CN115931904A - Wafer appearance defect detection equipment - Google Patents
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- CN115931904A CN115931904A CN202310057092.6A CN202310057092A CN115931904A CN 115931904 A CN115931904 A CN 115931904A CN 202310057092 A CN202310057092 A CN 202310057092A CN 115931904 A CN115931904 A CN 115931904A
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Abstract
The application relates to a wafer appearance defect detection device, and belongs to the technical field of wafer appearance defect detection. The method comprises the following steps: the multi-station loading and unloading module comprises a wafer transfer robot and a wafer loading port support surrounding the periphery of the wafer transfer robot, wherein a plurality of wafer loading ports surrounding the periphery of the wafer transfer robot are arranged at the top of the wafer loading port support, and wafer boxes for storing wafers are arranged in the wafer loading ports; the host detection module is positioned on one side of the multi-station feeding and discharging module and comprises a wafer adsorption carrying platform, an optical mechanical module which is positioned at the top of the wafer adsorption carrying platform and used for detecting and positioning the wafer, and a driving module which is positioned at the bottom of the wafer adsorption carrying platform and used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle. The full-process automatic transfer and automatic appearance defect detection of the wafer can be realized, and the wafer detection efficiency and the detection quality are improved.
Description
Technical Field
The application relates to the technical field of wafer appearance defect detection, in particular to wafer appearance defect detection equipment.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are dominated by 4 inches to 12 inches.
The wafer is in process of production, often can produce the wafer of bad product, and the wafer need detect in process of production, mainly carries out preliminary screening to its outward appearance and whether takes place the crackle, and the testing method is mostly people's eye discernment, but the accuracy of people's eye discernment is not high, efficiency is lower, and people's eye is tired easily, easily receives external interference factor to influence, and detection effect is unstable, and the management and control of missed measure rate is very difficult. Therefore, it is more and more important to realize automatic appearance defect detection by adopting a machine vision technology to replace human eyes and human brains.
Disclosure of Invention
The embodiment of the application provides a wafer appearance defect detection device, which aims to solve the problems of low detection accuracy and low efficiency caused by the fact that human eyes recognize the wafer appearance defects in the related technology.
The embodiment of the application provides a wafer appearance defect check out test set, includes:
the multi-station loading and unloading module comprises a wafer transfer robot and a wafer loading port support surrounding the periphery of the wafer transfer robot, wherein the top of the wafer loading port support is provided with a plurality of wafer loading ports surrounding the periphery of the wafer transfer robot, and wafer boxes for storing wafers are arranged in the wafer loading ports;
the main machine detection module is positioned on one side of the multi-station feeding and discharging module and comprises a wafer adsorption carrying platform, an optical machine module which is positioned at the top of the wafer adsorption carrying platform and used for detecting and positioning the wafer, and a driving module which is positioned at the bottom of the wafer adsorption carrying platform and used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle.
In some embodiments: the top of the wafer loading port support is also provided with a wafer edge finder for pre-positioning wafers, the wafer edge finder is used for driving the wafers to move along an X axis and a Y axis and rotate to a set angle, and the radius of the wafer transfer robot from the wafer edge finder to the plurality of wafer loading ports is equal.
In some embodiments: the wafer edge finder is characterized in that an edge finder camera for collecting wafer characteristic image information is arranged at the top of the wafer edge finder, the edge finder camera is connected with the wafer edge finder through a controller, the controller obtains the wafer characteristic image information and rotates the wafer to a set angle through the wafer edge finder, and a sweeping head for collecting wafer bar code information is further arranged at the top of the wafer edge finder.
In some embodiments: the wafer transfer robot is a dual-arm four-axis robot, an adsorption arm for adsorbing bare wafers is arranged on one arm of the wafer transfer robot, a fork-shaped arm for clamping wafers with patch rings is arranged on the other arm of the wafer transfer robot, notches which are forked into outer rings of the patch rings are formed in the fork-shaped arm, and wafer mapping sensors for detecting the number and positions of the wafers in a wafer loading port are arranged on the adsorption arm and the fork-shaped arm.
In some embodiments: host computer detection module still includes the base, the top of base is equipped with the marble platform of fixed drive module, the top of marble platform is equipped with the marble portal frame of fixed ray apparatus module, be equipped with a plurality of elastic support between base and the marble platform the damping air spring of marble platform.
In some embodiments: the optical-mechanical module comprises a scanning camera and a rechecking camera for acquiring wafer image information, and a distance measuring sensor for measuring the vertical distance between the scanning camera and the rechecking camera and the wafer, and is connected with a Z-axis linear module for adjusting the vertical distance between the optical-mechanical module and the wafer.
In some embodiments: the driving module comprises an X-axis linear module for driving the wafer adsorption carrier to move linearly along an X axis, a Y-axis linear module which is arranged at the top of the X-axis linear module and used for driving the wafer adsorption carrier to move linearly along a Y axis, and a DD motor which is arranged at the top of the Y-axis linear module and used for driving the wafer adsorption carrier to rotate, wherein the wafer adsorption carrier is fixed at the top of the DD motor.
In some embodiments: still including the host computer dustcoat that holds unloading module and host computer detection module on the multistation, the top of host computer dustcoat is equipped with fan filter unit and alarm, be equipped with the ion wind stick that eliminates static in the host computer dustcoat, be equipped with a plurality of last unloading sliding doors of opening and closing wafer load port on the lateral wall of host computer dustcoat to and the last maintenance door and the lower maintenance door of unloading module on the maintenance multistation.
In some embodiments: the host detection module is further provided with a frame, the back of the frame is provided with an electric cabinet, an air source assembly and a temperature and humidity sensor are arranged in the electric cabinet, and an operation interface for controlling the multi-station feeding and discharging module and the host detection module is fixedly arranged outside the host outer cover.
In some embodiments: the operation interface is connected with a robot controller for controlling the wafer transfer robot, the operation interface is also connected with an industrial personal computer for controlling the host detection module, and the robot controller and the industrial personal computer are both fixed at the bottom of the wafer loading port support.
The beneficial effect that technical scheme that this application provided brought includes:
the embodiment of the application provides a wafer appearance defect detection device, and the 4-6 inch wafer appearance defect detection device is provided with a multi-station loading and unloading module, wherein the multi-station loading and unloading module comprises a wafer transfer robot and a wafer loading port support surrounding the periphery of the wafer transfer robot, a plurality of wafer loading ports surrounding the periphery of the wafer transfer robot are arranged at the top of the wafer loading port support, and wafer boxes for storing wafers are arranged in the wafer loading ports; the main machine detection module is positioned on one side of the multi-station feeding and discharging module and comprises a wafer adsorption carrying platform, an optical machine module which is positioned at the top of the wafer adsorption carrying platform and used for detecting and positioning the wafer, and a driving module which is positioned at the bottom of the wafer adsorption carrying platform and used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle.
Therefore, the 4-6 inch wafer appearance defect detection equipment realizes automatic transfer and automatic optical appearance defect detection of the wafer by adopting the mutual matching of the multi-station feeding and discharging module and the host detection module. The wafer loading ports are arranged in a plurality of numbers, the wafer loading ports are arranged around the periphery of the wafer transfer robot in a surrounding mode, the wafer loading ports are all used for taking, placing and storing the wafer boxes and opening and closing the wafer boxes, and damage and pollution rate of wafers are reduced. The wafer transfer robot is used for picking and placing the wafer in the wafer loading port, transferring the wafer to the wafer detection unit for defect detection of the wafer, and transferring the detected wafer into the wafer box.
The wafer adsorption carrying platform of the host detection module is used for adsorbing the wafer transferred by the wafer transfer robot, and the optical machine module at the top of the wafer adsorption carrying platform is used for detecting and positioning the wafer and detecting the appearance defects of the surface of the wafer. The bottom of the wafer adsorption carrying platform is provided with a driving module which is used for driving the wafer to move along the X axis and the Y axis and rotate to a set angle, the driving module is used for not only accurately positioning the wafer, but also detecting the appearance defects of the surface of the wafer by matching with the optical-mechanical module, and driving the wafer to move along a set track so as to scan each detection area of the wafer. The full-automatic transfer and automatic appearance defect detection device can realize full-automatic transfer and automatic appearance defect detection of wafers, and improves wafer detection efficiency and detection quality.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a first perspective structure according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a second perspective structure according to an embodiment of the present disclosure;
fig. 3 is a top view of the multi-station loading and unloading module and the host detection module according to the embodiment of the present application;
FIG. 4 is a front view of the multi-station loading and unloading module and the host detection module according to the embodiment of the present disclosure;
fig. 5 is a perspective view of the multi-station loading and unloading module and the host detection module according to the embodiment of the present application.
Reference numerals:
1. an operation interface; 2. a host housing; 3. an alarm; 4. a first fan filter unit; 5. a second fan filter unit; 6. a feeding and discharging sliding door; 7. a lower maintenance door; 8. an upper maintenance door; 9. a gas source assembly; 10. a temperature and humidity sensor; 11. a wafer load port; 12. a wafer edge finder; 13. a wafer transfer robot; 14. an ion wind rod; 15. a frame; 16. an opto-mechanical module; 17. a wafer adsorption carrying platform; 18. a DD motor; 19. an X-axis linear module; 20. a Y-axis linear module; 21. a vibration damping gas spring; 22. an electrical cabinet; 23. a robot controller; 24. and an industrial personal computer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a wafer appearance defect detection device, which can solve the problems of low detection accuracy and low efficiency caused by the fact that human eyes recognize the wafer appearance defect in the related technology.
Referring to fig. 3 to 5, an embodiment of the present application provides a wafer appearance defect detecting apparatus, including:
the multi-station feeding and discharging module comprises a wafer transfer robot 13 and a wafer loading port support surrounding the periphery of the wafer transfer robot 13, wherein the wafer loading port support is formed by splicing and building aluminum profiles. The top of the wafer loading port support is provided with four wafer loading ports 11 which are arranged around the periphery of the wafer transfer robot 13, wafer boxes for storing wafers of different sizes and types are arranged in the wafer loading ports 11, and the wafer loading ports 11 are used for taking, placing, storing and opening and closing the wafer boxes.
The main machine detection module is located on one side of the multi-station feeding and discharging module and comprises a wafer adsorption carrying platform 17, an optical machine module 16 located at the top of the wafer adsorption carrying platform 17 and used for detecting and positioning wafers, and a driving module located at the bottom of the wafer adsorption carrying platform 17 and used for driving the wafers to move along an X axis and a Y axis and rotate to a set angle. The wafer transfer robot 13 transfers the wafer taken out of the wafer load port 11 to the wafer suction stage 17, and the optical mechanical module 16 precisely positions the wafer on the wafer suction stage 17 and detects the appearance defect.
The 4-6 inch wafer appearance defect detection equipment provided by the embodiment of the application realizes automatic transfer and automatic optical appearance defect detection of wafers by adopting mutual cooperation of the multi-station feeding and discharging module and the host detection module. The plurality of wafer loading ports 11 are arranged, the plurality of wafer loading ports 11 are arranged around the periphery of the wafer transfer robot 13, and the plurality of wafer loading ports 11 are used for picking, placing and storing wafer boxes and opening and closing the wafer boxes, so that the damage and the pollution rate of wafers are reduced. The wafer transfer robot 13 is used for picking and placing the wafer in the wafer loading port 11, transferring the wafer to the wafer inspection unit for defect inspection of the wafer, and transferring the inspected wafer into the wafer cassette.
The wafer suction stage 17 of the host detection module is used for sucking the wafer transferred by the wafer transfer robot 13, and the optical mechanical module 16 on the top of the wafer suction stage 17 is used for detecting and positioning the wafer, and performing appearance defect detection on the surface of the wafer. The bottom of the wafer adsorption carrying platform 17 is provided with a driving module for driving the wafer to move along the X axis and the Y axis and rotate to a set angle, the driving module not only can accurately position the wafer, but also can be used for matching with the optical mechanical module 16 to detect appearance defects on the surface of the wafer, and driving the wafer to move along a set track so as to scan each detection area of the wafer.
In some alternative embodiments: referring to fig. 3 to 5, the embodiment of the present invention provides a device for detecting appearance defects of a wafer, wherein a wafer edge finder 12 for pre-positioning a wafer is further disposed on a top of a wafer load port support of the device, the wafer edge finder 12 is used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle, and a radius of a wafer transfer robot 13 from the wafer edge finder 12 to four wafer load ports 11 is equal. The wafer transfer robot 13 transfers the wafers in the four wafer load ports 11 to the wafer edge finder 12, performs pre-positioning on the center positions of the wafers, and then transfers the wafers to the wafer adsorption stage 17 to perform fine positioning and appearance defect image detection on the wafers.
The top of the wafer edge finder 12 is provided with an edge finder camera for collecting wafer characteristic image information, the edge finder camera is connected with the wafer edge finder through a controller, the controller obtains the wafer characteristic image information and rotates the wafer to a set angle through the wafer edge finder, and the top of the wafer edge finder is provided with a scanning head for collecting wafer bar code information. The edge finder camera is connected with the controller, and the controller acquires the wafer feature image information and rotates the wafer to a set angle through the wafer edge finder 12 so as to keep the groove feature and the flat feature on the wafer facing to a set direction. The code reading head traces the source information of each wafer, and a tracing environment can be established by printing bar codes or characters on the wafer and the label, so that the requirement of acquiring the wafer information is met.
In some alternative embodiments: referring to fig. 3 to 5, an embodiment of the present invention provides a wafer appearance defect inspection apparatus, in which a wafer transfer robot 13 is a dual-arm four-axis robot, and an arm of the wafer transfer robot 13 is provided with an adsorption arm for adsorbing a bare wafer. The other arm of the wafer transfer robot 13 is provided with a fork arm for clamping the wafer with the patch ring, the fork arm is provided with a notch for forking into the outer ring of the patch ring, and the adsorption arm and the fork arm are both provided with wafer mapping sensors for detecting the number and the positions of the wafers in the wafer loading port 11.
The wafer mapping sensor is used for scanning the position and number of wafers in the wafer load port 11 and finding out whether the wafer is skewed, overlapped and damaged. The adsorption arm of the wafer transfer robot 13 can carry the bare wafer without the wafer ring, and the fork arm of the wafer transfer robot 13 can carry the wafer with the wafer ring, so that the carrying operation of different types of wafers can be satisfied.
In some alternative embodiments: referring to fig. 3 to 5, the embodiment of the application provides a wafer appearance defect detection device, and the host detection module of the detection device further comprises a base, a marble platform for fixing a driving module is arranged at the top of the base, a marble portal frame for fixing an optical mechanical module 16 is arranged at the top of the marble platform, and a plurality of damping air springs 21 for elastically supporting the marble platform are arranged between the base and the marble platform.
Marble platform and marble platform all adopt the marble material preparation, and the marble has better structural stability, uses for a long time to be difficult for deformation and stress deformation, provides the table surface of high accuracy for ray apparatus module 16 and drive module. The damping gas spring 21 is used for isolating external vibration, eliminating the influence of external environment vibration on the optical-mechanical module 16 and the drive module on wafer detection, and improving the reliability and detection precision of wafer appearance defect detection.
In some alternative embodiments: referring to fig. 3 to 5, an embodiment of the present application provides a wafer appearance defect detection apparatus, where an opto-mechanical module 16 of the detection apparatus includes a scanning camera and a rechecking camera for acquiring wafer image information, and a distance measuring sensor for measuring a vertical distance between the scanning camera and the rechecking camera and the wafer, the opto-mechanical module 16 is connected to a Z-axis linear module for adjusting the vertical distance between the opto-mechanical module 16 and the wafer, and the Z-axis linear module is used to implement functions such as focusing of focuses of the scanning camera and the rechecking camera on the wafer, so that the scanning camera and the rechecking camera are at an optimal focusing height.
The driving module comprises an X-axis linear module 19 for driving the wafer adsorption carrying platform 17 to linearly move along an X axis, a Y-axis linear module 20 located at the top of the X-axis linear module 19 and used for driving the wafer adsorption carrying platform 17 to linearly move along a Y axis, and a DD motor 18 located at the top of the Y-axis linear module 20 and used for driving the wafer adsorption carrying platform 17 to rotate, wherein the wafer adsorption carrying platform 17 is fixed at the top of the DD motor 18. The X-axis linear module 19, the Y-axis linear module 20, and the DD motor 18 are configured to drive the wafer suction stage 17 to perform linear motion along the X-axis, linear motion along the Y-axis, and rotational motion along the set defect detection trajectory, respectively. The stroke of the X-axis linear module 19 is 450mm and is used for responding to the high-speed motion state of the scanning camera, the stroke of the Y-axis linear module 20 is 500mm and is used for responding to the line changing motion state of the scanning camera, and the DD motor 18 is used for correcting the angle position of the wafer.
In some alternative embodiments: referring to fig. 1 to 2, the embodiment of the application provides a wafer appearance defect detection device, which further comprises a host machine outer cover 2 accommodating a multi-station feeding and discharging module and a host machine detection module, and a fan filter unit and an alarm 3 are arranged at the top of the host machine outer cover 2. The fan filter unit comprises a first fan filter unit 4 positioned at the top of the host detection module and a second fan filter unit 5 positioned at the top of the multi-station feeding and discharging module. An ion air bar 14 for eliminating static electricity in the main machine housing 2 is arranged in the main machine housing 2, a plurality of feeding and discharging sliding doors 6 for opening and closing the wafer loading port 11, an upper maintenance door 8 for overhauling the multi-station feeding and discharging module and a lower maintenance door 7 are arranged on the side wall of the main machine housing 2.
The host detection module is further provided with a frame 15, the frame 15 is a rectangular frame formed by splicing aluminum profiles, an electrical cabinet 22 is arranged at the back of the frame 15, an air source assembly 9 and a temperature and humidity sensor 10 are arranged in the electrical cabinet 22, and an operation interface for controlling the multi-station feeding and discharging module and the host detection module is fixedly arranged outside the host outer cover 2. The operation interface 1 is connected with a robot controller 23 for controlling the wafer transfer robot 13, the operation interface 1 is also connected with an industrial personal computer 24 for controlling the host detection module, and the robot controller 23 and the industrial personal computer 24 are both fixed at the bottom of the wafer load port support.
Principle of operation
The embodiment of the application provides a wafer appearance defect detection device, and as the 4-6 inch wafer appearance defect detection device is provided with a multi-station loading and unloading module, the multi-station loading and unloading module comprises a wafer transfer robot 13 and a wafer loading port support surrounding the periphery of the wafer transfer robot 13, a plurality of wafer loading ports 11 surrounding the periphery of the wafer transfer robot 13 are arranged at the top of the wafer loading port support, and wafer boxes for storing wafers are arranged in the wafer loading ports 11; the main machine detection module is positioned on one side of the multi-station feeding and discharging module and comprises a wafer adsorption carrying platform 17, an optical machine module 16 which is positioned at the top of the wafer adsorption carrying platform 17 and used for detecting and positioning the wafer, and a driving module which is positioned at the bottom of the wafer adsorption carrying platform 17 and used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle.
Therefore, the 4-6 inch wafer appearance defect detection equipment realizes automatic transfer and automatic optical appearance defect detection of the wafer by adopting the mutual matching of the multi-station feeding and discharging module and the host detection module. The plurality of wafer loading ports 11 are arranged, the plurality of wafer loading ports 11 are arranged around the periphery of the wafer transfer robot 13, and the plurality of wafer loading ports 11 are used for picking, placing and storing wafer boxes and opening and closing the wafer boxes, so that the damage and the pollution rate of wafers are reduced. The wafer transfer robot 13 is used for picking and placing the wafer in the wafer loading port 11, transferring the wafer to the wafer inspection unit for defect inspection of the wafer, and transferring the inspected wafer into the wafer cassette.
The wafer suction stage 17 of the host detection module is used for sucking the wafer transferred by the wafer transfer robot 13, and the optical mechanical module 16 on the top of the wafer suction stage 17 is used for detecting and positioning the wafer, and performing appearance defect detection on the surface of the wafer. The bottom of the wafer adsorption carrying platform 17 is provided with a driving module for driving the wafer to move along the X axis and the Y axis and rotate to a set angle, the driving module not only can accurately position the wafer, but also can be used for matching with the optical mechanical module 16 to detect appearance defects on the surface of the wafer, and driving the wafer to move along a set track so as to scan each detection area of the wafer. The full-automatic transfer and automatic appearance defect detection device can realize full-automatic transfer and automatic appearance defect detection of wafers, and improves wafer detection efficiency and detection quality.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly and encompass, for example, both fixed and removable coupling as well as integral coupling; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A wafer appearance defect detecting apparatus, comprising:
the multi-station loading and unloading module comprises a wafer transfer robot (13) and a wafer loading port support arranged around the periphery of the wafer transfer robot (13), a plurality of wafer loading ports (11) arranged around the periphery of the wafer transfer robot (13) are formed in the top of the wafer loading port support, and wafer boxes for storing wafers are arranged in the wafer loading ports (11);
the host detection module is positioned on one side of the multi-station feeding and discharging module and comprises a wafer adsorption carrying platform (17), an optical machine module (16) which is positioned at the top of the wafer adsorption carrying platform (17) and used for detecting and positioning a wafer, and a driving module which is positioned at the bottom of the wafer adsorption carrying platform (17) and used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle.
2. The apparatus for detecting defects in the appearance of a wafer of claim 1, wherein:
the top of the wafer loading port support is also provided with a wafer edge finder (12) for pre-positioning wafers, the wafer edge finder (12) is used for driving the wafers to move along an X axis and a Y axis and rotate to a set angle, and the radius of the wafer transfer robot (13) from the wafer edge finder (12) to the plurality of wafer loading ports (11) is equal.
3. The apparatus for detecting defects in the appearance of a wafer of claim 2, wherein:
the wafer edge finder is characterized in that an edge finder camera for collecting wafer characteristic image information is arranged at the top of the wafer edge finder (12), the edge finder camera is connected with the wafer edge finder (12) through a controller, the controller obtains the wafer characteristic image information and rotates the wafer to a set angle through the wafer edge finder (12), and a sweeping head for collecting wafer bar code information is further arranged at the top of the wafer edge finder (12).
4. The apparatus for detecting defects in the appearance of a wafer of claim 1, wherein:
the wafer transfer robot (13) is a dual-arm four-axis robot, an adsorption arm for adsorbing bare wafers is arranged on one arm of the wafer transfer robot (13), a fork-shaped arm for clamping wafers with patch rings is arranged on the other arm of the wafer transfer robot (13), notches which are forked into outer rings of the patch rings are formed in the fork-shaped arm, and the adsorption arm and the fork-shaped arm are respectively provided with a wafer mapping sensor for detecting the number and the positions of the wafers in a wafer loading port (11).
5. The apparatus for detecting defects in the appearance of a wafer of claim 1, wherein:
host computer detection module still includes the base, the top of base is equipped with the marble platform of fixed drive module, the top of marble platform is equipped with the marble portal frame of fixed ray apparatus module (16), be equipped with a plurality of elastic support between base and the marble platform the damping air spring (21) of marble platform.
6. The apparatus for detecting defects in the appearance of a wafer as defined in claim 1, wherein:
the optical-mechanical module (16) comprises a scanning camera and a rechecking camera for acquiring wafer image information, and a distance measuring sensor for measuring the vertical distance between the scanning camera and the rechecking camera and the wafer, and the optical-mechanical module (16) is connected with a Z-axis linear module for adjusting the vertical distance between the optical-mechanical module (16) and the wafer.
7. The apparatus for detecting defects in the appearance of a wafer as defined in claim 1, wherein:
the driving module comprises an X-axis linear module (19) for driving the wafer adsorption carrying platform (17) to linearly move along an X axis, a Y-axis linear module (20) which is located at the top of the X-axis linear module (19) and used for driving the wafer adsorption carrying platform (17) to linearly move along a Y axis, and a DD motor (18) which is located at the top of the Y-axis linear module (20) and used for driving the wafer adsorption carrying platform (17) to rotate, wherein the wafer adsorption carrying platform (17) is fixed to the top of the DD motor (18).
8. The apparatus for detecting defects in the appearance of a wafer of claim 1, wherein:
still including host computer dustcoat (2) that hold last unloading module and host computer detection module of multistation, the top of host computer dustcoat (2) is equipped with fan filter unit and alarm (3), be equipped with ion wind stick (14) of static in the elimination host computer dustcoat (2) in host computer dustcoat (2), be equipped with a plurality of last unloading sliding doors (6) of opening and closing wafer loading port (11) on the lateral wall of host computer dustcoat (2) to and the last door (8) of maintaining and lower door (7) of maintaining of unloading module on the maintenance multistation.
9. The apparatus for detecting defects in the appearance of a wafer of claim 8, wherein:
the host detection module is further provided with a rack (15), the back of the rack (15) is provided with an electric cabinet (22), an air source assembly (9) and a temperature and humidity sensor (10) are arranged in the electric cabinet, and an operation interface (1) for controlling the multi-station feeding and discharging module and the host detection module is fixedly arranged outside the host outer cover (2).
10. The apparatus for detecting defects in the appearance of a wafer as defined in claim 9, wherein:
the wafer transfer robot is characterized in that the operation interface (1) is connected with a robot controller (23) for controlling a wafer transfer robot (13), the operation interface is further connected with an industrial personal computer (24) for controlling a host detection module, and the robot controller (23) and the industrial personal computer (24) are both fixed at the bottom of the wafer loading port support.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310057092.6A CN115931904A (en) | 2023-01-16 | 2023-01-16 | Wafer appearance defect detection equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310057092.6A CN115931904A (en) | 2023-01-16 | 2023-01-16 | Wafer appearance defect detection equipment |
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| CN115931904A true CN115931904A (en) | 2023-04-07 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116666300A (en) * | 2023-07-18 | 2023-08-29 | 江苏海纳电子科技有限公司 | Semiconductor chip wafer defect detection device and defect detection method |
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2023
- 2023-01-16 CN CN202310057092.6A patent/CN115931904A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116666300A (en) * | 2023-07-18 | 2023-08-29 | 江苏海纳电子科技有限公司 | Semiconductor chip wafer defect detection device and defect detection method |
| CN116666300B (en) * | 2023-07-18 | 2023-09-29 | 江苏海纳电子科技有限公司 | Semiconductor chip wafer defect detection device and defect detection method |
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