CN219850870U

CN219850870U - Detection device

Info

Publication number: CN219850870U
Application number: CN202320393117.5U
Authority: CN
Inventors: 杨乐; 郑洪宝; 翁水才; 谢周阳; 周世超
Original assignee: Hangzhou Changchuan Technology Co Ltd
Current assignee: Hangzhou Changchuan Technology Co Ltd
Priority date: 2023-03-01
Filing date: 2023-03-01
Publication date: 2023-10-20
Anticipated expiration: 2033-03-01

Abstract

The application relates to the technical field of semiconductor detection, and provides a detection device. The detection device comprises a detection platform and a pickup module, wherein the detection platform is provided with a material receiving station, a material feeding station, an adjusting station and a detection station which are arranged at intervals along a first direction, and the stations together define a first flow path; the detection station is divided into a ballast sub-station, a first detection sub-station and a second detection sub-station which are distributed at intervals along the second direction, and a second flow path is defined together; the pick-up module can circulate among the feeding station, the adjusting station, the detecting station and the receiving station along the first circulation path. That is, the detection device is arranged at an angle through the first flow path and the second flow path, which is equivalent to transferring part of the space along the horizontal transverse direction to the horizontal longitudinal direction, so that the space occupied along the horizontal transverse direction is reduced; when the pick-up module moves along the first flow path, the moving stroke is shortened, and the use stability of the pick-up module is improved.

Description

Detection device

Technical Field

The application relates to the technical field of semiconductor detection, in particular to a detection device.

Background

At present, the automatic focusing motor adopted by the intelligent camera is mainly divided into three types: stepping motor, ultrasonic motor, voice coil motor is the mainstream at present with its simple structure, characteristics such as small. The important parts in the voice coil motor are mainly processed through the photoetching technology of a metal plate. On average, there are 500 voice coil motor springs on a metal plate, each with defects, dimples, chemical residues, Z-waves, etc. Therefore, quality inspection of each voice coil motor spring is required during the manufacturing process. However, the existing device for detecting the quality of the voice coil motor spring is loose in structural distribution corresponding to each procedure, so that the whole occupied space is large, and the stroke of the corresponding manipulator is also large.

Disclosure of Invention

Based on this, it is necessary to provide a detecting device capable of transferring a part of the space in the horizontal lateral direction to the horizontal longitudinal direction while satisfying the detection of the semiconductor element, reducing the length and making the structure more compact.

A detection device comprises a detection platform and a pickup module; the detection platform is provided with a material receiving station, a material feeding station, an adjusting station and a detection station which are arranged at intervals along a first direction, and the material receiving station, the material feeding station, the adjusting station and the detection station jointly define a first flow path; the pick-up module can circulate among the feeding station, the adjusting station, the detecting station and the receiving station along the first circulation path; the detection station is divided into a ballast sub-station, a first detection sub-station and a second detection sub-station which are distributed at intervals along a second direction, the ballast sub-station, the first detection sub-station and the second detection sub-station jointly define a second flow path, and the ballast sub-station is positioned at the intersection of the second flow path and the first flow path; the first direction and the second direction are arranged at an angle.

The detection device transfers part of the space along the first direction to the space along the second direction when the defect detection of the semiconductor element is met through the angled arrangement of the first flow path and the second flow path, so that the space occupied by the detection device along the first direction is reduced. Therefore, the travel of the first pickup module along the first direction is correspondingly reduced, and the moving travel of each pickup module is further reduced by matching with the arrangement of the second pickup module.

In one embodiment, along the first flow path, the adjustment station is located between the feeding station and the detection station, and the receiving station is located upstream of the feeding station; and/or a first dust removing station for installing a first dust removing component is arranged between the adjusting station and the detecting station, and a second dust removing station for installing a second dust removing component is arranged at the downstream of the detecting station, which is away from the adjusting station; one of the first dust removing station and the second dust removing station is used for cleaning the upper surface of the semiconductor element, and the other is used for cleaning the lower surface of the semiconductor element.

In one embodiment, the first dust removing component and the second dust removing component are staggered along a third direction, the first dust removing component is used for cleaning the lower surface of the semiconductor element, and the second dust removing component is used for cleaning the upper surface of the semiconductor element; the third direction, the first direction and the second direction are arranged in pairs at an angle; the first dust removing assembly and the second dust removing assembly comprise air knives, ion air bars and an integrated base, wherein the air knives and the ion air bars are staggered along a first direction and are integrally installed on the integrated base; the second dust removal assembly further comprises a second linear module and a movable guide support, the second linear module and the movable guide support are arranged at intervals along a second direction, one end of an integrated base in the second dust removal assembly is connected with the second linear module, the other end of the integrated base is connected with the movable guide support in a sliding manner, and the integrated base can reciprocate along a first direction under the action of the second linear module.

In one embodiment, the detection device further comprises a support beam having a length extending in a first direction; the picking module comprises a first picking module and a second picking module, wherein the first picking module and the second picking module are both connected to the supporting beam in a sliding manner and can move along the length direction of the supporting beam; the first pick-up module can circulate among the feeding station, the adjusting station, the detecting station and the receiving station along the first circulation path, and the second pick-up module can circulate relative to the receiving station along the first circulation path.

In one embodiment, the first pick-up module includes a voltage amplifier and an electrostatic platform, the electrostatic platform is slidably connected to the supporting beam and is electrically connected to the voltage amplifier, and the voltage amplifier can regulate and control the electrostatic voltage of the electrostatic platform; and/or the second pickup module comprises a plurality of absorption parts and a power source, wherein the power source is communicated with each absorption part, and each absorption part is arranged at intervals along the first direction and the second direction.

In one embodiment, the first pick-up module further includes a static table frame and a first lifting mechanism, the static table frame is connected to a power output end of the first lifting mechanism, the first lifting mechanism is used for being slidably connected with the supporting beam, and the static platform is mounted on the static table frame; and/or the second picking module further comprises an adsorption frame and a second lifting mechanism, wherein the adsorption frame is connected to the power output end of the second lifting mechanism, the second lifting mechanism is used for being in sliding connection with the supporting cross beam, and a plurality of adsorption pieces are arranged on the adsorption frame at intervals.

In one embodiment, the detection device further comprises an adjustment platform, the adjustment platform being disposed at the adjustment station: the adjusting platform comprises a rotating mechanism, a translation mechanism and an adjusting panel, wherein the rotating mechanism is connected to the bottom of the adjusting panel, and the translation mechanism is connected with the rotating mechanism; the translation mechanism is used for driving the adjustment panel to move along the second direction through the rotation mechanism, and the rotation mechanism is used for driving the adjustment panel to rotate around the central axis of the adjustment panel.

In one embodiment, the detection device further includes a first detection module set disposed at the first detection sub-station, a second detection module set disposed at the second detection sub-station, and a detection carrier plate disposed at the ballast sub-station, where the first detection module set and the second detection module set are respectively located at two sides of the detection carrier plate in a thickness direction, and the detection carrier plate is used for carrying the semiconductor element; the first detection module and the second detection module comprise a light source, a reflecting mirror and a detection camera, and the detection camera is configured to respond to the reflection of the reflecting mirror on materials based on the light source so as to obtain detection images of the semiconductor element.

In one embodiment, the detection device further comprises a capping mechanism arranged at the ballast station, the capping mechanism is provided with a capping carrier plate used for being pressed above the detection carrier plate, and the capping carrier plate and the detection carrier plate are used for clamping the semiconductor element together; the gland carrier plate can move relative to the detection carrier plate along a second direction and a third direction; and/or, the detection device further comprises a pressing mechanism arranged at the ballast station, and the pressing mechanism is used for pressing the semiconductor element to the detection carrier plate.

In one embodiment, the pressing mechanism comprises an integrated board and a plurality of pressing arms, the pressing arms are arranged at intervals along the second direction and are connected to the integrated board, and the integrated board can move along the first direction and the third direction so as to drive the pressing arms to synchronously move; the plurality of pressing arms are used for pressing the semiconductor element; the gland mechanism further comprises a driving source, a driving rack and a driven rack, the driving source is connected with the driving gear in a transmission mode, the driving gear is in meshed transmission with the driven rack, the driven rack is connected with the gland carrier plate, and the length of the driven rack extends along a third direction.

In one embodiment, the detection device further comprises a visual positioning module, the visual positioning module comprises a positioning camera, an adjusting sliding table and a visual support, one end of the visual support is suspended above the feeding station, the adjusting sliding table is mounted at the suspending end of the visual support, and the positioning camera is mounted at the adjusting sliding table; the adjusting sliding table can rotate around the Z axis and the Y axis relatively to the vision support so as to drive the positioning camera to synchronously rotate, and the adjusting sliding table can drive the positioning camera to respectively move along the Z axis and the X axis.

In one embodiment, the adjusting sliding table comprises a reference block, a first adjusting block and a second adjusting block; the first adjusting block comprises a first connecting arm and a second connecting arm which are arranged at an angle and connected, the first connecting arm is connected with the reference block, the second connecting arm is positioned at one side of the reference block, which is away from the vision bracket, and is connected with the second adjusting block, and the second adjusting block is connected with the positioning camera; the first adjusting block can rotate around the Z axis relative to the reference block, and the second adjusting block can rotate around the Y axis relative to the second connecting arm.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present application, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following descriptions are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

FIG. 1 is a schematic diagram of a detection device according to the present application;

FIG. 2 is a schematic view of a tray in the detection device provided in FIG. 1;

FIG. 3 is a schematic view of a first pick-up module in the inspection apparatus provided in FIG. 1;

FIG. 4 is a schematic diagram of a second pick-up module in the inspection apparatus provided in FIG. 1;

FIG. 5 is a schematic diagram of a visual positioning module in the detecting device provided in FIG. 1;

FIG. 6 is a first schematic view of an adjustment platform in the detection apparatus provided in FIG. 1;

FIG. 7 is a second schematic view of the adjustment platform of the detection apparatus provided in FIG. 1;

FIG. 8 is a schematic view of a dust removal station in the detection device provided in FIG. 1;

FIG. 9 is a schematic diagram of the pressing mechanism of the detecting device provided in FIG. 1 cooperating with the detecting carrier plate;

FIG. 10 is a first partial schematic view of the inspection apparatus provided in FIG. 1 at an inspection station;

FIG. 11 is a second partial schematic view of the inspection apparatus provided in FIG. 1 at an inspection station;

FIG. 12 is a third partial schematic view of the inspection apparatus provided in FIG. 1 at an inspection station;

FIG. 13 is a fourth partial schematic view of the inspection apparatus provided in FIG. 1 at an inspection station;

fig. 14 is a fifth partial schematic view of the inspection apparatus provided in fig. 1 at an inspection station.

Reference numerals: 2001. a material receiving station; 2002. a feeding station; 2003. a waste station; 2004. adjusting a station; 2005. detecting a station; 2051. a ballast station; 2052. a first detection sub-station; 2053. a second detection sub-station; 2006. a first dust removal station; 2007. a second dust removal station; 101. a first detection module; 102. a second detection module; 120. a support beam; 11. a light source; 12. a reflecting mirror; 13. detecting a camera; 200. a detection platform; 2010. a detection window; 210. detecting a carrier plate; 31. a first linear module; 32. a moving guide rail; 312. a first toothed plate; 313. a link driving mechanism; 331. a second toothed plate; 3131. a toothed plate cylinder; 3132. a connecting block; 3133. a connecting rod; 3134. a pushing plate; 40. a capping mechanism; 41. pressing the carrier plate; 42. a gland base; 43. a gland bracket; 44. a driving source; 45. a drive gear; 46. a passive rack; 47. a spring; 50. a material tray; 51. a material receiving disc; 52. a waste tray; 53. a feed tray; 501. avoidance holes; 54. a positioning piece; 61. a first pick-up module; 611. an electrostatic stage frame; 612. a voltage amplifier; 613. an electrostatic platform; 614. a paper ejection cylinder; 62. a second pick-up module; 621. an adsorption frame; 622. an absorbing member; 63. a lifting mechanism; 64. assembling a beam; 65. a sliding seat; 601. a cross frame beam; 602. a longitudinal frame beam; 603. a sheet metal bending part; 70. a visual positioning module; 71. positioning a camera; 73. a visual support; 74. adjusting the sliding table; 741. a reference block; 742. a first adjustment block; 743. a second adjustment block; 7421. a first arcuate aperture; 7431. a second arcuate aperture; 80. adjusting a platform; 81. a rotation mechanism; 82. a translation mechanism; 83. an adjustment panel; 84. a support plate; 85. a sliding support block; 86. sliding the support rail; 811. a rotating electric machine; 812. rotating the driving wheel; 813. rotating the driven wheel; 814. rotating the synchronous belt; 821. a translation motor; 822. a first synchronization band set; 823. a second set of synchronized bands; 824. joining the substrates; 8221. a first drive wheel; 8222. a first driven wheel; 8223. a first belt; 8231. a second driving wheel; 8232. a second driven wheel; 8233. a second timing belt; 90. a dust removing mechanism; 91. a first dust removal assembly; 92. a second dust removal assembly; 93. an integrated base; 9011. an air knife; 9012. an ion wind bar; 921. a second linear module; 922. a suspension arm; 923. moving the guide bracket; 130. a pressing mechanism; 1301. an integrated board; 1302. pressing down the arm; 1303. a first cylinder; 1304. pressing down the supporting plate; 1305. and a second cylinder.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and the like are used in the description of the present application for the purpose of illustration only and do not represent the only embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through intermedial media. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used in the description of the present application includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, an embodiment of the present application provides a detection apparatus, including a detection platform 200 and a pickup module; the detection platform 200 is provided with a receiving station 2001, a feeding station 2002, an adjusting station 2004 and a detection station 2005 which are arranged at intervals along a first direction, and the receiving station 2001, the feeding station 2002, the adjusting station 2004 and the detection station 2005 jointly define a first flow path; wherein the detection station 2005 is divided into a ballast sub-station 2051 (shown in fig. 13), a first detection sub-station 2052 (shown in fig. 13) and a second detection sub-station 2053 (shown in fig. 13) which are distributed at intervals along the second direction, the ballast sub-station 2051, the first detection sub-station 2052 and the second detection sub-station 2053 jointly define a second flow path, and the ballast sub-station 2051 is located at the intersection of the second flow path and the first flow path; the first direction and the second direction are arranged at an angle.

The first direction is used as a horizontal transverse direction, the second direction is used as a horizontal longitudinal direction, and the first direction is perpendicular to the second direction. Thus, the first flow path is in the horizontal transverse direction and the second flow path is in the horizontal longitudinal direction.

Specifically, after the semiconductor element to be detected is transferred to the feeding station 2002, the first pick-up module 61 can drive the semiconductor element to be carried to the adjusting station 2004 so as to adjust and compensate the position of the semiconductor element, thereby meeting the requirement of detecting the position; the first pick-up module 61 then drives the adjusted semiconductor device to move to the inspection station 2005 for defect inspection of the semiconductor device. In the inspection, the semiconductor element is first placed in the ballast station 2051, and is driven to move along the second flow path by the ballast station 2051, and then the defect inspection is performed by the first inspection station 2052 and the second inspection station 2053. After the inspection, the first pick-up module 61 again drives the semiconductor device to be carried from the ballast station 2051 to the material receiving station 2001 for storage.

Because of the precision requirements of semiconductor elements, dust-free paper needs to be placed between any two adjacent semiconductor elements that are stacked to improve the protection. Thus, the pick-up module comprises a first pick-up module 61 and a second pick-up module 62, the first pick-up module 61 being capable of flowing along a first flow path between the feeding station 2002, the adjusting station 2004, the detecting station 2005 and the receiving station 2001; the second pick-up module 62 can circulate along the first circulation path relative to the receiving station 2001; the second pick-up module 62 is capable of picking up the dust-free paper before the semiconductor device is transferred to the receiving station 2001, and moving the dust-free paper to the receiving station 2001.

The second pick-up module 62 may pick up the dust-free paper from the feeding station 2002 or from another position, as long as it can ensure that the dust-free paper is placed between any two adjacent semiconductor elements at the receiving station 2001.

As can be seen from the foregoing, the detection device provided in this embodiment, through the angled arrangement of the first flow path and the second flow path, is equivalent to transferring a part of space along the horizontal transverse direction to the horizontal longitudinal direction while satisfying the defect detection of the semiconductor element, so as to reduce the space occupied by the detection device along the horizontal transverse direction. Thus, when the first pick-up module 61 moves along the first flow path, the moving stroke is reduced, and the use stability of the first pick-up module 61 is improved. Meanwhile, the whole detection process is divided into two moving strokes by utilizing the cooperation of the first pickup module 61 and the second pickup module 62, so that the moving stroke of the single first pickup module 61 is further reduced.

The inspection apparatus according to the present application will be described in detail below in terms of the entire inspection process of semiconductor devices.

Referring to fig. 1 and 2, in some embodiments, a scrap station 2003 is disposed along the first flow path between the receiving station 2001 and the loading station 2002 to facilitate storage of semiconductor devices that are defective after inspection. In actual use, the detection means comprises a plurality of trays 50 arranged at intervals, at least one of the plurality of trays 50 being located at a receiving station 2001 and being referred to as receiving tray 51, at least one other being located at a waste station 2003 and being referred to as waste tray 52, and at least one further being located at a loading station 2002 and being referred to as feeding tray 53. The feeding tray 53 is used for placing semiconductor elements to be detected, the receiving tray 51 is used for placing qualified semiconductor elements after detection, and the waste tray 52 is used for placing unqualified semiconductor elements after detection.

Further, two opposite guide rails are arranged at the positions of the material receiving station 2001, the material feeding station 2002 and the waste material station 2003 at intervals so as to facilitate the corresponding material trays 50 to slide in or slide out along the corresponding guide rails; meanwhile, a handle is arranged at the tail of each tray 50, so that the trays 50 can be replaced manually.

Still further, each tray 50 is configured with a relief hole 501. The detecting device further comprises a positioning piece 54, a part of the positioning piece 54 can penetrate through the avoiding hole 501 to extend into the tray 50, and the positioning piece 54 can push the semiconductor element to move in the tray 50 under the action of external force driving so as to ensure that the semiconductor element is in place. Specifically, each tray 50 is rectangular, and at least one long side and at least one short side are provided with avoiding holes 501, and the avoiding holes 501 penetrate along the depth of the tray 50. The positioning member 54 is installed at the bottom of the tray 50 and partially extends from the escape hole 501 from bottom to top to satisfy the positioning of the semiconductor device. The positioning piece 54 can be lifted up and down in the vertical direction and can be linearly moved in the horizontal direction so as to meet the positioning of semiconductor elements of different specifications. Wherein the movement of the positioning member 54 is mainly achieved by a linear cylinder drive.

As shown in fig. 1, in some embodiments, a supporting beam 120 with a length extending along the first direction is further disposed on the inspection platform 200, and the first pick-up module 61 and the second pick-up module 62 are disposed at intervals and are both slidingly connected to the supporting beam 120, and can both move along the length direction (i.e. the first direction) of the supporting beam 120, so as to meet the handling of the semiconductor element and the dust-free paper. To avoid interference between the two handling operations, the first pick-up module 61 is disposed close to the feeding tray 53, and the second pick-up module 62 is disposed close to the receiving tray 51.

It should be noted that the structure of the supporting beam 120 is a mature technology, and is not an improvement point of the present application, so that the description is omitted.

Because the thickness of the semiconductor element to be absorbed is small and the overall size is large, special attention is paid to stability in the process of carrying, so that the semiconductor element is prevented from falling off in the process of carrying, and the protection of the semiconductor element is improved. Based on this, as shown in fig. 1 and 3, in some embodiments, the first pick-up module 61 includes a static platform frame 611, a voltage amplifier 612 and a static platform 613, the static platform frame 611 is slidably connected to the supporting beam 120, the static platform 613 is mounted on the static platform frame 611, and the static platform 613 is electrically connected to the voltage amplifier 612, and the voltage amplifier 612 can regulate the static voltage of the static platform 613.

That is, the electrostatic adsorption method is used to convey the semiconductor device. Since the projection area of the electrostatic stage 613 in the vertical direction is large, it can be substantially adapted to the size of the semiconductor element; therefore, the semiconductor element can form an entire contact state with the semiconductor element during adsorption, and the contact area between the semiconductor element and the semiconductor element is increased, so that stable adsorption of the semiconductor element is met, and the falling risk is prevented.

Further, since the semiconductor element and the dust-free paper are placed across each other, a paper ejection cylinder 614 is also mounted on the electrostatic stage frame 611, and the driving end of the paper ejection cylinder 614 can pass through the electrostatic stage 613 to press against the dust-free paper, so as to prevent the dust-free paper located in the collecting tray 51 from adhering to the semiconductor element or the electrostatic stage 613. Wherein, the electrostatic platform 613 is correspondingly provided with a through hole for the driving end of the paper ejection cylinder 614 to pass through, and the position of the through hole is matched with the position of the paper ejection cylinder 614; a gap is formed between the electrostatic stage frame 611 and the electrostatic stage 613 on the side facing away from the suction side. When the drive end of the top paper cylinder 614 does not need to press against the dust-free paper, it can retract within the gap or be flush with the electrostatic stage 613. The projection surface dimension of the electrostatic stage 613 in the vertical direction is larger than the planar dimension of the semiconductor element. In this way, the suction with the entire surface of the semiconductor element is ensured, and the suction is formed with the operation of the top paper cylinder 614. Wherein the number of top paper cylinders 614 is plural and spaced apart.

Meanwhile, because the dust-free paper is used for protecting the semiconductor element, the plane size of the dust-free paper is larger than that of the semiconductor element, so that the dust-free paper is not easy to transport, and the risk of a tray exists more easily. Based on this, as shown in fig. 1 and 4, the second pick-up module 62 includes an adsorption frame 621, a plurality of adsorption members 622, and a power source, the adsorption frame 621 is slidably connected to the support beam 120, and the plurality of adsorption members 622 are arranged at intervals on the adsorption frame 621 and are connected to the power source. Wherein, the power source is the structure that is used for realizing negative pressure vacuum.

Thus, the plurality of adsorbing members 622 are arranged at intervals to meet the requirement of a larger adsorption area, and the plurality of adsorbing members 622 are fixed at multiple points, so that the adsorption effect on the dust-free paper is improved on the basis of meeting the planar size of the dust-free paper. In one embodiment, the adsorbing member 622 employs a Bernoulli chuck to perform the adsorption of the dust-free paper in a non-contact manner, thereby facilitating the soft grasping of the dust-free paper and minimizing the contact with the dust-free paper.

The specific working principle of the Bernoulli sucker is the prior art, and the Bernoulli sucker does not belong to the application point of the application, so that the Bernoulli sucker is not repeated.

In summary, as shown in fig. 3 and 4, the first pick-up module 61 and the second pick-up module 62 need to be lifted in the vertical direction to satisfy the suction operation of the electrostatic stage 613 and the suction member 622. Therefore, the first pick-up module 61 and the second pick-up module 62 each have a lifting mechanism 63, which is a first lifting mechanism and a second lifting mechanism, and the two lifting mechanisms 63 adopt a linear cylinder or other linear driving modules to connect with the corresponding electrostatic stage frame 611 or the adsorption frame 621 through the follow-up sliding block.

Further, in order to improve the assembly quality, an L-shaped assembly beam 64 is fixed between the electrostatic stage frame 611 and the corresponding slider, an L-shaped assembly beam 64 is also fixed between the suction frame 621 and the corresponding slider, the two assembly beams 64 have substantially the same structure, and a buffer is further mounted on the assembly beam 64. Meanwhile, the first elevating mechanism and the second elevating mechanism are respectively installed with sliding seats 65 for cooperation with the support beams 120 at sides facing away from the respective assembly beams 64.

Still further, the electrostatic stage frame 611 and the suction frame 621 are substantially identical, each including a cross frame beam 601 and a longitudinal frame beam 602, both being vertically disposed; the length of the longitudinal frame beam 602 is smaller than that of the transverse frame beam 601, and the longitudinal frame beam 602 is fixedly arranged at the bottom of the transverse frame beam 601.

In the electrostatic stage frame 611, the number of the longitudinal frame beams 602 and the number of the transverse frame beams 601 are two, and are respectively arranged at intervals. Two longitudinal frame beams 602 are distributed at intervals at positions close to the middle of the transverse frame beam 601, and sheet metal bending parts 603 are respectively and fixedly arranged at positions of the two transverse frame beams 601 close to the end parts, so that a paper ejection cylinder 614 is assembled through the sheet metal bending parts 603, and a gap is formed between the sheet metal bending parts and the electrostatic platform 613. The structures of the two sheet metal bending parts 603 may be the same or different, for example, one sheet metal bending part 603 is arranged in a zigzag manner with an included angle of 90 degrees, and the other sheet metal bending part 603 is arranged in an inverted convex shape.

In the adsorption frame 621, the number of the longitudinal frame beams 602 is four, the number of the transverse frame beams 601 is two, and the four longitudinal frame beams 602 are uniformly distributed at intervals along the length direction of the transverse frame beams 601 so as to separate the transverse frame beams 601 into three spaced mounting sections, and each mounting section is provided with an adsorption piece 622; thus, in the present embodiment, the number of the adsorbing members 622 is six.

As shown in fig. 1 and 5, the inspection apparatus further includes a vision positioning module 70, the vision positioning module 70 having a positioning camera 71, the positioning camera 71 being installed above the feed tray 53, and the semiconductor elements placed in the feed tray 53 being photographed by the positioning camera 71 to determine the positions of the semiconductor elements. The vision positioning module 70 further comprises an illumination light source, a vision bracket 73 and an adjusting sliding table 74, one end of the vision bracket 73 is suspended above the feeding station 2002, and the illumination light source and the positioning camera 71 are both installed on the adjusting sliding table 74 and installed on the vision bracket 73 through the adjusting sliding table 74. The adjustment slide table 74 can rotate around the Z axis and the Y axis relative to the vision support 73, and the adjustment slide table 74 can drive the positioning camera 71 to move along the Z axis and the X axis respectively, so as to finely adjust the position of the positioning camera 71 relative to the semiconductor element. The Z-axis direction is the third direction, the Y-axis direction is the second direction, and the X-axis direction is the first direction. The bottom end of the visual support 73 is fixedly arranged on the detection platform 200 and is positioned on one side of the supporting beam 120, which is away from the carrying manipulator; the top end of the vision support 73 extends upward in the vertical direction, then extends toward the feed tray 53 in the second direction, and then extends downward in the vertical direction by a certain section; the adjustment slide 74 is suspended from the extended end of the vision bracket 73 by an engagement arm.

As shown in fig. 5, further, the adjustment slide 74 includes a reference block 741, a first adjustment block 742, and a second adjustment block 743; the reference block 741 is fixedly connected with the connecting arm; the first adjusting block 742 includes a first connecting arm and a second connecting arm that are disposed at an angle and connected, a first edge of the first connecting arm is overlapped on the top of the reference block 741 and connected with the reference block 741, the second connecting arm is located on a side of the reference block 741 facing away from the visual stand 73 and connected with the second adjusting block 743, and the second adjusting block 743 is connected with the positioning camera 71. Wherein, the first connecting arm is provided with two first arc holes 7421, and the two first arc holes 7421 are concentrically arranged and are arranged at intervals along the second direction; meanwhile, two second arc-shaped holes 7431 are formed in two sides of the second adjusting block 743 along the first direction, and the two second arc-shaped holes 7431 are concentrically arranged and radially arranged at intervals. Such a setting facilitates adjustment of the mounting angle of the first adjustment block 742 with respect to the reference block 741 on a horizontal plane, and facilitates adjustment of the mounting angle of the second adjustment block 743 with respect to the first adjustment block 742 on a vertical plane, thereby achieving adjustment of the mounting angle of the positioning camera 71.

Still further, a first adjusting seat is connected to the second connecting arm of the first adjusting block 742, and is in threaded connection with the second adjusting block 743 through a first bolt, and the second adjusting block 743 is driven to move along the Z axis relative to the first adjusting block 742 by rotating the first bolt. The reference block 741 is connected to a second adjustment seat, and is screwed to the first adjustment block 742 by a second bolt, and the first adjustment block 742 is driven to move along the X-axis relative to the reference block 741 by rotating the second bolt.

As shown in fig. 1, 6 and 7, in some embodiments, the inspection apparatus further includes an adjustment platform 80, where the adjustment platform 80 is disposed at the adjustment station 2004 downstream of the feed tray 53 to facilitate adjustment of the angle and position of the semiconductor components to meet inspection requirements. Specifically, the adjusting platform 80 includes a rotating mechanism 81, a translating mechanism 82 and an adjusting panel 83, the rotating mechanism 81 is connected to the bottom of the adjusting panel 83, the translating mechanism 82 is connected to the rotating mechanism 81, the translating mechanism 82 is used for driving the adjusting panel 83 to move along the second direction through the rotating mechanism 81, and the rotating mechanism 81 is used for driving the adjusting panel 83 to rotate around the central axis of the adjusting panel 83.

Specifically, the rotation mechanism 81 includes a rotation motor 811, a rotation driving wheel 812, a rotation driven wheel 813, and a rotation timing belt 814, wherein a motor shaft of the rotation motor 811 is in transmission connection with the rotation driving wheel 812, and the rotation timing belt 814 is tensioned between the rotation driving wheel 812 and the rotation driven wheel 813 so as to drive the rotation driven wheel 813 to rotate through the rotation driving wheel 812. The rotation driven wheel 813 is connected to the adjustment panel 83 through a disc to drive the adjustment panel 83 to rotate synchronously. The casing of the rotary motor 811 is fixed on a support plate 84, the support plate 84 is connected with the translation mechanism 82, and the support plate 84 is provided with a protrusion to support the rotary driven wheel 813, so as to satisfy the rotation of the rotary driven wheel 813. The support plate 84 is provided with a photoelectric switch and the disk is provided with a contact piece extending therefrom so as to be matched with the photoelectric switch. The diameter of the rotary driving wheel 812 is larger than that of the rotary driven wheel 813, so that the rotary synchronous belt 814 can be tensioned better, and the transmission stability is improved.

Meanwhile, the translation mechanism 82 includes a translation motor 821, a first synchronous belt group 822, a second synchronous belt group 823 and a linking substrate 824, the linking substrate 824 and the translation motor 821 are both mounted on the detection platform 200, a motor shaft of the translation motor 821 is in transmission connection with the first synchronous belt group 822, the first synchronous belt group 822 is in transmission connection with the second synchronous belt group 823, and the support plate 84 is connected with the first synchronous belt group 822 through a sliding support block 85 so as to satisfy the linear movement of the support plate 84. The first synchronous belt set 822 includes a first driving wheel 8221, a first driven wheel 8222 and a first driving belt 8223, the first driving wheel 8221 is in driving connection with a motor shaft of the translation motor 821, and the first driving belt 8223 is tensioned between the first driving wheel 8221 and the first driven wheel 8222. The second synchronous belt set 823 comprises a second driving wheel 8231, a second driven wheel 8232 and a second driving belt, the second driving wheel 8231 is in transmission connection with the first driven wheel 8232 through a rotating shaft, the second driving belt is tensioned between the second driving wheel 8231 and the second driven wheel 8232, and the sliding supporting block 85 is connected with the second driving belt. The engagement substrate 824 is configured with a rotation hole for the rotation shaft to pass through, and the rotation shaft is rotatably connected with the engagement substrate 824 through a bearing. A sliding support rail 86 is disposed on a side of the engagement substrate 824 facing away from the first synchronization belt set 822, and a sliding support block 85 is slidably connected to the sliding support rail 86, so as to support and move the sliding support block 85. Wherein, the number of the sliding supporting blocks 85 is at least two, and one sliding supporting block 85 is connected with the second synchronous belt 8233 and is in sliding connection with the sliding supporting rail 86; the other sliding support block 85 is connected to one side of the support plate 84 facing away from the adjustment panel 83 and is slidably connected to the sliding support rail 86; in this way, the support to the support plate 84 can be improved.

In actual use, after the first pick-up module 61 drives the semiconductor element to move from the feeding tray 53 to the adjustment panel 83, the controller can control the translation motor 821 and the rotation motor 811 to move respectively based on the position captured by the positioning camera 71, so as to meet the angle and position adjustment of the adjustment panel 83, so that the semiconductor element thereon reaches the target position and angle.

As shown in fig. 1 and 8, in some embodiments, a first dust removal station 2006 is also provided between the adjustment station 2004 and the detection station 2005, and a second dust removal station 2007 is also provided downstream of the detection station 2005 away from the adjustment station 2004; the first dust removal station 2006 is used for cleaning (including dust removal and static electricity removal) the lower surface of the semiconductor element and the second dust removal station 2007 is used for cleaning the upper surface of the semiconductor element. Correspondingly, the detection device comprises a first dust removing component 91 and a second dust removing component 92, the first dust removing component 91 is arranged at a first dust removing station 2006, and the second dust removing component 92 is arranged at a second dust removing station 2007; in a third direction (i.e., a vertical direction, hereinafter, collectively referred to as a third direction), the first dust removing assembly 91 is disposed offset from the second dust removing assembly 92. The first dust removing assembly 91 and the second dust removing assembly 92 together constitute a dust removing mechanism 90.

Specifically, the first dust removing assembly 91 and the second dust removing assembly 92 each include an air knife 9011 and an ion air bar 9012, and the air knives 9011 are staggered along the ion air bar 9012 along a first direction to perform multi-angle cleaning on the semiconductor element through airflow and current. Meanwhile, the first dust removing assembly 91 and the second dust removing assembly 92 further comprise an integrated base 93 so as to support and integrate the air knife 9011 and the ion air bar 9012, and the installation height of the air knife 9011 and the ion air bar 9012 relative to the integrated base 93 can be adjusted, for example, the height adjustment is satisfied by using the arrangement of the strip holes. The moving mode by using the strip holes is the existing mature technology, and does not belong to the application point of the application, so that the description is omitted.

In actual use, the second dust removing assembly 92 further includes a second linear module 921, a suspension arm 922 connected to the second linear module 921, and a moving guide bracket 923, where the second linear module 921 and the moving guide bracket 923 are arranged at intervals along the second direction, one end of the integrated base 93 in the second dust removing assembly 92 is connected to the suspension arm 922, and the other end is connected to the moving guide bracket 923 through a sliding block. In this way, the air knife 9011 and the ion air bar 9012 in the second dust removal assembly 92 can reciprocate along the first direction under the power of the second linear module 921, so as to satisfy the cleaning operation of the upper surface of the semiconductor element.

That is, when the first pick-up module 61 drives the semiconductor device to move from the adjustment station 2004 to the inspection station 2005, the first dust removing assembly 91 removes dust and static electricity from the lower surface of the semiconductor device; after the semiconductor element is placed at the ballast sub-station 2051 of the inspection station 2005, the air knives 9011 and the ion air bars 9012 in the second dust removal assembly 92 are moved in the first direction to remove dust and static electricity from the upper surface of the semiconductor element.

It should be added that the working principles of how the air knife 9011 performs dust removal by air flow blowing and how the ion air bar 9012 performs static removal all belong to the prior art, and are not the application point of the present application, so that the description is omitted.

Further, when cleaning the upper surface of the semiconductor device, it is necessary to fix the semiconductor device to the ballast sub-station 2051 to prevent the semiconductor device from being deviated or separated by the second dust removing assembly 92. Based on this, as shown in fig. 1 and 9, the inspection apparatus provided in the present embodiment further includes a pressing mechanism 130 disposed at the ballast substation 2051, and the inspection carrier 210 for receiving the semiconductor element is disposed at the ballast substation 2051, and the pressing mechanism 130 is used for pressing the edge of the semiconductor element against the inspection carrier 210. Specifically, the pressing mechanism 130 includes an integrated board 1301 and a plurality of pressing arms 1302, and the plurality of pressing arms 1302 are arranged at intervals along the second direction and connected to the integrated board 1301. The integrated board 1301 can move along the first direction and the third direction, so as to drive the plurality of pressing arms 1302 to move synchronously, and the plurality of pressing arms 1302 are used for pressing on the semiconductor element.

Still further, the pressing mechanism 130 includes a first cylinder 1303, a pressing support plate 1304, and a second cylinder 1305, the first cylinder 1303 being mounted on the inspection platform 200 and connected to the pressing support plate 1304, and the second cylinder 1305 being mounted on the pressing support plate 1304 and connected to the integrated board 1301. As such, the first cylinder 1303 drives the pressing support plate 1304 to move in the third direction, and the second cylinder 1305 drives the integrated plate 1301 to move in the first direction to satisfy the pressing of the plurality of pressing arms 1302 to the semiconductor element. After the plurality of pressing arms 1302 press the semiconductor element on the test carrier 210, the second dust removing assembly 92 is started, so that the air knife 9011 and the ion air bar 9012 in the second dust removing assembly 92 can reciprocate along the first direction under the power action of the second linear module 921 to satisfy the cleaning operation of the upper surface of the semiconductor element. After the upper surface cleaning is completed, the first cylinder 1303 and the second cylinder 1305 are activated again, respectively, to urge the plurality of pressing arms 1302 back to the safe positions. Then, the detection carrier 210 can drive the semiconductor device to move along the second flow path.

As shown in fig. 1 and 10, in some embodiments, the inspection device further includes a first linear module 31 disposed at the inspection station 2005 and two moving rails 32, where the two moving rails 32 are spaced apart along the first direction and are connected to the bottom of the inspection carrier 210 by a plurality of spaced apart sliders; each of the sliders is fixed to the detection carrier 210 and slidably coupled to the moving rail 32. The power output end of the first linear module 31 is detachably connected with the detection carrier 210, so as to drive the detection carrier 210 to move along the second direction, thereby satisfying the detection of the upper and lower surfaces of the semiconductor device.

With continued reference to fig. 1, 10 and 11, during the inspection process, adjustment of the inspection conditions is satisfied in order to ensure a flat press-fit of the semiconductor element. In some embodiments, the inspection apparatus further includes a capping mechanism 40 disposed at the ballast sub-station 2051, the capping mechanism 40 configured to flatten the semiconductor device against the inspection carrier 210 to eliminate inspection disturbances caused by product deformation. The capping mechanism 40 is mounted on the slider of the first linear module 31 and protrudes in the first direction to facilitate ballasting of the semiconductor elements. Specifically, the capping mechanism 40 includes a capping carrier 41, where the capping carrier 41 can move along a third direction to press the semiconductor element onto the detection carrier 210.

The cover carrier 41 is also made of glass material, so that the upper surface of the semiconductor device is fully exposed to the first detecting module 101 at the detecting window 2010 for detecting the upper surface of the semiconductor device.

With continued reference to fig. 1, 10 and 11, further, the capping mechanism 40 further includes a driving source 44, a driving gear 45 and a driven rack 46, the driving source 44 is in transmission connection with the driving gear 45, the driving gear 45 is in meshed transmission with the driven rack 46, the length of the driven rack 46 extends along the third direction, and the driven rack 46 is connected with the capping carrier 41. Wherein the drive source 44 employs a motor. Meanwhile, the gland mechanism 40 further comprises a gland base 42 and a gland bracket 43 slidably connected to the gland base 42, the gland bracket 43 is arranged around the gland carrier 41, and the gland base 42 is mounted on the slider and supports the gland carrier 41 through the gland bracket 43. The passive rack 46 is mounted on the gland bracket 43 and the drive source 44 is mounted on the gland base 42. Meanwhile, a spring 47 is further connected between the gland base 42 and the gland bracket 43 to protect the gland carrier 41.

In actual use, the second flow path is close to the intersection with the first flow path and is the start end of the second flow path, and the other end is the end. When the first pick-up module 61 drives the semiconductor device to be placed on the test carrier 210, the test carrier 210 is located at the start end. At this time, in order to avoid interference between the capping mechanism 40 and the first pick-up module 61, the capping mechanism 40 is located at the termination end of the second flow path under the action of the first linear module 31. After the semiconductor device is cleaned on the upper surface, the capping mechanism 40 moves to the starting end under the action of the first linear module 31, and the capping carrier 41 is located above the detecting carrier 210. In order to satisfy the movement of the detection carrier 210 under the action of the first linear module 31, the detection carrier 210 needs to be connected with the slider on the first linear module 31.

Therefore, as shown in fig. 10-12, the slider of the first linear module 31 is provided with a first toothed plate 312 and a link driving mechanism 313 connected to the first toothed plate 312, the detection carrier 210 is connected with a second toothed plate 331, and the link driving mechanism 313 can drive the first toothed plate 312 to move along the first direction so as to be engaged with the second toothed plate 331 for locking or disengaged from the second toothed plate 331. When the first toothed plate 312 and the second toothed plate 331 are engaged and locked, the detection carrier 210 can move along the second direction under the action of the first linear module 31 and gradually drive into the detection areas of the first detection module 101 and the second detection module 102.

Specifically, the link driving mechanism 313 includes a toothed plate cylinder 3131, a connecting block 3132, a connecting rod 3133 and a pushing plate 3134, the connecting block 3132 is connected with a piston rod of the toothed plate cylinder 3131, one end of the connecting rod 3133 is hinged to the connecting block 3132, the other end of the connecting rod 3133 is hinged to the pushing plate 3134, the connecting block 3132 and the pushing plate 3134 are both slidably connected to a sliding block of the first linear module 31, and one side of the pushing plate 3134, which is away from the connecting rod 3133, is connected with the first toothed plate 312. The piston rod of the toothed plate cylinder 3131 stretches and contracts along the second direction to drive the connecting block 3132 to reciprocate along the second direction, and the connecting block 3132 drives the pushing plate 3134 to reciprocate along the first direction through the connecting rod 3133 so as to meet the engagement locking or release unlocking of the first toothed plate 312 and the second toothed plate 331. An electromagnet may be used to magnetically attract the connecting block 3132, so that the pushing plate 3134 is driven to move by the connecting rod 3133, so as to realize the movement of the first toothed plate 312 relative to the second toothed plate 331.

As shown in fig. 1, 13 and 14, in some embodiments, since the first and second inspection sub-stations 2052 and 2053 are used for performing defect inspection on the upper and lower surfaces of the semiconductor device, respectively, the first and second inspection sub-stations 2052 and 2053 are located at both sides of the inspection carrier 210 along the third direction, and the inspection platform 200 is provided with inspection windows 2010. The inspection window 2010 is a through hole formed on the inspection platform 200, so that the upper and lower surfaces of the semiconductor element located at the inspection window 2010 are fully exposed in the inspection area. Therefore, the inspection apparatus further includes a first inspection module 101 and a second inspection module 102, the first inspection module 101 is installed at the first inspection sub-station 2052, the second inspection module 102 is installed at the second inspection sub-station 2053, and the structures of the first inspection module 101 and the second inspection module 102 are substantially similar.

Taking the first detection module 101 as an example, the first detection module 101 includes a light source 11, a reflecting mirror 12, and a detection camera 13, and the detection camera 13 is configured to obtain a detection image of the semiconductor element based on reflection of the material by the reflecting mirror 12. Thus, during the detection process, the light emitted by the light source 11 can be reflected by the reflecting mirror 12, so as to change the light path transmission direction. At this time, the detection camera 13 only needs to be disposed on the light path after the change of direction. By the arrangement, the detection angle of the detection camera 13 relative to the semiconductor element is reduced, and more importantly, the distance of the detection camera 13 for acquiring the semiconductor element image is reduced, so that the occupied space of the whole detection module is reduced, interference between the detection module and other structures is reduced, and the detection definition is improved.

In actual use, when the first linear module 31 drives the semiconductor element to move along the second direction so as to pass through the first detection module 101 and the second detection module 102, the position sensor on the second flow path is triggered in sequence, the signal processing center obtains the moving speed and position of the semiconductor element according to the grating ruler signal installed on the detection platform 200, the moving signal is sent to the image acquisition card after integration, and the detection camera 13 scans images at a specific frequency and line number. All the patterns are processed by the image card to form a complete product image, and the complete product image is sent to vision detection software for defect analysis. In order to meet the requirement of more comprehensive detection data, the semiconductor element is subjected to scanning detection on a second flow path entering and exiting the detection area, and when entering the detection area along the second flow path for the first time, the capping mechanism 40 is pressed above the semiconductor element and is not in direct contact with a product, so that defects such as warping, deformation and wire breakage of the semiconductor element can be effectively detected through the scanning structure. The second inspection is performed while the semiconductor element is returned along the second flow path, and the capping carrier 41 in the capping mechanism 40 is moved down to press the semiconductor element before entering the inspection area. And then moves back into the detection zone. The detection section can eliminate the interference caused by the deformation of the semiconductor element, thereby effectively detecting the defects of the semiconductor element such as color change, dirt, broken line, pinholes and the like. In this way, the quality of the semiconductor element is ensured by the two detections of the reciprocal movement along the second flow path.

In summary, the whole process of inspecting the semiconductor device is as follows:

and (3) manual discharging: the operator places the semiconductor element to be inspected in the supply tray 53.

Placing the bottom dust-free paper: the second pick-up module 62 moves, and sucks the first piece of dust-free paper in the dust-free paper magazine by using the plurality of suction members 622, and places the first piece of dust-free paper in the receiving tray 51; the code reader on the second pick-up module 62 finishes the code reading of the dust-free paper in the moving process, and the positioning camera 71 in the visual positioning module 70 photographs the semiconductor elements in the feeding tray 53 to obtain the gesture position of the product.

Carrying a semiconductor element: the first pick-up module 61 is started, and the electrostatic stage 613 is used to suck the semiconductor devices in the feed tray 53 and place them on the adjustment panel 83; then, according to the requirement of the actual detection position, the angle and the position of the adjusting panel 83 are adjusted by the rotating mechanism 81 and the shifting mechanism 82 so as to meet the position compensation of the semiconductor element; at this time, the second pick-up module 62 sucks the second dust-free paper and conveys it to the safe position to wait.

Cleaning the lower surface: the first pick-up module 61 is started again to absorb the semiconductor element after the position compensation and drive the semiconductor element to move towards the direction approaching to the detection station 2005, and in the moving process, the first dust removing assembly 91 is utilized to clean (including dust removal and static electricity removal) the lower surface of the semiconductor element, and the cleaned semiconductor element is placed on the detection carrier 210.

Cleaning the upper surface: the pressing mechanism 130 is started to press and fix the edge of the semiconductor element by using the plurality of pressing arms 1302, and then the second dust removing assembly 92 is started to move the air knife 9011 and the ion air bar 9012 along the first direction so as to clean the upper surface of the semiconductor element; after cleaning, the plurality of hold-down arms 1302 return to the original position.

Defect detection: the first linear module 31 is started to enable the sliding block to drive the first toothed plate 312 and the capping mechanism 40 to move to the starting end of the second flow path; the toothed plate cylinder 3131 starts and drives the first toothed plate 312 to move so as to be engaged and locked with the second toothed plate 331, so that the connection between the sliding block and the detection carrier 210 is satisfied; the gland carrier 41 in the gland mechanism 40 moves downwards to be close to the detection carrier 210, but is not in contact with and pressed against the semiconductor element; then, the first linear module 31 drives the capping mechanism 40, the detection carrier 210 and the semiconductor element to gradually enter the detection area along the second flow path through the sliding block so as to perform the first detection; when the semiconductor element moves to the end of the second flow path, the gland carrier 41 moves downwards to enable the semiconductor element to be pressed flatly, and then moves reversely along the second flow path under the action of the first linear module 31 so as to perform second detection; thus, the detection of the lower surface and the lower surface of the semiconductor element in different states can be satisfied.

And (3) replying: after the detection is completed, the gland carrier 41 moves upwards to separate from the semiconductor element, the first toothed plate 312 and the second toothed plate 331 are released and unlocked, and the first linear module 31 drives the gland mechanism 40 and the first toothed plate 312 to move towards the termination end along the second flow path for homing; then, the first pick-up module 61 moves down to adsorb the inspected semiconductor element and conveys it to the receiving tray 51; at this time, the second pick-up module 62 carrying the second piece of dust-free paper is activated to place the dust-free paper over the semiconductor element; if the waste is not acceptable, the waste is placed on the waste tray 52.

Image processing: after the photographing is completed by the detection camera 13, the image is analyzed by the vision processing system to obtain the defect information of the semiconductor element, and drawing a drawing paper, and the data can be displayed on a display of the upper computer in real time and transmitted to the server.

And performing the above operation until the defect detection of all the semiconductor elements is completed.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be determined from the following claims.

Claims

1. A inspection apparatus for inspecting a semiconductor device, the inspection apparatus comprising:

the detection platform (200) is provided with a receiving station (2001), a feeding station (2002), an adjusting station (2004) and a detection station (2005) which are arranged at intervals along a first direction, and the receiving station (2001), the feeding station (2002), the adjusting station (2004) and the detection station (2005) jointly define a first flow path;

the pick-up module can circulate among the feeding station (2002), the adjusting station (2004), the detecting station (2005) and the receiving station (2001) along the first circulation path;

wherein the detection station (2005) is divided into a ballast sub-station (2051), a first detection sub-station (2052) and a second detection sub-station (2053) which are distributed at intervals along a second direction, the ballast sub-station (2051), the first detection sub-station (2052) and the second detection sub-station (2053) jointly define a second flow path, and the ballast sub-station (2051) is positioned at the intersection of the second flow path and the first flow path; the first direction and the second direction are arranged at an angle.

2. The detection device according to claim 1, characterized in that along the first flow path, the adjustment station (2004) is located between the feeding station (2002) and the detection station (2005), the receiving station (2001) being located upstream of the feeding station (2002); and/or the number of the groups of groups,

a first dust removal station (2006) for installing a first dust removal assembly (91) is further arranged between the adjustment station (2004) and the detection station (2005), and a second dust removal station (2007) for installing a second dust removal assembly (92) is further arranged at the downstream of the detection station (2005) away from the adjustment station (2004); one of the first dust removal station (2006) and the second dust removal station (2007) is for cleaning an upper surface of a semiconductor element, and the other is for cleaning a lower surface of the semiconductor element.

3. The detection device according to claim 2, characterized in that in a third direction the first dust removal assembly (91) is arranged offset to the second dust removal assembly (92), the first dust removal assembly (91) being for cleaning the lower surface of the semiconductor element and the second dust removal assembly (92) being for cleaning the upper surface of the semiconductor element; the third direction, the first direction and the second direction are arranged in pairs at an angle;

The first dust removing assembly (91) and the second dust removing assembly (92) comprise an air knife (9011), an ion air bar (9012) and an integrated base (93), and the air knife (9011) and the ion air bar (9012) are staggered along a first direction and are integrally arranged on the integrated base (93);

the second dust removal assembly (92) further comprises a second linear module (921) and a movable guide bracket (923), the second linear module (921) and the movable guide bracket (923) are arranged at intervals along a second direction, one end of an integrated base (93) in the second dust removal assembly (92) is connected with the second linear module (921), the other end of the integrated base is connected with the movable guide bracket (923) in a sliding manner, and the integrated base can reciprocate along a first direction under the action of the second linear module (921).

4. The detection device according to claim 1, further comprising a support beam (120) having a length extending in a first direction; the picking up module comprises a first picking up module (61) and a second picking up module (62), wherein the first picking up module (61) and the second picking up module (62) are both connected to the supporting beam (120) in a sliding manner and can move along the length direction of the supporting beam (120); the first pickup module (61) can flow among the feeding station (2002), the adjusting station (2004), the detecting station (2005) and the receiving station (2001) along the first flow path; the second pick-up module (62) is capable of circulating relative to the receiving station (2001) along the first circulation path.

5. The detection device according to claim 4, wherein the first pick-up module (61) comprises a voltage amplifier (612) and an electrostatic platform (613), the electrostatic platform (613) is slidably connected to the supporting beam (120), and the electrostatic platform (613) is electrically connected to the voltage amplifier (612), and the voltage amplifier (612) is capable of regulating an electrostatic voltage of the electrostatic platform (613); and/or, the second pickup module (62) comprises a plurality of adsorbing members (622) and a power source, wherein the power source is communicated with each adsorbing member (622), and each adsorbing member (622) is arranged at intervals along the first direction and the second direction.

6. The detection device according to claim 5, wherein the first pick-up module (61) further comprises an electrostatic stage frame (611) and a first lifting mechanism, the electrostatic stage frame (611) being connected to a power output end of the first lifting mechanism, the first lifting mechanism being adapted to be slidingly connected to the support beam (120), the electrostatic stage (613) being mounted to the electrostatic stage frame (611); and/or

The second picking module (62) further comprises an adsorption frame (621) and a second lifting mechanism, the adsorption frame (621) is connected to a power output end of the second lifting mechanism, the second lifting mechanism is used for being in sliding connection with the supporting beam (120), and a plurality of adsorption pieces (622) are arranged on the adsorption frame (621) at intervals.

7. The detection device according to claim 1, further comprising an adjustment platform (80), the adjustment platform (80) being arranged at the adjustment station (2004):

the adjusting platform (80) comprises a rotating mechanism (81), a translation mechanism (82) and an adjusting panel (83), wherein the rotating mechanism (81) is connected to the bottom of the adjusting panel (83), and the translation mechanism (82) is connected with the rotating mechanism (81);

the translation mechanism (82) is used for driving the adjustment panel (83) to move along the second direction through the rotation mechanism (81), and the rotation mechanism (81) is used for driving the adjustment panel (83) to rotate around the central axis of the adjustment panel (83).

8. The inspection device according to claim 1, further comprising a first inspection module (101) disposed at the first inspection sub-station (2052), a second inspection module (102) disposed at the second inspection sub-station (2053), and an inspection carrier plate (210) disposed at the ballast sub-station (2051), wherein the first inspection module (101) and the second inspection module (102) are respectively disposed at two sides of the inspection carrier plate (210) in a thickness direction, and the inspection carrier plate (210) is used for carrying semiconductor elements;

Wherein the first detection module (101) and the second detection module (102) each comprise a light source (11), a reflecting mirror (12) and a detection camera (13), the detection camera (13) being configured to obtain a detection image of the semiconductor element in response to the reflecting mirror (12) based on a reflection of material by the light source (11).

9. The inspection apparatus of claim 8 further comprising a capping mechanism (40) disposed at the ballast sub-station (2051), the capping mechanism (40) having a capping carrier plate (41) for being pressed over the inspection carrier plate (210), the capping carrier plate (41) and the inspection carrier plate (210) for sandwiching the semiconductor element together; the gland carrier plate (41) is movable relative to the detection carrier plate (210) along a second direction and a third direction; and/or the number of the groups of groups,

the detection device further comprises a pressing mechanism (130) arranged at the ballast sub station (2051), and the pressing mechanism (130) is used for pressing the semiconductor element to the detection carrier plate (210).

10. The detection apparatus according to claim 9, wherein the pressing mechanism includes an integrated board (1301) and a plurality of pressing arms (1302), the plurality of pressing arms (1302) being arranged at intervals along a second direction and being connected to the integrated board (1301) each, the integrated board (1301) being movable along a first direction and a third direction to bring about synchronous movement of the plurality of pressing arms (1302); a plurality of the pressing arms (1302) for pressing the semiconductor element; and/or the number of the groups of groups,

The gland mechanism further comprises a driving source (44), a driving gear (45) and a driven rack (46), wherein the driving source (44) is in transmission connection with the driving gear (45), the driving gear (45) is in meshing transmission with the driven rack (46), the driven rack (46) is connected with the gland carrier plate (41), and the length of the driven rack (46) extends along a third direction.

11. The detection device according to any one of claims 1 to 10, characterized in that it further comprises a visual positioning module (70);

the visual positioning module (70) comprises a positioning camera (71), an adjusting sliding table (74) and a visual support (73), one end of the visual support (73) is suspended above the feeding station (2002), the adjusting sliding table (74) is mounted at the suspension end of the visual support (73), and the positioning camera (71) is mounted at the adjusting sliding table (74); the adjusting sliding table (74) can rotate around the Z axis and the Y axis relative to the visual support (73) to drive the positioning camera (71) to move synchronously, and the adjusting sliding table (74) can drive the positioning camera (71) to move along the Z axis and the X axis respectively.

12. The detection device according to claim 11, wherein the adjustment slide (74) comprises a reference block (741), a first adjustment block (742) and a second adjustment block (743);

The first adjusting block (742) comprises a first connecting arm and a second connecting arm which are arranged at an angle and connected, the first connecting arm is connected with the reference block (741), the second connecting arm is positioned at one side of the reference block (741) away from the visual stand (73) and connected with the second adjusting block (743), and the second adjusting block (743) is connected with the positioning camera (71);

the first adjusting block (742) can rotate around the Z axis relative to the reference block (741), and the second adjusting block (743) can rotate around the Y axis relative to the second connecting arm.