CN116008303A - Large-size wafer appearance defect detection equipment - Google Patents
Large-size wafer appearance defect detection equipment Download PDFInfo
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- CN116008303A CN116008303A CN202310057402.4A CN202310057402A CN116008303A CN 116008303 A CN116008303 A CN 116008303A CN 202310057402 A CN202310057402 A CN 202310057402A CN 116008303 A CN116008303 A CN 116008303A
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Abstract
The application relates to a large-size wafer appearance defect check out test set belongs to semiconductor wafer check out test set technical field, includes: the wafer transfer unit comprises at least two groups of wafer loading ports which are arranged in parallel, a wafer transfer robot for taking and placing wafers in the wafer loading ports, a wafer mapping sensor for detecting the positions of the wafers in the wafer loading ports, and a transverse moving shaft module for driving the wafer transfer robot to reciprocate between the at least two groups of wafer loading ports; the wafer detection unit is positioned at one side of the wafer transfer unit, the wafer transfer unit comprises a wafer adsorption carrier, an optical machine module positioned at the top of the wafer adsorption carrier and used for detecting and positioning the wafer, and a driving module positioned at the bottom of the wafer adsorption carrier and used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle. The full-process automatic transfer and automatic appearance defect detection of the wafer can be realized, and the wafer detection efficiency and the wafer detection quality are improved.
Description
Technical Field
The application relates to the technical field of semiconductor wafer detection, in particular to large-size wafer appearance defect detection equipment.
Background
The silicon wafer is a round chip made by cutting a silicon rod, and after the silicon rod is cut into the silicon wafer, a large amount of residues are left on the surface of the silicon rod, and even though the silicon wafer is polished and cleaned, the Defect (Defect) similar to scratch or water stain cannot exist on the surface of the silicon wafer, so that the Defect detection on the surface of the silicon wafer is required to ensure the shipment quality of the silicon wafer.
The existing method for detecting the defects on the surface of the silicon wafer is still manual detection no matter the silicon wafer manufacturing plant or the regenerated silicon wafer plant, mainly the defects on the surface of the silicon wafer are detected through experience of detection personnel, however, the method for manually detecting the defects on the surface of the silicon wafer is easy to misjudge, the defects are still found by manpower when the silicon wafer leaves the factory, and the problem of defects still exists, so that the quality of the manufactured silicon wafer leaves the factory is poor.
Disclosure of Invention
The embodiment of the application provides large-size wafer appearance defect detection equipment, which is used for solving the problems that in the related art, the mode of manually detecting the surface defects of a silicon wafer is easy to misjudge and defects still exist due to the fact that the defects are not found manually when the silicon wafer leaves a factory, and the quality of leaving the factory is good and uneven.
The embodiment of the application provides large-size wafer appearance defect detection equipment, which comprises the following components:
the wafer transfer unit comprises at least two groups of wafer loading ports which are arranged in parallel, a wafer transfer robot for taking and placing wafers in the wafer loading ports, a wafer mapping sensor for detecting the positions of the wafers in the wafer loading ports, and a transverse moving shaft module for driving the wafer transfer robot to reciprocate between the at least two groups of wafer loading ports, wherein the wafer mapping sensor is arranged on the wafer transfer robot;
the wafer detection unit is positioned at one side of the wafer transfer unit, the wafer transfer unit comprises a wafer adsorption carrier, an optical machine module which is positioned at the top of the wafer adsorption carrier and used for detecting and positioning the wafer, and a driving module which is positioned at the bottom of the wafer adsorption carrier and used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle.
In some embodiments: the wafer transfer unit further comprises a rectangular frame, an upper blanking port is arranged on the front face of the rectangular frame, the wafer loading port is fixed outside the rectangular frame and communicated with the upper blanking port, the transverse moving shaft module is located in the rectangular frame and fixedly connected with the back face of the rectangular frame, and the wafer transfer robot is connected with the transverse moving shaft module and is suspended in the rectangular frame.
In some embodiments: the wafer transfer unit further comprises a large-field camera alignment module for pre-positioning the wafer, the large-field camera alignment module is positioned at one side of the wafer transfer robot, and the large-field camera alignment module comprises:
the wafer edge finder is used for driving the wafer to move along the X axis and the Y axis and rotate to a set angle;
the large-view cameras are provided with two groups and are respectively positioned at two sides of the top of the wafer edge finder so as to respectively acquire the arc edge image information of the wafer;
and the controller is used for acquiring the arc edge image information to determine the deviation value of the wafer center position and the preset position, and transmitting the deviation value to the wafer edge finder.
In some embodiments: the device comprises a controller, a wafer edge finder camera, a wafer edge finder and a camera, wherein the controller is used for acquiring wafer characteristic image information, and the wafer edge finder camera is connected with the controller and used for acquiring the wafer characteristic image information and rotating the wafer to a set angle through the wafer edge finder.
In some embodiments: the large-view cameras are connected with large-view lenses, coaxial light sources for supplementing light towards the direction of the wafer edge finder are arranged at the front ends of the large-view lenses, and backlight sources for irradiating towards the back of the wafer and a reading port for scanning bar code information on the wafer are arranged on the wafer edge finder.
In some embodiments: the wafer detecting unit further comprises a bearing plate and a base arranged at the top of the bearing plate, a marble platform for fixing the driving module is arranged at the top of the base, a marble portal frame for fixing the optical machine module is arranged at the top of the marble platform, and a plurality of vibration reduction gas springs for elastically supporting the marble platform are arranged between the base and the marble platform.
In some embodiments: the optical machine module comprises a scanning camera and a rechecking camera for acquiring image information of the wafer and a distance measuring sensor for measuring the vertical distance between the scanning camera and the rechecking camera and the wafer, and is connected with a Z-axis linear module for adjusting the vertical distance between the optical machine module and the wafer.
In some embodiments: the driving module comprises an X-axis linear module for driving the wafer adsorption carrier to move along an X-axis linear direction, a Y-axis linear module for driving the wafer adsorption carrier to move along a Y-axis linear direction is arranged at the top of the X-axis linear module, a DD motor for driving the wafer adsorption carrier to rotate is arranged at the top of the Y-axis linear module, and the wafer adsorption carrier is fixed at the top of the DD motor.
In some embodiments: the wafer cleaning device is characterized by further comprising a shell for containing the round transfer unit and the wafer detection unit, wherein a fan filter unit and an alarm are arranged at the top of the shell, an ion wind rod for eliminating static electricity in the shell is arranged in the shell, and a plurality of access doors are arranged on the side wall of the shell.
In some embodiments: the front surface of the shell is provided with an operation interface for controlling the round transferring unit and the wafer detecting unit.
The beneficial effects that technical scheme that this application provided brought include:
the embodiment of the application provides large-size wafer appearance defect detection equipment, which is provided with a wafer transfer unit, wherein the wafer transfer unit comprises at least two groups of wafer loading ports which are arranged in parallel, a wafer transfer robot for taking and placing wafers in the wafer loading ports, a wafer mapping sensor for detecting the positions of the wafers in the wafer loading ports and a transverse moving shaft module for driving the wafer transfer robot to reciprocate between the at least two groups of wafer loading ports; the wafer detection unit is positioned at one side of the wafer transfer unit, the wafer transfer unit comprises a wafer adsorption carrier, an optical machine module which is positioned at the top of the wafer adsorption carrier and used for detecting and positioning the wafer, and a driving module which is positioned at the bottom of the wafer adsorption carrier and used for driving the wafer to move along the X axis and the Y axis and rotate to a set angle.
Therefore, the large-size wafer appearance defect detection equipment disclosed by the application adopts the mutual cooperation of the wafer transfer unit and the wafer detection unit to realize automatic transfer and automatic optical appearance detection of the wafer. The wafer loading port is used for taking, placing and storing the wafer box, and opening and closing the wafer box, so that the damage and pollution rate of the wafer are reduced. The wafer transfer robot is used for taking and placing the wafer in the wafer loading port, transferring the wafer to the wafer detection unit for detecting the defect of the wafer, and transferring the detected wafer to the wafer box. The wafer mapping sensor is used for scanning the positions and the number of the wafers in the wafer loading port and searching whether the wafer is obliquely inserted, overlapped and damaged. The transverse axis module is used for driving the wafer transfer robot to reciprocate between at least two groups of wafer loading ports so that the wafer transfer robot covers all the wafer loading ports and the grabbing efficiency of the wafer transfer robot is improved.
The wafer adsorption carrier is used for adsorbing the wafer transferred by the wafer transfer robot, and the optical machine module at the top of the wafer adsorption carrier is used for detecting and positioning the wafer and detecting the appearance defect of the surface of the wafer. The bottom of the wafer adsorption carrier is provided with a driving module for driving the wafer to move along the X axis and the Y axis and rotate to a set angle, the driving module is used for accurately positioning the wafer and detecting appearance defects on the surface of the wafer, and the driving module is used for driving the wafer to move along a set track so as to scan each detection area of the wafer. The full-process automatic transfer and automatic appearance defect detection of the wafer can be realized, and the wafer detection efficiency and the wafer detection quality are improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a perspective view of a structure of an embodiment of the present application;
FIG. 2 is a top view of the wafer transfer unit and the wafer inspection unit according to the embodiment of the present application;
fig. 3 is a front view illustrating the structures of a wafer transfer unit and a wafer inspection unit according to an embodiment of the present application;
fig. 4 is a perspective view illustrating the structures of a wafer transfer unit and a wafer inspection unit according to an embodiment of the present application;
FIG. 5 is a front view of a large-field-of-view camera alignment module according to an embodiment of the present disclosure;
fig. 6 is a top view of a large-view-field camera alignment module according to an embodiment of the disclosure.
Reference numerals:
1. a wafer load port; 2. a large-field camera alignment module; 3. an edge finder camera; 4. a marble platform; 5. a bearing plate; 6. an X-axis linear module; 7. a Y-axis linear module; 8. a DD motor; 9. a Z-axis straight line module; 10. a traversing shaft module; 11. a wafer transfer robot; 12. an optical machine module; 13. a vibration damping gas spring; 14. a wafer adsorption stage; 15. a gas tank; 16. a rectangular frame; 17. a housing; 18. a fan filter unit; 19. an alarm; 20. an operation interface; 21. an ion wind bar; 22. marble gantry; 23. a base; 24. a wafer edge finder; 25. a large field of view camera; 26. a large field lens; 27. a coaxial light source; 28. a backlight; 29. and reading the wharf.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.
The embodiment of the application provides large-size wafer appearance defect detection equipment, which can solve the problem that defects still exist due to the fact that defects are not found manually when a silicon wafer leaves a factory in a mode of manually detecting the surface defects of the silicon wafer in the related art, and the problem that the quality of leaving the factory is good and uneven.
Referring to fig. 2 to 4, an embodiment of the present application provides a large-sized wafer appearance defect detection apparatus, including:
the wafer transfer unit comprises at least two groups of wafer loading ports 1 which are arranged in parallel, wherein the wafer loading ports 1 are used for taking, placing and storing wafer boxes and opening and closing the wafer boxes. The wafer transfer robot 11 for picking and placing the wafer in the wafer load port 1 is preferably a double arm multi-degree of freedom robot. The wafer transfer robot 11 is provided with a wafer mapping sensor for detecting the position of the wafer in the wafer loading port 1, and a traverse shaft module 10 for driving the wafer transfer robot 11 to reciprocate between at least two sets of the wafer loading ports 1.
The wafer detection unit is located at one side of the wafer transfer unit, the wafer transfer unit comprises a wafer adsorption carrier 14, an optical machine module 12 located at the top of the wafer adsorption carrier 14 and used for detecting and positioning a wafer, and a driving module located at the bottom of the wafer adsorption carrier 14 and used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle. The wafer transfer robot 11 transfers the wafer taken out from the wafer loading port 1 to the wafer suction stage 14, and the optical module 12 performs appearance defect detection after precisely positioning the wafer on the wafer suction stage 14.
The large-size wafer appearance defect detection equipment adopts the wafer transfer unit and the wafer detection unit to mutually cooperate to realize automatic transfer of the wafer and automatic appearance defect detection. The wafer loading port 1 is used for taking, placing and storing wafer cassettes, and opening and closing the wafer cassettes, so that the damage and pollution rate of wafers are reduced. The wafer transfer robot 11 is used for picking and placing the wafer in the wafer loading port 1, transferring the wafer to the wafer detection unit to detect the defect of the wafer, and transferring the detected wafer to the wafer box.
The wafer map sensor is used to scan the positions and numbers of wafers in the wafer load port 1 and to find out whether there are wafer bevel, overlay, and breakage phenomena. The traverse shaft module 10 is used for driving the wafer transfer robot 11 to reciprocate between at least two groups of wafer loading ports 1, so that the wafer transfer robot 11 covers all the wafer loading ports 1, the traverse shaft module 10 traverses the wafer transfer robot 11 to the position of a picking port of a certain wafer loading port 1, and then the wafer transfer robot 11 picks up the wafer in the wafer loading port 1, so as to improve the picking efficiency of the wafer transfer robot 11 and the coverage area of the wafer.
The wafer adsorption stage 14 is used for adsorbing the wafer transferred by the wafer transfer robot 11, and the optical machine module 12 on the top of the wafer adsorption stage 14 is used for detecting and positioning the wafer and detecting the appearance defect of the surface of the wafer. The bottom of the wafer adsorption carrier 14 is provided with a driving module for driving the wafer to move along the X axis and the Y axis and rotate to a set angle, and the driving module is used for precisely positioning the wafer, detecting appearance defects on the surface of the wafer by matching with the optical machine module, and driving the wafer to move along a set track so as to scan each detection area of the wafer.
In some alternative embodiments: referring to fig. 2 to 4, the embodiment of the application provides a large-size wafer appearance defect detection device, and the wafer transfer unit of the detection device further includes a rectangular rack 16, where the rectangular rack 16 is formed by splicing and building aluminum profiles. The front surface of the rectangular frame 16 is provided with an upper and a lower feed ports, and the wafer loading port 1 is fixed outside the rectangular frame 16 and communicated with the upper and lower feed ports. The traversing axis module 10 is located in the rectangular frame 16 and fixedly connected with the back of the rectangular frame 16, and the wafer transfer robot 11 is connected with the traversing axis module 10 and suspended in the rectangular frame 16.
In some alternative embodiments: referring to fig. 5 to 6, an embodiment of the present application provides a large-sized wafer appearance defect detection apparatus, a wafer transfer unit of the detection apparatus further includes a large-field camera alignment module 2 for performing a predetermined positioning on a wafer, the large-field camera alignment module 2 is located at one side of the wafer transfer robot 11 and is fixedly connected with the rectangular frame 16, the wafer transfer robot 11 takes out a wafer in the wafer loading port 1 and sends the wafer to the large-field camera alignment module 2, the large-field camera alignment module 2 performs a predetermined positioning on the wafer, and the large-field camera alignment module 2 includes:
the wafer edge finder 24 is used for driving the wafer to move along the X axis and the Y axis and rotate to a set angle. The large-view cameras 25 are provided with two groups of large-view cameras 25 and are respectively positioned at two sides of the top of the wafer edge finder 24 so as to respectively collect the arc edge image information of the wafer, and the diameter and the center position of the wafer can be accurately determined by the arc edge image information collected by the two large-view cameras 25. And the controller is used for acquiring the arc edge image information to determine the deviation value of the wafer center position and the preset position, and sending the deviation value to the wafer edge finder 24, wherein the wafer edge finder 24 completes automatic correction and alignment of the wafer.
The large-field camera alignment module 2 further comprises an edge finder camera 3 for collecting wafer characteristic image information, the edge finder camera 3 is connected with a controller, the controller obtains the wafer characteristic image information, and the wafer is rotated to a set angle through the wafer edge finder 24 so as to keep the groove characteristic and the flat port characteristic on the wafer towards the set direction. The large-view cameras 25 are connected with a large-view lens 26, the front end of the large-view lens 26 is provided with a coaxial light source 27 for supplementing light towards the direction of the wafer edge finder 24, and the wafer edge finder 24 is provided with a backlight source 28 for irradiating towards the back of the wafer and a reading port 29 for scanning bar code information on the wafer.
The large-field lens 26 of the embodiment of the application is suitable for large-scale observation and measurement, and improves the efficiency of measurement. The coaxial light source 27 supplements the large-field camera 25 with light to assist the high-definition shooting of the large-field camera 25. The backlight 28 and the on-axis light source 27 are provided with a light source controller that controls the on-axis light source 27 and the backlight 28. The light source controller is used to adjust the light intensity and light source color of the coaxial light source 27 and the backlight 28 to highlight the edge profile of the wafer. The reading terminal 29 tracks the source information of each wafer, and can establish a traceability environment by printing bar codes or characters on the wafer and the label so as to meet the requirement of collecting the wafer information.
In some alternative embodiments: referring to fig. 2 to 4, the embodiment of the present application provides a large-sized wafer appearance defect detecting apparatus, the wafer detecting unit of the detecting apparatus further includes a bearing plate 5 and a base 23 located at the top of the bearing plate 5, a marble Dan Pingtai 4 for fixing a driving module is disposed at the top of the base 23, a marble gantry 22 for fixing an optical-mechanical module 12 is disposed at the top of the marble platform 4, a plurality of vibration-damping gas springs 13 for elastically supporting the marble platform 4 are disposed between the base 23 and the marble platform 4, and a gas tank 15 for inflating the plurality of vibration-damping gas springs 13 is disposed in the base 23.
Marble platform 4 and marble platform 4 all adopt marble preparation, and marble has better structural stability, and difficult deformation and stress deformation for long-term use provide high accuracy table surface for optical machine module 12 and drive module. The vibration-damping gas spring 13 is used for isolating external vibration, eliminating the influence of external environment vibration on the wafer detection by the optical engine module 12 and the driving module, and improving the reliability and the detection precision of the wafer appearance defect detection.
In some alternative embodiments: referring to fig. 2 to 4, an embodiment of the present application provides a large-sized wafer appearance defect detecting apparatus, in which an optical-mechanical module 12 of the detecting apparatus includes a scan camera and a review camera for acquiring image information of a wafer, and a ranging sensor for measuring a vertical distance between the scan camera and the review camera and the wafer. The optical mechanical module 12 is connected with a Z-axis linear module 9,Z axis linear module 9 for adjusting the vertical distance between the optical mechanical module 12 and the wafer, and the Z-axis linear module 9 is used for realizing functions of focusing the scanning camera and the recheck camera with the focus of the wafer, so that the scanning camera and the recheck camera are at the optimal focusing height.
The driving module comprises an X-axis linear module 6 for driving the wafer adsorption carrier 14 to move along an X-axis linear direction, a Y-axis linear module 7 positioned at the top of the X-axis linear module 6 and used for driving the wafer adsorption carrier 14 to move along a Y-axis linear direction, a DD motor 8 positioned at the top of the Y-axis linear module 7 and used for driving the wafer adsorption carrier 14 to rotate, and the wafer adsorption carrier 14 is fixed at the top of the DD motor 8. The X-axis linear module 6, the Y-axis linear module 7 and the DD motor 8 are used for driving the wafer adsorption stage 14 to move along the X-axis linear motion, the Y-axis linear motion and the rotational motion according to the set defect detection tracks, respectively. The stroke of the X-axis linear module 6 is 450mm and is used for coping with the high-speed motion state of the scanning camera, the stroke of the Y-axis linear module 7 is 500mm and is used for coping with the line feed motion state of the scanning camera, and the DD motor 8 is used for correcting the wafer corner positions.
In some alternative embodiments: referring to fig. 1, the embodiment of the application provides a large-size wafer appearance defect detection device, which further comprises a housing 17 for accommodating the wafer transfer unit and the wafer detection unit, wherein a fan filter unit 18 and an alarm 19 are arranged at the top of the housing 17, an ion wind rod 21 for eliminating static electricity in the housing is arranged in the housing 17, and a plurality of access doors are arranged on the side wall of the housing 17. An operation interface 20 for controlling the wafer transfer unit and the wafer inspection unit is provided on the front surface of the casing 17.
Principle of operation
The embodiment of the application provides a large-size wafer appearance defect detection device, wherein the large-size wafer appearance defect detection device is provided with a wafer transfer unit, the wafer transfer unit comprises at least two groups of wafer loading ports 1 which are arranged in parallel, a wafer transfer robot 11 for taking and placing wafers in the wafer loading ports 1, a wafer mapping sensor for detecting the positions of the wafers in the wafer loading ports 1 and a transverse moving shaft module 10 for driving the wafer transfer robot 11 to reciprocate between the at least two groups of wafer loading ports 1 are arranged on the wafer transfer robot 11; the wafer detection unit is located at one side of the wafer transfer unit, the wafer transfer unit comprises a wafer adsorption carrier 14, an optical machine module 12 located at the top of the wafer adsorption carrier 14 and used for detecting and positioning a wafer, and a driving module located at the bottom of the wafer adsorption carrier 14 and used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle.
Therefore, the large-size wafer appearance defect detection equipment disclosed by the application adopts the mutual cooperation of the wafer transfer unit and the wafer detection unit to realize automatic transfer and automatic optical appearance detection of the wafer. The wafer loading port 1 is used for taking, placing and storing wafer cassettes, and opening and closing the wafer cassettes, so that the damage and pollution rate of wafers are reduced. The wafer transfer robot 11 is used for picking and placing the wafer in the wafer loading port 1, transferring the wafer to the wafer detection unit to detect the defect of the wafer, and transferring the detected wafer to the wafer box. The wafer map sensor is used to scan the positions and numbers of wafers in the wafer load port 1 and to find out whether there are wafer bevel, overlay, and breakage phenomena. The traverse shaft module 10 is used for driving the wafer transfer robot 11 to reciprocate between at least two groups of wafer loading ports 1, so that the wafer transfer robot 11 covers all the wafer loading ports 1, and the grabbing efficiency of the wafer transfer robot 11 is improved.
The wafer adsorption stage 14 is used for adsorbing the wafer transferred by the wafer transfer robot 11, and the optical machine module 12 on the top of the wafer adsorption stage 14 is used for detecting and positioning the wafer and detecting the appearance defect of the surface of the wafer. The bottom of the wafer adsorption carrier 14 is provided with a driving module for driving the wafer to move along the X axis and the Y axis and rotate to a set angle, and the driving module is used for precisely positioning the wafer, detecting appearance defects on the surface of the wafer in cooperation with the optical machine module 12, and driving the wafer to move along a set track so as to scan each detection area of the wafer. The full-process automatic transfer and automatic appearance defect detection of the wafer can be realized, and the wafer detection efficiency and the wafer detection quality are improved.
In the description of the present application, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of description of the present application and simplification of the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present application. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
It should be noted that in this application, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely a specific embodiment of the application to enable one skilled in the art to understand or practice the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A large-size wafer appearance defect detecting apparatus, comprising:
the wafer transfer unit comprises at least two groups of wafer loading ports (1) which are arranged in parallel, a wafer transfer robot (11) for taking and placing wafers in the wafer loading ports (1), a wafer mapping sensor for detecting the positions of the wafers in the wafer loading ports (1) and a transverse moving shaft module (10) for driving the wafer transfer robot (11) to reciprocate between the at least two groups of wafer loading ports (1) are arranged on the wafer transfer robot (11);
the wafer detection unit is located at one side of the wafer transfer unit, the wafer transfer unit comprises a wafer adsorption carrier (14), an optical machine module (12) which is located at the top of the wafer adsorption carrier (14) and used for detecting and positioning a wafer, and a driving module which is located at the bottom of the wafer adsorption carrier (14) and used for driving the wafer to move along an X axis and a Y axis and rotate to a set angle.
2. A large-sized wafer appearance defect detecting apparatus as set forth in claim 1, wherein:
the wafer transfer unit further comprises a rectangular frame (16), an upper feed opening and a lower feed opening are formed in the front face of the rectangular frame (16), the wafer loading port (1) is fixed outside the rectangular frame (16) and is communicated with the upper feed opening and the lower feed opening, the transverse moving shaft module (10) is located in the rectangular frame (16) and is fixedly connected with the back face of the rectangular frame (16), and the wafer transfer robot (11) is connected with the transverse moving shaft module (10) and is suspended in the rectangular frame (16).
3. A large-sized wafer appearance defect detecting apparatus according to claim 1 or 2, wherein:
the wafer transfer unit further comprises a large-field camera alignment module (2) for pre-positioning the wafer, the large-field camera alignment module (2) is located at one side of the wafer transfer robot (11), and the large-field camera alignment module (2) comprises:
the wafer edge finder (24), the said wafer edge finder (24) is used for driving the wafer to move along X axis, Y axis and rotate to the settlement angle;
the large-view cameras (25) are provided with two groups and are respectively positioned at two sides of the top of the wafer edge finder (24) so as to respectively acquire the arc edge image information of the wafer;
and the controller is used for acquiring the arc edge image information to determine the deviation value of the wafer center position and the preset position, and transmitting the deviation value to the wafer edge finder (24).
4. A large-sized wafer appearance defect detecting apparatus as claimed in claim 3, wherein:
the wafer edge finder camera (3) is used for collecting wafer characteristic image information, the edge finder camera (3) is connected with a controller, and the controller acquires the wafer characteristic image information and rotates the wafer to a set angle through the wafer edge finder (24).
5. A large-sized wafer appearance defect detecting apparatus as claimed in claim 3, wherein:
the large-view camera (25) is connected with a large-view lens (26), the front end of the large-view lens (26) is provided with a coaxial light source (27) for supplementing light towards the direction of the wafer edge finder (24), and the wafer edge finder (24) is provided with a backlight source (28) for irradiating towards the back of the wafer and a reading port (29) for scanning bar code information on the wafer.
6. A large-sized wafer appearance defect detecting apparatus as set forth in claim 1, wherein:
the wafer detection unit further comprises a bearing plate (5) and a base (23) positioned at the top of the bearing plate (5), a marble platform (4) of a fixed driving module is arranged at the top of the base (23), a marble gantry (22) of a fixed optical machine module (12) is arranged at the top of the marble platform (4), and a plurality of vibration reduction gas springs (13) for elastically supporting the marble platform (4) are arranged between the base (23) and the marble platform (4).
7. A large-sized wafer appearance defect detecting apparatus according to claim 1 or 6, wherein:
the optical machine module (12) comprises a scanning camera and a rechecking camera for acquiring image information of the wafer and a distance measuring sensor for measuring the vertical distance between the scanning camera and the rechecking camera and the wafer, and the optical machine module (12) is connected with a Z-axis linear module (9) for adjusting the vertical distance between the optical machine module (12) and the wafer.
8. A large-sized wafer appearance defect detecting apparatus according to claim 1 or 6, wherein:
the driving module comprises an X-axis linear module (6) for driving the wafer adsorption carrier (14) to linearly move along an X axis, a Y-axis linear module (7) for driving the wafer adsorption carrier (14) to linearly move along a Y axis is arranged at the top of the X-axis linear module (6), a DD motor (8) for driving the wafer adsorption carrier (14) to rotate is arranged at the top of the Y-axis linear module (7), and the wafer adsorption carrier (14) is fixed at the top of the DD motor (8).
9. A large-sized wafer appearance defect detecting apparatus as set forth in claim 1, wherein:
the wafer cleaning device is characterized by further comprising a shell (17) for containing the round transfer unit and the wafer detection unit, wherein a fan filter unit (18) and an alarm (19) are arranged at the top of the shell (17), an ion wind rod (21) for eliminating static electricity in the shell (17) is arranged in the shell (17), and a plurality of access doors are arranged on the side wall of the shell (17).
10. A large-sized wafer appearance defect detecting apparatus as in claim 9, wherein:
an operation interface (20) for controlling the wafer transfer unit and the wafer detection unit is arranged on the front surface of the shell (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310057402.4A CN116008303A (en) | 2023-01-16 | 2023-01-16 | Large-size wafer appearance defect detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310057402.4A CN116008303A (en) | 2023-01-16 | 2023-01-16 | Large-size wafer appearance defect detection equipment |
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| CN116008303A true CN116008303A (en) | 2023-04-25 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117825280A (en) * | 2024-03-05 | 2024-04-05 | 宁德时代新能源科技股份有限公司 | Appearance detection system and battery production line |
| CN118189817A (en) * | 2024-05-14 | 2024-06-14 | 无锡迪渊特科技有限公司 | Wafer packing carton size short-term test equipment |
| CN118329777A (en) * | 2024-06-11 | 2024-07-12 | 深圳市华拓半导体技术有限公司 | Method and device for detecting surface defects of bare wafer, terminal equipment and storage medium |
-
2023
- 2023-01-16 CN CN202310057402.4A patent/CN116008303A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117825280A (en) * | 2024-03-05 | 2024-04-05 | 宁德时代新能源科技股份有限公司 | Appearance detection system and battery production line |
| CN118189817A (en) * | 2024-05-14 | 2024-06-14 | 无锡迪渊特科技有限公司 | Wafer packing carton size short-term test equipment |
| CN118189817B (en) * | 2024-05-14 | 2024-08-20 | 无锡迪渊特科技有限公司 | Wafer packing carton size short-term test equipment |
| CN118329777A (en) * | 2024-06-11 | 2024-07-12 | 深圳市华拓半导体技术有限公司 | Method and device for detecting surface defects of bare wafer, terminal equipment and storage medium |
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