CN104483617B - A kind of flip LED chips on-line measuring device - Google Patents
A kind of flip LED chips on-line measuring device Download PDFInfo
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- CN104483617B CN104483617B CN201410851945.4A CN201410851945A CN104483617B CN 104483617 B CN104483617 B CN 104483617B CN 201410851945 A CN201410851945 A CN 201410851945A CN 104483617 B CN104483617 B CN 104483617B
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- led chips
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Abstract
The invention discloses a kind of flip LED chips test device, the device includes：Bench top module, transport transmission assembly, receive optical tests component, probe test platform and Precision alignment systems, wherein, at work, transport transmission assembly can transport flip LED chips to be tested to suitable working region, flip LED chips alignment to be tested is received at the receipts optical port of optical tests component, after adjustment pose, start probe test platform, probe is contacted energization with chip to be tested, make chip shinny, it can be detected so as to receive optical tests component.According to the mechanical structure of the present invention, can successfully solve the problems, such as flip LED chips motor and light-emitting area not homonymy, and employ precision profile movement control technology, realize the high speed and precision test of flip LED chips, accelerate the detection efficiency of chip.
Description
Technical field
The invention belongs to flip LED chips detection field, more particularly, to it is a kind of towards flip LED chips it is complete from
Dynamic on-line measuring device.
Background technology
Flip LED chips have different degrees of improvement, upside-down mounting than traditional packed LED chip, light efficiency and production cost
The importance of LED chip is also more prominent, while also proposes new requirement, upside-down mounting to its corresponding detection technique and equipment
LED chip online detection instrument is used for the detection for completing flip LED chips photoelectric parameter and unified number is generated by parametric classification
According to document, cooperated with LED screening installation realizes the classification to flip LED chips, lifts added value of product.
Existing LED chip detection device spininess is to packed LED chip, and with the large-scale application of flip LED chips, and
The detection device of conventional packed LED chip also can not simply be indiscriminately imitated and used, and therefore, develop new flip LED chips
Detection test equipment and method also seem particularly important therewith, such as patent document CN103149524A of the prior art is disclosed
The test machine and its method of testing of a kind of flip LED chips, but this kind of test machine and method of testing have following technology
Defect：(1) quick-fit that each building block how is better achieved is not accounted for；(2) do not account for and how to improve receipts
How the efficiency and measuring accuracy of optical tests improve.With the fast development of LED industry and carrying for flip LED chips production technology
It is high, it is necessary to which that research and development are preferably directed to the quick online detection equipment of flip LED chips.
The content of the invention
For the disadvantages described above or Improvement requirement of prior art, the invention provides a kind of flip LED chips on-line checking
Device, thus solve the intelligence of flip LED chips, test problem fast and accurately.
To achieve the above object, according to one aspect of the present invention, there is provided a kind of flip LED chips on-line checking
Device, it is characterised in that the device includes：Bench top module, receive optical tests components, transport transmission assembly, probe test platform,
Precision alignment systems, wherein bench top module include objective table, are provided with the disc for loading multiple chips to be tested,
The bench top module is arranged on transport transmission assembly, is realized in the case where it drives translocation and is treated on the bench top module
The positioning of test chip；
Receive optical tests component to be arranged under the bench top module, it includes integrating ball component, optic test component；Institute
Stating integration ball component includes integrating sphere module, integrating sphere fixture and integrating sphere lowering or hoisting gear；Wherein described integrating sphere module bag
Integrating sphere is included, the integrating sphere lowering or hoisting gear promotes the integrating sphere after the flip LED chips to be tested complete positioning
To the chip to be measured luminous flat and hold out against the disc；The optic test component is used to receive and analyze integration
The optical signal to be tested of ball collection is simultaneously analyzed it；
Probe test platform is arranged on the bench top module, it include probe base, probe seat lifting and lowering mechanism and
Probe, wherein probe seat lifting and lowering mechanism are used to drive the probe base lifting to complete the probe and the chip to be tested
Contact and disengaging, so as to realize that the flip LED chips to be tested are lighted in energization, realize test.
Further, plate is provided with the integration mouth of the integrating sphere, is arranged to plane thereon, thus completion makes described
Integrating sphere holds out against the disc, the plate light transmittance is more than 92% and hardness is in Mohs' hardness more than 6.
Further, the material of the plate is in quartz glass, K9 glass, fused quartz, jewel, calcirm-fluoride or magnesium fluoride
One kind.
Further, the integrating sphere module bottom is additionally provided with 90 ° of adapters of integrating sphere.
Further, the on-line measuring device also includes Precision alignment systems, and it includes two cameras, and one positioned at sweeping
Retouch the pose that area is used to scan the chip to be measured, a spy for being used to realize the probe test platform positioned at detection zone
The alignment of pin.
Further, shaft rotating motor is also included on the bench top module, its driving belt winds the objective table,
For controlling its rotary motion, so as to adjust the pose of the chip to be measured.
Further, the posture information of the scanning includes described to be measured to every piece of the detection zone from the scanning area
The coordinates of motion of transport transmission assembly and the shaft rotating motor corresponding to the flip LED chips of examination.
Further, the transport transmission assembly includes X-axis module and Y-axis module, so as to realize the fortune of two axial directions of X/Y
Dynamic, wherein X-axis module includes X-axis guide rail, X-axis pedestal and the driving X-axis pedestal along the reciprocating drive of the X-axis guide rail
Dynamic device；Wherein Y-axis module includes Y-axis guide rail, Y-axis pedestal and drives the Y-axis pedestal to be moved back and forth along the Y-axis guide rail
Drive device.
Further, the on-line measuring device is arranged on a base, is provided with a support, and the transport passes
Defeated component is arranged on the base and under the support, the probe test platform is arranged on the support.
Further, including the integrating sphere lowering or hoisting gear includes air cylinder fixed plate and propulsion cylinder, and the cylinder is consolidated
Fixed board is fixed on base, and the main body of the propulsion cylinder is embedded in the base.
In general, by the contemplated above technical scheme of the present invention compared with prior art, it can obtain down and show
Beneficial effect：
(1) composition of device of the invention is more complicated with accurate, intellectuality and raising measuring accuracy to on-line testing
There is great help with testing efficiency；
(2) present invention is innovatively attached to the plate of certain material at the receipts optical port of integrating sphere, not only makes mechanical structure more
It is compact, and more conducively integrating sphere receives light and prevents dust from entering integrating sphere.
In a word, the present invention has the outstanding features such as ingenious in design, positioning precision is high, complete machine stability is good.
Brief description of the drawings
Fig. 1 is the overall schematic for the flip LED chips detection means realized according to the present invention；
Fig. 2 is the disc workbench and transport Transmission system for the flip LED chips detection means realized according to the present invention
Detailed schematic；
Fig. 3 is the top view for the flip LED chips detection means realized according to the present invention.
In all of the figs, identical reference is used for representing identical element or structure, wherein：
1- bench top modules 2- receives optical tests component 3- transport transmission assembly 4- probe test platform 5- fine registrations
System 7- scanning area 8- detection zone 9- base 10- support 11- objective table 111- disc 12- shaft rotating motors 21- is accumulated
Bulb separation component 211- integrating sphere module 212- integrating sphere fixture 213- integrating sphere lowering or hoisting gear 2131- air cylinder fixed plates
90 ° of adapter 22- optic test component 221- brightness probes of 2132- propulsion cylinder 2111- integrating sphere 2112- integrating spheres
222- optical fiber 223- anti-dazzling screen 31-X axle module 32-Y axle module 311-X axle pedestal 312-X axis rail 313-X axles drive
Device 321-Y axle pedestal 322-Y axis rail 323-Y axial brake device 41- probe base 42- probe seat lifting and lowering mechanisms 43-
Probe
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in each embodiment of invention described below
Conflict can is not formed each other to be mutually combined.
Flip LED chips test device includes bench top module 1, receives optical tests component 2, transport transmission group in the present embodiment
Part 3, probe test platform 4, Precision alignment systems 5；
Wherein bench top module 1 includes objective table 11, shaft rotating motor 12；
Optical tests component 2 is wherein received to wrap including integration ball component 21 and optic test component 22, wherein integrating sphere module 21
Include integrating sphere module 211, integrating sphere fixture 212, integrating sphere lowering or hoisting gear 213；
Wherein integrating sphere module 211 includes 90 ° of integrating sphere 2111, integrating sphere adapters 2112；
Optic test component 22 includes brightness probe 221, optical fiber 222 and follow-up optical parametric analytical equipment；Integration
Ball lowering or hoisting gear 213 includes air cylinder fixed plate 2131, propulsion cylinder 2132；The opening of the device of integrating sphere 2111 is provided with quartzy glass
Glass；
Transporting transmission assembly 3 includes X-axis module 31, Y-axis module 32；Wherein X-axis module 31 includes X-axis pedestal 311, X-axis
Guide rail 312, and the driving X-axis pedestal 311 drive along the reciprocating X-axis driving device 313 of X-axis guide rail 312, the X-axis
Device can be motor etc.；Y-axis module 32 includes Y-axis pedestal 321, Y-axis guide rail 322, and drives the Y-axis pedestal 321 along Y-axis
The reciprocating Y-axis driving device 323 of guide rail 322, the Y-axis driving device can be motor etc.；
Wherein probe test platform 4 includes probe base 41, probe seat lifting and lowering mechanism 42, probe 43；Probe seat lifting and lowering mechanism
42 controllable probe bases 41 move up and down, so as to control probe 43 to contact and depart from the pin of flip LED chips to be tested, and
Probe base 41 can be powered to probe 43, so as to realize that the optical parametric under the energization illuminating state of LED chip is tested.
Precision alignment systems 5 include two vision systems, and one is located at detection zone 8 positioned at scanning area 7, one；
Further, the facilities of flip LED chips on-line measuring device involved in present embodiment are as follows：
The flip LED chips LED on-line measuring devices of the present invention are arranged on a base 9, and a support 10 is set on base；
Transport transmission assembly 3 is used to load LED flip LED chips to be tested, and it is arranged at the lower section of support 10, receives optical tests component
2 are arranged on base 9, and probe test platform 4 is arranged on support 10, are by transporting the motion of transmission assembly 3 by loading
Platform transports detection zone 8, and the probe test platform 4 being arranged on support 10 controls probe 43 and LED flip LED cores to be tested
LED luminescence chips are lighted in the pin contact of piece, energization, and it is to be tested that the receipts optical tests component 3 being arranged on base 9 rises alignment
The emission side of LED chip is filled, and then its optical parametric is detected.
Wherein objective table 11 is arranged on X-axis pedestal 311, can be in the presence of X-axis driving device with X-axis pedestal 311
Moving back and forth in the X direction, disc 111 is wherein provided with objective table 11, it is used for loading flip LED chips to be tested,
The drive belt of wherein shaft rotating motor 12 is wound on disc 111, so as to realize the rotary motion of disc, reaches adjustment
The purpose of the pose of LED flip LED chips to be tested, several flip LED cores to be tested are wherein mounted with disc 111
Piece；
In the present invention, the operation principle of on-line checking single unit system is as follows：
Objective table 11 is moved to the vision of scanning area 7 by the X-axis module 31 of transport transmission assembly 3, Y-axis module 32 first
The lower section of system, the posture of disc is adjusted by shaft rotating motor 12, carry out vision setting, vision setting relates generally to figure
As the related setting of processing, it is therefore an objective to find motor coordinate of the chip to be tested immediately below detection zone vision system, vision is set
Can proceed by scanning motion after fixed, wherein scanning motion needs to obtain the position of each chip and posture on disc, scanning it is complete
Into the mainly completion with the vision system of the X-axis module 31 of transport transmission assembly 3, Y-axis module 32 and scanning area, because sweeping
The system of retouching needs to obtain position and the posture of each chip placed on disc 111.
Disc 111 after the completion of scanning transports the lower section of the vision system to detection zone 8 by transporting transmission assembly 3, complete
Probe seat lifting and lowering mechanism 42 into rear probe test platform 4 lifts, and treats that the needle point of the probe 43 in probe base 41 touches chip,
The integrating sphere lowering or hoisting gear 213 in optical tests component 2 is received in adjustment, integrating sphere 2111 is held out against disc 111, and carries out examination inspection, is tried
Inspection can proceed by the detection of optical parametric after, and probe 43 rises after completing on-line checking, transport transmission assembly 3
X-axis module 31, Y-axis module 32 and shaft rotating motor 12 coordinate adjustment disc 111, are directed at the probe 43 on probe base 41 next
Individual LED flip LED chips to be tested, carry out the detection of next chip, so repeatedly.
The specific facilities of wherein receipts optical tests component 2 of the invention are as follows：
Quartz glass is arranged at the receipts optical port of integrating sphere 2111, not only makes mechanical structure compacter, and more have
Light is received beneficial to integrating sphere 2111 and prevents dust from entering integrating sphere 2111.Enough power is produced, as a supporting surface, to treat
Test chip provides support force upward enough, to solve shakiness of the posture of chip to be tested under test pin during press contacts
The problem of qualitative.
This certain quartz glass can be multiple material, other materials for example K9 glass, fused quartz, jewel, calcirm-fluoride or
Magnesium fluoride also can, as long as meeting light transmittance more than 92% and hardness is used as plate in the material of Mohs' hardness more than 6.
Integrating sphere lowering or hoisting gear 213 includes air cylinder fixed plate 2131 and propulsion cylinder 2132, and air cylinder fixed plate 2131 is solid
Due on base 9, the main body of propulsion cylinder 2132 is inside base 9, wherein the integrating sphere fixture 212 for receiving optical tests component 2 is
Rack form, it is arranged on the sliding block of propulsion cylinder 2132, and the side of integrating sphere 2111 is connected to follow-up by optical fiber 222
Optical parametric analytical equipment, the other side of integrating sphere 2111 are provided with brightness probe 221, and the light-emitting window of integrating sphere 2111 is set
There is anti-dazzling screen 223, the bottom of the wherein light-emitting window of integrating sphere 2111 is additionally provided with 90 ° of adapters 2112 of integrating sphere, and its effect is
The receipts light that vertical receipts light is converted into horizontal direction is produced by optical fiber 222, is being risen it is possible thereby to solve integrating sphere 2111
Bending is produced to the optical fiber of receipts light with during decline, the loss of light is received in the test thus brought.
It is in addition, as follows for the application method of the flip LED chips on-line measuring device of the present invention：
(1) the upper chip to be tested of objective table 11 is moved to the receipts optical port of integrating sphere 2111 by transport transmission assembly 3
Top；
(2) integrating sphere lowering or hoisting gear 213 moves upwards and integrating sphere is increased and hold out against disc 111, makes the integrating sphere
2111 receipts optical port is directed at flip LED chips to be tested；
(3) probe test platform 4 controls probe 43 to move downward and be directed at the two poles of the earth of flip LED chips；
(4) probe base 41 is powered to probe 43 and lights flip LED chips, and the receipts light of integrating sphere 2111, which is sent, gives follow-up optics
Parameter analysis device completes test.
After completing above-mentioned testing procedure, band Moving plate of the whole flip LED chips test device in transport transmission assembly
Piece 111 moves to next point to be tested, step (1)-(4) is completed so as to circulate, so as to complete all flip LEDs on disc
The test of chip.
The present invention is placed in flip LED by cleverly Machine Design by optical assembly integrating sphere, luminance sensor, optical fiber etc. is received
Below chip light emitting plane, successfully solve flip LED chips test problems, and can be applied to the on-line testing for the chip of falling stake, have
There is the higher market competitiveness.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, all any modification, equivalent and improvement made within the spirit and principles of the invention etc., all should be included
Within protection scope of the present invention.
Claims (9)
1. a kind of flip LED chips on-line measuring device, it is characterised in that the device includes：Bench top module (1), receive flash ranging
Component (2), transport transmission assembly (3), probe test platform (4), Precision alignment systems (5) are tried,
Wherein bench top module (1) includes objective table (11), is provided with the disc for loading multiple chips to be tested
(111), the bench top module (1) is arranged on transport transmission assembly (3), and the work is realized in the case where it drives translocation
Make the positioning of chip to be tested in platform module (1)；
Receive optical tests component (2) to be arranged under the bench top module (1), it includes integrating ball component (21), optic test
Component (22)；The integration ball component (21) includes integrating sphere module (211), integrating sphere fixture (212) and integrating sphere lifting
Device (213)；Wherein described integrating sphere module (211) includes integrating sphere (2111), and the integrating sphere lowering or hoisting gear (213) is in institute
State flip LED chips to be tested to complete after positioning, the integrating sphere (2111) is pushed to the luminous flat of the chip to be measured
And hold out against the disc (111)；The optic test component (22) is used to receiving and analyzing the to be tested of integrating sphere collection
Optical signal and it is analyzed；
The transport transmission assembly (3) includes X-axis module (31) and Y-axis module (32), so as to realize the fortune of two axial directions of X/Y
It is dynamic；
Probe test platform (4) is arranged on the bench top module (1), and it includes probe base (41), probe base lifting dress
(42) and probe (43) are put, wherein probe seat lifting and lowering mechanism (42) is used to drive the probe base (41) lifting described to complete
The contact and disengaging of probe (43) and the chip to be tested, it is real so as to realize that the flip LED chips to be tested are lighted in energization
Now test；
Also include shaft rotating motor (12) on the bench top module (1), its driving belt winds the objective table (11), uses
In controlling its rotary motion, so as to adjust the pose of the chip to be measured；
The operation principle of the on-line checking single unit system is as follows：
Objective table (11) is moved to scanning area (7) by the X-axis module (31) of transport transmission assembly (3), Y-axis module (32) first
Vision system lower section, the posture of disc is adjusted by shaft rotating motor (12), carries out vision setting, it is to be tested to find
Motor coordinate of the chip immediately below detection zone vision system, scanning motion, wherein scanning motion are proceeded by after vision setting
Need to obtain the position of each chip and posture on disc；
Disc (111) after the completion of scanning is transported to the lower section of the vision system of detection zone (8) by transporting transmission assembly (3),
After the completion of probe test platform (4) probe seat lifting and lowering mechanism (42) lifting, treat the needle point of the probe (43) in probe base (41)
Chip is touched, adjustment receives the integrating sphere lowering or hoisting gear (213) in optical tests component (2), integrating sphere (2111) is held out against disc
(111), and examination inspection is carried out, tries to proceed by the detection of optical parametric after inspection passes through, after completion on-line checking on probe (43)
Rising, X-axis module (31), Y-axis module (32) and the shaft rotating motor (12) of transport transmission assembly (3) coordinate adjustment disc (111),
The probe (43) on probe base (41) is directed at next LED flip LED chips to be tested, carry out the inspection of next chip
Survey, so repeatedly.
2. flip LED chips on-line measuring device as claimed in claim 1, it is characterised in that the integrating sphere (2111)
Plate is provided with integration mouth, is arranged to plane thereon, thus completes to make the integrating sphere (2111) hold out against the disc
(111), the light transmittance of the plate is more than 92% and hardness is in Mohs' hardness more than 6.
3. flip LED chips on-line measuring device as claimed in claim 2, it is characterised in that the material of the plate is stone
One kind in English glass, K9 glass, fused quartz, jewel, calcirm-fluoride or magnesium fluoride.
4. the flip LED chips on-line measuring device as described in any one in claim 1-3, it is characterised in that the product
Bulb separation module (211) bottom is additionally provided with 90 ° of adapters (2112) of integrating sphere.
5. flip LED chips on-line measuring device as claimed in claim 4, it is characterised in that the on-line measuring device also wraps
Precision alignment systems (5) are included, it includes two cameras, a position for being used to scan the chip to be measured positioned at scanning area (7)
Appearance, the alignment of a probe (43) for being used to realize the probe test platform (4) positioned at detection zone (8).
6. flip LED chips on-line measuring device as claimed in claim 5, it is characterised in that the posture information of the scanning
Including from the scanning area (7) to transport transmission corresponding to the flip LED chips to be tested of every piece of the detection zone (8)
The coordinates of motion of component (3) and the shaft rotating motor (12).
7. flip LED chips on-line measuring device as claimed in claim 6, it is characterised in that wherein X-axis module (31) includes
X-axis guide rail (312), X-axis pedestal (311) and the driving X-axis pedestal (311) are reciprocating along the X-axis guide rail (312)
Drive device (313)；Wherein Y-axis module (32) includes Y-axis guide rail (322), Y-axis pedestal (321) and the driving Y-axis pedestal
(321) along the Y-axis guide rail (322) reciprocating drive device (323).
8. flip LED chips on-line measuring device as claimed in claim 7, it is characterised in that the on-line measuring device is set
It is placed on a base (9), is provided with a support (10), the transport transmission assembly (3) is arranged on the base (9)
And under the support (10), the probe test platform (4) is arranged on the support (10).
9. flip LED chips on-line measuring device as claimed in claim 8, it is characterised in that lifted including the integrating sphere
Device (213) includes air cylinder fixed plate (2131) and propulsion cylinder (2132), and the air cylinder fixed plate (2131) is fixed on bottom
On seat (9), the main body of the propulsion cylinder (2132) is embedded in the base (9).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410851945.4A CN104483617B (en) | 2014-12-31 | 2014-12-31 | A kind of flip LED chips on-line measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410851945.4A CN104483617B (en) | 2014-12-31 | 2014-12-31 | A kind of flip LED chips on-line measuring device |
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| Publication Number | Publication Date |
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| CN104483617A CN104483617A (en) | 2015-04-01 |
| CN104483617B true CN104483617B (en) | 2018-02-23 |
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| CN201410851945.4A Active CN104483617B (en) | 2014-12-31 | 2014-12-31 | A kind of flip LED chips on-line measuring device |
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| CN107218962B (en) * | 2017-05-25 | 2020-03-13 | 苏州米河自动化科技有限公司 | A tool for testing car turbine sensor |
| CN109757094B (en) * | 2019-02-01 | 2023-10-03 | 南昌大学 | Detection repair mounting equipment for Micro LED chip |
| CN109782103B (en) * | 2019-03-11 | 2021-07-30 | 镇江宏祥自动化科技有限公司 | Alignment method and system for probe and electronic device pin |
| CN110749425B (en) * | 2019-10-31 | 2020-08-14 | 厦门大学 | LED multi-angle optical testing device and testing method |
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| CN104483617A (en) | 2015-04-01 |
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