CN217043543U - Wafer sorting equipment - Google Patents
Wafer sorting equipment Download PDFInfo
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- CN217043543U CN217043543U CN202220598443.5U CN202220598443U CN217043543U CN 217043543 U CN217043543 U CN 217043543U CN 202220598443 U CN202220598443 U CN 202220598443U CN 217043543 U CN217043543 U CN 217043543U
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Abstract
本实用新型公开了一种晶圆分选设备，包括机架、上料机构、摆臂机构、晶圆平台机构、Bin盘平台机构、晶圆顶针机构、Bin盘顶膜机构和CCD对位系统。工作时，上料机构夹持晶圆盘放入到晶圆平台上，上料机构夹持Bin盘放入到Bin盘平台上，晶圆平台机构移动到CCD搜索、对位位置，CCD对位系统对晶圆进行搜索、对位，Bin盘平台机构移动到CCD对位、检测位置，CCD对位系统对晶圆进行对位、检测，晶圆顶针机构将晶圆上的晶粒顶出，摆臂机构上的吸嘴吸住晶粒，摆臂机构旋转，Bin盘顶针机构顶起Bin盘膜，摆臂机构将晶粒放置在Bin盘上。本实用新型的高速晶圆分选设备具有速度块、精度高、适用产品类型多等特点。
The utility model discloses a wafer sorting device, comprising a rack, a feeding mechanism, a swing arm mechanism, a wafer platform mechanism, a Bin plate platform mechanism, a wafer ejector mechanism, a Bin plate top film mechanism and a CCD alignment system . When working, the feeding mechanism clamps the wafer disc and puts it on the wafer platform, the feeding mechanism clamps the Bin disc and puts it on the Bin disc platform, and the wafer platform mechanism moves to the CCD search and alignment position, and the CCD is aligned. The system searches and aligns the wafer, the Bin plate platform mechanism moves to the CCD alignment and detection position, the CCD alignment system aligns and detects the wafer, and the wafer ejector mechanism ejects the dies on the wafer. The suction nozzle on the swing arm mechanism sucks the die, the swing arm mechanism rotates, the Bin disc ejector mechanism lifts the Bin disc film, and the swing arm mechanism places the die on the Bin disc. The high-speed wafer sorting equipment of the utility model has the characteristics of a speed block, high precision, and many types of applicable products.
Description
Technical Field
The utility model relates to a semiconductor, miniLED's processing equipment, specific saying so relates to a wafer sorting facilities.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the wafer is called a wafer because the shape is circular, and various circuit device structures can be manufactured on the silicon wafer, so that an IC product with a specific electrical function can be obtained.
The wafer sorting equipment is one of the key equipments in the front-end process of the wafer, and because the wafer has small particles and high productivity, the equipment has higher requirements on the picking stability and the sorting speed. There is also a great demand in the miniLED industry for sorting equipment, and since a large number of LEDs are required on one miniLED screen, there are also high requirements on the stability of the equipment pick-up and the sorting speed. At present, the sorting speed in the industry is slow, and the production capacity is limited.
Therefore, it is necessary to provide a high-speed sorting apparatus suitable for wafers to make up for the short plate as soon as possible.
SUMMERY OF THE UTILITY MODEL
To the deficiency among the prior art, the to-be-solved technical problem of the utility model lies in providing a wafer sorting facilities. The purpose of designing the sorting apparatus is to improve the pick-up stability and to increase the sorting speed.
In order to solve the technical problem, the utility model discloses a following scheme realizes: the utility model discloses a wafer sorting facilities, including the frame, the frame is equipped with material loading station, sorting facilities still includes:
the feeding mechanism is arranged at a feeding station, is suspended on a frame and is provided with a first XYZ three-axis linkage mechanism, and a wafer disc clamping mechanism and a Bin disc clamping mechanism which are arranged on the first XYZ three-axis linkage mechanism;
the wafer platform mechanism is provided with a first base arranged on the rack and a first YZ axis movement module arranged on the first base, the first YZ axis movement module is connected with a wafer assembly in a driving way, and a wafer fixing mechanism, a light source and a suction nozzle wiping device are respectively arranged on the wafer assembly;
the wafer thimble mechanism is arranged on the first base and is provided with a second XYZ three-axis linkage mechanism and a thimble fixing assembly arranged on the second XYZ three-axis linkage mechanism, and a thimble is detachably arranged on the thimble fixing assembly;
the swing arm mechanism is arranged at the sorting station and is provided with a second base, a first theta shaft mechanism arranged on the second base and a rotating support arranged on the first theta shaft mechanism and driven by the first theta shaft mechanism to rotate, and a first swing arm and a second swing arm are symmetrically arranged on the rotating support;
the Bin disc platform mechanism is provided with a third base fixed on the rack, a second YZ axis movement module arranged on the third base and a second theta axis mechanism in driving connection with the second YZ axis movement module, the second theta axis mechanism is in driving connection with a Bin disc assembly, and a Bin disc fixing mechanism and a light source are arranged on the Bin disc assembly;
the Bin disc film jacking mechanism is arranged on the third base and is provided with a third X-axis movement module and a film jacking mechanism which is in driving connection with the third X-axis movement module and is driven by the third X-axis movement module to do X-axis movement;
the CCD alignment system is arranged on the second base and provided with a first CCD visual module and a second CCD visual module, the first CCD visual module is coincided with the centers of the first swing arm, the second swing arm and the ejector pin, and the second CCD visual module is coincided with the centers of the first swing arm and the second swing arm.
Further, the first XYZ three-axis linkage mechanism includes:
a first X-axis motion module;
the first Y-axis movement module is in driving connection with the first X-axis movement module and is driven by the first X-axis movement module to do X-axis movement;
the first Z-axis mechanism and the second Z-axis mechanism are respectively arranged on the left side and the right side of the first Y-axis movable part;
the wafer disc clamping mechanism is in driving connection with the first Z-axis mechanism;
the Bin disc clamping mechanism is in driving connection with the second Z-axis mechanism;
the first X-axis movement module is arranged on the frame, the power source of the first X-axis movement module is a first synchronous belt motor, and the first synchronous belt motor is connected with the X-axis movable part in a driving mode through a synchronous belt assembly;
the first Y-axis motion module is arranged on the X-axis movable part, and the power source of the first Y-axis motion module is a second synchronous belt motor which is in driving connection with the Y-axis movable part;
the power source of the first Z-axis mechanism is a third synchronous belt motor which is in driving connection with a first Z-axis movable part, and the wafer disc clamping mechanism is installed on the first Z-axis movable part;
and the power source of the second Z-axis mechanism is a fourth synchronous belt motor, the fourth synchronous belt motor is in driving connection with a second Z-axis movable part, and the second Z-axis movable part is provided with the Bin disc clamping mechanism.
Furthermore, the power source of the wafer disc clamping mechanism is a first clamping cylinder, the first clamping cylinder is connected with a first clamp in a driving mode, and the first clamp is used for clamping a first wafer disc;
the power source of the Bin disc clamping mechanism is a second clamping cylinder, the second clamping cylinder is in driving connection with a second clamp, and the second clamp is used for clamping a second crystal disc.
Further, the first base is made of marble;
the first YZ axle motion module includes:
the second Y-axis movement module is arranged on the first base and is in driving connection with a second Y-axis movable part;
and the third Z-axis mechanism is arranged on the second Y-axis movable part and is in driving connection with a third Z-axis movable part, and the third Z-axis movable part is respectively provided with the wafer fixing mechanism, the light source and the suction nozzle wiping device.
Furthermore, the power source of the second Y-axis motion module is a first lead screw motor which is in driving connection with a first lead screw, and the first lead screw is in threaded connection with the second Y-axis movable part;
the power source of the third Z-axis mechanism is a second lead screw motor, the second lead screw motor is in driving connection with a second lead screw, and the second lead screw is in threaded connection with the third Z-axis movable part;
the power source of the wafer fixing mechanism is a first pressing cylinder, the first pressing cylinder is connected with a pressing plate in a driving mode, and the moving direction of the pressing plate points to the wafer disc;
the power source of the suction nozzle wiping device is a wiping cylinder which is connected with a wiping device in a driving mode, and the moving path of the wiping device can reach the wiping position of a product.
Further, the second XYZ three-axis linkage mechanism includes:
the third Y-axis motion module is arranged on the first base;
the second X-axis movement module is in driving connection with the third Y-axis movement module and is driven by the third Y-axis movement module to do Y-axis movement;
the fourth Z-axis mechanism is in driving connection with the second X-axis movement module and is driven by the second X-axis movement module to do X-axis movement, the fourth Z-axis mechanism is provided with a fourth Z-axis movable part which moves along a Z-axis guide rail, and the fourth Z-axis movable part is provided with the ejector pin fixing component;
the thimble fixing assembly comprises a thimble cap mechanism and a thimble driving mechanism installed on the thimble cap mechanism, the thimble driving mechanism is in driving connection with a thimble fixing part, and a thimble is detachably installed on the thimble fixing part.
Furthermore, the power source of the third Y-axis motion module is a first motor, the first motor is connected with a first cam in a driving manner, the first cam is connected with a first connecting rod, the other end of the first connecting rod is rotatably connected with a third Y-axis movable part, and the first connecting rod is displaced by the rotation of the first cam so as to drive the third Y-axis movable part to move in the Y-axis direction;
the power source of the second X-axis movement module is a first linear cylinder which is in driving connection with the first X-axis movable part;
the power source of the fourth Z-axis mechanism is a second motor, the second motor is connected with a second cam in a driving mode, the second cam is connected with a second connecting rod, the other end of the second connecting rod is rotatably connected with a fifth Z-axis movable part, and the second connecting rod is displaced through the rotation of the second cam so as to drive the fifth Z-axis movable part to move in the Z axial direction;
the power source of the thimble cap mechanism is a first cam motor, the first cam motor is in driving connection with a first telescopic piece, and the first telescopic piece is connected with the thimble driving mechanism;
the power source of the thimble driving mechanism is a second cam motor, the second cam motor is in driving connection with a second telescopic piece, the second telescopic piece is connected with a thimble fixing part, and the thimble fixing part is detachably mounted on the thimble.
Furthermore, the power source of the first theta axis mechanism is a first servo motor, and the first servo motor drives the rotating bracket to rotate;
the first swing arm and the second swing arm have the same structure and are vertically arranged on two sides of the rotating bracket through elastic plates;
a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the first swing arm;
and a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the second swing arm.
Furthermore, the second YZ-axis movement module comprises a fourth Y-axis movement module and a fifth Z-axis movement module which is in driving connection with the fourth Y-axis movement module and is driven by the fourth Y-axis movement module to perform Y-axis movement;
the fourth Y-axis movement module is installed on the third base, the power source of the fourth Y-axis movement module is a third screw rod motor, the third screw rod motor is connected with a third screw rod in a driving mode, the third screw rod is connected with a fourth Y-axis movable portion in a threaded mode, and the fifth Z-axis movement module is installed on the fourth Y-axis movable portion;
the power source of the fifth Z-axis motion module is a fourth screw rod motor, the fourth screw rod motor is in driving connection with a fourth screw rod, the fourth screw rod is in threaded connection with a sixth Z-axis movable part, and the sixth Z-axis movable part is provided with the second theta-axis mechanism;
the power source of the second theta axis mechanism is a second servo motor, the second servo motor is in driving connection with the Bin disc assembly, and the second servo motor drives the Bin disc assembly to rotate;
and the power source of the Bin disc fixing mechanism is a second pressing cylinder which drives a pressing plate to press the Bin disc.
Furthermore, the power source of the third X-axis motion module is a second linear cylinder which is in driving connection with a second X-axis movable part, and the second X-axis movable part is provided with the top film mechanism;
the power source of the film jacking mechanism is a third cam motor, and the third cam motor drives the film jacking part to do telescopic motion.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a sorting equipment passes through feed mechanism, swing arm mechanism, wafer platform mechanism, Bin dish platform mechanism, wafer thimble mechanism, Bin dish epiphragma mechanism and CCD counterpoint system in the frame and processes the wafer, and the wafer forms Map (the Map is the mapplet for the mapplet) after the front end detects earlier, reads the Map by equipment after, picks up required crystalline grain from the wafer and places on Bin dish blue membrane. Because this equipment is vertical with wafer dish platform and Bin dish platform and is placed and have the grating, the swing arm is rotary motion by two sets of, so the platform precision is high, selects separately fastly, satisfies wafer and selects separately precision and efficiency demand. The utility model discloses a sorting equipment reasonable in design, low in manufacturing cost, the precision is high, and work efficiency is high.
Drawings
Fig. 1 is the overall structure schematic diagram of the sorting equipment of the present invention.
Fig. 2 is a schematic structural diagram of the feeding mechanism of the present invention.
Fig. 3 is a schematic structural diagram of the wafer stage mechanism of the present invention.
Fig. 4 is a schematic structural diagram of the wafer thimble mechanism of the present invention.
Fig. 5 is a schematic structural view of the swing arm mechanism of the present invention.
Fig. 6 is a schematic structural diagram of the Bin tray platform mechanism of the present invention.
Fig. 7 is a schematic structural diagram of the Bin tray top film mechanism of the present invention.
Fig. 8 is a schematic structural view of the CCD alignment system of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is obvious that the described embodiments of the invention are only some of the embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The following Bin disks are classified disks.
Example 1: the utility model discloses a concrete structure as follows:
referring to fig. 1-8, the utility model discloses a wafer sorting equipment, including frame 1, frame 1 is equipped with material loading station, selects separately the station, sorting equipment still includes:
the feeding mechanism 2 is arranged at a feeding station, the feeding mechanism 2 is suspended on a frame, and the feeding mechanism 2 is provided with a first XYZ three-axis linkage mechanism, and a wafer disc clamping mechanism 25 and a Bin disc clamping mechanism 26 which are arranged on the first XYZ three-axis linkage mechanism;
the wafer platform mechanism 3 is provided with a first base (31) arranged on the rack 1 and a first YZ axis movement module arranged on the first base 31, the first YZ axis movement module is in driving connection with a wafer assembly, and a wafer fixing mechanism 34, a light source 35 and a suction nozzle wiping device 36 are respectively arranged on the wafer assembly;
the wafer thimble mechanism 4 is arranged on the first base 31, and is provided with a second XYZ three-axis linkage mechanism and a thimble fixing assembly arranged on the second XYZ three-axis linkage mechanism, and a thimble 46 is detachably arranged on the thimble fixing assembly;
the swing arm mechanism 5 is arranged at the sorting station, and is provided with a second base 51, a first theta axis mechanism 52 arranged on the second base 51, and a rotating support which is arranged on the first theta axis mechanism 52 and is driven by the first theta axis mechanism 52 to rotate, wherein a first swing arm 53 and a second swing arm 54 are symmetrically arranged on the rotating support;
the Bin disc platform mechanism 6 is provided with a third base 61 fixed on the frame 1, a second YZ axis movement module arranged on the third base 61, and a second theta axis mechanism 64 in driving connection with the second YZ axis movement module, wherein the second theta axis mechanism 64 is in driving connection with a Bin disc assembly, and a Bin disc fixing mechanism 65 and a light source 66 are arranged on the Bin disc assembly;
the Bin tray film-jacking mechanism 7 is arranged on the third base 61, and the Bin tray film-jacking mechanism 7 is provided with a third X-axis movement module 71 and a film-jacking mechanism 72 which is in driving connection with the third X-axis movement module 71 and is driven by the third X-axis movement module 71 to do X-axis movement;
the CCD alignment system 8 is mounted on the second base 51, the CCD alignment system 8 has a first CCD vision module 81 and a second CCD vision module 82, the first CCD vision module 81 coincides with the centers of the first swing arm 53, the second swing arm 54 and the thimble 46, and the second CCD vision module 82 coincides with the centers of the first swing arm 53 and the second swing arm 54.
A preferred technical solution of this embodiment: the first XYZ three-axis linkage mechanism includes:
a first X-axis motion module 21;
the first Y-axis movement module 22 is in driving connection with the first X-axis movement module 21 and is driven by the first X-axis movement module 21 to do X-axis movement, and the first Y-axis movement module 22 is in driving connection with a first Y-axis movable part;
a first Z-axis mechanism 23 and a second Z-axis mechanism 24 respectively installed at left and right sides of the first Y-axis movable portion;
the wafer disc clamping mechanism 25 is in driving connection with the first Z-axis mechanism 23;
a Bin disc clamping mechanism 26 in driving connection with the second Z-axis mechanism 24;
the first X-axis movement module 21 is arranged on the frame, the power source of the first X-axis movement module is a first synchronous belt motor, and the first synchronous belt motor is connected with the X-axis movement part in a driving mode through a synchronous belt component;
the first Y-axis motion module 22 is mounted on the X-axis movable portion, and its power source is a second synchronous belt motor, which is in driving connection with the Y-axis movable portion;
the power source of the first Z-axis mechanism 23 is a third synchronous belt motor, the third synchronous belt motor is connected with a first Z-axis movable part in a driving manner, and the wafer disc clamping mechanism 25 is installed on the first Z-axis movable part;
the power source of the second Z-axis mechanism 24 is a fourth synchronous belt motor, which is drivingly connected with a second Z-axis movable portion, and the second Z-axis movable portion is mounted with the Bin tray clamping mechanism 26.
A preferred technical solution of this embodiment: the power source of the wafer disc clamping mechanism 25 is a first clamping cylinder which is connected with a first clamp in a driving way, and the first clamp is used for clamping a first wafer disc;
the power source of the Bin disc clamping mechanism 26 is a second clamping cylinder, the second clamping cylinder is in driving connection with a second clamp, and the second clamp is used for clamping a second crystal disc.
A preferred technical solution of this embodiment: the first base 31 is made of marble;
the first YZ axle motion module includes:
the second Y-axis movement module 32 is mounted on the first base 31, and the second Y-axis movement module 32 is in driving connection with the second Y-axis movable part;
and the third Z-axis mechanism 33 is arranged on the second Y-axis movable part, the third Z-axis mechanism 33 is connected with a third Z-axis movable part in a driving manner, and the wafer fixing mechanism 34, the light source 35 and the suction nozzle wiping device 36 are respectively arranged on the third Z-axis movable part.
A preferred technical solution of this embodiment: the power source of the second Y-axis motion module 32 is a first lead screw motor, the first lead screw motor is in driving connection with a first lead screw, and the first lead screw is in threaded connection with the second Y-axis movable part;
the power source of the third Z-axis mechanism 33 is a second lead screw motor, the second lead screw motor is in driving connection with a second lead screw, and the second lead screw is in threaded connection with the third Z-axis movable part;
the power source of the wafer fixing mechanism 34 is a first pressing cylinder, the first pressing cylinder is connected with a pressing plate in a driving manner, and the moving direction of the pressing plate points to the wafer disc;
the power source of the nozzle wiping device 36 is a wiping cylinder to which a wiping device is drivingly connected, and the moving path of the wiping device can reach the wiping position of the product.
A preferred technical solution of this embodiment: the second XYZ three-axis linkage mechanism includes:
a third Y-axis motion module 41 mounted on the first base 31;
a second X-axis movement module 42 drivingly connected to the third Y-axis movement module 41 and driven by the third Y-axis movement module 41 to perform Y-axis movement;
a fourth Z-axis mechanism 43 drivingly connected to the second X-axis movement module 42 and driven by the second X-axis movement module 42 to perform an X-axis movement, wherein the fourth Z-axis mechanism 43 has a fourth Z-axis movable portion movable along a Z-axis guide rail, and the fourth Z-axis movable portion mounts the thimble fixing assembly;
the thimble fixing component comprises a thimble cap mechanism 44 and a thimble driving mechanism 45 installed on the thimble cap mechanism 44, the thimble driving mechanism 45 is in driving connection with a thimble fixing part, and a thimble 46 is detachably installed on the thimble fixing part.
A preferred technical solution of this embodiment: the power source of the third Y-axis motion module 41 is a first motor, the first motor is connected to a first cam in a driving manner, the first cam is connected to a first connecting rod, the other end of the first connecting rod is rotatably connected to a third Y-axis movable portion, and the first connecting rod is displaced by the rotation of the first cam, so as to drive the third Y-axis movable portion to move in the Y-axis direction;
the power source of the second X-axis movement module 42 is a first linear cylinder, and the first linear cylinder is in driving connection with the first X-axis movable part;
the power source of the fourth Z-axis mechanism 43 is a second motor, the second motor is connected with a second cam in a driving manner, the second cam is connected with a second connecting rod, the other end of the second connecting rod is rotatably connected with a fifth Z-axis movable portion, and the second connecting rod is displaced by the rotation of the second cam so as to drive the fifth Z-axis movable portion to move in the Z-axis direction;
the power source of the thimble cap mechanism 44 is a first cam motor, the first cam motor is in driving connection with a first telescopic piece, and the first telescopic piece is connected with the thimble driving mechanism 45;
the power source of the thimble driving mechanism 45 is a second cam motor, the second cam motor is in driving connection with a second telescopic piece, the second telescopic piece is connected with a thimble fixing part, and the thimble 46 is detachably mounted on the thimble fixing part.
A preferred technical solution of this embodiment: the power source of the first θ -axis mechanism 52 is a first servo motor, and the first servo motor drives the rotating bracket to rotate;
the first swing arm 53 and the second swing arm 54 have the same structure, and are vertically arranged on two sides of the rotating bracket through elastic plates;
a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the first swing arm 53;
a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the second swing arm 54.
A preferred technical solution of this embodiment: the second YZ-axis movement module comprises a fourth Y-axis movement module 62 and a fifth Z-axis movement module 63 which is in driving connection with the fourth Y-axis movement module 62 and is driven by the fourth Y-axis movement module 62 to move in the Y-axis direction;
the fourth Y-axis motion module 62 is mounted on the third base 61, and its power source is a third lead screw motor, which is connected with a third lead screw in a driving manner, the third lead screw is connected with a fourth Y-axis movable part in a screw joint manner, and the fifth Z-axis motion module 63 is mounted on the fourth Y-axis movable part;
the power source of the fifth Z-axis motion module 63 is a fourth lead screw motor, the fourth lead screw motor is in driving connection with a fourth lead screw, the fourth lead screw is in threaded connection with a sixth Z-axis movable part, and the sixth Z-axis movable part is provided with the second theta-axis mechanism 64;
the power source of the second theta axis mechanism 64 is a second servo motor, the second servo motor is in driving connection with the Bin disc assembly, and the second servo motor drives the Bin disc assembly to rotate;
the power source of the Bin disk fixing mechanism 65 is a second pressing cylinder, and the second pressing cylinder drives a pressing plate to press the Bin disk.
A preferred technical solution of this embodiment: the power source of the third X-axis motion module 71 is a second linear cylinder, the second linear cylinder is connected with a second X-axis movable part in a driving manner, and the second X-axis movable part is provided with the top film mechanism 72;
the power source of the top film mechanism 72 is a third cam motor, and the third cam motor drives the top film part to do telescopic motion.
Example 2:
the following is the utility model discloses wafer sorting equipment's theory of operation:
during operation, a wafer disc is placed into the wafer fixing mechanism 34 through the feeding mechanism 2, a Bin disc is placed into the Bin disc fixing mechanism 65 through the feeding mechanism 2, and the wafer is scanned through the first CCD vision module 81 to determine the positions of grains needing Bin division; the wafer platform mechanism 3 moves the crystal grain to the position of the first swing arm 53 through the second Y-axis motion module 32 and the third Z-axis mechanism 33; the wafer ejector pin mechanism 4 sends an ejector pin 46 to a position close to a crystal grain through the second X-axis motion module 42, the Bin disc ejector film mechanism 7 sends an ejector film mechanism 72 to be tightly attached to a blue film of a Bin disc through the third X-axis motion module 71, the third Y-axis motion module 41 and the fourth Z-axis mechanism 43 move the ejector pin 46 to the center of the crystal grain, the ejector pin cap mechanism 44 tightly attaches an ejector pin cap to the wafer film through the first cam motor and opens vacuum, the ejector pin driving mechanism 45 ejects the ejector pin 46 through the second cam motor, the ejector pin 46 ejects the crystal grain to a suction nozzle of the first swing arm 53, and the suction nozzle of the first swing arm 53 opens vacuum adsorption of the crystal grain; the first theta axis mechanism 52 of the swing arm mechanism 5 rotates 180 degrees, the film ejection mechanism 72 ejects the Bin blue film and sticks to the crystal grains through the third cam motor, the suction nozzle of the first swing arm 53 breaks vacuum and releases the crystal grains, the film ejection mechanism 72 retracts the Bin blue film through the third cam motor, and the required Bin crystal grains are stuck on the Bin disc; the grains are detected by the second CCD vision module 8. The utility model discloses a sorting equipment simple structure, reasonable in design, the preparation is with low costs, and the precision is high, and work efficiency is high.
To sum up, the utility model discloses a sorting equipment passes through feed mechanism, swing arm mechanism, wafer platform mechanism, Bin dish platform mechanism, wafer thimble mechanism, Bin dish epiphragma mechanism and CCD counterpoint system in the frame and processes the wafer, and the wafer forms the Map picture after the front end detects earlier, reads the Map picture by equipment after, picks up required crystalline grain from the wafer and places on Bin dish epiphragma. Because this equipment is vertical with wafer dish platform and Bin dish platform and is placed and have the grating, the swing arm is rotary motion by two sets of, so the platform precision is high, selects separately fastly, satisfies wafer and selects separately precision and efficiency demand.
The above description is only the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all the equivalent structures or equivalent processes that are used in the specification and drawings of the present invention can be directly or indirectly applied to other related technical fields, and all the same principles are included in the scope of the present invention.
Claims (10)
1. The utility model provides a wafer sorting facilities, includes frame (1), and frame (1) is equipped with the material loading station, selects separately the station, its characterized in that, sorting facilities still includes:
the feeding mechanism (2) is arranged at a feeding station, the feeding mechanism (2) is suspended on a frame, and the feeding mechanism is provided with a first XYZ three-axis linkage mechanism, and a wafer disc clamping mechanism (25) and a Bin disc clamping mechanism (26) which are arranged on the first XYZ three-axis linkage mechanism;
the wafer platform mechanism (3) is provided with a first base (31) arranged on the rack (1) and a first YZ axis motion module arranged on the first base (31), the first YZ axis motion module is in driving connection with a wafer assembly, and a wafer fixing mechanism (34), a light source (35) and a suction nozzle wiping device (36) are respectively arranged on the wafer assembly;
the wafer thimble mechanism (4) is arranged on the first base (31) and is provided with a second XYZ three-axis linkage mechanism and a thimble fixing assembly arranged on the second XYZ three-axis linkage mechanism, and a thimble (46) is detachably arranged on the thimble fixing assembly;
the swing arm mechanism (5) is arranged at the sorting station and is provided with a second base (51), a first theta shaft mechanism (52) arranged on the second base (51), and a rotary support which is arranged on the first theta shaft mechanism (52) and is driven by the first theta shaft mechanism (52) to rotate, wherein a first swing arm (53) and a second swing arm (54) are symmetrically arranged on the rotary support;
the Bin disc platform mechanism (6) is provided with a third base (61) fixed on the rack (1), a second YZ axis movement module arranged on the third base (61), and a second theta axis mechanism (64) in driving connection with the second YZ axis movement module, wherein the second theta axis mechanism (64) is in driving connection with a Bin disc assembly, and a Bin disc fixing mechanism (65) and a light source (66) are arranged on the Bin disc assembly;
the Bin disc film-jacking mechanism (7) is arranged on the third base (61), and the Bin disc film-jacking mechanism (7) is provided with a third X-axis movement module (71) and a film-jacking mechanism (72) which is in driving connection with the third X-axis movement module (71) and is driven by the third X-axis movement module (71) to do X-axis movement;
the CCD alignment system (8) is installed on the second base (51), the CCD alignment system (8) is provided with a first CCD visual module (81) and a second CCD visual module (82), the first CCD visual module (81) is coincided with the centers of the first swing arm (53), the second swing arm (54) and the ejector pin (46), and the second CCD visual module (82) is coincided with the centers of the first swing arm (53) and the second swing arm (54).
2. The wafer sorting apparatus as claimed in claim 1, wherein the first XYZ tri-axis linkage mechanism comprises:
a first X-axis motion module (21);
the first Y-axis movement module (22) is in driving connection with the first X-axis movement module (21) and is driven by the first X-axis movement module (21) to do X-axis movement, and the first Y-axis movement module (22) is in driving connection with a first Y-axis movable part;
a first Z-axis mechanism (23) and a second Z-axis mechanism (24) which are respectively arranged on the left side and the right side of the first Y-axis movable part;
the wafer disc clamping mechanism (25) is in driving connection with the first Z-axis mechanism (23);
a Bin disc clamping mechanism (26) in driving connection with the second Z-axis mechanism (24);
the first X-axis motion module (21) is arranged on the frame, the power source of the first X-axis motion module is a first synchronous belt motor, and the first synchronous belt motor is connected with the X-axis movable part in a driving mode through a synchronous belt assembly;
the first Y-axis motion module (22) is arranged on the X-axis movable part, and the power source of the first Y-axis motion module is a second synchronous belt motor which is in driving connection with the Y-axis movable part;
the power source of the first Z-axis mechanism (23) is a third synchronous belt motor which is in driving connection with a first Z-axis movable part, and the wafer disc clamping mechanism (25) is installed on the first Z-axis movable part;
and the power source of the second Z-axis mechanism (24) is a fourth synchronous belt motor, the fourth synchronous belt motor is in driving connection with a second Z-axis movable part, and the Bin disc clamping mechanism (26) is installed on the second Z-axis movable part.
3. The wafer sorting apparatus according to claim 1, wherein the power source of the wafer chuck mechanism (25) is a first chuck cylinder to which a first clamp for clamping a first wafer is drivingly connected;
the power source of the Bin disc clamping mechanism (26) is a second clamping cylinder, the second clamping cylinder is connected with a second clamp in a driving mode, and the second clamp is used for clamping a second crystal disc.
4. Wafer sorting device according to claim 1, characterized in that said first seat (31) is a seat of marble material;
the first YZ-axis motion module comprises:
the second Y-axis movement module (32) is mounted on the first base (31), and the second Y-axis movement module (32) is in driving connection with the second Y-axis movable part;
and the third Z-axis mechanism (33) is arranged on the second Y-axis movable part, the third Z-axis mechanism (33) is connected with a third Z-axis movable part in a driving manner, and the third Z-axis movable part is respectively provided with the wafer fixing mechanism (34), the light source (35) and the suction nozzle wiping device (36).
5. The wafer sorting apparatus according to claim 4, wherein the power source of the second Y-axis moving module (32) is a first lead screw motor, the first lead screw motor is in driving connection with a first lead screw, and the first lead screw is in threaded connection with the second Y-axis movable part;
the power source of the third Z-axis mechanism (33) is a second screw motor, the second screw motor is connected with a second screw in a driving way, and the second screw is in threaded connection with the third Z-axis movable part;
the power source of the wafer fixing mechanism (34) is a first pressing cylinder, the first pressing cylinder is connected with a pressing plate in a driving mode, and the moving direction of the pressing plate points to the wafer disc;
the power source of the suction nozzle wiping device (36) is a wiping cylinder which is connected with a wiping device in a driving way, and the moving path of the wiping device can reach the wiping position of the product.
6. The wafer sorting apparatus as claimed in claim 1, wherein the second XYZ tri-axis linkage mechanism comprises:
a third Y-axis motion module (41) mounted on the first base (31);
the second X-axis movement module (42) is in driving connection with the third Y-axis movement module (41) and is driven by the third Y-axis movement module (41) to do Y-axis movement;
a fourth Z-axis mechanism (43) which is in driving connection with the second X-axis movement module (42) and is driven by the second X-axis movement module (42) to do X-axis movement, wherein the fourth Z-axis mechanism (43) is provided with a fourth Z-axis movable part which moves along a Z-axis guide rail, and the fourth Z-axis movable part is provided with the thimble fixing component;
the thimble fixing assembly comprises a thimble cap mechanism (44) and a thimble driving mechanism (45) installed on the thimble cap mechanism (44), the thimble driving mechanism (45) is in driving connection with a thimble fixing part, and a thimble (46) is detachably installed on the thimble fixing part.
7. The wafer sorting device according to claim 6, wherein the power source of the third Y-axis moving module (41) is a first motor, the first motor is connected with a first cam in a driving manner, the first cam is connected with a first connecting rod, the other end of the first connecting rod is rotatably connected with a third Y-axis movable part, and the first connecting rod is displaced through the rotation of the first cam so as to drive the third Y-axis movable part to move in the Y-axis direction;
the power source of the second X-axis movement module (42) is a first linear air cylinder which is in driving connection with the first X-axis movable part;
the power source of the fourth Z-axis mechanism (43) is a second motor, the second motor is in driving connection with a second cam, the second cam is connected with a second connecting rod, the other end of the second connecting rod is rotatably connected with a fifth Z-axis movable part, and the second connecting rod is displaced through the rotation of the second cam so as to drive the fifth Z-axis movable part to move in the Z axial direction;
the power source of the thimble cap mechanism (44) is a first cam motor, the first cam motor is in driving connection with a first telescopic piece, and the first telescopic piece is connected with the thimble driving mechanism (45);
the power source of the thimble driving mechanism (45) is a second cam motor, the second cam motor is in driving connection with a second telescopic piece, the second telescopic piece is connected with a thimble fixing part, and the thimble (46) is detachably mounted on the thimble fixing part.
8. The wafer sorting apparatus according to claim 1, wherein a power source of the first θ -axis mechanism (52) is a first servo motor that drives the rotary support to make a rotary motion;
the first swing arm (53) and the second swing arm (54) have the same structure and are vertically arranged on two sides of the rotating bracket through elastic plates;
a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the first swing arm (53);
a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the second swing arm (54).
9. The wafer sorting apparatus according to claim 1, wherein the second YZ-axis motion module comprises a fourth Y-axis motion module (62), a fifth Z-axis motion module (63) drivingly connected to the fourth Y-axis motion module (62) and driven by the fourth Y-axis motion module (62) to move in a Y-axis direction;
the fourth Y-axis movement module (62) is arranged on the third base (61), the power source of the fourth Y-axis movement module is a third screw motor, the third screw motor is connected with a third screw in a driving mode, the third screw is connected with a fourth Y-axis movable part in a threaded mode, and the fifth Z-axis movement module (63) is arranged on the fourth Y-axis movable part;
the power source of the fifth Z-axis movement module (63) is a fourth screw rod motor, the fourth screw rod motor is connected with a fourth screw rod in a driving mode, the fourth screw rod is connected with a sixth Z-axis movable portion in a threaded mode, and the sixth Z-axis movable portion is provided with the second theta-axis mechanism (64);
the power source of the second theta axis mechanism (64) is a second servo motor, the second servo motor is in driving connection with the Bin disc assembly, and the second servo motor drives the Bin disc assembly to rotate;
the power source of the Bin disc fixing mechanism (65) is a second pressing cylinder, and the second pressing cylinder drives a pressing plate to press the Bin disc.
10. The wafer sorting apparatus according to claim 1, wherein the power source of the third X-axis moving module (71) is a second linear cylinder drivingly connected to a second X-axis movable portion, and the second X-axis movable portion mounts the top film mechanism (72);
the power source of the film jacking mechanism (72) is a third cam motor, and the third cam motor drives the film jacking part to do telescopic motion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220598443.5U CN217043543U (en) | 2022-03-18 | 2022-03-18 | Wafer sorting equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220598443.5U CN217043543U (en) | 2022-03-18 | 2022-03-18 | Wafer sorting equipment |
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| CN217043543U true CN217043543U (en) | 2022-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114535139A (en) * | 2022-03-18 | 2022-05-27 | 深圳市鑫三力自动化设备有限公司 | Wafer sorting equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114535139A (en) * | 2022-03-18 | 2022-05-27 | 深圳市鑫三力自动化设备有限公司 | Wafer sorting equipment |
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