CN115274483B - Wafer electrical property detection equipment - Google Patents
Wafer electrical property detection equipment Download PDFInfo
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- CN115274483B CN115274483B CN202210929255.0A CN202210929255A CN115274483B CN 115274483 B CN115274483 B CN 115274483B CN 202210929255 A CN202210929255 A CN 202210929255A CN 115274483 B CN115274483 B CN 115274483B
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- 238000001514 detection method Methods 0.000 title claims abstract description 105
- 238000012546 transfer Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 72
- 238000003708 edge detection Methods 0.000 claims description 28
- 230000007306 turnover Effects 0.000 claims description 24
- 238000007689 inspection Methods 0.000 claims description 22
- 230000007246 mechanism Effects 0.000 claims description 21
- 238000003384 imaging method Methods 0.000 claims description 9
- 230000033001 locomotion Effects 0.000 claims description 8
- 239000000523 sample Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 17
- 230000008569 process Effects 0.000 abstract description 17
- 238000012360 testing method Methods 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 abstract description 2
- 238000012216 screening Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 118
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000007599 discharging Methods 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the technical field of wafer detection, especially, disclose a wafer electrical property check out test set, be in including mounting platform, setting storage station and the detection station on the mounting platform, still be equipped with on the mounting platform and move the device that moves, move the device to await measuring the wafer follow storage station transport extremely the detection station to after the detection is accomplished transport back storage station. The wafer transfer device realizes the back and forth transfer of the wafer between the storage station and the detection station, the detection station automatically detects the electrical performance parameters of the wafer, and finally, the processes of automatic loading and unloading, alignment, detection, marking and the like of the wafer are realized, the detection is fast and efficient, the screening of defective products is convenient, and the detection result is accurate.
Description
Technical Field
The application relates to the technical field of wafer detection, in particular to wafer electrical property detection equipment.
Background
With the increasing popularity of integrated circuit applications, the demand of wafers as basic materials for manufacturing semiconductor devices in the market is rapidly rising, and the development of wafer manufacturing industry is synchronously promoted.
In the process of manufacturing and packaging the wafer, the electrical performance parameters of the wafer need to be detected to ensure the quality of the wafer. In the traditional detection mode, after manual feeding, detection personnel manually calibrate, select the point, detect, finally manually retrieve to the inside of wafer basket of flowers, carry out the circulation of next process.
The mode has long detection period and high labor intensity, and the wafer is very easy to scratch and pollute in the manual feeding and discharging process due to the fact that the wafer is thinner, so that the quality of the wafer is reduced, the accuracy of a detection result is influenced, and the qualification rate of products is finally influenced.
Disclosure of Invention
In order to solve the technical problem, the technical scheme of the application provides wafer electrical property detection equipment. The technical proposal is as follows:
the application provides a wafer electrical property check out test set, be in including mounting platform, setting storage station and the detection station on the mounting platform, still be equipped with on the mounting platform and move and carry the device, move and carry the wafer that awaits measuring follow storage station transport extremely the detection station to after the detection is accomplished transport back storage station.
Further, the storage station comprises a flower basket, a base frame and a turnover part, wherein a material taking opening is formed in one side of the flower basket, the base frame is vertically and slidably arranged on the mounting platform, the flower basket is movably arranged on the base frame, and the turnover part is connected between the flower basket and the base frame so as to drive the flower basket to turn over along the direction deviating from the material taking opening.
Specifically, the detection station includes counterpoint platform, is configured detection platform, circular telegram detection portion and the counterpoint imaging unit of vacuum adsorption wafer, the counterpoint platform sets up on the mounting platform and can horizontal migration, the detection platform liftable ground sets up on the counterpoint platform and can follow vertical rotation, circular telegram detection portion set up in the detection platform top, be equipped with the dotter on the circular telegram detection portion, circular telegram detection portion includes the probe chuck that has the syringe needle, the counterpoint imaging unit including connect in circular telegram detection portion counterpoint camera one, connect in counterpoint camera two of counterpoint platform, counterpoint camera one with counterpoint camera two all realize 90 to get the image through the speculum, counterpoint camera one gathers the positional information of examining the wafer, counterpoint camera two gathers the positional information of syringe needle and dotter, external industrial control equipment integration compares the information of gathering, establishes complete space coordinate system and generates the route planning when the wafer detects.
Particularly, the turnover part comprises a sliding unit, a linear driving piece and a linkage plate fixedly connected with the flower basket, a guide groove is formed in the linkage plate, the end part of the guide groove gradually rises along the direction deviating from the material taking opening, the sliding unit is slidably inserted into the guide groove, and the linear driving piece is hinged between the sliding unit and the base frame.
Further, the turnover part further comprises a positioning piece, wherein the positioning piece is a micro switch arranged on the base frame, and the micro switch is electrically connected with the linear driving piece.
Specifically, still include fixed connection in the roll-over stand of linkage board, the bed frame keep away from one side of linkage board with the roll-over stand is articulated, the roll-over stand with the bed frame sets up relatively and forms the confined space in order to hold and carry the thing dish, it is the level setting to carry the thing dish, the roll-over stand pass through the holder with the basket of flowers can dismantle and be connected.
Particularly, the transfer device comprises a rotating frame, a first material taking arm and a second material taking arm which are horizontally connected with the rotating frame in a sliding mode, wherein the first material taking arm and the second material taking arm are in two states of extending and retracting, the rotating frame is arranged on the mounting platform and can rotate vertically, projections of the first material taking arm and the second material taking arm in the sliding direction are collinear in the vertical direction, and the vertical distance between the second material taking arm and the first material taking arm is larger than the thickness of one wafer.
Further, the transfer device further comprises a control module, and an edge detection sensor and an angle adjusting mechanism, wherein the edge detection sensor and the angle adjusting mechanism are connected with the control module, the edge detection sensor is arranged on the rotating frame, when the first material taking arm is in a retraction state, the edge detection sensor senses the notch position of the first wafer on the first material taking arm, and when the edge detection sensor does not detect the notch, the edge detection sensor starts the angle adjusting mechanism through the controller, and the angle adjusting mechanism drives the wafer to vertically rotate.
Specifically, the edge detection sensor comprises an upper laser emitter and a lower laser receiver which are arranged on the rotating frame, and light transmission openings are formed in detection positions of the first material taking arm and the second material taking arm relative to the edge detection sensor; the angle adjusting mechanism comprises an adjusting motor, a rotating sucker and a first lifting cylinder, wherein the adjusting motor and the rotating sucker are coaxially connected, the first lifting cylinder is vertically connected to the rotating frame, and the piston end of the first lifting cylinder is fixedly connected with the fixed end of the adjusting motor through a bearing plate.
The machine box comprises a storage station, a detection station and a transfer device, and is characterized by further comprising a machine box, wherein the storage station, the detection station and the transfer device are all sealed in the machine box.
Compared with the prior art, the application has the beneficial effects that: on the storage station, the turnover part drives the basket to turn back and forth through the turnover frame linkage, and when the material is not taken, the basket and the wafer are kept inclined, and when the material is taken, the basket is vertically arranged. And the sliding motor drives the first material taking arm and the second material taking arm to move, the first material taking arm stretches out to take down the wafer to be detected from the storage station, the rotary sucker ascends to adsorb the wafer, then the wafer is driven to rotate, and when the edge detection sensor detects the notch, the rotary sucker stops rotating and descends to reset. The rotating frame rotates, and the material taking arm leaves after transferring the wafer to the detection station.
When a wafer is at a detection station, the detection platform adsorbs the wafer in vacuum, the alignment platform moves to the lower part of an alignment camera I through the X-direction linear slide rail and the Y-direction linear slide rail, the alignment camera I grabs the mark position information of the detection wafer, and a wafer MAP is generated. And the alignment platform is linked with the alignment camera II and moves to the lower parts of the probe chuck and the dotter respectively, the needle head position and the dotter position are grabbed, and the alignment platform is combined with the position coordinates of the wafer to perform comparison, so that a complete position coordinate system is generated. And the alignment platform moves to a detection position according to the generated wafer MAP. The linear motor drives the detection platform to ascend, so that a chip Pin (PAD) on the wafer is contacted with the needle head, the tester connected with the chuck measures parameters such as the electrical property of each chip, and the industrial personal computer generates a detection result graph of all chips on the wafer according to the detection result. Then, the detection platform moves to the lower part of the dotter, and the dotter marks bad chips on the wafer.
After the detection is finished, the second material taking arm stretches out to take off the detected wafer from the detection station, then the rotating frame rotates, and the second material taking arm conveys the wafer to the detection station and leaves. The process is circularly reciprocated, the wafer realizes automatic feeding, detection and receiving, and is suitable for wafers with different specifications, and the universality is high. Meanwhile, automatic calibration, point selection and parameter test are performed in the detection process, the detection speed is high, the detection efficiency is high, and the surface quality of the wafer is effectively guaranteed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application, wherein:
FIG. 1 is a schematic view of a mounting platform and a plurality of stations of the present application;
FIG. 2 is a schematic overall structure of the present application;
FIG. 3 is a schematic view of the storage station of the present application;
FIG. 4 is a schematic view showing the structure of the turnover part in the present application;
fig. 5 is a schematic structural view of the transfer device of the present application;
FIG. 6 is a schematic view showing the structure of a rotary driving part in the present application;
FIG. 7 is a schematic view of a structure embodying an angle adjustment mechanism of the present application;
FIG. 8 is a schematic view of the inspection station of the present application;
FIG. 9 is a schematic structural diagram of a detection platform embodying the present application;
fig. 10 is a schematic structural view showing a lifting mechanism in the present application.
Reference numerals: 1. a mounting platform; 2. a storage station; 201. flower basket; 202. a base frame; 2021. a track; 203. a roll-over stand; 204. a sliding unit; 2041. a slide block; 2042. a pulley; 205. a linear driving member; 2051. an adapter plate; 206. a linkage plate; 2061. a guide groove; 207. a micro-switch; 209. a carrying tray; 2091. a connecting plate; 3. detecting a station; 301. an alignment platform; 3011. a movable seat; 3012. an X-direction linear slide rail; 3013. y-direction linear slide rail; 3014. a linear motor; 3015. a rotary motor; 3016. an origin limit sensor; 302. a detection platform; 3021. a support post; 303. an energization detecting unit; 3031. a chuck fixing plate; 3032. a probe chuck; 3033. a needle; 304. a lifting mechanism; 3041. a second lifting cylinder; 3042. a cylinder block; 305. a dotter; 3051. a mounting base; 306. a guide bar; 307. aligning a first camera; 308. aligning a second camera; 309. a support; 4. a transfer device; 401. a rotating frame; 402. a first material taking arm; 403. a second material taking arm; 404. a base; 405. a rotation driving part; 4051. a driven coil; 4052. a driving wheel; 4053. a transmission belt; 4054. a rotating electric machine; 406. a slip assembly; 4061. a synchronous belt; 4062. a rotating wheel, 4063, a slipping motor; 4064. a synchronizing member; 407. an edge detection sensor; 4071. an upper laser emitter; 4072. a lower laser receiver; 408. an angle adjusting mechanism; 4081. adjusting a motor; 4082. rotating the sucker; 4083. a first lifting cylinder; 4084. a carrying plate; 4085. a linkage shaft; 4086. a fixed block; 4087. a guide rod; 4088. a top plate; 4089. a spline; 409. a detection disc; 4091. connecting sleeves; 4092. an induction member; 5. a chassis; 51. an alarm; 52. a display screen; 6. and (3) a wafer.
Detailed Description
The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed.
With the increasing popularity of integrated circuit applications, the demand of wafers as basic materials for manufacturing semiconductor devices in the market is rapidly rising, and the development of wafer manufacturing industry is synchronously promoted.
In the process of manufacturing and packaging the wafer, the electrical performance parameters of the wafer need to be detected to ensure the quality of the wafer. In the traditional detection mode, after manual feeding, detection personnel manually calibrate, select the point, detect, finally manually retrieve to the inside of wafer basket of flowers, carry out the circulation of next process.
The mode has long detection period and high labor intensity, and the wafer is very easy to scratch and pollute in the manual feeding and discharging process due to the fact that the wafer is thinner, so that the quality of the wafer is reduced, the accuracy of a detection result is influenced, and the qualification rate of products is finally influenced.
In order to solve the technical problem, the technical scheme of the application provides wafer electrical property detection equipment. The technical proposal is as follows:
the present application is described in further detail below with reference to fig. 1-10.
As shown in fig. 1, the application provides wafer electrical property detection equipment, including the mounting platform 1 of level setting, be equipped with storage station 2, detection station 3 and move and carry device 4 on the mounting platform 1, move and carry device 4 to be located between storage station 2 and the detection station 3. In operation, the transfer device 4 transfers the wafer 6 to be tested from the storage station 2 to the inspection station 3, and returns to the storage station 2 after the inspection is completed.
As shown in fig. 1 and 2, in order to reduce the possibility of contamination of the wafer 6 during the inspection, the wafer electrical performance inspection apparatus further includes a housing 5, where the storage station 2, the inspection station 3, and the transfer device 4 are all hermetically contained in the housing 5. In addition, the case 5 is further provided with an alarm 51 and a display screen 52, the display screen 52 intuitively displays detection information of the wafer 6 detected by the detection station 3, and when abnormality occurs in the detection equipment, the alarm 51 alarms.
As shown in fig. 1 and 3, the storage station 2 includes a basket 201, a base frame 202, a roll-over stand 203, and a roll-over part, one side of the basket 201 has a material taking opening, a plurality of horizontally arranged wafers 6 are placed in the basket 201, and the plurality of wafers 6 are vertically stacked at equal intervals. The base frame 202 is vertically slidably disposed on the mounting platform 1 by being engaged with a linear guide and a cylinder.
Referring to fig. 3, the roll-over stand 203 and the base frame 202 are sequentially disposed below the basket 201 from top to bottom, the roll-over stand 203 is connected with the basket 201, the bottom of the roll-over stand 203 is hinged with the base frame 202, and a hinge point of the base frame 202 and the roll-over stand 203 is located at one side of the base frame 202 away from the material taking opening. The turnover part is connected between the turnover frame 203 and the base frame 202 to drive the basket 201 to turn in a direction away from the material taking opening.
During actual use, the turnover part drives the turnover frame 203 to horizontally turn, the turnover frame 203 is linked with the basket 201 to turn, the material taking opening moves upwards in the turnover process, and the basket 201 and the wafer 6 are obliquely arranged, so that the possibility that the wafer 6 falls from the basket 201 is avoided, and the stability of the wafer 6 is ensured. When the material is required to be taken and placed, the overturning frame 203 is linked with the basket 201 to reset, and at the moment, the basket 201 is vertically arranged.
As shown in fig. 3 and 4, the flipping section includes a sliding unit 204, a linear driving member 205, and a link plate 206, and the link plate 206 is vertically disposed and fixedly connected to the bottom of the flipping frame 203. When the basket 201 is vertically disposed, the lower surface of the linkage plate 206 and the base frame 202 remain in abutment. The linkage plate 206 is provided with a guide groove 2061, the guide groove 2061 is a waist-shaped groove, and the position of the end part of the guide groove 2061 gradually rises along the direction deviating from the material taking opening.
As shown in fig. 4, the sliding unit 204 includes a sliding block 2041 and a pulley 2042, a horizontally arranged track 2021 is fixedly connected to the inner wall of the base frame 202, and the sliding block 2041 is slidably sleeved on the track 2021. The pulley 2042 is rotatably coupled to a side wall of the slider 2041, and the slider 2041 is located in the guide groove 2061. In this embodiment, the linear driving member 205 is a driving cylinder, one end of the driving cylinder is hinged to the slider 2041, and the other end of the driving cylinder is hinged to the adaptor plate 2051, and the adaptor plate 2051 is fixedly connected to the side wall of the base frame 202.
When the driving cylinder performs telescopic movement, the driving sliding block 2041 slides, the sliding block 2041 is linked with the pulley 2042, the position of the pulley 2042 in the guide groove 2061 is changed, at this time, the linkage plate 206 and the pulley 2042 perform relative movement, and the linkage plate 206 drives the turnover frame 203 to perform turnover movement, so that the turnover of the basket 201 is realized.
As shown in fig. 4, the turning portion further includes a positioning member, where the positioning member monitors the position of the linkage plate 206, so as to avoid the situation that the linkage plate 206 is overturned excessively and the linkage plate 206 is not reset in place after being overturned. The positioning member includes a micro switch 207 disposed on the base frame 202, the micro switch 207 being electrically connected to the linear drive member 205.
As shown in fig. 3, in order to facilitate loading of a specific single wafer 6, the storage station 2 further includes a carrying tray 209 and a connection plate 2091, where the carrying tray 209 is provided with a receiving slot for receiving the single wafer 6. The roll-over stand 203 and the base frame 202 are disposed opposite to each other to form a defined space, the tray 209 and the connection plate 2091 are disposed horizontally in the defined space, and the connection plate 2091 is located directly under the tray 209. Wherein, carry thing dish 209 to slide through linear guide and connect in connecting plate 2091, carry thing dish 209's slip direction level to set up and directional reclaimer opening, through above-mentioned structure, the horizontal position of nimble adjustment year thing dish 209 has improved the commonality.
As shown in fig. 5 and 6, the transfer device 4 includes a rotating frame 401, a first material taking arm 402 and a second material taking arm 403 which are horizontally slidably connected to the rotating frame 401. The mounting platform 1 is horizontally provided with a base 404, the rotating frame 401 is vertically and rotatably arranged on the base 404, and the base 404 is also provided with a rotary driving part 405 in transmission connection with the rotating frame 401.
The first material taking arm 402 takes down the wafer 6 to be detected from the storage station 2 and then transfers the wafer 6 to the detection station 3, the second material taking arm 403 stretches out to transfer the detected wafer 6 from the detection station 3 to the storage station 2, and the wafer 6 realizes automatic feeding, transferring and receiving, is applicable to wafers 6 with different specifications, and has high universality.
As shown in fig. 6, the rotation driving part 405 includes a driven ring 4051, a driving wheel 4052 and a driving belt 4053, the bottom of the rotating frame 401 is penetrated by the base 404, and the driven ring 4051 is fixedly sleeved on the bottom of the rotating frame 401. The driving wheel 4052 is rotatably connected to the lower surface of the base 404, and the driving belt 4053 is wound around the driven ring 4051 and the driving wheel 4052. The base 404 is also connected with a rotating motor 4054, and an output shaft of the rotating motor 4054 penetrates through the base 404 and is in transmission connection with the driving wheel 4052.
As shown in fig. 4, the first material taking arm 402 and the second material taking arm 403 are respectively connected with the rotating frame 401 in a horizontal sliding manner through the sliding component 406, and the second material taking arm 403 is located above the first material taking arm 402, and the vertical distance between the first material taking arm and the second material taking arm is greater than the thickness of one wafer 6. In the vertical direction, projections of the slip directions of the first and second take-out arms 402 and 403 are collinear, and the first and second take-out arms 402 and 403 each have two states of extension and retraction.
Referring to fig. 4, a description will be given below of an example of a sliding assembly 406 connected to the first material taking arm 402, where the sliding assembly 406 includes a timing belt 4061, a rotating wheel 4062, and a sliding motor 4063, and the rotating wheel 4062 is rotatably connected to the rotating frame 401 and is provided with two sliding members along the sliding direction of the first material taking arm 402. The sliding motor 4063 is disposed on the rotating frame 401, and an output end of the sliding motor 4063 is coaxially connected to one rotating wheel 4062. The timing belt 4061 is wound around the rotating wheel 4062, and a synchronizing member 4064 for connecting with the first material taking arm 402 is connected to the timing belt 4061.
As shown in fig. 5, the sliding motor 4063 is linked with the first material taking arm 402 through the rotating wheel 4062 and the synchronous belt 4061, the first material taking arm 402 slides, and in order to improve the stability of the first material taking arm 402 in the moving process, the first material taking arm 402 is slidingly connected with the rotating frame 401 through a linear guide rail.
As shown in fig. 5 and 7, in order to ensure that the relative positions of each wafer 6 transferred to the inspection station 3 are the same, the transfer device 4 positions the wafer 6, and the transfer device 4 further includes a control module, and an edge detection sensor 407 and an angle adjustment mechanism 408 both connected to the control module, where the edge detection sensor 407 and the angle adjustment mechanism 408 are located on the movement path of the first material taking arm 402. In the retracted state, the imaging positions of the first and second take-out arms 402 and 403 with respect to the edge detection sensor 407 are each provided with a light-transmitting opening.
As shown in fig. 5 and fig. 7, when the first pick-up arm 402 takes down the wafer 6 to be inspected and is in a retracted state, the edge detection sensor 407 scans the edge of the wafer 6 to image, and if the edge detection sensor 407 detects a notch on the edge of the wafer 6, the control module starts the rotation transmission part to transfer the wafer 6. If the edge detection sensor 407 does not detect the notch of the wafer 6, the control module starts the angle adjustment mechanism 408, and the angle adjustment mechanism 408 drives the wafer 6 to rotate vertically until the edge detection sensor 407 scans the notch of the wafer 6.
Referring to fig. 5, the edge detection sensor 407 includes an upper laser emitter 4071 and a lower laser receiver 4072, and the upper laser emitter 4071 and the lower laser receiver 4072 are sequentially disposed on the rotating frame 401 from top to bottom. The first and second take-off arms 402 and 403 are each located between the upper laser transmitter 4071 and the lower laser receiver 4072.
As shown in fig. 7, the angle adjusting mechanism 408 includes an adjusting motor 4081, a rotating suction cup 4082 and a first lifting cylinder 4083, wherein a fixed end of the first lifting cylinder 4083 is fixedly connected with the rotating frame 401 through a fixed block 4086, and a piston end of the first lifting cylinder 4083 is connected with a bearing plate 4084 which is horizontally arranged. The adjusting motor 4081 is vertically arranged and located below the bearing plate 4084, and the fixed end of the adjusting motor 4081 is fixedly connected with the bearing plate 4084. The power output end of the adjusting motor 4081 is coaxially connected with a linkage shaft 4085 penetrating through the bearing plate 4084, and the top end of the linkage shaft 4085 is coaxially connected with the rotary sucker 4082.
The piston end of the first lifting cylinder 4083 moves, synchronous lifting of the adjusting motor 4081 and the rotating sucker 4082 is achieved through the bearing plate 4084, the power output end of the adjusting motor 4081 runs, the rotating sucker 4082 is driven to rotate through the linkage shaft 4085, vertical lifting and rotation of the rotating sucker 4082 are achieved, and the rotating sucker 4082 drives the wafer 6 to rotate.
As shown in fig. 7, a guide rod 4087 arranged vertically is connected to the fixed block 4086, a top plate 4088 is connected to the top end of the guide rod 4087, and the top plate 4088 is fixedly connected to the rotating frame 401. The guide rod 4087 is sleeved with a spline 4089 in a sliding manner, the spline 4089 is fixedly embedded in the bearing plate 4084, and guiding is provided for vertical movement of the bearing plate 4084 and the adjusting motor 4081, so that stability of the rotary sucker 4082 in the lifting process is improved.
As shown in fig. 7, the coupling shaft 4085 is provided with a sensing element 4092 through a connecting sleeve 4091, and the connecting sleeve 4091 is fixedly connected to the upper surface of the carrier 4084. The linkage shaft 4085 is fixedly sleeved with a detection disc 409, the detection disc 409 is provided with a detection through groove, and the detection disc 409 is positioned in the induction range of the induction piece 4092.
In actual use, the detecting disc 409 rotates along with the rotating chuck 4082 through the linkage shaft 4085, the sensing element 4092 senses the detecting disc 409 in real time, and when the sensing element 4092 senses the detecting through groove again, the wafer 6 has completed at least 360 ° of rotation. If the edge detection sensor 407 does not detect the notch of the wafer 6, it indicates that the wafer 6 has a problem, and the industrial personal computer alarms.
As shown in fig. 8, the inspection station 3 includes an alignment stage 301, an inspection stage 302, an energization inspection unit 303, and an alignment imaging unit, and the alignment stage 301 is horizontally disposed and moves on a horizontal plane. The inspection platform 302 is liftably provided on the alignment platform 301, and is capable of rotating vertically, and the inspection platform 302 is disposed on the vacuum suction wafer 6.
As shown in fig. 8, a horizontal moving seat 3011 is disposed below the alignment platform 301, and the alignment platform 301 is slidably connected to the moving seat 3011 by two side-by-side X-direction linear slide rails 3012. The moving seat 3011 is located above the mounting platform 1, and the moving seat 3011 is slidably connected to the mounting platform 1 by two side-by-side Y-direction linear slide rails 3013. The X-direction linear slide 3012 and the Y-direction linear slide 3013 are both horizontally disposed and perpendicular to each other.
As shown in fig. 9, since the wafer 6 is placed on the inspection platform 302 by an external manipulator, in order to facilitate taking and placing of the wafer 6, the inspection platform 302 is a vacuum chuck, and three supports 3021 are centrally and symmetrically arranged on the inspection platform 302.
The wafer 6 is placed on the support 3021 by the manipulator, the inspection platform 302 applies an adsorption force to the wafer 6, so that the wafer 6 is stably adsorbed on the support 3021, and the wafer 6 can be removed by removing the adsorption force. The support post 3021 is a space between the bottom of the wafer 6 and the detection platform 302, so that the wafer 6 can be conveniently taken and placed by a manipulator, and the possibility that the wafer 6 is damaged in the taking and placing process is avoided.
As shown in fig. 9, in order to realize the lifting and autorotation functions of the detection platform 302, a vertically arranged linear motor 3014 is connected to the lower surface of the alignment platform 301, a power output end of the linear motor 3014 penetrates through the alignment platform 301 and is connected with a rotary motor 3015, and a power shaft of the rotary motor 3015 is vertically arranged and is coaxially connected with the bottom of the detection platform 302. Preferably, the rotary motor 3015 is a DD motor, and an origin limit sensor 3016 disposed corresponding to the DD motor is connected to the alignment stage 301 to monitor the rotation of the alignment stage 301.
As shown in fig. 8 and 9, the energization detecting portion 303 is provided above the detecting platform 302, and the energization detecting portion 303 includes a chuck fixing plate 3031 and a probe chuck 3032, the chuck fixing plate 3031 being horizontally provided and provided on the housing 5. The sidewall of the chuck fixing plate 3031 is connected with a dotter 305 through a lifting mechanism 304, the dotting direction of the dotter 305 is downward, and the dotter 305 is electrically connected with external industrial control equipment. The probe chuck 3032 is horizontally embedded in the chuck fixing plate 3031 and connected to an external tester. The probe chuck 3032 has a needle 3033 at a center position, and the bottom end of the needle 3033 is electrically contacted with the chip pins on the wafer 6 during detection.
As shown in fig. 10, the elevating mechanism 304 includes a second elevating cylinder 3041 and a cylinder block 3042, the cylinder block 3042 being fixedly connected to the chuck plate 3031, the second elevating cylinder 3041 being vertically disposed on the cylinder block 3042. The piston end of the second lifting cylinder 3041 is fixedly connected with the dotter 305 through a mounting seat 3051, and in order to improve stability in the motion process of the dotter 305, a guide bar 306 is vertically connected to the fixed end of the second lifting cylinder 3041, and the mounting seat 3051 is slidably sleeved on the guide bar 306.
As shown in fig. 8, the alignment imaging unit is configured to be connected to an external industrial control device, where the alignment imaging unit includes a first alignment camera 307 and a second alignment camera 308, and the first alignment camera 307 and the second alignment camera 308 achieve image capturing through a mirror.
The first alignment camera 307 collects the position information of the wafer 6 to be detected, the second alignment camera 308 collects the position information of the needle 3033 and the dotter 305, and the external industrial control equipment integrates the collected information, establishes a complete space coordinate system and generates a path plan when the wafer 6 is detected. The alignment platform 301 moves the detection position according to the path planning, the detection platform 302 rises until the chip pins on the wafer 6 are contacted with the needle 3033, and the tester measures parameters such as the electrical property of each chip. Finally, the detection platform 302 moves to the lower part of the dotter 305, the dotter 305 performs dotting marking on bad chips on the wafer 6 according to a detection result diagram of the wafer 6, the process realizes automatic alignment, detection and marking of the wafer 6 to be detected, the detection is fast and efficient, the screening of defective products is convenient, and the detection result is accurate.
As shown in fig. 8 and 9, in order to reduce the space required for mounting the imaging unit while satisfying the use requirements, the alignment camera 307 is fixedly connected to the chuck fixing plate 3031 and is horizontally disposed, with the lens of the alignment camera 307 facing directly below. The second alignment camera 308 is horizontally mounted on the alignment platform 301 through the support 309, and the lens of the second alignment camera 308 is disposed right above.
The implementation principle of the application is as follows: on the storage station 2, the turnover part drives the basket 201 to turn back and forth through the turnover frame 203 in a linkage mode, when the basket 201 and the wafer 6 are not taken for discharging, the basket 201 is arranged in a vertical mode when the basket is taken for discharging.
The sliding motor 4063 drives the first material taking arm 402 and the second material taking arm 403 to move, the first material taking arm 402 stretches out to take the wafer 6 to be detected off the storage station 2, the rotary sucker 4082 rises to adsorb the wafer 6, then the wafer 6 is driven to rotate, and when the edge detection sensor 407 detects a gap, the rotary sucker 4082 stops rotating and descends to reset. The rotating frame 401 rotates, and the first material taking arm 402 conveys the wafer 6 to the detecting station 3 and then leaves.
When the wafer 6 is detected at the station 3, the detecting platform 302 vacuum adsorbs the wafer 6, the alignment platform 301 moves to the lower part of the alignment camera one 307 through the X-direction linear slide rail 3012 and the Y-direction linear slide rail 3013, the alignment camera one 307 grabs the position information of the detected wafer 6mark, and the wafer 6MAP is generated. The alignment platform 301 is linked with the second alignment camera 308, and moves below the probe chuck 3032 and the dotter 305 respectively, and grabs the position of the needle 3033 and the position of the dotter 305, and performs comparison by combining the position coordinates of the wafer 6 to generate a complete position coordinate system. The alignment stage 301 moves to the inspection position according to the generated wafer 6MAP. The linear motor 3014 drives the detection platform 302 to ascend, so that a chip Pin (PAD) on the wafer 6 is contacted with the needle 3033, a tester connected with the chuck measures parameters such as the electrical property of each chip, and the industrial personal computer generates a detection result graph of all the chips on the wafer 6 according to the detection result. Then, the inspection stage 302 moves below the dotter 305, and the dotter 305 performs dotting marking on the bad chips on the wafer 6.
After the inspection is completed, the second material taking arm 403 extends to take down the inspected wafer 6 from the inspection station 3, then the rotating frame 401 rotates, and the second material taking arm 403 transports the wafer 6 to the inspection station 3 and leaves. The above-mentioned process is reciprocal in circulation, and automatic feeding, detection and receiving are realized to wafer 6, and are applicable to wafer 6 of different specifications, and the commonality is high. Meanwhile, automatic calibration, point selection and parameter test are performed in the detection process, the detection speed is high, the detection efficiency is high, and the surface quality of the wafer 6 is effectively guaranteed.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the application pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It is to be understood that the present application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (5)
1. The wafer electrical property detection equipment is characterized by comprising a mounting platform, a storage station and a detection station, wherein the storage station and the detection station are arranged on the mounting platform, a transfer device is further arranged on the mounting platform, and the transfer device transfers a wafer to be detected from the storage station to the detection station and returns to the storage station after detection is completed;
the transfer device comprises a rotating frame, a first material taking arm and a second material taking arm which are horizontally connected to the rotating frame in a sliding mode, wherein the first material taking arm and the second material taking arm are in two states of extending and retracting, the rotating frame is arranged on the mounting platform and can rotate vertically, projections of the first material taking arm and the second material taking arm in the sliding direction are collinear in the vertical direction, and the vertical distance between the second material taking arm and the first material taking arm is larger than the thickness of a wafer;
the transfer device also comprises a control module, an edge detection sensor and an angle adjusting mechanism, wherein the edge detection sensor and the angle adjusting mechanism are connected with the control module, the edge detection sensor is arranged on the rotating frame, when the first material taking arm is in a retraction state, the edge detection sensor senses the notch position of the wafer on the first material taking arm, and when the edge detection sensor does not detect the notch, the edge detection sensor starts the angle adjusting mechanism through the control module, and the angle adjusting mechanism drives the wafer to vertically rotate;
the edge detection sensor comprises an upper laser emitter and a lower laser receiver which are arranged on the rotating frame, and light transmission openings are formed in detection positions of the first material taking arm and the second material taking arm relative to the edge detection sensor; the angle adjusting mechanism comprises an adjusting motor, a rotating sucker and a first lifting cylinder, wherein the adjusting motor and the rotating sucker are coaxially connected, the first lifting cylinder is vertically connected to the rotating frame, and a piston end of the first lifting cylinder is fixedly connected with a fixed end of the adjusting motor through a bearing plate;
the storage station comprises a flower basket, a base frame and a turnover part, wherein a material taking opening is formed in one side of the flower basket, the base frame is vertically and slidably arranged on the mounting platform, the flower basket is movably arranged on the base frame, and the turnover part is connected between the flower basket and the base frame so as to drive the flower basket to turn over along the direction deviating from the material taking opening;
the turnover part comprises a sliding unit, a linear driving piece and a linkage plate fixedly connected with the flower basket, a guide groove is formed in the linkage plate, the end part of the guide groove gradually rises along the direction deviating from the material taking opening, the sliding unit is inserted into the guide groove in a sliding manner, and the linear driving piece is hinged between the sliding unit and the base frame;
the sliding unit comprises a sliding block and a pulley, a horizontally arranged track is fixedly connected to the inner wall of the base frame, the sliding block is sleeved on the track in a sliding manner, the pulley is rotationally connected to the side wall of the sliding block, and the sliding block is positioned in the guide groove; the linear driving piece is a driving air cylinder, one end of the driving air cylinder is hinged with the sliding block, the other end of the driving air cylinder is hinged with the adapter plate, and the adapter plate is fixedly connected with the side wall of the base frame
The driving cylinder drives the sliding block to slide during telescopic movement, the sliding block is linked with the pulley, the position of the pulley in the guide groove is changed, at the moment, the linkage plate and the pulley move relatively, and the movement of the linkage plate realizes the overturning of the flower basket.
2. The wafer electrical property detection device according to claim 1, wherein the detection station comprises an alignment platform, a detection platform configured to vacuum adsorb a wafer, an electrifying detection part and an alignment imaging unit, the alignment platform is arranged on the mounting platform and can horizontally move, the detection platform is arranged on the alignment platform in a liftable manner and can vertically rotate, the electrifying detection part is arranged above the detection platform, a dotter is arranged on the electrifying detection part, the electrifying detection part comprises a probe chuck with a needle head, the alignment imaging unit comprises an alignment camera I connected with the electrifying detection part, an alignment camera II connected with the alignment platform, the alignment camera I and the alignment camera II are all used for realizing 90-degree image capturing through a reflecting mirror, the alignment camera I is used for acquiring position information of the wafer, the alignment camera II is used for acquiring position information of the needle head and the dotter, the external industrial control device is used for integrating acquired information, a complete space coordinate system is established, and a path planning and a path during wafer detection is generated.
3. The apparatus of claim 1, wherein the turnover portion further comprises a positioning member, the positioning member is a micro switch disposed on the base frame, and the micro switch is electrically connected to the linear driving member.
4. The wafer electrical property detection apparatus according to claim 1, further comprising a roll-over stand fixedly connected to the linkage plate, wherein the base frame is hinged to the roll-over stand at a side far away from the linkage plate, the roll-over stand and the base frame are oppositely arranged to form a limited space for accommodating a carrying tray, the carrying tray is horizontally arranged, and the roll-over stand is detachably connected with the flower basket through a clamping piece.
5. The apparatus of claim 1, further comprising a housing, wherein the storage station, the inspection station, and the transfer device are sealed within the housing.
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| CN202210929255.0A CN115274483B (en) | 2022-08-03 | 2022-08-03 | Wafer electrical property detection equipment |
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| CN202210929255.0A CN115274483B (en) | 2022-08-03 | 2022-08-03 | Wafer electrical property detection equipment |
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