CN111929568A - IC chip heating detection device - Google Patents
IC chip heating detection device Download PDFInfo
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- CN111929568A CN111929568A CN202010873040.2A CN202010873040A CN111929568A CN 111929568 A CN111929568 A CN 111929568A CN 202010873040 A CN202010873040 A CN 202010873040A CN 111929568 A CN111929568 A CN 111929568A
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- 238000001514 detection method Methods 0.000 title claims abstract description 27
- 238000010438 heat treatment Methods 0.000 title claims abstract description 16
- 238000001931 thermography Methods 0.000 claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 28
- 239000000725 suspension Substances 0.000 claims abstract description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000000741 silica gel Substances 0.000 claims description 14
- 229910002027 silica gel Inorganic materials 0.000 claims description 14
- 230000009471 action Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 claims 6
- 230000001681 protective effect Effects 0.000 abstract description 17
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- Environmental & Geological Engineering (AREA)
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- Health & Medical Sciences (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses an IC chip heating detection device which comprises an air suspension table, wherein an upright post is fixedly arranged at the position, close to the front part, of the upper part of the air suspension table, a protection plate is fixedly arranged at the top end of the upright post, a support table is fixedly arranged at the position, close to the rear part, of the upper part of the air suspension table, a chip carrier is movably arranged at the inner side of the protection plate at the upper part of the air suspension table through a carrier adjusting mechanism, and the carrier adjusting mechanism comprises a fixed table, an X-direction sliding table, a Y-direction sliding table, an X-direction protective cover, an X-direction handle, a Y-direction protective cover. According to the IC chip heating detection device, the position of the chip carrying platform can be conveniently adjusted, the chip carrying platform has two direction adjusting functions in the X direction and the Y direction, the application range is widened, the chip can be conveniently clamped and fixed, the use convenience is improved, in addition, the height and the angle of the thermal imaging camera can be conveniently adjusted, and the practicability is higher.
Description
Technical Field
The invention relates to the field of heating detection devices, in particular to an IC chip heating detection device.
Background
The IC chip heating detection device is a device for acquiring information such as IC chip hot spots, heat transfer guide paths, hot spot focal planes and the like, mainly shoots through a thermal imaging camera, and analyzes through a computer, and belongs to one of common detection items of IC chips;
firstly, the carrier does not have an adjusting function, the position of the carrier is fixed, and the carrier is used for mounting the chip, so that the position of the chip cannot be adjusted when the chip is detected, the chip cannot be suitable for various chips, and the application range is reduced; secondly, the chip is not convenient to position, and the chip is not stable enough to be installed, so that the chip is not beneficial to use; in addition, the camera adjusting function is not provided, the height and the angle of the camera cannot be adjusted, and the quality of a chip detection result is reduced.
Disclosure of Invention
The invention mainly aims to provide an IC chip heating detection device, which can effectively solve the problems that a carrier in the background technology does not have an adjusting function, the position of the carrier is fixed, and the carrier is used for mounting a chip, so that the chip cannot be adjusted in position when being detected, and can not be suitable for various chips, and the application range is reduced; secondly, the chip is not convenient to position, and the chip is not stable enough to be installed, so that the chip is not beneficial to use; in addition, the camera adjusting function is not provided, the height and the angle of the camera cannot be adjusted, and the technical problem of the quality of a chip detection result is reduced.
In order to achieve the purpose, the invention adopts the technical scheme that:
an IC chip heating detection device comprises an air suspension table, wherein the upper part of the air suspension table is fixedly provided with a stand column near the front part, the top end of the stand column is fixedly provided with a protection plate, the upper part of the air suspension table is fixedly provided with a support table near the rear part, the upper part of the air suspension table is positioned at the inner side of the protection plate and is movably provided with a chip carrier through a carrier adjusting mechanism, the carrier adjusting mechanism comprises a fixed table, an X-direction sliding table, a Y-direction sliding table, an X-direction protective cover, an X-direction handle, a Y-direction protective cover, a Y-direction handle and a Y-direction screw rod, the upper part of the chip carrier is provided with a chip positioning mechanism, the upper part of the support table is fixedly provided with a support, the front part of the support is provided with a camera adjusting mechanism, and the camera adjusting mechanism comprises an, the front part of the shaft sleeve is fixedly connected with a thermal imaging camera.
As a further scheme of the invention, the fixed table is fixedly installed on the upper portion of the air suspension table and located inside the protection plate, the X-direction sliding table is slidably connected to the upper portion of the fixed table, the Y-direction sliding table is slidably connected to the upper portion of the X-direction sliding table, the X-direction protective cover is fixedly installed on the front portion of the fixed table, the Y-direction protective cover is fixedly installed on one side of the X-direction sliding table, the Y-direction screw rod is movably connected inside the Y-direction protective cover, the Y-direction handle is fixedly installed at the front end of the Y-direction screw rod, the connection screw base is fixedly connected to one side of the Y-direction sliding table, and the chip carrier is fixedly installed on the.
As a further aspect of the present invention, the connection screw seat penetrates through the Y-direction shield and is connected with the Y-direction screw rod by a screw thread, and the connection screw seat is connected with the Y-direction shield in a sliding manner.
As a further scheme of the invention, an X-direction screw rod is movably connected inside the X-direction protective cover, the X-direction handle is fixedly connected to one end of the X-direction screw rod, and a connecting screw seat is also arranged between the X-direction sliding table and the X-direction screw rod.
As a further scheme of the invention, the chip positioning mechanism comprises a shaft seat, a positioning screw rod, a rotary table, a first positioning block, a silica gel protection pad, a second positioning block, a first sliding seat and a second sliding seat, the positioning screw rod is movably connected to the central position inside the chip carrier through the shaft seat, the rotary table is fixedly connected to one end of the positioning screw rod, the first positioning block is slidably connected to one side of the upper part of the chip carrier through the first sliding seat, the silica gel protection pad is fixedly connected to one side of the first positioning block, and the second positioning block is slidably connected to the other side of the upper part of the chip carrier through the second sliding seat.
As a further scheme of the invention, two groups of threads in different directions are arranged on the outer surface of the positioning screw rod and positioned on two sides of the shaft seat, and the first sliding seat and the second sliding seat are both in threaded connection with the positioning screw rod.
As a further scheme of the invention, the adjusting seat is slidably connected to the front part of the support, the connecting plate is fixedly arranged at the front part of the adjusting seat, the fixing plate is fixedly arranged at the front part of the connecting plate, the fixing shaft is fixedly arranged at the front part of the fixing plate, the shaft sleeve is rotatably connected to the outer part of the fixing shaft, the adjusting screw rod is movably connected to the position close to the front inside the support, the adjusting screw seat is fixedly arranged at the rear part of the adjusting seat, the hand wheel is fixedly connected to the top end of the adjusting screw rod, and the adjusting screw seat is in threaded connection with the.
As a further aspect of the present invention, the IC chip heat detection apparatus specifically includes the following steps when in use:
the method comprises the following steps: placing a chip to be detected on the upper part of a chip carrier, rotating a positioning screw rod by using a turntable, driving a first sliding seat and a second sliding seat to slide by the positioning screw rod through the action of threads, so as to drive a first positioning block and a second positioning block to move in opposite directions, and clamping and fixing the chip through a silica gel protective pad;
step two: rotating a Y-direction handle to drive a Y-direction screw rod to rotate, driving a connecting screw seat to move through the action of threads between the Y-direction screw rod and the connecting screw seat so as to drive a Y-direction sliding table to move in the Y direction of the upper part of an X-direction sliding table, rotating an X-direction handle to drive an X-direction screw rod to rotate so as to drive the X-direction sliding table and the Y-direction sliding table to move in the X direction, and adjusting the position of a chip carrier so as to adjust the position of a chip to be detected;
step three: the hand wheel is rotated to drive the adjusting screw rod to rotate, the adjusting screw rod drives the adjusting screw seat to move in the vertical direction, so that the adjusting seat is driven to move in the vertical direction, the adjusting seat drives the fixing plate and the fixing shaft to move in the vertical direction, the thermal imaging camera can be driven to move in the vertical direction, then the thermal imaging camera is stirred, and the thermal imaging camera rotates outside the fixing shaft through the shaft sleeve, so that the angle of the thermal imaging camera is adjusted;
step four: and applying voltage to the chip to be detected, starting the thermal imaging camera to work, detecting the hot spot of the chip to be detected through the thermal imaging camera, and analyzing through a computer.
Compared with the prior art, the invention has the following beneficial effects:
by arranging the platform adjusting mechanism, the Y-direction handle is rotated to drive the Y-direction screw rod to rotate, the Y-direction screw rod drives the connecting screw seat to move through the action of threads between the Y-direction screw rod and the connecting screw seat, so that the Y-direction sliding table is driven to move in the Y direction of the upper part of the X-direction sliding table, the X-direction handle is rotated to drive the X-direction screw rod to rotate, the X-direction sliding table and the Y-direction sliding table can be driven to move in the X direction, the position of the chip platform is adjusted, the position of a chip to be detected is adjusted, the position of the chip platform can be conveniently adjusted, two direction adjusting functions of the X direction and the Y direction are provided, the position of the chip can be;
by arranging the chip positioning mechanism, a chip to be detected is placed on the upper part of the chip carrying platform, the positioning screw rod is rotated by the turntable, the positioning screw rod drives the first sliding seat and the second sliding seat to slide through the screw action, so that the first positioning block and the second positioning block are driven to move in the opposite directions, the chip is clamped and fixed through the silica gel protective pad, the chip can be conveniently clamped and fixed, the use convenience is improved, and the silica gel protective pad can play a role in protecting the chip, so that the safety is improved;
through setting up camera adjustment mechanism, it rotates the hand wheel and drives accommodate the lead screw rotation, accommodate the lead screw drives and adjusts screw seat vertical direction and remove, thereby it removes to drive the seat vertical direction of regulation, it removes to adjust the seat and drive fixed plate and fixed axle vertical direction, can drive thermal imaging camera vertical direction and remove, then stir thermal imaging camera, the thermal imaging camera passes through the axle sleeve and rotates in the outside of fixed axle, thereby adjust thermal imaging camera's angle, can conveniently adjust thermal imaging camera's height and angle, conveniently survey each position of chip, improve the quality of detection result, the practicality is higher.
Drawings
FIG. 1 is a schematic diagram of an overall structure of an IC chip heating detection apparatus according to the present invention;
FIG. 2 is a front view of a stage adjustment mechanism of an IC chip heating detection apparatus according to the present invention and a schematic diagram of an internal structure of a Y-direction shield;
FIG. 3 is an enlarged view of the internal structure of a chip carrier of the IC chip heating detection apparatus according to the present invention;
FIG. 4 is a front view of an IC chip heating detection apparatus according to the present invention;
FIG. 5 is a side view of an IC chip heat detection device of the present invention;
FIG. 6 is an enlarged view of a connection structure between a support and an adjustment seat of the IC chip heating detection apparatus according to the present invention;
FIG. 7 is a system diagram of an IC chip heat detection device according to the present invention.
In the figure: 1. an air suspension table; 2. a column; 3. a protection plate; 4. a support table; 5. a chip carrier; 6. a stage adjustment mechanism; 601. a fixed table; 602. an X-direction sliding table; 603. a Y-direction sliding table; 604. an X-direction shield; 605. an X-direction handle; 606. a Y-direction shield; 607. a Y-direction handle; 608. a Y-direction screw rod; 609. a connecting screw seat; 7. a chip positioning mechanism; 701. a shaft seat; 702. positioning a screw rod; 703. a turntable; 704. a first positioning block; 705. a silica gel protective pad; 706. a second positioning block; 707. a first slider; 708. a second slide carriage; 8. a support; 9. a camera adjustment mechanism; 901. an adjusting seat; 902. a connecting plate; 903. a fixing plate; 904. a fixed shaft; 905. a shaft sleeve; 906. a hand wheel; 907. adjusting the screw rod; 908. adjusting a screw seat; 10. a thermal imaging camera.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in FIGS. 1-7, an IC chip heating detection device comprises an air suspension table 1, wherein an upright post 2 is fixedly mounted on the upper portion of the air suspension table 1 near the front portion, a protection plate 3 is fixedly mounted on the top end of the upright post 2, a support table 4 is fixedly mounted on the upper portion of the air suspension table 1 near the rear portion, a chip carrier 5 is movably mounted on the upper portion of the air suspension table 1 at the inner side of the protection plate 3 through a carrier adjustment mechanism 6, the carrier adjustment mechanism 6 comprises a fixed table 601, an X-direction sliding table 602, a Y-direction sliding table 603, an X-direction shield 604, an X-direction handle 605, a Y-direction shield 606, a Y-direction handle 607 and a Y-direction screw rod 608, a chip positioning mechanism 7 is arranged on the upper portion of the chip carrier 5, a support 8 is fixedly mounted on the upper portion of the support table 4, a camera adjustment, The thermal imaging camera comprises a connecting plate 902, a fixing plate 903, a fixing shaft 904, a shaft sleeve 905, a hand wheel 906, an adjusting screw rod 907 and an adjusting screw base 908, wherein the front part of the shaft sleeve 905 is fixedly connected with a thermal imaging camera 10;
the fixed table 601 is fixedly arranged at the upper part of the air suspension table 1 and is positioned at the inner side of the protection plate 3, the X-direction sliding table 602 is connected to the upper part of the fixed table 601 in a sliding manner, the Y-direction sliding table 603 is connected to the upper part of the X-direction sliding table 602 in a sliding manner, the X-direction protective cover 604 is fixedly arranged at the front part of the fixed table 601, the Y-direction protective cover 606 is fixedly arranged at one side of the X-direction sliding table 602, the Y-direction screw rod 608 is movably connected inside the Y-direction protective cover 606, the Y-direction handle 607 is fixedly arranged at the front end of the Y-direction screw rod 608, the connecting screw base 609 is fixedly connected to one; the connecting screw seat 609 penetrates through the Y-direction shield 606 to be in threaded connection with the Y-direction screw rod 608, and the connecting screw seat 609 is in sliding connection with the Y-direction shield 606; an X-direction screw rod is movably connected inside the X-direction shield 604, an X-direction handle 605 is fixedly connected to one end of the X-direction screw rod, and a connecting screw seat 609 is also arranged between the X-direction sliding table 602 and the X-direction screw rod; the chip positioning mechanism 7 comprises a shaft seat 701, a positioning screw 702, a rotary disc 703, a first positioning block 704, a silica gel protection pad 705, a second positioning block 706, a first sliding seat 707 and a second sliding seat 708, wherein the positioning screw 702 is movably connected to the central position inside the chip carrier 5 through the shaft seat 701, the rotary disc 703 is fixedly connected to one end of the positioning screw 702, the first positioning block 704 is slidably connected to one side of the upper part of the chip carrier 5 through the first sliding seat 707, the silica gel protection pad 705 is fixedly connected to one side of the first positioning block 704, and the second positioning block 706 is slidably connected to the other side of the upper part of the chip carrier 5 through the second sliding seat 708; two groups of threads in different directions are arranged on the outer surface of the positioning screw rod 702 at the two sides of the shaft seat 701, and the first sliding seat 707 and the second sliding seat 708 are both in threaded connection with the positioning screw rod 702; an adjusting seat 901 is connected to the front portion of a support 8 in a sliding mode, a connecting plate 902 is fixedly installed at the front portion of the adjusting seat 901, a fixing plate 903 is fixedly installed at the front portion of the connecting plate 902, a fixing shaft 904 is fixedly installed at the front portion of the fixing plate 903, a shaft sleeve 905 is rotatably connected to the outer portion of the fixing shaft 904, an adjusting screw seat 907 is movably connected to the position, close to the front, in the support 8, an adjusting screw seat 908 is fixedly installed at the rear portion of the adjusting seat 901, a hand wheel 906 is fixedly connected to the top end of the adjusting screw seat 907.
It should be noted that, when the IC chip heat detection device of the present invention is used, a chip to be detected is placed on the upper portion of the chip carrier 5, the positioning screw 702 is rotated by the turntable 703, the positioning screw 702 drives the first sliding seat 707 and the second sliding seat 708 to slide through the screw action, so as to drive the first positioning block 704 and the second positioning block 706 to move relatively, the chip is clamped and fixed by the silica gel protection pad 705, the Y-direction handle 607 is rotated to drive the Y-direction screw 608 to rotate, the Y-direction screw 608 drives the connection screw 609 to move through the screw action between the connection screw 609 and the Y-direction screw, so as to drive the Y-direction sliding table 603 to move in the Y direction on the upper portion of the X-direction sliding table 602, the X-direction handle 605 is rotated to drive the X-direction screw to rotate, so as to drive the X-direction sliding table 602 and the Y-direction sliding table 603 to move, and adjust the, the hand wheel 906 is rotated to drive the adjusting screw rod 907 to rotate, the adjusting screw rod 907 drives the adjusting screw base 908 to move in the vertical direction, so that the adjusting base 901 is driven to move in the vertical direction, the adjusting base 901 drives the fixing plate 903 and the fixing shaft 904 to move in the vertical direction, the thermal imaging camera 10 can be driven to move in the vertical direction, then the thermal imaging camera 10 is shifted, the thermal imaging camera 10 rotates outside the fixing shaft 904 through a shaft sleeve 905, so that the angle of the thermal imaging camera 10 is adjusted, voltage is applied to a chip to be detected, the thermal imaging camera 10 is started to work, a hot spot of the chip to be detected is detected through the thermal imaging camera 10, the hot spot is displayed through a display after being processed by a signal processor, and the thermal imaging camera 10 is a three-dimensional focal plane array detector.
According to the invention, by arranging the stage adjusting mechanism 6, the Y-direction handle 607 is rotated to drive the Y-direction lead screw 608 to rotate, the Y-direction lead screw 608 drives the connecting screw 609 to move through the action of a thread between the Y-direction lead screw 608 and the connecting screw 609, so that the Y-direction sliding table 603 is driven to move in the upper Y direction of the X-direction sliding table 602, the X-direction handle 605 is rotated to drive the X-direction lead screw to rotate, the X-direction sliding table 602 and the Y-direction sliding table 603 can be driven to move in the X direction, the position of the chip stage 5 can be adjusted, the position of a chip to be detected can be adjusted, the position of the chip stage 5 can be conveniently adjusted, and the two-direction adjusting functions of the X direction and the Y direction are provided, so that the; by arranging the chip positioning mechanism 7, a chip to be detected is placed on the upper part of the chip carrier 5, the positioning screw rod 702 is rotated by the turntable 703, the positioning screw rod 702 drives the first slide seat 707 and the second slide seat 708 to slide through the screw action, so that the first positioning block 704 and the second positioning block 706 are driven to move in the opposite direction, the chip is clamped and fixed through the silica gel protective pad 705, the chip can be conveniently clamped and fixed, the use convenience is improved, and the silica gel protective pad 705 can play a role in protecting the chip, so that the safety is improved; through setting up camera adjustment mechanism 9, it rotates hand wheel 906 and drives accommodate the lead screw 907 and rotate, accommodate the lead screw 907 drives and adjusts screw seat 908 vertical direction and removes, thereby it removes to drive accommodate seat 901 vertical direction, it removes to adjust seat 901 and drive fixed plate 903 and fixed axle 904 vertical direction, can drive thermal imaging camera 10 vertical direction and remove, then stir thermal imaging camera 10, thermal imaging camera 10 passes through axle sleeve 905 and rotates in the outside of fixed axle 904, thereby adjust thermal imaging camera 10's angle, can conveniently adjust thermal imaging camera 10's height and angle, conveniently survey each position of chip, improve the quality of detection result, the practicality is higher.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. An IC chip heating detection device is characterized in that: comprises an air suspension table (1), wherein the upper part of the air suspension table (1) is fixedly provided with an upright post (2) close to the front part, the top end of the upright post (2) is fixedly provided with a protection plate (3), the upper part of the air suspension table (1) is fixedly provided with a support table (4) close to the rear part, the upper part of the air suspension table (1) is positioned at the inner side of the protection plate (3) and is movably provided with a chip carrier (5) through a carrier adjusting mechanism (6), the carrier adjusting mechanism (6) comprises a fixed table (601), an X-direction sliding table (602), a Y-direction sliding table (603), an X-direction shield (604), an X-direction handle (605), a Y-direction shield (606), a Y-direction handle (607) and a Y-direction screw rod (608), the upper part of the chip carrier (5) is provided with a chip positioning mechanism (7), and, the front part of the support (8) is provided with a camera adjusting mechanism (9), the camera adjusting mechanism (9) comprises an adjusting seat (901), a connecting plate (902), a fixing plate (903), a fixing shaft (904), a shaft sleeve (905), a hand wheel (906), an adjusting screw rod (907) and an adjusting screw seat (908), and the front part of the shaft sleeve (905) is fixedly connected with a thermal imaging camera (10).
2. The IC chip heat generation detecting device according to claim 1, wherein: fixed station (601) fixed mounting is located the inboard of guard plate (3) on the upper portion of air suspension platform (1), X direction slip table (602) sliding connection is on the upper portion of fixed station (601), Y direction slip table (603) sliding connection is on the upper portion of X direction slip table (602), X direction guard shield (604) fixed mounting is in the front portion of fixed station (601), Y direction guard shield (606) fixed mounting is in one side of X direction slip table (602), Y direction lead screw (608) swing joint is in the inside of Y direction guard shield (606), Y direction handle (607) fixed mounting is at the front end of Y direction lead screw (608), connect spiral shell seat (609) fixed connection in one side of Y direction slip table (603), chip carrier (5) fixed mounting is in the top position placed in the middle of Y direction slip table (603).
3. The IC chip heat generation detecting device according to claim 2, wherein: the connecting screw seat (609) penetrates through the Y-direction shield (606) to be in threaded connection with the Y-direction screw rod (608), and the connecting screw seat (609) is in sliding connection with the Y-direction shield (606).
4. The IC chip heat generation detecting device according to claim 1, wherein: the inside swing joint of X direction guard shield (604) has the X direction lead screw, X direction handle (605) fixed connection is in the one end of X direction lead screw, be equipped with between X direction slip table (602) and the X direction lead screw and connect screw seat (609) equally.
5. The IC chip heat generation detecting device according to claim 1, wherein: the chip positioning mechanism (7) comprises a shaft seat (701), a positioning screw rod (702), a rotary disc (703), a first positioning block (704), a silica gel protection pad (705), a second positioning block (706), a first sliding seat (707) and a second sliding seat (708), wherein the positioning screw rod (702) is movably connected to the center inside the chip carrier (5) through the shaft seat (701), the rotary disc (703) is fixedly connected to one end of the positioning screw rod (702), the first positioning block (704) is slidably connected to one side of the upper portion of the chip carrier (5) through the first sliding seat (707), the silica gel protection pad (705) is fixedly connected to one side of the first positioning block (704), and the second positioning block (706) is slidably connected to the other side of the upper portion of the chip carrier (5) through the second sliding seat (708).
6. The IC chip heat generation detecting device according to claim 5, wherein: two groups of threads in different directions are arranged on the outer surface of the positioning screw rod (702) and positioned on two sides of the shaft seat (701), and the first sliding seat (707) and the second sliding seat (708) are in threaded connection with the positioning screw rod (702).
7. The IC chip heat generation detecting device according to claim 1, wherein: the adjusting seat (901) is connected to the front portion of the support (8) in a sliding mode, the connecting plate (902) is fixedly installed at the front portion of the adjusting seat (901), the fixing plate (903) is fixedly installed at the front portion of the connecting plate (902), the fixing shaft (904) is fixedly installed at the front portion of the fixing plate (903), the shaft sleeve (905) is rotatably connected to the outer portion of the fixing shaft (904), the adjusting screw rod (907) is movably connected to the position, close to the front, inside of the support (8), the adjusting screw seat (908) is fixedly installed at the rear portion of the adjusting seat (901), the hand wheel (906) is fixedly connected to the top end of the adjusting screw rod (907), and the adjusting screw seat (908) is in threaded connection with the adjusting screw rod (.
8. The IC chip heat detection device according to claim 1, wherein the IC chip heat detection device comprises the following steps in use:
the method comprises the following steps: a chip to be detected is placed on the upper part of a chip carrier (5), a positioning screw rod (702) is rotated by a turntable (703), the positioning screw rod (702) drives a first sliding seat (707) and a second sliding seat (708) to slide through the action of threads, so that a first positioning block (704) and a second positioning block (706) are driven to move in the opposite direction, and the chip is clamped and fixed through a silica gel protection pad (705);
step two: rotating a Y-direction handle (607) to drive a Y-direction screw rod (608) to rotate, driving a connecting screw seat (609) to move through the action of a thread between the Y-direction screw rod (608) and the connecting screw seat (609), so as to drive a Y-direction sliding table (603) to move in the Y direction of the upper part of an X-direction sliding table (602), rotating an X-direction handle (605) to drive an X-direction screw rod to rotate, so as to drive the X-direction sliding table (602) and the Y-direction sliding table (603) to move in the X direction, and adjusting the position of a chip carrier (5), so as to adjust the position of a chip to be detected;
step three: the hand wheel (906) is rotated to drive the adjusting screw rod (907) to rotate, the adjusting screw rod (907) drives the adjusting screw seat (908) to move in the vertical direction, so that the adjusting seat (901) is driven to move in the vertical direction, the adjusting seat (901) drives the fixing plate (903) and the fixing shaft (904) to move in the vertical direction, the thermal imaging camera (10) can be driven to move in the vertical direction, then the thermal imaging camera (10) is driven, and the thermal imaging camera (10) rotates outside the fixing shaft (904) through a shaft sleeve (905), so that the angle of the thermal imaging camera (10) is adjusted;
step four: applying voltage to the chip to be detected, starting the thermal imaging camera (10) to work, detecting the hot spot of the chip to be detected through the thermal imaging camera (10), and analyzing through a computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010873040.2A CN111929568A (en) | 2020-08-26 | 2020-08-26 | IC chip heating detection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010873040.2A CN111929568A (en) | 2020-08-26 | 2020-08-26 | IC chip heating detection device |
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| CN111929568A true CN111929568A (en) | 2020-11-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113281340A (en) * | 2021-06-30 | 2021-08-20 | 东莞现代产品整理服务有限公司 | Food microorganism inspection equipment and use method thereof |
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