CN209766467U - double-swing-arm die bonder for die bonding of LED - Google Patents
double-swing-arm die bonder for die bonding of LED Download PDFInfo
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- CN209766467U CN209766467U CN201920785614.3U CN201920785614U CN209766467U CN 209766467 U CN209766467 U CN 209766467U CN 201920785614 U CN201920785614 U CN 201920785614U CN 209766467 U CN209766467 U CN 209766467U
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Abstract
The utility model discloses a solid brilliant device of double swing arm of solid brilliant of LED, solid brilliant device include the platen, set up the solid brilliant mechanism of double swing arm on the platen, and the solid brilliant mechanism top of double swing arm is provided with brilliant ring moving platform, and its below is provided with anchor clamps moving platform, anchor clamps moving platform one side is provided with automatic brilliant ring mechanism of going up, and the opposite side is provided with the camera lens subassembly, and brilliant ring moving platform top still is provided with thimble assembly. The lens assembly is used for assisting the wafer ring moving platform and the clamp to move to a specified position, the thimble assembly is used for ejecting the LED wafer on the wafer ring moving platform, the double-swing-arm wafer fixing mechanism respectively sucks the ejected wafer and then fixes the ejected wafer on the LED bracket by driving the two wafer fixing arms to rotate along a plane vertical to the horizontal plane, and the automatic wafer ring feeding mechanism is used for feeding or recycling the wafer ring; compared with the traditional die bonding mode, the die bonding device carries out continuous die bonding by arranging two die bonding swing arms to rotate, improves the die bonding speed and has wide application range.
Description
Technical Field
the utility model relates to a LED processing equipment, specific saying so relates to a solid brilliant device of double swing arm of solid brilliant of LED.
Background
a Light Emitting Diode (LED) is a Light Emitting element that can convert electrical energy into Light energy. The LED product can be used in a plurality of fields such as illumination, display, signal indication and the like. With the continuous development of LED technology, the die bonding speed of LEDs is required to be higher and higher.
the existing LED die bonding process is as follows: because the LED chips are usually adhered to the die ring film in a centralized manner by a supplier, the specified LED chip is lifted from the die ring film by the ejector pin mechanism, then the die bonding swing arm of the die bonding mechanism horizontally rotates to a position right above the specified LED chip, and then moves up and down to absorb the specified LED chip on the die ring film and transport the same to the specified position of the dispensed LED support, and then the die bonding swing arm moves up and down to complete the die bonding operation. The working mode can only absorb and convey one LED wafer at a time, so that the working efficiency is low and the die bonding speed is low. For die bonding of a large-size LED support, the length and the weight of the swing arm are increased to meet die bonding requirements in a traditional die bonding mode, the inertia amount of the swing arm in the movement process is increased due to the increase of the length and the weight of the swing arm, and accordingly speed and precision are reduced.
in view of the above defects and market demands in the prior art, there is a strong need to develop a novel LED die bonding apparatus.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the to-be-solved technical problem of the utility model lies in providing a solid brilliant device of double swing arm of solid brilliant of LED, and the purpose of the solid brilliant device of double swing arm of the solid brilliant of research and development this LED reduces LED processing link, improves LED machining efficiency and precision.
In order to solve the technical problem, the utility model discloses a following scheme realizes: a double-swing-arm die bonder for LED die bonding comprises:
a platen;
further comprising, disposed on the platen:
the die bonding mechanism is provided with two die bonding swing arms, a telescopic driving mechanism for driving the two die bonding swing arms to move oppositely or reversely, and a rotary driving mechanism which is connected with and drives the telescopic driving mechanism to drive the two die bonding swing arms to rotate;
the fixture moving platform is arranged on the adjacent side of the die bonding mechanism, a first transverse slide rail mechanism, a first longitudinal slide rail mechanism seated on the first transverse slide rail mechanism and a belt pulley assembly which is arranged at the upper end of the first longitudinal slide rail mechanism and used for receiving and conveying an LED support are arranged on the fixture moving platform, and the LED support can be conveyed to the clamping parts of the two die bonding swing arms;
the fixture comprises a fixture moving platform, a mounting frame, a first transverse sliding rail mechanism, a first longitudinal sliding rail mechanism, a crystal frame mounting plate and a belt rotating assembly, wherein the fixture moving platform is vertically fixed at the corner side of the fixture moving platform, the lower bottom surface of the mounting plate at the upper end of the fixture moving platform is provided with a crystal ring moving platform assembly and an ejector pin assembly, the crystal ring moving platform assembly is provided with a second transverse sliding rail mechanism, the second longitudinal sliding rail mechanism is arranged at the lower side of the second transverse sliding rail mechanism, the crystal frame mounting plate is horizontally arranged on the second longitudinal sliding rail mechanism, the belt rotating assembly is arranged on the crystal frame mounting plate, the belt rotating assembly is provided with a crystal ring placing groove for placing a crystal ring, and;
The lens assembly is arranged on one side of the clamp moving platform, and is provided with a crystal taking lens assembly which is used for matching with the crystal ring moving platform assembly to move to a set position and carrying out wafer correction and a crystal fixing lens assembly which is used for assisting the clamp moving platform to move the LED support to the set position;
the automatic crystal ring feeding mechanism is provided with a material box lifting assembly and a crystal ring carrying assembly, wherein the material box lifting assembly is used for lifting a material box, crystal rings are stored in the material box, and the material box lifting assembly lifts the material box to a set height to enable the crystal ring carrying assembly to pick up the crystal rings and send the crystal rings to a crystal ring placing groove on the crystal ring moving platform assembly.
Furthermore, the die bonding mechanism also comprises a die bonding base fixed on the bedplate, a transverse rotary driving mechanism is arranged on the top plate surface of the die bonding base, the rotary driving mechanism is rigidly connected with the telescopic driving mechanism, both ends of the telescopic driving mechanism are provided with telescopic parts, the outer ends of the telescopic parts are provided with connecting blocks, the connecting blocks are connected with die bonding swing arms, the two die bonding swing arms are positioned on a straight line and move oppositely or oppositely to form opening and closing type loosening or clamping action, the side part of the telescopic driving mechanism is also provided with a cross slide rail, the die bonding swing arm is driven by the telescopic driving mechanism to perform telescopic motion along the cross slide rail, the die bonding swing arm can rotate and stretch relative to the die bonding base in the rotating plane, the telescopic driving mechanism and the die bonding swing arm rotate together in a plane which is perpendicular to the horizontal plane under the driving of the rotary driving mechanism.
further, the fixture moving platform comprises a first base, a first longitudinal slide rail longitudinally arranged on the first base, and a first transverse slide rail transversely arranged on the first longitudinal slide rail, wherein two first longitudinal slide rails are arranged and fixed on the first base side by side, and form a first longitudinal slide rail mechanism with a slide block arranged at the lower end of the first transverse slide rail, and a fixture mounting seat is arranged on the first transverse slide rail;
the first transverse sliding table is provided with two first transverse sliding rails which are fixed on the first transverse sliding table side by side and form a first transverse sliding rail mechanism together with a sliding block arranged at the bottom of the fixture mounting seat;
The LED support frame comprises a clamp mounting seat, and is characterized in that a belt pulley assembly is arranged on the clamp mounting seat, the belt pulley assembly comprises a belt and a motor assembly for driving the belt to rotate, a support plate connecting block is arranged on a belt descending belt, the support plate connecting block is connected with a support plate, the motor assembly drives the belt to rotate so as to drive the support plate to move back and forth, an LED support conveying device is arranged on the support plate and used for receiving and conveying the LED support, and the belt pulley assembly transversely and longitudinally moves through a first longitudinal slide rail and a first transverse slide table;
The first longitudinal sliding rail and the first transverse sliding table are driven by motors respectively connected with the first longitudinal sliding rail and the first transverse sliding table.
further, the crystal ring moving platform assembly comprises a second base fixed on the lower end face of the mounting plate at the upper end of the mounting frame, a second transverse slide rail transversely arranged on the second base, and a first longitudinal slide rail longitudinally arranged on the second transverse slide rail, wherein a second longitudinal slide rail is arranged on the first longitudinal slide rail, a crystal frame mounting plate is arranged on the second longitudinal slide rail, a belt rotating assembly is arranged on the crystal frame mounting plate, a crystal ring placing groove for placing a crystal ring is arranged on the belt rotating assembly, the crystal ring is sent into the crystal ring placing groove from the automatic crystal ring feeding mechanism, and the crystal ring can rotate by using the belt rotating assembly and can transversely and longitudinally move through the second transverse slide rail and the second longitudinal slide rail;
the two second transverse sliding rails are arranged on two sides of the lower end face of the second base, a sliding block is arranged between the two second transverse sliding rails, the sliding block is connected with a first motor through a first screw rod and forms a second transverse sliding rail mechanism with the second transverse sliding rails, and the first motor drives the screw rod to rotate to drive the sliding block and a second longitudinal sliding rail mechanism connected with the lower end of the sliding block to move;
The second longitudinal sliding rail mechanism is provided with two second longitudinal sliding rails and sliding block assemblies, the two second longitudinal sliding rails are arranged on two sides of the lower end of the first longitudinal sliding table, the sliding block assemblies are connected with a second motor through a second screw rod, and the second motor drives the second screw rod to rotate so as to drive the sliding block assemblies and a crystal frame mounting plate connected with the lower end of the sliding block assemblies to longitudinally move.
Furthermore, the thimble assembly comprises a thimble and a thimble driving mechanism, the thimble driving mechanism is used for driving the thimble to move up and down, and the thimble is used for jacking the wafer located at the set position on the wafer ring.
the lens assembly comprises a lens assembly fixing column, a crystal taking lens assembly and a crystal fixing lens assembly, the crystal taking lens assembly and the crystal fixing lens assembly are fixed on the upper portion of the side face of the lens assembly fixing column one above the other, a lens and a camera are arranged on the crystal taking lens assembly and the crystal fixing lens assembly, the crystal taking lens assembly is used for being matched with the crystal ring moving platform assembly to move to a set position and correct a wafer, the crystal fixing lens assembly is used for being matched with the clamp moving platform to move the LED support to the set position, and the lens and the camera on the crystal taking lens assembly and the crystal fixing lens assembly are used for recognizing and storing images.
Further, the automatic crystal ring feeding mechanism comprises a material box lifting assembly and a crystal ring carrying assembly;
the material box lifting component comprises a third motor, a third screw rod, a first sliding block component and a material box, the third motor is arranged in a hole of the bedplate through a motor box, the driving end of the third motor is upward and connected with the upward third screw rod, the third screw rod is connected with the first sliding block component, a horizontal plate is horizontally arranged on the first sliding block component in an inclined upward direction, the material box is arranged on the horizontal plate, the vertical side plate of the first sliding block component is arranged on a vertical sliding rail, the vertical sliding rail is fixed on a support plate at the upper end of the motor box,
The crystal ring carrying assembly is arranged on the side adjacent to the material box lifting assembly and comprises a screw rod mounting seat, a fourth motor, a fourth screw rod, a second sliding block assembly and a crystal ring clamping frame, the screw rod mounting seat is fixed on the bedplate, the fourth screw rod is arranged in the screw rod mounting seat, the fourth motor is fixed at one side end of the screw rod mounting seat, the driving end of the fourth motor is connected with the fourth screw rod, the rod body of the fourth screw rod is in threaded connection with the crystal ring clamping frame, the crystal ring clamping frame comprises an L-shaped support rod and a crystal ring clamping part, the tail end of the L-shaped support is connected with the crystal ring clamping part, the crystal ring clamping part is provided with a clamping cylinder, and the clamping part of the clamping cylinder faces the direction of the material box;
The material box lifting assembly is used for lifting crystal rings stored in the material box, the fourth motor drives the fourth screw to rotate so as to drive the second sliding block assembly to move, the second sliding block assembly drives the crystal ring clamping frame to move, the clamping portion on the clamping cylinder enters the material box to clamp the crystal rings, and then the crystal rings are conveyed to the crystal ring placing groove on the crystal ring moving platform assembly through the crystal ring carrying assembly.
compared with the prior art, the beneficial effects of the utility model are that:
1. compare with the solid brilliant mode of tradition, the utility model discloses be provided with two solid brilliant swing arms and carry out solid brilliant in succession, improved solid brilliant efficiency.
2. The utility model discloses compact structure has saved the production place for the enterprise, need not to increase the solid brilliant of the LED support of swing arm length just adaptable various sizes, a tractor serves several purposes, and adaptability is better, can effectively improve the performance of enterprises simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of a double-swing-arm die bonder in an embodiment of the application.
Fig. 2 is an exploded schematic view of a double-swing-arm die bonder according to an embodiment of the application.
Fig. 3 is a schematic structural view of a clamp platform of the double-swing-arm die bonder according to the embodiment of the application.
Fig. 4 is a schematic structural diagram of a wafer ring moving platform of the double-swing-arm die bonder in the embodiment of the present application.
fig. 5 is a schematic structural diagram of a lens assembly of a double-swing-arm die bonder in an embodiment of the present application.
Fig. 6 is a schematic structural diagram of an ejector pin assembly of the double-swing-arm die bonder in the embodiment of the application.
Fig. 7 is a schematic structural diagram of a double-swing-arm die bonding mechanism of the double-swing-arm die bonding device according to the embodiment of the present application.
fig. 8 is a schematic structural diagram of an automatic die-feeding ring of the double-swing-arm die bonder in the embodiment of the present application.
Detailed Description
the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is obvious that the described embodiments of the invention are only some of the embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
embodiment 1, the utility model discloses a specific structure as follows:
referring to fig. 1-8, the present invention provides a double-swing arm die bonder for die bonding of LED, comprising:
A platen 1;
Further comprising, provided on the platen 1:
The die bonding mechanism 6 is provided with two die bonding swing arms 6-4, a telescopic driving mechanism 6-3 for driving the two die bonding swing arms 6-4 to move in opposite directions or in opposite directions, and a rotary driving mechanism 6-2 for connecting and driving the telescopic driving mechanism 6-3 to drive the two die bonding swing arms 6-4 to rotate;
The fixture moving platform 2 is arranged on the adjacent side of the die bonding mechanism 6, a first transverse slide rail mechanism, a first longitudinal slide rail mechanism seated on the first transverse slide rail mechanism and a belt pulley assembly 2-6 which is arranged at the upper end of the first longitudinal slide rail mechanism and used for receiving and conveying an LED support are arranged on the fixture moving platform, and the LED support can be conveyed to clamping parts of the two die bonding swing arms 6-4;
the fixture comprises a fixture moving platform 2, a mounting frame, a second transverse sliding rail mechanism, a second longitudinal sliding rail mechanism, a crystal frame mounting plate 3-5 and a belt rotating assembly 3-6, wherein the fixture moving platform 2 is vertically fixed at the corner side of the fixture moving platform, the lower bottom surface of the mounting plate at the upper end of the fixture moving platform is provided with a crystal ring moving platform assembly 3 and a thimble assembly 5, the crystal ring moving platform assembly 3 is provided with a second transverse sliding rail mechanism, the second longitudinal sliding rail mechanism is arranged at the lower side of the second transverse sliding rail mechanism, the crystal frame mounting plate 3-5 is horizontally arranged on the second longitudinal sliding rail mechanism, the belt rotating assembly 3-6 is arranged on the crystal frame mounting plate 3-5, a crystal ring placing groove for placing a crystal ring is arranged on the belt;
the lens assembly 4 is arranged on one side of the clamp moving platform 2, and is provided with a crystal taking lens assembly 4-1 which is used for matching with the crystal ring moving platform assembly 3 to move to a set position and carrying out wafer correction and a crystal fixing lens assembly 4-2 which is used for assisting the clamp moving platform 2 to move the LED support to the set position;
The automatic crystal ring feeding mechanism 7 is provided with a material box lifting assembly 7-1 and a crystal ring carrying assembly 7-2, wherein the material box lifting assembly 7-1 is used for lifting a material box, crystal rings are stored in the material box, and the material box lifting assembly 7-1 lifts the material box to a set height so that the crystal ring carrying assembly 7-2 picks up the crystal rings and sends the crystal rings to a crystal ring placing groove on the crystal ring moving platform assembly 3.
a preferred technical solution of this embodiment: the die bonding mechanism 6 further comprises a die bonding base 6-1 fixed on the bedplate 1, a transverse rotary driving mechanism 6-2 is arranged on the top plate surface of the die bonding base 6-1, the rotary driving mechanism 6-2 is rigidly connected with a telescopic driving mechanism 6-3, telescopic parts are arranged at two ends of the telescopic driving mechanism 6-3, a connecting block is arranged at the outer end of each telescopic part and connected with a die bonding swing arm 6-4, the two die bonding swing arms 6-4 are positioned on a straight line, the two die bonding swing arms 6-4 move oppositely or oppositely to form opening and closing type loosening or clamping actions, a cross slide rail 6-5 is further arranged at the side part of the telescopic driving mechanism 6-3, the die bonding swing arms 6-4 perform telescopic movement along the cross slide rail 6-5 under the driving of the telescopic driving mechanism 6-3, and the die bonding swing arm 6-4 can rotate and do telescopic motion in the rotating plane relative to the die bonding base 6-1, and the telescopic driving mechanism 6-3 rotates along the plane vertical to the horizontal plane under the driving of the rotary driving mechanism 6-2 along with the die bonding swing arm 6-4.
A preferred technical solution of this embodiment: the fixture moving platform 2 comprises a first base 2-1, a first longitudinal slide rail 2-2 longitudinally arranged on the first base 2-1, and a first transverse slide table 2-3 transversely arranged on the first longitudinal slide rail 2-2, wherein two first longitudinal slide rails 2-2 are arranged and fixed on the first base 2-1 side by side, and form a first longitudinal slide rail mechanism with a slide block arranged at the lower end of the first transverse slide table 2-3, and a fixture mounting seat 2-5 is arranged on the first transverse slide rail 2-4;
the first transverse sliding table 2-3 is provided with a first transverse sliding rail 2-4, two first transverse sliding rails 2-4 are arranged and fixed on the first transverse sliding table 2-3 side by side, and a first transverse sliding rail mechanism is formed by the first transverse sliding rails 2-4 and a sliding block arranged at the bottom of the fixture mounting seat 2-5;
The fixture mounting seat 2-5 is provided with a belt pulley assembly 2-6, the belt pulley assembly 2-6 comprises a belt 2-7 and a motor assembly for driving the belt to rotate, a supporting plate connecting block is arranged on the belt 2-7 at the lower part, the supporting plate connecting block is connected with a supporting plate, the motor assembly drives the belt to rotate so as to drive the supporting plate to move back and forth, an LED support conveying device is arranged on the supporting plate and used for receiving and conveying the LED support, and the belt pulley assembly 2-6 moves transversely and longitudinally through a first longitudinal sliding rail 2-2 and a first transverse sliding table 2-3;
the first longitudinal slide rail 2-2 and the first transverse sliding table 2-3 are driven by motors respectively connected with the first longitudinal slide rail 2-2 and the first transverse sliding table.
a preferred technical solution of this embodiment: the crystal ring moving platform component 3 comprises a second base 3-1 fixed on the lower end face of a mounting plate at the upper end of the mounting frame, a second transverse slide rail 3-2 transversely arranged on the second base 3-1, and a first longitudinal slide table 3-3 longitudinally arranged on the second transverse slide rail 3-2, wherein a second longitudinal slide rail 3-4 is arranged on the first longitudinal slide table 3-3, a crystal frame mounting plate 3-5 is arranged on the second longitudinal slide rail 3-4, a belt rotating component 3-6 is arranged on the crystal frame mounting plate 3-5, a crystal ring placing groove for placing a crystal ring is arranged on the belt rotating component 3-6, the crystal ring is fed into the crystal ring placing groove from the automatic crystal ring feeding mechanism 7, and the crystal ring can rotate by using the belt rotating component 3-6, the transverse and longitudinal movement can be carried out through a second transverse slide rail 3-2 and a second longitudinal slide rail 3-4;
The number of the second transverse sliding rails 3-2 is two, the second transverse sliding rails are arranged on two sides of the lower end face of the second base 3-1, a sliding block is arranged between the two second transverse sliding rails 3-2 and connected with a first motor through a first screw rod, the sliding block and the second transverse sliding rails 3-2 form a second transverse sliding rail mechanism, and the first motor drives the screw rod to rotate to drive the sliding block and a second longitudinal sliding rail mechanism connected with the lower end of the sliding block to move;
The second longitudinal slide rail mechanism is provided with two second longitudinal slide rails 3-4 and a slide block assembly, the two second longitudinal slide rails 3-4 are arranged on two sides of the lower end of the first longitudinal sliding table 3-3, the slide block assembly is connected with a second motor through a second screw rod, and the second motor drives the second screw rod to rotate and drive the slide block assembly and a crystal frame mounting plate 3-5 connected with the lower end of the slide block assembly to longitudinally move.
A preferred technical solution of this embodiment: the thimble assembly 5 comprises a thimble 5-1 and a thimble driving mechanism 5-2, the thimble driving mechanism 5-2 is used for driving the thimble 5-1 to move up and down, and the thimble 5-1 is used for jacking up a wafer positioned at a set position on the wafer ring.
A preferred technical solution of this embodiment: the lens assembly 4 comprises a lens assembly fixing column, a crystal taking lens assembly 4-1 and a crystal fixing lens assembly 4-2, the crystal taking lens assembly 4-1 and the crystal fixing lens assembly 4-2 are fixed on the upper portion of the side face of the lens assembly fixing column from top to bottom, a lens and a camera are arranged on the crystal taking lens assembly 4-1, the crystal taking lens assembly 4-1 is used for matching with the crystal ring moving platform assembly 3 to move to a set position and correcting a wafer, the crystal fixing lens assembly 4-2 is used for matching with the clamp moving platform 2 to move the LED support to the set position, and the lens and the camera on the crystal taking lens assembly 4-1 and the crystal fixing lens assembly 4-2 are used for recognizing and storing images.
A preferred technical solution of this embodiment: the automatic crystal ring feeding mechanism 7 comprises a material box lifting assembly 7-1 and a crystal ring carrying assembly 7-2;
the material box lifting component 7-1 comprises a third motor, a third screw rod, a first sliding block component and a material box, the third motor is arranged in a hole of the bedplate through a motor box, the driving end of the third motor is upward and connected with the upward third screw rod, the third screw rod is connected with the first sliding block component, a horizontal plate is horizontally arranged on the first sliding block component in an inclined upward direction, the material box is arranged on the horizontal plate, the vertical side plate of the first sliding block component is arranged on a vertical sliding rail, the vertical sliding rail is fixed on a supporting plate at the upper end of the motor box,
The crystal ring carrying assembly 7-2 is arranged on the side adjacent to the material box lifting assembly 7-1 and comprises a screw rod mounting seat, a fourth motor, a fourth screw rod, a second sliding block assembly and a crystal ring clamping frame, the screw rod mounting seat is fixed on the bedplate, the fourth screw rod is arranged in the screw rod mounting seat, the fourth motor is fixed at one side end of the screw rod mounting seat, the driving end of the fourth motor is connected with the fourth screw rod, the rod body of the fourth screw rod is in threaded connection with the crystal ring clamping frame, the crystal ring clamping frame comprises an L-shaped support rod and a crystal ring clamping part, the tail end of the L-shaped support is connected with the crystal ring clamping part, the crystal ring clamping part is provided with a clamping cylinder, and the clamping part of the clamping cylinder faces the direction of the material box;
The material box lifting assembly 7-1 is used for lifting crystal rings stored in the material box, the fourth motor drives the fourth screw to rotate so as to drive the second sliding block assembly to move, the second sliding block assembly drives the crystal ring clamping frame to move, the clamping part on the clamping cylinder enters the material box to clamp the crystal rings, and then the crystal rings are conveyed to the crystal ring placing groove on the crystal ring moving platform assembly 3 through the crystal ring carrying assembly 7-2.
example 2: the utility model discloses a solid brilliant method of double swing arm solid brilliant device of LED solid brilliant machine, this method includes following step:
Under the assistance of a die bonding lens assembly 4-2, a system controls a clamp moving platform 2 to move transversely and longitudinally, so that an LED support on the clamp moving platform is driven to move to a die bonding position;
Secondly, with the help of the crystal taking lens assembly 4-1, the system control ring moving platform assembly 3 moves transversely and longitudinally, so as to drive the crystal ring on the system control ring moving platform assembly to move to a specified position and correct the position;
fourthly, the rotary driving mechanism 6-2 drives one of the die bonding swing arms 6-4 to rotate and move right above the wafer, the thimble assembly 5 ejects one LED wafer on the wafer ring, the driven die bonding swing arm 6-4 absorbs the ejected wafer and then rotates 180 degrees to fix the wafer on the LED bracket, and meanwhile, the other die bonding swing arm 6-4 rotates the same angle and then moves right above the wafer;
fifthly, the thimble assembly 5 ejects out another LED wafer on the wafer ring, and the wafer is fixed on the LED bracket by rotating 180 degrees after the wafer is sucked by the die fixing swing arm 6-4;
and step six, repeating the step four and the step five to finish the die bonding of the whole LED bracket.
To sum up, the utility model provides a pair of solid brilliant device of double swing arm of solid brilliant machine of LED compares with the solid brilliant mode of tradition, carries out solid brilliant through setting up two solid brilliant swing arms in succession to solid brilliant speed has been accelerated, can improve work efficiency greatly. And simultaneously, the utility model discloses solid brilliant device need not to increase the solid brilliant of swing arm length with regard to the LED support of adaptable various sizes, a tractor serves several purposes, and adaptability is better to its simple structure is compact, easily assembles, and is with low costs, can effectively improve the performance of enterprises.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.
Claims (7)
1. A double-swing-arm die bonder for LED die bonding comprises:
a platen (1);
Characterized in that it further comprises, arranged on the bedplate (1):
the die bonding mechanism (6) is provided with two die bonding swing arms (6-4), a telescopic driving mechanism (6-3) for driving the two die bonding swing arms (6-4) to move in opposite directions or in reverse directions, and a rotary driving mechanism (6-2) which is connected with and drives the telescopic driving mechanism (6-3) to drive the two die bonding swing arms (6-4) to rotate;
the fixture moving platform (2) is arranged on the adjacent side of the die bonding mechanism (6), a first transverse slide rail mechanism, a first longitudinal slide rail mechanism seated on the first transverse slide rail mechanism and a belt pulley assembly (2-6) mounted at the upper end of the first longitudinal slide rail mechanism and used for receiving and conveying the LED support are arranged on the fixture moving platform, and the LED support can be conveyed to the clamping parts of the two die bonding swing arms (6-4);
the fixture comprises a fixture moving platform (2), a mounting frame, a second transverse sliding rail mechanism, a second longitudinal sliding rail mechanism, a crystal frame mounting plate (3-5) and a belt rotating assembly (3-6), wherein the fixture moving platform (2) is vertically fixed at the corner side of the fixture moving platform, the lower bottom surface of the mounting plate at the upper end of the fixture moving platform is provided with a crystal ring moving platform assembly (3) and a thimble assembly (5), the crystal ring moving platform assembly (3) is provided with a second transverse sliding rail mechanism, the second longitudinal sliding rail mechanism is arranged at the lower side of the second transverse sliding rail mechanism, the crystal frame mounting plate (3-5) is horizontally arranged on the second longitudinal sliding rail mechanism, the belt rotating assembly (3-6) is arranged on the crystal frame mounting plate (3-5), a crystal ring placing groove for placing a crystal ring is arranged on the belt;
the lens assembly (4) is arranged on one side of the clamp moving platform (2), and is provided with a crystal taking lens assembly (4-1) which is used for matching with the crystal ring moving platform assembly (3) to move to a set position and carrying out wafer correction and a crystal fixing lens assembly (4-2) which is used for assisting the clamp moving platform (2) to move the LED bracket to the set position;
the automatic crystal ring feeding mechanism (7) is provided with a material box lifting assembly (7-1) and a crystal ring carrying assembly (7-2), the material box is used for lifting a material box, crystal rings are stored in the material box, and the material box lifting assembly (7-1) lifts the material box to a set height to enable the crystal ring carrying assembly (7-2) to pick up the crystal rings and send the crystal rings to a crystal ring placing groove on the crystal ring moving platform assembly (3).
2. The double-swing-arm die bonding device for die bonding of the LED according to claim 1, wherein: the die bonding mechanism (6) further comprises a die bonding base (6-1) fixed on the bedplate (1), a transverse rotary driving mechanism (6-2) is arranged on the top plate surface of the die bonding base (6-1), the rotary driving mechanism (6-2) is in rigid connection with the telescopic driving mechanism (6-3), telescopic parts are arranged at two ends of the telescopic driving mechanism (6-3), connecting blocks are arranged at the outer ends of the telescopic parts and connected with die bonding swing arms (6-4), the two die bonding swing arms (6-4) are located on a straight line, the two die bonding swing arms (6-4) move oppositely or oppositely to form opening and closing type loosening or clamping actions, cross slide rails (6-5) are further arranged on the side portions of the telescopic driving mechanism (6-3), and the die bonding swing arms (6-4) are driven by the telescopic driving mechanism (6-3) to move along cross slide rails (6-5) The sliding rail (6-5) performs telescopic motion, the die bonding swing arm (6-4) can perform rotary and telescopic motion in a rotary surface relative to the die bonding base (6-1), and the telescopic driving mechanism (6-3) performs rotary motion in a plane which is perpendicular to the horizontal plane under the driving of the rotary driving mechanism (6-2) along with the die bonding swing arm (6-4).
3. The double-swing-arm die bonding device for die bonding of the LED according to claim 1, wherein: the fixture moving platform (2) comprises a first base (2-1), a first longitudinal sliding rail (2-2) longitudinally arranged on the first base (2-1), and a first transverse sliding table (2-3) transversely arranged on the first longitudinal sliding rail (2-2), wherein two first longitudinal sliding rails (2-2) are arranged and fixed on the first base (2-1) side by side, and form a first longitudinal sliding rail mechanism with a sliding block arranged at the lower end of the first transverse sliding table (2-3), and a fixture mounting seat (2-5) is arranged on the first transverse sliding rail (2-4);
the first transverse sliding table (2-3) is provided with two first transverse sliding rails (2-4), the two first transverse sliding rails (2-4) are fixed on the first transverse sliding table (2-3) side by side, and a first transverse sliding rail mechanism is formed by the two first transverse sliding rails and a sliding block arranged at the bottom of the clamp mounting seat (2-5);
The LED support is characterized in that a belt pulley assembly (2-6) is arranged on the clamp mounting seat (2-5), the belt pulley assembly (2-6) comprises a belt (2-7) and a motor assembly for driving the belt to rotate, a support plate connecting block is arranged on the belt (2-7) in a downward moving mode, the support plate connecting block is connected with a support plate, the motor assembly drives the belt to rotate so as to drive the support plate to move back and forth, an LED support conveying device is arranged on the support plate and used for receiving and conveying the LED support, and the belt pulley assembly (2-6) moves transversely and longitudinally through a first longitudinal sliding rail (2-2) and a first transverse sliding table (2-3);
the first longitudinal sliding rail (2-2) and the first transverse sliding table (2-3) are driven by motors respectively connected with the first longitudinal sliding rail and the first transverse sliding table.
4. The double-swing-arm die bonding device for die bonding of the LED according to claim 1, wherein: the crystal ring moving platform assembly (3) comprises a second base (3-1) fixed on the lower end face of a mounting plate at the upper end of the mounting frame, a second transverse slide rail (3-2) transversely arranged on the second base (3-1), and a first longitudinal slide table (3-3) longitudinally arranged on the second transverse slide rail (3-2), wherein a second longitudinal slide rail (3-4) is arranged on the first longitudinal slide table (3-3), a crystal frame mounting plate (3-5) is arranged on the second longitudinal slide rail (3-4), a belt rotating assembly (3-6) is arranged on the crystal frame mounting plate (3-5), a crystal ring placing groove for placing a crystal ring is arranged on the belt rotating assembly (3-6), and the crystal ring is sent into the crystal ring placing groove from the automatic crystal ring feeding mechanism (7), the crystal ring can rotate by utilizing a belt rotating assembly (3-6) and can move transversely and longitudinally by a second transverse slide rail (3-2) and a second longitudinal slide rail (3-4);
The two second transverse sliding rails (3-2) are arranged on two sides of the lower end face of the second base (3-1), a sliding block is arranged between the two second transverse sliding rails (3-2), the sliding block is connected with a first motor through a first screw rod and forms a second transverse sliding rail mechanism with the second transverse sliding rails (3-2), and the first motor drives the screw rod to rotate to drive the sliding block and a second longitudinal sliding rail mechanism connected with the lower ends of the sliding block to move;
the second longitudinal slide rail mechanism is provided with two second longitudinal slide rails (3-4) and a slide block component, the two second longitudinal slide rails (3-4) are arranged on two sides of the lower end of the first longitudinal sliding table (3-3), the slide block component is connected with a second motor through a second screw rod, and the second motor drives the second screw rod to rotate and drive the slide block component and a crystal frame mounting plate (3-5) connected with the lower end of the slide block component to move longitudinally.
5. The double-swing-arm die bonding device for die bonding of the LED according to claim 1, wherein: the thimble assembly (5) comprises a thimble (5-1) and a thimble driving mechanism (5-2), the thimble driving mechanism (5-2) is used for driving the thimble (5-1) to move up and down, and the thimble (5-1) is used for jacking a wafer located at a set position on the wafer ring.
6. the double-swing-arm die bonding device for die bonding of the LED according to claim 1, wherein: the lens assembly (4) comprises a lens assembly fixing column, a crystal taking lens assembly (4-1) and a crystal fixing lens assembly (4-2), the crystal taking lens assembly (4-1) and the crystal fixing lens assembly (4-2) are fixed on the upper portion of the side face of the lens assembly fixing column one above the other, a lens and a camera are arranged on the crystal taking lens assembly (4-1), the crystal taking lens assembly (4-1) is used for being matched with the crystal ring moving platform assembly (3) to move to a set position and correct a wafer, the crystal fixing lens assembly (4-2) is used for being matched with the clamp moving platform (2) to move the LED support to the set position, and the lens and the camera on the crystal taking lens assembly (4-1) and the crystal fixing lens assembly (4-2) are used for identifying and storing images.
7. The double-swing-arm die bonding device for die bonding of the LED according to claim 1, wherein: the automatic crystal ring feeding mechanism (7) comprises a material box lifting assembly (7-1) and a crystal ring carrying assembly (7-2);
The material box lifting component (7-1) comprises a third motor, a third screw rod, a first sliding block component and a material box, the third motor is arranged in a hole of the bedplate through a motor box, the driving end of the third motor is upward and connected with the upward third screw rod, the third screw rod is connected with the first sliding block component, a horizontal plate is horizontally arranged on the first sliding block component in an inclined upward direction, the material box is arranged on the horizontal plate, the vertical side plate of the first sliding block component is arranged on a vertical sliding rail, the vertical sliding rail is fixed on a supporting plate at the upper end of the motor box,
The crystal ring carrying assembly (7-2) is arranged on the side adjacent to the material box lifting assembly (7-1) and comprises a screw rod mounting seat, a fourth motor, a fourth screw rod, a second sliding block assembly and a crystal ring clamping frame, the screw rod mounting seat is fixed on the bedplate, the fourth screw rod is arranged in the screw rod mounting seat, the fourth motor is fixed at one side end of the screw rod mounting seat, the driving end of the fourth motor is connected with the fourth screw rod, the body of the fourth screw rod is in threaded connection with the crystal ring clamping frame, the crystal ring clamping frame comprises an L-shaped support rod and a crystal ring clamping part, the tail end of the L-shaped support is connected with the crystal ring clamping part, the crystal ring clamping part is provided with a clamping cylinder, and the clamping part of the clamping cylinder faces the direction of the material box;
The material box lifting assembly (7-1) is used for lifting crystal rings stored in the material box, the fourth motor drives the fourth screw to rotate so as to drive the second sliding block assembly to move, the second sliding block assembly drives the crystal ring clamping frame to move, a clamping part on the clamping cylinder enters the material box to clamp the crystal rings, and then the crystal rings are conveyed to the crystal ring placing groove on the crystal ring moving platform assembly (3) through the crystal ring carrying assembly (7-2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201920785614.3U CN209766467U (en) | 2019-05-28 | 2019-05-28 | double-swing-arm die bonder for die bonding of LED |
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| CN201920785614.3U CN209766467U (en) | 2019-05-28 | 2019-05-28 | double-swing-arm die bonder for die bonding of LED |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224052A (en) * | 2019-05-28 | 2019-09-10 | 深圳市新益昌自动化设备有限公司 | A kind of the double-pendulum arms crystal solidifying apparatus and its die-bonding method of LED die bond |
| CN111370350A (en) * | 2020-03-19 | 2020-07-03 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN112691924A (en) * | 2020-12-08 | 2021-04-23 | 青岛中科墨云智能有限公司 | Novel calibration system and calibration method for LED semiconductor wafer sorting machine |
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2019
- 2019-05-28 CN CN201920785614.3U patent/CN209766467U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110224052A (en) * | 2019-05-28 | 2019-09-10 | 深圳市新益昌自动化设备有限公司 | A kind of the double-pendulum arms crystal solidifying apparatus and its die-bonding method of LED die bond |
| CN110224052B (en) * | 2019-05-28 | 2024-02-06 | 深圳新益昌科技股份有限公司 | Double-swing-arm die bonding device for LED die bonding and die bonding method thereof |
| CN111370350A (en) * | 2020-03-19 | 2020-07-03 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN112691924A (en) * | 2020-12-08 | 2021-04-23 | 青岛中科墨云智能有限公司 | Novel calibration system and calibration method for LED semiconductor wafer sorting machine |
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