CN109757094B - Detection repair mounting equipment for Micro LED chip - Google Patents
Detection repair mounting equipment for Micro LED chip Download PDFInfo
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- CN109757094B CN109757094B CN201910104238.1A CN201910104238A CN109757094B CN 109757094 B CN109757094 B CN 109757094B CN 201910104238 A CN201910104238 A CN 201910104238A CN 109757094 B CN109757094 B CN 109757094B
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- 238000001514 detection method Methods 0.000 title claims abstract description 41
- 230000008439 repair process Effects 0.000 title claims abstract description 26
- 230000000007 visual effect Effects 0.000 claims abstract description 12
- 238000013519 translation Methods 0.000 claims description 16
- 238000007689 inspection Methods 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000000608 laser ablation Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Abstract
The invention discloses Micro LED chip-oriented detection repair mounting equipment which comprises a Micro LED chip lighting unit, a Micro LED chip double positioning unit, a Micro LED chip chuck unit, a laser stripping unit, a visual detection adjusting unit, a bracket serving as a mounting foundation for the Micro LED chip, and the like, wherein the Micro LED chip is lighted by the Micro LED chip lighting unit, a Micro LED chip is firstly positioned by a coarse positioning part in the Micro LED chip double positioning unit, a Micro LED chip damaged by the detection and positioning part of a overlooking camera in the visual detection adjusting unit is detected and positioned, the fine positioning part is moved to a repairable mounting position, the Micro LED chip is peeled off from a Micro LED chip disc by the laser unit, the falling track of the Micro LED chip is judged and adjusted by the side view camera part, the repair mounting of the Micro LED chip is finally realized, and after the repair is completed, the Micro LED chip is subjected to visual detection again by the overlooking camera to ensure the success of the repair, so that all module units are mutually connected and cooperatively and remarkably improve the repair mounting efficiency of the Micro LED chip.
Description
Technical Field
The invention relates to the technical field of detection repair equipment for Micro LED chips, in particular to detection repair mounting equipment for Micro LED chips.
Background
With the rapid development of the information industry, the electronic products are widely applied, and the demand of the electronic products is increasing. The Micro electronic components such as Micro LED chips are the minimum unit of electronic products, and are the basis for manufacturing and application of electronic products. At present, along with the huge increase of the demands of electronic components on the types and the quantity, the huge transfer and mounting technology of Micro LED chips is gradually mature, but the detection and repair field of the Micro LED chips is still vacant, and the detection and repair mounting equipment of the Micro LED chips has an indispensable effect on improving the high efficiency and the reliability of the production of the Micro LED chips. Industrial production is also increasingly important, and research on detection and repair technology is imperative.
At present, no mature detection repair mounting equipment for Micro LED chips exists, so in order to meet the requirements of the existing mass transfer and mounting equipment on high efficiency and reliability, a set of mature detection repair mounting equipment for Micro LED chips is developed without delay, and accordingly, the field needs to seek a perfect solution aiming at the technical requirements so as to meet the current increasingly-improved technical requirements.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides the detection repair mounting equipment for the Micro LED chip, which solves the problems of huge transfer and high efficiency and reliability of the mounting equipment in working movement.
(II) technical scheme
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a patch equipment is repaired in detection towards Micro LED chip, includes Micro LED chip lighting unit, micro LED chip double positioning unit, micro LED chip chuck unit, laser instrument stripping unit and vision detection adjustment unit, and as above each unit installation basic support, LED chip lighting unit includes contact module and contact movable module, contact module and contact movable module all slidable mounting are on the basic support of LED chip lighting unit.
Preferably, the Micro LED chip double-positioning unit comprises an X-direction translation module, a Y-direction translation module, an X-direction axial movement module, a Y-direction axial movement module and a Z-direction axial movement module, wherein the X-direction translation module, the Y-direction translation module, the X-direction axial movement module, the Y-direction axial movement module and the Z-direction axial movement module are all slidably mounted on a support frame of the LED chip double-positioning unit, two square rings are arranged at the bottom of the support frame of the LED chip double-positioning unit, the Micro LED chip chuck unit of the square rings comprises a chuck and a Micro LED chip disc, the Micro LED chip disc is arranged on the inner wall of the chuck, the Micro LED chip disc is in sliding connection with the chuck, and four symmetrically arranged wedge blocks and built-in springs are fixedly connected with the inner wall of the chuck.
Preferably, the laser stripping unit is arranged at the bottom of the transverse plate of the basic bracket in an inverted mode, and the adhesive layer of the Micro LED chip adhered to the chip disc is failed in adhesion through laser ablation reaction, so that the Micro LED chip is stripped and falls.
Preferably, the visual detection unit comprises a overlook detection camera and a side-type detection camera, and the visual detection unit and the overlook detection camera are oppositely arranged to realize visual positioning of the Micro LED chip.
Preferably, a square ring is arranged above the Micro LED chip chuck unit, and the bottom of the square ring is in sliding connection with the top of the chuck through a sliding block.
(III) beneficial effects
The invention provides detection repair mounting equipment for Micro LED chips. The beneficial effects are as follows:
(1) According to the detection repair mounting equipment for the Micro LED chips, the targeted design is carried out by combining the technological characteristics of flip-chip bonding of the Micro LED chips, the overall structure of the detection equipment is correspondingly subjected to layout design again, the high-precision synchronous repair of multiple suction nozzles can be realized, and the production efficiency is remarkably improved compared with the existing equipment.
(2) According to the detection repair mounting equipment for the Micro LED chips, the specific composition structure and the arrangement mode of key components are researched and improved, and particularly, means such as horizontal rotation butt joint between an inverted Micro LED chip transfer unit and a large/small turntable unit are adopted, so that high-efficiency Micro LED chip transfer can be realized, and high positioning accuracy and operation convenience are ensured; in addition, the specific composition structure of each suction nozzle component is correspondingly designed, the whole structure of the mounting equipment is compact, the layout is ingenious, the operation is simple, and the module units are mutually connected and cooperate, so that the mounting equipment is particularly suitable for large-scale production occasions of Micro LED chip flip-chip bonding mounting, the efficiency of Micro LED chip repairing mounting is remarkably improved, and meanwhile, the effect of detecting and repairing Micro LED chips at high precision and high speed is obtained.
Drawings
FIG. 1 is a schematic diagram of a Micro LED chip repair device;
FIG. 2 is a flow chart for Micro LED chip repair;
fig. 3 is a schematic perspective view of a Micro LED chip-oriented inspection repair mounting apparatus constructed in accordance with a preferred embodiment of the present invention;
FIG. 4 is a side view of the main structure of the inspection patch mounting apparatus shown in FIG. 1;
FIG. 5 is a schematic diagram of the coarse positioning portion of the Micro LED chip dual positioning unit and the visual inspection unit and laser unit shown in FIG. 1;
FIG. 6 is a schematic diagram of the fine positioning portion of the Micro LED chip dual positioning unit and the Micro LED chip chuck unit shown in FIG. 1;
fig. 7 is a front view of a main structure of the inspection repair mounting apparatus shown in fig. 1.
In the figure: 100. a Micro LED chip lighting unit; 101. a contact module; 102. a contact moving module; 200. micro LED chip double positioning units; 201. an X-direction translation module; 202. a Y-direction translation module; 203. a Z-axis moving module; 204. an X-axis moving module; 205. a Y-axis moving module; 206. a slide block; 207. a square ring; 300. a Micro LED chip chuck unit; 301. a chuck; 302. wedge blocks; 303. micro LED chip tray; 400. a laser peeling unit; 500. a visual sense detection adjustment unit; 501. a top-down detection camera; 502. a side-type detection camera.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-7, the present invention provides a technical solution: the Micro LED chip double positioning unit 200 comprises an X-direction translation module 201, a Y-direction translation module 202, an X-direction axial movement module 204, a Y-direction axial movement module 205 and a Z-direction axial movement module 203, wherein the X-direction translation module 201, the Y-direction translation module 202, the X-direction axial movement module 204, the Y-direction axial movement module 205 and the Z-direction axial movement module 203 are all arranged on a support frame of the LED chip double positioning unit 200 in a sliding manner, the bottom of the supporting frame of the LED chip double-positioning unit 200 is provided with two square rings 207, the Micro LED chip chuck unit 300 of the square rings 207 comprises a chuck 301 and a Micro LED chip disc 303, the Micro LED chip disc 303 is arranged on the inner wall of the chuck 301, the Micro LED chip disc 303 is connected with the chuck 301 in a sliding way, the inner wall of the chuck 301 is fixedly connected with four symmetrically arranged wedge blocks 302 and built-in springs, the laser stripping unit 400 is arranged on the bottom of a transverse plate of a basic bracket in an inverted way, the adhesive layer of the Micro LED chip adhered on the chip disc is failed through laser ablation reaction, the Micro LED chip is stripped and falls, the visual detection unit 500 comprises a overlook detection camera 501 and a side-type detection camera 502, the visual detection unit 500 and the overlook detection camera 501 are arranged oppositely, so as to realize visual positioning of the Micro LED chip, the Micro LED chip chuck unit 300 is provided with a square ring 207 above, the bottom of the square ring 207 is in sliding connection with the top of the chuck 301 through a sliding block 206, the Micro LED chip double-positioning unit 200 comprises a coarse positioning part and a fine positioning part which are based on a large plane, the coarse positioning part which is based on the large plane comprises an X-direction translation module 201 and a Y-direction translation module 202, the Micro LED chip lighting unit 100 comprises a contact module 101 and a contact moving module 102, the two modules realize the function of quickly lighting up and detecting a fault Micro LED chip, the X-direction linear motor realizes X-axis movement and Y-axis movement through the Y-direction linear motor to accurately position the Micro LED chip disc, at the moment, after a falling track is determined through the scanning of a camera, the Micro LED chip in the Micro LED chip disc falls down to repair by utilizing a laser stripping technology, then the Micro LED chip is moved to the next fault location by utilizing the X-direction linear motor to repair the Micro LED chip.
When the Micro LED chip is used, when the Micro LED chip is conveyed to the repairing device, the position of a fault wafer is found by the lighting device, then the fault wafer is scanned through overlooking and side-looking industrial cameras to determine the accurate coordinates, the X-axis linear motor and the Y-axis linear motor are driven to move in the X-axis direction and the Y-axis direction and are positioned to the repairing position, the Z-axis motor enables the device to be close to, the side-looking camera buckles and draws the Micro LED chip to be similar to a falling track of the Micro LED chip through an algorithm, the Micro LED chip is stripped and falls through the laser, the repairing device is used for detecting whether the fault is eliminated after the repairing is finished, wherein the Micro LED chip is contacted with the contact module after being moved to the fixed position, the contact is moved to the position of the conducting hole and is lighted through the contact moving module, the specific position is captured through the industrial camera, the X-axis movement is realized through the X-axis linear motor, the Y-axis movement is realized through the Y-axis linear motor to accurately position the Micro LED chip, at the moment, the Micro LED chip is well positioned to the position of the Micro LED chip in the Micro LED chip is removed through the Z-axis linear motor, the falling track is determined to strip the falling track through the Z-direction motor, the Micro LED chip is stripped and is used for repairing the fault LED chip to be identical to be stripped and removed through the laser, the laser chip is stripped and removed through the laser on the same line after the laser stripping chip is moved to the laser to the position to be stripped and completely and removed through the laser chip to be used for repairing the fault LED chip after the fault chip is stripped and completely and removed, and all that is not described in detail in this specification is well known to those skilled in the art.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (2)
1. The utility model provides a patch equipment is repaired in detection towards Micro LED chip, includes Micro LED chip lighting unit (100), micro LED chip double positioning unit (200), micro LED chip chuck unit (300), laser instrument stripping unit (400) and vision detection adjusting unit (500) to and set up in each unit as the basic support of installation basis, its characterized in that above: the LED chip lighting unit (100) comprises a contact module (101) and a contact moving module (102), wherein the contact module (101) and the contact moving module (102) are both slidably arranged on a basic bracket of the LED chip lighting unit (100);
the Micro LED chip double-positioning unit (200) comprises an X-direction translation module (201), a Y-direction translation module (202), an X-axis movement module (204), a Y-axis movement module (205) and a Z-axis movement module (203), wherein the X-direction translation module (201), the Y-direction translation module (202), the X-axis movement module (204), the Y-axis movement module (205) and the Z-axis movement module (203) are all slidably mounted on a support frame of the LED chip double-positioning unit (200);
the bottom of the support frame of the LED chip double-positioning unit (200) is provided with two square rings (207), a Micro LED chip chuck unit (300) of each square ring (207) comprises a chuck (301) and a Micro LED chip disc (303), the Micro LED chip disc (303) is arranged on the inner wall of the chuck (301), the Micro LED chip disc (303) is connected with the chuck (301) in a sliding manner, and four symmetrically arranged wedge-shaped blocks (302) and built-in springs are fixedly connected on the inner wall of the chuck (301);
a square ring (207) is arranged above the Micro LED chip chuck unit (300), and the bottom of the square ring (207) is connected with the top of the chuck (301) in a sliding manner through a sliding block (206);
the laser stripping unit (400) is arranged at the bottom of the transverse plate of the basic bracket in an inverted mode, the side view camera is buckled and drawn and simulates a falling track of the Micro LED chip through an algorithm, and the adhesive layer of the Micro LED chip adhered to the chip disc is failed in adhesive strength through the laser ablation reaction of the laser stripping unit (400), so that the Micro LED chip is stripped and falls.
2. The Micro LED chip-oriented inspection repair mounting device according to claim 1, wherein: the visual detection and adjustment unit (500) comprises a overlook detection camera (501) and a side-view detection camera (502), wherein the overlook detection camera (501) and the side-view detection camera (502) are oppositely arranged, so that the visual positioning of the Micro LED chip is realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910104238.1A CN109757094B (en) | 2019-02-01 | 2019-02-01 | Detection repair mounting equipment for Micro LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910104238.1A CN109757094B (en) | 2019-02-01 | 2019-02-01 | Detection repair mounting equipment for Micro LED chip |
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| Publication Number | Publication Date |
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| CN109757094A CN109757094A (en) | 2019-05-14 |
| CN109757094B true CN109757094B (en) | 2023-10-03 |
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| CN201910104238.1A Active CN109757094B (en) | 2019-02-01 | 2019-02-01 | Detection repair mounting equipment for Micro LED chip |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111341682A (en) * | 2020-02-09 | 2020-06-26 | 纳晶科技股份有限公司 | Chip overhauling device and method for display substrate |
| CN111243976A (en) * | 2020-03-17 | 2020-06-05 | 南京中电熊猫平板显示科技有限公司 | Detection and repair equipment and method |
| CN113368916A (en) * | 2021-07-15 | 2021-09-10 | 合肥市华达半导体有限公司 | Integrative platform of detection and maintenance suitable for 32 MCU chips |
| CN114141158B (en) * | 2021-11-08 | 2023-06-16 | 星源电子科技(深圳)有限公司 | Micro-LED backboard repairing device convenient to operate and use |
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Effective date of registration: 20240528 Address after: Room 104, Building 2, No. 657 Donghuan Road, Gusu District, Suzhou City, Jiangsu Province, 215008 (Room 104-70, Building E, Chuangzhi Yingjia) Patentee after: Suzhou Jinwuyuan Technology Co.,Ltd. Country or region after: China Address before: 999 No. 330000 Jiangxi province Nanchang Honggutan University Avenue Patentee before: Nanchang University Country or region before: China |