CN103766016A - Electronic component mounting device and electronic component mounting method - Google Patents
Electronic component mounting device and electronic component mounting method Download PDFInfo
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- CN103766016A CN103766016A CN201280041983.2A CN201280041983A CN103766016A CN 103766016 A CN103766016 A CN 103766016A CN 201280041983 A CN201280041983 A CN 201280041983A CN 103766016 A CN103766016 A CN 103766016A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Abstract
Provided is an electronic component mounting device which efficiently uses manufactured wafer-shape electronic components and which suppresses variation while maintaining the consistent quality required in the final product. This electronic component mounting device (1) is provided with: an electronic component holding table (11) which holds a wafer sheet (200) on which multiple electronic components (100) of different ranks are arranged in a wafer shape; an electronic component information storage unit (41) which stores electronic component information comprising position information about the electronic components (100) on the wafer sheet (200) on the electronic component holding table (11) and rank information about said electronic components (100); a transfer head (30) which extracts one or more electronic components (100) from the wafer sheet (200) at a time and transfers the same to a mounting unit (300); a mounting board information storage unit (42) which stores mounting board information including the necessary number and mounting position of the electronic components (100) on the mounting board (300); a mounting board ratio determination unit which calculates the electronic component rank ratio of each rank in the electronic components (100) on the wafer sheet (200) on the basis of the electronic component information, and determines the mounting ratio of each rank in the mounting board (300) on the basis of the electronic component rank ratio and mounting board information; and a control unit which, on the basis of the mounting ratio and the electronic component information, controls the transfer head (30) so as to mount the electronic components (100) to prescribed positions on the mounting board (300) in a state in which the ranks are mixed.
Description
Technical field
The present invention relates to a kind of electronic element installation device and electronic component mounting method that the electronic components such as chip are installed that pick up, transfer.
Background technology
In recent years, as electronic element transferring device, a kind of picking up cut disperseed and was set to the electronic component of wafer-like and the device in handover destination is widely known by the people by hierarchical arrangement by it.The adsorption mouth that this electronic element transferring device utilization is connected with vacuum pump, in the time of from the upside stick electronic components of electronic component, by the action of praising from downside, picks up and transfers electronic component one by one.Now, electronic element transferring device, in order to use more easily the electronic component that is installed in substrate in rear operation, is only arranged in certain position by the electronic component of ad eundem.
The electronic component that is set to wafer-like consists of a lot of electronic components, so transfer the transfer device of electronic component, is required to transfer at short notice a large amount of electronic components.Therefore,, for shortening the pitch time of transferring operation, in patent documentation 1, recorded the invention that can simultaneously transfer a plurality of electronic components.
Patent documentation 1 discloses with the disposable absorption one row semiconductor article (electronic component) of a plurality of adsorption mouth of shape in column is set, and is transferred to the structure of transferring destination.In this structure, in absorption during semiconductor article, by use, praise pin and from downside, praise the grade separation of the semiconductor article of assisting and picking up that the semiconductor article of suitable grade picks up.
In addition, patent documentation 2 has also been recorded when the chip of bonding wafer shape (electronic component), according to the structure of the chip of the performance data of chip and a position data same grade of bonding.
Prior art document
Patent documentation
Patent documentation 1: No. 3712695 communique of Japanese Patent login
Patent documentation 2: Japanese kokai publication hei 4-262543 communique
Summary of the invention
The problem that invention will solve
In recent years, the precision of the inspection of electronic component is being promoted, being set in of In Grade is also more detailed.In addition, from highest ranking, to using the grade allowing, there are a plurality of grades, but also have product not to only require the highest grade.In addition, because the substrate of a product needs a plurality of electronic components, thus require by do not waste the electronic component of manufacturing in front operation as far as possible, and effectively use limited resource and reduce costs.
But as mentioned above, the electronic component of same grade is transferred, arranged to traditional electronic element transferring device, so that the chip bonding of the installation procedure of rear operation is easily transferred.In addition, although have the chip of wafer-like directly from the structure of bonding chip,, the chip that this structure can only the same grade of bonding.
That is to say, traditional technology can be bonded in a product or substrate by each hierarchical arrangement or by the electronic component of same grade, but can not manufacture product or the substrate doped with the electronic component of a plurality of grades.
In addition, in conventional art, for the certain quality of electronic components fabrication and the uneven less product with being arranged to a plurality of grades of wafer-like, can only use the electronic component of same quality.Now, owing to can not using in allowed band but the slightly poor electronic component of quality, so efficiency is not high.
In view of the foregoing, one of object of the present invention is to provide a kind of electronic element installation device and electronic component mounting method, it can use the electronic component of the wafer-like of having manufactured effectively, and makes final products keep certain quality and suppress the uneven of product.
The means of dealing with problems
In order to solve above-mentioned problem, electronic element installation device of the present invention possesses: electronic component holding table, and it is used for keeping wafer band, and a plurality of electronic components that on this wafer band, grade is different are set to wafer-like; Electronic component information storage part, the electronic component information that the positional information of above-mentioned electronic component on the above-mentioned wafer band of its storage in above-mentioned electronic component holding table and the class information of above-mentioned electronic component form; Electronic element transferring installation portion, it takes out above-mentioned electronic component and transfers from above-mentioned wafer band in each one or more modes and is mounted to substrate; Installation base plate information storage part, the installation base plate information that its installation site in aforesaid substrate of storage and necessary quantity form; Ratio determination section in installation base plate, it asks for the grade ratio of the electronic component of each grade in the above-mentioned electronic component on above-mentioned wafer band according to above-mentioned electronic component information, and according to the installation ratio of the electronic component of each grade in above-mentioned electronic component grade ratio and above-mentioned installation base plate information decision aforesaid substrate; Control part, it controls above-mentioned electronic element transferring installation portion so that the state with above-mentioned electronic component information, above-mentioned electronic component being mixed with a plurality of grades according to above-mentioned installation ratio is mounted to the assigned position in aforesaid substrate.
Further, in order to solve above-mentioned problem, electronic component mounting method of the present invention possesses: wafer band keeps operation, and it remains on wafer band on electronic component holding table, and a plurality of electronic components that on this wafer band, grade is different are set to wafer-like; Electronic component information storage operation, its electronic component information that positional information of above-mentioned electronic component on above-mentioned wafer band in above-mentioned electronic component holding table and the class information of above-mentioned electronic component are formed is stored in electronic component information storage part; Installation base plate information storage operation, its installation base plate information that quantity of the installation site in aforesaid substrate and necessity is formed is stored in installation base plate information storage part; In installation base plate, ratio determines operation, it asks for the grade ratio of the electronic component of each grade in the above-mentioned electronic component on above-mentioned wafer band according to above-mentioned electronic component information, and according to the installation ratio of the electronic component of each grade in above-mentioned electronic component grade ratio and above-mentioned installation base plate information decision aforesaid substrate; Control operation, it takes out the above-mentioned electronic component on above-mentioned wafer band according to above-mentioned installation ratio and above-mentioned electronic component information in each one or more modes, then the state mixing with a plurality of grades handover is installed on the assigned position in aforesaid substrate.
Accompanying drawing explanation
Fig. 1 is the block diagram that shows the electronic element installation device of present embodiment and the structure of electronic component mounting method.
Fig. 2 is the position relationship of each parts and the figure of direction of action that shows electronic element installation device.
Fig. 3 shows to pick up the figure of the form of electronic component by electronic element installation device.
Fig. 4 is the flow chart that shows the electronic element installation device of present embodiment and the motion flow of electronic component mounting method.
Fig. 5 generates in display control unit and the flow chart of the flow process that transmits control signal.
Fig. 6 is the flow chart that shows the picking action flow process of present embodiment.
Fig. 7 is the flow chart that shows the installation action flow process of present embodiment.
Fig. 8 is the example that shows the light-emitting diode on wafer band and be installed on the light emitting diode module of substrate.
Fig. 9 is the example that shows the light-emitting diode on wafer band and be installed on the light emitting diode module of substrate.
Embodiment
Below, utilize accompanying drawing to describe embodiments of the present invention in detail.Fig. 1 is the block diagram that shows the electronic element installation device of present embodiment and the structure of electronic component mounting method.
The execution mode of electronic element installation device of the present invention is described, i.e. the structure of electronic element installation device 1 with reference to Fig. 1.In the portion of picking up 10 and installation portion 20 of this Fig. 1, the explanation using left and right directions as directions X, after carrying out from nearside direction distad as Y-direction, using above-below direction as Z direction, using the angle XY plane as θ.
As shown in Figure 1, electronic element installation device 1(is configured to) there is the portion of picking up 10, installation portion 20, as ratio determination section 43 and region determination section 44 in the handover of electronic element transferring installation portion 30, control part 40, electronic component information storage part 41, installation base plate information storage part 42, installation base plate.Pick up portion 10 and be set to isolation mutually on directions X with installation portion 20.In the present invention, electronic element transferring installation portion is by possessing the handover head of adsorption mouth and an actuator for this handover head starting being formed.
Pick up portion 10 and be in electronic element installation device 1 unit that picks up electronic component 100 from be provided with the wafer band 200 of electronic component 100.The portion 10(of picking up is configured to) there is electronic component holding table 11, electronic component holding table actuator 12, pick up hand hammer 13, upper plectane cam 14, pick up motor 15, praise pin 16, lower plectane cam 17, praise motor 18 and camera 19.
Pick up and in portion 10, set a take-off location Pu of place, for picking up by transferring 30 the electronic component 100 being arranged on wafer band 200.Take-off location Pu represents the assigned position of directions X and Y-direction in the portion of picking up 10.
Electronic component holding table 11 is the parts with tabular surface, can keep being provided with the wafer band 200 of electronic component 100.Electronic component holding table 11 is by keeping the edge part of wafer band 200 and elongating the adhesive tape with retractility, makes to be arranged at electronic component 100 on wafer band 200 distance in accordance with regulations and mutually isolates.
Electronic component holding table actuator 12 actuator at θ direction rotation when making electronic component holding table 11 (in other words, XY plane in) is mobile on the face that is provided with electronic component 100 is formed.The control signal mobile electron element holding table 11 that electronic component holding table actuator 12 provides according to control part 40, is set in take-off location Pu place by the electronic component 100 that is arranged on the expectation on wafer band 200 thus.
At take-off location Pu place, pick up hand hammer 13 and there is the bearing shape end that is provided in wafer band 200 tops.The bearing shape end of picking up hand hammer 13 is connected with upper plectane cam 14 by arm.
At take-off location Pu place, praise pin 16 for being provided in the structure of the needle-like of wafer band 200 belows.Praise pin 16 and be connected in lower plectane cam 17 places by arm, and the Z direction that is rotated in that is accompanied by lower plectane cam 17 moves.
Praise pin 16 and move to the top of Z direction by the rotation of lower plectane cam 17, thereby the upper end of praising pin 16 is contacted with wafer band 200.Thereby praise pin 16, at the upper end through-wafer band 200 of moving range, contact with electronic component 100, and electronic component 100 is lifted.
The upper end of praising the needle-like of pin 16 is set to the form that the electronic component 100 that is arranged at take-off location Pu can be lifted.The control signal that praising motor 18 provides according to control part 40 makes lower plectane cam 17 rotations.
Installation portion 20 is the electronic component 100 of adsorption mouth 31 absorption to be mounted to the unit of installation base plate 300 in the portion of picking up 10, and (being configured to) has installation base plate and keep platform 21, installation base plate to keep platform actuator 22, hand hammer 23, plectane cam 24, mounted motor 25 and camera 26 are installed.
In addition, in installation portion 20, set installation site, a place PI, for the electronic component 100 of adsorption mouth 31 absorption is mounted to installation base plate 300.
Installation site PI represents the assigned position of directions X in installation portion 20 and Y-direction.In addition, installation site PI is set at along directions X on the isolated location apart from take-off location Pu predetermined distance.
It is the parts with tabular surface that installation base plate keeps platform 21, can keep being provided with the installation base plate 300 of electronic component 100.Installation base plate 300 can be ceramic substrate, glass substrate, printed base plate etc. (substrate).
It is the actuators with movable axis that installation base plate keeps platform actuator 22, and this movable axis can make installation base plate keep platform 21 that the face direction of electronic component 100 (in other words, directions X Y-direction and θ direction) movement is being installed.
Remain on installation base plate and keep in the installation base plate 300 on platform 21, a Do a plurality of electronic components 100 that the adsorption mouth 31 of the handover 30 of interval isolation is adsorbed are in accordance with regulations installed.In explanation afterwards, the position that on installation base plate 300, each electronic component 100 should be mounted is called to electronic component installation site.In addition, electronic component installation site, for example, is set to rectangular that a plurality of row on installation base plate 300 and row form.
The bearing shape end that hand hammer 23 is installed is connected in arm place, and is connected with plectane cam 24 by this arm.Plectane cam 24 can rotate according to the driving of mounted motor 25.
Arm is followed the rotation of plectane cam 24 and is moved, thereby makes to install bearing shape end back and forth movement in Z direction of hand hammer 23.The control signal that mounted motor 25 provides according to control part 40 makes 24 rotations of plectane cam.
Camera 26 is set to the electronic component 100 and the periphery that are installed on the PI place, installation site on installation base plate 300 to be included in coverage.The image that photographs the installation base plate 300 of (or is taken by camera 26) in camera 26 is sent to control part 40.
Transfer an a plurality of adsorption mouth 31 cylindraceous of 30 maintenance, by the action of an actuator 32, be displaced between the portion of picking up 10 and installation portion 20, and carry out picking action and the installation action of electronic component 100.Transfer 30 top that are arranged on respect to the Z direction of the electronic component holding table 11 of the portion of picking up 10 and the installation base plate platform 21 of installation portion 20.
Control signal is sent into installation base plate and keep platform actuator 22, electronic component holding table actuator 12, an actuator 32, and the control part 40 of controlling respectively above-mentioned actuator is connected with electronic component information storage part 41 and installation base plate information storage part 42.
41 the past of electronic component information storage part operation or pin check machine obtain and store the positional information of the electronic component 100 comprising on wafer band 200 and the electronic component information of class information.
This electronic component information is obtained by methods such as Electronic saving medium such as the methods such as the server path by LAN or CD, memory banks.Positional information comprises the index on wafer band 200, and class information comprises the information such as light quantity, wavelength, resistance value, processing speed, high voltage withstanding, electric current amplification factor.In addition, the grade that class information also can predetermine according to information such as light quantity, wavelength, resistance value, processing speed, high voltage withstanding, electric current amplification factors is classified.
42 storages of installation base plate information storage part are arranged on the installation base plate information that installation base plate keeps the electronic component 100 in the installation base plate 300 on platform 21.Installation base plate information at least comprises the information of necessity installation number of the installation site of each electronic component in installation base plate and the electronic component in installation base plate.
Fig. 2 is the position relationship at each position and the figure of direction of action that shows electronic element installation device.
With reference to Fig. 2, further illustrate the position relationship of each parts of electronic element installation device 1.Fig. 2 is that the electronic component holding table 11 of the portion of picking up 10 while showing the electronic element installation device 1 of observing Fig. 1 from the top of Z direction, the installation base plate of installation portion 20 keep platform 21 and transfer a setting of 30 and the figure of direction of action.
As shown in Figure 2, transfer 30 and pick up on the straight line of the take-off location Pu of portion 10 and the installation site PI of installation portion 20 in connection, make a plurality of adsorption mouth 31 isolate respectively regulation blank and remain row.
Therefore,, in the portion of picking up 10, the action of an actuator 32 makes to transfer 30 and moves at directions X, thereby make to transfer 30 adsorption mouth 31 that keep, is transferred to one by one take-off location Pu.On the other hand, in installation portion 20, the action of an actuator 32 makes to transfer 30 and moves on directions X, thereby make to transfer 30 adsorption mouth 31 that keep, is moved into one by one installation site PI.
Thereby control part 40 is for example by resolving image desired location coordinate in each electronic component 100 of the electronic component 100 on the wafer band 200 being sent by camera 19.Control part 40 makes 12 actions of electronic component holding table actuator according to the desired locations coordinate of electronic component 100, thereby makes electronic component holding table 11 carry out position adjustment so that electronic component 100 to take-off location Pu.
In addition, control part 40 is desired location coordinate on installation base plate 300, using the coordinate of expectation as electronic component installation site ， And, make installation base plate keep 22 actions of platform actuator to carry out the position adjustment that installation base plate keeps platform 21, make the installation site of electronic component to installation site PI.
In addition, the image analysis result that control part 40 sends according to camera 26, is arranged at obtaining of the quality inspection of the electronic component 100 on installation base plate 300 or positional information etc.
In addition, the image that control part 40 is taken with reference to camera 19, camera 26, when electronic component 100 in XY plane when θ direction is shifted to install, to electronic component holding table actuator 13 and installation base plate, keep platform actuator 22 to transmit control signal, the correction that makes electronic component holding table 11, installation base plate keep platform 21 to move to θ direction respectively.Thus, can carry out more exactly picking up and installing of electronic component.
Fig. 3 shows to pick up the figure of the form of electronic component by electronic element installation device.
The picking action of the electronic component 100 on adsorption mouth 31 absorption wafer bands 200 of transferring 30 then, is described with reference to Fig. 3.In Fig. 3, the position relationship of each parts is separately recited as state 1 to state 4.Below the action of each parts of explanation is implemented by the control of control part 40.
In the picking action of electronic component 100, first, electronic component holding table actuator 12 moves electronic component holding table 11, and the electronic component of expectation 100 is moved on the axle shown in take-off location Pu(dotted line).
Meanwhile, or before and after it, an actuator 32 moves transfers 30, makes the adsorption mouth 31 of expectation move to take-off location Pu(state 1).Picking up hand hammer 13, praise pin under this state, adsorption mouth 31 are respectively that it is at the primary position of Z direction in the position of Z direction.
Then, pick up motor 15 and make 14 rotations of plectane cam, thereby make to pick up hand hammer 13, move downwards.Pick up hand hammer 13 along with moving contact is behind the upper end of adsorption mouth 31, opposing applies the active force that active force makes adsorption mouth 31 spring assembly upward, and adsorption mouth 31 is pressed down downwards.
The adsorption mouth 31 being pressed down is picked up the lower end butt electronic component 100 of the moving range of hand hammer 13 arrival, and control part 40 makes adsorption mouth 31 carry out the action of stick electronic components 100 in advance, thus stick electronic components 100.In addition, praise motor 18 and make lower plectane cam 17 rotations, thereby make to praise pin 16, towards electronic component 100, move (state 2).
Then, pick up motor 15 and make 14 rotations of plectane cam, thereby make to pick up hand hammer 13, be moved upward, remove thus pressing down adsorption mouth 31.The adsorption mouth 31 that releasing presses down relies on the active force of spring assembly to be moved upward under the state that is adsorbing electronic component 100.Meanwhile, praise the upper end through-wafer band 200 of pin 16, electronic component 100 is praised upward, and make the lower end of electronic component 100 move (state 3) to the direction of peeling off from wafer band 200.
Pick up hand hammer 13 and praise pin 16 and return to primary position separately, the adsorption mouth 31 that electronic component 100 is adsorbed in to lower end is also returned to the primary position in Z direction.Afterwards, electronic component holding table actuator 12 mobile electron element holding tables 11 are so that next electronic component 100 to next take-off location Pu.Meanwhile, or before and after it, an actuator 32 moves transfers 30, makes next adsorption mouth 31 move to take-off location Pu(state 4).
According to action described above, electronic component 100 is transferred adsorption mouth 31 absorption of 30.By repeatedly repeating above-mentioned action, remain on a plurality of adsorption mouth 31 transferred on 30 stick electronic components 100 separately.
In addition, the installation action in relevant installation portion 20 also can same program be implemented.Concrete program is below described.In the installation action of electronic component 100, first, installation base plate keeps platform actuator 22 to move installation base plate and keeps platform 21, thereby makes the electronic component installation site of expectation on installation base plate 300 move to installation site PI.Meanwhile, or before and after it, an actuator 32 moves transfers 30, and the adsorption mouth 31 of adsorbing electronic component 100 is moved to installation site PI.Now, the primary position that hand hammer 23 is positioned at Z direction is installed.
Then, mounted motor 25 armature cams 24, move downwards thereby make to install hand hammer 23.Hand hammer 23 is installed along with moving contact is behind the upper end of adsorption mouth 31, opposing applies the active force that active force makes adsorption mouth 31 spring assembly upward, and adsorption mouth 31 is pressed down.The electronic component that is adsorbed in adsorption mouth 31 100 being pressed down is being installed the lower end butt installation base plate 300 of hand hammer 23 arrival movings range.
Now, by control part 40, remove the absorption of the adsorption mouth 31 of stick electronic components 100, make electronic component 100 be arranged on the electronic component installed position on installation base plate 300.Installation base plate 300 has viscosity, so electronic component 100 is adhered to the electronic component installed position of installation base plate 300.
Then, mounted motor 25 makes 24 rotations of plectane cam, thereby make to install hand hammer 23, is moved upward, and removes thus pressing down adsorption mouth 31.Be disengaged active force that the adsorption mouth 31 pressing down relies on spring assembly is moved upward under the state of stick electronic components 100 not.
Meanwhile, or before and after it, an actuator 32 makes to transfer 30 and moves, thereby makes the adsorption mouth 31 of adsorbing next electronic component 100 move to installation site PI.
Action according to the above description, transfers 30 electronic component 100 of transferring and is installed on installation base plate 300.By repeatedly repeating above-mentioned action, transfer 30 have the electronic component 100 that adsorbs respectively of a plurality of adsorption mouth 31 be installed on installation base plate 300.
Fig. 4 is the flow chart that shows the electronic element installation device of present embodiment and the motion flow of electronic component mounting method.Next the action of electronic element installation device 1 is described with reference to Fig. 4 (flow chart of the picking action that demonstration comprises electronic element installation device 1 and all motion flows of installation action).
In electronic element installation device 1, when a series of action at first, the wafer band 200 that maintains electronic component 100 is arranged on the electronic component holding table 11 of the portion of picking up 10 (step S1).On this wafer band 200, a plurality of electronic components 100 that grade is different are configured to wafer-like.
Meanwhile, or before and after it, the installation base plate that the installation base plate 300 that electronic component 100 is installed is arranged on installation portion 20 keeps on platform 21 (step S2).
Then, control part 40 generates and sends the control signal (step S3) for controlling each actuator.According to this control signal control electronic component holding table actuator 12, pick up motor 15, installation base plate keeps platform actuator 22, an actuator 32 etc., thereby control picking up, installing of electronic component 100.In addition, the generation of relevant controlling signal and transmission narration after a while.
Secondly, control part 40 moves to handovers 30 to pick up the 10(of portion step S4), thus implementation picking action (step S5).
By such picking action, be arranged on electronic component 100 on wafer band 200 and transferred respectively a plurality of adsorption mouth 31 absorption of 30.In addition, relevant picking action will be in narration after a while.
Then, control part 40 moves (step S6) to installation portion 20 by handover 30, thereby carries out installation action (step S7).
By such installation action, transfer the electronic component 100 that 30 a plurality of adsorption mouth 31 adsorb respectively and be mounted to installation base plate 300.In addition, relevant installation action will be in narration after a while.
Fig. 5 means the flow chart of the flow process that the generation of control signal in control part 40 sends.Flow process (the step 3) of Fig. 4 that generates, transmits control signal referring to the control part 40 of the flowchart text electronic element installation device 1 of Fig. 5.
Then, control part 40 is calculated the electronic component grade ratio (step S11) of electronic component 100 on wafer band 200 by the electronic component information obtaining.
In the installation base plate of control part 40, ratio determination section 43 calculates installation ratio (step S13) according to electronic component grade ratio and installation base plate information.What is called is installed ratio, refers to the grade ratio of the electronic component being installed in installation base plate.
The region determination section 44 of control part 40 determines according to ratio and installation base plate information are installed the region (step S14) that the electronic component 100 of each grade is mounted.
The wafer band that wafer band is remained on to electronic component holding table keeps operation corresponding to step S1, and a plurality of electronic components that on above-mentioned wafer band, grade is different are set to wafer-like.
The electronic component information that the positional information of electronic component on wafer band in electronic component holding table and the class information of electronic component form is stored in the electronic component information storage operation of electronic component information storage part corresponding to step S10.
The installation base plate information that the quantity of the installation site in substrate and necessity is formed is stored in the installation base plate information storage operation of installation base plate information storage part corresponding to step S12.
According to electronic component information, ask for the electronic component grade ratio of each grade in the above-mentioned electronic component on wafer band, and according to electronic component grade ratio and installation base plate information, the interior ratio of installation base plate that determines the installation ratio of each grade in substrate determines that operation is corresponding to step S11, S13.
According to installing, ratio and electronic component information are each one or more takes out the electronic component on wafer band, and the control operation that the state mixing in a plurality of grades is transferred installation to the assigned position in substrate is corresponding with step S4-7.
Fig. 6 is the flow chart that shows the picking action flow process of present embodiment.Next the picking action (the step S5 of Fig. 4) of the electronic component 100 that the portion of picking up 10 of electronic element installation device 1 carries out is described with reference to the flow chart of Fig. 6.
First, control part 40 is set as standard electronic element by the electronic component 100 that starts most to carry out picking action.Camera 19 is taken the image of this standard electronic element, and image information is sent to control part 40.Control part 40 is again set coordinate according to the image information sending in standard electronic element, thereby generates positional information (step S101).
The positional information of the standard electronic element that control part 40 use obtain again, upgrades the positional information (step S103) of the standard electronic element of storage.
Then, control part 40 makes 12 actions of electronic component holding table actuator according to the positional information after the renewal of standard electronic element, thereby electronic component holding table 11 is moved, so that standard electronic element moves to take-off location Pu(step S104).
Meanwhile, or before and after it, thereby making an actuator 32 actions make to transfer 30, moves control part 40, so that the adsorption mouth 31 of stick electronic components 100 does not move to take-off location Pu(step S105).
Then, control part 40 makes adsorption mouth 31 adsorption criteria electronic components, thereby carries out pick up (the step S106) of electronic component 100.
Particularly, control part 40 drives and picks up motor 15, thereby make to pick up hand hammer 13, presses down adsorption mouth 31.Meanwhile, control part 40 drives praises motor 18, thereby make to praise pin 16, praises electronic component 100.
Then, if there is the electronic component 100(step S107:Yes that can pick up), and there is the not adsorbable adsorption mouth 31(step S108:Yes of stick electronic components 100), carry out picking up of next electronic component 100.
Correction suitable application region shows take the prescribed limit that the position coordinates of standard electronic element is starting point.In such correction suitable application region, about each electronic component 100, can think that the initial detection (that is, the step S10 of Fig. 5) of position of electronic component 100 and the position deviation that detects again generation between (that is, the step S101 of Fig. 6) of the position of standard electronic element is same.
The flexible principal element that becomes the position deviation of electronic component 100 of the wafer band 200 extending is identical in the extent of deviation of position that approaches the electronic component 100 in scope to a certain extent.
After carrying out the picking up of standard electronic element, if picked electronic component is present in correction suitable application region, can think that the deviation of position of electronic component is identical with the extent of deviation of the position of standard electronic element.Therefore,, even not to this electronic component detection coordinates obtain positional information again, by using the correction of standard electronic element, also can calculate the positional information after picked electronic component deviation next time.
In addition, for stipulating to revise the change that suitable application region, prescribed limit centered by standard electronic element can be suitable.For example, can suitably change according to the retractility etc. of wafer band 200 of principal element that becomes the position deviation of electronic component 100.
Particularly, for the positional information of this electronic component 100 of storage, will use positional information after the position correction amount of standard electronic element as revised positional information.
Then, make the not next adsorption mouth 31 of stick electronic components 100 move to take-off location Pu(step S105), thus carry out picking up of next electronic component 100.
On the other hand, in the time of outside the correction suitable application region that standard electronic element is standard take in the position of next electronic component 100 (step S109:No), control part 40 is set as new standard electronic component by this electronic component 100.
According to structure described above, be maintained at and transfer 30 a plurality of adsorption mouth 31 and can adsorb continuously the absorption of the electronic component 100 being arranged on wafer band 200 and move.Thus, mobile once transfer 30, just can be by the disposable installation portion 20 that is transferred to of a plurality of electronic components 100.
Electronic element installation device 1 regulation is as the take-off location Pu that takes out the position of electronic component 100, thereby makes adsorption mouth 31 and electronic component 100 be transferred to one by one in order this take-off location Pu place.Thus, can within the shorter time, determine position, realize the reduction of pitch time.
In addition, by the handover of electronic component 100 and the handover of adsorption mouth 31, carry out simultaneously, more can reduce pitch time.In addition, also can suitably select the electronic component 100 of absorption according to the state of electronic component 100, shape and grade, thereby realize the classification of electronic component 100.
Fig. 7 is the flow chart that shows the installation action flow process of present embodiment.The installation action (the step S7 of Fig. 4) of the electronic component 100 next being undertaken by the installation portion 20 of electronic element installation device 1 with reference to the flowchart text of Fig. 7.
Meanwhile, or before and after it, control part 40 makes an actuator 32 actions, moves, so that the adsorption mouth 31 of stick electronic components 100 does not move to installation site PI(step S202 thereby make to transfer 30).
Then, control part 40 is removed absorption, to be adsorbed the electronic component 100 of mouth 31 absorption, is mounted to the electronic component installation site (step S203) on installation base plate 300.
Particularly, control part 40 drive installation motors 25, make to install hand hammer 23 and press down adsorption mouth 31.After the electronic component 100 of adsorption mouth 31 absorption that are pressed down contacts with installation base plate 300, control part 40 is removed the absorption of this adsorption mouth 31, thereby makes electronic component 100 be mounted to the electronic component installed position on installation base plate 300.
Secondly, control part 40 repeating step S201 are to a succession of action of step S203, until till transferring the electronic component of adsorption mouth 31 absorption that arrange in 30 and not existing (step S204:Yes).
In relevant adsorption mouth 31, whether have electronic component, complete the quantity of handover when consistent in the image that the quantity that should be transferred of appointment and camera 26 are taken, control part 40 can be thought in adsorption mouth 31 and not have electronic component.
In addition, also can electronic component 100 be mounted to installation base plate 300 until arrive the installation quantity of the electronic component 100 by installation base plate information setting or the installation quantity of each grade of the electronic component 100 that is set, move to next operation.
After all electronic components 100 of adsorption mouth 31 absorption are mounted to installation base plate 300, (step S204:Yes) control part 40 is taken the image of the electronic component 100 that is installed on installation base plate 300 by camera 26, thus the input of acceptance pattern picture.And according to the image information of input, check whether electronic component 100 is mounted, the arrangement precision of electronic component 100 and the outward appearance (step S205) of electronic component 100.After checking electronic component 100, control part 40 finishes installation action.
When next explanation utilizes light-emitting diode as electronic component with reference to Fig. 8 and Fig. 9, from wafer, bring to the installation of substrate.In addition, the handover of electronic element installation device 1 and installation can directly utilize said structure and action, therefore do not explain.
The example that Fig. 8 means the light-emitting diode on wafer band and is installed on the light-emitting diode (LED) module of substrate.At this, electronic component 100 is light-emitting diodes, and installation base plate 300 is ceramic substrate or glass substrate etc.As the substrate of light emitting diode module be can diode installed element substrate.
Light-emitting diode on wafer band 200 is due to factors such as creating conditions of the manufacturing process of light-emitting diode in front operation and quality is uneven.This quality uneven is light-emitting diode gas in chamber while manufacturing, the cleaning of light-emitting diode, inevitably uneven in uneven etc. the manufacture of the thickness of light-emitting diode.If do not consider, this quality is uneven, manufactures a product or module, and finished product will occur that quality is uneven, finally causes rate of finished products to reduce.
So, by pin check etc., check one by one light-emitting diode, thereby carry out grade separation according to check result.The wafer band of Fig. 8 has shown typical check result, and zero is A grade, ● be B grade, * be C grade.In fact there is dozens of grade, but with 3 grades, explain in description of the present embodiment.Grade becomes also applicable the present invention of dozens of.
The binding of the information of this check result and grade separation and positional information, with the index number of wafer band one by one or coding is together stored on server or the storage part of the testing fixture of front operation etc. in.Also can directly be stored in electronic component information storage part 41.
Electronic component information storage part 41 in the past testing fixture or the above-mentioned storage part of operation obtains electronic component information.On the other hand, by installation base plate input information installation base plate information storage part 42, this installation base plate information is relevant to necessary amount and the position of light-emitting diode that should be installed on substrate.
By ratio determination section 43 in installation base plate, calculate the grade ratio of the light-emitting diode on wafer band 200.The grade ratio of the light-emitting diode in Fig. 8 on wafer band 200 is A grade: B grade: C grade is 80:16:4.
Further, in installation base plate, ratio determination section 43 determines the grade ratio in installation base plate 300 according to the grade ratio on the wafer band 200 calculating.In the light emitting diode module being formed by 25 light-emitting diodes, by 20 A grades, 4 B grades, 1 C grade forms.Grade ratio using above grade ratio in installation base plate 300 also can be called installation ratio.
While carrying out above-mentioned installation, region determination section 44 is according to the installation region that each grade in ratio or installation base plate information decision installation base plate 300 is installed.In Fig. 8, region determination section 44 determines that the light-emitting diode that the light-emitting diode of the A grade that grades are high is arranged on neighboring area, C grade that grade is low is arranged on central area.
Using the grade ratio of the light-emitting diode on this wafer band 200 as ratio is installed, the light-emitting diode of each grade is mounted to installation base plate 300.
Illustrate class information and positional information in relevant light emitting diode module.The installation procedure of process to each grade of substrate in reference key diagram 8, as the completion status 3 of light emitting diode module.
The all light-emitting diodes that use in the module of light emitting diode module need not to be highest ranking.This is that the light quantity of module or the deviation of brightness are less because result, as long as therefore can produce the module in specification allowed band.
Thus, light emitting diode module has also been installed the light-emitting diode of the grade except highest ranking.But, according to the specification of this light emitting diode module, also there are some restrictions, such as end, because contrast former thereby light-emitting diode that calling hierarchy is higher, central part can be junior light-emitting diode etc.
In the light emitting diode module of the state 3 of Fig. 8, the light-emitting diode that is installed on end is used the A grade of highest ranking, Yue Wang center, and the grade of use is lower.That is to say, the C grade that grade is low is arranged on center, and what it was around installed is B grade, and the surrounding of B grade is surrounded by A grade, thereby has guaranteed brightness and light quantity that module is all.
In order to meet the desired specification of final products, the light-emitting diode of necessary grade is installed in position, and prepared multiple pattern of rows and columns as above.Therefore, for example,, when the installation base plate of installation portion 20 keeps platform 21 to maintain a plurality of substrate, for each substrate, can install and also can install with different mode with same pattern of rows and columns.
Thus, light-emitting diode picks up from wafer band 200 by transferring an adsorption mouth 31 of 30, and is mounted to substrate.
For example, in Fig. 8, for a plate base that is arranged on installation base plate and keeps platform 21, maximum light-emitting diode in the light-emitting diode that first should install, the light-emitting diode of A grade is mounted to substrate (state 1).
Secondly, from wafer band 200, pick up (state 2) and the light-emitting diode of B grade is installed, finally from wafer band 200, picking up and install the light-emitting diode (state 3) of C grade.
In addition, also can after installing the light-emitting diode of each grade, check the electronic component of installation.After installing each grade, carry out such inspection and can shorten pitch time.Also have, when from the wafer bands 200 such as A grade, more light-emitting diode starts to check, in inspection after A grade is mounted, check while ging wrong, stop the installation to this substrate, can prevent that thus less electronic component from being the waste of the light-emitting diode of B grade or C grade.
Also have, also can be in the inspection that finishes to carry out each substrate after the installation of substrate.This inspection is carried out according to the captured image of the camera 26 of installation portion 20.
In the captured image of camera 26, check each light-emitting diode whether be present in should position, should position and other light-emitting diodes between whether isolate and have predetermined distance, whether installed sideling or sidewards etc.
In addition, in the explanation of Fig. 8, although described from substrate the installation that the light-emitting diode of maximum A grades starts be installed, but the order of installing is as limit, light-emitting diode or the minimum light-emitting diode that also can grades maximum on the light-emitting diode, wafer band 200 of minimum grade be installed from substrate start to install.
In addition, region although determined periphery and central part according to the rank of grade, also can be decided according to the ratio of grade in determining in region.In addition, the ratio of grade only not, also the rank of reference grade decides region in the lump.Thus, the light-emitting diode on wafer band 200 can be mounted to substrate efficiently.
Fig. 9 means the light-emitting diode and an example that is installed on the light emitting diode module of substrate on wafer band 200.Next with reference to Fig. 9, light-emitting diode and other examples that are installed on the light emitting diode module of substrate on wafer band are described.
In Fig. 9, on wafer band 200, the grade ratio of light-emitting diode is A grade: B grade: C grade is 64:24:12.
Therefore, in the light emitting diode module being formed by 25 light-emitting diodes, by 16 A grades, 6 B grades, 3 C grades form.
When carrying out above installation, region determination section determines the installation region of each grade according to installation ratio or installation base plate information.In Fig. 9, region determination section according to class information with ratio be installed determined the light-emitting diode of higher grade A grade to be arranged on neighboring area, the light-emitting diode of junior B grade and C grade is arranged on to central area side by side.
Fig. 8 and Fig. 9 are illustrated for 3 grades, but applicable too during for dozens of grade.。In addition, also can be set as not using the electronic component of poor grade or the electronic component of the grade that usage rate is not few, can differentiate thus and not use bad electronic component.For example, while having 20 grades, can be set as not using the electronic component of poor grade.
Also have, also can be set as not using the electronic component that only has 1% on wafer band 200.By such setting, can realize that to reduce quality uneven, and the electronic component on wafer band 200 can be efficiently and be not wasted and use.
The structure of < execution mode and effect >
Electronic element installation device in present embodiment possesses: electronic component holding table, and it is used for keeping wafer band, and a plurality of light-emitting diodes that on this wafer band, grade is different are set to wafer-like; Electronic component information storage part, the electronic component information that the positional information of light-emitting diode on the above-mentioned wafer band of its storage in above-mentioned electronic component holding table and the class information of above-mentioned light-emitting diode form; Electronic component moves installation portion, and it takes out light-emitting diode and transfer from wafer band in each one or more modes and is mounted to substrate; Installation base plate information storage part, its storage installation site and installation base plate information of forming with necessary quantity in substrate; Ratio determination section in installation base plate, it asks for the electronic component grade ratio of each grade in light-emitting diode on wafer band according to electronic component information, and according to the installation ratio of the electronic component of each grade in electronic component grade ratio and installation base plate information decision substrate; Control part, it is controlled, and electronic component moves installation portion so that the state with electronic component information, light-emitting diode being mixed with a plurality of grades according to installation ratio is installed on the position of stipulating in aforesaid substrate.
By said structure, while directly installing to substrate from wafer band, the light-emitting diode on wafer band can be installed efficiently, thereby cut the waste.
In addition, because be to take the grade ratio of light-emitting diode of wafer band one side to install to substrate as standard, therefore can reduce final residue at the light-emitting diode of wafer band one side.
In addition, the region determination section that also possesses the installation region of the light-emitting diode that determines each grade.
Thus, the light-emitting diode of same grade can be arranged in the regulation region on substrate.
The electronic component mounting method of present embodiment possesses: wafer band keeps operation, and it is used for wafer band to remain on electronic component holding table, and a plurality of electronic components that on this wafer band, grade is different are set to wafer-like; Electronic component information storage operation, the electronic component information that it forms the class information of the positional information of the electronic component on wafer band in electronic component holding table and electronic component is stored in electronic component information storage part; Installation base plate information storage operation, it is stored in installation base plate storage part by installation site in substrate and the installation base plate information that forms with necessary quantity; In installation base plate, ratio determines operation, it asks on wafer band the electronic component grade ratio of each grade in electronic component according to electronic component information, and according to electronic component grade ratio and installation base plate information, determines the installation ratio of the electronic component of each grade in substrate; Control operation, it takes out the electronic component on above-mentioned wafer band according to ratio and electronic component information are installed in each one or more modes, then the state mixing with a plurality of grades moves the assigned position being installed in substrate.
By said structure, while directly installing to substrate from wafer band, the light-emitting diode on wafer band can be installed efficiently, thereby cut the waste.
< defines >
In the present invention, as an example, electronic component has been used light-emitting diode, still, such as being also semiconductor element, resistive element, triode etc., in addition, so long as component properties for the electronic component that can be categorized as a plurality of grades just.
Substrate in the present invention can be also the substrate such as ceramic substrate, glass substrate or printed base plate etc., so long as substrate that can installing electronic elements just.
In the present invention, so-called electronic component information, such as the class information that can be the information such as the positional information that comprises index on wafer band, each light-emitting diode, light quantity, wavelength.In addition, class information can be also with information such as light quantity, wavelength, to have determined in advance the class information of grade separation.Also have, electronic component information storage part is except being the storage part of electronic element installation device, it can also be the external memory of electronic element installation device, for example, the storage mediums such as the storage part of the probe examination device of front operation, the server being connected with this probe examination device, CD, memory, so long as the thing that can store just.
In the present invention, so-called installation base plate information can be the installation site information of each light-emitting diode in substrate and be mounted to the installation number of substrate or the shape of substrate.In addition, installation base plate information storage part is except being the storage part of electronic element installation device, it can also be the external memory of electronic element installation device, for example, the storage mediums such as the computer being connected with electronic element installation device, server, CD, memory, so long as the thing that can store just.
Symbol description
1 electronic element installation device
10 pick up portion
11 electronic component holding tables
12 electronic component holding table actuators
13 pick up hand hammer
Plectane cam on 14
15 pick up motor
16 praise pin
17 times plectane cams
18 praise motor
19 cameras
20 installation portions
21 installation base plates keep platform
22 installation base plates keep platform actuator
23 install hand hammer
24 plectane cams
25 mounted motors
26 cameras
30 transfer head
31 adsorption mouth
32 actuators
40 control parts
41 electronic component information storage parts
42 installation base plate information storage parts
Ratio determination section in 43 installation base plates
44 region determination sections
100 electronic components
200 wafer bands
300 installation base plates
Pu take-off location
PI installation site
Claims (4)
1. an electronic element installation device, is characterized in that, has:
Electronic component holding table, it is used for keeping wafer band, and a plurality of electronic components that on this wafer band, grade is different are set to wafer-like;
Electronic component information storage part, the electronic component information that the positional information of above-mentioned electronic component on the above-mentioned wafer band of its storage in above-mentioned electronic component holding table and the class information of above-mentioned electronic component form;
Electronic element transferring installation portion, it takes out above-mentioned electronic component and transfers from above-mentioned wafer band in each one or more modes and is mounted to substrate;
Installation base plate information storage part, the installation base plate information that its installation site in aforesaid substrate of storage and necessary quantity form;
Ratio determination section in installation base plate, it asks for the electronic component grade ratio of the electronic component of each grade in the above-mentioned electronic component on above-mentioned wafer band according to above-mentioned electronic component information, and according to the installation ratio of each grade electronic component in above-mentioned electronic component grade ratio and above-mentioned installation base plate information decision aforesaid substrate; And
Control part, it controls above-mentioned electronic element transferring installation portion so that the state with above-mentioned electronic component information, above-mentioned electronic component being mixed with a plurality of grades according to above-mentioned installation ratio is mounted to the assigned position in aforesaid substrate.
2. the electronic element installation device of recording as claims 1, is characterized in that, has the region determination section in the region that determines that the above-mentioned electronic component of above-mentioned each grade is mounted.
3. the electronic element installation device of recording as any one in claims 1 or claims 2, is characterized in that, above-mentioned electronic component is light-emitting diode, and aforesaid substrate is light emitting diode module.
4. an electronic component mounting method, is characterized in that, possesses:
Wafer band keeps operation, and it remains on wafer band on electronic component holding table, and a plurality of electronic components that on this wafer band, grade is different are set to wafer-like;
Electronic component information storage operation, its electronic component information that positional information of above-mentioned electronic component on above-mentioned wafer band in above-mentioned electronic component holding table and the class information of above-mentioned electronic component are formed is stored in electronic component information storage part;
Installation base plate information storage operation, its installation base plate information that quantity of the installation site in aforesaid substrate and necessity is formed is stored in installation base plate information storage part;
In installation base plate, ratio determines operation, it asks for the electronic component grade ratio of the electronic component of each grade in the above-mentioned electronic component on above-mentioned wafer band according to above-mentioned electronic component information, and according to the installation ratio of the electronic component of each grade in above-mentioned electronic component grade ratio and above-mentioned installation base plate information decision aforesaid substrate; And
Control operation, it takes out the above-mentioned electronic component on above-mentioned wafer band according to above-mentioned installation ratio and above-mentioned electronic component information in each one or more modes, then the state mixing with a plurality of grades handover is installed on the assigned position in aforesaid substrate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/050848 WO2013108367A1 (en) | 2012-01-17 | 2012-01-17 | Electronic component mounting device and electronic component mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103766016A true CN103766016A (en) | 2014-04-30 |
| CN103766016B CN103766016B (en) | 2017-02-15 |
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| CN201280041983.2A Active CN103766016B (en) | 2012-01-17 | 2012-01-17 | Electronic component mounting device and electronic component mounting method |
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| Country | Link |
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| JP (1) | JP5789680B2 (en) |
| CN (1) | CN103766016B (en) |
| WO (1) | WO2013108367A1 (en) |
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| CN108633244A (en) * | 2017-03-23 | 2018-10-09 | 松下知识产权经营株式会社 | component preparation method and component preparation device |
| CN109519978A (en) * | 2018-11-30 | 2019-03-26 | 王银仙 | Natural gas cooker positioning system |
| CN110622631A (en) * | 2017-05-23 | 2019-12-27 | 株式会社富士 | Mounting order determination device, mounting order inspection device, mounting order determination method, and mounting order inspection method |
| CN112470265A (en) * | 2018-07-23 | 2021-03-09 | 三星电子株式会社 | Electronic device including LED transmission device and control method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5975556B1 (en) * | 2015-12-11 | 2016-08-23 | 上野精機株式会社 | Transfer equipment |
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- 2012-01-17 JP JP2013554118A patent/JP5789680B2/en active Active
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- 2012-01-17 WO PCT/JP2012/050848 patent/WO2013108367A1/en active Application Filing
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| JP2007065414A (en) * | 2005-08-31 | 2007-03-15 | Sharp Corp | Method for manufacturing backlight |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108633244A (en) * | 2017-03-23 | 2018-10-09 | 松下知识产权经营株式会社 | component preparation method and component preparation device |
| CN108633244B (en) * | 2017-03-23 | 2020-07-28 | 松下知识产权经营株式会社 | Component preparation method and component preparation device |
| CN110622631A (en) * | 2017-05-23 | 2019-12-27 | 株式会社富士 | Mounting order determination device, mounting order inspection device, mounting order determination method, and mounting order inspection method |
| CN110622631B (en) * | 2017-05-23 | 2022-02-22 | 株式会社富士 | Mounting order determination device, mounting order inspection device, mounting order determination method, and mounting order inspection method |
| CN112470265A (en) * | 2018-07-23 | 2021-03-09 | 三星电子株式会社 | Electronic device including LED transmission device and control method thereof |
| CN112470265B (en) * | 2018-07-23 | 2024-02-13 | 三星电子株式会社 | Electronic device including LED transfer device and control method thereof |
| CN109519978A (en) * | 2018-11-30 | 2019-03-26 | 王银仙 | Natural gas cooker positioning system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103766016B (en) | 2017-02-15 |
| JPWO2013108367A1 (en) | 2015-05-11 |
| JP5789680B2 (en) | 2015-10-07 |
| WO2013108367A1 (en) | 2013-07-25 |
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