CN102484087B - Apparatus and method for transferring component - Google Patents

Apparatus and method for transferring component Download PDF

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Publication number
CN102484087B
CN102484087B CN201080038736.8A CN201080038736A CN102484087B CN 102484087 B CN102484087 B CN 102484087B CN 201080038736 A CN201080038736 A CN 201080038736A CN 102484087 B CN102484087 B CN 102484087B
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China
Prior art keywords
suction nozzle
chip
transfer
held
unit
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Expired - Fee Related
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CN201080038736.8A
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Chinese (zh)
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CN102484087A (en
Inventor
藤森昭一
清水寿治
青木秀宪
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Shinkawa Ltd
Pioneer Corp
PFA Corp
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Pioneer Corp
Pioneer FA Corp
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Publication of CN102484087A publication Critical patent/CN102484087A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Disclosed is a component transfer apparatus (1), which picks up a plurality of wafer-like chips (100) held by a holding unit (11, 200), and transfers the chips to a disposing unit (21, 300). The component transfer apparatus is provided with: the holding unit, which holds the chips; suction nozzles (31), which suck the chips; placing means (30, 32), which hold the suction nozzles, and move between the holding unit and the disposing unit; a nozzle moving means (32) which sequentially moves the suction nozzles one by one to predetermined pickup positions (Pu) by moving the placing means, said suction nozzles being held by the placing means; and nozzle control means (13, 14, 15) which, at the pickup position, control one of the suction nozzles to suck one of the chips held by the holding unit. The placing means move to the disposing unit after suction to be performed by each suction nozzle is completed.

Description

Component transfer apparatus and method
Technical field
The present invention relates to the electronic unit such as pick-up chip and be arranged in the technical field of the component transfer apparatus of transferring destination.
Background technology
As the known chip part that picks up the wafer-shaped of cutting apart by cutting machine of this device, and transferring the device of destination according to hierarchical arrangement.Existing component transfer apparatus, from the upside pick-up chip, and one by one pick up the handover chip from the action of downside jack-up by the suction nozzle that is connected with vacuum pump.
But, in order to use the very many said chip parts of a wafer manufacture, require the component transfer apparatus for transferring chip part to transfer at short notice many chips.For example, in order to shorten the pitch time of transferring operation, requirement can be transferred the structure of a plurality of chips simultaneously, and is studied.
Illustrated that in following prior art document utilizing a plurality of suction nozzles that are the configuration of row shape, every row integrally to adsorb chip is transferred to the structure of transferring destination.In this structure, when the absorption chip, utilize the chip of jack-up pin from the suitable grade of downside jack-up, to picking up the row of assisting and distinguishing the chip that will pick up.
In addition, illustrated possess a plurality of suction nozzles and can be individually by the position adjustments of each suction nozzle to the structure that can suitably adsorb the position of chip.
The prior art document
Patent documentation
Patent documentation 1: No. 3712695, Japan Patent
Patent documentation 2: No. 3719182, Japan Patent
Summary of the invention
The problem that invention will solve
In component transfer apparatus, in order to transfer at short notice a plurality of chips, require to shorten as much as possible the pitch time of the various operations of transferring.
For example, developed and used a plurality of suction nozzles in order to shorten pitch time, the structure of simultaneously picking up a plurality of chips.But, in prior art document record described above is the structure of row shape arrangement suction nozzle like that, can not tackle the situations such as chip position skew, sometimes can not suitably pick up.In addition, if the mechanism that adjusts separately respectively a plurality of suction nozzles position is set, there is apparatus structure and become complicated, the technical problem that the treating capacity of device also becomes complicated.
For example, the wafer after cutting enters the operation of picking up that pasting boards elongation by making to maintain wafer is divided into each chip part and utilizes head with suction nozzle to be picked up.Now, through after a while, because pasting boards is flexible, the position of each chip part can change.
In above-mentioned prior art document, illustrated and detected together the position of the chip part on pasting boards and start to pick up operation, and then detected the structure that will take out the positional information before each chip part.In the method, exist whole chips must respectively detect position 2 times, and the technical problem that pitch time extends.In addition, the whole chip parts that adsorbed by a plurality of suction nozzles respectively must all carry out position probing, the time lengthening that position probing is required.
For example, require the arrangement state whether correct, chip to being arranged in the chip of transferring destination to be checked.In existing structure, the chip photographic images to arranging, checked by image recognition.Now, according to the ordered state difference of chip, sometimes in order to carry out suitable inspection, often need a plurality of images, take required time lengthening.In addition, because need to carry out individually image recognition to a plurality of images, so can make the beat time lengthening.
The present invention proposes in view of example existing issue described above, and its purpose is to provide suitably to picking up and transfer chip part and can shortening component transfer apparatus and the method for the pitch time of operational sequence.
For the means of dealing with problems
In order to address the above problem, component transfer apparatus of the present invention, the chip that is held in a plurality of wafer-shapeds of maintaining part is taken out and is transferred to configuration section, possess: maintaining part, keep described chip, suction nozzle, adsorb described chip, the transfer unit, maintain described a plurality of suction nozzle, between described maintaining part and described configuration section, move, the suction nozzle mobile unit, by making described transfer cell moving, the described a plurality of suction nozzles that are held in described transfer unit are moved to the take-off location of regulation one by one sequentially, and suction nozzle control unit, at described take-off location, a suction nozzle in described a plurality of suction nozzle is adsorbed a chip in the described a plurality of chips that are held in described maintaining part, described transfer unit, after the absorption separately of described a plurality of suction nozzles is through with, moves to described configuration section.
In order to address the above problem, component transfer method of the present invention, in taking out and be transferred to the component transfer apparatus of configuration section, the chip of a plurality of wafer-shapeds that will be held in maintaining part carries out, comprise: the transfer unit that the suction nozzle to the described chip of a plurality of absorption is kept mobile transfer operation between maintaining part and described configuration section, by making described transfer cell moving, the described a plurality of suction nozzles that are held in described transfer unit are sequentially moved to one by one to the suction nozzle mobile process of the take-off location of regulation, and at described take-off location, the suction nozzle that a suction nozzle in described a plurality of suction nozzle is adsorbed a plurality of described chip that is held in described maintaining part is controlled operation, in described transfer operation, after at described a plurality of suction nozzles, absorption separately finishes, by described transfer cell moving to described configuration section.
Effect of the present invention and other advantages can be clear and definite according to the execution mode the following describes.
The accompanying drawing explanation
Fig. 1 means the block diagram of formation of the transfer device of the present embodiment.
Fig. 2 means the position relationship of each several part of transfer device and the figure of direction of action.
Fig. 3 means by the figure of the mode of transfer device pick-up chip.
The chart of the position relationship of each several part when Fig. 4 means pick-up chip.
Fig. 5 means the flow chart of motion flow of the transfer device of the present embodiment.
Fig. 6 means the flow chart of the picking action flow process of the present embodiment.
Fig. 7 means the figure of mode of the position correction of the chip in picking action.
Fig. 8 means the flow chart of the placement motion flow of the present embodiment.
The figure of the relation between the allocation position of chip when Fig. 9 means the placement action and the inspection position of chip.
The figure of the relation between the allocation position of chip when Figure 10 means the placement action and the inspection position of chip.
Figure 11 means the block diagram of formation of the variation of transfer device.
Figure 12 means the position relationship of each several part of variation of transfer device and the figure of direction of action.
Figure 13 means the position relationship of each several part of variation of transfer device and the figure of direction of action.
Figure 14 means the position relationship of each several part of variation of transfer device and the figure of direction of action.
Figure 15 means the flow chart of motion flow of the variation of transfer device.
Embodiment
The execution mode of component transfer apparatus of the present invention is the component transfer apparatus that a kind of chip that will be held in a plurality of wafer-shapeds of maintaining part took out and be transferred to configuration section, possess: maintaining part, keep described chip, suction nozzle, adsorb described chip, the transfer unit, maintain described a plurality of suction nozzle, between described maintaining part and described configuration section, move, the suction nozzle mobile unit, by making described transfer cell moving, the described a plurality of suction nozzles that are held in described transfer unit are sequentially moved to the take-off location of regulation one by one, and suction nozzle control unit, at described take-off location, a suction nozzle in described a plurality of suction nozzle is adsorbed a chip in the described a plurality of chips that are held in described maintaining part, described transfer unit after absorption separately finishes at described a plurality of suction nozzles, moves to described configuration section.
According to the execution mode of component transfer apparatus of the present invention, the chip that is held in the divided a plurality of wafer-shapeds on maintaining part is transferred to configuration section.
Maintaining part is for example for stickup being maintained to the member that the pasting boards of a plurality of chips is kept, such as the ring that can keep this pasting boards under the state for having extended at this pasting boards etc.With respect to such maintaining part, on the plane that keeps face as chip, on (in other words, the XY plane), in the position of the predetermined distance that is isolated from each other, maintain a plurality of chips.
Configuration section is the member that maintains pasting boards same with maintaining part.The pasting boards that is held in configuration section has the chip configuration face, and this chip configuration face keeps configuring chip on face that face is identical for chip on the pasting boards with being held in maintaining part.
The transfer unit is keep chip and can move to the member of configuration section from maintaining part, maintains a plurality of for keeping the suction nozzle of chip.Suction nozzle is the cylindric suction nozzle be connected with the decompressor such as vacuum pump, by adsorbing to keep being connected to the chip of cylinder end (preferably bottom).The transfer unit, relative with isolation predetermined distance between the end of the absorption chip of each suction nozzle and chip maintenance face, and can be along with chip, keeping the mobile mode of direction (in other words, Z direction) that face is vertical keep each suction nozzle.
The suction nozzle mobile unit is the actuator that the transfer unit is moved along directions X and Y-direction.The suction nozzle mobile unit, along with the movement of transfer unit, makes the suction nozzle that is held in this transfer unit move along directions X and Y-direction, and the suction nozzle of expectation is positioned to take-off location.
The suction nozzle control unit is connected on chip and adsorbs chip by the end by suction nozzle at take-off location.
Such take-off location is the position of implementing the taking-up action of chip in component transfer apparatus, and specifically, aim is a certain position that means to take in the component transfer apparatus directions X that is benchmark and the assigned position on Y-direction.Thereby, in the time will adsorbing chip, chip remains on take-off location, suction nozzle remains on isolates the position of predetermined distance in Z side with this chip, but is based on above-mentioned aim, and the position of suction nozzle is also referred to as take-off location.
According to above-mentioned structure, the chip that is held in maintaining part pick up operation, at first, the 1st suction nozzle be held in a plurality of suction nozzles of transfer unit moves to take-off location.Then, the 1st suction nozzle, by the action of suction nozzle control unit, is adsorbed the chip that is held in take-off location.Then, the suction nozzle mobile unit makes the transfer cell moving, and the 2nd suction nozzle in a plurality of suction nozzles moves to take-off location.In addition, now, preferably by the action such as chip mobile unit described later etc., the chip that the next one on maintaining part will be removed moves to take-off location.Then, the 2nd suction nozzle remains on the chip of take-off location by the action absorption of suction nozzle control unit.Then, the 3rd suction nozzle, the 4th suction nozzle and each suction nozzle of being held in the transfer unit carry out same processing repeatedly.
The transfer unit, after kept suction nozzle has adsorbed chip respectively, moves to configuration section.In addition, the actuator class of supplying with the power for making this transfer cell moving can be formed to the structure identical with the actuator of above-mentioned suction nozzle mobile unit.Now, preferably utilize the suction nozzle mobile unit the transfer unit shifting axle and by the transfer cell moving shifting axle during to configuration section on same single shaft.If form like this, can make the structural change of actuator simple, useful aspect the cost of apparatus structure etc.
According to structure described above, carry out continuously the absorption action of chip by a plurality of suction nozzles that are held in the transfer unit, thereby a plurality of chips can be moved to configuration section together.Therefore, with the existing apparatus of being transferred one by one, compare, can significantly shorten pitch time.
In the present embodiment, determine the take-off location that is taken out the chip action, sequentially mobile suction nozzle positions one by one.Therefore, with in the prior art document, illustrate in locate a plurality of suction nozzles structure compare, can within the shorter time, position, and relatively shorten pitch time.In addition, can realize with fairly simple apparatus structure, so useful aspect the cost when device causes.
In a mode of the execution mode of component transfer apparatus of the present invention, also possesses the chip mobile unit, this chip mobile unit is by described maintaining part is moved, and the chip be held in described a plurality of chips of described maintaining part is moved to described take-off location.
According to this mode, by the action of chip mobile unit, the chip that the next one on maintaining part will be removed moves to take-off location.The chip mobile unit, such as by controls of control device arbitrarily such as CPU, determine the next chip that will be removed, so that this chip arrives the mode of take-off location, maintaining part moved.Specifically, the chip mobile unit is set coordinate for each chip on maintaining part, so that the coordinate of the chip of expectation moves maintaining part with the mode that the coordinate of the take-off location of setting separately becomes identical.
By such formation, regardless of the shape of for example transfer unit, the hold mode of chip, can both make the chip of suction nozzle absorption expectation.In addition, because can realize with fairly simple apparatus structure, so useful aspect the cost when device is manufactured etc.
In addition, preferably the movement of this maintaining part is synchronously carried out with the movement of the transfer unit undertaken by the suction nozzle mobile unit.By such formation, make suction nozzle move to the action of take-off location and make chip move to parallel the carrying out of action of take-off location, thereby can shorten pitch time.
In addition, the chip mobile unit can be the structure that classification arbitrarily determines the next chip that will be removed according to the quality that is held in the chip of maintaining part, classification etc.By such formation, can to configuration section, transfer according to the classification of chip.Therefore, for example, in the situation that the mass formation difference of chip, different types of chip mixes is useful.
A plurality of suction nozzles that are the configuration of row shape of putting down in writing in the prior art document by above-mentioned adsorb in the structure of the chip that is equally the configuration of row shape together, in the situation that chip quality produces difference as described above, only adsorb suitable chip.Therefore, sometimes can not pass through a picking action, make to be held in whole suction nozzle absorption chips of head, may affect the transfer efficiency for the chips such as pitch time of chip transfer.The reduction of transfer efficiency is especially in the situation that the quality judgment standard of the large situation of chip deviation and chip is strict significantly.
On the other hand, in making a plurality of suction nozzles relatively chip carry out the structure of prior art of contraposition respectively, according to the mobile allowed band of arm that each suction nozzle is connected in to head etc., the scope (the chip position scope that in other words, can adsorb) that suction nozzle can contraposition is limited.Therefore, the mass discrepancy of the chip in the scope that can be adsorbed according to each suction nozzle, may produce same technical problem.
On the other hand, according to the manner, one by one chip is moved to take-off location and adsorb this chip, thereby, regardless of the position that keeps chip, can both adsorb the chip of expectation.Therefore, can quality or classification as requested adsorb chip.And, because be as described above suction nozzle to be moved to the structure that take-off location adsorbs chip one by one, so carry out transfer after can all having adsorbed chip at a plurality of suction nozzles by being held in the transfer unit.Therefore, can realize good transfer efficiency.
In other modes of the execution mode of component transfer apparatus of the present invention, described transfer unit possesses described a plurality of suction nozzle application of forces so that the application of force unit that described a plurality of suction nozzle separates from a plurality of described chip that is held in described maintaining part, and described suction nozzle control unit is pressed suction nozzle in described a plurality of suction nozzle so that a suction nozzle in described a plurality of suction nozzle is connected to a chip in described a plurality of chip and is adsorbed.
According to this mode, the transfer unit possesses and at the position that keeps suction nozzle, suction nozzle is kept the application of force unit such as spring mechanism of direction (for example, the upper direction) application of force of face to the chip that leaves maintaining part.
The suction nozzle control unit keeps face direction (for example, lower direction) to press suction nozzle at take-off location to chip.The pressing force of this suction nozzle control unit is set to such an extent that be greater than the active force of application of force unit, overcomes active force and presses suction nozzle downwards.The suction nozzle be depressed like this is connected on chip, is adsorbed.Then, if the suction nozzle control unit is removed the pressed state of suction nozzle, suction nozzle is biased unit and presses, and with absorption, has the state of chip to leave chip and keeps face.Thus, chip is peeled off from the pasting boards that is held in maintaining part, realizes pick-up chip.
By such formation, can, with fairly simple structure, from the members such as pasting boards that keep chip, take out chip.
In addition, preferably the suction nozzle control unit is to press the structure of suction nozzle at take-off location, so the position that can press at this is fixed with respect to component transfer apparatus.
In addition, the structure of a suction nozzle in described a plurality of suction nozzle is pressed in the end that described suction nozzle control unit is the front end by being arranged at arm member, and wherein, this arm member moves by the driving of rotating cam.
By such formation, can press suction nozzle and releasing is pressed with fairly simple structure.
In addition, described suction nozzle control unit can be the structure that possesses the end of the bearing shape of pressing a suction nozzle in described a plurality of suction nozzle.
By such formation, during a suction nozzle in pressing a plurality of suction nozzles that are held in the transfer unit, even the end of the end of this suction nozzle and suction nozzle control unit in the situation that the position of directions X or Y-direction has produced skew, can prevent from pressing other adjacent suction nozzles reliably.This especially is being held in space between a plurality of suction nozzles of transfer unit hour effectively.
In other modes of the execution mode of component transfer apparatus of the present invention, described transfer unit is so that the mode that described a plurality of suction nozzle is configured to row along the shifting axle between described maintaining part and described configuration section keeps described a plurality of suction nozzle.
According to this mode, the transfer unit becomes the movement on same single shaft in the movement between maintaining part and configuration section and the movement for the transfer unit that suction nozzle is positioned to take-off location undertaken by the suction nozzle control unit.Therefore, can by same single shaft actuator etc. realize the movement of transfer unit between maintaining part and configuration section and by the suction nozzle control unit, undertaken for suction nozzle being positioned to the transfer of take-off location.
By such formation, can make apparatus structure simple, useful aspect the cost when device is manufactured etc.
In other modes of the execution mode of component transfer apparatus of the present invention, also there is the unit of pressing, this press in a plurality of described chip that unit will be held in described maintaining part, to by a chip of a suction nozzle absorption in described a plurality of suction nozzles, to this suction nozzle direction, be pressed at described take-off location.
According to this mode, pressing unit is the member with the needle-like end that can move along the Z direction at take-off location, at suction nozzle, is connected on chip while being adsorbed, and a side direction suction nozzle direction contrary from the side with suction nozzle institute butt pressed this chip.
In the situation that form like this, chip, when being adsorbed, is subject to the power of the active force generation of suction nozzle, and the member that also is pressed on same direction is pressed.Therefore, can peel off, take out from pasting boards more reliably paste the chip remained on pasting boards in maintaining part.
In addition, preferably pressing unit is to press the structure of chip at take-off location, at this, can carry out the position that this is pressed, and with respect to component transfer apparatus, fixes.
In other modes of the execution mode of component transfer apparatus of the present invention, also there is the dispensing unit in described configuration section in a plurality of described chip configuration that will be adsorbed by described suction nozzle of placement location of regulation, described suction nozzle mobile unit by making described transfer cell moving, one by one sequentially moves to described placement location by the described a plurality of suction nozzles that are held in described transfer unit in described configuration section.
According to this mode, in suction nozzle absorption, there is the transfer unit that moves to configuration section under the state of chip further to be moved by the action of suction nozzle mobile unit.By this, move, the suction nozzle that the suction nozzle mobile unit will be held in the expectation of transfer unit is positioned at placement location.
Dispensing unit is connected on configuration section by the chip that will be adsorbed by suction nozzle at placement location, and the adsorbed state of simultaneously removing suction nozzle carrys out configuring chip.
At this, said placement location is the position of configuring chip in component transfer apparatus, specifically, same with the section of picking up, and its aim is a certain position that means to take in the component transfer apparatus directions X that is benchmark and the assigned position on Y-direction.Thereby, when wanting configuring chip, the allocation position of the chip in configuration section and the chip adsorbed by suction nozzle are present in placement location identical on the XY plane, be held in the position of isolation predetermined distance on the Z direction.
According to structure described above, carry out continuously the action of configuration of chip by a plurality of suction nozzles that are held in the transfer unit, thereby a plurality of chips can be disposed to configuration section together.Therefore, with the existing apparatus of being transferred one by one, compare, can significantly shorten pitch time.
In this mode, determine the placement location that chip is configured, by sequentially mobile suction nozzle one by one, move to position.Therefore, with locate the prior art document simultaneously in the structure simultaneously positioned for a plurality of suction nozzles that illustrates compare, can within the shorter time, position, thereby can relatively shorten pitch time.In addition, because be to realize with fairly simple apparatus structure, so useful aspect the cost when device is manufactured etc.
In addition, can be the structure that also there is the configuration section mobile unit, this configuration section mobile unit, by described configuration section is moved, sequentially moves to described placement location one by one by the position that should configure a chip in described a plurality of chip in described configuration section.
According to this mode, by the action of configuration section mobile unit, the allocation position of the next chip of the configuration on configuration section moves to placement location.The configuration section mobile unit, such as by controls of control device arbitrarily such as CPU, determines the allocation position of the next chip of configuration, and in the mode of this allocation position arrival placement location, configuration section is moved.Specifically, the configuration section mobile unit is set coordinate on configuration section, and so that the coordinate of the allocation position of expectation moves configuration section with the mode that the coordinate of the placement location of setting in addition becomes identical.
By such formation, the allocation position configuring chip of expectation that can be on configuration section.In addition, because can realize with fairly simple apparatus structure, so useful aspect the cost when device is manufactured etc.
In addition, preferably the movement of this configuration section is synchronously implemented with the movement of the transfer unit undertaken by the suction nozzle mobile unit.By such formation, the action that makes suction nozzle and chip move to the action of placement location and to make configuration section move to placement location is implemented concurrently, thereby can be shortened pitch time.
In addition, the configuration section mobile unit is that the classification arbitrarily such as quality according to the chip adsorbed by suction nozzle, classification determines the next structure of wanting the configuration section of configuring chip.By such formation, can be configured according to the classification of chip.Therefore, for example, in the situation that the mass formation difference of chip and mix and have different types of chip useful.
On the other hand, according to the disclosed structure of prior art document, the same reason of processing during due to the pick-up chip with above-mentioned, the position that sometimes not necessarily chip configuration can expected.Therefore, being difficult to change allocation position by the quality according to chip, kind is sorted to chip.
On the other hand, according to the manner, one by one chip is moved to placement location, implements the configuration of this chip, thus quality that can be as requested or classification by chip configuration the position in expectation.
In the other mode of the execution mode of component transfer apparatus of the present invention, possess between described maintaining part and described configuration section, the 1st transfer unit and these two described transfer unit, the 2nd transfer unit of on the path be parallel to each other, moving, in described maintaining part, described suction nozzle control unit makes to be held in during the described suction nozzle of described the 1st transfer unit adsorbed a plurality of described chip that is held in described maintaining part, in described configuration section, described dispensing unit makes to be held in a plurality of described chip configuration of described suction nozzle absorption of described the 2nd transfer unit in described configuration section, in described configuration section, described dispensing unit makes to be held in a plurality of described chip configuration of described suction nozzle absorption of described the 1st transfer unit during described configuration section, in described maintaining part, described suction nozzle control unit makes the described suction nozzle that is held in described the 2nd transfer unit be adsorbed a plurality of described chip that is held in described maintaining part.
According to this mode, can make suction nozzle by being held in the 1st transfer unit take out picking up operation and the chip configuration of the suction nozzle absorption by being held in the 2nd transfer unit being carried out the placement operation of configuration section is parallel of chip on maintaining part.
In addition, by be held in the 1st transfer unit suction nozzle absorption chip configuration the placement operation of configuration section and take out chip on maintaining part by the suction nozzle that is held in the 2nd transfer unit pick up that operation is parallel carries out.
In order to realize this action, preferably the moving direction between the 1st transfer unit and the 2nd transfer cell location Cheng Yu maintaining part and configuration section (for example, directions X) the upper isolation of vertical direction (for example, Y-direction) is so that the distance that the mode that can not contact is each other set.
In addition, preferably the 2nd transfer unit and the 1st movement of transfer unit from maintaining part to configuration section are synchronously moved to maintaining part from configuration section.Equally, preferably the 2nd transfer unit and the 1st movement of transfer unit from configuration section to maintaining part are synchronously moved to configuration section from maintaining part.
By such formation, can make to take out picking up operation and chip configuration being carried out the placement operation of configuration section is parallel of the chip be held in maintaining part, thereby can further shorten pitch time.
In addition, described suction nozzle control unit also can be configured to and possess: the 1st end, a suction nozzle in the described a plurality of suction nozzles that are held in described the 1st transfer unit is pressed, made a suction nozzle in these described a plurality of suction nozzles that are held in described the 1st transfer unit be connected to a chip in described a plurality of chip and be adsorbed; With the 2nd end, a suction nozzle in the described a plurality of suction nozzles that are held in described the 2nd transfer unit is pressed, and the chip that a suction nozzle in these described a plurality of suction nozzles that are held in described the 2nd transfer unit is connected in described a plurality of chip is adsorbed.
According to this mode, the suction nozzle control unit possesses the end that is divided into the 1st end and the 2nd end, and is configured in that the 1st end is pressed the suction nozzle that is held in the 1st transfer unit and position that the 2nd end is pressed the suction nozzle that is held in the 2nd transfer unit.
By such formation, can realize the action that the suction nozzle that is held in the 1st transfer unit is pressed and the action that the suction nozzle that is held in the 2nd transfer unit is pressed by the structure of a suction nozzle control unit, and without the movement of carrying out the suction nozzle control unit.In addition, can realize above-mentioned action by fairly simple apparatus structure, so useful aspect the cost when device is manufactured etc.
The execution mode of component transfer method of the present invention is a kind of component transfer method, it is the component transfer method that the chip that will be held in a plurality of wafer-shapeds of maintaining part took out and be transferred to the component transfer apparatus of configuration section, this component transfer method comprises: make the transfer operation that a plurality of transfer unit that kept for the suction nozzle that adsorbs described chip are moved between maintaining part and described configuration section, by making described transfer cell moving, the described a plurality of suction nozzles that are held in described transfer unit are sequentially moved to one by one to the suction nozzle mobile process of the take-off location of regulation, and at described take-off location, the suction nozzle that a suction nozzle in described a plurality of suction nozzle is adsorbed a plurality of described chip that is held in described maintaining part is controlled operation, in described transfer operation, after at described a plurality of suction nozzles, absorption separately finishes, by described transfer cell moving to described configuration section.
According to the execution mode of component transfer method of the present invention, can realize the various effects same with the execution mode of above-mentioned component transfer apparatus of the present invention.
In addition, in the execution mode of component transfer method of the present invention, can adopt the variety of way same with the variety of way of the execution mode of above-mentioned component transfer apparatus of the present invention.
As mentioned above, the execution mode of component transfer apparatus of the present invention possesses maintaining part, suction nozzle, transfer unit, suction nozzle mobile unit and suction nozzle control unit.The execution mode of component transfer method of the present invention possesses transfer operation, suction nozzle mobile process and suction nozzle and controls operation.Thereby, chip part can be suitably picked up and transfer, and the pitch time of operational sequence can be shortened.
Embodiment
Below, with reference to accompanying drawing, embodiments of the invention are described.
(1) basic structure
Illustrate referring to the drawings the structure as the transfer device 1 of the embodiment of component transfer apparatus of the present invention.
Fig. 1 means the schematic diagram of the structure of transfer device 1.In this Fig. 1, using left and right directions as directions X, will be from side nearby towards inboard direction as Y-direction, using above-below direction as the Z direction, carry out following explanation.
As shown in Figure 1, transfer device 1 has the section of picking up 10, placement section 20, transfer 30 and control part 40.Pick up the configuration isolator mutually on directions X of section 10 and placement section 20.
Pick up section 10 and be in transfer device 1 unit of pick-up chip 100 from the pasting boards 200 that maintains chip 100.Picking up section 10 possesses pick-up table 11, pick-up table actuator 12, picks up hammer 13, upper plectane cam 14, picks up motor 15, thimble 16, lower plectane cam 17, jack-up motor 18 and camera 19.
In the section of picking up 10, for by transfer 30 a take-off location Pu that pick up the chip 100 that is held in pasting boards 200, being set with a place.Take-off location Pu is intended to mean to pick up directions X in section 10 and the assigned position on Y-direction.
Pick-up table 11 is the members with the tabular surface that can keep pasting boards 200, and this pasting boards 200 maintains chip 100.Pick-up table 11 keeps the circumference of pasting boards 200, and by making to have pasting boards 200 elongations of retractility, thereby the chip 100 that makes to remain on pasting boards 200 is isolated predetermined distance mutually.
Pick-up table actuator 12 is by making pick-up table 11 (in other words, XY plane in) within keeping the face of chip 100 mobile and can make the unit of a plurality of actuators formations that pick-up table 11 rotates in this face.Pick-up table actuator 12, according to the control signal of supplying with from control part 40, moves pick-up table 11, thereby the chip 100 that will remain on the expectation on pasting boards 200 is transferred to take-off location Pu.
Picking up hammer 13 is the structures with end of the bearing shape above take-off location Pu is configured in pasting boards 200.The end of picking up the bearing shape of hammer 13 is connected in upper plectane cam 14 via arm.Upper plectane cam 14 is the discoideus cams that can rotate by the rotation of picking up motor 15.Pick up motor 15 and rotate according to the control signal of supplying with from control part 40, and make 14 rotations of plectane cam.The arm that picks up hammer 13 moves by the rotation of upper plectane cam 14, thereby the end of bearing shape moves back and forth along the Z direction.
Thimble 16 is the acicular textures below take-off location Pu is configured in pasting boards 200.Thimble 16 is connected in lower plectane cam 17 via arm, along with the rotation of lower plectane cam 17, along the Z direction, moves.By the rotation of lower plectane cam 17, thimble 16 is moved upward on the Z direction, thereupon the upper end in contact pasting boards 200 of thimble 16.Thimble 16, in the upper end of moving range, connects pasting boards 200, with chip 100, contacts, and jack-up chip 100.In addition, the mode that thimble 16 can jack-up be held in the chip 100 of take-off location Pu with the upper end of needle-like configures.Jack-up motor 18 makes 17 rotations of plectane cam according to the control signal of supplying with from control part 40.
Camera 19 forms and is configured to position to be adjusted to the chip 100 of the take-off location Pu on pasting boards 200 and remains on the state that peripheral chip 100 is taken in shooting areas.The image of the chip 100 of taking in camera 19 is sent to control part 40.
Placement section 20 is to be disposed at the position of configuration plate 300 by the chip 100 of suction nozzle 31 absorption in the section of picking up 10, possesses mounting table 21, mounting table actuator 22, placement hammer 23, plectane cam 24, places motor 25 and camera 26.In addition, in placement section, chip 100 configurations of adsorbing for the suction nozzle 31 that will be held in transfer 30 (in other words for placing) placement location Pl on configuration plate 300 is set with a place.
Placement location pl is intended to mean the position of the regulation of directions X in placement section 20 and Y-direction.In addition, placement location Pl is set in the position at directions X isolation predetermined distance with take-off location Pu.
Mounting table 21 is the members with the smooth face that can keep configuring plate 300, and this configuration plate 300 is for configuring chip 100.Configuration plate 300 is to have equally the member on the plate of adhibit quality with pasting boards 200.Mounting table actuator 22 is the actuators with the movable axis that can make mounting table 21 have the face direction (in other words, directions X and Y-direction) of chip 100 to move along configuration (in other words, placing).
A plurality of chips 100 that kept by the suction nozzle 31 of transfer 30 specified gap that is isolated from each other is configured in the configuration plate 300 be held on mounting table 21 (margin).Below, the position that each by configuration on plate 300 should configuring chip 100 is called the chip configuration position and describes.In addition, the chip configuration position is set as by a plurality of row and form rectangular that go on configuration plate 300.
The end of placing the bearing shape of hammer 23 is connected in arm, and is connected in plectane cam 24 via this arm.Plectane cam 24 can rotate by the driving of placing motor 25.Arm moves along with the rotation of plectane cam 24, and the end of placing the bearing shape of hammer 23 moves back and forth along the Z direction.Place motor 25 according to the control signal of supplying with from control part 40, make 24 rotations of plectane cam.
Camera 26 forms and is configured to and will be placed on the chip 100 of the placement location Pl on configuration plate 300 and the state of periphery income shooting area.The image of the configuration plate 300 of taking in camera 26 is sent to control part 40.
Transfer 30 maintains a plurality of suction nozzles cylindraceous 31, and under the action of an actuator 32, transfer 30 is moved between the section of picking up 10 and placement section 20, carries out the picking action of chip 100 and places action.The mounting table 21 of transfer 30 pick-up table with respect to the section of picking up 10 11 and placement section 20 is disposed at the top of Z direction.
Suction nozzle 31 is connected via decompressors (not shown) such as being arranged at air suction way (not shown) in transfer 30 and vacuum pump, and chip 100 or the releasing of adsorbing institute's butt according to the control signal of supplying with from control part 40 are adsorbed.
Actuator 32 is to make transfer 30 a single shaft actuator that move along directions X according to the control signal of supplying with from control part 40.Actuator 32 make transfer 30 along the straight lines that connect take-off location Pu and placement location Pl as the arrow of Fig. 1, between the section of picking up 10 and placement section 20, move.
Transfer 30 kept and the upper end that makes the lower end of suction nozzle 31 and chip 100 at Z direction isolation predetermined distance, and have to the Z direction top application of force suction nozzle 31 is fixed on to the spring mechanism of this holding position.
Further illustrate the position relationship of the each several part of transfer device 1 with reference to Fig. 2.The configuration of the pick-up table 11 of the section of picking up 10 when Fig. 2 means the shifting apparatus 1 of observing Fig. 1 from Z direction top, the mounting table 21 of placement section 20 and transfer 30 and the figure of direction of action.
As shown in Figure 2, transfer 30 is picked up in connection on the straight line of placement location Pl of the take-off location Pu of section 10 and placement section 20 and is maintained a plurality of suction nozzles 31 that form row, and a plurality of suction nozzle 31 specified gap that is isolated from each other.Thereby, in the section of picking up 10, the action by an actuator 32 makes transfer 30 move along directions X, the suction nozzle 31 that is held in transfer 30 is transferred to take-off location Pu one by one.On the other hand, in placement section 20, the action by an actuator 32 makes transfer 30 move along directions X, and the suction nozzle 31 that is held in transfer 30 is by one by one to being transferred to placement location Pl.
Returning to Fig. 1 goes on to say.Control part 40 is control CPU that the action of the each several part of the section of picking up 10, placement section 20 and transfer 30 is controlled, and with each several part, is electrically connected to, and by supplying with control signal etc., carrys out control action.
Control part 40 is by resolving the image of the chip 100 on the pasting boards 200 that for example camera 19 sends, to each chip 100 desired location coordinates.Control part 40 is moved pick-up table actuator 12 according to the position coordinates of the chip 100 of expectation, adjusts the position of pick-up table 11 so that this chip 100 arrives take-off location Pu.
In addition, control part 40 is the desired location coordinate on configuration plate 300, makes 22 actions of mounting table actuator adjust the position of mounting table 21, usings and as the chip configuration position, makes this chip configuration position arrive placement location Pl on the coordinate of expectation.
In addition, the image analysis result that control part 40 sends based on camera 26, check the quality that is configured in the chip 100 of configuration on plate 300, obtain positional information etc.
With reference to Fig. 3 and Fig. 4, illustrate that the suction nozzle 31 of transfer 30 picks up the action of the chip 100 on pasting boards 200 by absorption.Fig. 3 is the figure that is divided into the position relationship of state 1～state 4 record each several parts, and Fig. 4 means that the upper end of the lower end of picking up hammer 13 and thimble 16 changed along with the time and the chart of the situation of change of Z direction position.The action of the each several part the following describes is controlled and is implemented by control part 40.
In the picking action of chip 100, at first, pick-up table actuator 12 moves pick-up table 11, and the chip of expectation 100 is moved to take-off location Pu (on the axle meaned with chain-dotted line).Simultaneously or before and after it, an actuator 32 moves transfer 30, and the suction nozzle of expectation 31 is moved to take-off location Pu (state 1).Now, as shown in Figure 4, pick up the lower end of hammer 13 and the upper end of thimble 16 and be positioned at initial position separately.
Then, pick up motor 15 and make 14 rotations of plectane cam, make to pick up hammer 13 and move downwards.Pick up hammer 13 along with mobile and with the upper end in contact of suction nozzle 31 after, overcome upward the active force of the spring mechanism of suction nozzle 31 application of forces pressed to suction nozzle 31 downwards.The suction nozzle 31 be depressed, in the position of the lower end of picking up hammer 13 arrival movings range, is connected to chip 100, adsorbs chip 100.In addition, jack-up motor 18 makes lower plectane cam 17 rotations, makes thimble 16 move (state 2) towards chip 100.
Then, pick up motor 15 and make 14 rotations of plectane cam, make to pick up hammer 13 and be moved upward, thus the depressed state of releasing suction nozzle 31.Remove the application of force of the suction nozzle 31 of depressed state by spring mechanism, with absorption, had the state of chip 100 to be moved upward.Simultaneously, the upper end of thimble 16 connects pasting boards 200 jack-up chip 100 upward, thereby makes the lower end of chip 100 move (state 3) to the direction of peeling off from pasting boards 200.
As shown in Figure 4, pick up hammer 13 and thimble 16 and return to initial position separately, in lower end absorption, have the suction nozzle 31 of chip 100 also to return to the initial position of Z direction.Then, pick-up table actuator 12 moves pick-up table 11, and next chip 100 is moved to take-off location Pu.Simultaneously or before and after this, an actuator 32 moves transfer 30, and next suction nozzle 31 is moved to take-off location Pu (state 4).
Above, by the action of explanation, chip 100 is by suction nozzle 31 absorption of transfer 30.Carry out above-mentioned action by repeated multiple times, thereby a plurality of suction nozzles 31 that are held in transfer 30 adsorb chip 100 are arranged respectively.
In addition, implement the placement action in placement section 20 with same order.The following describes concrete order.In the placement action of chip 100, at first mounting table actuator 22 moves mounting table 21, and the chip configuration position of the expectation on configuration plate 300 is moved to placement location Pl.Simultaneously or before and after this, an actuator 32 moves transfer 30, has the suction nozzle 31 of chip 100 to move to placement location Pl absorption.Now, place hammer 23 in initial position.
Then, place motor 25 and make 24 rotations of plectane cam, make to place hammer 23 and move downwards.After placing the upper end in contact of hammer 23 along with mobile and suction nozzle 31, overcome upward the active force of the spring mechanism of suction nozzle 31 application of forces is pressed to suction nozzle 31 downwards.The chip 100 that the suction nozzle 31 be depressed adsorbs has arrived the position of the lower end of moving range at placement hammer 23, be connected to configuration plate 300.Now, control part 40 is removed the adsorbed state of the suction nozzle 31 that maintains this chip 100, thereby chip 100 is configured in the chip configuration position on configuration plate 300.Configuration plate 300 has adhibit quality, so chip 100 sticks on configuration plate 300 in the chip configuration position.
Then, place motor 25 and make 24 rotations of plectane cam, make to place hammer 23 and be moved upward, thus the depressed state of releasing suction nozzle 31.Removed the application of force of the suction nozzle 31 of depressed state by spring mechanism, be moved upward with the state that does not adsorb chip 100.
Return to initial position placing hammer 23, and, after the suction nozzle 31 that has completed chip 100 configurations also turns back to the initial position of Z direction, mounting table actuator 22 moves mounting table 21, and next chip configuration position is moved to placement location Pl.Simultaneously or before and after this, an actuator 32 moves transfer 30, has the suction nozzle 31 of chip 100 to move to placement location Pl next one absorption.
Above, by the action of explanation, by a transfer chip 100 that 30 handovers come, be configured on configuration plate 300.Carry out above-mentioned action by repeated multiple times, be held in the chip 100 that a plurality of suction nozzles 31 of transfer 30 adsorb respectively and be configured on configuration plate 300.
(2) action case
The action of transfer device 1 is described with reference to Fig. 5, and this Fig. 5 means the flow chart of the flow process of the picking action that comprises transfer device 1 and whole actions of placing action.
In transfer device 1, when starting to carry out a series of actions, the pasting boards 200 that keeps chip 100 is arranged on the pick-up table 11 of the section of picking up 10 (step S1).Simultaneously or before and after this, the configuration plate 300 of moving chip 100 is arranged on the mounting table 21 of placement section 20 (step S2).
Then, 19 pairs, the camera that picks up section 10 remains on whole chips 100 photographic images on pasting boards 200, and image information is sent to control part 40.The image information of control part 40 based on receiving, set coordinate to each chip 100 on pasting boards 200, and generate positional information (step S3).The positional information generated is stored in the memory in control part 40.
Then, control part 40 makes transfer 30 move (step S4) to the section of picking up 10, carries out picking action (step S5).By this picking action, the chip 100 remained on pasting boards 200 is adsorbed by transfer 30 an interior a plurality of suction nozzle 31 respectively.In addition, the picking action back describes in detail.
Then, control part 40 makes transfer 30 move (step S6) to placement section 20, carries out and places action (step S7).Place action by this, be disposed at configuration plate 300 by a transfer chip 100 that 30 interior a plurality of suction nozzles 31 adsorb respectively.In addition, placing the action back describes in detail.
Control part 40 repeatedly carries out step S4 to a series of actions of step S7 until whole chips 100 that should move on pasting boards 200 move to configuration plate 300 (step S8: be), then tenth skill.
(2-1) picking action
With reference to the flow chart of Fig. 6, the action of pick-up chip 100 of the section of picking up 10 of transfer device 1 is described.
At first, the chip 100 that control part 40 will will pick up for the first time is set as fiducial chip.Camera 19 is taken the image of this fiducial chip, and image information is sent to control part 40.The image information of control part 40 based on receiving set coordinate to fiducial chip again, and generates positional information (step S101).
(Fig. 5 that control part 40 is obtained more at first, step S3) whole positional information of the positional information of chips 100 and the fiducial chip obtained again, the position of detection reference chip with respect to initial (, detected in step S3) position has been offset how many, and calculated for revising the position correction amount (step S102) of skew.
The positional information of the fiducial chip that control part 40 application obtain again, upgraded (step S103) to the positional information of stored fiducial chip.
Then, the positional information after the renewal of control part 40 based on fiducial chip is moved pick-up table actuator 12, makes pick-up table 11 move fiducial chip to be moved to take-off location Pu (step S104).
Simultaneously or, before and after this, control part 40 makes an actuator 32 actions, makes transfer 30 suction nozzle 31 that move will not adsorb chip 100 move to take-off location Pu (step S105).
Then, control part 40 makes suction nozzle 31 absorption fiducial chips, carrys out pick-up chip 100 (step S106).Specifically, control part 40 makes to pick up motor 15 and is driven, and makes to pick up hammer 13 and depresses suction nozzle 31.Simultaneously, control part 40 is driven jack-up motor 18, makes thimble 16 jack-up chips 100.The suction nozzle 31 that chip 100 is depressed with picked hammer 13 contacts and is adsorbed, then is moved upward and, by the further jack-up of thimble 16, peels off from pasting boards 200 by suction nozzle 31, picked.
Then, in the situation that there is the chip 100 (step S107: be) that can pick up and there is the suction nozzle 31 (step S108: be) that does not adsorb chip 100 and can adsorb, pick up next chip 100.
Control part 40 is read stored positional information with regard to next chip 100, relatively the coordinate of the fiducial chip before the coordinate of this chip 100 and renewal (, the coordinate detected), judge that the position of this chip 100 is whether in the correction application region in step S3.
The scope of the regulation that the position coordinates of fiducial chip is starting point is intended to mean to take in the correction application region.In this correction application region, can think that (each chip 100 from detecting for the first time chip 100 positions, the step S3 of Fig. 5) to the position skew produced during the position that again detects fiducial chip (that is, the step S101 of Fig. 6), be the same.About the skew of the position of chip 100, the stretching for main cause of the pasting boards 200 of elongation, so long as the chip 100 near distance scope to a certain extent just thinks that the degree of position skew is identical.
Position relationship between fiducial chip and correction application region has been shown in Fig. 7 (a).After having picked up fiducial chip A, as long as chip 100B that will be picked in the correction application region, just thinks that the position skew of chip 100B equates with the position degrees of offset of fiducial chip A.Therefore, even for chip 100B detection coordinates again, do not obtain positional information, by the correction of application fiducial chip A, also can calculate the positional information after chip 100B is offset.
In addition, the regulation zone centered by fiducial chip of regulation correction application region can suitably be changed, such as can be according to the suitably changes such as retractility of the pasting boards 200 of the main cause of the position skew that becomes chip 100.
In the position of next chip 100, in the situation that take (step S109: be) in the correction application region that fiducial chip is benchmark, control part 40 is used the position correction amount of fiducial chips, revises the positional information (step S110) of this chip 100.Specifically, will to the position correction amount of the positional information application fiducial chip of this stored chip 100 revised and the positional information that forms as revised positional information.
The revised positional information of control part 40 based on next chip 100, moved pick-up table actuator 12, pick-up table 11 moved and this chip 100 is moved to take-off location Pu (step S111).Then, make the next suction nozzle 31 that does not adsorb chip 100 move to take-off location Pu (step S105), pick up this next one chip 100.
On the other hand, in the situation that the position of next chip 100 is positioned at, take (step S109: no) outside the correction application region that fiducial chip is benchmark, control part 40 is set as new fiducial chip by this chip 100.Then, control part 40, for new fiducial chip, is obtained positional information (step S101) by photographic images, calculates position correction amount (step S102), and upgrades positional information (step S103), the later picking action of execution step S104.
Specifically, in Fig. 7 (a), exemplified with the situation of pick-up chip 100C.Chip 100C because be positioned at be take outside the correction application region that fiducial chip A is benchmark, so can not think that the position skew of chip 100C is identical with the degree that the position of fiducial chip A is offset.Therefore, the coordinate of detection chip 100C, obtain positional information again.Therefore, as shown in Fig. 7 (b), control part 40 is set as new fiducial chip by chip 100C, upgrades positional information.Be positioned at and take the position skew of chip 100 of the correction application region that the fiducial chip C of new settings is benchmark, think identical with the degree of the position skew of fiducial chip C.
Control part 40 performs step S105 a series of actions to step S111 repeatedly, until there is no the chip 100 (step S107: no) that can pick up, or do not adsorb chip 100 and the suction nozzle 31 that can be adsorbed till (step S108: no).In the situation that there is no the chip 100 (step S107: no) that can pick up, or do not adsorb chip 100 and the situation of the suction nozzle 31 that can be adsorbed under (step S108: no), control part 40 finishes picking actions.
Above, according to the structure of explanation, a plurality of suction nozzles 31 that are held in transfer 30 can adsorb action to the chip 100 remained on pasting boards 200 continuously.Therefore, by transfer 30 once moves, a plurality of chips 100 can be transferred to placement section 20 together.Therefore, with the device in the past of transferring one by one, compare, can significantly shorten pitch time.
In transfer device 1, determine that the position of taking out chip 100 is take-off location Pu, suction nozzle 31 and chip 100 are transferred to this take-off location pu one by one according to priority.Therefore, can within the shorter time, position, shorten pitch time.In addition, transferred concurrently the action of moving and transferred suction nozzle 31 of chip 100, thereby can further be shortened pitch time.In addition, by the state according to chip 100, shape, the chip 100 that suitably selection will be adsorbed, thus can distinguish chip 100.
(2-2) place action
With reference to the flow chart of Fig. 8, the action of placement section 20 chip placements 100 of transfer device 1 is described.
Control part 40, based on predefined coordinate on mounting table 21 etc., is moved mounting table actuator 22, and the chip configuration position that mounting table 21 is moved will configure the expectation on plate 300 moves to placement location Pl (step S201).
Simultaneously or, before and after this, control part 40 is moved an actuator 32, makes transfer 30 suction nozzle 31 that move absorption is had to chip 100 move to placement location Pl (step S202).
Then, control part 40 is removed adsorbed state, and the chip 100 that will be adsorbed by suction nozzle 31 is configured in the chip configuration position (step S203) on configuration plate 300.Specifically, control part 40 is driven motor 205, and make to place hammer 23, depresses suction nozzle 31.After the chip 100 contact configuration plates 300 that adsorb at the suction nozzle 31 be depressed, control part 40 is removed the adsorbed state of this suction nozzle 31, and chip 100 is configured on configuration plate 300.
Then, control part 40 carries out step S201 a series of actions to step S203 repeatedly, until there is no the chip 100 (step S204: no) that can place.
After the whole chips 100 that adsorbed by suction nozzle 31 are configured on configuration plate 300 (step S204: be), control part 40 is taken the image of the chip 100 configured by camera 26, accept the input of image information.Then, the image information based on inputted, check and whether dispose the arrangement precision of chip 100, chip 100 and the outward appearance (step S208) of chip 100.After checking out chip 100, control part 40 finishes to place action.
Relation between the inspection of the chip 100 that the chip configuration position on configuration plate 300 is described and configures.Fig. 9 (a) means the chip configuration position of configuration on plate 300 and by once taking the figure that the zone of being taken by camera 26 is shooting area.
As shown in Fig. 9 (a), the chip configuration position isolates respectively predetermined distance on the XY direction, is configured to rectangular.The shooting area of camera 26 is for example the rectangular scope that comprises a plurality of chip configuration position.In the example shown in Fig. 9 (a), in 4 of directions Xs of the shooting area of camera 26 income, 3 of Y-directions, amount to 12 chips 100.
At this, consider that transfer 30 maintains the situation of 12 suction nozzles 31.In the transfer device 1 with this transfer 30, can and place action by a picking action 12 chips 100 are configured on configuration plate 300.
In addition, in the situation that will be as shown in the arrow in Fig. 9 (b) configuring chip 100, at 6 chips 100 of directions X configuration, at 2 chips 100 of Y-direction configuration.Now, next chip configuration position is because adjacent (in other words with previous chip configuration position, distance is the shortest), so from configuring amount of movement (in other words, the amount of movement of the mounting table 21) minimum of a chip 100 configuration plate 300 during next chip 100 to configuration.Therefore, it is also the shortest that configuration plate 300 moves the needed time, contributes to shorten pitch time.
But, in the situation that will be as shown in the arrow in Fig. 9 (b) configuring chip 100,12 chips 100 that configure can not be taken in the shooting area of camera 26.Therefore, in order to check chip 100, camera 26, as shown in Fig. 9 (b), makes to configure the image that plate 300 moves to take shooting area 1 and shooting area 2.Obtain like this in the situation of a plurality of images, can extend pitch time, increase the treating capacity for mobile configuration plate 300, thereby consider not preferred from the device action aspect.
Therefore, control part 40 is as shown in Fig. 9 (c), and with income in determining shooting area, the mode of whole chips 100 determines the collocation method of chip 100.Specifically, with 4 of directions X incomes, take in the mode of whole 12 chips 100 at the shooting area of the camera 26 of 3 chips 100 of Y-direction income, determine the position of wanting configuring chip 100 according to zigzag order (in other words, describing the mode of square wave) as shown in the arrow in Fig. 9 (c).
In more detail, configuring chip 100 in the following manner.At first, from an angle of rectangular shooting area, start configuring chip 100, along a limit of shooting area, at the position configuration chip 100 of every isolation predetermined distance.After chip 100 is configured in the other angle of shooting area, the vertical limit along the limit with above-mentioned, at the position configuration chip 100 of isolation predetermined distance.Then, at position configuration chip 100 parallel with first limit and every isolation predetermined distance in the opposite direction.In the situation that the chip configuration position arrives the limit of shooting area, along this limit at the position configuration chip 100 of isolation predetermined distance.Then, in the direction parallel with first limit, at the position configuration chip 100 of every isolation predetermined distance.By repeatedly carrying out above operative configuration chip 100.
By configuring chip 100 as shown in the arrow as in Fig. 9 (c), also can be as described above, make to configure plate 300 and move the required time and shorten, thereby contribute to shorten pitch time.In addition, while after whole chips 100 are configured, checking chip 100, can pass through 12 chips 100 that image inspection is whole, thereby can also shorten the pitch time for photographic images.
In addition, according to circumstances different, sometimes can not be by whole chips 100 incomes by once placing the action configuration in a shooting area.
For example, in the example of Figure 10 (a), illustrated in a shooting area on the income directions X that on 4, Y-direction, 3 amount to 12 chips 100, transfer 30 keeps 15 suction nozzles 31 on the other hand, by once placing the situation that action can configure 15 chips 100.Now, the position that control part 40 determines with above-mentioned zig-zag fashion configuring chip 100, take in whole chip 100 with the shooting area the least possible.
In addition, in above-mentioned example, illustrated from Y-direction (in other words, column direction) and started to place action, be configured to zigzag, and made the shooting area example mobile along directions X (in other words, line direction).Also can be not limited to this, and, as shown in Figure 10 (b), for start to place action from directions X (line direction), indention ground configuring chip 100, make the shooting area mode mobile along Y-direction (column direction).
By the position of such decision configuring chip 100, can reduce and take for the needed pitch time of the image that checks chip 100.According to above-mentioned structure, no matter how many, as long as can reduce the picture number of shooting, just can there is above-mentioned effect.
(3) variation
Structure with reference to Figure 11～Figure 14 explanation as the transfer device 1 ' of the variation of transfer device 1.
Figure 11～Figure 14 means the schematic diagram of the structure of transfer device 1 ', Figure 11 observes the figure of transfer device 1 ' from Y-direction, Figure 12 observes the figure of transfer device 1 ' from Z direction top, Figure 13 observes the figure of the section 10 ' of picking up of transfer device 1 ' from directions X, Figure 14 observes the figure of the placement section 20 ' of transfer device 1 ' from directions X.
As shown in figure 11, transfer device 1 ' has the section of picking up 10 ', placement section 20 ' and control part 40 ', and possesses transfer that structure and transfer device 1 possess 30 same a transfer 30a and a transfer 30b.A transfer 30a maintains a plurality of structures and the same suction nozzle 31a of suction nozzle 31, and a transfer 30b maintains a plurality of structures and the same suction nozzle 31b of suction nozzle 31.In addition, the actuator 32a that a transfer 30a can be same by structure and an actuator 32 moves along directions X, and the actuator 32b that a transfer 30b can be same by structure and an actuator 32 moves along directions X.As described above, in transfer device 1 ', transfer 30, suction nozzle 31, an actuator 32 respectively have two groups.
As shown in figure 12, a transfer 30a and a transfer 30b are disposed at the position at Y-direction isolation predetermined distance.
Transfer device 1 ' pick up section 10 ', be set with the 1st take-off location Pua of transfer 30a absorption chip 100 use and the 2nd take-off location Pub these 2 kinds of take-off location Pu of transfer 30b absorption chip 100 use.Equally, in the placement section 20 ' of transfer device 1 ', be set with the 1st placement location Pla of transfer 30a configuring chip 100 use and these 2 kinds of placement location Pl of the 2nd placement location Plb of transfer 30b configuring chip 100 use.
A transfer 30a picks up in connection on the straight line of placement location Pla of the take-off location Pua of section 10 ' and placement section 20 ' and maintains a plurality of suction nozzle 31a that form row, and a plurality of suction nozzle 31a each interval specified gap.In addition, the actuator 32a that a transfer 30a possesses, as shown in the arrow of Figure 12, make a transfer 30a move between the section of picking up 10 ' and placement section 20 ' along the straight line that connects take-off location Pua and placement location Pla.
A transfer 30b picks up in connection on the straight line of placement location Plb of the take-off location Pub of section 10 ' and placement section 20 ' and maintains a plurality of suction nozzle 31b that form row, and a plurality of suction nozzle 31b each interval specified gap.In addition, the actuator 32b that a transfer 30b has, as shown in the arrow of Figure 12, makes a transfer 30b move between the section of picking up 10 ' and placement section 20 ' along the straight line that connects take-off location Pub and placement location Plb.
A transfer 30a and a transfer 30b be by control part 40 ' control action, and during making a side therein be moved in the section of getting 10 ', the opposing party places action in placement section 20 '.
In addition, the take-off location Pua and the take-off location Pub that pick up section 10 ' are set as at Y-direction isolation predetermined distance, and the placement location Pla of placement section 20 ' and placement location Plb are set as at Y-direction isolation predetermined distance.Therefore, the shifting axle of the shifting axle of a transfer 30a and a transfer 30b is parallel to each other.
With reference to Figure 13 and Figure 14, further illustrate the structure of the each several part of transfer device 1 '.As shown in figure 13, the section of picking up 10 ' of transfer device 1 ' possesses for press picking up hammer 13a and picking up hammer for these two of the 13b of hammer that pick up that press the suction nozzle 31b that a transfer 30b keeps at take-off location Pub of suction nozzle 31a that a transfer 30a keeps at take-off location Pua.Pick up hammer 13a and pick up hammer 13b and be connected in plectane cam 14 in the mode of pressing suction nozzle 31b at corresponding take-off location respectively via same arm.Therefore, in the situation that make 14 rotations of plectane cam by the action of picking up motor 15, pick up hammer 13a and pick up hammer 13b and move along the Z direction simultaneously.Pick up hammer 13a and pick up hammer 13b by such, the suction nozzle 31 that the either party of the transfer 30a that carries out picking action in the section of picking up 10 ' or a transfer 30b is kept is pressed.
In addition, as shown in figure 13, the section of picking up 10 ' of transfer device 1 ' possesses the thimble actuator 50 that the structure that can make to comprise thimble 16, plectane cam 17 and jack-up motor 18 for jack-up chip 100 (below, be called the thimble unit and illustrate) moves along Y-direction.Thimble actuator 50 is the control by control part 40 ', the actuator that the thimble 16 of thimble unit is moved back and forth between take-off location Pua and take-off location Pub.
Control part 40 ', when carrying out the picking action of take-off location Pua, makes the thimble cell moving to the position corresponding with take-off location Pua by thimble actuator 50, carries out by the action of thimble 16 jack-up chips 100.On the other hand, when carrying out the picking action of take-off location Pub, by thimble actuator 50, make the thimble cell moving to the position corresponding with take-off location Pub, carry out by the action of thimble 16 jack-up chips 100.
As shown in figure 14, the placement section 20 ' of transfer device 1 ' possesses placement hammer 23a for press the suction nozzle 31a that a transfer 30a keeps at placement location Pla and places hammer for two of placement hammer 23b that press the suction nozzle 31b that a transfer 30b keeps at placement location Plb.Place hammer 23a and place hammer 23b and be connected in plectane cam 24 in the mode of pressing suction nozzle 31b at corresponding placement location respectively via same arm.Therefore, in the situation that by the action of motor 25 make 24 rotations of plectane cam, place hammer 23a and place hammer 23b and move along the Z direction simultaneously.By such placement hammer 23a and place hammer 23b, to is placing the transfer 30a that moves or any suction nozzle kept 31 of a transfer 30b at placement section 10 ', pressed.
With reference to the flow chart of Figure 15, illustrate and use a series of handovers of transfer device 1 ' to process.At first, the pasting boards 200 that maintains chip 100 is arranged on the pick-up table 11 of the section of picking up 10 ' (step S1).Simultaneously or before and after this, the configuration plate 300 of moving chip 100 is arranged on the mounting table 21 of placement section 20 ' (step S2).Then, pick up the camera 19 of section 10 ' for whole chips 100 photographic images that are configured on pasting boards 200, and image information is sent to control part 40.The image information of control part 40 based on receiving, set coordinate to each chip 100 on pasting boards 200, and generate positional information (step S3).The positional information generated is stored in the memory in control part 40.
Then, control part 40 makes a transfer 30a move to the section of picking up 10 ' (step S4a), carries out picking action (step S5a).Simultaneously, control part 40 makes a transfer 30b move to placement section 20 ' (step S4b), places action (step S5b).In addition, the action of placement for the first time when action starts, owing on the suction nozzle 31b at a transfer 30b, not keeping chip 100, thereby do not carry out.
Then, control part 40 makes a transfer 30a move to placement section 20 ' (step S6a), carries out and places action (step S7a).Simultaneously, control part 40 makes a transfer 30b move to the section of picking up 10 ' (step S6b), carries out picking action (step S7b).
Control part 40 moves to (step S8: be), then tenth skill on configuration plate 300 in a series of actions of repeatedly carrying out step S4～step S7 until should move to whole chips 100 on pasting boards 200.
According to the action of transfer device 1 ', during a transfer 30a carries out picking action in the section of picking up 10 ', a transfer 30b can place action in placement section 20 '.Now, according to position relationship and the mobile route of a transfer 30a and a transfer 30b, the action of a transfer 30a can not affect the action of a transfer 30b, and the action of a transfer 30b can not affect the action of a transfer 30a.
Therefore, can make a transfer 30a and a transfer 30b be moved concurrently, not only there is the effect of the action of transfer device 1, can also further shorten pitch time.
The invention is not restricted to the embodiments described, can suitably change in not violating according to the scope of the purport of the invention of claims and whole specification record or thought, carried out in the component transfer apparatus of such change and scope that method is also included within technology of the present invention.
The explanation of Reference numeral
1 transfer device
10 pick up section
11 pick-up table
12 pick-up table actuators
13 pick up hammer
14 plectane cams
15 pick up motor
16 thimbles
17 times plectane cams
18 jack-up motors
19 cameras (picking up section)
20 placement sections
21 mounting tables
22 mounting table actuators
23 place hammer
24 plectane cams
25 place motor
26 cameras (placement section)
30 transfer heads
31 suction nozzles
32 actuators
40 control parts
100 chips
200 pasting boards
300 configuration plates

Claims (8)

1. a component transfer apparatus, take out and be transferred to configuration section by the chip that is held in a plurality of wafer-shapeds of maintaining part, it is characterized in that possessing:
Maintaining part, keep described chip,
Suction nozzle, adsorb described chip,
The transfer unit, maintain described a plurality of suction nozzle, between described maintaining part and described configuration section, moves,
The suction nozzle mobile unit, by making described transfer cell moving, sequentially move to the take-off location of regulation one by one by the described a plurality of suction nozzles that are held in described transfer unit, and
The suction nozzle control unit, be configured in the position fixing with respect to described transfer device, at described take-off location, press suction nozzle in described a plurality of suction nozzle so that a suction nozzle in described a plurality of suction nozzle is connected to a chip in described a plurality of chip and is adsorbed;
Described transfer unit possesses described a plurality of suction nozzle application of forces so that the application of force unit that described a plurality of suction nozzle separates from a plurality of described chip that is held in described maintaining part, after absorption separately finishes at described a plurality of suction nozzles, moves to described configuration section,
Described suction nozzle control unit possesses the end of the bearing shape of pressing a suction nozzle in described a plurality of suction nozzle,
Described transfer unit is so that the mode that described a plurality of suction nozzle is configured to row along the shifting axle between described maintaining part and described configuration section keeps described a plurality of suction nozzle.
2. component transfer apparatus as claimed in claim 1, it is characterized in that, also possess the chip mobile unit, this chip mobile unit is by described maintaining part is moved, and the chip be held in described a plurality of chips of described maintaining part is moved to described take-off location.
3. component transfer apparatus as claimed in claim 1, is characterized in that, a suction nozzle in described a plurality of suction nozzle is pressed in the end of the front end of described suction nozzle control unit by being arranged on arm member, and wherein, this arm member moves by the driving of rotating cam.
4. component transfer apparatus as claimed in claim 1, it is characterized in that, also there is the unit of pressing, this press in a plurality of described chip that unit will be held in described maintaining part, to by a chip of a suction nozzle absorption in described a plurality of suction nozzles, to this suction nozzle direction, be pressed at described take-off location.
5. a component transfer apparatus,
The chip that is held in a plurality of wafer-shapeds of maintaining part is taken out and is transferred to configuration section, it is characterized in that, possess:
Maintaining part, keep described chip,
Suction nozzle, adsorb described chip,
The transfer unit, maintain described a plurality of suction nozzle, between described maintaining part and described configuration section, moves,
The suction nozzle mobile unit, by making described transfer cell moving, sequentially move to the take-off location of regulation one by one by the described a plurality of suction nozzles that are held in described transfer unit, and
The suction nozzle control unit, be configured in the position fixing with respect to described transfer device, at described take-off location, press suction nozzle in described a plurality of suction nozzle so that a suction nozzle in described a plurality of suction nozzle is connected to a chip in described a plurality of chip and is adsorbed;
Described transfer unit possesses described a plurality of suction nozzle application of forces so that the application of force unit that described a plurality of suction nozzle separates from a plurality of described chip that is held in described maintaining part, after absorption separately finishes at described a plurality of suction nozzles, moves to described configuration section,
Described component transfer apparatus also has the dispensing unit in described configuration section in a plurality of described chip configuration that will be adsorbed by described suction nozzle of placement location of regulation,
Described suction nozzle mobile unit by making described transfer cell moving, one by one sequentially moves to described placement location by the described a plurality of suction nozzles that are held in described transfer unit in described configuration section,
Described component transfer apparatus possesses between described maintaining part and described configuration section, the 1st transfer unit and these two described transfer unit, the 2nd transfer unit of on the path be parallel to each other, moving,
At suction nozzle control unit described in described maintaining part, make to be held in during the described suction nozzle of described the 1st transfer unit adsorbed a plurality of described chip that is held in described maintaining part, in described configuration section, described dispensing unit makes to be held in a plurality of described chip configuration of described suction nozzle absorption of described the 2nd transfer unit in described configuration section
Make to be held in a plurality of described chip configuration of described suction nozzle absorption of described the 1st transfer unit at dispensing unit described in described configuration section during described configuration section, at suction nozzle control unit described in described maintaining part, the described suction nozzle that is held in described the 2nd transfer unit is adsorbed to a plurality of described chip that is held in described maintaining part
Described suction nozzle control unit possesses two ends that (i) links via same parts and shared driving mechanism for driving this suction nozzle control unit, (ii) these two ends are the 1st ends, a suction nozzle in the described a plurality of suction nozzles that are held in described the 1st transfer unit is pressed, made a suction nozzle in these described a plurality of suction nozzles that are held in described the 1st transfer unit be connected to a chip in described a plurality of chip and be adsorbed; With the 2nd end, a suction nozzle in the described a plurality of suction nozzles that are held in described the 2nd transfer unit is pressed, and the chip that a suction nozzle in these described a plurality of suction nozzles that are held in described the 2nd transfer unit is connected in described a plurality of chip is adsorbed.
6. component transfer apparatus as claimed in claim 5, it is characterized in that, also there is the configuration section mobile unit, this configuration section mobile unit, by described configuration section is moved, sequentially moves to described placement location one by one by the position that should configure a chip in described a plurality of chip in described configuration section.
7. a component transfer method, be the component transfer method that the chip that will be held in a plurality of wafer-shapeds of maintaining part took out and be transferred to the component transfer apparatus of configuration section, it is characterized in that, comprising:
The transfer operation that the transfer unit is moved between maintaining part and described configuration section, wherein, described transfer unit is kept for the suction nozzle that adsorbs described chip a plurality of, possess described a plurality of suction nozzle application of forces so that the application of force unit that described a plurality of suction nozzle separates from a plurality of described chip that is held in described maintaining part
By making described transfer cell moving, the described a plurality of suction nozzles that are held in described transfer unit are sequentially moved to one by one to the suction nozzle mobile process of the take-off location of regulation, and
By being configured in the suction nozzle control unit of the position fixing with respect to described transfer device, at described take-off location, press the suction nozzle control operation that a suction nozzle in described a plurality of suction nozzle is adsorbed so that a suction nozzle in described a plurality of suction nozzle is connected to a chip in described a plurality of chip;
In described transfer operation, after at described a plurality of suction nozzles, absorption separately finishes, by described transfer cell moving to described configuration section,
Described suction nozzle control unit possesses the end of the bearing shape of pressing a suction nozzle in described a plurality of suction nozzle,
Described transfer unit is so that the mode that described a plurality of suction nozzle is configured to row along the shifting axle between described maintaining part and described configuration section keeps described a plurality of suction nozzle.
8. a component transfer method, be the component transfer method that the chip that will be held in a plurality of wafer-shapeds of maintaining part took out and be transferred to the component transfer apparatus of configuration section, it is characterized in that, comprising:
The transfer operation that the transfer unit is moved between maintaining part and described configuration section, wherein, described transfer unit is kept for the suction nozzle that adsorbs described chip a plurality of, possess described a plurality of suction nozzle application of forces so that the application of force unit that described a plurality of suction nozzle separates from a plurality of described chip that is held in described maintaining part
By making described transfer cell moving, the described a plurality of suction nozzles that are held in described transfer unit are sequentially moved to one by one to the suction nozzle mobile process of the take-off location of regulation, and
By being configured in the suction nozzle control unit of the position fixing with respect to described transfer device, at described take-off location, press the suction nozzle control operation that a suction nozzle in described a plurality of suction nozzle is adsorbed so that a suction nozzle in described a plurality of suction nozzle is connected to a chip in described a plurality of chip;
In described transfer operation, after at described a plurality of suction nozzles, absorption separately finishes, by described transfer cell moving to described configuration section,
Also there is the arrangement step in described configuration section in a plurality of described chip configuration that will be adsorbed by described suction nozzle of placement location of regulation in described component transfer method,
In described suction nozzle mobile process, in described configuration section, by making described transfer cell moving, the described a plurality of suction nozzles that are held in described transfer unit are sequentially moved to described placement location one by one,
In described transfer operation, two described transfer unit are moved, two described transfer unit are between described maintaining part and described configuration section, the 1st transfer unit and the 2nd transfer unit that on the path be parallel to each other, move,
During controlling at suction nozzle described in described maintaining part that described suction nozzle that operation makes to be held in described the 1st transfer unit adsorbed a plurality of described chip that is held in described maintaining part, in described configuration section, described arrangement step makes to be held in a plurality of described chip configuration of described suction nozzle absorption of described the 2nd transfer unit in described configuration section
Make to be held in a plurality of described chip configuration of described suction nozzle absorption of described the 1st transfer unit in arrangement step described in described configuration section during described configuration section, controlling operation at suction nozzle described in described maintaining part makes the described suction nozzle that is held in described the 2nd transfer unit be adsorbed a plurality of described chip that is held in described maintaining part
Described suction nozzle control unit possesses two ends that (i) links via same parts and shared driving mechanism for driving this suction nozzle control unit, (ii) these two ends are the 1st ends, a suction nozzle in the described a plurality of suction nozzles that are held in described the 1st transfer unit is pressed, made a suction nozzle in these described a plurality of suction nozzles that are held in described the 1st transfer unit be connected to a chip in described a plurality of chip and be adsorbed; With the 2nd end, a suction nozzle in the described a plurality of suction nozzles that are held in described the 2nd transfer unit is pressed, and the chip that a suction nozzle in these described a plurality of suction nozzles that are held in described the 2nd transfer unit is connected in described a plurality of chip is adsorbed.
CN201080038736.8A 2010-04-13 2010-04-13 Apparatus and method for transferring component Expired - Fee Related CN102484087B (en)

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CN102751218B (en) * 2012-07-05 2014-09-24 深圳翠涛自动化设备股份有限公司 Real-time regulation thimble mechanism as well as system and method thereof
CN108311765A (en) * 2017-01-18 2018-07-24 鸿骐新技股份有限公司 Dual chip module takes the assemble method for setting welding system and dual chip module
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