (312), the second Y-axis motor is arranged between the double-row second longitudinal slide rails (312), and the second X-axis platform (32) is connected to the double-row second longitudinal slide rails (312) in a sliding manner and driven by the second Y-axis motor;
the second X-axis platform (32) comprises a second transverse platform (321), a second transverse sliding rail (322) and a second X-axis motor, wherein the plate surface of the second transverse platform (321) is transversely provided with double-row second transverse sliding rails (322), the second X-axis motor is arranged between the double-row second transverse sliding rails (322), and the rotary crystal frame mechanism (33) is connected to the double-row second transverse sliding rails (322) in a sliding manner and is driven by the second X-axis motor;
the second Y-axis platform (31) is used for longitudinally moving the rotary crystal frame mechanism (33), the second X-axis platform (32) is used for transversely moving the rotary crystal frame mechanism (33), and the rotary crystal frame mechanism (33) is arranged below the crystal absorption lens (14).
9. The double-head die bonder of a mini-LED full-automatic die bonder as claimed in claim 8, wherein: the rotary crystal frame mechanism (33) comprises a rotary crystal frame base (331), a rotary crystal frame driving mechanism (332), a rotary crystal frame (333), a rotary crystal frame belt (334), a tensioning belt (335) for adjusting the rotary crystal frame belt (334), a rotary crystal frame guide wheel (336) for guiding the rotary crystal frame (333), an origin point photoelectric reset (337) for detecting the origin point reset of the rotary crystal frame (333), an automatic ring-changing cylinder (338) for pushing the crystal frame clamping block (3310) tightly so as to loosen the crystal ring, a crystal ring photoelectric induction (339) for detecting whether the crystal ring is arranged on the rotary crystal frame (333) or not, and a crystal frame clamping block (3310);
a rotary crystal frame driving mechanism (332) and a rotary crystal frame (333) are arranged on the rotary crystal frame base (331), a rotary crystal frame belt (334) is sleeved between the rotary crystal frame (333) and the rotary crystal frame driving mechanism (332), a crystal frame clamping block (3310) is arranged on the rotary crystal frame (333), three rotary crystal frame guide wheels (336), a crystal ring photoelectric induction (339), an automatic ring changing cylinder (338) and an origin point photoelectric reset (337) are arranged on the periphery of the rotary crystal frame (333), equilateral triangles of the rotary crystal frame guide wheels (336) are distributed on the periphery of the rotary crystal frame (333) and support the rotary crystal frame (333), and belt tensioning wheels (335) are respectively arranged on two sides of the rotary crystal frame belt (334);
an ejector pin mechanism (4) is arranged below the rotary crystal frame (333) and arranged below the crystal absorption lens (14), and the rotary crystal frame driver (332) is used for driving the rotary crystal frame belt (334) to rotate so as to drive the rotary crystal frame to rotate (333) and further correct the appointed LED chip on the crystal ring.
10. The double-head die bonder of a mini-LED full-automatic die bonder as claimed in claim 1, wherein: thimble mechanism (4) adjust pole (42), front and back regulation pole (43), thimble drive (44) and thimble (45) including cross guide rail regulation seat (41), about, adjust pole (42) in cross guide rail regulation seat (41) one side is equipped with, and its opposite side is equipped with front and back regulation pole (43), is equipped with thimble (45) and is used for driving thimble drive (44) of thimble (45) vertical movement on cross guide rail regulation seat (41), it is used for adjusting thimble (45) to control regulation pole (42) and front and back regulation pole (43), thimble (45) are used for the jack-up to be located brilliant LED chip on encircling.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921909775.5U CN210576014U (en) | 2019-11-07 | 2019-11-07 | Double-head die bonder of mini-LED full-automatic die bonder |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921909775.5U CN210576014U (en) | 2019-11-07 | 2019-11-07 | Double-head die bonder of mini-LED full-automatic die bonder |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725699A (en) * | 2020-06-05 | 2020-09-29 | 哈工大机器人南昌智能制造研究院 | Method for detecting photoelectric property of Bar laser chip |
| CN114733794A (en) * | 2022-04-27 | 2022-07-12 | 泉州兰姆达仪器设备有限公司 | Laser chip appearance detection sorting machine and working method thereof |
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2019
- 2019-11-07 CN CN201921909775.5U patent/CN210576014U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725699A (en) * | 2020-06-05 | 2020-09-29 | 哈工大机器人南昌智能制造研究院 | Method for detecting photoelectric property of Bar laser chip |
| CN111725699B (en) * | 2020-06-05 | 2021-06-08 | 哈工大机器人南昌智能制造研究院 | Method for detecting photoelectric property of Bar laser chip |
| CN114733794A (en) * | 2022-04-27 | 2022-07-12 | 泉州兰姆达仪器设备有限公司 | Laser chip appearance detection sorting machine and working method thereof |
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