CN104483617A - Online flip LED chip detection device - Google Patents
Online flip LED chip detection device Download PDFInfo
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- CN104483617A CN104483617A CN201410851945.4A CN201410851945A CN104483617A CN 104483617 A CN104483617 A CN 104483617A CN 201410851945 A CN201410851945 A CN 201410851945A CN 104483617 A CN104483617 A CN 104483617A
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- flip led
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Abstract
The invention discloses an online flip LED chip detection device which comprises a workbench module, a transport conveying assembly, a light collection test assembly, a probe test platform and a precise alignment system. In the working process, the transport conveying assembly can transport a flip LED chip to be tested to a proper working region. The flip LED chip to be tested is made to be aligned with a light collection opening in the light collection test assembly. After the pose of the chip is adjusted, the probe test platform is started, a probe is made to make contact with the chip to be tested and powered, the chip is made to emit light, and thus the light collection test assembly can detect the chip. According to the mechanical structure of the online flip LED chip detection device, the problem that a flip LED chip electrode is not on the same side as a light-emitting face can be successfully solved, a precise image motion control technology is adopted, a high-speed precise test of the flip LED chip is achieved, and the detection efficiency of the chip is accelerated.
Description
Technical field
The invention belongs to flip LED chips detection field, more specifically, relate to a kind of full-automatic on-line measuring device towards flip LED chips.
Background technology
Flip LED chips is than traditional packed LED chip, light efficiency and production cost all have improvement in various degree, the importance of flip LED chips is also more outstanding, simultaneously also new requirement is proposed to the detection technique of its correspondence and equipment, flip LED chips online detection instrument is for completing the detection of flip LED chips photoelectric parameter and generating unified data file by parametric classification, cooperated with LED screening installation realizes the classification to flip LED chips, improving product added value.
Existing LED chip checkout equipment spininess is to packed LED chip, and along with the large-scale application of flip LED chips, and the checkout equipment of conventional packed LED chip also can not simply indiscriminately imitate use, therefore, detection testing apparatus and the method for developing new flip LED chips also seem very important thereupon, such as patent documentation CN103149524A of the prior art discloses a kind of test machine and method of testing thereof of flip LED chips, but this kind of test machine and method of testing have following technological deficiency: (1) does not consider the quick-fit realizing each building block how better, (2) do not consider how the efficiency how improving and receive optical tests and measuring accuracy improve.Along with the fast development of LED industry and the raising of flip LED chips production technology, must research and develop better for the quick online detection equipment of flip LED chips.
Summary of the invention
For above defect or the Improvement requirement of prior art, the invention provides a kind of flip LED chips on-line measuring device, solve the intelligence of flip LED chips, test problem fast and accurately thus.
For achieving the above object, according to one aspect of the present invention, provide a kind of flip LED chips on-line measuring device, it is characterized in that, this device comprises: bench top module, receipts optical tests assembly, transport transmission assembly, probe test platform, Precision alignment systems, wherein bench top module comprises objective table, be provided with the disc for loading multiple chip to be tested, described bench top module is arranged on transport transmission assembly, realizes the location of chip to be tested on described bench top module under it drives translocation;
Receiving optical tests assembly is arranged under described bench top module, and it comprises integrating sphere assembly, optic test assembly; Described integrating sphere assembly comprises integrating sphere module, integrating sphere fixture and integrating sphere jacking gear; Wherein said integrating sphere module comprises integrating sphere, and described integrating sphere, after described flip LED chips to be tested completes location, is pushed to the luminous flat of described chip to be measured and holds out against described disc by described integrating sphere jacking gear; Described optic test assembly is for receiving and analyzing the light signal to be tested of integrating sphere collection and analyze it;
Probe test platform is arranged on described bench top module, it comprises probe base, probe base jacking gear and probe, wherein probe base jacking gear is elevated for driving described probe base with the contact and the disengaging that complete described probe and described chip to be tested, thus realize energising and light described flip LED chips to be tested, realize test.
Further, the integration mouth place of described integrating sphere is provided with plate, and it is set to plane, completes thus and makes described integrating sphere hold out against described disc, the transmittance of described plate more than 92% and hardness in Mohs value more than 6.
Further, the material of described plate is the one in quartz glass, K9 glass, fused quartz, jewel, calcium fluoride or magnesium fluoride.
Further, described integrating sphere module bottom is also provided with integrating sphere 90 ° of adapters.
Further, this on-line measuring device also comprises Precision alignment systems, and it comprises two cameras, and one is positioned at scanning area for scanning the pose of described chip to be measured, and one is positioned at detection zone for realizing the aligning of the described probe of described probe test platform.
Further, described bench top module also includes shaft rotating motor, its driving belt is wound around described objective table, for controlling its rotary motion, thus adjusts the pose of described chip to be measured.
Further, the coordinates of motion of the transport transmission assembly that flip LED chips to be tested described in every block that the posture information of described scanning comprises from described scanning area to described test section is corresponding and described shaft rotating motor.
Further, described transport transmission assembly comprises X-axis module and Y-axis module, thus realizes the motion of X/Y two axis, and wherein X-axis module comprises X-axis guide rail, X-axis pedestal and drives described X-axis pedestal along the reciprocating drive unit of described X-axis guide rail; Wherein Y-axis module comprises Y-axis guide rail, Y-axis pedestal and drives described Y-axis pedestal along the reciprocating drive unit of described Y-axis guide rail.
Further, described on-line measuring device is arranged on a base, is provided with a support, and described transport transmission assembly is arranged on described base and under being positioned at described support, described probe test platform is arranged on described support.
Further, comprise described integrating sphere jacking gear and comprise air cylinder fixed plate and propulsion cylinder, described air cylinder fixed plate is fixed on base, and the main body of described propulsion cylinder is embedded in described base.
In general, the above technical scheme conceived by the present invention compared with prior art, can obtain following beneficial effect:
(1) composition of device of the present invention is more complicated with precision, to the intellectuality of on-line testing with improve measuring accuracy and testing efficiency has great help;
(2) the present invention innovatively installs to the plate of certain material the receipts light mouth place of integrating sphere, not only makes physical construction compacter, and is more conducive to integrating sphere receipts light and prevents dust from entering integrating sphere.
In a word, the present invention has the outstanding features such as design is ingenious, positioning precision is high, complete machine stability is good.
Accompanying drawing explanation
Fig. 1 is the overall schematic of the flip LED chips pick-up unit according to the present invention's realization;
Fig. 2 be according to the present invention realize flip LED chips pick-up unit disc worktable and transport transmission system detailed schematic;
Fig. 3 is the vertical view of the flip LED chips pick-up unit according to the present invention's realization.
In all of the figs, identical Reference numeral is used for representing identical element or structure, wherein:
1-bench top module 2-receives optical tests assembly 3-and transports 8-detection zone, transmission assembly 4-probe test platform 5-Precision alignment systems 6-quartz glass 7-scanning area 9-base 10-support 11-objective table 111-disc 12-shaft rotating motor 21-integrating sphere assembly 211-integrating sphere module 212-integrating sphere fixture 213-integrating sphere jacking gear 2131-air cylinder fixed plate 2132-propulsion cylinder 2111-integrating sphere 2112-integrating sphere 90 ° of adapter 22-optic test assembly 221-brightness probe 222-optical fiber 223-anti-dazzling screen 31-X axle module 32-Y axle module 311-X axle pedestal 312-X axis rail 313-X axial brake device 321-Y axle pedestal 322-Y axis rail 323-Y axial brake device 41-probe base 42-probe base jacking gear 43-probes
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.In addition, if below in described each embodiment of the present invention involved technical characteristic do not form conflict each other and just can mutually combine.
In the present embodiment, flip LED chips proving installation comprises bench top module 1, receives optical tests assembly 2, transports transmission assembly 3, probe test platform 4, Precision alignment systems 5;
Wherein bench top module 1 comprises objective table 11, shaft rotating motor 12;
Wherein receive optical tests assembly 2 and comprise integrating sphere assembly 21 and optic test assembly 22, wherein integrating sphere module 21 comprises integrating sphere module 211, integrating sphere fixture 212, integrating sphere jacking gear 213;
Wherein integrating sphere module 211 comprises integrating sphere 2111, integrating sphere 90 ° of adapters 2112;
Optic test assembly 22 comprises brightness probe 221, optical fiber 222 and follow-up optical parametric analytical equipment; Integrating sphere jacking gear 213 comprises air cylinder fixed plate 2131, propulsion cylinder 2132; The opening of integrating sphere 2111 device is provided with quartz glass 6;
Transport transmission assembly 3 comprises X-axis module 31, Y-axis module 32; Wherein X-axis module 31 comprises X-axis pedestal 311, X-axis guide rail 312, and drives described X-axis pedestal 311 along the reciprocating X-axis drive unit 313 of X-axis guide rail 312, and this X-axis drive unit can be motor etc.; Y-axis module 32 comprises Y-axis pedestal 321, Y-axis guide rail 322, and drives described Y-axis pedestal 321 along the reciprocating Y-axis drive unit 323 of Y-axis guide rail 322, and this Y-axis drive unit can be motor etc.;
Wherein probe test platform 4 comprises probe base 41, probe base jacking gear 42, probe 43; The controlled manufacturing probe seat 41 of probe base jacking gear 42 moves up and down, thus control probe 43 contacts with the pin of flip LED chips to be tested and departs from, and probe base 41 is energized to probe 43, thus realize the optical parametric test under the energising illuminating state of LED chip.
Precision alignment systems 5 comprises two vision systems, and one is positioned at 7, one, scanning area and is positioned at detection zone 8;
Further, the facilities of involved in present embodiment flip LED chips on-line measuring device is as follows:
Flip LED chips LED on-line measuring device of the present invention is arranged on a base 9, base is arranged a support 10, transport transmission assembly 3 is for loading LED flip LED chips to be tested, it is arranged at the below of support 10, receiving optical tests assembly 2 is arranged on base 9, probe test platform 4 is arranged on support 10, namely be, by the motion of transport transmission assembly 3, objective table is transported to detection zone 8, the probe test platform 4 be arranged on support 10 controls probe 43 and contacts with the pin of LED flip LED chips to be tested, LED luminescence chip is lighted in energising, the receipts optical tests assembly 3 be arranged on base 9 rises and aims at the emission side of flip LED chips to be tested, and then its optical parametric is detected.
Wherein objective table 11 is arranged on X-axis pedestal 311, can along with X-axis pedestal 311 to-and-fro movement in the X direction under the effect of X-axis drive unit, wherein objective table is provided with disc 111, it is used for loading flip LED chips to be tested, wherein the drive belt wrap of shaft rotating motor 12 is on disc 111, thus the rotary motion of disc can be realized, reach the object of the pose adjusting LED flip LED chips to be tested, its discs 111 is mounted with several flip LED chips to be tested;
In the present invention, the principle of work of on-line checkingi single unit system is as follows:
First by the X-axis module 31 of transmission transport assembly 3, objective table 11 is moved to the below of the vision system of scanning area 7 by Y-axis module 32, the attitude of disc is adjusted by shaft rotating motor 12, carry out vision setting, the setting of this vision relates generally to the relevant setting of image procossing, object is the motor coordinate finding chip to be tested immediately below the vision system of detection zone, can start to carry out scanning motion after vision setting, wherein scanning motion needs the position and the attitude that obtain each chip on disc, the X-axis module 31 completed primarily of transmission transport assembly 3 of scanning, the vision system of Y-axis module 32 and scanning area has coordinated, because scanning system needs the position and the attitude that obtain each chip that disc 111 is placed.
Disc 111 after having scanned is transported to the below of the vision system of detection zone 8 by transmission transport assembly 3, after completing, the probe base jacking gear 42 of probe test platform 4 is elevated, treat that the needle point of the probe 43 in probe base 41 touches chip, the integrating sphere jacking gear 213 in optical tests assembly 2 is received in adjustment, integrating sphere 2111 is made to hold out against disc 111, and carry out examination inspection, examination inspection is by starting the detection carrying out optical parametric afterwards, after completing on-line checkingi, probe 43 rises, the X-axis module 31 of transport transmission assembly 3, Y-axis module 32 and shaft rotating motor 12 coordinate adjustment disc 111, the probe 43 on probe base 41 is made to aim at LED flip LED chips next to be tested, carry out the detection of next chip, so repeatedly.
Wherein the concrete facilities of receipts optical tests assembly 2 of the present invention is as follows:
Quartz glass 6 is arranged on the receipts light mouth place of integrating sphere 2111, not only makes physical construction compacter, and be more conducive to integrating sphere 2111 and receive light and prevent dust from entering integrating sphere 2111.Produce enough power, as a supporting surface, treat test chip and provide enough anchorage forces upwards, to solve the instable problem of attitude under test pin during press contacts of chip to be tested.
Certainly this quartz glass 6 can be multiple material, other material such as K9 glass, fused quartz, jewel, calcium fluoride or magnesium fluoride also can, as long as meet transmittance more than 92% and hardness is used as plate at the material of Mohs value more than 6.
Integrating sphere jacking gear 213 comprises air cylinder fixed plate 2131 and propulsion cylinder 2132, air cylinder fixed plate 2131 is fixed on base 9, it is inner that propulsion cylinder 2132 main body is embedded in base 9, the integrating sphere fixture 212 wherein receiving optical tests assembly 2 is rack form, it is arranged on the slide block of propulsion cylinder 2132, the side of integrating sphere 2111 is connected to follow-up optical parametric analytical equipment by optical fiber 222, the other side of integrating sphere 2111 is provided with brightness probe 221, the light-emitting window of integrating sphere 2111 is provided with anti-dazzling screen 223, wherein the bottom of the light-emitting window of integrating sphere 2111 is also provided with integrating sphere 90 ° of adapters 2112, its effect is that the receipts light vertical receipts light being converted into horizontal direction is produced by optical fiber 222, integrating sphere 2111 can be solved thus and in the process risen and decline, bending is produced to the optical fiber receiving light, the loss of light is received in the test brought thus.
In addition, the using method for flip LED chips on-line measuring device of the present invention is as follows:
(1) top that the upper chip to be tested of objective table 11 is moved to the receipts light mouth of integrating sphere 2111 by transmission assembly 3 is transported;
(2) integrating sphere jacking gear 213 moves upward and makes integrating sphere increase and hold out against disc 111, makes the receipts light mouth of this integrating sphere 2111 aim at flip LED chips to be tested;
(3) probe test platform 4 controls probe 43 and moves downward and the two poles of the earth aiming at flip LED chips;
(4) probe base 41 is energized and lights flip LED chips to probe 43, and integrating sphere 2111 is received light and sent and give follow-up optical parametric analytical equipment and complete test.
After completing above-mentioned testing procedure, whole flip LED chips proving installation moves to point next to be tested at the drive disc 111 of transport transmission assembly, thus circulation completing steps (1)-(4), thus complete the test of all flip LED chips on disc.
Receipts optical assembly integrating sphere, luminance sensor, optical fiber etc. are placed in below flip LED chips luminous flat by Machine Design cleverly by the present invention, success solves flip LED chips test problems, and can be applicable to the on-line testing of the chip of falling stake, there is the higher market competitiveness.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a flip LED chips on-line measuring device, it is characterized in that, this device comprises: bench top module (1), receipts optical tests assembly (2), transport transmission assembly (3), probe test platform (4), Precision alignment systems (5)
Wherein bench top module (1) comprises objective table (11), be provided with the disc (111) for loading multiple chip to be tested, described bench top module (1) is arranged on transport transmission assembly (3), realizes the location of the upper chip to be tested of described bench top module (1) under it drives translocation;
Receiving optical tests assembly (2) is arranged under described bench top module (1), and it comprises integrating sphere assembly (21), optic test assembly (22); Described integrating sphere assembly (21) comprises integrating sphere module (211), integrating sphere fixture (212) and integrating sphere jacking gear (213); Wherein said integrating sphere module (211) comprises integrating sphere (2111), described integrating sphere (2111), after described flip LED chips to be tested completes location, is pushed to the luminous flat of described chip to be measured and holds out against described disc (111) by described integrating sphere jacking gear (213); Described optic test assembly (22) is for receiving and analyzing the light signal to be tested of integrating sphere collection and analyze it;
Probe test platform (4) is arranged on described bench top module (1), it comprises probe base (41), probe base jacking gear (42) and probe (43), wherein probe base jacking gear (42) is elevated with the contact completing described probe (43) and described chip to be tested and disengaging for driving described probe base (41), thus realize energising and light described flip LED chips to be tested, realize test.
2. flip LED chips on-line measuring device as claimed in claim 1, it is characterized in that, the integration mouth place of described integrating sphere (2111) is provided with plate, it is set to plane, complete thus and make described integrating sphere (2111) hold out against described disc (111), the transmittance of described plate more than 92% and hardness in Mohs value more than 6.
3. flip LED chips on-line measuring device as claimed in claim 2, it is characterized in that, the material of described plate is the one in quartz glass (6), K9 glass, fused quartz, jewel, calcium fluoride or magnesium fluoride.
4. as the flip LED chips on-line measuring device in claim 1-3 as described in any one, it is characterized in that, described integrating sphere module (211) bottom is also provided with integrating sphere 90 ° of adapters (2112).
5. flip LED chips on-line measuring device as claimed in claim 4, it is characterized in that, this on-line measuring device also comprises Precision alignment systems (5), it comprises two cameras, one is positioned at scanning area (6) for scanning the pose of described chip to be measured, and one is positioned at detection zone (5) for realizing the aligning of the described probe (43) of described probe test platform (4).
6. flip LED chips on-line measuring device as claimed in claim 5, it is characterized in that, described bench top module (1) also includes shaft rotating motor (33), its driving belt is wound around described objective table (2), for controlling its rotary motion, thus adjust the pose of described chip to be measured.
7. flip LED chips on-line measuring device as claimed in claim 6, it is characterized in that, the posture information of described scanning comprises the transport transmission assembly (3) corresponding to flip LED chips to be tested described in every block of described test section (5) from described scanning area (6) and the coordinates of motion of described shaft rotating motor (33).
8. flip LED chips on-line measuring device as claimed in claim 7, it is characterized in that, described transport transmission assembly (3) comprises X-axis module (31) and Y-axis module (32), thus realize the motion of X/Y two axis, wherein X-axis module (31) comprises X-axis guide rail (312), X-axis pedestal (311) and drives described X-axis pedestal (311) along the reciprocating drive unit of described X-axis guide rail (312) (313); Wherein Y-axis module (32) comprises Y-axis guide rail (322), Y-axis pedestal (321) and drives described Y-axis pedestal (321) along the reciprocating drive unit of described Y-axis guide rail (322) (323).
9. flip LED chips on-line measuring device as claimed in claim 8, it is characterized in that, described on-line measuring device is arranged on a base (9), be provided with a support (10), described transport transmission assembly (3) is arranged at that described base (9) is upper and under being positioned at described support (10), described probe test platform (4) is arranged on described support (10).
10. flip LED chips on-line measuring device as claimed in claim 9, it is characterized in that, comprise described integrating sphere jacking gear (213) and comprise air cylinder fixed plate (2131) and propulsion cylinder (2132), described air cylinder fixed plate (2131) is fixed on base (9), and the main body of described propulsion cylinder (2132) is embedded in described base (9).
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| CN201410851945.4A CN104483617B (en) | 2014-12-31 | 2014-12-31 | A kind of flip LED chips on-line measuring device |
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| CN201410851945.4A CN104483617B (en) | 2014-12-31 | 2014-12-31 | A kind of flip LED chips on-line measuring device |
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| CN104483617A true CN104483617A (en) | 2015-04-01 |
| CN104483617B CN104483617B (en) | 2018-02-23 |
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| CN105783977A (en) * | 2016-04-18 | 2016-07-20 | 深圳市华腾半导体设备有限公司 | Electronic component transparent medium turntable bearing testing and automatic wiping method |
| CN106443505A (en) * | 2016-08-31 | 2017-02-22 | 苏州康贝尔电子设备有限公司 | Automatic lighting tester |
| CN106644405A (en) * | 2016-12-01 | 2017-05-10 | 深圳市标谱半导体科技有限公司 | Spectrophotometric equipment for testing tiny electronic components |
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| CN107218962A (en) * | 2017-05-25 | 2017-09-29 | 苏州米河自动化科技有限公司 | A kind of tool for being used to test vehicle turbine sensor |
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| CN106644405A (en) * | 2016-12-01 | 2017-05-10 | 深圳市标谱半导体科技有限公司 | Spectrophotometric equipment for testing tiny electronic components |
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| CN109782103B (en) * | 2019-03-11 | 2021-07-30 | 镇江宏祥自动化科技有限公司 | Alignment method and system for probe and electronic device pin |
| CN110749425A (en) * | 2019-10-31 | 2020-02-04 | 厦门大学 | LED multi-angle optical testing device and testing method |
| CN110749425B (en) * | 2019-10-31 | 2020-08-14 | 厦门大学 | LED multi-angle optical testing device and testing method |
| CN111929568A (en) * | 2020-08-26 | 2020-11-13 | 泓准达科技(上海)有限公司 | IC chip heating detection device |
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