CN114535139A - Wafer sorting equipment - Google Patents

Wafer sorting equipment Download PDF

Info

Publication number
CN114535139A
CN114535139A CN202210269844.0A CN202210269844A CN114535139A CN 114535139 A CN114535139 A CN 114535139A CN 202210269844 A CN202210269844 A CN 202210269844A CN 114535139 A CN114535139 A CN 114535139A
Authority
CN
China
Prior art keywords
axis
wafer
movable part
power source
driving connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210269844.0A
Other languages
Chinese (zh)
Inventor
胡争光
师利全
李小根
罗东
贺天文
甘恩荣
吴嘉睿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Xinsanli Automation Equipment Co ltd
Original Assignee
Shenzhen Xinsanli Automation Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Xinsanli Automation Equipment Co ltd filed Critical Shenzhen Xinsanli Automation Equipment Co ltd
Priority to CN202210269844.0A priority Critical patent/CN114535139A/en
Publication of CN114535139A publication Critical patent/CN114535139A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36—Sorting apparatus characterised by the means used for distribution
    • B07C5/361—Processing or control devices therefor, e.g. escort memory
    • B07C5/362—Separating or distributor mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention discloses wafer sorting equipment which comprises a rack, a feeding mechanism, a swing arm mechanism, a wafer platform mechanism, a Bin disc platform mechanism, a wafer ejector pin mechanism, a Bin disc top film mechanism and a CCD (charge coupled device) alignment system. During operation, a feeding mechanism clamps a wafer disc and is placed on a wafer platform, a feeding mechanism clamps a Bin disc and is placed on the Bin disc platform, the wafer platform mechanism moves to a CCD searching and aligning position, a CCD aligning system searches and aligns the wafer, the Bin disc platform mechanism moves to a CCD aligning and detecting position, the CCD aligning system aligns and detects the wafer, a wafer ejector pin mechanism ejects crystal grains on the wafer, a suction nozzle on a swing arm mechanism sucks the crystal grains, the swing arm mechanism rotates, the Bin disc ejector pin mechanism jacks up a Bin disc film, and the swing arm mechanism places the crystal grains on the Bin disc. The high-speed wafer sorting equipment has the characteristics of speed block, high precision, multiple applicable product types and the like.

Description

Wafer sorting equipment
Technical Field
The invention relates to processing equipment for semiconductors and miniLEDs, in particular to wafer sorting equipment.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular, and various circuit element structures can be manufactured on the silicon wafer to become an IC product with specific electrical functions.
The wafer sorting equipment is one of the key equipments in the front-end process of the wafer, and because the wafer has small particles and high productivity, the equipment has higher requirements on the picking stability and the sorting speed. There is also a great demand in the miniLED industry for sorting equipment, and since a large number of LEDs are required on one miniLED screen, there are also high requirements on the stability of the equipment pick-up and the sorting speed. At present, the sorting speed in the industry is slow, and the production capacity is limited.
Therefore, it is necessary to provide a high-speed sorting apparatus suitable for wafers to make up for the short plate as soon as possible.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides wafer sorting equipment. The sorting apparatus is designed with the aim of improving the picking stability and increasing the sorting speed.
In order to solve the technical problem, the invention is realized by the following scheme: the invention discloses wafer sorting equipment, which comprises a rack, wherein the rack is provided with a feeding station and a sorting station, and the sorting equipment further comprises:
the feeding mechanism is arranged at a feeding station, is suspended on a frame and is provided with a first XYZ three-axis linkage mechanism, and a wafer disc clamping mechanism and a Bin disc clamping mechanism which are arranged on the first XYZ three-axis linkage mechanism;
the wafer platform mechanism is provided with a first base arranged on the rack and a first YZ axis movement module arranged on the first base, the first YZ axis movement module is in driving connection with a wafer assembly, and a wafer fixing mechanism, a light source and a suction nozzle wiping device are respectively arranged on the wafer assembly;
the wafer thimble mechanism is arranged on the first base and is provided with a second XYZ three-axis linkage mechanism and a thimble fixing assembly arranged on the second XYZ three-axis linkage mechanism, and a thimble is detachably arranged on the thimble fixing assembly;
the swing arm mechanism is arranged at the sorting station and is provided with a second base, a first theta shaft mechanism arranged on the second base and a rotating support arranged on the first theta shaft mechanism and driven by the first theta shaft mechanism to rotate, and a first swing arm and a second swing arm are symmetrically arranged on the rotating support;
the Bin disc platform mechanism is provided with a third base fixed on the rack, a second YZ axis movement module arranged on the third base and a second theta axis mechanism in driving connection with the second YZ axis movement module, the second theta axis mechanism is in driving connection with a Bin disc assembly, and a Bin disc fixing mechanism and a light source are arranged on the Bin disc assembly;
the Bin disc film jacking mechanism is arranged on the third base and is provided with a third X-axis movement module and a film jacking mechanism which is in driving connection with the third X-axis movement module and is driven by the third X-axis movement module to do X-axis movement;
the CCD alignment system is arranged on the second base and provided with a first CCD visual module and a second CCD visual module, the first CCD visual module is coincided with the centers of the first swing arm, the second swing arm and the ejector pin, and the second CCD visual module is coincided with the centers of the first swing arm and the second swing arm.
Further, the first XYZ three-axis linkage mechanism includes:
a first X-axis motion module;
the first Y-axis movement module is in driving connection with the first X-axis movement module and is driven by the first X-axis movement module to do X-axis movement, and the first Y-axis movement module is in driving connection with a first Y-axis movable part;
a first Z-axis mechanism and a second Z-axis mechanism which are respectively arranged on the left side and the right side of the first Y-axis movable part;
the wafer disc clamping mechanism is in driving connection with the first Z-axis mechanism;
the Bin disc clamping mechanism is in driving connection with the second Z-axis mechanism;
the first X-axis motion module is arranged on the frame, the power source of the first X-axis motion module is a first synchronous belt motor, and the first synchronous belt motor is connected with the X-axis movable part in a driving mode through a synchronous belt assembly;
the first Y-axis motion module is arranged on the X-axis movable part, and the power source of the first Y-axis motion module is a second synchronous belt motor which is in driving connection with the Y-axis movable part;
the power source of the first Z-axis mechanism is a third synchronous belt motor which is in driving connection with a first Z-axis movable part, and the wafer disc clamping mechanism is installed on the first Z-axis movable part;
and the power source of the second Z-axis mechanism is a fourth synchronous belt motor, the fourth synchronous belt motor is in driving connection with a second Z-axis movable part, and the second Z-axis movable part is provided with the Bin disc clamping mechanism.
Furthermore, the power source of the wafer disc clamping mechanism is a first clamping cylinder, the first clamping cylinder is connected with a first clamp in a driving mode, and the first clamp is used for clamping a first wafer disc;
the power source of the Bin disc clamping mechanism is a second clamping cylinder, the second clamping cylinder is in driving connection with a second clamp, and the second clamp is used for clamping a second crystal disc.
Further, the first base is made of marble;
the first YZ-axis motion module comprises:
the second Y-axis movement module is arranged on the first base and is in driving connection with the second Y-axis movable part;
and the third Z-axis mechanism is arranged on the second Y-axis movable part and is in driving connection with a third Z-axis movable part, and the wafer fixing mechanism, the light source and the suction nozzle wiping device are respectively arranged on the third Z-axis movable part.
Furthermore, the power source of the second Y-axis motion module is a first lead screw motor which is in driving connection with a first lead screw, and the first lead screw is in threaded connection with the second Y-axis movable part;
the power source of the third Z-axis mechanism is a second lead screw motor, the second lead screw motor is in driving connection with a second lead screw, and the second lead screw is in threaded connection with the third Z-axis movable part;
the power source of the wafer fixing mechanism is a first pressing cylinder, the first pressing cylinder is connected with a pressing plate in a driving mode, and the moving direction of the pressing plate points to the wafer disc;
the power source of the suction nozzle wiping device is a wiping cylinder which is connected with a wiping device in a driving mode, and the moving path of the wiping device can reach the wiping position of a product.
Further, the second XYZ three-axis linkage mechanism includes:
the third Y-axis motion module is arranged on the first base;
the second X-axis movement module is in driving connection with the third Y-axis movement module and is driven by the third Y-axis movement module to do Y-axis movement;
the fourth Z-axis mechanism is in driving connection with the second X-axis movement module and is driven by the second X-axis movement module to do X-axis movement, the fourth Z-axis mechanism is provided with a fourth Z-axis movable part which moves along a Z-axis guide rail, and the fourth Z-axis movable part is provided with the thimble fixing component;
the thimble fixing assembly comprises a thimble cap mechanism and a thimble fixing part installed on the thimble cap mechanism, the thimble driving mechanism is in driving connection with the thimble fixing part, and a thimble is detachably installed on the thimble fixing part.
Furthermore, the power source of the third Y-axis motion module is a first motor, the first motor is connected with a first cam in a driving manner, the first cam is connected with a first connecting rod, the other end of the first connecting rod is rotatably connected with a third Y-axis movable part, and the first connecting rod is displaced by the rotation of the first cam so as to drive the third Y-axis movable part to move in the Y-axis direction;
the power source of the second X-axis motion module is a first linear cylinder which is in driving connection with the first X-axis movable part;
the power source of the fourth Z-axis mechanism is a second motor, the second motor is in driving connection with a second cam, the second cam is connected with a second connecting rod, the other end of the second connecting rod is rotatably connected with a fifth Z-axis movable part, and the second connecting rod is displaced through the rotation of the second cam so as to drive the fifth Z-axis movable part to move in the Z axial direction;
the power source of the thimble cap mechanism is a first cam motor, the first cam motor is in driving connection with a first telescopic piece, and the first telescopic piece is connected with the thimble driving mechanism;
the power source of the thimble driving mechanism is a second cam motor, the second cam motor is in driving connection with a second telescopic piece, the second telescopic piece is connected with a thimble fixing part, and the thimble fixing part is detachably mounted on the thimble.
Furthermore, the power source of the first theta axis mechanism is a first servo motor, and the first servo motor drives the rotating bracket to rotate;
the first swing arm and the second swing arm have the same structure and are vertically arranged on two sides of the rotating bracket through elastic plates;
a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the first swing arm;
and a limiting structure and an elastic force size adjusting structure are arranged between the rotating bracket and the second swing arm.
Furthermore, the second YZ-axis movement module comprises a fourth Y-axis movement module and a fifth Z-axis movement module which is in driving connection with the fourth Y-axis movement module and is driven by the fourth Y-axis movement module to perform Y-axis movement;
the fourth Y-axis motion module is arranged on the third base, the power source of the fourth Y-axis motion module is a third lead screw motor, the third lead screw motor is in driving connection with a third lead screw, the third lead screw is in threaded connection with a fourth Y-axis movable part, and the fifth Z-axis motion module is arranged on the fourth Y-axis movable part;
the power source of the fifth Z-axis motion module is a fourth screw rod motor, the fourth screw rod motor is in driving connection with a fourth screw rod, the fourth screw rod is in threaded connection with a sixth Z-axis movable part, and the sixth Z-axis movable part is provided with the second theta-axis mechanism;
the power source of the second theta axis mechanism is a second servo motor, the second servo motor is in driving connection with the Bin disc assembly, and the second servo motor drives the Bin disc assembly to rotate;
and the power source of the Bin disc fixing mechanism is a second pressing cylinder which drives a pressing plate to press the Bin disc.
Furthermore, the power source of the third X-axis motion module is a second linear cylinder which is in driving connection with a second X-axis movable part, and the second X-axis movable part is provided with the top film mechanism;
the power source of the film jacking mechanism is a third cam motor, and the third cam motor drives the film jacking part to do telescopic motion.
Compared with the prior art, the invention has the beneficial effects that: the sorting equipment processes the wafer through a feeding mechanism, a swing arm mechanism, a wafer platform mechanism, a Bin disc platform mechanism, a wafer thimble mechanism, a Bin disc top film mechanism and a CCD (charge coupled device) alignment system on a rack, the wafer is subjected to front-end detection to form a Map (the Map is a Meipu), and after the Map is read by the equipment, required crystal grains are picked from the wafer and placed on a Bin disc blue film. Because this equipment is with vertical the placing of wafer dish platform and Bin dish platform and have the grating, the swing arm is rotary motion by two sets of, therefore the platform precision is high, selects separately fastly, satisfies wafer and selects separately precision and efficiency demand. The sorting equipment has the advantages of reasonable design, low manufacturing cost, high precision and high working efficiency.
Drawings
FIG. 1 is a schematic view showing the overall structure of the sorting apparatus of the present invention.
Fig. 2 is a schematic structural diagram of the feeding mechanism of the present invention.
FIG. 3 is a schematic structural diagram of a wafer stage mechanism according to the present invention.
FIG. 4 is a schematic structural diagram of a wafer ejector pin mechanism according to the present invention.
Fig. 5 is a schematic structural view of the swing arm mechanism of the present invention.
Fig. 6 is a schematic structural diagram of a Bin tray platform mechanism of the present invention.
FIG. 7 is a schematic structural diagram of a Bin disk top film mechanism of the present invention.
Fig. 8 is a schematic structural diagram of the CCD alignment system of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and thus the protection scope of the present invention is more clearly and clearly defined. It should be apparent that the described embodiments of the present invention are only some embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The following Bin disks are classified disks.
Example 1: the concrete structure of the invention is as follows:
referring to fig. 1-8, the wafer sorting apparatus of the present invention includes a frame 1, the frame 1 is provided with a feeding station and a sorting station, the sorting apparatus further includes:
the feeding mechanism 2 is arranged at a feeding station, the feeding mechanism 2 is suspended on a frame, and is provided with a first XYZ three-axis linkage mechanism, and a wafer disc clamping mechanism 25 and a Bin disc clamping mechanism 26 which are arranged on the first XYZ three-axis linkage mechanism;
the wafer platform mechanism 3 is provided with a first base (31) arranged on the rack 1 and a first YZ axis movement module arranged on the first base 31, the first YZ axis movement module is connected with a wafer assembly in a driving way, and a wafer fixing mechanism 34, a light source 35 and a suction nozzle wiping device 36 are respectively arranged on the wafer assembly;
the wafer thimble mechanism 4 is arranged on the first base 31, and is provided with a second XYZ three-axis linkage mechanism and a thimble fixing assembly arranged on the second XYZ three-axis linkage mechanism, and a thimble 46 is detachably arranged on the thimble fixing assembly;
the swing arm mechanism 5 is arranged at the sorting station, and is provided with a second base 51, a first theta axis mechanism 52 arranged on the second base 51, and a rotating support which is arranged on the first theta axis mechanism 52 and is driven by the first theta axis mechanism 52 to rotate, wherein a first swing arm 53 and a second swing arm 54 are symmetrically arranged on the rotating support;
the Bin disc platform mechanism 6 is provided with a third base 61 fixed on the frame 1, a second YZ axis movement module arranged on the third base 61, and a second theta axis mechanism 64 in driving connection with the second YZ axis movement module, wherein the second theta axis mechanism 64 is in driving connection with a Bin disc assembly, and a Bin disc fixing mechanism 65 and a light source 66 are arranged on the Bin disc assembly;
the Bin tray film-jacking mechanism 7 is arranged on the third base 61, and the Bin tray film-jacking mechanism 7 is provided with a third X-axis movement module 71 and a film-jacking mechanism 72 which is in driving connection with the third X-axis movement module 71 and is driven by the third X-axis movement module 71 to do X-axis movement;
the CCD alignment system 8 is mounted on the second base 51, the CCD alignment system 8 has a first CCD vision module 81 and a second CCD vision module 82, the first CCD vision module 81 coincides with the centers of the first swing arm 53, the second swing arm 54 and the thimble 46, and the second CCD vision module 82 coincides with the centers of the first swing arm 53 and the second swing arm 54.
A preferred technical solution of this embodiment: the first XYZ three-axis linkage mechanism includes:
a first X-axis motion module 21;
the first Y-axis movement module 22 is in driving connection with the first X-axis movement module 21 and is driven by the first X-axis movement module 21 to do X-axis movement, and the first Y-axis movement module 22 is in driving connection with a first Y-axis movable part;
a first Z-axis mechanism 23 and a second Z-axis mechanism 24 respectively installed at the left and right sides of the first Y-axis movable portion;
the wafer disc clamping mechanism 25 is in driving connection with the first Z-axis mechanism 23;
a Bin disc holding mechanism 26 in driving connection with the second Z-axis mechanism 24;
the first X-axis motion module 21 is arranged on the frame, the power source of the first X-axis motion module is a first synchronous belt motor, and the first synchronous belt motor is connected with the X-axis movable part in a driving way through a synchronous belt component;
the first Y-axis motion module 22 is mounted on the X-axis movable portion, and its power source is a second synchronous belt motor, which is in driving connection with the Y-axis movable portion;
the power source of the first Z-axis mechanism 23 is a third synchronous belt motor, the third synchronous belt motor is connected with a first Z-axis movable part in a driving manner, and the wafer disc clamping mechanism 25 is installed on the first Z-axis movable part;
the power source of the second Z-axis mechanism 24 is a fourth synchronous belt motor, which is drivingly connected with a second Z-axis movable portion, and the second Z-axis movable portion is mounted with the Bin tray clamping mechanism 26.
A preferred technical solution of this embodiment: the power source of the wafer disc clamping mechanism 25 is a first clamping cylinder which is connected with a first clamp in a driving way, and the first clamp is used for clamping a first wafer disc;
the power source of the Bin disc clamping mechanism 25 is a second clamping cylinder, the second clamping cylinder is in driving connection with a second clamp, and the second clamp is used for clamping a second crystal disc.
A preferred technical solution of this embodiment: the first base 31 is made of marble;
the first YZ-axis motion module comprises:
the second Y-axis movement module 32 is mounted on the first base 31, and the second Y-axis movement module 32 is in driving connection with the second Y-axis movable part;
and a third Z-axis mechanism 33 mounted on the second Y-axis movable portion, wherein the third Z-axis mechanism 33 is drivingly connected to a third Z-axis movable portion, and the wafer fixing mechanism 34, the light source 35 and the nozzle wiping device 36 are respectively mounted on the third Z-axis movable portion.
A preferred technical solution of this embodiment: the power source of the second Y-axis motion module 32 is a first lead screw motor, the first lead screw motor is in driving connection with a first lead screw, and the first lead screw is in threaded connection with the second Y-axis movable part;
the power source of the third Z-axis mechanism 33 is a second lead screw motor, the second lead screw motor is in driving connection with a second lead screw, and the second lead screw is in threaded connection with the third Z-axis movable part;
the power source of the wafer fixing mechanism 34 is a first pressing cylinder, the first pressing cylinder is connected with a pressing plate in a driving manner, and the moving direction of the pressing plate points to the wafer disc;
the power source of the nozzle wiping device 36 is a wiping cylinder to which a wiping device is drivingly connected, and the moving path of the wiping device can reach the wiping position of the product.
A preferred technical solution of this embodiment: the second XYZ three-axis linkage mechanism includes:
a third Y-axis motion module 41 mounted on the first base 31;
a second X-axis motion module 42 drivingly connected to the third Y-axis motion module 41 and driven by the third Y-axis motion module 41 to perform Y-axis motion;
a fourth Z-axis mechanism 43 drivingly connected to the second X-axis movement module 42 and driven by the second X-axis movement module 42 to perform an X-axis movement, wherein the fourth Z-axis mechanism 43 has a fourth Z-axis movable portion movable along a Z-axis guide rail, and the fourth Z-axis movable portion mounts the thimble fixing assembly;
the thimble fixing component comprises a thimble cap mechanism 44 and a thimble fixing part 45 installed on the thimble cap mechanism 44, the thimble driving mechanism 45 is connected with a thimble fixing part in a driving manner, and a thimble 46 is detachably installed on the thimble fixing part.
A preferred technical solution of this embodiment: the power source of the third Y-axis motion module 41 is a first motor, the first motor is connected to a first cam in a driving manner, the first cam is connected to a first connecting rod, the other end of the first connecting rod is rotatably connected to a third Y-axis movable portion, and the first connecting rod is displaced by the rotation of the first cam, so as to drive the third Y-axis movable portion to move in the Y-axis direction;
the power source of the second X-axis motion module 42 is a first linear cylinder, and the first linear cylinder is in driving connection with the first X-axis movable part;
the power source of the fourth Z-axis mechanism 43 is a second motor, the second motor is connected to a second cam in a driving manner, the second cam is connected to a second connecting rod, the other end of the second connecting rod is rotatably connected to a fifth Z-axis movable portion, and the second connecting rod is displaced by the rotation of the second cam, so as to drive the fifth Z-axis movable portion to move in the Z-axis direction;
the power source of the thimble cap mechanism 44 is a first cam motor, the first cam motor is in driving connection with a first telescopic piece, and the first telescopic piece is connected with the thimble driving mechanism 45;
the power source of the thimble driving mechanism 45 is a second cam motor, the second cam motor is in driving connection with a second telescopic piece, the second telescopic piece is connected with a thimble fixing part, and the thimble 46 is detachably mounted on the thimble fixing part.
A preferred technical solution of this embodiment: the power source of the first θ -axis mechanism 52 is a first servo motor, and the first servo motor drives the rotating bracket to rotate;
the first swing arm 53 and the second swing arm 54 have the same structure, and are vertically arranged on two sides of the rotating bracket through elastic plates;
a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the first swing arm 53;
a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the second swing arm 54.
A preferred technical solution of this embodiment: the second YZ-axis movement module comprises a fourth Y-axis movement module 62 and a fifth Z-axis movement module 63 which is in driving connection with the fourth Y-axis movement module 62 and is driven by the fourth Y-axis movement module 62 to do Y-axis movement;
the fourth Y-axis movement module 62 is mounted on the third base 61, and the power source thereof is a third lead screw motor, the third lead screw motor is connected with a third lead screw in a driving manner, the third lead screw is connected with a fourth Y-axis movable portion in a threaded manner, and the fifth Z-axis movement module 63 is mounted on the fourth Y-axis movable portion;
the power source of the fifth Z-axis movement module 63 is a fourth screw motor, the fourth screw motor is in driving connection with a fourth screw, the fourth screw is in threaded connection with a sixth Z-axis movable part, and the sixth Z-axis movable part is provided with the second theta-axis mechanism 64;
the power source of the second θ -axis mechanism 64 is a second servo motor, the second servo motor is in driving connection with the Bin disc assembly, and the second servo motor drives the Bin disc assembly to rotate;
the power source of the Bin disk fixing mechanism 65 is a second pressing cylinder, and the second pressing cylinder drives a pressing plate to press the Bin disk.
A preferred technical solution of this embodiment: the power source of the third X-axis motion module 71 is a second linear cylinder, the second linear cylinder is connected with a second X-axis movable part in a driving manner, and the second X-axis movable part is provided with the top film mechanism 72;
the power source of the top film mechanism 72 is a third cam motor, and the third cam motor drives the top film part to do telescopic motion.
Example 2:
the working principle of the wafer sorting equipment is as follows:
during operation, a wafer disc is placed into the wafer fixing mechanism 34 through the feeding mechanism 2, a Bin disc is placed into the Bin disc fixing mechanism 65 through the feeding mechanism 2, the wafer is scanned through the first CCD vision module 81, and the position of a grain needing Bin division is determined; the wafer platform mechanism 3 moves the crystal grain to the position of the first swing arm 53 through the second Y-axis motion module 32 and the third Z-axis mechanism 33; the wafer ejector pin mechanism 4 sends an ejector pin 46 to a position close to a crystal grain through a second X-axis motion module 42, the Bin disc ejector pin mechanism 7 sends an ejector pin mechanism 72 to be tightly attached to a Bin disc blue film through a third X-axis motion module 71, the third Y-axis motion module 41 and a fourth Z-axis mechanism 43 move the ejector pin 46 to the center of the crystal grain, an ejector pin cap mechanism 44 tightly attaches an ejector pin cap to the wafer film through a first cam motor and opens vacuum, the ejector pin driving mechanism 45 ejects the ejector pin 46 through a second cam motor, the ejector pin 46 ejects the crystal grain to a suction nozzle of a first swing arm 53, and the suction nozzle of the first swing arm 53 opens vacuum to adsorb the crystal grain; the first theta axis mechanism 52 of the swing arm mechanism 5 rotates 180 degrees, the film ejection mechanism 72 ejects the Bin blue film and sticks to the crystal grains through the third cam motor, the suction nozzle of the first swing arm 53 breaks vacuum and releases the crystal grains, the film ejection mechanism 72 retracts the Bin blue film through the third cam motor, and the required Bin crystal grains are stuck on the Bin disc; the grains are detected by the second CCD vision module 8. The sorting equipment provided by the invention has the advantages of simple structure, reasonable design, low preparation cost, high precision and high working efficiency.
In summary, in the sorting apparatus of the present invention, the wafer is processed by the feeding mechanism, the swing arm mechanism, the wafer platform mechanism, the Bin tray platform mechanism, the wafer ejector pin mechanism, the Bin tray top film mechanism and the CCD alignment system on the frame, the wafer is subjected to front end detection to form a Map, and after the Map is read by the apparatus, the required dies are picked up from the wafer and placed on the Bin tray blue film. Because this equipment is with vertical the placing of wafer dish platform and Bin dish platform and have the grating, the swing arm is rotary motion by two sets of, therefore the platform precision is high, selects separately fastly, satisfies wafer and selects separately precision and efficiency demand.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. The utility model provides a wafer sorting facilities, includes frame (1), and frame (1) is equipped with the material loading station, selects separately the station, its characterized in that, sorting facilities still includes:
the feeding mechanism (2) is arranged at a feeding station, the feeding mechanism (2) is suspended on a frame and is provided with a first XYZ three-axis linkage mechanism, and a wafer disc clamping mechanism (25) and a Bin disc clamping mechanism (26) which are arranged on the first XYZ three-axis linkage mechanism;
the wafer platform mechanism (3) is provided with a first base (31) arranged on the rack (1) and a first YZ axis motion module arranged on the first base (31), the first YZ axis motion module is in driving connection with a wafer assembly, and a wafer fixing mechanism (34), a light source (35) and a suction nozzle wiping device (36) are respectively arranged on the wafer assembly;
the wafer thimble mechanism (4) is arranged on the first base (31) and is provided with a second XYZ three-axis linkage mechanism and a thimble fixing assembly arranged on the second XYZ three-axis linkage mechanism, and a thimble (46) is detachably arranged on the thimble fixing assembly;
the swing arm mechanism (5) is arranged at the sorting station, and is provided with a second base (51), a first theta shaft mechanism (52) arranged on the second base (51), and a rotating support which is arranged on the first theta shaft mechanism (52) and is driven by the first theta shaft mechanism (52) to rotate, wherein a first swing arm (53) and a second swing arm (54) are symmetrically arranged on the rotating support;
the Bin disc platform mechanism (6) is provided with a third base (61) fixed on the rack (1), a second YZ axis movement module arranged on the third base (61), and a second theta axis mechanism (64) in driving connection with the second YZ axis movement module, wherein the second theta axis mechanism (64) is in driving connection with a Bin disc assembly, and a Bin disc fixing mechanism (65) and a light source (66) are arranged on the Bin disc assembly;
the Bin disc film-jacking mechanism (7) is arranged on the third base (61), and the Bin disc film-jacking mechanism (7) is provided with a third X-axis movement module (71) and a film-jacking mechanism (72) which is in driving connection with the third X-axis movement module (71) and is driven by the third X-axis movement module (71) to do X-axis movement;
the CCD aligning system (8) is installed on the second base (51), the CCD aligning system (8) is provided with a first CCD visual module (81) and a second CCD visual module (82), the first CCD visual module (81) coincides with the centers of the first swing arm (53), the second swing arm (54) and the ejector pin (46), and the second CCD visual module (82) coincides with the centers of the first swing arm (53) and the second swing arm (54).
2. The wafer sorting apparatus as claimed in claim 1, wherein the first XYZ three-axis linkage mechanism comprises:
a first X-axis motion module (21);
the first Y-axis movement module (22) is in driving connection with the first X-axis movement module (21) and is driven by the first X-axis movement module (21) to do X-axis movement, and the first Y-axis movement module (22) is in driving connection with a first Y-axis movable part;
a first Z-axis mechanism (23) and a second Z-axis mechanism (24) which are respectively arranged on the left side and the right side of the first Y-axis movable part;
the wafer disc clamping mechanism (25) is in driving connection with the first Z-axis mechanism (23);
a Bin disc clamping mechanism (26) in driving connection with the second Z-axis mechanism (24);
the first X-axis motion module (21) is arranged on the frame, the power source of the first X-axis motion module is a first synchronous belt motor, and the first synchronous belt motor is connected with the X-axis movable part in a driving mode through a synchronous belt assembly;
the first Y-axis motion module (22) is arranged on the X-axis movable part, and the power source of the first Y-axis motion module is a second synchronous belt motor which is in driving connection with the Y-axis movable part;
the power source of the first Z-axis mechanism (23) is a third synchronous belt motor which is in driving connection with a first Z-axis movable part, and the wafer disc clamping mechanism (25) is installed on the first Z-axis movable part;
and the power source of the second Z-axis mechanism (24) is a fourth synchronous belt motor, the fourth synchronous belt motor is in driving connection with a second Z-axis movable part, and the Bin disc clamping mechanism (26) is installed on the second Z-axis movable part.
3. The wafer sorting apparatus according to claim 1, wherein the power source of the wafer chuck mechanism (25) is a first chuck cylinder to which a first clamp for clamping a first wafer is drivingly connected;
the power source of the Bin disc clamping mechanism (25) is a second clamping cylinder, the second clamping cylinder is in driving connection with a second clamp, and the second clamp is used for clamping a second crystal disc.
4. Wafer sorting device according to claim 1, characterized in that said first seat (31) is a seat of marble material;
the first YZ-axis motion module comprises:
the second Y-axis movement module (32) is mounted on the first base (31), and the second Y-axis movement module (32) is in driving connection with the second Y-axis movable part;
and the third Z-axis mechanism (33) is arranged on the second Y-axis movable part, the third Z-axis mechanism (33) is in driving connection with a third Z-axis movable part, and the wafer fixing mechanism (34), the light source (35) and the suction nozzle wiping device (36) are respectively arranged on the third Z-axis movable part.
5. The wafer sorting apparatus according to claim 4, wherein the power source of the second Y-axis moving module (32) is a first lead screw motor, the first lead screw motor is in driving connection with a first lead screw, and the first lead screw is in threaded connection with the second Y-axis movable part;
the power source of the third Z-axis mechanism (33) is a second lead screw motor, the second lead screw motor is in driving connection with a second lead screw, and the second lead screw is in threaded connection with the third Z-axis movable part;
the power source of the wafer fixing mechanism (34) is a first pressing cylinder, the first pressing cylinder is connected with a pressing plate in a driving mode, and the moving direction of the pressing plate points to the wafer disc;
the power source of the nozzle wiping device (36) is a wiping cylinder which is in driving connection with a wiping device, and the moving path of the wiping device can reach the wiping position of the product.
6. The wafer sorting apparatus as claimed in claim 1, wherein the second XYZ three-axis linkage mechanism comprises:
a third Y-axis motion module (41) mounted on the first base (31);
the second X-axis movement module (42) is in driving connection with the third Y-axis movement module (41) and is driven by the third Y-axis movement module (41) to do Y-axis movement;
a fourth Z-axis mechanism (43) which is in driving connection with the second X-axis movement module (42) and is driven by the second X-axis movement module (42) to do X-axis movement, wherein the fourth Z-axis mechanism (43) is provided with a fourth Z-axis movable part which moves along a Z-axis guide rail, and the fourth Z-axis movable part is provided with the thimble fixing component;
the thimble fixing assembly comprises a thimble cap mechanism (44) and a thimble fixing part (45) mounted on the thimble cap mechanism (44), the thimble driving mechanism (45) is in driving connection with the thimble fixing part, and a thimble (46) is detachably mounted on the thimble fixing part.
7. The wafer sorting device according to claim 6, wherein the power source of the third Y-axis moving module (41) is a first motor, the first motor is connected with a first cam in a driving manner, the first cam is connected with a first connecting rod, the other end of the first connecting rod is rotatably connected with a third Y-axis movable part, and the first connecting rod is displaced through the rotation of the first cam so as to drive the third Y-axis movable part to move in the Y-axis direction;
the power source of the second X-axis motion module (42) is a first linear cylinder which is in driving connection with the first X-axis movable part;
the power source of the fourth Z-axis mechanism (43) is a second motor, the second motor is in driving connection with a second cam, the second cam is connected with a second connecting rod, the other end of the second connecting rod is rotatably connected with a fifth Z-axis movable part, and the second connecting rod is displaced through the rotation of the second cam so as to drive the fifth Z-axis movable part to move in the Z axial direction;
the power source of the thimble cap mechanism (44) is a first cam motor which is in driving connection with a first telescopic piece, and the first telescopic piece is connected with the thimble driving mechanism (45);
the power source of the thimble driving mechanism (45) is a second cam motor, the second cam motor is in driving connection with a second telescopic piece, the second telescopic piece is connected with a thimble fixing part, and the thimble (46) is detachably mounted on the thimble fixing part.
8. The wafer sorting apparatus according to claim 1, wherein a power source of the first θ -axis mechanism (52) is a first servo motor that drives the rotary support to make a rotary motion;
the first swing arm (53) and the second swing arm (54) have the same structure and are vertically arranged at two sides of the rotating bracket through elastic plates;
a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the first swing arm (53);
a limiting structure and an elastic force adjusting structure are arranged between the rotating bracket and the second swing arm (54).
9. The wafer sorting apparatus according to claim 1, wherein the second YZ-axis motion module comprises a fourth Y-axis motion module (62), a fifth Z-axis motion module (63) drivingly connected to the fourth Y-axis motion module (62) and driven by the fourth Y-axis motion module (62) to move in a Y-axis direction;
the fourth Y-axis movement module (62) is arranged on the third base (61), the power source of the fourth Y-axis movement module is a third screw motor, the third screw motor is connected with a third screw in a driving mode, the third screw is connected with a fourth Y-axis movable part in a threaded mode, and the fifth Z-axis movement module (63) is arranged on the fourth Y-axis movable part;
the power source of the fifth Z-axis movement module (63) is a fourth screw motor which is in driving connection with a fourth screw, the fourth screw is in threaded connection with a sixth Z-axis movable part, and the sixth Z-axis movable part is provided with the second theta-axis mechanism (64);
the power source of the second theta axis mechanism (64) is a second servo motor, the second servo motor is in driving connection with the Bin disc assembly, and the second servo motor drives the Bin disc assembly to rotate;
the power source of the Bin disc fixing mechanism (65) is a second pressing cylinder, and the second pressing cylinder drives a pressing plate to press the Bin disc.
10. The wafer sorting apparatus according to claim 1, wherein the power source of the third X-axis motion module (71) is a second linear cylinder drivingly connected to a second X-axis movable portion, the second X-axis movable portion mounting the top film mechanism (72);
the power source of the film jacking mechanism (72) is a third cam motor, and the third cam motor drives the film jacking part to do telescopic motion.
CN202210269844.0A 2022-03-18 2022-03-18 Wafer sorting equipment Pending CN114535139A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210269844.0A CN114535139A (en) 2022-03-18 2022-03-18 Wafer sorting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210269844.0A CN114535139A (en) 2022-03-18 2022-03-18 Wafer sorting equipment

Publications (1)

Publication Number Publication Date
CN114535139A true CN114535139A (en) 2022-05-27

Family

ID=81664228

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210269844.0A Pending CN114535139A (en) 2022-03-18 2022-03-18 Wafer sorting equipment

Country Status (1)

Country Link
CN (1) CN114535139A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116060324A (en) * 2023-01-12 2023-05-05 苏州有道芯量智能科技有限公司 On-line inspection machine for MiniLED backlight display screen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116060324A (en) * 2023-01-12 2023-05-05 苏州有道芯量智能科技有限公司 On-line inspection machine for MiniLED backlight display screen

Similar Documents

Publication Publication Date Title
CN113794083A (en) Automatic pin inserting equipment for carrier
CN112007868A (en) Chip capacitor detection equipment
CN106060531B (en) A kind of full-automatic four stations Camera Test machine
CN110224052B (en) Double-swing-arm die bonding device for LED die bonding and die bonding method thereof
CN215880376U (en) Novel laser cutting equipment
US6579057B2 (en) Conveyor apparatus for dies and small components
CN219094012U (en) Automatic stealthy cutting equipment of wafer
CN213034041U (en) Automatic assembly production line of product
CN114535139A (en) Wafer sorting equipment
CN113990787A (en) Chip detection equipment for chip processing production
CN216085670U (en) Automatic pin inserting equipment for carrier
CN115254644A (en) Four-side detection equipment and method for DFB chip
CN217043543U (en) Wafer sorting equipment
CN219216697U (en) Mounting equipment
CN109894375B (en) Connecting and direction-changing mechanism among multiple conveying discs of automatic detection and screening system
CN115083963B (en) Chip sorting machine
CN115274483B (en) Wafer electrical property detection equipment
CN114335253B (en) Silicon wafer picking and placing device and method
CN215247638U (en) Automatic conveying device for wafer boxes
CN114927451A (en) Wafer transportation manipulator for semiconductor equipment
CN210778672U (en) Horizontal rotation double-swing-arm die bonder
CN219553440U (en) Capacitor processing assembly line
CN219403674U (en) Large lens core taking equipment
CN114088992B (en) Resistor substrate center positioning clamping device and resistor measuring instrument comprising same
CN116810381B (en) Integrated lens assembling machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination