CN114859214A

CN114859214A - Chip testing device

Info

Publication number: CN114859214A
Application number: CN202210782000.6A
Authority: CN
Inventors: 段雄斌; 张利利; 庞华贵; 何选民
Original assignee: Shenzhen Biaopu Semiconductor Technology Co ltd
Current assignee: Shenzhen Biaopu Semiconductor Technology Co ltd
Priority date: 2022-07-05
Filing date: 2022-07-05
Publication date: 2022-08-05

Abstract

The application belongs to the technical field of chip testing, and particularly relates to chip testing equipment which comprises a rack, a chip carrying platform, a testing assembly, a vision assembly, an integrating sphere assembly and a translation mechanism, wherein the chip carrying platform is arranged on the rack; the testing component is arranged on the frame and comprises a testing needle used for contacting with the pin of the chip; the visual component is positioned above the chip carrier; the integrating sphere assembly can collect light rays emitted by the chip and can be arranged on the rack; the translation mechanism is connected with the rack, and the moving end of the translation mechanism is connected with the vision assembly; the integrating sphere assembly can also be arranged on the moving end of the translation mechanism; the integrating sphere assembly is positioned below the chip carrier when being arranged on the frame; the integrating sphere assembly is arranged above the chip carrying platform when being arranged on the moving end of the translation mechanism and is arranged side by side with the visual assembly along the translation direction of the moving end of the translation mechanism, and the chip testing equipment can be compatible with the testing requirements of a normally-installed chip and a flip chip at the same time.

Description

Chip testing device

Technical Field

The application belongs to the technical field of chip testing, and particularly relates to chip testing equipment.

Background

After the chip is manufactured, the chip is usually subjected to an electrical characteristic test and an optical test by using chip test equipment; the chip testing equipment is divided into integrating sphere positively-mounted chip testing equipment and integrating sphere inversely-mounted chip testing equipment, wherein an integrating sphere assembly and a visual assembly in the integrating sphere positively-mounted chip testing equipment are required to be arranged above the chip carrying platform at the same time, so that the testing requirements of positively-mounted chips with light emitting surfaces and pins on the same side surface can be met; and the integrating sphere assembly and the visual assembly in the chip testing equipment with the integrating sphere inverted are respectively positioned at two opposite sides of the chip carrier, so that the testing requirements of the inverted chip with the light-emitting surface and the pins positioned at two opposite sides can be met.

At present, different types of chip testing equipment are required to be adopted for testing a normally-installed chip and a flip chip, so that in actual testing, the equipment is more in types, the equipment occupies a large area, and more managers exist, so that the testing cost of the chip is rapidly increased.

Disclosure of Invention

The application aims to provide chip testing equipment, and aims to solve the technical problems that in the prior art, different types of chip testing equipment need to be adopted for testing a normally-installed chip and a flip chip, so that in actual testing, the types of equipment are multiple, the occupied area of the equipment is large, and a lot of managers exist, and the testing cost of the chip is rapidly increased.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: a chip testing device comprises a frame, a chip carrying platform, a testing assembly, a vision assembly, an integrating sphere assembly and a translation mechanism, wherein the chip carrying platform is arranged on the frame and used for carrying a chip; the testing component is arranged on the rack and comprises a testing needle, and the testing needle is used for being in contact with a pin of the chip so as to electrically conduct the chip and lighten the chip; the visual component is positioned above the chip carrier and can observe whether the test needle is in contact with the pin of the chip or not; the integrating sphere assembly can collect light rays emitted by the chip and can be arranged on the rack; the translation mechanism is connected with the rack, and the moving end of the translation mechanism is connected with the visual component; the integrating sphere assembly can also be mounted on the moving end of the translation mechanism; the integrating sphere assembly is positioned below the chip carrier when being installed on the rack; the integrating sphere assembly is arranged above the chip carrier when being arranged on the moving end of the translation mechanism and is arranged side by side with the visual assembly along the translation direction of the moving end of the translation mechanism.

Optionally, the vision subassembly includes observation camera, scanning camera, vision lift cylinder and vision connecting seat, vision lift cylinder install in on translation mechanism's the removal end, the piston rod of vision lift cylinder with the vision connecting seat is connected, the observation camera with the scanning camera install side by side in the vision connecting seat, the observation camera is used for observing whether the test needle with the pin contact of chip, the scanning camera is used for acquireing the position data of chip.

Optionally, the integrating sphere assembly comprises an integrating sphere connecting seat, and an integrating sphere, a turntable, an optical fiber and a first motor which are mounted on the integrating sphere connecting seat, the integrating sphere connecting seat can be connected with the rack and the moving end of the translation mechanism, and the light inlet end of the optical fiber is arranged opposite to the light outlet of the integrating sphere; the edge of the rotating disc is positioned between the light inlet end of the optical fiber and the light outlet of the integrating sphere; a plurality of mounting holes are formed in the periphery of the rotary table, the mounting holes are distributed along the circumferential direction of the rotary table, and different light-transmitting sheets are mounted in different mounting holes; the output shaft of the first motor is connected with the rotary table and can drive the rotary table to rotate, so that different light-transmitting sheets are rotated between the light inlet end of the optical fiber and the light outlet of the integrating sphere.

Optionally, the integrating sphere assembly further comprises an integrating sphere fixing seat and an integrating sphere lifting mechanism installed on the integrating sphere fixing seat, the integrating sphere fixing seat can be installed at the rack and the moving end of the translation mechanism, and the lifting end of the integrating sphere lifting mechanism is connected with the integrating sphere connecting seat.

Optionally, the chip carrier includes a first linear driving element, a second linear driving element, and a carrier for carrying the chip, the first linear driving element is mounted on the frame, the second linear driving element is mounted on a moving end of the first linear driving element, the carrier is mounted on a moving end of the second linear driving element, and a moving direction of the moving end of the first linear driving element intersects with a moving direction of the second linear driving element.

Optionally, carry thing seat including connecting base, test panel module, drive mechanism and second motor, connect the base with the removal end of second linear driving piece is connected, the test panel module rotate install in connect on the base, the second motor install in connect on the base and be located the side of test panel module, the second motor passes through drive mechanism with the test panel module is connected and can be driven the test panel module rotates.

Optionally, the test disc module includes a base plate, a transparent plate and an iron ring, and the transmission mechanism is connected to the base plate; the substrate is provided with a hollow hole, and the transparent plate is placed on the substrate and covers the hollow hole; the iron ring is arranged on the substrate and surrounds the transparent plate.

Optionally, the testing assembly includes a testing needle lifting mechanism and a plurality of testing needle modules, each testing needle is connected with the testing needle, the testing needle lifting mechanism is installed on the frame, and the plurality of testing needle modules are installed on the lifting end of the testing needle lifting mechanism.

Optionally, the test pin module includes a fine adjustment mechanism, the fine adjustment mechanism is connected between the lifting end of the test pin lifting mechanism and the test pin and can adjust the position of the test pin.

Optionally, the chip testing device is further provided with a status box; the test pin module also comprises a fixing piece, an elastic piece, a positive pole, a negative pole and a connecting block connected with the fine adjustment mechanism;

one end of the fixing piece is connected with the test needle, the other end of the fixing piece is connected with one end of the elastic sheet, the other end of the elastic sheet is connected with the connecting block, and the end part of the fixing piece connected with the elastic sheet extends to the position below the connecting block;

the positive electrode is arranged on the lower surface of the connecting block, the negative electrode is arranged on the upper surface of the fixing piece, and the elastic piece is positioned between the negative electrode and the test needle; the positive pole and the negative pole are oppositely arranged and are electrically connected with the state box so as to control the on-off of the indicating lamp in the state box.

At least one or more technical solutions in the chip testing device provided by the present application have at least one of the following technical effects: according to the chip testing equipment, the integrating sphere assembly is arranged on the rack, so that the testing requirement of the flip chip is met, the integrating sphere assembly is arranged at the moving end of the translation mechanism, and the positions of the vision assembly and the integrating sphere assembly are switched through the translation mechanism, so that the testing requirement of a normally-installed chip is met; the chip test equipment can be compatible with the test requirements of the normally-installed chip and the flip chip, so that the equipment purchase quantity of a production enterprise can be reduced, the occupied site of the equipment and the occupied management personnel are reduced, and the test cost of the chip is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a chip testing apparatus for testing a mounted chip according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of testing a flip chip by the chip testing apparatus according to the embodiment of the present application.

Fig. 3 is a schematic structural diagram of a chip testing apparatus test provided in the embodiment of the present application.

Fig. 4 is a schematic structural diagram of the chip testing apparatus shown in fig. 1 after testing the hidden housing.

Fig. 5 is a schematic diagram of a first perspective view of the mount, vision assembly and integrator assembly of fig. 4.

Fig. 6 is a schematic diagram of a second perspective view of the mount, vision assembly and integrator assembly of fig. 4.

Fig. 7 is a schematic structural diagram of the visual element in fig. 4.

Fig. 8 is a schematic structural diagram of some components of the chip carrier shown in fig. 4.

Fig. 9 is a schematic structural diagram of other components of the chip carrier shown in fig. 4.

Fig. 10 is a schematic structural diagram of the test assembly in fig. 4.

Fig. 11 is a schematic structural view of the test pin lifting mechanism in fig. 10.

Fig. 12 is an exploded view of the test pin lifting mechanism of fig. 10.

Fig. 13 is an exploded view of the fine adjustment mechanism of fig. 10.

Wherein, in the figures, the respective reference numerals:

10. a frame; 11. a support platform; 111. a grating scale; 12. testing the bottom plate; 13. a mounting frame; 14. a column; 20. a chip carrier; 21. a first linear drive; 211. a servo motor; 212. a coupling; 213. moving the screw rod; 214. moving the nut; 215. a screw rod mounting seat; 22. a second linear drive; 23. a carrying seat; 231. connecting a base; 232. a test tray module; 2321. a substrate; 2322. a transparent plate; 2323. an iron ring; 2324. rotating the V wheel; 2325. fixing the V wheel; 2326. adjusting the V wheel; 2327. a positioning column; 2328. a magnet; 234. a transmission mechanism; 2341. a synchronous belt; 2342. a driving wheel; 2343. a driven wheel; 2344. a tension wheel; 235. a second motor; 24. a support plate; 25. a second linear guide; 26. a second tow chain; 27. a third linear guide rail; 28. a third drag chain; 30. testing the component; 31. a test pin; 32. a test pin lifting mechanism; 321. a lifting connecting seat; 322. a third motor; 323. a cam; 324. a follower; 325. a lifting moving seat; 326. a first elastic member; 327. a fourth linear guide; 328. a third limiting block; 329. a fourth limiting block; 33. a test pin module; 331. a fine adjustment mechanism; 33111. a first abutment post; 3312. a first movable base; 33121. a first nut; 33122. a first rotating block; 33123. a second nut; 3313. a first adjustment member; 33131. a first lead screw; 3314. a second movable base; 33141. a third nut; 33142. a second turning block; 3315. a second adjustment member; 33151. a second lead screw; 3316. a third movable seat; 33161. a second abutment post; 3317. a third adjustment member; 3318. a fifth linear guide rail; 3319. a second elastic member; 332. a fixing member; 3321. a signal connector; 333. a spring plate; 334. a positive electrode; 335. a negative electrode; 336. connecting blocks; 3361. an adjusting screw; 3311. a fixed seat; 40. A visual component; 41. an observation camera; 42. a scanning camera; 43. a visual lifting cylinder; 44. a vision connecting seat; 45. a visual fixing seat; 46. a first stopper; 50. an integrating sphere assembly; 51. an integrating sphere connecting seat; 52. an integrating sphere; 53. a turntable; 531. mounting holes; 54. an optical fiber; 55. a first motor; 56. an integrating sphere fixing seat; 57. an integrating sphere lifting mechanism; 60. a translation mechanism; 61. a translation cylinder; 62. a link block; 63. a first tow chain; 64. a first linear guide rail; 65. a second limiting block; 71. a housing; 72. a status display light; 73. a display screen; 74. an industrial personal computer; 75. a control panel; 76. a code scanning gun; 77. a mouse; 78. a key panel; 79. a keyboard; 81. a status box; 811. an indicator light; 91. a support leg; 92. a universal wheel; 101. positively installing a chip; 102. and (7) flip chip.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Fig. 1 is a schematic structural diagram of a chip testing device according to an embodiment of the present disclosure when testing an upright chip 101, in which a pin and a light-emitting surface of the upright chip 101 are located on the same side, and in an actual testing process, the pin and the light-emitting surface of the upright chip 101 are both disposed upward, so that a testing pin 31, a visual component 40, and an integrating sphere component 50 in a testing component 30 are all located above the chip to ensure that the testing pin 31 contacts with the pin of the chip, thereby lighting the chip; meanwhile, the visual component 40 can be ensured to acquire the position information of the chip and observe whether the pin of the chip is in contact with the test needle 31, and the light emitted by the chip can enter the integrating sphere component 50 to be collected so as to acquire the optical performance of the chip, so that the electrical test and the optical test of the normally installed chip 101 are realized.

Fig. 2 is a schematic structural diagram of the chip testing apparatus provided in the embodiment of the present application when testing the flip chip 102, because the pins and the light-emitting surface of the flip chip 102 are located on two opposite sides of the chip, and in an actual testing process, the pins and the light-emitting surface of the flip chip 102 are respectively arranged up and down, so that the testing pins 31 and the vision assembly 40 in the testing assembly 30 are both required to be located above the chip, so that the testing pins 31 can smoothly contact with the pins of the chip, thereby lighting the chip, and obtaining electrical characteristics of the chip; meanwhile, the vision assembly 40 can also smoothly observe the position of the chip and whether the pin of the chip is in contact with the test needle 31, so that the misjudgment of good chips is reduced; the integrating sphere assembly 50 is required to be arranged below the chip, so that the light emitting surface of the chip and the integrating sphere assembly 50 are arranged on the same side of the chip, the integrating sphere assembly 50 can collect light emitted by the chip, the optical performance of the chip is obtained, and the electrical test and the optical test of the flip chip 102 are realized.

In one embodiment of the present application, a chip testing apparatus is provided, which is shown in fig. 3 and 4, and includes a frame 10, a chip stage 20, a testing assembly 30, an integrating sphere assembly 50, and a translation mechanism 60, wherein the frame 10 is a mounting base of the chip stage 20, the testing assembly 30, the integrating sphere assembly 50, and the translation mechanism 60, and functions as a support fixing member.

The chip carrier 20 is mounted on the frame 10 and is used for carrying a chip, and it is understood that the chip carrier 20 can play a role of supporting and fixing the chip.

The testing component 30 is mounted on the rack 10, the testing component 30 includes a testing pin 31, the testing pin 31 is used for contacting with a pin of the chip to electrically conduct the chip and light the chip; it can be understood that the test pins 31 of the test assembly 30 are in contact with the pins of the chip to electrically connect the chip, so as to light the chip, and the test assembly 30 can also obtain the electrical performance of the chip, so as to complete the electrical test of the chip.

The vision component 40 is positioned above the chip carrier 20 and can observe whether the test needles 31 are in contact with the pins of the chip; it can be understood that, when the testing needle 31 contacts with the pin of the chip, the chip is electrically conducted and in a light-emitting state, and when the pin of the chip does not contact with the testing needle 31, the chip does not emit light, so that whether the pin of the chip contacts with the testing needle 31 can be accurately observed through the visual component 40, and the probability of misjudging that the chip is a defective product because the testing needle 31 does not contact with the pin of the chip is reduced.

The integrating sphere assembly 50 can collect light emitted by the chip, and it can be understood that after the integrating sphere assembly 50 collects light emitted by the chip, optical properties of the chip, such as brightness information, can be obtained; integrating sphere assembly 50 can be mounted to frame 10.

The translation mechanism 60 is connected with the frame 10, and the moving end of the translation mechanism 60 is connected with the visual component 40; integrating sphere assembly 50 can also be mounted on the moving end of translation mechanism 60, it being understood that translation mechanism 60 is used to drive the vision assembly 40 and integrating sphere assembly 50 mounted on the moving end of translation mechanism 60 to translate back and forth; wherein, integrating sphere assembly 50 is located below chip carrier 20 when mounted on frame 10; the integrating sphere assembly 50, when mounted to the moving end of the translation mechanism 60, is located above the chip stage 20 and is aligned with the vision assembly 40 along the translation direction of the moving end of the translation mechanism 60.

The working principle of the chip testing equipment of the embodiment of the application is as follows:

when the chip 101 is required to be tested, the integrating sphere assembly 50 is installed at the moving end of the translation mechanism 60, and at this time, the integrating sphere assembly 50, the vision assembly 40 and the testing assembly 30 are all located above the chip carrier 20; after the chip 101 to be tested is fixed on the chip carrier 20, the translation mechanism 60 translates the visual component 40 to a position right above the chip, and meanwhile, the testing pins 31 of the testing component 30 abut against the pins of the chip 101; when the vision assembly 40 observes that the test needle 31 is in contact with the chip, the chip is electrically conducted and is lightened, then the translation mechanism 60 moves the integrating sphere assembly 50 to the position right above the chip, and light emitted by the chip enters the integrating sphere assembly 50, so that the electrical test and the optical test of the normally installed chip 101 are realized.

When flip chip 102 needs to be tested, integrating sphere assembly 50 is installed on frame 10, integrating sphere assembly 50 is located below chip carrier 20, the chip is fixed on chip carrier 20, translation mechanism 60 moves visual component 40 to the position right above the chip, and simultaneously, testing pin 31 of testing assembly 30 abuts on the pin of the chip, when visual component 40 observes testing pin 31 and chip contact, meanwhile, the chip electrical property switches on and is lighted, the light emitted by the lighted chip enters into integrating sphere assembly 50, so that electrical test and optical test of flip chip 102 are realized.

The chip testing device of the embodiment of the application is arranged on the rack 10 through the integrating sphere assembly 50, so that the testing requirement of the flip chip 102 is met, the integrating sphere assembly 50 is arranged at the moving end of the translation mechanism 60, and the positions of the vision assembly 40 and the integrating sphere assembly 50 are switched through the translation mechanism 60, so that the testing requirement of the normally-installed chip 101 is met; the chip test equipment of the embodiment of the application can be compatible with the test requirements of the normally-installed chip 101 and the flip chip 102 at the same time, so that the equipment purchase quantity of a production enterprise can be reduced, the occupied site of the equipment and the occupied management personnel are reduced, and the test cost of the chip is reduced.

Here, it should be noted that the number of the integrating sphere assemblies 50 may be one or two, and when the number of the integrating sphere assemblies 50 is one, the integrating sphere assemblies 50 are detachably mounted at the moving ends of the rack 10 and the translation mechanism 60, such as screwing, clamping, and the like, so that the testing requirements of the front-mounted chip 101 and the flip-chip 102 can be met by detachably mounting the integrating sphere assemblies 50 between the moving ends of the rack 10 and the translation mechanism 60; referring to fig. 4, when the number of integrating sphere assemblies 50 is two, and two integrating sphere assemblies 50 are respectively mounted on the frame 10 and the moving end of the translation mechanism 60, the corresponding integrating sphere assemblies 50 are selected for different types of chips.

In a specific embodiment, as shown in fig. 4, the rack 10 includes a supporting platform 11, a testing base plate 12, and a mounting frame 13, wherein the supporting platform 11 and the testing base plate 12 are disposed up and down and connected through a column 14, and a chip carrier 20 is mounted on the supporting platform 11 and located between the supporting platform 11 and the testing base plate 12; the mounting frame 13 and the test assemblies 30 are both mounted on the test base plate 12, the translation mechanism 60 is mounted on the mounting frame 13, the test base plate 12 is provided with a first avoidance hole, the number of the test assemblies 30 is multiple and is arranged along the circumferential direction of the first avoidance hole, so that the test needles 31 of the test assemblies 30 can penetrate through the first avoidance hole to be in contact with pins of a chip on the chip carrier 20, and the chip is lightened; meanwhile, the arrangement of the plurality of test assemblies 30 can test a plurality of chips at the same time, and the test efficiency is high; illustratively, the number of test assemblies 30 is four. Supporting platform 11 is the marble platform, and the marble platform quality is heavy for the stationarity of installing the part motion on the marble platform is good, and the plane degree of marble platform is high, makes the part installation accuracy of installing on the marble platform high, thereby is favorable to improving measuring accuracy and efficiency.

In this embodiment, as shown in fig. 3, the chip testing apparatus further includes a housing 71, the rack 10, the chip stage 20, the testing assembly 30, the integrating sphere assembly 50, and the translation mechanism 60 are all disposed in the housing 71, and the housing 71 is provided with a status display lamp, a display screen 73, an industrial control computer 74, a control panel 75, a code scanning gun 76, a mouse 77, a key panel 78, a keyboard 79, and other components to assist the operation of the apparatus and implement an automatic intelligent test of the chip testing apparatus. The bottom of the shell 71 is further provided with a lifting support leg 91 and a universal wheel 92, the support leg 91 can support and fix the whole device, and the universal wheel 92 can facilitate the movement of the device.

In another embodiment of the present application, as shown in fig. 5 and fig. 6, a translation mechanism 60 of the chip testing apparatus is provided, which includes a translation cylinder 61 and a link block 62, the translation cylinder 61 is mounted on the rack 10, specifically, the translation cylinder 61 is mounted on the mounting frame 13, a piston rod of the translation cylinder 61 is connected to the link block 62, the visual component 40 is fixedly connected to the link block 62, and a piston rod of the translation cylinder 61 extends and retracts back and forth, so as to drive the visual component 40 and the integrating sphere component 50 connected to the link block 62 to move back and forth, thereby realizing position switching of the visual component 40 and the integrating sphere component 50, and enabling the visual component 40 and the integrating sphere component 50 to respectively face the chip, thereby realizing back and forth switching of the image and optical testing functions of the chip; in a specific embodiment, the translation cylinders 61 are horizontally distributed from left to right, the integrating sphere assembly 50 and the visual assembly 40 connected to the linking block 62 are arranged side by side from left to right, and the translation cylinders 61 drive the visual assembly 40 and the integrating sphere assembly 50 connected to the linking block 62 to move left and right, so that the visual assembly 40 and the integrating sphere assembly 50 are respectively opposite to the chip, and the image and optical test functions of the chip are switched back and forth.

In another embodiment of the present application, as shown in fig. 5 and 6, a vision assembly 40 of the chip testing apparatus is provided, which includes an observation camera 41, a scanning camera 42, a vision lifting cylinder 43 and a vision connecting base 44, wherein the vision lifting cylinder 43 is mounted on a moving end of the translation mechanism 60, and specifically, the vision lifting cylinder 43 is connected with a linking block 62; the piston rod of the vision lifting cylinder 43 is connected with the vision connecting base 44, the observation camera 41 and the scanning camera 42 are arranged on the vision connecting base 44 side by side, the observation camera 41 is used for observing whether the testing needle 31 is in contact with the pin of the chip, and the scanning camera 42 is used for acquiring the position data of the chip. In an actual testing process, a plurality of chips are arranged on a blue film, when testing, the blue film is fixed on the chip carrier 20, then the blue film is moved to a position below the scanning camera 42, the vision lifting cylinder 43 drives the vision connecting seat 44 and the scanning camera 42 connected with the vision connecting seat to move towards the blue film, when the chips on the blue film are located in a visual field range of the scanning camera 42, the scanning camera 42 scans the chips to acquire chip position data and simultaneously produces an MAPP image for storage, so that subsequent testing can conveniently perform testing on each chip on the blue film according to data records of the MAPP and store test data of each chip obtained by testing in the MAPP document (wherein, it is required to be explained that the acquisition of the chip MAPP image by the scanning camera 42 is a mature technology in the chip testing field, and is not repeated herein); after the chip is scanned by the scanning camera 42, the blue film is moved to the lower part of the observation camera 41, the testing needle 31 in the testing component 30 moves towards the chip, and meanwhile, the observation camera 41 observes the position between the testing needle 31 and the pin of the chip, and the testing is performed after the testing needle 31 is ensured to be in contact with the pin of the chip, thereby avoiding the chip from being judged as a defective product by mistake because the testing needle 31 is not in contact with the pin of the chip, wherein, the visual connecting seat 44 is used as a mounting base body of the observation camera 41 and the scanning camera 42, plays a role of supporting and fixing, the visual lifting cylinder 43 drives the observation camera 41 and the scanning camera 42 to move upwards, and can ensure that the subsequent translation mechanism 60 can not interfere with the testing component 30 when driving the observation camera 41 and the scanning camera 42 to translate, and the visual lifting cylinder 43 drives the observation camera 41 and the scanning camera 42 to move downwards, and the distance between the observation camera 41 and the scanning camera 42 and the chip is small, the observation camera 41 and the scanning camera 42 have high definition of the obtained images, the accuracy of the extracted chip position information is good, the accuracy of the subsequent test result is improved, the position judgment accuracy between the test needle 31 and the pin of the chip is good, and the misjudgment is reduced.

In another embodiment, as shown in fig. 5 and 6, the visual assembly 40 further includes a visual fixing seat 45, the visual lifting cylinder 43 is mounted on the visual fixing seat 45, the visual fixing seat 45 is fixedly connected with the linking block 62, a first drag chain 63 and a first linear guide rail 64 are connected between the mounting frame 13 and the visual fixing seat 45, and under the guiding action of the first linear guide rail 64 and the first drag chain 63, the movement stability of the visual assembly 40 is good, the testing effect is good, and the testing precision is high; the first limiting block 46 is arranged on the visual fixing seat 45, and the first limiting block 46 can prevent the visual connecting seat 44 from excessively moving downwards, so that the damage to a chip is reduced; be provided with second stopper 65 on the mounting bracket 13, second stopper 65 plays and stops the removal of vision fixing base 45, avoids the excessive removal of vision fixing base 45.

In another embodiment of the present application, as shown in fig. 5, 6 and 7, an integrating sphere assembly 50 of the chip testing apparatus is provided, which includes an integrating sphere connecting seat 51, and an integrating sphere 52, a rotating disk 53, an optical fiber 54 and a first motor 55 mounted on the integrating sphere connecting seat 51, wherein the integrating sphere connecting seat 51 can be connected to the frame 10 and the moving end of the translation mechanism 60, and the light inlet end of the optical fiber 54 is disposed opposite to the light outlet of the integrating sphere 52; the edge of the rotating disc 53 is positioned between the light inlet end of the optical fiber 54 and the light outlet of the integrating sphere 52; a plurality of mounting holes 531 are formed in the periphery of the turntable 53, the mounting holes 531 are distributed along the circumferential direction of the turntable 53, and different light-transmitting sheets are mounted in different mounting holes 531; an output shaft of the first motor 55 is connected to the rotating disc 53 and can drive the rotating disc 53 to rotate, so that different light-transmitting sheets can be rotated between the light inlet end of the optical fiber 54 and the light outlet of the integrating sphere 52. In specific application, after light emitted by the chip enters the integrating sphere 52, the integrating sphere 52 acquires partial optical performance of the chip, and then the light enters the optical fiber 54 through the light-transmitting sheet for transmission, and is transmitted to an analysis device of chip testing equipment, so that other required optical performance is acquired, and thus, the optical test of the chip is realized; in addition, the first motor 55 drives the turntable 53 to rotate, and different light-transmitting sheets are rotated between the light inlet end of the optical fiber 54 and the light outlet of the integrating sphere 52, so that light emitted by the integrating sphere 52 enters the optical fiber 54 through different light-transmitting sheets, the optical test requirements of different technical requirements can be met or the optical test requirements of different types of chips can be met, and the application range and the universality of the chip test equipment are improved; in addition, the first motor 55 directly drives the turntable 53 to rotate, so that the replacement of different light-transmitting sheets is realized, the operation is simple, and the automatic control is easy to realize.

In this embodiment, the output shaft of the first motor 55 may be directly fixedly connected to the turntable 53, or may be connected to the turntable 53 through a transmission mechanism such as a synchronous belt transmission mechanism, and the specific structure thereof may be selected according to the actual use condition, which is not limited herein.

In another embodiment of the present application, as shown in fig. 5, 6 and 7, the integrating sphere assembly 50 of the chip testing apparatus further includes an integrating sphere fixing seat 56 and an integrating sphere lifting mechanism 57 mounted on the integrating sphere fixing seat 56, the integrating sphere fixing seat 56 can be mounted on the moving ends of the frame 10 and the translation mechanism 60, and the lifting end of the integrating sphere lifting mechanism 57 is connected to the integrating sphere connecting seat 51. Specifically, the integrating sphere fixing seat 56 serves as an installation base body of the integrating sphere lifting mechanism 57 and plays a role in supporting and fixing the integrating sphere lifting mechanism 57, and the integrating sphere lifting mechanism 57 can drive the integrating sphere 52, the turntable 53 and other components to move up and down, so that on one hand, the integrating sphere 52 can be closer to a chip, light emitted by the chip is collected to the maximum extent, and the accuracy of a test result is improved; on the other hand, interference of integrating sphere 52 with parts such as chip stage 20 and test module 30 can be avoided.

In a specific embodiment, the integrating sphere lifting mechanism 57 is a vertically arranged cylinder or other components capable of driving the components to move up and down, such as a linear module; the integrating sphere fixing seat 56 is mounted on the lower surface of the marble platform, the marble platform is provided with a second avoidance hole, the first avoidance hole and the second avoidance hole are arranged oppositely, and the integrating sphere lifting mechanism 57 drives the integrating sphere 52 to move upwards and penetrate out of the upper part of the second avoidance hole, so that the integrating sphere 52 can be closer to the chip, light rays emitted by the chip can be collected to the maximum extent, and the accuracy of a test result is improved; in addition, the integrating sphere lifting mechanism 57 can also drive the integrating sphere 52 to move downwards so as to move back to the position below the second avoidance hole, so that the interference between the integrating sphere assembly 50 and the chip carrier 20 is avoided; in addition, when the chip 101 is tested, the integrating sphere fixing base 56 is mounted on the vision fixing base 45 and is connected with the link block 62, wherein it should be noted that the integrating sphere fixing base 56 can be mounted on the link block 62 alone or mounted on the vision fixing base 45.

In another embodiment of the present application, as shown in fig. 5, fig. 8 and fig. 9, a chip carrier 20 of the chip testing apparatus is provided, which includes a first linear driving element 21, a second linear driving element 22 and a carrier 23 for carrying a chip, the first linear driving element 21 is installed on the rack 10, the second linear driving element 22 is installed on a moving end of the first linear driving element 21, the carrier 23 is installed on a moving end of the second linear driving element 22, and a moving direction of the moving end of the first linear driving element 21 intersects with a moving direction of the moving end of the second linear driving element 22. Specifically, the first linear driving element 21 and the second linear driving element 22 can drive the object carrying seat 23 to move in a plane, so that the chip on the object carrying seat 23 is moved to the position below the corresponding scanning camera 42 and the corresponding observation camera 41, the scanning camera 42 and the observation camera 41 can capture clear images, and the subsequent test operation and the optical test can be stably and accurately performed, in addition, the position of the object carrying seat 23 can be automatically adjusted by the first linear driving element 21 and the second linear driving element 22, and the automatic operation of the chip test equipment is favorably realized; meanwhile, the first linear driving element 21 can move the object carrying seat 23 out of the side of the rack 10, so that chip manual operation or manipulator feeding and discharging are facilitated.

In a specific embodiment, the first linear driving element 21 is installed on the marble platform, the marble platform is further provided with a grating ruler 111 which is arranged in parallel with the first linear driving element 21, and the moving distance of the moving end of the first linear driving element 21 can be corrected at any time through the grating ruler 111, so that the test error is reduced, and the test precision is improved.

In another embodiment, the moving direction of the moving end of the second linear driving element 22 is perpendicular to the moving direction of the moving end of the second linear driving element 22, so that the first linear driving element 21 and the second linear driving element 22 can drive the object holder 23 to quickly reach any position in a plane, and the object stage moves at a high speed, which is beneficial to improving the testing efficiency.

In another embodiment, the chip carrier 20 further includes a supporting plate 24, the number of the first linear drivers 21 is two, the two first linear drivers 21 are installed in parallel on two opposite sides of the marble platform, the driving ends of the two first linear drivers 21 are respectively connected with two opposite sides of the supporting plate 24, the second linear driver 22 is installed on the supporting plate 24, and the two first linear drivers 21, the supporting plate 24, and the second linear drivers 22 and the carrier 23 installed on the supporting plate 24 move more stably and reliably; the two first linear driving pieces 21 are respectively arranged between the supporting plate 24 and the marble platform and connected with a second linear guide rail 25 and a second drag chain 26, so that the moving stability and reliability of the object carrying seat 23 are better under the guiding action of the second linear guide rail 25 and the second drag chain 26; a third linear guide rail 27 and a third drag chain 28 are arranged between the object carrier 23 and the support plate 24, so that the moving stability and reliability of the object carrier are further improved; the number of the second linear guides 25 and the number of the third linear guides 27 may be multiple, such as two, three, four, etc., and the specific number may be selected according to actual needs, which is not limited herein.

In some embodiments, the first linear driving element 21 includes a servo motor 211, a coupler 212, a movable screw 213 and a movable nut 214, the servo motor 211 is installed on the marble platform, two ends of the movable screw 213 are installed on the marble platform through a screw installation seat 215, an output shaft of the servo motor 211 is connected with one end of the movable screw 213 through the coupler 212, the movable nut 214 is screwed on the movable screw 213, the movable nut 214 is fixedly connected with the support plate 24, the servo motor 211 drives the movable screw 213 to rotate, during the rotation of the movable screw 213, the movable nut 214 moves along the length direction of the movable screw 213, so as to drive the support plate 24 to move and the object carrying seat 23 to move, of course, in other embodiments, the first linear driving element 21 may also be a cylinder or other component capable of driving the support plate 24 to move linearly; the second linear driving element 22 may have the same structure as the first linear driving element 21, or may have a different structure from the second linear driving element 22, and may drive the object holder 23 to move linearly, where the specific structure is not limited herein.

In another embodiment of the present application, as shown in fig. 5 and 9, the carrier 23 of the chip testing apparatus includes a connection base 231, a test tray module 232, a transmission mechanism 234 and a second motor 235, wherein the connection base 231 is connected to the moving end of the second linear actuator 22, the test tray module 232 is rotatably mounted on the connection base 231, the second motor 235 is mounted on the connection base 231 and located at a side of the test tray module 232, and the second motor 235 is connected to the test tray module 232 through the transmission mechanism 234 and can drive the test tray module 232 to rotate; the connecting base 231 serves as a mounting base body of the transmission mechanism 234, the second motor 235 and the test disc module 232, and plays a role in supporting and fixing; the blue membrane that loads the chip is fixed on test disc module 232, second motor 235 accessible drive test disc module 232 rotates through drive mechanism 234, thereby the angle of adjustment chip, so in actual test process, the angle of chip is transferred to presetting the angle with the cooperation of scanning camera 42 to second motor 235, thereby make things convenient for follow-up scanning camera 42 to scan the chip and acquire the position data of chip and produce the MAPP picture simultaneously and preserve, also make things convenient for follow-up test to update the state of chip according to the data record of MAPP.

In another embodiment of the present application, as shown in fig. 5 and 9, the test disk module 232 of the chip testing apparatus includes a base plate 2321, a transparent plate 2322 and an iron ring 2323, and the transmission mechanism 234 is connected to the base plate 2321; the substrate 2321 is provided with a hollow hole, and the transparent plate 2322 is placed on the substrate 2321 and covers the cylindrical hollow hole; the iron ring 2323 is magnetically attracted to the substrate 2321 and disposed around the transparent plate 2322. When the device is used, the periphery of the blue film is clamped and fixed between the substrate 2321 and the iron plate, the transparent plate 2322 supports the part, provided with the chip, of the blue film, so that the test needle 31 can be stably abutted against the chip and also supported by the transparent plate 2322, and the damage to the chip and the blue film is reduced, meanwhile, the transparent plate 2322 can ensure that light emitted by the flip chip 102 penetrates through and enters the integrating sphere 52 positioned below, and the optical information acquisition of the flip chip 102 is realized; the substrate 2321 is provided with the magnet 2328, the iron ring 2323 is magnetically adsorbed on the magnet 2328 and clamps the blue film, so that the chip is fixed, and the magnetic clamping mode is adopted, so that the iron ring 2323 and the substrate 2321 cannot be damaged after being used for a long time, the service life is long, and the service life of the chip testing equipment can be greatly prolonged; in addition, the substrate 2321 is provided with positioning pillars 2327, the positioning pillars 2327 are distributed at intervals along the periphery of the iron ring 2323, and abut against the peripheral wall of the iron ring 2323, so that the iron ring 2323 cannot move in the testing process of the chip.

In another embodiment, the substrate 2321 is provided with an annular protrusion, the annular protrusion is annularly arranged outside the transparent plate 2322, the iron ring 2323 is annularly arranged outside the annular protrusion, a vacuum groove is formed in an end face of the annular protrusion, when the blue film is placed on the transparent plate 2322, the vacuum groove is vacuumized, so that air between the blue film and the transparent plate 2322 is sucked away, at the moment, the blue film can be tightly attached to the transparent plate 2322, bubbles between the transparent plate 2322 and the blue film are eliminated, it is ensured that a chip is stable and does not displace in the moving process of the object carrying seat 23, and the testing accuracy is improved.

In another embodiment, the test disc module 232 further includes a primary ring and a secondary ring, the primary ring and the secondary ring are located between the hollow hole and the iron ring 2323, so that when in specific use, the blue film fixed by the primary ring and the secondary ring can be fixed on the test disc module 232 through the primary ring and the secondary ring, and the blue film fixed by the iron plate can be fixed on the test disc module 232 through the iron ring 2323, so as to perform a test, that is, the test disc module 232 can simultaneously meet fixing requirements of various blue films, thereby greatly improving the application range and the universality of the chip test equipment.

In a specific embodiment, as shown in fig. 5 and fig. 9, the transmission mechanism 234 includes a synchronous belt 2341, a driving wheel 2342, a driven wheel 2343 and a tension wheel 2344, the driven wheel 2343 is rotatably mounted on the connection base 231, the base plate 2321 is mounted on the driven wheel 2343, the second motor 235 is mounted on the connection base 231, an output shaft of the second motor 235 is connected to the driving wheel 2342, the synchronous belt 2341 is wound around the driving wheel 2342 and the driven wheel 2343, the tension wheel 2344 is mounted on the connection base 231 and abuts against the synchronous belt 2341 to tension the synchronous belt 2341, the second motor 235 drives the driving wheel 2342 to rotate, and the driving wheel 2342 rotates to drive the driven wheel 2343 to rotate, so that the rotation of the base plate 2321 is achieved. In addition, the test disc module 232 further includes a rotating V wheel 2324, a fixed V wheel 2325 and an adjusting V wheel 2326, the rotating V wheel 2324 is rotatably installed on the connection base 231, the substrate 2321, the driven wheel 2343 and the fixed V wheel 2325 are sequentially and fixedly connected from top to bottom, the periphery of the fixed V wheel 2325 and the periphery of the adjusting V wheel 2326 are both inserted into the V-shaped groove on the periphery of the fixed V wheel 2325, and the fixed V wheel 2325 and the adjusting V wheel 2326 are distributed along the circumferential direction of the rotating V wheel 2324, so that the driven wheel 2343 drives the rotating V wheel 2324 to rotate, the rotating V wheel 2324 is subjected to the circumferential limiting effect of the fixed V wheel 2325 and the adjusting V wheel 2326, the rotating V wheel 2324 is good in rotation stability and reliability, the substrate 2321 is good in rotation stability and reliability, and the accuracy of chip test is better; at the same time, the adjustment V-wheel 2326 may be moved relative to the connection mount 231 to calibrate the position of the rotation V-wheel 2324.

In another embodiment of the present application, as shown in fig. 5 and 10, the testing assembly 30 of the chip testing apparatus is provided, which includes a testing pin lifting mechanism 32 and a plurality of testing pin modules 33, wherein the testing pin lifting mechanism 32 is installed on the frame 10, and the plurality of testing pin modules 33 are all installed on the lifting end of the testing pin lifting mechanism 32; specifically, the drive test pin module 33 of the test pin lifting mechanism 32 and the corresponding test pin 31 move up and down, so that the pins of the test pin 31 and the chip are contacted and separated, and the plurality of pins of the chip can be tested simultaneously by the arrangement of the plurality of test pin modules 33, and the test efficiency is improved.

In a specific embodiment, as shown in fig. 10, 11 and 12, the test pin lifting mechanism 32 includes a lifting connection seat 321, a third motor 322, a cam 323, a follower 324 and a lifting moving seat 325, the lifting connection seat 321 is connected to the connection base 231, the third motor 322 is installed on the lifting connection seat 321, the cam 323 is installed on an output shaft of the third motor 322, the follower 324 is installed on the lifting moving seat 325 and located below the cam 323, a first elastic member 326 and a fourth linear guide 327 are vertically arranged between the lifting connection seat 321 and the lifting moving seat 325, the follower 324 can always abut against an outer peripheral wall of the cam 323 under the elastic action of the first elastic member 326, so that when the third motor 322 drives the cam 323 to rotate, the follower 324 and the lifting moving seat 325 can be driven to move up and down, so that the test needle 31 can move up and down; and adopt cam 323 elevation structure, the rotation of the less angle of output of third motor 322 can realize the great displacement of test needle 31 like this, in addition, adopt cam 323 elevation structure, its small in size, also can be applicable to in the small precision equipment in space. The upper end and the lower end of the lifting connecting seat 321 are respectively provided with a third limiting block 328 and a fourth limiting block 329, and the lifting moving seat 325 moves between the third limiting block 328 and the fourth limiting block 329, so that the damage to the chip or other parts caused by the excessive up-and-down movement of the lifting moving seat 325 can be avoided.

In another embodiment of the present application, as shown in fig. 10 and 13, the test pin module 33 of the chip testing apparatus is provided to include a fine adjustment mechanism 331, and the fine adjustment mechanism 331 is connected between the elevating end of the test pin elevating mechanism 32 and the test pin 31 and can adjust the position of the test pin 31. Specifically, the position adjustment between the test needles 31 is realized through the fine adjustment mechanism 331, so that different pin positions on different types of chips are met, and the application range and the universality of the chip test equipment are improved.

In another embodiment of the present application, as shown in fig. 10 and 13, the trimming mechanism 331 of the chip testing apparatus is provided to include a fixed base 3311, a first moving base 3312, a first adjusting part 3313, a second moving base 3314, a second adjusting part 3315, a third moving base 3316 and a third adjusting part 3317; the first movable base 3312 is slidably connected to the fixed base 3311; the first adjusting member 3313 is movably mounted on the first movable base 3312 and is capable of driving the first movable base 3312 to slide relative to the fixed base 3311 along a first direction (X-axis direction); the second movable base 3314 is slidably connected to the first movable base 3312; the second adjusting member 3315 is movably mounted on the first moving base 3312 and is capable of driving the second moving base 3314 to slide in a second direction (Z-axis direction) relative to the first moving base 3312; the third moving base 3316 is slidably connected to the second moving base 3314 and is connected to the test pin 31; the third adjusting member 3317 is movably mounted on the second movable base 3314, and is capable of driving the third movable base 3316 to slide in a third direction (Y-axis direction) relative to the second movable base 3314; the first direction, the second direction and the third direction are perpendicular to each other, and the first adjusting part 3313, the second adjusting part 3315 and the third adjusting part 3317 are located on the same side of the fine adjustment mechanism 331. Specifically, when the operator operates the first adjusting member 3313 to move, the first adjusting member 3313 moves to drive the first moving base 3312 and the testing needle 31 connected to the first moving base 3312 to move along a first direction; when the operator operates the third adjustor 3317 to move, the third adjustor 3317 moves to drive the third movable base 3316 and the testing needle 31 connected to the third movable base 3316 to move in a third direction; when an operator operates the second adjusting part 3315 to move, the second adjusting part 3315 moves to drive the second moving seat 3314 and the testing needle 31 connected with the second moving seat to move along the second direction, so that the operator can realize the movement of the testing needle 31 in three directions by operating the second adjusting part 3315, the third adjusting part 3317 and the first adjusting part 3313, and the testing needle 31 can reach any position in a three-dimensional space, thereby accurately contacting with the pin of the chip, meeting the testing requirements of most types of chips and improving the universality of the chip testing equipment; meanwhile, because the first adjusting piece 3313, the second adjusting piece 3315 and the third adjusting piece 3317 are positioned at the same side of the adjusting component of the testing needle 31, the operator can adjust the testing needle 31 in multiple directions on one side of the adjusting component of the testing needle 31, the adjusting operation is simple and rapid, the debugging time of the chip testing equipment is favorably shortened, the adjusting surface is single, a larger adjusting space is not required to be reserved in the chip testing equipment, the chip testing equipment can be suitable for the chip testing equipment with smaller and more precise space, and the whole appearance size of the chip testing equipment is favorably reduced.

In the embodiment, the fixing base 3311 is connected to the lifting moving base 325, the fixing base 3311 is connected to the first moving base 3312, the first moving base 3312 is connected to the second moving base 3314, and the second moving base 3314 is connected to the third moving base 3316 via a fifth linear guide 3318, so that the sliding connection is realized via the fifth linear guide 3318, the stability and reliability of the sliding are good, and the position of the testing pin 31 can be adjusted more accurately.

In one embodiment, the first adjusting member 3313 is a first screw 33131, the first moving base 3312 is provided with a first nut 33121, the first screw 33131 is screwed into the first nut 33121, the first moving base 3312 is provided with a first rotating block 33122, the fixed base 3311 is provided with a first abutting column 33111, the first screw 33131 and the first abutting column 33111 abut against opposite sides of the first rotating block 33122, respectively, when the first screw 33131 is rotated, the first screw 33131 moves up and down in the first nut 33121 and simultaneously pushes the first rotating block 33122 to rotate, but when the first rotating block 33122 rotates, the first rotating block 33122 is limited by the first abutting column 33111, so that the first rotating block 33122 and the first moving base 3312 connected to the first rotating block 22 move in a first direction, thereby realizing the first direction movement of the needle 33131, and, in addition, a second elastic member 3319 is connected between the fixed base 3311 and the first moving base 3312, the elastic force of the second elastic component 3319 makes the first rotating block 33122 always abut against the first abutting post 33111, so that the first rotating block 33122 can smoothly push the first moving seat 3312 to move when rotating, and the test needle 31 has good stability and reliability in movement; the second adjusting member 3315 is a second screw 33151, the first moving base 3312 is further provided with a second nut 33123, the second screw 33151 is screwed to the second nut 33123, a third elastic member is connected between the first moving base 3312 and the second moving base 3314, and the elastic force of the third elastic member makes the first screw 33131 always abut against the second moving base 3314, so that the second screw 33151 is rotated, the second screw 33151 moves up and down in the second nut 33123, thereby driving the second moving base 3314 to move up and down relative to the first moving base 3312, so that the second direction movement of the test needle 31 is realized, the structure is simple, excessive transmission members are not required, and the moving precision of the test needle 31 is improved; meanwhile, the manufacturing and processing are convenient, and the manufacturing cost is reduced. The third adjusting member 3317 is a third screw rod, the second moving base 3314 is provided with a third nut 33141, the third screw rod is screwed in the third nut 33141, the second moving base 3314 is provided with a second rotating block 33142, the third moving base 3316 is provided with a second abutting column 33161, the third screw rod and the second abutting column 33161 abut against opposite sides of the second rotating block 33142 respectively, and when the third screw rod is rotated, the third screw rod moves up and down in the third nut 33141 and pushes the second rotating block 33142 to rotate at the same time, but when the second rotating block 33142 rotates, the second abutting column 33161 is pushed to move and drives the third moving base 3316 to move along a third direction, so that the third direction movement of the testing needle 31 is realized, in addition, a fourth elastic member is connected between the second moving base 3314 and the third moving base 3316, and the elastic force of the fourth elastic member makes the second rotating block 33142 abut against the second abutting column 33161 all the time, therefore, the third moving seat 3316 can be smoothly pushed to move when the second rotating block 33142 rotates, and the stability and reliability of the movement of the test needle 31 are good; in addition, through these ingenious structural designs for first regulating part 3313, second regulating part 3315 and third regulating part 3317 all adopt the structure of lead screw, and its mode of regulation is the same, is favorable to realizing placing first regulating part 3313, second regulating part 3315 and third regulating part 3317 in fine tuning 331 same one side, and the regulation in the three directions of test needle 31 is also more simple convenient and fast, and chip test equipment's debugging effect is higher.

In another embodiment of the present application, as shown in fig. 4, the chip testing apparatus is further provided with a status box 81; the testing pin module 33 further comprises a fixing member 332, an elastic sheet 333, a positive electrode 334, a negative electrode 335 and a connecting block 336 connected with the fine adjustment mechanism 331; specifically, the connecting block 336 is connected with the third moving block; one end of the fixing member 332 is connected with the test pin 31, the other end of the fixing member 332 is connected with one end of the elastic sheet 333, the other end of the elastic sheet 333 is connected with the connecting block 336, and the end part of the fixing member 332 connected with the elastic sheet 333 extends to the lower part of the connecting block 336; the anode 334 is arranged on the lower surface of the connecting block 336, the cathode 335 is arranged on the upper surface of the fixing piece 332, and the elastic sheet 333 is positioned between the cathode 335 and the test pin 31; the positive electrode 334 and the negative electrode 335 are disposed opposite to each other and electrically connected to the status box 81 to control the on/off of the indicator 811 in the status box 81. In a specific application, under the action of the gravity of the fixing member 332 and the test pin 31, the fixing member 332 and the test pin 31 pull the elastic sheet 333 to move downward, so that the test pin 31 is not in contact with the chip and is in a suspended state, at this time, the positive electrode 334 is disconnected from the negative electrode 335, and the indicator lamp 811 in the state box 81 does not emit light; and when the testing needle 31 contacts with the pin of the chip, the chip provides an upward acting force to the fixing piece 332 and the testing needle 31, so that the anode 334 and the cathode 335 are contacted and closed, the indicator lamp 811 in the electrical conduction state box 81 emits light to prompt that the testing needle 31 and the pin of the chip are in a contact state, and therefore misjudgment of defective products caused by the fact that the testing needle 31 is not in contact with the pin of the chip is reduced. In the embodiment, the status box 81 is disposed on the mounting frame 13, so that a person can conveniently and quickly observe the status of the indicator lights 811, wherein the indicator lights 811 in the status box 81 are disposed in one-to-one correspondence with the test pins 31, so that the status of all the test pins 31 can be observed through the status box 81.

In the embodiments, the first elastic member 326, the second elastic member 3319, the third elastic member, and the fourth elastic member may be a spring or the like having a certain elasticity.

In a specific embodiment, the fixing member 332 is further provided with a signal connector 3321, and the signal connector 3321 facilitates the wire connection between the test pin 31 and components such as the industrial personal computer 74; the connecting block 336 is provided with an adjusting screw 3361, and the distance between the connecting block 336 and the fixing member 332 is adjusted by screwing the adjusting screw 3361.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims

1. A chip testing apparatus, comprising:

a frame:

the chip carrying platform is arranged on the rack and is used for carrying a chip;

the testing component is arranged on the rack and comprises a testing needle which is used for being in contact with a pin of the chip so as to electrically conduct the chip and lighten the chip;

the visual assembly is positioned above the chip carrier and can observe whether the test needle is in contact with the pin of the chip or not;

the integrating sphere assembly can collect light emitted by the chip and can be arranged on the rack;

the translation mechanism is connected with the rack, and the moving end of the translation mechanism is connected with the visual component; the integrating sphere assembly can also be mounted on the moving end of the translation mechanism;

the integrating sphere assembly is positioned below the chip carrier when being installed on the rack; the integrating sphere assembly is arranged above the chip carrier when being arranged on the moving end of the translation mechanism and is arranged side by side with the visual assembly along the translation direction of the moving end of the translation mechanism.

2. The chip test apparatus according to claim 1, wherein: the vision subassembly is including observing camera, scanning camera, vision lift cylinder and vision connecting seat, vision lift cylinder install in translation mechanism's removal is served, the piston rod of vision lift cylinder with the vision connecting seat is connected, observe the camera with the scanning camera install side by side in on the vision connecting seat, it is used for observing to observe the camera whether the test needle with the pin contact of chip, the scanning camera is used for acquireing the position data of chip.

3. The chip test apparatus according to claim 1, wherein: the integrating sphere assembly comprises an integrating sphere connecting seat, an integrating sphere, a rotary table, an optical fiber and a first motor, wherein the integrating sphere, the rotary table, the optical fiber and the first motor are arranged on the integrating sphere connecting seat; the edge of the rotating disc is positioned between the light inlet end of the optical fiber and the light outlet of the integrating sphere; a plurality of mounting holes are formed in the periphery of the rotary table, the mounting holes are distributed along the circumferential direction of the rotary table, and different light-transmitting sheets are mounted in different mounting holes; the output shaft of the first motor is connected with the rotary table and can drive the rotary table to rotate, so that different light-transmitting sheets are rotated between the light inlet end of the optical fiber and the light outlet of the integrating sphere.

4. The chip test apparatus according to claim 3, wherein: the integrating sphere assembly further comprises an integrating sphere fixing seat and an integrating sphere lifting mechanism arranged on the integrating sphere fixing seat, the integrating sphere fixing seat can be arranged at the rack and the moving end of the translation mechanism, and the lifting end of the integrating sphere lifting mechanism is connected with the integrating sphere connecting seat.

5. The chip testing apparatus according to any one of claims 1 to 4, wherein: the chip carrying platform comprises a first linear driving part, a second linear driving part and a carrying seat for bearing the chip, the first linear driving part is installed on the rack, the second linear driving part is installed on the moving end of the first linear driving part, the carrying seat is installed on the moving end of the second linear driving part, and the moving direction of the moving end of the first linear driving part is intersected with the moving direction of the second linear driving part.

6. The chip test apparatus according to claim 5, wherein: carry thing seat including connecting base, test panel module, drive mechanism and second motor, connect the base with the removal end of second linear driving piece is connected, the test panel module rotate install in connect on the base, the second motor install in connect on the base and be located the side of test panel module, the second motor passes through drive mechanism with the test panel module is connected and can be driven the test panel module rotates.

7. The chip test apparatus according to claim 6, wherein: the test disc module comprises a substrate, a transparent plate and an iron ring, and the transmission mechanism is connected with the substrate; the substrate is provided with a hollow hole, and the transparent plate is placed on the substrate and covers the hollow hole; the iron ring is arranged on the substrate and surrounds the transparent plate.

8. The chip testing apparatus according to any one of claims 1 to 4, wherein: the test assembly comprises a test needle lifting mechanism and a plurality of test needle modules, each test needle is connected with the test needle, the test needle lifting mechanism is installed on the rack, and the plurality of test needle modules are installed on the lifting end of the test needle lifting mechanism.

9. The chip test apparatus according to claim 8, wherein: the testing needle module comprises a fine adjustment mechanism, and the fine adjustment mechanism is connected with the lifting end of the testing needle lifting mechanism and the position of the testing needle between the testing needles and can be adjusted.

10. The chip test apparatus according to claim 9, wherein: the chip testing equipment is also provided with a state box; the test pin module also comprises a fixing piece, an elastic piece, a positive pole, a negative pole and a connecting block connected with the fine adjustment mechanism;