CN212410027U - Flip LED core particle test system and compatible forward-mounted flip LED core particle test system - Google Patents
Flip LED core particle test system and compatible forward-mounted flip LED core particle test system Download PDFInfo
- Publication number
- CN212410027U CN212410027U CN202021295835.1U CN202021295835U CN212410027U CN 212410027 U CN212410027 U CN 212410027U CN 202021295835 U CN202021295835 U CN 202021295835U CN 212410027 U CN212410027 U CN 212410027U
- Authority
- CN
- China
- Prior art keywords
- flip
- opening
- test system
- along
- vertical direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a flip-chip LED core grain test system and compatible face-up LED core grain test system of just adorning. A flip LED core particle test system is characterized in that a horizontally arranged glass plate is connected to a moving assembly which is hollow along the vertical direction, and the glass plate just corresponds to the hollow part of the moving assembly; the moving assembly is connected to the base provided with the first opening and can convey the inverted LED core particles carried by the glass plate to a position right corresponding to the first opening along the vertical direction; the first light receiving part is movably connected to the base along the vertical direction, a light receiving opening of the first light receiving part corresponds to the first opening along the vertical direction, and the first light receiving part receives light of the inverted LED core particles attached to the glass plate on the light emitting side of the glass plate through the hollow part; a compatible face-down mounting LED core grain testing system comprises the face-down mounting LED core grain testing system, wherein a second light-absorbing part corresponds to a third opening and is connected to the upper side of a mounting part.
Description
Technical Field
The utility model relates to a flip-chip LED core grain test system and compatible just adorn flip-chip LED core grain test system.
Background
The flip LED core particle has the problem of inconvenient electrical connection and light collection for the optical parameter test of the flip LED core particle because the light-emitting surface and the electrode are positioned on two sides which are deviated from each other relatively.
SUMMERY OF THE UTILITY MODEL
For solving the inconvenient problem of flip-chip LED core grain optical parameter test, the utility model provides a flip-chip LED core grain test system and compatible just adorn flip-chip LED core grain test system.
The technical scheme of the utility model is that: a flip-chip LED chip testing system is provided,
the horizontally arranged glass plate is connected with the moving assembly which is hollow along the vertical direction, and the glass plate just corresponds to the hollow part of the moving assembly; the moving assembly is connected to the base provided with the first opening and can convey the inverted LED core particles carried by the glass plate to a position right corresponding to the first opening along the vertical direction; first receipts light part is connected in the base along vertical direction motion, and just corresponds first opening along vertical direction in the receipts light mouth of first receipts light part, and first receipts light part receives the light through the flip-chip LED core grain that cavity position was laminated glass board to the luminous side on the glass board.
Further, the moving assembly comprises two first guide rails which are distributed on two sides of the first opening along a first direction parallel to the horizontal plane; the two second guide rails are respectively and simultaneously connected with the two first guide rails along a direction which is parallel to the horizontal plane and vertical to the first direction; a second opening along the vertical direction is reserved between the two second guide rails, and the two first guide rails and the two second guide rails form a structure shaped like a Chinese character 'jing'; the glass plate connected to the two second guide rails positively corresponds to the second openings in the vertical direction.
Furthermore, the mounting part provided with a third opening is horizontally arranged and connected to the base, so that the third opening is right corresponding to the first opening along the vertical direction; the glass plate and the moving assembly are located between the mounting portion and the base.
Furthermore, a test probe connected to the mounting part through a needle base penetrates through the third opening and is electrically connected to the inverted LED core particles on the glass plate.
Furthermore, a plurality of needle bases are bilaterally symmetrically connected to the mounting part along the third opening.
Furthermore, the observation camera moves along the vertical direction and is connected to the installation part, and the lighting direction of the observation camera is just corresponding to the third opening.
A compatible face-down mounting LED core grain testing system comprises the face-down mounting LED core grain testing system, wherein a second light-absorbing part corresponds to a third opening and is connected to the upper side of a mounting part.
Further, the second light receiving component is connected to the mounting portion in a sliding mode in the vertical direction.
Further, the second light-receiving component is an integrating sphere.
Further, the second light receiving component and the observation camera are respectively connected to the anti-collision part along the vertical direction, and the anti-collision part is connected to the installation part along the horizontal movement.
The beneficial effects of the utility model reside in that: the flip LED core particle light parameter test is accurate and reliable, and the use is convenient.
Drawings
FIG. 1 is a physical diagram of an inverted LED core testing system of the present invention;
FIG. 2 is a schematic view of the kinematic assembly connected to the base;
FIG. 3 is a schematic diagram of a compatible forward-mounted flip-chip LED die testing system;
fig. 4 is a schematic view of the connection relationship between the second light receiving element and the observation camera.
Detailed Description
In order to facilitate the understanding of the technical solutions of the present invention for those skilled in the art, the technical solutions of the present invention will be described in further detail with reference to specific embodiments.
The utility model relates to a technical scheme in "kinematic connection" only be used for explaining can producing relative displacement between relevant two parts to the concrete structure of its adoption is injectd.
As shown in fig. 1, a flip-chip LED die test system 100,
the horizontally arranged glass plate 21 is connected to the moving assembly 22 which is hollow along the vertical direction, and the glass plate 21 is opposite to the hollow part corresponding to the moving assembly 22, the glass plate 21 is not limited, and the requirement that a part made of other materials with light transmission and supporting the LED core particles is the same as the glass plate 21 is met; the moving assembly 22 is connected to the base 30 provided with the first opening 31, and can transport the flipped LED chip carried by the glass plate 21 to a position corresponding to the first opening 31 along the vertical direction a, that is, the moving assembly 22 can transport the flipped LED chip to a position corresponding to the first opening 31, and the position of the flipped LED chip on the glass plate 21 corresponding to the first opening 31 is not limited; the first light receiving part 41 is movably connected to the base 30 along a vertical direction, that is, the first light receiving part 41 can move close to or far away from the base 30 along the vertical direction; the light receiving opening 411 of the first light receiving part 41 is opposite to the corresponding first opening 31 along the vertical direction a, and the first light receiving part 41 receives light of the flip-chip LED core particles attached to the glass plate 21 at the light emitting side of the glass plate 21 through a hollow part; the flip LED core particle is an LED core particle with an electrode end deviating from a light emitting surface, and the technical scheme is adopted, so that the light emitting surface of the flip LED core particle is attached to the glass plate 21, and therefore the flip LED core particle is conveniently electrically connected with and collects emitted light.
With the above technical solution, the first light receiving component 41 can test the optical parameters of the flip-chip LED chip through the lower side of the base 30; the first light-receiving component 41 can move along the direction close to the glass plate 21, so that the first light-receiving component 41 is close to the flip LED core particles as much as possible, thereby reducing the light loss and improving the accuracy of optical parameter measurement; the first light-receiving member 41 can move along the glass plate 21 to move the first light-receiving member 41 away from the moving assembly 22, thereby facilitating the moving assembly 22 to move the glass plate 21 away from the first opening 31 to facilitate removal or replacement of the flip-chip LED die; the flip LED core particles are adhered to a blue film or a white film, the blue film or the white film is fixed on the tension ring or adhered to the iron ring for convenient taking and placing, and the taking and placing of the flip LED core particles are realized by taking and placing the tension ring or the iron ring; the optical parameter test of the flip LED core particles is convenient to realize, the optical parameter test of the flip LED core particles is accurate and reliable, and the use is convenient.
As shown in fig. 1 and 2, the kinematic assembly 22 comprises two first guide rails 221, the two first guide rails 221 being distributed on both sides of the first opening 31 along a first direction b1 parallel to the horizontal plane b; the two second guide rails 222 are respectively and simultaneously connected to the two first guide rails 221 along a direction parallel to the horizontal plane b and perpendicular to the first direction b 1; a second opening 2221 along the vertical direction a is reserved between the two second guide rails 222, and the two first guide rails 221 and the two second guide rails 222 form a structure shaped like a Chinese character 'jing'; the glass plate 21 connected to the two second rails 222 is directly opposite to the second opening 2221 in the vertical direction a.
By adopting the above technical scheme, the first light-receiving component 41 located on the moving component 22 can collect the light emitted by the flip LED core particle located above the moving component 22, thereby facilitating the realization of the test of the light parameter of the flip LED core particle; simple structure and convenient and reliable use.
As shown in fig. 1, the mounting portion 50 provided with the third opening 51 is horizontally disposed and connected to the base 30 such that the third opening 51 corresponds to the first opening 31 in the vertical direction a; the glass plate 21 and the moving assembly 22 are positioned between the mounting portion 50 and the base 30; the mounting portion 50 is used to place or mount other components or parts since the glass sheet 21 can be moved relative to the base 30 by the moving assembly 22.
By adopting the technical scheme, the glass plate 21 can be conveniently moved to the positions corresponding to the first opening 31 and the third opening 51, and the mounting part 50 can be used for placing components for testing, such as a testing machine and a needle seat; because the moving assembly 22 can move, so that certain dangers can be caused, the mounting part 50 can isolate an operator from the moving assembly 22 to a certain extent, and therefore the use safety of the flip-chip LED chip testing system 100 is enhanced; the operator can also perform maintenance or repair on the moving assembly 22 through the third opening 51 for convenience of use.
As shown in fig. 1, a test probe 61 connected to the mounting portion 50 through a needle base 60 is electrically connected to the flip-chip LED chip on the glass plate 21 through the third opening 51; the mounting base 60 is used to mount and adjust the position of the test probe 61 so that the test probe 61 meets the electrical connection requirements for the flip-chip LED die.
As shown in fig. 1, the plurality of needle holders 60 are bilaterally symmetrically connected to the mounting portion 50 along the third opening 51; since the conventional single flip LED chip requires electrical connection of two electrodes, testing the single flip LED chip requires at least two test probes 61 to be electrically connected at the same time; when optical parameter testing is performed on a plurality of (N, N being a positive integer greater than 1) flip LED chips, 2N test probes 61 are required to contact electrodes of the corresponding flip LED chips.
By adopting the technical scheme, the multi-core test is convenient to carry out on the flip LED core particles, and the test efficiency of the flip LED core particles is improved.
As shown in fig. 1, the observation camera 70 is movably connected to the mounting portion 50 along the vertical direction a, and the light direction 71 of the observation camera 70 corresponds to the third opening 51; facilitating the observation scan or positioning of the electrodes of the flip-chip LED die on the glass plate 21 by the observation camera 70 through the third opening 51.
As shown in fig. 3, a compatible flip-chip LED die testing system 200 includes the above-mentioned flip-chip LED die testing system 100, and the second light-receiving member 42 just corresponds to the third opening 51 and is connected to the upper side of the mounting portion 50.
By adopting the technical scheme, the compatible forward-mounted and inverted LED core particle testing system 200 is conveniently used for testing forward-mounted LED core particles, and the second light-receiving component 42 is used for receiving light of the forward-mounted LED core particles; the forward installation of the LED core particles means that the electrodes and the light-emitting surface are positioned at the same side, and at the moment, if the light-emitting surface is attached to the glass plate 21, the forward installation of the LED core particles is not convenient to be electrically connected; therefore, according to the technical scheme, when the flip LED core particles are tested, only the light emitting surface of the flip LED core particles is required to be attached to the glass plate 21, so that the test probes 61 can electrically connect the flip LED core particles from the upper part, and the first light receiving component 41 is used for receiving light; when the LED core particles are tested, the light emitting surface deviates from the glass plate 21, and the second light-receiving component 42 is used for receiving light of the LED core particles; in general, it is required to ensure that the electrodes of the forward-mounted LED chip or the flip-chip LED chip are oriented to positions convenient for the electrical connection of the test probe 61, and the first/second light receiving parts 41/42 at different positions are used for light receiving, so as to complete the test of the optical parameters.
As shown in fig. 3, the second light receiving member 42 is slidably connected to the mounting portion 50 in the vertical direction a; thereby facilitating adjustment of the position of the second light-receiving component 42 (closer/farther from the currently mounted LED die) to meet the usage requirements of the second light-receiving component 42; the second light-receiving component 42 is an integrating sphere, and the integrating sphere is a light-receiving component commonly used for the LED core particle light parameter test.
As shown in fig. 3 and 4, the second light receiving member 42 and the observation camera 70 are respectively connected to the bump guard 80 in the vertical direction a, and the bump guard 80 is connected to the mounting portion 50 in a horizontal movement (by a horizontal movement slider 81); since the second light-receiving member 42 and the observation camera 70 do not operate simultaneously, the horizontal movement slider 81 can switch the positions of the second light-receiving member 42 and the observation camera 70 on the third opening 51, because the bumper 80 keeps the second light-receiving member 42 and the observation camera 70 at a safe distance, prevents the bumper 80 from colliding with the second light-receiving member 42, and enhances the safety of the second light-receiving member 42 and the observation camera 70.
The above is the preferred embodiment of the present invention, and is not used to limit the protection scope of the present invention. It should be recognized that non-inventive variations and modifications to the disclosed embodiments, as understood by those skilled in the art, are intended to be included within the scope of the present invention as claimed and claimed.
Claims (10)
1. The utility model provides a flip-chip LED core grain test system which characterized in that:
the horizontally arranged glass plate is connected with the moving assembly which is hollow along the vertical direction, and the glass plate just corresponds to the hollow part of the moving assembly; the moving assembly is connected to the base provided with the first opening and can convey the inverted LED core particles carried by the glass plate to a position right corresponding to the first opening along the vertical direction; first receipts light part is connected in the base along vertical direction motion, and just corresponds first opening along vertical direction in the receipts light mouth of first receipts light part, and first receipts light part receives the light through the flip-chip LED core grain that cavity position was laminated glass board to the luminous side on the glass board.
2. The flip-chip LED die test system of claim 1, wherein: the moving assembly comprises two first guide rails which are distributed on two sides of the first opening along a first direction parallel to the horizontal plane; the two second guide rails are respectively and simultaneously connected with the two first guide rails along a direction which is parallel to the horizontal plane and vertical to the first direction; a second opening along the vertical direction is reserved between the two second guide rails, and the two first guide rails and the two second guide rails form a structure shaped like a Chinese character 'jing'; the glass plate connected to the two second guide rails positively corresponds to the second openings in the vertical direction.
3. The flip-chip LED die test system of claim 1, wherein: the mounting part provided with the third opening is horizontally arranged and connected to the base, so that the third opening is right corresponding to the first opening along the vertical direction; the glass plate and the moving assembly are located between the mounting portion and the base.
4. The flip-chip LED die test system of claim 3, wherein: and the test probe connected to the mounting part through the needle stand penetrates through the third opening and is electrically connected to the inverted LED core particles on the glass plate.
5. The flip-chip LED die test system of claim 4, wherein: the needle bases are bilaterally symmetrically connected to the mounting portion along the third opening.
6. The flip-chip LED die test system of claim 3, wherein: the observation camera is connected to the installation part along the vertical direction motion, and the lighting direction of the observation camera is just corresponding to the third opening.
7. A compatible face-up flip LED die test system comprising the flip LED die test system of any of claims 3-6, wherein: the second light-absorbing part just corresponds the third opening and is connected in the installation department upside.
8. The compatible forward-mounted flip-chip LED die test system of claim 7, wherein: the second light receiving component is connected to the mounting portion in a sliding mode along the vertical direction.
9. The compatible forward-mounted flip-chip LED die test system of claim 7, wherein: the second light-receiving component is an integrating sphere.
10. The compatible forward-mounted flip-chip LED die test system of claim 7, wherein: the second light receiving component and the observation camera are respectively connected to the anti-collision part along the vertical direction, and the anti-collision part is connected to the installation part along the horizontal movement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021295835.1U CN212410027U (en) | 2020-07-06 | 2020-07-06 | Flip LED core particle test system and compatible forward-mounted flip LED core particle test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021295835.1U CN212410027U (en) | 2020-07-06 | 2020-07-06 | Flip LED core particle test system and compatible forward-mounted flip LED core particle test system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212410027U true CN212410027U (en) | 2021-01-26 |
Family
ID=74404689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021295835.1U Active CN212410027U (en) | 2020-07-06 | 2020-07-06 | Flip LED core particle test system and compatible forward-mounted flip LED core particle test system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212410027U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113866601A (en) * | 2021-09-24 | 2021-12-31 | 深圳市华腾半导体设备有限公司 | Point measurement equipment and point measurement system for chip and point measurement method thereof |
| CN114859214A (en) * | 2022-07-05 | 2022-08-05 | 深圳市标谱半导体科技有限公司 | Chip testing device |
-
2020
- 2020-07-06 CN CN202021295835.1U patent/CN212410027U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113866601A (en) * | 2021-09-24 | 2021-12-31 | 深圳市华腾半导体设备有限公司 | Point measurement equipment and point measurement system for chip and point measurement method thereof |
| CN114859214A (en) * | 2022-07-05 | 2022-08-05 | 深圳市标谱半导体科技有限公司 | Chip testing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN212410027U (en) | Flip LED core particle test system and compatible forward-mounted flip LED core particle test system | |
| KR101663061B1 (en) | Optical measurement of a component having structural features existing on the sides opposite to each other | |
| CN109387523A (en) | A kind of burr detection machine and its detection method | |
| JP2008070290A (en) | Apparatus for measuring light distribution characteristics | |
| CN201967306U (en) | Manual multifunctional surface mounting system for photoelectric device | |
| CN212410031U (en) | Flip-chip LED core grain testing arrangement | |
| CN108414914A (en) | A kind of flip LED chips receipts flash ranging test-run a machine | |
| CN108828433A (en) | A kind of photoelectric properties test device of flip LED chips | |
| KR19980081524A (en) | IC test equipment | |
| CN211756998U (en) | High-speed upper and lower opposite-clamping type LED light splitting machine test structure | |
| CN208188267U (en) | A kind of flip LED chips receipts flash ranging test-run a machine | |
| CN112880979B (en) | Double-station device for testing light-emitting chip | |
| CN115598507B (en) | Chip backlight detection structure and chip detection equipment | |
| CN212539579U (en) | Full-automatic facula test board | |
| CN210534010U (en) | System for detecting visible foreign matters in traditional Chinese medicine oral liquid bottle | |
| CN220509084U (en) | Probe testing device for CSP chip test and CSP chip testing equipment | |
| CN112684316A (en) | Detection structure and chip detection mechanism | |
| CN106644405B (en) | Light splitting device for testing micro electronic element | |
| CN114061908A (en) | Flip-chip LED core grain testing arrangement | |
| CN111855150A (en) | Full-automatic facula test board | |
| CN213558508U (en) | Chip size measuring device | |
| KR102524031B1 (en) | Laser module | |
| CN111141732A (en) | Multi-directional visual detection device | |
| CN218298430U (en) | Coplanarity detection device compatible with CCGA and BGA packaging | |
| CN219890373U (en) | Multi-dimensional detection device for lead frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |