CN220509084U

CN220509084U - Probe testing device for CSP chip test and CSP chip testing equipment

Info

Publication number: CN220509084U
Application number: CN202321387540.0U
Authority: CN
Inventors: 孙名瑞; 朱剑飞; 何琦
Original assignee: Shenzhen Refond Optoelectronics Co Ltd
Current assignee: Shenzhen Refond Optoelectronics Co Ltd
Priority date: 2023-06-01
Filing date: 2023-06-01
Publication date: 2024-02-20
Anticipated expiration: 2033-06-01

Abstract

The utility model relates to the technical field of CSP chip testing, in particular to a probe testing device for CSP chip testing and CSP chip testing equipment. The probe testing device for CSP chip testing comprises a pair of probes, a first probe and a second probe, wherein the pair of probes are used for contacting with electrodes of a chip to be tested to enable the chip to be conducted and emit light; the reflecting component is arranged around the probe, connected with the probe and can synchronously move with the probe to cover part of the chip to be tested when the probe is matched to test the chip to be tested, so that the chip electrode is exposed and reflects the light of the chip to be tested in the non-probe detection direction; and the driving assembly is in signal connection with the probe and the reflecting assembly and drives the probe and the reflecting assembly to synchronously move. The utility model solves the technical problems of inconsistent chip testing environment and practical application environment and lower efficiency and precision, and the CSP chip testing equipment has the same beneficial effects as the probe testing device for CSP chip testing.

Description

Probe testing device for CSP chip test and CSP chip testing equipment

[ field of technology ]

The present utility model relates to the field of CSP chip testing technology, and in particular, to a probe testing device for CSP chip testing and CSP chip testing equipment.

[ background Art ]

CSP (Chip Scale Package), i.e. chip scale packaging. As a latest generation of memory chip packaging technology, CSP packaging can make the ratio of the chip area to the packaging area exceed 1:1.14, which is quite close to the ideal case of 1:1, and the absolute size is only 32 square millimeters, which is about one third of the common BGA (Ball Grid Array) technology. As such, CSP packages continue to penetrate more of the application market and continue to expand, as well as testing techniques associated therewith, are rapidly evolving.

Currently, two test methods of the conventional CSP tester are as follows:

the first is a beam splitter, the testing efficiency and the testing precision can not be matched with the CSP chip with four sides emitting light, and the back light leakage can cause insufficient light receiving during testing;

the second type is a spot measuring machine, the test precision can not meet the basic product requirement, and the spot measuring equipment has larger difference with the environment of receiving light by a standard integrating sphere.

Therefore, the improvement of the structure based on the traditional point measuring machine, so that the testing environment is closer to the environment on the PCB substrate, and the testing efficiency and the testing precision are higher, which is the key of solving the problems of the utility model.

[ utility model ]

The utility model provides a probe testing device for CSP chip testing and CSP chip testing equipment, which aims to solve the problems that a chip testing environment is inconsistent with an actual application environment and the efficiency and the precision are low.

The utility model provides a probe testing device for CSP chip test, which comprises a pair of probes for contacting with electrodes of a chip to be tested to lead the chip to be conducted and emit light;

the reflecting component is arranged around the probe, connected with the probe and can synchronously move with the probe to cover part of the chip to be tested when the probe is matched with the chip to be tested to test the chip to be tested, so that the chip electrode is exposed and reflects the light of the chip to be tested in the non-probe detection direction;

and the driving assembly is in signal connection with the probe and the reflecting assembly and drives the probe and the reflecting assembly to synchronously move.

Preferably, the drive assembly includes cooperating pressure sensing and pressure control structures; the pressure sensing structure monitors the pressure of the probe and/or the reflecting component to the chip, and the pressure control structure enables the probe and/or the reflecting component to be in contact with the chip to be tested and be in a zero pressure range.

Preferably, the reflecting assembly comprises a first reflecting member and a second reflecting member which are arranged in a coplanar manner, and the first reflecting member and the second reflecting member can be close to or far away from each other.

Preferably, the opposite side edges of the first reflecting piece and the second reflecting piece are respectively provided with a first notch and a second notch correspondingly; when the first reflecting piece and the second reflecting piece are close to each other in opposite directions and are attached to each other, the first notch and the second notch jointly form an opening, and the size of the opening is equivalent to the size of a bare die of a chip to be tested.

Preferably, before testing, the first reflecting piece and the second reflecting piece are close to each other and are attached to form the opening, the probe is located above the opening, and the tip of the probe is coplanar with the surfaces of the first reflecting piece and the second reflecting piece, which are close to the chip to be tested.

Preferably, the relative positions of the probe and the reflecting component in the respective horizontal directions are unchanged, and the first reflecting piece and the second reflecting piece are just in contact with the chip to be tested in the vertical direction of the chip.

The utility model solves another technical scheme of the technical problem to provide a CSP chip test device, adopt the above-mentioned probe test device, including the light-transmitting and movable plummer, the plummer has bearing surface can be used for bearing the chip to be tested and move in its horizontal plane so that the chip to be tested is located under the said open pore while testing the chip;

the light source collecting device is arranged on one side, far away from the bearing surface, of the bearing table, and when the probe contacts the chip to conduct and emit light, the light source collecting device collects and detects light emitted by the chip to be tested downwards from the bearing table and/or light emitted by the chip upwards from the bearing table and processed by the reflecting component.

Preferably, the light source collecting device is provided with a light inlet, and the light inlet collects and detects light emitted by the chip downwards at the bearing table and light processed by the light emitted by the chip upwards at the bearing table through the reflecting component.

Preferably, the CSP chip testing device further includes a scanning structure, and the scanning structure is disposed on a side close to the carrying surface of the carrying platform and located right above the opening, and is used for identifying the position of the chip to be tested.

Preferably, a pair of probes are respectively arranged at two sides of the scanning structure; and/or the first reflecting piece and the second reflecting piece are respectively arranged at two sides of the scanning structure.

Compared with the prior art, the probe testing device and the CSP chip testing equipment provided by the utility model have the following advantages:

1. the probe testing device provided by the embodiment of the utility model comprises a pair of probes, a probe module and a probe control module, wherein the probes are used for contacting with electrodes of a chip to be tested to enable the chip to be conducted and emit light; the reflecting component is arranged around the probe, connected with the probe and can synchronously move with the probe to cover part of the chip to be tested when the probe is matched to test the chip to be tested, so that the chip electrode is exposed and reflects the light of the chip to be tested in the non-probe detection direction; and the driving assembly is in signal connection with the probe and the reflecting assembly and drives the probe and the reflecting assembly to synchronously move.

It can be understood that the driving component controls the probe and the reflecting component to synchronously move and adjust to a proper position before testing the chip, so that the part of the reflecting component covering the chip to be tested exposes the electrode of the chip when testing the chip; in addition, the reflecting structure also reflects the light of the chip to be tested in the non-probe detection direction, so that the testing environment is closer to the actual application environment, the deviation between the testing result and the standard machine is smaller, and the testing efficiency and the testing precision are improved.

2. The probe testing device provided by the embodiment of the utility model comprises a driving assembly, a testing assembly and a testing assembly, wherein the driving assembly comprises a pressure sensing structure and a pressure control structure which are matched with each other; the pressure sensing structure monitors the pressure of the probe and/or the reflecting component to the chip, and the pressure control structure enables the probe and/or the reflecting component to be in contact with the chip to be tested and be in a zero pressure range.

It can be understood that the driving assembly can monitor the pressure of the probe and the reflecting assembly on each chip and make the pressure zero, that is, when the reflecting assembly moves in the vertical direction, the chip closest to the probe is in a state of just contacting with the chip, so that the reflecting assembly can not press each chip to be tested, and the accuracy of chip testing is prevented from being influenced.

3. According to the probe testing device provided by the embodiment of the utility model, the reflecting assembly comprises the first reflecting piece and the second reflecting piece which are arranged in a coplanar manner, and the first reflecting piece and the second reflecting piece can be close to or far away from each other. It can be understood that the first reflecting piece and the second reflecting piece which are arranged in a coplanar manner are distributed in opposite directions and can be close to or far away from each other, and in addition, for testing chips with different sizes, only the first reflecting piece and the second reflecting piece corresponding to different models are required to be replaced.

4. According to the probe testing device provided by the embodiment of the utility model, the opposite side edges of the first reflecting piece and the second reflecting piece are respectively provided with a first notch and a second notch correspondingly; when the first reflecting piece and the second reflecting piece are close to each other in opposite directions and are attached to each other, the first notch and the second notch jointly form an opening, and the size of the opening is equivalent to the size of a bare crystal of the chip to be tested.

It can be understood that the first reflecting piece and the second reflecting piece which are arranged in a coplanar manner form an opening through two corresponding gaps, and the chip to be tested is covered when the probe is used for testing the chip, so that on one hand, the chip electrode is exposed to the outside for the probe to contact the chip to conduct and emit light, and on the other hand, the first reflecting piece and the second reflecting piece can respectively reflect the light rays of the two sides of the chip to be tested in the non-probe detection direction, so that the testing environment is closer to the actual application environment.

5. According to the probe testing device provided by the embodiment of the utility model, before testing, the first reflecting piece and the second reflecting piece are closely attached to form the opening, the probe is positioned above the opening, and the needle tip of the probe is coplanar with the surfaces of the first reflecting piece and the second reflecting piece, which are close to the chip to be tested.

It can be understood that the probe, the first reflecting member and the second reflecting member before the start of the test can be controlled to be manually controlled to a proper position by the driving assembly, that is, the first reflecting member and the second reflecting member are coplanar and attached, at this time, the first notch and the second notch form an opening, the probe is positioned above the opening, and the tip of the probe is coplanar with the surfaces of the first reflecting member and the second reflecting member close to the chip to be tested; and during the test of the chip, the probe, the first reflecting piece and the second reflecting piece only move in the respective vertical directions.

6. According to the probe testing device provided by the embodiment of the utility model, the relative positions of the probe and the reflecting component in the respective horizontal directions are unchanged, and the first reflecting piece and the second reflecting piece are just in contact with the chip to be tested in the vertical direction of the chip.

It will be appreciated that during testing of the chip, the probe, the first reflector and the second reflector are moved only in respective vertical directions; and after the positions of the probe and the reflecting assembly are manually adjusted, the relative positions of the probe, the first reflecting piece and the second reflecting piece in the respective horizontal directions are kept unchanged.

7. The CSP chip testing device provided by the embodiment of the utility model adopts the probe testing device and comprises: the light-transmitting and movable bearing table is provided with a bearing surface which can be used for bearing the chip to be tested and moves on the horizontal plane of the bearing surface, so that the chip to be tested is positioned under the open hole when the chip is tested; the light source collecting device is arranged on one side of the bearing table far away from the bearing surface, and is used for collecting and detecting light emitted by the chip to be tested downwards on the bearing table and/or light processed by the reflecting component on the light emitted by the chip upwards on the bearing table when the probe contacts the chip to conduct luminescence.

As can be appreciated, the CSP chip testing apparatus uses the probe testing device, during the testing process of the chip, the relative positions of the probe, the first reflecting member and the second reflecting member in the respective horizontal directions are kept unchanged, and the probe moves only in the respective vertical directions, so that the carrier for placing the chip is transparent and movable, the chip to be tested moves to the position under the first reflecting member, the second reflecting member and the probe along with the movement of the carrier, and the first reflecting member and the second reflecting member cover the chip to be tested to expose the electrode part of the chip, and the probe contacts with the electrode of the chip to be tested to make the chip conduct and emit light; through the design, the first reflecting piece and the second reflecting piece can reflect the light of the chip to be tested in the non-probe detection direction, so that the accuracy and the efficiency of the light source collecting device on the chip test are higher.

8. The CSP chip testing equipment provided by the embodiment of the utility model is characterized in that the light source collecting device is provided with the light inlet, and the light inlet is used for collecting and detecting the light emitted by the chip downwards from the bearing table and the light processed by the light emitted by the chip upwards from the bearing table through the reflecting component.

It can be understood that the light inlet arranged on the light source collecting device can collect the light emitted by the chip downwards at the bearing table, and also can collect the light processed by the reflecting component from the light emitted by the chip upwards at the bearing table, namely the light processed by the reflecting component, namely the light of the chip in the non-probe detection direction.

9. The CSP chip testing equipment provided by the embodiment of the utility model further comprises a scanning structure, wherein the scanning structure is arranged on one side close to the bearing surface of the bearing table and is positioned right above the opening for identifying the position of the chip to be tested. The pair of probes are respectively arranged at two sides of the scanning structure; and/or the first reflecting piece and the second reflecting piece are respectively arranged at two sides of the scanning structure.

It will be appreciated that the scanning structure is required to determine the position of the chip before testing the chip, and the probe and the reflecting assembly move accordingly, so that the probe and the first reflecting member and the second reflecting member opposite to each other in the reflecting assembly are respectively located at two sides of the scanning structure.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort to a person skilled in the art.

Fig. 1 is a schematic diagram of a CSP chip test apparatus according to an embodiment of the utility model.

Fig. 2 is a schematic diagram of a CSP chip testing apparatus according to an embodiment of the utility model except for a driving unit.

Fig. 3 is a schematic diagram of a CSP chip testing apparatus according to an embodiment of the utility model except for a driving module.

FIG. 4 is a schematic diagram of a frame of a probe testing apparatus according to an embodiment of the utility model.

FIG. 5 is a schematic diagram of a frame of a driving assembly in a probe testing apparatus according to an embodiment of the utility model.

FIG. 6 is a schematic diagram of a frame of a reflective element in a probe test apparatus according to an embodiment of the utility model.

Fig. 7 is a schematic top view of a first light reflecting member and a second light reflecting member in the CSP chip testing apparatus according to the embodiment of the utility model.

Fig. 8 is a schematic top view of a first light reflecting member and a second light reflecting member in the CSP chip testing apparatus according to the embodiment of the utility model.

The attached drawings are used for identifying and describing:

1. a probe testing device; 2. CSP chip test equipment

10. A probe; 11. a reflective assembly; 12. a drive assembly; 20. a carrying platform; 21. a light source collecting device; 22. a scanning structure;

110. a clamping structure; 111. a first light reflecting member; 112. a second light reflecting member; 113. opening holes; 120. a control system; 121. a pressure sensing structure; 122. a pressure control structure; 210. a light inlet;

1100. a first clamping member; 1101. a second clamping member; 1110. a first notch; 1120. and a second notch.

[ detailed description ] of the utility model

The present utility model will be described in further detail with reference to the accompanying drawings and examples of implementation in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

It should be noted that the terms "first" and "second" and the like in the description and the claims of the present utility model are used for distinguishing between different objects and not for describing a particular sequential order.

In the present utility model, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present utility model and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.

Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present utility model will be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 2 and 4, a first embodiment of the present utility model provides a probe testing apparatus 1 for CSP chip testing, which includes a pair of probes 10 for contacting with electrodes of a chip to be tested to turn on the chip and emit light;

the reflecting component 11 is arranged around the probe 10, the reflecting component 11 is connected with the probe 10 and can synchronously move with the probe 10 to cover part of the chip to be tested when the probe 10 is matched for testing the chip to be tested, so that the chip electrode is exposed and reflects the light of the chip to be tested in the non-probe 10 detection direction;

and a driving assembly 12 which is in signal connection with the probe 10 and the reflecting assembly 11 and drives the probe 10 to synchronously move with the reflecting assembly 11.

Before testing the chip, the driving component 12 controls the probe 10 and the reflecting component 11 to move synchronously to adjust to a proper position, so that the reflecting component 11 covers the portion of the chip to be tested to expose the electrode of the chip.

When testing the chip to be tested, one end of the probe 10 is connected with a power supply, the other end is in contact with the chip to be tested and is electrified to enable the chip to be conducted and emit light, the driving component 12 is in signal connection with the probe 10 and the reflecting component 11 arranged around the probe 10 so as to control the probe 10 and the reflecting component 11 to synchronously move, the position adjusting mechanism on the driving component 12 controls the reflecting component 11 to be matched with the probe 10 to test the chip, and it can be understood that the reflecting component 11 covers the part of the chip to be tested to expose the electrode of the chip and reflect the light of the chip in the detection direction of the non-probe 10, so that the testing environment is closer to the actual application environment, the deviation between the testing result and a standard machine is smaller, and the testing efficiency and accuracy are improved.

Referring specifically to fig. 2, 4 and 5, in this embodiment, the driving assembly 12 includes a pressure sensing structure 121 and a pressure control structure 122 that cooperate with each other;

the pressure sensing structure 121 monitors the pressure of the probe 10 and/or the reflecting component 11 on the chip, and the pressure control structure 122 enables the probe 10 and/or the reflecting component 11 to be in contact with the chip to be tested and to be in a zero pressure range.

It should be noted that, as a preferred solution of the present utility model, the pressure sensing structure 121 and the pressure control structure 122 in the driving component 12 are electrically connected, the pressure sensing structure 121 monitors the pressure of the probe 10 and the reflection component 11 on the chip respectively and gives real-time pressure data to the driving component 12, then the control system 120 in the driving component 12 issues a control command, the pressure control structure 122 controls the probe 10 and the reflection component 11 to be in contact with the chip to be tested respectively and be in a zero pressure range, when the probe 10 and the reflection component 11 just contact the chip each time, there is a pressure adaptive feedback adjustment system, after the set pressure is 0, the contact is 0g plus or minus 0.1g each time, that is, the pressure can float up and down by 0.1g, and after each contact, fine adjustment can be performed according to the actual pressure, so that the probe 10 and the reflection component 11 just contact with the chip to be tested.

In addition, it is easy to think that, around a single chip to be tested, chips with different sizes and specifications may be placed, and the chips are generally not on the same horizontal plane, so that the horizontal plane where the reflecting component 11 is located needs to be as close to the horizontal plane where the chip to be tested is located as possible, so that the environment in testing is more similar to the environment in practical application, and further, the efficiency and the accuracy of testing are improved.

It can be understood that the pressure sensing structure 121 can monitor the pressure of the reflecting component 11 on the plurality of chips not on the same horizontal plane, and the pressure control structure 122 ensures that the reflecting component 11 will not press each chip to be tested, thereby avoiding affecting the accuracy of chip testing, which is specifically shown in a state that the pressure of the reflecting component 11 on the chip is zero, that is, the surface of the reflecting component 11 close to the chip is in just contact with the chip.

It should be noted that, the adhesion between the reflective component 11 and the chip to be tested needs to satisfy that the plane on which the upper surface of the chip to be tested is located is above the plane on which the upper surfaces of other chips are located or is coplanar with other chips. At this time, the pressure sensing structure 121 and the pressure control structure 122 monitor and control the pressure of the reflecting component 11 on the chips to be zero, i.e. in a just contacted state, so as to ensure that the reflecting component 11 will not press the chips, thereby avoiding affecting the accuracy and efficiency of chip testing.

As an alternative embodiment, referring to fig. 3 and 6 to 8, the reflective assembly 11 includes a first reflective member 111 and a second reflective member 112 disposed in a coplanar manner, and the first reflective member 111 and the second reflective member 112 may be close to or distant from each other.

Further, a first notch 1110 and a second notch 1120 are respectively disposed on opposite sides of the first light reflecting member 111 and the second light reflecting member 112; when the first light reflecting element 111 and the second light reflecting element 112 are close to each other and are attached to each other, the first notch 1110 and the second notch 1120 together form an opening 113, and the size of the opening 113 is equivalent to the die size of the chip to be tested.

In addition, the reflective assembly 11 includes a clamping structure 110, a first reflective member 111, and a second reflective member 112, the clamping structure 110 including a first clamping member 1100 and a second clamping member 1101 detachably coupled to the first reflective member 111 and the second reflective member 112, respectively.

It can be understood that the first light reflecting member 111 and the second light reflecting member 112 are disposed in a coplanar manner and are distributed oppositely, the first light reflecting member 111 and the second light reflecting member 112 are detachably connected with the clamping structure 110, and the first notch 1110 and the second notch 1120 form an opening 113 for exposing the chip electrode and then using the probe 10 to contact and conduct the chip to be tested, so that only the first light reflecting member 111 and the second light reflecting member 112 corresponding to different models need to be replaced for testing chips with different sizes.

It can be further understood that the first light reflecting member 111 and the second light reflecting member 112 form the opening 113 through the corresponding first notch 1110 and the second notch 1120, when the probe 10 tests the chip, the first light reflecting member 111 and the second light reflecting member 112 which are coplanar and attached cover the chip to be tested, on one hand, the opening 113 formed by the first notch 1110 and the second notch 1120 can expose the electrode of the chip to be tested to make the probe 10 contact the chip to be tested to conduct and emit light, and on the other hand, the first light reflecting member 111 and the second light reflecting member 112 can respectively reflect the light rays of the two sides of the chip to be tested in the detection direction of the non-probe 10, so that the test environment is closer to the practical application environment.

The present utility model is merely illustrated as an embodiment, the shape and size of the first light reflecting member 111 and the second light reflecting member 112, and the shape of the opening 113 formed by the first notch 1110 and the second notch 1120 are not specifically limited herein, and may be determined according to practical situations, and the structure similar to the present embodiment is within the scope of the present utility model.

Specifically, referring to fig. 3 and fig. 6 to fig. 8, before testing, the first reflecting member 111 and the second reflecting member 112 are closely attached to form an opening 113, the probe 10 is located above the opening 113, and the tip of the probe 10 is coplanar with the surfaces of the first reflecting member 111 and the second reflecting member 112 near the chip to be tested.

It will be appreciated that the probe 10, first reflector 111 and second reflector 112 may be manipulated to drive assembly 12 to manually control them to the appropriate positions prior to commencing the test.

It should be noted that, the first reflecting member 111 and the second reflecting member 112 disposed in a coplanar manner are attached to each other, and an opening 113 is formed between the two through the corresponding first notch 1110 and the second notch 1120, at this time, the probe 10 is located above the opening 113, and the tip of the probe 10 is coplanar with the surfaces of the first reflecting member 111 and the second reflecting member 112 close to the chip to be tested; in the chip testing process, the probe 10, the first reflecting member 111 and the second reflecting member 112 only move in the respective vertical directions, and the opening 113 just can allow the probe 10 to contact with the electrode of the chip to be tested, so that the chip to be tested is conducted and emits light, i.e. the opening 113 exposes the electrode of the chip to be tested.

Further, the relative positions of the probe 10 and the reflecting component 11 in the respective horizontal directions are unchanged, and the first reflecting piece 111 and the second reflecting piece 112 are just in contact with the chip to be tested in the vertical direction of the chip.

As can be appreciated, during testing of the chip, the probe 10, the first light reflecting member 111 and the second light reflecting member 112 are moved only in the respective vertical directions; whereas the relative positions of the probe 10, the first reflecting member 111 and the second reflecting member 112 in the respective horizontal directions remain unchanged after the manual adjustment of the positions of the probe 10 and the reflecting member 11 is completed.

Referring to fig. 1 to 3, a second embodiment of the present utility model provides a CSP chip testing apparatus 2, which adopts the probe testing device 1 described above, and includes a light-transmitting and movable carrying table 20, wherein the carrying table 20 has a carrying surface for carrying a chip to be tested and moves in a horizontal plane thereof such that the chip to be tested is located under an opening 113 formed by a first reflecting member 111 and a second reflecting member 112 when testing the chip;

the light source collecting device 21 is arranged on one side of the bearing table 20 far away from the bearing surface, and when the probe 10 contacts the chip to conduct and emit light, the light source collecting device 21 collects and detects the light emitted by the chip to be tested downwards on the bearing table 20 and/or the light emitted by the chip upwards on the bearing table 20 and processed by the reflecting component 11.

As can be appreciated, with the above-mentioned probe testing device 1, in the initial state, the first reflecting member 111 and the second reflecting member 112 are close to each other to form the opening 113, the probe 10 is located above the opening 113, and the tip of the probe 10 is coplanar with the surfaces of the first reflecting member 111 and the second reflecting member 112 close to the chip to be tested, and the carrying table 20 moves in its horizontal plane so that the chip to be tested is located directly below the opening 113 when the chip is tested.

In the chip testing process, the relative positions of the probe 10, the first reflecting member 111 and the second reflecting member 112 in the respective horizontal directions are kept unchanged, the probe 10 moves only in the respective vertical directions, the bearing table 20 is transparent and movable, the bearing surface on the bearing table 20 can be used for bearing the chip to be tested and moves in the horizontal plane so that the chip to be tested moves to the position right below the opening 113 formed by the first reflecting member 111 and the second reflecting member 112 when the chip is tested, the first reflecting member 111 and the second reflecting member 112 cover the chip to be tested to expose the electrode part of the chip, and the probe 10 contacts with the electrode of the chip to be tested to conduct the chip to emit light.

By the design, the first reflecting piece 111 and the second reflecting piece 112 can reflect the light of the chip in the detection direction of the non-probe 10, so that the accuracy and the efficiency of the chip test by the light source collecting device 21 are higher.

It should be noted that, the carrying table 20 is movable below the probe 10 and the reflecting component 11, so that the probe 10 and the reflecting component 11 in the probe testing device 1 cooperate to perform spot testing, and the light source collecting device 21 collects and determines the light intensity of the chip under test under the on-state luminescence.

As an alternative embodiment, referring to fig. 3, the light source collecting device 21 is provided with a light inlet 210, and the light inlet 210 collects and detects the light emitted by the chip downward from the carrying platform 20 and the light emitted by the chip upward from the carrying platform 20 through the reflecting component 11.

It should be noted that, the light source collecting device 21 may be specifically an integrating sphere, where the light inlet 210 is disposed on the integrating sphere, so as to collect light emitted by the chip downward from the carrying platform 20, or collect light processed by the reflecting component 11 by light emitted by the chip upward from the carrying platform 20, that is, light processed by the reflecting component 11, that is, light of the chip in a direction not detected by the probe 10; after the light emitted by the chip is collected, the integrating sphere automatically completes the test of the chip, and can specifically test the parameters such as luminous flux, color temperature, light efficiency and the like of the light source.

In particular, as an alternative embodiment, referring to fig. 1 to 3 and 8, the csp chip testing device 2 further includes a scanning structure 22, where the scanning structure 22 is disposed on a side close to the carrying surface of the carrying platform 20 and directly above the opening 113, for identifying the position of the chip to be tested so as to facilitate accurate probing by the probe 10.

Further, a pair of probes 10 are respectively disposed on both sides of the scanning structure 22; and/or the first light reflecting member 111 and the second light reflecting member 112 are disposed at both sides of the scanning structure 22, respectively.

It should be understood that the scanning structure 22 is used for determining a specific position of a chip to be tested placed on the carrying table 20, in a test state, a plurality of chips to be tested are placed on the carrying table 20, and the scanning structure 22 locates the positions of the chips, that is, positions of the positive electrode and the negative electrode of the chip, so that when the scanning structure 22 determines the positions of the chips, the probe 10 and the reflecting component 11 move along with the scanning structure, and a group of probes 10 and the first reflecting piece 111 and the second reflecting piece 112 opposite to each other in the reflecting component 11 are kept on two sides of the scanning structure 22, so that the scanning process is not affected.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the utility model, but any modifications, equivalents, improvements, etc. within the principles of the present utility model should be included in the scope of the present utility model.

Claims

1. A probe testing device for CSP chip testing, comprising:

the pair of probes are used for contacting with the electrodes of the chip to be tested to enable the chip to be conducted and emit light;

2. The probe testing apparatus according to claim 1, wherein:

the driving assembly comprises a pressure sensing structure and a pressure control structure which are matched with each other;

the pressure sensing structure monitors the pressure of the probe and/or the reflecting component to the chip, and the pressure control structure enables the probe and/or the reflecting component to be in contact with the chip to be tested and be in a zero pressure range.

3. The probe testing apparatus according to claim 2, wherein:

the reflection assembly comprises a first reflection piece and a second reflection piece which are arranged in a coplanar mode, and the first reflection piece and the second reflection piece can be close to or far away from each other.

4. A probe testing device according to claim 3, wherein:

the opposite side edges of the first reflecting piece and the second reflecting piece are respectively provided with a first notch and a second notch correspondingly;

when the first reflecting piece and the second reflecting piece are close to each other in opposite directions and are attached to each other, the first notch and the second notch jointly form an opening, and the size of the opening is equivalent to the size of a bare die of a chip to be tested.

5. The probe testing apparatus according to claim 4, wherein:

before testing, the first reflecting piece and the second reflecting piece are close to each other and are attached to form the opening, the probe is located above the opening, and the tip of the probe is coplanar with the surfaces of the first reflecting piece and the second reflecting piece, which are close to the chip to be tested.

6. The probe testing apparatus according to claim 5, wherein:

the relative positions of the probe and the reflecting component in the respective horizontal directions are unchanged, and the first reflecting piece and the second reflecting piece are just in contact with the chip to be tested in the vertical direction of the chip.

7. A CSP chip testing apparatus employing the probe testing device according to any one of claims 4 to 6, comprising:

the light-transmitting and movable bearing table is provided with a bearing surface which can be used for bearing the chip to be tested and moves on the horizontal plane of the bearing surface, so that the chip to be tested is positioned under the open hole when the chip is tested;

8. The CSP chip testing apparatus according to claim 7, wherein:

the light source collecting device is provided with a light inlet, and the light inlet is used for collecting and detecting light emitted by the chip downwards at the bearing table and light processed by the light emitted by the chip upwards at the bearing table through the reflecting component.

9. The CSP chip testing apparatus according to claim 7, wherein:

the CSP chip testing equipment further comprises a scanning structure, wherein the scanning structure is arranged on one side close to the bearing surface of the bearing table and is positioned right above the opening hole and used for identifying the position of the chip to be tested.

10. The CSP chip testing apparatus according to claim 9, wherein:

a pair of probes are respectively arranged at two sides of the scanning structure;

and/or the first reflecting piece and the second reflecting piece are respectively arranged at two sides of the scanning structure.