CN209929338U - Novel solid brilliant device of solid brilliant machine of LED - Google Patents
Novel solid brilliant device of solid brilliant machine of LED Download PDFInfo
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- CN209929338U CN209929338U CN201920798205.7U CN201920798205U CN209929338U CN 209929338 U CN209929338 U CN 209929338U CN 201920798205 U CN201920798205 U CN 201920798205U CN 209929338 U CN209929338 U CN 209929338U
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Abstract
The utility model relates to a solid brilliant machine technical field of LED, concretely relates to novel solid brilliant machine of LED gu brilliant device, including big platen, set up the anchor clamps moving platform on big platen, anchor clamps moving platform top is provided with brilliant ring moving platform, and its below is provided with second camera lens subassembly, brilliant ring moving platform top is provided with thimble assembly, thimble assembly top is provided with first camera lens subassembly. The first lens assembly is used for assisting the wafer on the wafer ring moving platform to move to a designated position, the second lens assembly assists the transparent LED support on the clamp platform to move to the designated position, and the ejector pin assembly directly pushes the designated LED wafer on the wafer ring onto the glued transparent LED support to finish die bonding. Compared with the traditional die bonding mode, the device directly fixes the LED wafer on the wafer ring on the transparent LED bracket, saves a plurality of intermediate links such as absorption, transportation and the like of the wafer, and improves die bonding precision and working efficiency.
Description
Technical Field
The utility model relates to a LED processing technology field, specific saying so relates to a solid brilliant device of novel solid brilliant machine of LED.
Background
A Light Emitting Diode (LED) is a Light Emitting element that can convert electrical energy into Light energy, and is popular in the market since its introduction due to the characteristics of energy saving, environmental protection, and long service life.
The LED transparent screen takes the transparent LED bracket as a substrate, and the die bonding process comprises the following steps: firstly, a thimble mechanism jacks up an appointed LED wafer from a wafer ring film, then the die bonding swing arm of the die bonding mechanism horizontally rotates to a position right above the appointed LED wafer, then the die bonding swing arm moves up and down to suck the appointed LED wafer on the wafer ring film and carries the LED wafer to an appointed position of a glued transparent LED support, and then the die bonding swing arm moves up and down to complete die bonding operation. The working mode needs a plurality of intermediate links such as the absorption and the transportation of the LED wafer, so that the working efficiency is low and the die bonding speed is low.
Aiming at the market demand of die bonding of a transparent LED bracket, a novel LED die bonding device is urgently needed to be researched and developed.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the to-be-solved technical problem of the utility model lies in providing a solid brilliant device of novel solid brilliant machine of LED, and the purpose of designing this solid brilliant device is that improve the solid brilliant efficiency of LED, reduces the work link.
In order to solve the technical problem, the utility model discloses a following scheme realizes: the utility model provides a solid brilliant device of novel LED solid brilliant machine, includes big platen, still includes:
the fixture moving platform is arranged on the large bedplate, the X-axis driving mechanism is used for driving the whole fixture moving platform to transversely move, the longitudinal moving platform and the Y-axis driving mechanism are arranged on the fixture moving platform and are used for driving the longitudinal moving platform to longitudinally move, and a fixture assembly used for clamping the LED bracket is arranged at the top of the longitudinal moving platform;
the wafer ring moving platform is fixed on the large platen through a first support and arranged above the clamp moving platform, a wafer ring bearing assembly for bearing the LED wafer and a longitudinal and transverse driving mechanism for driving the wafer ring bearing assembly to move longitudinally and transversely are arranged on the wafer ring moving platform, and the longitudinal and transverse driving mechanism drives the wafer ring on the wafer ring bearing assembly to move longitudinally and transversely so that the LED wafer can move to a specified position above the LED bracket clamped on the clamp assembly; the wafer ring bearing assembly is provided with a belt rotating assembly which can drive the wafer to rotate to carry out wafer position correction;
the second support on the ejector pin component is arranged on the transverse side of the clamp moving platform, an eccentric wheel component and a rotary driving mechanism for driving the eccentric wheel component to move are arranged on the second support, the eccentric wheel component is connected with an ejector pin arm component capable of moving up and down, the rotary driving mechanism drives the eccentric wheel component to swing, and then the eccentric wheel component drives the ejector pin arm component to move up and down;
the first lens assembly is arranged at the corner of the first support, the lens of the first lens assembly points downwards to the LED wafer correcting position, and the first lens assembly identifies whether the LED wafer moves to a specified position or not and judges whether the LED wafer is corrected in place or not through an image identification module of a camera;
and the second lens assembly is arranged on the clamp moving platform and is moved to a specified position through an image recognition module of the camera by recognizing a bracket on the clamp moving platform.
Further, the clamp moving platform comprises: the fixture comprises a first base, a first transverse slide rail transversely arranged on the first base, and a first longitudinal slide rail longitudinally arranged on the first transverse slide rail, wherein a first longitudinal slide rail is arranged on the first longitudinal slide rail, a fixture mounting seat is arranged on the first longitudinal slide rail, the fixture assembly is arranged on the fixture mounting seat, a first lead screw driving device is arranged on one side of the first base, a second lead screw driving device is arranged on one side of the first longitudinal slide rail, the first lead screw driving device drives the first longitudinal slide rail to do X axial movement through the rotation of a motor driving lead screw, the second lead screw driving device drives the fixture mounting seat to do Y axial movement through the rotation of the motor driving lead screw, so that the fixture assembly follows the fixture mounting seat to do Y axial movement together, and a clamping part for clamping an LED bracket is arranged on the fixture assembly, the first lead screw driving device is an X-axis driving mechanism, and the second lead screw driving device is a Y-axis driving mechanism.
Further, all be provided with the square through hole that is used for preventing the field of vision of second camera lens subassembly from causing the sheltering from on first base, the first vertical slip table and the anchor clamps mount pad.
Further, a first support on the crystal ring moving platform comprises a first upright post and a crystal ring moving platform mounting plate fixed at the upper end of the first upright post, and a crystal ring bearing assembly is mounted at the lower end of the crystal ring moving platform mounting plate; the brilliant ring bearing assembly includes second base, the vertical slide rail of second, the vertical slip table of second, second transverse sliding rail and brilliant frame mounting panel, the lower terminal surface both sides of second base are provided with the vertical slide rail of double second, be provided with the slider on the vertical slide rail of second, the vertical slip table of second is installed to the slider lower extreme, the horizontal both sides of the vertical slip table lower extreme of second are provided with the horizontal slide rail of double second, be provided with slider assembly on the horizontal slide rail of second, brilliant frame mounting panel is installed to slider assembly lower extreme, be provided with the belt rotating assembly on the brilliant frame mounting panel, be provided with brilliant ring and its drive that is used for bearing the LED wafer on the belt rotating assembly the brilliant ring is the horizontal plane and rotates, and the vertical actuating mechanism and the transverse driving mechanism drive on the vertical transverse driving mechanism are indulged respectively to the vertical slip table of.
Furthermore, the second support on the thimble assembly is fixed on the large platen, the thimble assembly comprises a second upright and a thimble assembly mounting plate fixed on the upper end of the second upright, the rotary driving mechanism is mounted on one side of the thimble assembly mounting plate and comprises a fixed seat and a thimble driving motor, the thimble driving motor is transversely mounted on the fixed seat, the fixed seat is mounted on the thimble assembly mounting plate, a side plate on the fixed seat extends downwards and is provided with a cross slide rail on the outer side surface of the extending part of the side plate, the driving end on the thimble driving motor passes through the round hole of the fixed seat and is connected with the eccentric wheel assembly, and the driving end of the thimble driving motor rotates to drive the eccentric wheel assembly to move up and down.
Furthermore, the eccentric wheel assembly comprises an eccentric wheel and a connecting rod, the eccentric position of the outer wheel surface of the eccentric wheel is coupled with the connecting rod, and the other end of the connecting rod is coupled with the ejector pin arm assembly.
Furthermore, the thimble arm assembly comprises a thimble connecting block and a needle arm, wherein the connecting block is connected to one end of the connecting rod in a shaft mode, the lower side of a plate body of the thimble arm assembly is connected with the needle arm, a convex rail is arranged on the inner side surface of the needle arm, and the convex rail is connected in the cross slide rail in a sliding mode so that the needle arm can slide on the cross slide rail;
the lower extreme side joint of needle arm is a thimble support, the thimble support is the L type, and its lower part needle bar level sets up, is provided with the thimble hole in this lower part needle bar outer end, is fixed with the thimble on the thimble hole, the thimble lower extreme is sharp portion.
Further, the first lens component comprises a first lens supporting seat, a first lens and a first camera, the first lens supporting seat is fixed at the corner of the first supporting seat, a coaxial mounting hole is formed in the outer end of the inclined portion of the first lens supporting seat, the first camera is mounted on the coaxial mounting hole, the lower end of the first camera is provided with the first lens, and the first camera is used for identifying that the LED wafer borne on the wafer ring moving platform moves to a specified position and is corrected.
Furthermore, the second lens assembly comprises a second lens supporting seat, a second lens and a second camera, the second lens supporting seat is fixed on the fixture moving platform, a coaxial mounting hole is formed in the outer end of the inclined part of the second lens supporting seat, the second camera is mounted on the coaxial mounting hole, the second camera is vertically arranged, the second lens is fixed to the upper end of the second camera, and the second camera is used for identifying that the LED support on the fixture moving platform moves to a specified position. Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses solid brilliant to the LED support compares with traditional mode, and it has saved a plurality of intermediate links such as absorption, transport of LED wafer to solid brilliant precision and work efficiency have been improved.
2. The utility model discloses simple structure, occupation of land are little, can effectively improve the performance of enterprises.
Drawings
Fig. 1 is a schematic structural diagram of a novel LED die bonder according to an embodiment of the present application.
Fig. 2 is an exploded schematic view of a novel LED die bonder according to an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a fixture platform of the novel LED die bonder according to an embodiment of the present application.
Fig. 4 is a schematic structural diagram of a die ring moving platform of the novel LED die bonder according to the embodiment of the present application.
Fig. 5 is a schematic structural diagram of a thimble assembly of the novel LED die bonder in the embodiment of the present application.
Fig. 6 is a schematic structural diagram of a first lens assembly of a novel LED die bonder according to an embodiment of the present application.
Fig. 7 is a schematic structural diagram of a second lens assembly of the novel LED die bonder according to the embodiment of the present application.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is obvious that the described embodiments of the invention are only some of the embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Embodiment 1, the utility model discloses a specific structure as follows:
referring to fig. 1-7, the die bonder of the present invention comprises a large platen 1, and further comprises:
the fixture moving platform 2 is arranged on the large bedplate 1, the X-axis driving mechanism is used for driving the whole fixture moving platform 2 to transversely move, the longitudinal moving platform and the Y-axis driving mechanism are arranged on the fixture moving platform 2 and are used for driving the longitudinal moving platform to longitudinally move, and fixture components 2-6 used for clamping the LED support are arranged at the top of the longitudinal moving platform;
the wafer ring moving platform 3 is fixed on the large platen 1 through a first support and arranged above the clamp moving platform 2, a wafer ring bearing assembly for bearing the LED wafer and a longitudinal and transverse driving mechanism for driving the wafer ring bearing assembly to move longitudinally and transversely are arranged on the wafer ring moving platform, and the longitudinal and transverse driving mechanism drives the wafer ring on the wafer ring bearing assembly to move longitudinally and transversely so that the LED wafer can move to a specified position above the LED bracket clamped on the clamp assembly 2-6; the wafer ring bearing assembly is provided with belt rotating assemblies 3-6 which can drive the wafer to rotate to carry out wafer position correction;
the second support on the ejector pin component 4 is arranged on the transverse side of the clamp moving platform 2, an eccentric wheel component and a rotary driving mechanism for driving the eccentric wheel component to move are arranged on the second support, the eccentric wheel component is connected with an ejector pin arm component capable of moving up and down, the rotary driving mechanism drives the eccentric wheel component to swing, and then the eccentric wheel component drives the ejector pin arm component to move up and down;
the first lens assembly 5 is arranged at the corner of the first support, the lens of the first lens assembly points downwards to the LED wafer correcting position, and the first lens assembly identifies whether the LED wafer moves to a specified position and judges whether the LED wafer is corrected in place through an image identification module of a camera;
and the second lens assembly 6 is arranged on the clamp moving platform 2 and moves to a specified position through an image recognition module of the camera by recognizing a bracket on the clamp moving platform 2.
A preferred technical solution of this embodiment: the jig moving platform 2 includes: the device comprises a first base 2-1, a first transverse slide rail 2-2 transversely arranged on the first base 2-1, and a first longitudinal slide table 2-3 longitudinally arranged on the first transverse slide rail 2-2, wherein the first longitudinal slide rail 2-3 is provided with a first longitudinal slide rail 2-4, the first longitudinal slide rail 2-4 is provided with a clamp mounting seat 2-5, the clamp assembly 2-6 is arranged on the clamp mounting seat 2-5, one side of the first base 2-1 is provided with a first lead screw driving device 2-8, one side of the first longitudinal slide table 2-3 is provided with a second lead screw driving device 2-7, the first lead screw driving device 2-8 drives the first longitudinal slide table 2-3 to do X axial movement by driving a lead screw to rotate through a motor, the second lead screw driving device 2-7 drives a lead screw to rotate through a motor to drive the fixture mounting seat 2-5 to move in the Y axial direction, the fixture assembly 2-6 further moves in the Y axial direction along with the fixture mounting seat 2-5, a clamping part used for clamping an LED support is arranged on the fixture assembly 2-6, the first lead screw driving device 2-8 is an X axial driving mechanism, and the second lead screw driving device 2-7 is a Y axial driving mechanism.
A preferred technical solution of this embodiment: the first base 2-1, the first longitudinal sliding table 2-3 and the clamp mounting seat 2-5 are all provided with square through holes for preventing the view of the second lens assembly 6 from being blocked. The horizontal sliding table and the vertical sliding table do not shield the view of the second lens assembly 6 arranged below the fixture moving platform 2 in the moving process, so that the second lens assembly 6 can be positioned on the LED support through the identification module.
A preferred technical solution of this embodiment: the first support of the crystal ring moving platform 3 comprises a first upright post and a crystal ring moving platform mounting plate fixed at the upper end of the first upright post, and the lower end of the crystal ring moving platform mounting plate is provided with a crystal ring bearing assembly; the crystal ring bearing assembly comprises a second base 3-1, a second longitudinal sliding rail 3-2, a second longitudinal sliding table 3-3, a second transverse sliding rail 3-4 and a crystal frame mounting plate 3-5, wherein two rows of second longitudinal sliding rails 3-2 are arranged on two sides of the lower end face of the second base 3-1, a sliding block is arranged on the second longitudinal sliding rail 3-2, the second longitudinal sliding table 3-3 is arranged at the lower end of the sliding block, two rows of second transverse sliding rails 3-4 are arranged on two sides of the lower end face of the second longitudinal sliding table 3-3, a sliding block assembly is arranged on the second transverse sliding rail 3-4, the crystal frame mounting plate 3-5 is arranged at the lower end of the sliding block assembly, a belt rotating assembly 3-6 is arranged on the crystal frame mounting plate 3-5, a crystal ring 3-7 for bearing LED wafers is arranged on the belt rotating assembly 3-6, and the crystal ring 3-7 drives the 7, horizontal rotation is carried out, and the second longitudinal sliding table 3-3 and the sliding block assembly are driven by a longitudinal driving mechanism and a transverse driving mechanism on a longitudinal driving mechanism and a transverse driving mechanism respectively. The wafer ring 3-7 can be moved to a set position longitudinally and transversely by using a second longitudinal slide rail 3-2 and a second transverse slide rail 3-4, and then wafer correction is carried out under the driving of the belt rotating assembly 3-6.
A preferred technical solution of this embodiment: the second support of the thimble assembly 4 is fixed on the large bedplate 1 and comprises a second upright post and a thimble assembly mounting plate fixed at the upper end of the second upright post, the rotary driving mechanism is arranged on one side of the thimble assembly mounting plate and comprises a fixed seat 4-1 and a thimble driving motor 4-2, the thimble driving motor 4-2 is transversely arranged on the fixed seat 4-1, the fixed seat 4-1 is arranged on the thimble assembly mounting plate, the side plates on the upper part extend downwards and the outer side surface of the extending part is provided with a crossed slide rail 4-5, the driving end of the thimble driving motor 4-2 passes through the round hole of the fixed seat 4-1, and the thimble driving motor 4-2 is connected with the eccentric wheel component, and the driving end of the thimble driving motor rotates to drive the eccentric wheel component to move up and down.
A preferred technical solution of this embodiment: the eccentric wheel assembly comprises an eccentric wheel 4-3 and a connecting rod 4-4, the eccentric position of the wheel surface at the outer side of the eccentric wheel 4-3 is connected with the connecting rod 4-4 in a shaft mode, and the other end of the connecting rod 4-4 is connected with the ejector pin arm assembly in a shaft mode.
A preferred technical solution of this embodiment: the thimble arm assembly comprises a thimble connecting block and a needle arm 4-6, the thimble connecting block is connected to one end of the connecting rod 4-4 in a shaft mode, the lower side of a plate body of the thimble arm assembly is connected with the needle arm 4-6, a convex rail is arranged on the inner side surface of the needle arm 4-6 and is connected in the cross sliding rail 4-5 in a sliding mode so that the needle arm 4-6 can slide on the cross sliding rail 4-5;
the lower end of the needle arm 4-6 is connected with an ejector pin support in an L shape, the lower needle bar of the ejector pin support is horizontally arranged, the outer end of the lower needle bar is provided with an ejector pin hole, an ejector pin 4-7 is fixed on the ejector pin hole, and the lower end of the ejector pin 4-7 is a tip part. When the thimble arm 4-6 drives the thimble 4-7 to move, the view of the first lens component 5-2 above the thimble arm is not blocked, and the belt rotating component 3-6 is convenient to correct the wafer on the wafer ring.
A preferred technical solution of this embodiment: the first lens assembly 5 comprises a first lens supporting seat 5-1, a first lens 5-2 and a first camera 5-3, the first lens supporting seat 5-1 is fixed at the corner of the first supporting seat, a coaxial mounting hole is formed in the outer end of the inclined part of the first lens supporting seat, the first camera 5-3 is mounted on the coaxial mounting hole, the first lens 5-2 is arranged at the lower end of the first camera 5-3, and the first camera 5-3 is used for moving an LED wafer carried on the clamp moving platform 2 to a specified position and correcting the LED wafer.
A preferred technical solution of this embodiment: the second lens assembly 6 comprises a second lens supporting seat 6-1, a second lens 6-2 and a second camera 6-3, the second lens supporting seat 6-1 is fixed on the fixture moving platform 2, a coaxial mounting hole is formed in the outer end of the inclined portion of the second lens supporting seat, the second camera 6-3 is mounted on the coaxial mounting hole, the second camera 6-3 is vertically arranged, the second lens 6-2 is fixed to the upper end of the second camera, and the second camera 6-3 is used for identifying that the LED support on the fixture moving platform 2 moves to a specified position.
A preferred technical solution of this embodiment: the utility model discloses a LED support is transparent support.
Example 2: the die bonding method of the die bonding device of the utility model is as follows:
the die bonding method of the die bonding device comprises the following steps:
firstly, a die bonding system controls a clamp moving platform 2 to move transversely and longitudinally, and an LED bracket on the clamp moving platform 2 is moved to a die bonding position through an identification module of a second lens assembly 6;
secondly, controlling the wafer ring moving platform 3 to move transversely and longitudinally by the wafer fixing system, and moving the LED wafers on the wafer rings 3-7 to a set position through the identification module of the first lens assembly 5 and correcting;
thirdly, the thimble driving motor 4-2 drives a connecting rod 4-4 connected to the eccentric wheel 4-3 to move up and down by driving the eccentric wheel 4-3 to rotate, and a thimble arm 4-6 connected to the connecting rod 4-4 moves up and down along a cross slide rail 4-5, so that the thimble arm 4-6 drives a thimble 4-7 arranged on the thimble arm to push the LED wafer on the wafer ring to a set position of the LED bracket;
and step four, repeating the step one, the step two and the step three for circulation.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.
Claims (9)
1. The utility model provides a solid brilliant device of novel LED solid brilliant machine, includes big platen (1), its characterized in that still includes:
the fixture moving platform (2) is arranged on the large bedplate (1), the X-axis driving mechanism is used for driving the fixture moving platform (2) to integrally move transversely, the longitudinal moving platform and the Y-axis driving mechanism are arranged on the fixture moving platform (2) and used for driving the longitudinal moving platform to move longitudinally, and a fixture assembly (2-6) used for clamping the LED bracket is arranged at the top of the longitudinal moving platform;
the wafer ring moving platform (3) is fixed on the large platen (1) through a first support and arranged above the clamp moving platform (2), a wafer ring bearing assembly for bearing the LED wafer and a longitudinal and transverse driving mechanism for driving the wafer ring bearing assembly to move longitudinally and transversely are arranged on the wafer ring moving platform, and the longitudinal and transverse driving mechanism drives the wafer ring on the wafer ring bearing assembly to move longitudinally and transversely so that the LED wafer can move to a specified position above the LED bracket clamped on the clamp assembly (2-6); the wafer ring bearing assembly is provided with a belt rotating assembly (3-6) which can drive the wafer to rotate to carry out wafer position correction;
the second support on the ejector pin component (4) is arranged on the transverse side of the clamp moving platform (2), an eccentric wheel component and a rotary driving mechanism for driving the eccentric wheel component to move are arranged on the second support, the eccentric wheel component is connected with an ejector pin arm component capable of moving up and down, the rotary driving mechanism drives the eccentric wheel component to swing, and then the eccentric wheel component drives the ejector pin arm component to move up and down;
the first lens assembly (5) is arranged at the corner of the first support, the lens of the first lens assembly points downwards to the LED wafer correcting position, and the first lens assembly is used for identifying whether the LED wafer moves to a specified position or not and judging whether the LED wafer is corrected in place or not through an image identification module of a camera;
and the second lens assembly (6) is arranged on the clamp moving platform (2) and moves to a specified position through an image recognition module of the camera by recognizing a bracket on the clamp moving platform (2).
2. The die bonder of the novel LED die bonder according to claim 1, wherein: the clamp moving platform (2) comprises: the fixture comprises a first base (2-1), a first transverse sliding rail (2-2) transversely arranged on the first base (2-1), and a first longitudinal sliding table (2-3) longitudinally arranged on the first transverse sliding rail (2-2), wherein a first longitudinal sliding rail (2-4) is arranged on the first longitudinal sliding table (2-3), a fixture mounting seat (2-5) is arranged on the first longitudinal sliding rail (2-4), a fixture assembly (2-6) is arranged on the fixture mounting seat (2-5), a first lead screw driving device (2-8) is arranged on one side of the first base (2-1), a second lead screw driving device (2-7) is arranged on one side of the first longitudinal sliding table (2-3), and the first lead screw driving device (2-8) drives the first longitudinal sliding table (2-2) through the rotation of a motor driving lead screw -3) moving in the X axial direction, driving a screw rod to rotate by a second screw rod driving device (2-7) through a motor to drive the fixture mounting seat (2-5) to move in the Y axial direction, further driving the fixture assembly (2-6) to move in the Y axial direction along with the fixture mounting seat (2-5), wherein a clamping part for clamping the LED support is arranged on the fixture assembly (2-6), the first screw rod driving device (2-8) is an X axial driving mechanism, and the second screw rod driving device (2-7) is a Y axial driving mechanism.
3. The die bonder of the novel LED die bonder according to claim 2, wherein: the first base (2-1), the first longitudinal sliding table (2-3) and the clamp mounting seat (2-5) are all provided with square through holes for preventing the view of the second lens assembly (6) from being blocked.
4. The die bonder of the novel LED die bonder according to claim 1, wherein: the first support on the crystal ring moving platform (3) comprises a first upright post and a crystal ring moving platform mounting plate fixed at the upper end of the first upright post, and a crystal ring bearing assembly is mounted at the lower end of the crystal ring moving platform mounting plate; the crystal ring bearing assembly comprises a second base (3-1), a second longitudinal sliding rail (3-2), a second longitudinal sliding table (3-3), a second transverse sliding rail (3-4) and a crystal frame mounting plate (3-5), wherein double rows of second longitudinal sliding rails (3-2) are arranged on two sides of the lower end face of the second base (3-1), a sliding block is arranged on the second longitudinal sliding rail (3-2), the second longitudinal sliding table (3-3) is arranged at the lower end of the sliding block, double rows of second transverse sliding rails (3-4) are arranged on two transverse sides of the lower end of the second longitudinal sliding table (3-3), a sliding block assembly is arranged on the second transverse sliding rail (3-4), the crystal frame mounting plate (3-5) is arranged at the lower end of the sliding block assembly, and a belt rotating assembly (3-6) is arranged on the crystal frame mounting plate (3-5), the belt rotating assembly (3-6) is provided with a crystal ring (3-7) used for bearing an LED wafer and driving the crystal ring (3-7) to rotate horizontally, and the second longitudinal sliding table (3-3) and the sliding block assembly are respectively driven by a longitudinal driving mechanism and a transverse driving mechanism on the longitudinal and transverse driving mechanism.
5. The die bonder of the novel LED die bonder according to claim 1, wherein: the thimble assembly (4) is characterized in that a second support on the thimble assembly (4) is fixed on the large bedplate (1) and comprises a second upright and a thimble assembly mounting plate fixed at the upper end of the second upright, the rotary driving mechanism is installed at one side of the thimble assembly mounting plate and comprises a fixed seat (4-1) and a thimble driving motor (4-2), the thimble driving motor (4-2) is transversely installed on the fixed seat (4-1), the fixed seat (4-1) is installed on the thimble assembly mounting plate, a side plate on the thimble assembly mounting plate extends downwards and is provided with a cross sliding rail (4-5) on the outer side surface of the extending part of the thimble driving motor, a driving end on the thimble driving motor (4-2) penetrates through a round hole of the fixed seat (4-1) and is connected with the eccentric wheel assembly, and the driving end of the thimble driving motor (4-2) rotates to drive And (6) moving.
6. The die bonder of the novel LED die bonder according to claim 5, wherein: the eccentric wheel assembly comprises an eccentric wheel (4-3) and a connecting rod (4-4), the eccentric position of the wheel surface at the outer side of the eccentric wheel (4-3) is connected with the connecting rod (4-4) in a shaft mode, and the other end of the connecting rod (4-4) is connected with the ejector pin arm assembly in a shaft mode.
7. The die bonder of the novel LED die bonder according to claim 6, wherein: the thimble arm assembly comprises a thimble connecting block and a needle arm (4-6), the thimble connecting block is connected to one end of the connecting rod (4-4) in a shaft mode, the lower side of a plate body of the thimble arm assembly is connected with the needle arm (4-6), a convex rail is arranged on the inner side face of the needle arm (4-6), and the convex rail is connected in the cross sliding rail (4-5) in a sliding mode so that the needle arm (4-6) can slide on the cross sliding rail (4-5);
the lower end of the needle arm (4-6) is connected with an ejector pin support in an L shape, a lower needle rod of the ejector pin support is horizontally arranged, an ejector pin hole is formed in the outer end of the lower needle rod, an ejector pin (4-7) is fixed on the ejector pin hole, and the lower end of the ejector pin (4-7) is a tip part.
8. The die bonder of the novel LED die bonder according to claim 1, wherein: the first lens assembly (5) comprises a first lens supporting seat (5-1), a first lens (5-2) and a first camera (5-3), the first lens supporting seat (5-1) is fixed at the corner of the first supporting seat, a coaxial mounting hole is formed in the outer end of the inclined portion of the first lens supporting seat, the first camera (5-3) is mounted on the coaxial mounting hole, the first lens (5-2) is arranged at the lower end of the first camera (5-3), and the first camera (5-3) is used for identifying that an LED wafer borne on the clamp moving platform (2) moves to a specified position and is corrected.
9. The die bonder of the novel LED die bonder according to claim 1, wherein: the second lens assembly (6) comprises a second lens supporting seat (6-1), a second lens (6-2) and a second camera (6-3), the second lens supporting seat (6-1) is fixed on the clamp moving platform (2), a coaxial mounting hole is formed in the outer end of an inclined part of the second lens supporting seat, the second camera (6-3) is mounted on the coaxial mounting hole, the second camera (6-3) is vertically arranged, the second lens (6-2) is fixed to the upper end of the second camera, and the second camera (6-3) is used for recognizing that the LED support on the clamp moving platform (2) moves to a specified position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920798205.7U CN209929338U (en) | 2019-05-28 | 2019-05-28 | Novel solid brilliant device of solid brilliant machine of LED |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110165038A (en) * | 2019-05-28 | 2019-08-23 | 深圳市新益昌自动化设备有限公司 | A kind of crystal solidifying apparatus and its die-bonding method of Novel LED die bonding machine |
| CN111430285A (en) * | 2020-04-01 | 2020-07-17 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
| CN113328028A (en) * | 2021-06-25 | 2021-08-31 | 深圳市广晟德科技发展有限公司 | CSP on-line die bonder |
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2019
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110165038A (en) * | 2019-05-28 | 2019-08-23 | 深圳市新益昌自动化设备有限公司 | A kind of crystal solidifying apparatus and its die-bonding method of Novel LED die bonding machine |
| CN110165038B (en) * | 2019-05-28 | 2024-02-06 | 深圳新益昌科技股份有限公司 | Novel LED die bonder and die bonder method thereof |
| CN111430285A (en) * | 2020-04-01 | 2020-07-17 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
| CN111430285B (en) * | 2020-04-01 | 2020-11-13 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
| CN113328028A (en) * | 2021-06-25 | 2021-08-31 | 深圳市广晟德科技发展有限公司 | CSP on-line die bonder |
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