CN109768129B

CN109768129B - Transfer equipment for Micro LED chip

Info

Publication number: CN109768129B
Application number: CN201910103835.2A
Authority: CN
Inventors: 洪金华; 邱旋; 郑阳辉
Original assignee: Nanchang University
Current assignee: Nanchang University
Priority date: 2019-02-01
Filing date: 2019-02-01
Publication date: 2023-10-03
Anticipated expiration: 2039-02-01
Also published as: CN109768129A

Abstract

The invention discloses Micro-oriented LED chip transfer equipment which comprises a transfer unit, a laser stripping unit, a pick-up head switching unit, a visual detection unit, a repair unit and a bracket serving as a mounting foundation of the units. The transfer equipment facing the Micro LED chips can pick up and transfer the Micro LED chips by the transfer unit; the laser stripping unit can realize the stripping of the Micro LED chip and the substrate; the overlooking fixed camera can pre-judge the size, the number and the positions of Micro LED chips to be transferred, so that the coarse positioning of the pick-up head is realized; the pick-up head switching unit can automatically select and switch the pick-up heads to pick up and transfer Micro LED chips with different sizes and numbers; the overlooking motion camera can realize the accurate positioning of the pick-up head; the visual detection camera is used for detecting whether the Micro LED chip works normally after being transferred; the repair unit is used for repairing the Micro LED chips which work abnormally, and finally, the Micro LED chips are transferred, and the effect of quickly and accurately transferring the Micro LED chips is achieved.

Description

Transfer equipment for Micro LED chip

Technical Field

The invention relates to the technical field of Micro LED chip transfer equipment, in particular to Micro LED chip-oriented transfer equipment.

Background

With the rapid development of information industry, electronic products are increasingly widely used. For electronic products such as mobile phones, tablet computers, notebooks, televisions, etc., the display technology is very critical, and the most common display technology at present is a light emitting diode. The Micro LED chip is a new generation display technology, and has the advantages of low power consumption, high brightness, high efficiency, high reliability, short response time, long service life, ultrahigh resolution, color saturation and the like. The data shows that the power consumption of Micro LED chip is about 10% of LCD and 50% of OLED compared with LCD and OLED. The Micro LED chip has obvious advantages and has great application prospect in the future. At present, micro LED chips face a plurality of technical challenges in the process of realizing industrialization, wherein the mass transfer technology is one of the most difficult key processes at present. The mass transfer technology requires very high transfer efficiency, and at present, many companies are performing related researches, and the mass transfer technology has become a technical bottleneck for restricting the development of Micro LED chips.

Some devices for the mass transfer of Micro LED chips have been proposed in the prior art, such as CN107910413a and CN 108461438A. Further research shows that such existing mass transfer devices still have difficulty in meeting the existing demands in terms of transfer efficiency, transfer yield, and the like, and accordingly, there is a need in the art to seek more complete solutions to the above-mentioned technical problems to meet the current increasing process requirements.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the invention provides transfer equipment for Micro LED chips, which solves the problem that the existing huge amount of transfer equipment still has difficulty in meeting the existing requirements in the aspects of transfer efficiency, transfer yield and the like.

(II) technical scheme

In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a transfer equipment towards Micro LED chip, includes transfer unit, laser stripping unit, picks up first switching unit, visual detection unit, repair unit and as the support of above each unit installation basis, transfer unit includes picks up first, X to translation module, Y to translation module and Z to translation module, and this three module is used for carrying out respectively pick up the linear movement of first in X axle and Y axle and Z axle direction, from this can realize picking up and transferring of Micro LED chip, laser stripping unit fixed mounting is in transfer unit's below, laser stripping unit can realize Micro LED chip and the peeling off of base plate.

Preferably, the visual detection unit comprises a overlook fixed camera and a overlook moving camera, the overlook moving camera is movably mounted on the left side of the transfer unit, the overlook moving camera is movably mounted on the upper side of the pick-up head, the overlook moving camera is used for being matched with the accurate positioning of the pick-up head, the pick-up head switching unit is mounted on the lower side of the overlook moving camera, the visual detection unit is respectively provided with a matched visual detection camera, a Y-direction translation module and a Z-direction translation module, and the visual detection camera, the Y-direction translation module and the Z-direction translation module are all positioned on the right side of the transfer unit.

Preferably, the laser stripping unit comprises a heating substrate, laser irradiation is arranged below the heating substrate, a contact adhesive layer is attached to the top of the heating substrate, a Micro LED chip is placed on the top of the heating substrate, and the Micro LED chip is located below the pick-up head.

Preferably, the pick-up heads of the transfer unit can be switched, and the pick-up head switching unit can be used for switching different pick-up heads and picking up and transferring Micro LED chips with different sizes and numbers.

Preferably, a visual detection unit is arranged at the left side of the visual detection unit, and the bottom of the visual detection unit is fixedly arranged on the bottom of the support of the foundation.

(III) beneficial effects

The invention provides transfer equipment for Micro LED chips. The beneficial effects are as follows:

(1) According to the transfer equipment for the Micro LED chips, the targeted design is carried out by combining the process characteristics of the transfer of the Micro LED chips, the overall structure of the equipment is correspondingly subjected to layout design again, and a new process flow is provided, so that the production efficiency is remarkably improved compared with the existing equipment.

(2) According to the Micro LED chip-oriented transfer equipment, the specific composition structure and the arrangement mode of key components are researched and improved, and particularly, a visual detection unit is adopted, so that high positioning precision and operation convenience can be ensured while high-efficiency Micro LED chip transfer is realized; in addition, the pick-up head switching unit and the laser stripping unit are correspondingly designed, so that the device has compact overall structure, ingenious layout and simple operation, and all the module units are mutually connected and cooperate, thereby being particularly suitable for the occasion of mass production of Micro LED chips.

Drawings

Fig. 1 is a schematic perspective view of a transfer device for Micro LED chips constructed in accordance with a preferred embodiment of the present invention;

FIG. 2 is a schematic plan view of a transfer unit;

FIG. 3 is a schematic plan view of a laser lift-off unit;

FIG. 4 is a schematic plan view of a different pick-up head switching area;

FIG. 5 is a schematic plan view of a detection unit;

fig. 6 is a process flow diagram of Micro LED chip transfer.

In the figure: 100. a transfer unit; 101. a pick-up head; 102. an X-direction translation module; 103. a Y-direction translation module; 104. a Z-direction translation module; 200. a laser peeling unit; 201. heating the substrate; 202. a contact adhesive layer; 203. a pick-up head; 204. micro LED chip; 205. laser; 300. a pickup switching unit; 400. a visual detection unit; 401. a top-down fixed camera; 402. a top-down motion camera; 403. a visual inspection camera; 404. a Y-direction translation module; 405. a Z-direction translation module; 500. and a visual detection unit.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

As shown in fig. 1-6, the present invention provides a technical solution: the transfer equipment for Micro LED chips comprises a transfer unit 100, a laser stripping unit 200, a pick-up head switching unit 300, a visual detection unit 400, a repair unit 500 and a bracket serving as a mounting base of the units, wherein the transfer unit 100 comprises a pick-up head 101, an X-direction translation module 102, a Y-direction translation module 103 and a Z-direction translation module 104, the three modules are respectively used for executing linear movement of the pick-up head 101 in X-axis, Y-axis and Z-axis directions, thereby realizing pick-up and transfer of the Micro LED chips, the laser stripping unit 200 is fixedly arranged below the transfer unit 100, the laser stripping unit 200 can realize stripping of the Micro LED chips from a substrate, the visual detection unit 400 comprises a overlook fixed camera 401 and a overlook moving camera 402, the overlook moving camera 402 is movably arranged at the left side of the transfer unit 100, the overlook moving camera 402 is movably arranged above the pick-up head 101, the overlooking moving camera 402 is used for matching with the accurate positioning of the pick-up head 101, the pick-up head switching unit 300 is arranged below the overlooking moving camera 402, the vision detecting unit 400 is respectively provided with a matched vision detecting camera 403, a Y-direction translation module 404 and a Z-direction translation module 405, the vision detecting camera 403, the Y-direction translation module 404 and the Z-direction translation module 405 are all positioned on the right side of the transferring unit 100, the left side of the vision detecting unit 400 is provided with a vision detecting unit 500, the bottom of the vision detecting unit 500 is fixedly arranged on the bottom of a basic bracket, the laser stripping unit 200 comprises a heating substrate 201, the lower part of the heating substrate 201 is irradiated by laser 205, the top of the heating substrate 201 is attached with a contact adhesive layer 202, the top of the heating substrate 201 is provided with a Micro LED chip 204, the Micro LED chip 204 is positioned below the pick-up head 203, the pick-up head 101 of the transferring unit can be switched, the pickup switching unit 300 can realize switching of different pickup heads, and pick-up and transfer of Micro LED chips with different sizes and numbers.

When the Micro LED chip automatic repair device is used, the fixed camera 401 is overlooked to detect the number, the size and the position of Micro LED chips to be transferred on a workbench, then the pickup head switching unit selects the corresponding pickup head, the overlooking motion camera observes the position of the Micro LED chips to be picked, a reference is provided for the motion of the pickup head, then the laser peeling device is started, the heated Micro LED chips are separated from a substrate, the transfer unit is started at the moment, the Micro LED chips are picked and transferred, the workbench starts to move, the Micro LED chips are lightened, the vision detection camera is started, the vision detection camera is used for detecting and judging whether the Micro LED chips work normally or not, the repair device is started, the Micro LED chips which do not work normally are repaired, the Micro LED chips are lightened, the light-emitting number of the Micro LED chips is detected, the step S-S is repeated until the light-emitting number of the Micro LED chips is higher than the percentage of the total Micro LED chips, the laser peeling unit rapidly irradiates the contact adhesive layer of the Micro LED chips through laser, the Micro LED chips is subjected to laser ablation reaction, the Micro LED chips are lost, the Micro LED chips are adsorbed and transferred by the pickup head, the Micro LED chips are subjected to the automatic repair device, the Micro LED chips are subjected to the transfer, the Micro LED chips are detected by the vision detection camera, the Micro LED chips are subjected to the overlooking motion detection camera, the Micro LED chips are fixed on the same size, the detection camera, the Micro LED chips are required to be fixed, the size and the LED chips, and the LED chips are fixed by the detection camera, and the different in the size, and the vision detection unit, and the vision detection device is used for the pick up and can be used for the pick up and fixed, and the pick up and the change, and the size and the Micro LED chip, and the size and the life The number and the positions provide data for the selection of the pick-up heads and the rough positioning of the pick-up heads; the overlook motion camera is used for observing the accurate position of the Micro LED chip to be picked up and providing a precise reference for the motion of the pick-up head; the visual inspection camera is used for detecting whether the Micro LED chip works normally after being transferred, and meanwhile, contents which are not described in detail in the specification belong to the prior art known to the person skilled in the art.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a transfer equipment towards Micro LED chip, includes transfer unit (100), laser stripping unit (200), picks up first switching element (300), visual detection unit (400), repair unit (500) and as the support of above each unit installation basis, its characterized in that: the transfer unit (100) comprises a first pickup head (101), an X-direction translation module (102), a Y-direction translation module (103) and a Z-direction translation module (104), wherein the three modules are respectively used for executing linear movement of the first pickup head (101) in X-axis, Y-axis and Z-axis directions, so that pickup and transfer of Micro LED chips can be realized, the laser stripping unit (200) is fixedly arranged below the transfer unit (100), and the laser stripping unit (200) can realize stripping of the Micro LED chips and a substrate;

the visual detection unit (400) comprises a overlook fixed camera (401) and a overlook moving camera (402), the overlook moving camera (402) is movably mounted on the left side of the transfer unit (100), the overlook moving camera (402) is movably mounted above the first pickup head (101), the overlook moving camera (402) is used for being matched with the accurate positioning of the first pickup head (101), the pickup head switching unit (300) is mounted below the overlook moving camera (402), the visual detection unit (400) is respectively provided with a matched visual detection camera (403), a Y-direction translation module (404) and a Z-direction translation module (405), and the visual detection camera (403), the Y-direction translation module (404) and the Z-direction translation module (405) are all positioned on the right side of the transfer unit (100);

the laser stripping unit (200) comprises a heating substrate (201), laser (205) irradiates below the heating substrate (201), a contact adhesive layer (202) is attached to the top of the heating substrate (201), a Micro LED chip (204) is placed on the top of the heating substrate (201), and the Micro LED chip (204) is located below the second pickup head (203).

2. The Micro LED chip-oriented transfer device of claim 1, wherein: the pick-up head (101) of the transfer unit can be switched, and the pick-up head switching unit (300) can be used for switching different pick-up heads and picking up and transferring Micro LED chips with different sizes and numbers.