CN216213270U

CN216213270U - Double-channel chip detection equipment

Info

Publication number: CN216213270U
Application number: CN202122458348.3U
Authority: CN
Inventors: 晁阳升; 蔡浪滔; 王宇峰; 梁永鑫
Original assignee: Hunan Aochuangpu Technology Co ltd
Current assignee: Hunan Aochuangpu Technology Co ltd
Priority date: 2021-10-12
Filing date: 2021-10-12
Publication date: 2022-04-05
Anticipated expiration: 2031-10-12

Abstract

The utility model relates to a double-channel chip detection device which comprises a base, a blanking device, a first detection system and a second detection system which are arranged oppositely, wherein the blanking device is positioned between the first detection system and the second detection system, the two detection systems operate simultaneously, the detection efficiency is improved, blanking is carried out through the same blanking device, the blanking device does not need to be arranged independently, and the structure of the device is simplified. Both detection systems include a correction device, a jacking device, a conveying device, a top surface detection camera, an end surface detection camera and a bottom surface detection camera. The optical axis quadrature of bottom surface detection camera and end face detection camera, the chip carries out the end face detection when carrying out the bottom surface detection, and the quadrature point is located between unloader and the top surface detection camera, and in the testing process, the chip carries out the top surface earlier and detects, carries out end face detection and bottom surface detection simultaneously again, carries out the unloading at last, and all operations can be accomplished to the chip towards a direction transportation, need not reciprocal transportation, optimizes the work chronogenesis, improves work efficiency.

Description

Double-channel chip detection equipment

Technical Field

The utility model relates to the technical field of visual detection, in particular to a double-channel chip detection device.

Background

And the integrated circuit chip finished product is attached to the blue film after being produced. And packaging and warehousing finished chips after the finished chips need to be detected and qualified, wherein the detection contents comprise physical defect detection, magnetic induction detection and the like, and the chips which are not detected are recovered.

The existing chip detection process comprises manual detection and equipment detection, wherein the manual detection is that the chips are detected one by one through naked eyes by labor-intensive workers, the detection mode is low in efficiency, the detection error is large, and the detection environment is very easy to pollute the chips in the detection process. The equipment detection is to detect one surface of the chip through a detection camera, turn over the chip through manual work, and then detect the other surface. The mode is also low in efficiency, automatic feeding and discharging operations cannot be realized, and subsequent packaging and other processes cannot be finished simultaneously.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In view of the above disadvantages and shortcomings of the prior art, the present invention provides a dual channel chip inspection apparatus, which solves the technical problem of low chip inspection efficiency.

(II) technical scheme

In order to achieve the above object, a dual channel chip inspection apparatus of the present invention includes:

the blanking device is positioned between the first detection system and the second detection system;

the first detection system and the second detection system respectively comprise a correction device, a jacking device, a conveying device, a top surface detection camera, an end surface detection camera and a bottom surface detection camera; the bottom surface detection camera and the end surface detection camera are both arranged on the base, the optical axis of the bottom surface detection camera is orthogonal to the optical axis of the end surface detection camera, and an orthogonal point is positioned between the blanking device and the top surface detection camera;

the correcting device comprises a correcting installation mechanism, a turntable mechanism and a positioning camera; the correcting installation mechanism is arranged on the base, the rotary table mechanism is arranged on the correcting installation mechanism, the rotary table mechanism can move in the directions of an x axis and a y axis, and the rotary table mechanism can rotate by taking a vertical line as a rotating shaft; the positioning camera is arranged above the turntable mechanism;

the jacking device comprises a jacking installation mechanism, a thimble and a telescopic mechanism; the jacking installation mechanism is arranged on the base, the telescopic mechanism is arranged on the jacking installation mechanism, and the telescopic mechanism can move in the z-axis direction; the ejector pin is vertically arranged on the telescopic mechanism and is positioned below the turntable mechanism; the top surface detection camera is arranged above the turntable mechanism;

the conveying device comprises a rotating assembly and a suction nozzle, the rotating assembly is arranged on the base and can move in the directions of an x axis, a y axis and a z axis, and the directions of the x axis, the y axis and the z axis are mutually vertical; the suction nozzle is arranged on the rotating assembly, the suction nozzle can rotate by taking a vertical line as a rotating shaft, and the rotating assembly can convey the chip on the turntable mechanism to an orthogonal point of optical axes of the bottom surface detection camera and the end surface detection camera through the suction nozzle.

Optionally, the correcting mounting mechanism comprises a first correcting mounting plate, a second correcting mounting plate, a first correcting driving component and a second correcting driving component;

the first correcting installation plate is arranged on the base in a sliding mode through a first correcting slide rail, the second correcting installation plate is arranged on the first correcting installation plate in a sliding mode through a second correcting slide rail, the first correcting slide rail is parallel to the x-axis direction, and the second correcting slide rail is parallel to the y-axis direction;

the first correction driving assembly is arranged on the base and used for driving the first correction mounting plate to move along the first correction sliding rail;

the second correction driving assembly is arranged on the first correction mounting plate and used for driving the second correction mounting plate to move along the second correction sliding rail;

the turntable mechanism is arranged on the second correction mounting plate.

Optionally, the carousel mechanism comprises a carousel drive assembly and a rotating disc;

the rotating disc is rotatably arranged on the second correcting mounting plate, the rotating disc driving assembly is arranged on the second correcting mounting plate, and the rotating disc driving assembly is used for driving the rotating disc to rotate;

a first circular through hole is formed in the rotating disc, a second circular through hole is formed in the second correcting and installing plate, and the central axes of the first circular through hole and the second circular through hole are collinear with the rotation axis of the rotating disc;

the positioning camera is positioned above the rotating disc, and a lens of the positioning camera faces downwards;

the ejector pin is located below the second circular through hole, and the top end of the ejector pin faces upwards.

Optionally, the correcting device further comprises a first pressing mechanism and a second pressing mechanism which are oppositely arranged;

the first pressing mechanism and the second pressing mechanism respectively comprise a pressing cylinder, a pressing plate and a material lifting block;

the pressing cylinder is arranged on the second correcting and mounting plate, and a piston rod of the pressing cylinder is arranged vertically upwards;

the compression plate is horizontally arranged on a piston rod of the compression cylinder, the lower surface of the compression plate can abut against the upper surface of the rotating disc, and the compression plate of the first compression mechanism and the compression plate of the second compression mechanism are point-symmetrical about the symmetry center of the rotating disc;

the material lifting block is arranged on the lower surface of the pressing plate.

Optionally, each of the first pressing mechanism and the second pressing mechanism further includes a pull rod assembly and a plurality of guide assemblies;

the pull rod assembly comprises a first guide shaft and a spring, the first guide shaft is vertically arranged on the lower surface of the compression plate, the spring is sleeved on the first guide shaft, the lower end of the spring is connected with the second correction mounting plate, and the second end of the spring is connected with the compression plate;

the guide assembly comprises a second guide shaft and a guide sleeve, the second guide shaft is vertically arranged on the lower surface of the pressing plate, the guide sleeve is vertically arranged on the second correction mounting plate, and the second guide shaft is slidably sleeved in the guide sleeve.

Optionally, the telescopic mechanism comprises a telescopic mounting plate, a telescopic driving assembly, a telescopic rod, a thimble guide tube and a thimble mounting block;

the jacking mounting mechanism comprises a first jacking mounting plate, a second jacking mounting plate and a jacking driving assembly; the first jacking mounting plate is arranged on the base, the second jacking mounting plate is arranged on the first jacking mounting plate in a sliding mode through a jacking sliding rail, and the jacking sliding rail is parallel to the z-axis direction; the jacking driving assembly is arranged on the first jacking mounting plate and used for driving the second jacking mounting plate to move along the jacking sliding rail; the telescopic mounting plate is arranged on the second jacking mounting plate, and the thimble guide pipe is arranged on the telescopic mounting plate;

the thimble mounting block is arranged on the telescopic mounting plate in a sliding manner through a telescopic slide rail, the first end of the telescopic rod is connected with the thimble mounting block, the second end of the telescopic rod is connected with the thimble, the telescopic rod is sleeved in the thimble guide tube in a sliding manner, and the telescopic slide rail and the telescopic rod are parallel to the z-axis direction;

the telescopic driving assembly is arranged on the telescopic mounting plate and used for driving the thimble mounting block to move along the telescopic slide rail.

Optionally, the dual-channel chip detection device further comprises a mounting rack and a cross beam, the mounting rack is arranged on the base, and the top surface detection camera and the positioning camera are both arranged on the mounting rack;

the cross beam is arranged on the mounting frame along the x-axis direction, and the conveying device is arranged on the cross beam in a sliding mode; the conveying device of the first detection system is positioned between the blanking device and the top surface detection camera of the first detection system, and the conveying device of the second detection system is positioned between the blanking device of the second detection system and the top surface detection camera.

Optionally, the transport device further comprises a first motion assembly, a second motion assembly, and a third motion assembly;

the first motion assembly, the second motion assembly and the third motion assembly each comprise a motion mounting plate and a motion driving assembly;

the motion mounting plate of the first motion assembly is arranged on the cross beam in a sliding mode through a first motion sliding rail, and the first motion sliding rail is parallel to the x-axis direction; the motion driving assembly of the first motion assembly is arranged on the motion mounting plate of the first motion assembly and used for driving the motion mounting plate of the first motion assembly to move along the first motion sliding rail;

the motion mounting plate of the second motion assembly is arranged on the motion mounting plate of the first motion assembly in a sliding mode through a second motion sliding rail, and the second motion sliding rail is parallel to the y-axis direction; the motion driving assembly of the second motion assembly is arranged on the motion mounting plate of the first motion assembly and is used for driving the motion mounting plate of the second motion assembly to move along the second motion sliding rail;

the motion mounting plate of the third motion assembly is slidably arranged on the motion mounting plate of the second motion assembly through a third motion sliding rail, and the third motion sliding rail is parallel to the z-axis direction; the motion driving assembly of the third motion assembly is arranged on the motion mounting plate of the second motion assembly and used for driving the motion mounting plate of the third motion assembly to move along the third motion sliding rail;

the rotating assembly is arranged on the motion mounting plate of the third motion assembly.

Optionally, the rotating assembly includes a rotation driving motor, a rotation housing and a rotating head, the rotation driving motor and the rotation housing are both disposed on the movement mounting plate of the third moving assembly, and a rotating shaft of the rotation driving motor is disposed vertically downward;

the lower extreme of rotary drive motor's pivot passes connect behind the swivel housing the rotating head, the suction nozzle set up in the lower extreme of rotating head.

Optionally, the blanking devices each include a blanking moving table, a blanking driving assembly, and an empty material detection camera;

the blanking mobile station is horizontally arranged on the base through a mobile slide rail, and the mobile slide rail is parallel to the y-axis direction;

the blanking driving assembly is arranged on the blanking moving table and used for driving the blanking moving table to move along the moving slide rail;

the empty material detection camera is arranged above the blanking mobile station.

(III) advantageous effects

The blanking device is positioned between the first detection system and the second detection system, the first detection system and the second detection system simultaneously carry out chip detection operation, the detection efficiency is improved, blanking is carried out through the same blanking device, the blanking device does not need to be independently arranged for each detection system, and the equipment structure is simplified;

in the detection process, the chip is subjected to top surface detection, end surface detection and bottom surface detection at the same time, and finally blanking is performed, so that all operations can be completed by transporting the chip in one direction without reciprocating transportation, the working time sequence is optimized, and the working efficiency is improved;

the correcting device corrects the position of the chip, the positioning camera is arranged above the turntable mechanism, and the position of each chip is shot and determined by the positioning camera after being adjusted by the correcting installation mechanism and the turntable mechanism, so that the subsequent top surface detection and the positioning adsorption of the conveying device are facilitated; the jacking device utilizes the upward jacking force of the ejector pin to separate the chip from the film, so that the conveying device can adsorb and convey the chip to the detection system conveniently. The optical axis of the bottom surface detection camera is orthogonal to that of the end surface detection camera, and the chip located in the orthogonal area can simultaneously detect the end surface and the bottom surface so as to improve the detection efficiency. The rotating assembly adjusts the spatial position of the suction nozzle through the movement in the three directions of the x axis, the y axis and the z axis, so that the suction nozzle can be ensured to adsorb each chip on the turntable mechanism, the chips are conveyed to the orthogonal area of the optical axis of the bottom surface detection camera and the optical axis of the end surface detection camera through the movement in the three directions of the x axis, the y axis and the z axis, and the bottom surface and the end surface detection are carried out on the chips of which the top surface detection is finished. The suction nozzle can use the vertical line to rotate as the rotation axis, and rotatory in-process end face detection camera carries out once detection to every terminal surface of chip, has improved detection efficiency.

Drawings

FIG. 1 is a schematic structural diagram of a dual-channel chip inspection apparatus according to the present invention;

FIG. 2 is a schematic structural diagram of a calibration device of the dual-channel chip inspection apparatus of the present invention;

FIG. 3 is a schematic view of a partial structure of a calibration device of the dual-channel chip inspection apparatus according to the present invention;

FIG. 4 is a schematic view of a partial structure of a calibration device of the dual-channel chip inspection apparatus of the present invention;

FIG. 5 is a schematic structural diagram of a jacking device of the dual-channel chip detection apparatus of the present invention;

FIG. 6 is a schematic partial structural view of a jacking device of the dual-channel chip detection apparatus of the present invention;

FIG. 7 is a schematic structural diagram of a conveying device of the dual-channel chip inspection apparatus of the present invention;

FIG. 8 is a schematic view of the mounting structure of the suction nozzle of the dual channel chip inspection apparatus of the present invention;

FIG. 9 is a schematic structural view of a blanking device of the dual-channel chip detection apparatus of the present invention;

FIG. 10 is a schematic structural diagram of a fine tuning platform of the dual-channel chip inspection apparatus of the present invention.

[ description of reference ]

100: a base; 101: a chip;

10: positioning a camera; 20: a top surface inspection camera; 30: a bottom surface detection camera; 40: an end face detection camera;

1: a correction device; 111: a first correcting mounting plate; 112: a second correction mounting plate; 113: a first correction drive assembly; 114: a second correction drive component;

12: a turntable mechanism; 121: a turntable drive assembly; 122: rotating the disc;

13: a first hold-down mechanism; 14: a second hold-down mechanism; 131: a pressing cylinder; 132: a compression plate; 133: lifting a material block; 134: a first guide shaft; 135: a spring; 136: a second guide shaft; 137: a guide sleeve;

2: a jacking device; 22: a thimble;

211: a first jacking mounting plate; 212: a second jacking mounting plate; 213: a jacking driving component;

231: a telescopic mounting plate; 232: a telescopic drive assembly; 233: a telescopic rod; 234: a thimble guide tube; 235: a thimble mounting block; 236: a thimble guide mounting block;

31: a conveyance device; 311: a suction nozzle; 312: a cross beam; 313: a first motion assembly; 314: a second motion assembly; 315: a third motion assembly;

3161: a rotary drive motor; 3162: rotating the head;

4: a blanking device; 41: a blanking mobile station; 42: a blanking driving component; 43: a material receiving box; 44: an empty material detection camera;

501: and (5) fine tuning the platform.

Detailed Description

For the purpose of better explaining the present invention and to facilitate understanding, the present invention will be described in detail by way of specific embodiments with reference to the accompanying drawings. In which the terms "upper", "lower", etc. are used herein with reference to the orientation of fig. 1.

For a better understanding of the above-described technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the utility model are shown in the drawings, it should be understood that the utility model can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

As shown in fig. 1, the present invention provides a dual-channel chip detection apparatus, which includes a base 100, a blanking device 4, and a first detection system and a second detection system that are arranged oppositely, wherein the blanking device 4 is located between the first detection system and the second detection system, and the first detection system and the second detection system perform detection operation of a chip 101 at the same time, so as to improve detection efficiency, and perform blanking through the same blanking device 4 without separately arranging a blanking device 4 for each detection system, thereby simplifying the apparatus structure. The first detection system and the second detection system each include a correction device 1, a jacking device 2, a conveying device 31, a top surface detection camera 20, an end surface detection camera 40 and a bottom surface detection camera 30, and the sector area in fig. 1 is the detection range of each camera. Bottom surface detection camera 30 all installs on base 100 with end face detection camera 40, bottom surface detection camera 30 and end face detection camera 40's optical axis quadrature, chip 101 carries out the end face detection when carrying out the bottom surface detection, the quadrature point is located between unloader 4 and the top surface detection camera 20, in the testing process, chip 101 carries out the top surface detection earlier, carry out end face detection and bottom surface detection simultaneously again, carry out the unloading at last, all operations can be accomplished towards a direction transportation to chip 101, need not reciprocal transportation, optimize the work chronogenesis, and the work efficiency is improved.

Specifically, the correction device 1 includes a correction mounting mechanism, a turntable mechanism 12, and a positioning camera 10. The correction mounting mechanism is mounted on the base 100, the turntable mechanism 12 is mounted on the correction mounting mechanism, and the correction mounting mechanism is used for driving the turntable mechanism 12 to move in two directions of an x axis and a y axis, wherein the two directions of movement can be independent movement or simultaneous movement, so that the chip 101 placed on the turntable can be adjusted in the directions of the x axis and the y axis. The turntable mechanism 12 is rotatable about a vertical line as a rotation axis, and the turntable mechanism 12 adjusts the angle of the chip 101 on the turntable mechanism 12 by rotating. The positioning camera 10 is mounted above the turntable mechanism 12, and after the position of the chip 101 is adjusted via the correction mounting mechanism and the turntable mechanism 12, the position of each chip 101 is photographed and determined by the positioning camera 10. The jacking device 2 comprises a jacking installation mechanism, a thimble 22 and a telescopic mechanism, wherein the jacking installation mechanism is installed on the base 100, the telescopic mechanism is installed on the jacking installation mechanism, and the jacking installation mechanism is used for driving the telescopic mechanism to move in the z-axis direction. The thimble 22 is vertically installed on the telescopic mechanism, and the thimble 22 is located below the turntable mechanism 12. The jacking installation mechanism drives the telescopic mechanism to move along the z-axis direction, so that the telescopic mechanism contacts the turntable mechanism 12, the telescopic mechanism drives the ejector pins 22 to extend upwards, and the chip 101 is jacked out of the film on the chip tray through the ejector pins 22. The inspection system employs a dual channel inspection system that includes a top surface inspection camera 20 and first and second inspection devices disposed opposite each other. The first and second inspection devices each include a bottom surface inspection camera 30, an end surface inspection camera 40, and a conveyance device 31. A top surface inspection camera 20 is mounted above the turntable mechanism 12 for top surface inspection of the chips 101 on the turntable. The bottom surface detection camera 30 and the end surface detection camera 40 are both installed on the base 100, the optical axis of the bottom surface detection camera 30 is orthogonal to the optical axis of the end surface detection camera 40, and the chip 101 located in the orthogonal area can simultaneously perform end surface detection and bottom surface detection, so that the detection efficiency is improved. The conveying device 31 includes a rotating component and a suction nozzle 311, the rotating component is mounted on the base 100, the rotating component can move in the directions of x, y and z axes, the directions of x, y and z axes are perpendicular to each other, the suction nozzle 311 is mounted on the rotating component, the rotating component adjusts the spatial position of the suction nozzle 311 through the movement in the three directions of x, y and z axes, so as to ensure that the suction nozzle 311 can absorb each chip 101 on the turntable mechanism 12, and then the chip 101 is conveyed to the orthogonal point of the optical axes of the bottom surface detection camera 30 and the end surface detection camera 40 through the movement in the three directions of x, y and z axes, so as to perform bottom surface and end surface detection on the chip 101 whose top surface detection is completed. The suction nozzle 311 can rotate by taking a vertical line as a rotating shaft, and the end face detection camera 40 detects each end face of the chip 101 once in the rotating process, so that the end face detection is performed while the bottom face detection is performed, and the detection efficiency of the chip 101 detection is improved. The correcting device 1 corrects the position of the chip 101, and confirms and records the position of the chip 101 through the positioning camera 10, so as to facilitate subsequent top surface detection and positioning and adsorption of the conveying device 31. The lifting device 2 uses the upward lifting force of the ejector pin 22 to separate the chip 101 from the film, so that the conveying device 31 can absorb and convey the chip into the detection system.

As shown in fig. 2, the correcting mounting mechanism includes a first correcting mounting plate 111, a second correcting mounting plate 112, a first correcting driving component 113, and a second correcting driving component 114. First correction mounting plate 111 is through first correction slide rail slidable mounting on base 100, and second correction mounting plate 112 is through second correction slide rail slidable mounting on first correction mounting plate 111, and first correction slide rail is parallel with the x axle direction, and the second correction slide rail is parallel with the y axle direction. The first correction driving assembly 113 is installed on the base 100, the first correction driving assembly 113 includes a motor and a screw rod assembly, a slider of the screw rod assembly is connected with the first correction mounting plate 111, a rotating shaft of the motor is connected with a screw rod of the screw rod assembly, and the motor drives the screw rod to rotate, so as to drive the first correction mounting plate 111 to move along the first correction sliding rail. The second correcting driving element 114 is mounted on the first correcting mounting plate 111, and the structure of the second correcting driving element 114 is the same as that of the first correcting driving element 113, so as to drive the second correcting mounting plate 112 to move along the second correcting slide rail. The turntable mechanism 12 is mounted on a second alignment mounting plate 112, and the horizontal position of the turntable mechanism 12 is adjusted by the alignment mounting mechanism to match the operation of other devices and mechanisms. The chip tray with the chips 101 is manually placed on the rotating tray 122, the placed chips 101 are photographed by the positioning camera 10, the position difference is determined, and the chips 101 are horizontally adjusted by the correction mounting mechanism to be positioned at the preset position.

As shown in fig. 3, the turntable mechanism 12 includes a turntable drive assembly 121 and a rotating disk 122. The rotating disc 122 is rotatably mounted on the second correcting mounting plate 112 through an end face bearing, the turntable driving assembly 121 is mounted on the second correcting mounting plate 112, and the turntable driving assembly 121 is used for driving the rotating disc 122 to rotate. Specifically, the turntable drive assembly 121 includes at least a motor and a gear set, and the motor drives the rotary disk 122 to rotate through the gear set. The turntable driving assembly 121 preferably includes a motor, a timing belt, a plurality of timing wheels, and a gear set, wherein the motor drives a driving gear of the gear set to rotate through the timing belt, and drives the rotary plate 122 to rotate through a driven gear. A first circular through hole is formed in the rotating disc 122, a second circular through hole is formed in the second correcting and installing plate 112, and the central axes of the first circular through hole and the second circular through hole are collinear with the rotation axis of the rotating disc 122. The thimble 22 is located below the second circular through hole, and the top end of the thimble 22 faces upward. The chip tray with the chips 101 is placed on the rotary plate 122, the bottom of the chip tray is placed above the first circular through hole, the position of the chip 101 is adjusted by the aligning and mounting mechanism, so that each chip 101 is sequentially positioned above the ejector pins 22, and the chips 101 are sequentially ejected from the film of the chip tray by the ejector mechanism. The positioning camera 10 is located above the rotating disc 122, the lens of the positioning camera 10 faces downwards, the positions of the chips 101 are shot, the shot pictures are sent to the control system, the positions of the chips 101 are labeled and recorded through the control system, and the chips 101 with the defects detected are recorded in the form of labels.

As shown in fig. 3, the correcting device 1 further includes a first pressing mechanism 13 and a second pressing mechanism 14 which are oppositely disposed. Each of the first pressing mechanism 13 and the second pressing mechanism 14 includes a pressing cylinder 131, a pressing plate 132, and a lifter block 133. The pressing cylinder 131 is installed on the second correcting installation plate 112, and a piston rod of the pressing cylinder 131 is vertically arranged upward. The pressing plate 132 is horizontally installed on the piston rod of the pressing cylinder 131, and when the piston rod of the pressing cylinder 131 is retracted, the lower surface of the pressing plate 132 can abut against the edge position of the upper surface of the rotating disk 122. A lifter block 133 is mounted on the lower surface of the hold-down plate 132. The edge of the chip tray placed on the rotary tray 122 is located between the material lifting block 133 and the pressing plate 132, the chip tray is fixed on the rotary tray 122 through the pressing plate 132 during detection, the chip tray is lifted through the material lifting block 133 after detection is finished, and then the chip tray is replaced manually. The pressing plate 132 of the first pressing mechanism 13 and the pressing plate 132 of the second pressing mechanism 14 are point-symmetric about the symmetric center of the rotating disc 122, and respectively clamp or lift two symmetric positions of the chip tray, so that the chip tray is prevented from moving due to unbalanced stress, and stability is improved.

As shown in fig. 4, each of the first pressing mechanism 13 and the second pressing mechanism 14 further includes a pull rod assembly and a plurality of guide assemblies. The pull rod assembly comprises a first guide shaft 134 and a spring 135, the first guide shaft 134 is vertically installed on the lower surface of the pressing plate 132, the spring 135 is sleeved on the first guide shaft 134, the lower end of the spring 135 is connected with the second correction installation plate 112 through a connection block, and the second end of the spring 135 is connected with the pressing plate 132. The pressing plate 132 is tensioned and abutted on the rotary disk 122 by a spring 135 to fix the chip tray, and the piston rod of the air cylinder is moved upward against the tension of the spring 135 to release the chip tray when being extended. The guide assembly comprises a second guide shaft 136 and a guide sleeve 137, the second guide shaft 136 is vertically installed on the lower surface of the pressing plate 132, the guide sleeve 137 is vertically installed on a connecting block on the second correction installing plate 112, and the second guide shaft 136 is slidably sleeved in the guide sleeve 137. The pressure strip 132 is positioned through a plurality of guide assemblies, the pressure strip 132 is prevented from shaking left and right, the pressure strip 132 is guaranteed to move vertically in a linear mode, and the stability of the pressure strip 132 is improved.

As shown in fig. 5, the retractable mechanism includes a retractable mounting plate 231, a retractable driving assembly 232, a retractable rod 233, a needle guide 234, and a needle mounting block 235. The telescopic installation plate 231 is installed on the jacking installation mechanism, and the telescopic installation plate 231 is driven to move up and down through the jacking installation mechanism. The ejector pin guide pipe 234 is installed on the telescopic installation plate 231, a through hole is formed in the ejector pin guide pipe 234, and the ejector pin guide pipe 234 is connected with a vacuum generator through the through hole. Thimble installation piece 235 is through flexible slide rail slidable mounting on flexible installation version 231, and thimble installation piece 235 is connected to the first end of telescopic link 233, and thimble installation piece 235 still plays the stabilizing effect to the first end of telescopic link 233, guarantees that the first end of telescopic link 233 can only follow flexible slide rail motion. The second end of the telescopic rod 233 is connected to the thimble 22 through a thimble guide mounting block 236, the telescopic rod 233 is slidably sleeved in the thimble guide tube 234, and the telescopic rod 233 can position the thimble 22 in the thimble guide tube 234. The thimble guide mounting block 236 is slidably connected to the inner wall of the thimble guide tube 234 to prevent the second end of the telescopic rod 233 from shaking during movement, and the telescopic slide rail is used to limit the first end of the telescopic rod 233, so as to effectively improve the movement stability of the thimble 22. The telescopic slide rail and the telescopic rod 233 are both parallel to the z-axis direction. A sealing ring is arranged between the telescopic rod 233 and the ejector pin guide pipe 234, a vacuum generator inputs vacuum to the ejector pin guide pipe 234, the top end of the guide end of the ejector pin 22 contacts the lower surface of the chip tray and adsorbs the chip tray, and the chip 101 is jacked upwards through the ejector pin 22 without driving the chip tray. The telescopic driving assembly 232 is installed on the telescopic installation plate 231, the telescopic driving assembly 232 comprises a screw rod assembly of a motor, the motor drives a screw rod of the screw rod assembly to rotate, a sliding block of the screw rod assembly is connected with the ejector pin installation block 235, the ejector pin installation block 235 can only do linear motion along the telescopic slide rail under the limitation of the telescopic slide rail, so that the telescopic rod 233 on the ejector pin assembly is driven to move in the z-axis direction, and the chip 101 is jacked up through the ejector pin 22 to be separated from a film during upward motion.

As shown in fig. 6, the jacking mounting mechanism includes a first jacking mounting plate 211, a second jacking mounting plate 212, and a jacking driving assembly 213. First jacking mounting panel 211 is installed on base 100, and second jacking mounting panel 212 passes through jacking slide rail slidable mounting on first jacking mounting panel 211, and the jacking slide rail is parallel with the z axle direction. Jacking drive assembly 213 is installed on first jacking mounting panel 211, jacking drive assembly 213 includes motor and lead screw subassembly, the motor is connected with the lead screw of lead screw subassembly, second jacking mounting panel 212 is connected with the slider of lead screw subassembly, drive second jacking mounting panel 212 along the motion of jacking slide rail, flexible installation version 231 is installed on second jacking mounting panel 212, flexible installation version 231 moves along with second jacking mounting panel 212, thereby drive telescopic machanism and move in the z axle direction.

As shown in fig. 7 and 8, the transport device 31 further includes a first motion assembly 313, a second motion assembly 314, and a third motion assembly 315, the beam 312 is mounted on the base 100 by a column, and the beam 312 is parallel to the x-axis direction. The first 313, second 314 and third 315 motion assemblies each include a motion mounting plate and motion drive assemblies, each of which is a conventional motor and screw assembly or motor and gear set combination. The motion mounting plate of the first motion assembly 313 is slidably mounted on the cross beam 312 through a first motion slide rail, and the first motion slide rail is parallel to the x-axis direction; the motion driving assembly of the first motion assembly 313 is mounted on the motion mounting plate of the first motion assembly 313 for driving the motion mounting plate of the first motion assembly 313 to move along the first motion rail. The motion mounting plate of the second motion assembly 314 is slidably mounted on the motion mounting plate of the first motion assembly 313 through a second motion sliding rail, and the second motion sliding rail is parallel to the y-axis direction; the motion driving assembly of the second motion assembly 314 is mounted on the motion mounting plate of the first motion assembly 313 for driving the motion mounting plate of the second motion assembly 314 to move along the second motion rail. The motion mounting plate of the third motion assembly 315 is slidably mounted on the motion mounting plate of the second motion assembly 314 through a third motion slide rail, which is parallel to the z-axis direction; the motion driving assembly of the third motion assembly 315 is mounted on the motion mounting plate of the second motion assembly 314 for driving the motion mounting plate of the third motion assembly 315 along the third motion rail. The rotary assembly is mounted on the motion mounting plate of the third motion assembly 315, and the spatial position of the rotary assembly is controlled by the first motion assembly 313, the second motion assembly 314 and the third motion assembly 315, so that the suction nozzle 311 on the rotary assembly can correspondingly suck each chip 101 on the rotary disk 122 and convey the chip 101 to the detection camera for defect detection.

Preferably, the rotating assembly includes a rotation driving motor 3161, a rotating housing, and a rotating head 3162, the rotation driving motor 3161 and the rotating housing are both mounted on the movement mounting plate of the third moving assembly 315, and the rotating shaft of the rotation driving motor 3161 is disposed vertically downward. The lower end of the rotation shaft of the rotation driving motor 3161 is connected to the rotation head 3162 after passing through the rotation housing, the suction nozzle 311 is installed at the lower end of the rotation head 3162, and the suction nozzle 311 can independently open vacuum for sucking the chip 101. The rotary driving motor 3161 drives the suction nozzle 311 to rotate through the rotary head 3162, thereby rotating the chip 101, and the end surface detection camera 40 sequentially detects the end surfaces of the chip 101.

As shown in fig. 1, the dual channel chip inspection apparatus further includes a mounting frame and a beam 312, the mounting frame is disposed on the base 100, and the top surface inspection camera 20 and the positioning camera 10 are both mounted on the mounting frame. The beam 312 is disposed on the mounting frame along the x-axis direction, and the transportation device 31 is slidably disposed on the beam 312. The conveying device 31 of the first inspection system is located between the blanking device 4 and the top inspection camera 20 of the first inspection system, and is configured to convey the chip 101 with the top inspection completed to the orthogonal point of the optical axes of the bottom inspection camera 30 and the end face inspection camera 40, and convey the chip 101 to the blanking device 4 after the bottom and end faces of the chip 101 are inspected. Likewise, the conveyor 31 of the second inspection system is located between the unloader 4 and the ceiling inspection camera 20 of the second inspection system.

As shown in fig. 9, each of the blanking devices 5 includes a blanking moving table 41, a blanking driving assembly 42, and an empty material detection camera 44. The blanking moving table 41 is horizontally mounted on the base 100 by a moving slide rail, which is parallel to the y-axis direction. The blanking driving assembly 42 is installed on the blanking moving platform 41, and the blanking driving assembly 42 includes a motor and a screw rod assembly, and the motor drives the blanking moving platform 41 to move along the moving slide rail through the screw rod assembly. The empty receiving cassette 43 for storing the chips 101 is manually placed on the feeding moving table 41, and the chips 101 subjected to the detection are placed in the receiving cassette 43 by the conveyor 31. The empty detecting camera 44 is installed above the discharging moving table 41, and whether each of the placement areas of the material receiving box 43 is empty is detected by the empty detecting camera 44. Preferably, as shown in fig. 10, a fine adjustment platform 501 is installed on the base of each camera, and an adjustment micrometer is disposed on the fine adjustment platform 501 to perform fine adjustment on the position of the camera. Blanking: firstly, the empty material detection camera 44 takes a picture of the material receiving box 43 to determine whether the material receiving box 43 is initially an empty box, and gives a signal to determine that the material receiving box is an empty box. After the detection is completed, the chip 101 is transported by the transport device 31, the spatial position of the chip is adjusted, and the chip 101 is finally placed at the target position on the material receiving box 43, and the chip 101 is placed in different material receiving boxes 43 to be distinguished by combining the judgment results given by the shooting of all the cameras. After loading, the empty material detection camera 44 takes a picture of the material receiving box 43 on the blanking moving table 41 before taking away, determines whether the box is full, and gives a signal. And after all the determinations are finished, taking away the material receiving box 43 containing the chip 101, and realizing the final work flow.

The working process is as follows: firstly, manually placing a blue film disc with chips 101 on a rotating disc 122 of a correction device 1, correcting the chip disc by a positioning camera 10, after the correction by the correction device 1, carrying out photo recognition on the upper surface of the chip 101 by a top surface detection camera 20, jacking the chip 101 adhered to the blue film by a thimble 22 of a jacking device 2 after the upper surface recognition is finished, so as to separate the chip from the blue film, then sucking and taking the jacked chip 101 by a conveying device 31, moving the chip to an optical axis orthogonal point of a bottom surface detection camera 30 and an end surface detection camera 40, carrying out photo recognition on the end surface and the bottom surface of the chip 101, after all the surfaces are recognized, placing the chip 101 in a material receiving box 43 on a blanking moving platform 41 by the conveying device 31, wherein the recognition result of each chip 101 is defined differently, such as: OK, NG, minor defects, secondary inspection, etc., chips 101 of different definitions are placed in different material receiving boxes 43, and the empty material detecting camera 44 scans the material receiving boxes 43 to determine whether the material receiving boxes 43 are full or empty.

The correcting device 1 corrects the position of the chip 101, the positioning camera 10 is installed above the turntable mechanism 12, and after the position of the chip 101 is adjusted by the correcting installation mechanism and the turntable mechanism 12, the positioning camera 10 shoots and determines the position of each chip 101, so that the subsequent top surface detection and positioning adsorption of the conveying device 31 are facilitated; the lifting device 2 uses the upward lifting force of the ejector pin 22 to separate the chip 101 from the film, so that the conveying device 31 can absorb and convey the chip into the detection system. The bottom surface detection camera 30 is orthogonal to the optical axis of the end surface detection camera 40, and the chip 101 located in the orthogonal region can simultaneously perform end surface detection and bottom surface detection to improve detection efficiency. The rotating assembly adjusts the spatial position of the suction nozzle 311 through the movement in the three directions of the x-axis, the y-axis and the z-axis, so as to ensure that the suction nozzle 311 can be attached to each chip 101 on the turntable mechanism 12, and then the chip 101 is transported to the orthogonal area of the optical axes of the bottom surface detection camera 30 and the end surface detection camera 40 through the movement in the three directions of the x-axis, the y-axis and the z-axis, so as to perform bottom surface and end surface detection on the chip 101 whose top surface detection is completed. The suction nozzle 311 can rotate by taking a vertical line as a rotating shaft, and the end face detection camera 40 detects each end face of the chip 101 once in the rotating process, so that the automation degree of the detection of the chip 101 is improved, and the detection efficiency is further improved. The first detection device and the second detection device share the turntable mechanism 12 as a storage bin, the first detection device and the second detection device operate independently, and end face detection and bottom face detection are respectively carried out on the chip 101 with the top face detection completed, so that the detection efficiency is effectively improved.

In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; either as communication within the two elements or as an interactive relationship of the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, a first feature may be "on" or "under" a second feature, and the first and second features may be in direct contact, or the first and second features may be in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lower level than the second feature.

In the description herein, the description of the terms "one embodiment," "some embodiments," "an embodiment," "an example," "a specific example" or "some examples" or the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present invention.

Claims

1. A dual channel chip inspection apparatus, comprising: the blanking device is positioned between the first detection system and the second detection system;

2. The dual channel chip test apparatus as claimed in claim 1, wherein said calibration mounting mechanism comprises a first calibration mounting plate, a second calibration mounting plate, a first calibration driving assembly, and a second calibration driving assembly;

the turntable mechanism is arranged on the second correction mounting plate.

3. The dual channel chip inspection apparatus of claim 2, wherein the turntable mechanism includes a turntable drive assembly and a rotating disk;

4. The dual channel chip inspection apparatus of claim 3, wherein the calibration device further comprises a first pressing mechanism and a second pressing mechanism disposed opposite to each other;

5. The dual channel chip inspection apparatus of claim 4, wherein each of the first and second clamping mechanisms further comprises a pull rod assembly and a plurality of guide assemblies;

6. The dual-channel chip detection device as claimed in any one of claims 1 to 5, wherein the telescoping mechanism comprises a telescoping mounting plate, a telescoping driving assembly, a telescoping rod, a thimble guide tube, and a thimble mounting block;

7. The dual-channel chip inspection apparatus of any one of claims 1 to 5, further comprising a mounting bracket and a beam, the mounting bracket being disposed on the base, the top surface inspection camera and the positioning camera both being disposed on the mounting bracket;

8. The dual channel chip inspection apparatus of claim 7, wherein the conveyor further comprises a first motion assembly, a second motion assembly, and a third motion assembly;

9. The dual-channel chip detection device according to claim 8, wherein the rotation assembly includes a rotation driving motor, a rotation housing and a rotation head, the rotation driving motor and the rotation housing are both disposed on the motion mounting plate of the third motion assembly, and a rotation shaft of the rotation driving motor is disposed vertically downward;

10. The dual-channel chip detection device as claimed in any one of claims 1 to 5, wherein each of the blanking devices comprises a blanking moving table, a blanking driving assembly and an empty material detection camera;