CN108493124A - Automate wafer test board - Google Patents
Automate wafer test board Download PDFInfo
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- CN108493124A CN108493124A CN201810467796.XA CN201810467796A CN108493124A CN 108493124 A CN108493124 A CN 108493124A CN 201810467796 A CN201810467796 A CN 201810467796A CN 108493124 A CN108493124 A CN 108493124A
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- 238000012360 testing method Methods 0.000 title claims abstract description 222
- 230000007246 mechanism Effects 0.000 claims abstract description 33
- 238000013519 translation Methods 0.000 claims abstract description 11
- 238000004891 communication Methods 0.000 claims abstract description 10
- 238000001514 detection method Methods 0.000 claims abstract description 7
- 230000003287 optical effect Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 17
- 239000000523 sample Substances 0.000 claims description 15
- 230000005611 electricity Effects 0.000 claims description 14
- 239000000835 fiber Substances 0.000 claims description 12
- 239000013307 optical fiber Substances 0.000 claims description 12
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 230000008030 elimination Effects 0.000 claims description 8
- 238000003379 elimination reaction Methods 0.000 claims description 8
- 230000003068 static effect Effects 0.000 claims description 8
- 230000003319 supportive effect Effects 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 93
- 238000010438 heat treatment Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 230000006698 induction Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000010338 mechanical breakdown Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to a kind of automation wafer test boards, for fixing and testing the chip on wafer.It includes board, angle-adjusting mechanism, wafer test positioning device, test suite and controller to automate wafer test board.Test station is provided on board.Angle-adjusting mechanism includes rotary components and translation component.Wafer test positioning device is installed on surface of the angle-adjusting mechanism backwards to mounting surface, and angle-adjusting mechanism can drive wafer test positioning device to rotate or translate, to drive chip to be moved to test station.Test suite is used to carry out performance detection to the chip positioned at test station.Controller is connected with angle-adjusting mechanism and test suite communication, and controller to angle-adjusting mechanism and test suite for sending trigger signal respectively, with trigger angle adjustment mechanism and test suite.Automation wafer test board provided by the invention has test speed fast, the high feature of testing efficiency.
Description
Technical field
The present invention relates to wafer test technical field more particularly to a kind of automation wafer test boards.
Background technology
Wafer refers to the silicon wafer used in silicon semiconductor production of integrated circuits.On wafer can the various chips of processing and fabricating,
Wafer is set to become the product with specific function.In the process of wafer, usually wafer need to be fixed on wafer test machine
On platform, and the test of optics and electric property is carried out to the chip being set on wafer one by one.And existing wafer test board
Test speed is slow, and testing efficiency is low.
Invention content
Based on this, it is necessary to for the low problem of traditional testing efficiency, it is brilliant to provide a kind of automation that testing efficiency is high
Circle tester table.
A kind of automation wafer test board for fixation and tests the chip on wafer, including：
The board to play a supportive role has mounting surface, test station is provided on the mounting surface；
It is set to the angle-adjusting mechanism of the mounting surface, including rotary components and translation component；
Wafer test positioning device is installed on the angle for adsorbing simultaneously fixed chip, the wafer test positioning device
Adjustment mechanism is spent backwards to the surface of the mounting surface, and the angle-adjusting mechanism can drive the wafer test positioning device to rotate
Or translation, to drive the chip to be moved to the test station；
Test suite, is set to the board, and the test suite is used for the chip progress positioned at the test station
Performance detection；And
Controller, with the angle-adjusting mechanism and the test suite communication connect, the controller for respectively to
The angle-adjusting mechanism and the test suite send trigger signal, to trigger the angle-adjusting mechanism and the test group
Part.
The translation component includes in one of the embodiments,：
First translating element, including the first sliding rail, first motor and the first sliding block that extend in a first direction, described first slides
Rail is fixed on the mounting surface, and first sliding block is slidably disposed in first sliding rail, and the first motor is for driving
First sliding block is moved to slide along first sliding rail；And
Second translating element, including the second sliding rail, the second motor and the second sliding block that extend in a second direction, described second slides
Rail is fixed on first sliding block backwards to the surface of first sliding rail, and second sliding block is slidably disposed in described second
Sliding rail, the rotary components and the wafer test positioning device are fixed on table of second sliding block backwards to second sliding rail
Face, second motor is for driving second sliding block to be slided along second sliding rail.
The rotary components include turntable and actuator in one of the embodiments, the turntable rotatably arranged with
In the surface of second sliding block, the actuator is sequentially connected with the turntable, and the wafer test positioning device is fixed on
The turntable is backwards to the surface of second sliding block.
The test suite includes in one of the embodiments,：
Optical module, including launching fiber, receive light, optical drive part and along perpendicular to the first direction and described
The optics guide rail that the third direction of second direction extends, the optical drive part is for driving the launching fiber and the reception
Optical fiber is moved along the optics guide rail；
Electric components, the electric components include probe, electricity actuator and along perpendicular to the first direction and described
The electricity guide rail that the third direction of second direction extends, the electricity actuator is for driving the probe along the electricity guide rail
It is mobile.
Further include airborne laser range finder in one of the embodiments, the airborne laser range finder is movably arranged at described
Board is simultaneously connect with the controller communication, the airborne laser range finder be used for obtain the chip the third direction thickness
Parameter, and feed back to the controller, with calibrate the test suite on the third direction with the chip surface away from
From.
Further include camera positioning component in one of the embodiments, the camera positioning component is set to the board,
And it is corresponding with the test station, the camera positioning component is connect with the controller communication, and the camera positioning component is used
It takes pictures in towards the test station, and feeds back to the controller after being compared with default photo.
Further include two Xelminators in one of the embodiments, described two Xelminators are respectively arranged at
The both ends of the board, to form static elimination region, the angle-adjusting mechanism, the wafer test positioning device and described
Test suite is respectively positioned in the static elimination region.
The wafer test positioning device includes in one of the embodiments,：
The substrate to play a supportive role has loading end；
Multiple lifters are installed on the loading end；
Vacuum absorbing platform is set to the one end of the multiple lifters far from the loading end, the multiple lifters
The vacuum absorbing platform can be driven to be lifted along the first direction；The vacuum absorbing platform has vacuum chamber, the vacuum
The surface of absorption platform offers multiple vacuum absorption holes being connected to the vacuum chamber.
Mounting portion, the vacuum absorbing platform court are both provided in the multiple lifters in one of the embodiments,
The side of the loading end is provided with multiple auxiliary sections, the mounting portion is internal thread structure, and the auxiliary section is external screw thread
Structure, the multiple auxiliary section coordinate with the multiple mounting portion respectively, so that the lifters and the vacuum absorbing platform
Between formed threads turn connection.
Further include locking nut in one of the embodiments, the locking nut is sheathed on the external thread structure,
And it is screwed togather with the external thread structure.
Above-mentioned automation wafer test board, wafer are fixed on the surface of wafer test positioning device.When work, controller
Rotary components rotation or translation component translation are controlled, the position of wafer test positioning device and wafer is driven to move, so that
Chip is moved to test station.In turn, controller control test suite is moved to test station, and is surveyed to chip performance
Examination.Compared with existing semi-automatic test board, above-mentioned automation wafer test board can fully achieve oneself of test process
Dynamicization, thus test speed is fast, testing efficiency is high.
Description of the drawings
Fig. 1 is the structural schematic diagram that wafer test board is automated in present pre-ferred embodiments；
Fig. 2 is the structural schematic diagram of the angle-adjusting mechanism in automation wafer test board shown in FIG. 1；
Fig. 3 is the structural schematic diagram of the wafer test positioning device in automation wafer test board shown in FIG. 1；
Fig. 4 is the explosive view of the wafer test positioning device in automation wafer test board shown in FIG. 1.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.Keep the understanding to the disclosure more saturating on the contrary, purpose of providing these embodiments is
It is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the Listed Items of pass.
It please refers to Fig.1 and Fig. 2, the automation wafer test board 10 in present pre-ferred embodiments includes board 200, angle
Spend adjustment mechanism 300, wafer test positioning device 100, test suite 400 and controller (not shown).Automate wafer test
Board 10 is for fixing and being tested for the property to the chip on wafer.
Board 200 plays a supportive role, and has mounting surface 210.Specifically, board 200 can be by with stronger mechanical strength
Alloy, plastic-steel or other high molecular materials are made, to prevent board from deforming and being broken at work.It is provided on mounting surface 210
Test station 220, chip are located at test station 220 and are tested for the property.
Angle-adjusting mechanism 300 is set to mounting surface 210.Angle-adjusting mechanism 300 includes translation component 320 and rotation group
Part 310.Angle-adjusting mechanism 300 is rotatable or translates, and chip is moved to test station 220.
Wafer test positioning device 100 is for adsorbing simultaneously fixed chip.Wafer test positioning device 100 is installed on angle tune
Complete machine structure 300 is backwards to the surface of mounting surface 210.Angle-adjusting mechanism 300 can drive wafer test positioning device 100 to rotate or put down
It moves, to drive chip to be moved to test station 220.
In the present embodiment, translation component 320 includes the first translating element 322 and the second translating element 324.
First translating element 322 includes the first sliding rail 3223 extended in a first direction, first motor (figure is not marked) and first
Sliding block 3224.First sliding rail 3223 is fixed on mounting surface 210, and the first sliding block 3224 is slidably disposed in the first sliding rail 3223.
First motor is for driving the first sliding block 3224 to be slided along the first sliding rail 3223.
Second translating element 324 includes the second sliding rail 3243 extended in a second direction, the second motor (figure is not marked) and second
Sliding block 3244.Second sliding rail 3243 is fixed on the first sliding block 3244 backwards to the surface of the first sliding rail 3243.Second sliding block 3244 can
It is slidingly arranged at the second sliding rail 3243, rotary components 310 and wafer test positioning device 100 are fixed on the second sliding block 3244 back of the body
To the surface of the second sliding rail 3243.Second motor is for driving the second sliding block 3244 to be slided along the second sliding rail 3243.
When first motor drives the first sliding block 3224 to be slided along the first sliding rail 3223, the first sliding block 3224 can drive second
Translating element 324 and wafer test positioning device 100 are moved along first direction.When the second motor drives the second sliding block 3244 along second
When sliding rail 3243 slides, the second sliding block 3244 can drive wafer test positioning device 100 to move in a second direction.Therefore, when solid
When the position of the chip in wafer test positioning device 100 and test station 220 are deviateed, pass through the first translating element
322 and second translating element 324 drive wafer test positioning device 100 to move, coarse adjustment can be carried out to the position of chip.
In the present embodiment, rotary components 310 include turntable 312 and actuator (not shown).Turntable 312 is rotationally set
It is placed in the surface of the second sliding block 3244, actuator is sequentially connected with turntable 312.Wafer test positioning device 100 is fixed on turntable
312 backwards to the surface of the second sliding block 3244.
When turntable 312 works, actuator driving disc 312 drives wafer test positioning device 100 to rotate.Since wafer is surveyed
It is fixed with multiple wafers in examination positioning device 100, when test, by rotation, chip can be aligned with test station 220, be convenient for
Accurately chip is tested for the property.After the completion of test, turntable 312 is rotated, the chip for completing performance test leaves test work
Position 220, next chip to be measured are moved to test station 220, carry out loop test.
Test suite 400 is set to board 200.Test suite 400 is used for the chip progressive positioned at test station 220
It can detection.Specifically, test suite 400 can to the optical property of chip, electric property, thermodynamic property, characterization performance and
Other performances are tested.The test performance project of test suite 400 can be set as needed.
Specifically in the present embodiment, test suite 400 includes optical module 410 and electric components 420.
Optical module 410 includes launching fiber 414, reception optical fiber 416, optical drive part 418 and edge perpendicular to first party
To and second direction third direction extend optics guide rail 412.Optical drive part 418 is for driving launching fiber 414 and connecing
Optical fiber 416 is received to move along optics guide rail 412.Optical module 410 is used for the optical property of test chip.
Launching fiber 414 is used for the surface emitting light to chip, and reception optical fiber 416 is reflected for receiving from chip surface
Light.The energy difference between light and the light of reflection by comparing transmitting, the optical property to obtain chip surface are joined
Number.When work, optical drive part 418 drives launching fiber 414 and reception optical fiber 416 to be moved along optics guide rail 412, so that transmitting
Optical fiber 414 is moved to the position that can emit light to chip surface, and reception optical fiber 416 is moved to receivable chip surface reflected light
The position of line.
Electric components 420 include probe 422, electricity actuator 426 and along perpendicular to the of first direction and second direction
The electricity guide rail 424 that three directions extend.Electricity actuator 426 is for driving probe 422 to be moved along electricity guide rail 424.Electricity group
Part 420 can be used for the electric property of test chip.
Probe 422 sends electrical signal for being contacted with chip, and to chip, with the electric property of detection chip.Specifically
Ground, when electric components work, electricity actuator 426 drives probe 422 to be moved along third direction, so that probe 422 and chip
Surface contacts.In turn, probe 422 sends electrical signal with the electric property of detection chip.
Controller (not shown) is connected with angle-adjusting mechanism 300 and the communication of test suite 400.Controller for respectively to
Angle-adjusting mechanism 300 and test suite 400 send trigger signal, with trigger angle adjustment mechanism 300 and test suite 400.
Controller drives wafer test positioning device 100 to transport according to chip physical location, control angle-adjusting mechanism 300
It is dynamic, so that chip is located at test station 220.In turn, controller can adjust test suite 400 and move according to the height of chip, with
So that test suite 220 is located at can be to the suitable position that chip is tested, and controls the work of test suite 400, to measure chip
Optical property and electric parameters.By the way that controller is arranged, solves the problems, such as traditional manual operation, so that certainly
Dynamicization wafer test board 10 can fully achieve the automation of test process, thus test speed is fast, and testing efficiency is high.
Specifically, wafer test positioning device 100 can fix the fixed form of chip by fastener, and it is recessed to open up limit
Slot is fixed, and can also be fixed by way of vacuum suction.
Specifically in the present embodiment, wafer test positioning device 100 fixes chip by the way of vacuum suction.Vacuum
Chip can be stably fixed in wafer test positioning device 100 by the mode of absorption.In addition, vacuum suction mode without using
External fastening can effectively prevent damage of the external fastening to chip surface, to improve the precision of chip.
Also referring to Fig. 3 and Fig. 4, further, in the present embodiment, wafer test positioning device 100 includes substrate
110, multiple lifters 120 and vacuum absorbing platform 130.
Substrate 110 plays a supportive role, and has loading end 112.
Multiple lifters 120 are installed on loading end 112.
Vacuum absorbing platform 130 is set to the one end of multiple lifters 120 far from loading end 112.Multiple lifters 120 can
Vacuum absorbing platform 130 is driven to be lifted along first direction.Vacuum absorbing platform 130 has vacuum chamber 132, vacuum absorbing platform
130 surface offers multiple vacuum absorption holes 134 being connected to vacuum chamber 132.
Substrate 110 is generally made of alloy, plastic-steel or other high molecular materials with larger mechanical strength, to prevent
Substrate 110 deforms and is broken during the work time.Vacuum absorbing platform 130 is for adsorbing and fixing wafer and chip.It rises
Drop part 120 is used to adjust the gradient of height and vacuum absorbing platform 130 of the vacuum absorbing platform 130 apart from loading end 112.
For wafer when carrying out optical property and electrical performance testing, wafer need to be angled with test suite 400, to reach
To good test effect.When wafer test positioning device 100 works, part lifters 120 can drive vacuum absorbing platform 130
Part lifting.In turn, difference in height is formed between fixed lifters 120 and the lifters 120 for carrying out elevating movement, very
130 run-off the straight of empty absorption platform, so that the angle between wafer and test suite 400 is adjusted, to reach good
Test effect., can also be to complete alternatively, if the position of wafer test positioning device 100 and test suite 400 is there are when gap
The lifters 120 in portion carry out lifting, to adjust the distance between vacuum absorbing platform 130 and loading end 112, to realize vacuum
The adjusting of the distance between absorption platform 130 and test suite 400.
Specifically, lifters 120 can be hydraulic stem, lead screw or screw element.Specifically in the present embodiment, multiple liftings
Mounting portion 122 is both provided on part 120, the side of vacuum absorbing platform 130 towards loading end 112 is provided with multiple auxiliary sections
136.Mounting portion 122 is internal thread structure, and auxiliary section 136 is external thread structure.Multiple auxiliary sections 136 respectively with multiple mounting portions
122 cooperations, so as to form threads turn connection between lifters 120 and vacuum absorbing platform 130.
When lifters 120 work, the mounting portion 122 of part lifters 120 is fixed, rotates rest part lifters
120 mounting portion 122, rest part mounting portion 122 are further screwed togather with corresponding auxiliary section 136.In turn, fixed
Lifters 120 and rotation lifters 120 between form difference in height, 130 run-off the straight of vacuum absorbing platform, so that brilliant
Angle between circle and test suite 400 is adjusted.Therefore, it is internal thread structure, auxiliary section by the way that mounting portion 122 is arranged
136 be external thread structure so that lifters 120 install and adjust it is easy to operate, convenient for improve working efficiency.
It should be pointed out that in other embodiments, mounting portion 122 or external thread structure, auxiliary section 136 is interior
Helicitic texture.
Further, in the present embodiment, wafer test positioning device 100 further includes bolt 140.Lifters 120 include
Base portion 124 and the riffled tube 126 for protruding from base portion 124.The surface of vacuum absorbing platform 130 towards loading end 112 is provided with
Threaded post, riffled tube 126 are screwed togather with threaded post.Base portion 124 is detachably secured to substrate 110 by bolt 140.
When work, rotating part lifters 120, part riffled tube 126 is further screwed togather with partial threads column.Therefore,
In the case where rest part lifters 120 remain stationary, the vacuum absorbing platform 130 of rotation portion and substrate 110 it
Between distance reduce and lead to 130 run-off the straight of vacuum absorbing platform, and then adjustable vacuum absorbing platform 130 and test suite
Angle between 400, to meet test needs.If be pointed out that excessive height of the vacuum absorbing platform 130 away from substrate or
When person is too low, all lifters 120 can also be rotated simultaneously, so that riffled tube 126 is screwed togather with multiple threaded posts, and then are made
It obtains 130 entirety opposing substrate 110 of vacuum absorbing platform to rise or fall, to meet the need of 130 test height of vacuum absorbing platform
It asks.After the height or Slope angle adjustment of vacuum absorbing platform 130, base portion 124 can be fixed on substrate 110 by bolt 140, with
Lifters 120 are avoided to occur to slide and influence test effect during the work time.Specifically, base portion 124 is opposite with substrate 110
Position offers threaded hole 128, and bolt 140 and the threaded hole 128 of base portion 124 and substrate 110 screw togather, you can by lifters
120 and vacuum absorbing platform 130 be stably fixed to substrate 110.Therefore, by the way that bolt 140 is arranged, lifters can be effectively prevent
120 move, and are tested for the property in the angle adjusted convenient for wafer, thus with preferably test effect.
Further, threaded post can be integrally formed with vacuum absorbing platform 130, can also be with vacuum absorbing platform 130
Separately molding, and vacuum absorbing platform 130 is fixed on towards the surface of substrate 110 by fastener.
Further, in the present embodiment, multiple threaded posts are along the equally circumferentially spaced of vacuum absorbing platform 130.
I.e. lifters 120 are also arranged along the axial direction of substrate 110 at equal intervals.Therefore, it is convenient for lifters 120 flat along vacuum suction
The stress that the equally spaced distribution vacuum absorbing platform 130 of circumferential direction of platform 130 applies, to avoid wafer test positioning device 100
Stress is concentrated and deforms or be broken, convenient for extending the service life of wafer test positioning device 100.Moreover, lifters
120 are set to the edge of substrate 110, also allow for On-Wafer Measurement positioning device 100 need carry out angle adjustment when to lifters
120 are operated.
In the present embodiment, wafer test positioning device 100 further includes locking nut 150.Locking nut 150 is sheathed on spiral shell
On line column, and screwed togather with threaded post.
By the way that locking nut 150 is arranged, the mounting portion 122 and vacuum absorbing platform 130 of lifters 120 can effectively avoid
The opposite sliding of position occurs after angle adjustment for auxiliary section 136, and then the gradient of vacuum absorbing platform 130 is kept to fix
It is constant, thus with preferably test effect.
In the present embodiment, wafer test positioning device 100 further includes heating rod 160 and temperature controller.Vacuum suction
The side wall of platform 130 offers the mounting hole being connected to vacuum chamber 132.Heating rod 160 is arranged in mounting hole, and with mounting hole
Inner wall is closely sealed.Temperature controller is electrically connected with heating rod 160.
Since wafer performance test need to carry out at high temperature, it can quickly be inhaled heating, vacuum by the way that heating rod 160 is arranged
Attached platform 130.Temperature controller can control heating rod 160 to be heated, and the temperature of vacuum absorbing platform 130 is maintained and is set
It sets in range, to have higher accurate testing degree.
Further, heating rod 160 is multiple.Multiple heating rods 160 are arranged at equal intervals.
The heating rod 160 being arranged at equal intervals heats up uniformly and rapidly convenient for vacuum absorbing platform 130, so that vacuum
The temperature difference of 130 surface of absorption platform everywhere is smaller, convenient for reducing test error, promotes measuring accuracy.
In the present embodiment, wafer test positioning device 100 further includes thermocouple 170.Thermocouple 170 and temperature controller
Electrical connection.Thermocouple 170 is used to measure the temperature value of vacuum absorbing platform 130 and feeds back to temperature controller.
Thermocouple 170 has the function of detecting 130 temperature of vacuum absorbing platform.Thermocouple 170 is electrically connected with temperature controller
It connects, the temperature value of the vacuum absorbing platform 130 of detection can be fed back to temperature controller.If the temperature value of feedback is higher than default temperature
Angle value, temperature controller will control heating rod 160 and stop heating, to realize cooling.If the temperature value of feedback is less than preset temperature
It is worth, then temperature controller is heated heating rod 160 is controlled, to realize heating.Therefore, it by the way that thermocouple 170 is arranged, is easy to implement
The 100 temperature controlled automation of wafer test positioning device.
In the present embodiment, wafer test positioning device 100 further includes vacuum generator 180 and vacuum exhaust pipe.Vacuum
Generator 180 is connected to by vacuum exhaust pipe with vacuum chamber 132.
By the way that vacuum generator 180 and vacuum exhaust pipe is arranged, the air entered in vacuum chamber can be taken away in time, then
132 good vacuum degree of vacuum chamber is maintained, wafer stabilizing is fixed on vacuum absorbing platform 130.And by vacuum generator
The vacuum chamber 132 of 180 pumpings and formation, vacuum environment are stablized, efficiently work convenient for wafer test positioning device 100.
In the present embodiment, wafer test positioning device 100 further includes vacuum induction device 190.Vacuum induction device 190 is used for
Detect the vacuum values of vacuum chamber 132.
Vacuum induction device 190 can measure and show to the vacuum values of vacuum chamber 132.Under normal circumstances, vacuum values are
Stable numerical value, when vacuum values change, it is possible to which there are mechanical breakdowns.Therefore, the setting of vacuum induction device 190, just
The vacuum environment of vacuum chamber can be monitored in real time in operating personnel, when mechanical breakdown occurs, can in time to failure into
Row investigation, improves the production efficiency of wafer test positioning device 100.
In the present embodiment, automation wafer test board 10 further includes airborne laser range finder 500.Airborne laser range finder 500 can
It is movably set to board 200 and is connect with controller communication.Airborne laser range finder 500 be used for obtain chip third direction thickness
Spend parameter, and feed back to controller, with calibration test component on third direction at a distance from chip surface.
Due between mechanically actuated there are inevitable error, the thickness of chip after molding can not possibly be kept
Unanimously.And in optical property and electrical performance testing, need the position to probe 422, launching fiber 414 and reception optical fiber 416
It sets and is moved, to reach good test effect.When test, probe 422 need to be contacted with the surface of chip, 422 displacement of probe
It is excessive, it is possible to excessive rigid contact occur with the surface of chip and damage chip.Launching fiber 414 and reception optical fiber 416
Also the surface with chip is needed within the scope of pre-determined distance, can be only achieved the effect of good transmitting and reception light.Therefore, pass through
Thickness parameter on the acquisition chip third direction of airborne laser range finder 500 is set, and feeds back to controller.Controller can be according to reception
The thickness parameter signal of airborne laser range finder 500 be compared with preset thickness value, and control probe 422, launching fiber 414 and
The position along third direction of reception optical fiber 416 is moved, to avoid probe 422, launching fiber 414 and reception optical fiber 416 and core
Rigid contact between piece surface, to reach good test effect.
In the present embodiment, automation wafer test board 10 further includes camera positioning component 700.Camera positioning component
700 are set to board 200, and corresponding with test station 220.Camera positioning component 700 is connect with controller communication.Camera positions
Component 700 feeds back to controller for taking pictures towards test station 220 after being compared with default photo.
By the way that camera positioning component 700 is arranged, the position of chip can accurately be positioned, to reach good test
Effect.
Specifically, camera positioning component 700 includes camera 710, Locating driver part (not shown) and positioning slide 720.It is fixed
Position sliding rail 720 extends along third direction.Camera 710 is slidably disposed in positioning slide 720, Locating driver part and camera 710
It is sequentially connected.Before test, Locating driver part drives camera 710 to be slided along third direction, so that camera 710 is moved to suitable bat
According to position.When test, Locating driver part does not work, and 710 position of camera is fixed.Camera 710 is taken pictures towards test station 220, and will
The photo of shooting is compared with default photo.If the photo and default photo of shooting are inconsistent, camera 710 will be sent out to controller
Send feedback signal.Controller controls angle-adjusting mechanism 300 and wafer test positioning device 100 is driven to translate or rotate, with adjustment
The position of chip is until corresponding with test station 220.In addition, after the completion of the performance test of chip, when wafer is removed, in order to
Easy to operation, Locating driver part drives camera 710 to be moved along the direction backwards to mounting surface 210, to be conveniently operated personnel by wafer
It removes.
In the present embodiment, automation wafer test board 10 further includes two Xelminators 600.Two static eliminations
Device 600 is respectively arranged at the both ends of board 200, to form static elimination region.Angle-adjusting mechanism 300, wafer test positioning
Device 100 and test suite 400 are respectively positioned in static elimination region.
Automation wafer test board 10 needs to be powered when working, and the engineering goods of energization will produce electrostatic at work.
And electrostatic will influence the test of the electric property of chip, to reduce the measuring accuracy of chip.Therefore, by the way that static elimination is arranged
Device 600 can eliminate the electrostatic in 10 course of work of automation wafer test board, to improve the measuring accuracy of chip.
The course of work of automation wafer test board 10 is sketched by being described below：
Controller controls angle-adjusting mechanism 300 and moves, and wafer test positioning device 100 and chip is driven to be moved to test
Station 220.Camera 710 is taken pictures towards test station 220, and the photo of shooting is compared with default photo, by comparison result
Feed back to controller.Controller is judged according to feedback result, if chip is not at test station 220, controller continues
It controls angle-adjusting mechanism 300 to move, until chip is moved to test station 220.In turn, controller controls airborne laser range finder
500 pairs of chips are measured in the thickness parameter of third direction, and the thickness parameter of measurement is compared with preset parameter value,
And test suite 400 is controlled according to comparison result and is moved to the test position with preferably test effect, test suite 400 is to core
Piece is tested for the property, and test result is fed back to controller.After the completion of test, controller controls turntable 312 and rotates, wafer
On next chip to be measured be moved to test station 220 and be tested for the property.
Above-mentioned automation wafer test board 10, wafer is fixed on the surface of wafer test positioning device 100.When work,
Controller controls the rotation of rotary components 310 or translation component 320 translates, and drives the position of wafer test positioning device 100 and wafer
It sets and moves, so that chip is moved to test station 220.In turn, controller control test suite 400 is moved to test station
220, and chip performance is tested.Compared with existing semi-automatic test board, above-mentioned automation wafer test board 10
The automation of test process can be fully achieved, thus test speed is fast, testing efficiency is high.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of automation wafer test board, for fixing and testing the chip on wafer, which is characterized in that including：
The board to play a supportive role has mounting surface, test station is provided on the mounting surface；
It is set to the angle-adjusting mechanism of the mounting surface, including rotary components and translation component；
Wafer test positioning device is installed on the angle tune for adsorbing simultaneously fixed chip, the wafer test positioning device
For complete machine structure backwards to the surface of the mounting surface, the angle-adjusting mechanism can drive the wafer test positioning device to rotate or put down
It moves, to drive the chip to be moved to the test station；
Test suite, is set to the board, and the test suite is used to carry out performance to the chip positioned at the test station
Detection；And
Controller is connected with the angle-adjusting mechanism and test suite communication, and the controller is used for respectively to described
Angle-adjusting mechanism and the test suite send trigger signal, to trigger the angle-adjusting mechanism and the test suite.
2. wafer test board according to claim 1, which is characterized in that the translation component includes：
First translating element, including the first sliding rail, first motor and the first sliding block that extend in a first direction, first sliding rail are solid
Due to the mounting surface, first sliding block is slidably disposed in first sliding rail, and the first motor is for driving institute
The first sliding block is stated to slide along first sliding rail；And
Second translating element, including the second sliding rail, the second motor and the second sliding block that extend in a second direction, second sliding rail are solid
Due to first sliding block backwards to the surface of first sliding rail, second sliding block is slidably disposed in described second and slides
Rail, the rotary components and the wafer test positioning device are fixed on table of second sliding block backwards to second sliding rail
Face, second motor is for driving second sliding block to be slided along second sliding rail.
3. automation wafer test board according to claim 2, which is characterized in that the rotary components include turntable and
Actuator, the turntable are rotatablely arranged at the surface of second sliding block, and the actuator is sequentially connected with the turntable,
The wafer test positioning device is fixed on the turntable backwards to the surface of second sliding block.
4. automation wafer test board according to claim 2, which is characterized in that the test suite includes：
Optical module, including launching fiber, reception light, optical drive part and edge are perpendicular to the first direction and described second
The optics guide rail that the third direction in direction extends, the optical drive part is for driving the launching fiber and the reception optical fiber
It is moved along the optics guide rail；
Electric components, the electric components include probe, electricity actuator and edge perpendicular to the first direction and described second
The electricity guide rail that the third direction in direction extends, the electricity actuator is for driving the probe to be moved along the electricity guide rail
It is dynamic.
5. automation wafer test board according to claim 4, which is characterized in that further include airborne laser range finder, it is described
Airborne laser range finder is movably arranged at the board and is connect with the controller communication, and the airborne laser range finder is for obtaining
The chip and feeds back to the controller in the thickness parameter of the third direction, to calibrate the test suite described
On third direction at a distance from the chip surface.
6. automation wafer test board according to claim 1, which is characterized in that further include camera positioning component, institute
It states camera positioning component and is set to the board, and is corresponding with the test station, the camera positioning component and the control
Device communication connection, the camera positioning component are fed back for taking pictures towards the test station after being compared with default photo
To the controller.
7. automation wafer test board according to claim 1, which is characterized in that further include two Xelminators,
Described two Xelminators are respectively arranged at the both ends of the board, and to form static elimination region, the angle adjusts machine
Structure, the wafer test positioning device and the test suite are respectively positioned in the static elimination region.
8. automation wafer test board according to claim 2, which is characterized in that the wafer test positioning device packet
It includes：
The substrate to play a supportive role has loading end；
Multiple lifters are installed on the loading end；
Vacuum absorbing platform, is set to the one end of the multiple lifters far from the loading end, and the multiple lifters can band
The vacuum absorbing platform is moved to lift along the first direction；The vacuum absorbing platform has vacuum chamber, the vacuum suction
The surface of platform offers multiple vacuum absorption holes being connected to the vacuum chamber.
9. automation wafer test board according to claim 8, which is characterized in that be respectively provided in the multiple lifters
There are mounting portion, the side of the vacuum absorbing platform towards the loading end to be provided with multiple auxiliary sections, the mounting portion is interior
Helicitic texture, the auxiliary section are external thread structure, and the multiple auxiliary section coordinates with the multiple mounting portion respectively, so that institute
It states and forms threads turn connection between lifters and the vacuum absorbing platform.
10. automation wafer test board according to claim 9, which is characterized in that further include locking nut, the lock
Tight nut is sheathed on the external thread structure, and is screwed togather with the external thread structure.
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| CN201810467796.XA CN108493124A (en) | 2018-05-16 | 2018-05-16 | Automate wafer test board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810467796.XA CN108493124A (en) | 2018-05-16 | 2018-05-16 | Automate wafer test board |
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Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109607183A (en) * | 2018-11-22 | 2019-04-12 | 青岛海信宽带多媒体技术有限公司 | A kind of chip transfer feed mechanism |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200403440A (en) * | 2002-08-23 | 2004-03-01 | Tokyo Electron Ltd | Probe apparatus |
| WO2008078886A1 (en) * | 2006-12-27 | 2008-07-03 | Secron Co., Ltd. | Carrying apparatus for probe card |
| CN101261306A (en) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | Full-automatic wafer test method and equipment accomplishing the method |
| CN206930687U (en) * | 2017-06-22 | 2018-01-26 | 珠海市中芯集成电路有限公司 | Probe test means for correcting for wafer sort |
| JP2018037538A (en) * | 2016-08-31 | 2018-03-08 | 株式会社東京精密 | Prober |
| CN208225844U (en) * | 2018-05-16 | 2018-12-11 | 深圳市杰普特光电股份有限公司 | Automate wafer tester |
| CN208225861U (en) * | 2018-05-16 | 2018-12-11 | 深圳市杰普特光电股份有限公司 | Wafer test positioning device |
| CN208284457U (en) * | 2018-05-16 | 2018-12-25 | 深圳市杰普特光电股份有限公司 | Automate wafer test board |
-
2018
- 2018-05-16 CN CN201810467796.XA patent/CN108493124A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200403440A (en) * | 2002-08-23 | 2004-03-01 | Tokyo Electron Ltd | Probe apparatus |
| WO2008078886A1 (en) * | 2006-12-27 | 2008-07-03 | Secron Co., Ltd. | Carrying apparatus for probe card |
| CN101261306A (en) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | Full-automatic wafer test method and equipment accomplishing the method |
| JP2018037538A (en) * | 2016-08-31 | 2018-03-08 | 株式会社東京精密 | Prober |
| CN206930687U (en) * | 2017-06-22 | 2018-01-26 | 珠海市中芯集成电路有限公司 | Probe test means for correcting for wafer sort |
| CN208225844U (en) * | 2018-05-16 | 2018-12-11 | 深圳市杰普特光电股份有限公司 | Automate wafer tester |
| CN208225861U (en) * | 2018-05-16 | 2018-12-11 | 深圳市杰普特光电股份有限公司 | Wafer test positioning device |
| CN208284457U (en) * | 2018-05-16 | 2018-12-25 | 深圳市杰普特光电股份有限公司 | Automate wafer test board |
Cited By (31)
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|---|---|---|---|---|
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| CN109607183A (en) * | 2018-11-22 | 2019-04-12 | 青岛海信宽带多媒体技术有限公司 | A kind of chip transfer feed mechanism |
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| CN109757094A (en) * | 2019-02-01 | 2019-05-14 | 南昌大学 | A kind of detection repairing mounting device towards Micro LED chip |
| CN109757094B (en) * | 2019-02-01 | 2023-10-03 | 南昌大学 | Detection repair mounting equipment for Micro LED chip |
| CN112098768A (en) * | 2019-05-30 | 2020-12-18 | 上海新微技术研发中心有限公司 | Method and equipment for testing silicon optical chip |
| CN110320462A (en) * | 2019-07-04 | 2019-10-11 | 范群意 | A kind of test device and wafer automatic testing machine |
| CN110646725A (en) * | 2019-09-02 | 2020-01-03 | 深圳市极致兴通科技有限公司 | Rapid testing device and testing method for laser chip semi-finished product |
| CN110702526A (en) * | 2019-10-14 | 2020-01-17 | 中芯集成电路制造(绍兴)有限公司 | Wafer air pressure resistance reliability testing equipment and testing method thereof |
| CN110757278A (en) * | 2019-10-23 | 2020-02-07 | 清华大学 | Wafer thickness measuring device and grinding machine |
| CN113291813A (en) * | 2020-02-21 | 2021-08-24 | 长鑫存储技术有限公司 | Wafer processing system, semiconductor machine automatic leveling device and leveling method thereof |
| CN113291813B (en) * | 2020-02-21 | 2022-05-27 | 长鑫存储技术有限公司 | Wafer processing system, semiconductor machine automatic leveling device and leveling method thereof |
| CN112630566A (en) * | 2020-12-10 | 2021-04-09 | 江西舜源电子科技有限公司 | Electrical property detection device of semiconductor wafer |
| CN112630566B (en) * | 2020-12-10 | 2024-02-27 | 江西舜源电子科技有限公司 | Electrical property detection device of semiconductor wafer |
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| CN113299585A (en) * | 2021-07-26 | 2021-08-24 | 武汉中导光电设备有限公司 | Z-Theta combined device for wafer detection |
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