CN102751218B - Real-time regulation thimble mechanism as well as system and method thereof - Google Patents
Real-time regulation thimble mechanism as well as system and method thereof Download PDFInfo
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- CN102751218B CN102751218B CN201210231232.9A CN201210231232A CN102751218B CN 102751218 B CN102751218 B CN 102751218B CN 201210231232 A CN201210231232 A CN 201210231232A CN 102751218 B CN102751218 B CN 102751218B
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- ejector pin
- pin mechanism
- suction nozzle
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- thimble
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Abstract
The invention discloses a real-time regulation thimble mechanism as well as a system and a method thereof. The system comprises a thimble mechanism and a control device, wherein the thimble mechanism comprises a plane motion platform, a thimble arranged on the plane motion platform and a thimble center on the top end of the thimble; the control device comprises the following functional modules: an image acquiring module, an image processing module, a motion control module and a driver, wherein the image acquiring module is used for obtaining the image of the center position of a suction nozzle; the image processing module is used for obtaining the coordinate value of the center position of the suction nozzle by calculation; the motion control module is used for conveying the coordinate value of the center position of the suction nozzle; and the driver is used for receiving the coordinate value of the center position of the suction nozzle, controls the thimble mechanism to move and enables the thimble mechanism and the suction nozzle center of a crystal fixing executive device to be positioned on one longitudinal vertical line. According to the center position of the suction nozzle, the thimble center is regulated in real time to enable the thimble mechanism and the suction nozzle center of the crystal fixing executive device to be positioned on one longitudinal vertical line, the operation of manually regulating the center position of the thimble after halting is omitted, and therefore the production efficiency is improved.
Description
Technical field
The present invention relates to die bond sealed in unit field, what relate in particular is the improvement of a kind of real-time adjustment ejector pin mechanism and system and method thereof.
Background technology
In the brilliant step of picking up of die bond encapsulation process, want the wafer being bonded on blue film to pick up, except providing to suction nozzle enough vacuum, also need thimble by wafer jack-up, to make wafer depart from blue film.
In prior art, be arranged on the top of die bond final controlling element for the camera of real-time monitored wafer position, ejector pin mechanism is arranged on the below of die bond final controlling element.Picking up in brilliant process, first need to utilize wafer disks platform chip conveying to be arrived to the below of camera, make center wafer and camera center at a vertical vertical line, therefore camera center is equal to center wafer; Then thimble is by wafer jack-up, to make wafer depart from blue film.
At thimble during by wafer jack-up, must ensure that camera center, suction nozzle center, these three points of thimble center must be (hereinafter referred to as sight alignments on the vertical vertical line of same, be called two one lines if camera is not set), to ensure that die bond position can not be offset, and reaches the optimum efficiency of die bond.
Sight alignment (or two one lines) plays key effect to die bond quality, therefore, is strict for the adjustment requirement of sight alignment (or two one lines), must ensure in process of production sight alignment (or two one lines) always.Meanwhile, after die bond continues for some time, along with making mechanical self-temperature rising or spare and accessory parts wearing and tearing, friction of motion also can cause sight alignment (or two one lines) biasing phenomenon.
In the time there is bias conditions; conventionally after needing to shut down, first adjust camera position; make cross hairs center aim at suction nozzle center; and then suction nozzle is removed; by thimble, blue wafer film is exposed; again thimble seat is adjusted to camera cross hairs center, makes thimble center and camera center, suction nozzle center on the vertical vertical line of same.
Above-mentioned adjustment process adopts manual operation completely, and especially very high because of its requirement for the adjustment of sight alignment (or two one lines), manual operation adjustment need to expend a large amount of time, and simultaneously, production line needs to stop work, thereby production efficiency is low.
Therefore, prior art still haves much room for improvement and develops.
Summary of the invention
The object of the invention is to, provide a kind of ejector pin mechanism and system and method thereof adjusted in real time, to solve the low problem of existing thimble structure production efficiency.
Technical scheme of the present invention is as follows:
A system for real-time adjustment ejector pin mechanism, wherein, comprises ejector pin mechanism, and for adjusting in real time the position of described ejector pin mechanism, makes the thimble center of ejector pin mechanism and the suction nozzle center of the die bond final controlling element control device on a vertical vertical line;
Described ejector pin mechanism comprises plane motion platform, be arranged on thimble on plane motion platform and the thimble center on thimble top;
Described control device comprises following functions module:
For obtaining the image collection module of suction nozzle center image;
For obtain the image processing module of the position coordinate value at suction nozzle center by calculating;
Be used for the motion-control module of the position coordinate value that transmits suction nozzle center;
For receiving the position coordinate value at described suction nozzle center, and control ejector pin mechanism and move, the driver of the suction nozzle center that makes ejector pin mechanism and die bond final controlling element on a vertical vertical line;
Described driver is connected on described ejector pin mechanism, drives described ejector pin mechanism according to the position coordinate value motion at suction nozzle center.
The system of described real-time adjustment ejector pin mechanism, wherein, described position coordinate value comprises X-axis coordinate figure and the Y-axis coordinate figure that in horizontal plane, rectangular coordinate is fastened.
The system of described real-time adjustment ejector pin mechanism, wherein, described position coordinate value comprises utmost point footpath and the polar angle in polar coordinate system in horizontal plane.
A kind of ejector pin mechanism of real-time adjustment, wherein, for coordinating the system of real-time adjustment ejector pin mechanism, make the thimble center of ejector pin mechanism and the suction nozzle center of die bond final controlling element on a vertical vertical line, described ejector pin mechanism comprises plane motion platform, be arranged on thimble on plane motion platform and the thimble center on thimble top;
Also comprise: for receiving the position coordinate value at described suction nozzle center, and control ejector pin mechanism and move, the driver of the suction nozzle center that makes ejector pin mechanism and die bond final controlling element on a vertical vertical line;
Described driver is connected on described ejector pin mechanism, drives described ejector pin mechanism according to the position coordinate value motion at suction nozzle center.
Described ejector pin mechanism, wherein, described plane motion platform comprises Y-axis motion platform or X-axis motion platform, is arranged on X-axis motion platform or Y-axis motion platform on Y-axis motion platform or X-axis motion platform, and described thimble is arranged on X-axis motion platform or Y-axis motion platform.
Described ejector pin mechanism, wherein, described plane motion platform comprises linear motion platform or pole axis motion platform, is arranged on pole axis motion platform or linear motion platform on linear motion platform or pole axis motion platform, and described thimble is arranged on pole axis motion platform or linear motion platform.
Described ejector pin mechanism, wherein, is provided with the drive motors being connected with described driver on described plane motion platform.
A method for real-time adjustment ejector pin mechanism, wherein, for adjusting in real time ejector pin mechanism position, makes the thimble center of ejector pin mechanism and the suction nozzle center of die bond final controlling element on a vertical vertical line, said method comprising the steps of:
A, obtain suction nozzle center image;
B, obtain the position coordinate value at suction nozzle center by calculating;
C, send the position coordinate value at described suction nozzle center to driver;
D, driver control ejector pin mechanism move, and make the suction nozzle center of thimble center and die bond final controlling element on a vertical vertical line.
The method of described real-time adjustment ejector pin mechanism, wherein, described position coordinate value comprises X-axis coordinate figure and the Y-axis coordinate figure that in horizontal plane, rectangular coordinate is fastened.
The method of described real-time adjustment ejector pin mechanism, wherein, described position coordinate value comprises polar angle and the utmost point footpath in polar coordinate system in horizontal plane.
The ejector pin mechanism of a kind of real-time adjustment provided by the present invention and system thereof and method thereof; can carry out automatically adjusting in real time to thimble center according to the position at suction nozzle center; make the suction nozzle center of ejector pin mechanism and die bond final controlling element on a vertical vertical line; no longer need to shut down the position at rear manual adjustments thimble center, therefore improved production efficiency.
Brief description of the drawings
Fig. 1 is the FB(flow block) that the present invention adjusts the system of ejector pin mechanism in real time.
Fig. 2 is the structural representation that the present invention adjusts ejector pin mechanism preferred embodiment in real time.
Fig. 3 is the structural representation sketch that the present invention adjusts another embodiment of ejector pin mechanism in real time.
Fig. 4 is that the present invention adjusts the ejector pin mechanism structural representation sketch of an embodiment more in real time.
Fig. 5 is the structural representation sketch that the present invention adjusts ejector pin mechanism and hide in an embodiment thimble module in real time.
Fig. 6 is the FB(flow block) that the present invention adjusts ejector pin mechanism method in real time.
Fig. 7 is the schematic diagram of the embodiment of the present invention.
Embodiment
Below with reference to accompanying drawing, the specific embodiment of the present invention and embodiment are described in detail, described specific embodiment only, in order to explain the present invention, is not intended to limit the specific embodiment of the present invention.
The invention discloses a kind of system of real-time adjustment ejector pin mechanism, comprise ejector pin mechanism and control device; Described ejector pin mechanism comprises plane motion platform, be arranged on thimble module on plane motion platform and the thimble center on thimble module top.Described control device, for adjusting in real time the position of described ejector pin mechanism, makes the thimble center of ejector pin mechanism and the suction nozzle center of die bond final controlling element on a vertical vertical line.The present invention can adjust thimble center in real time according to the position at suction nozzle center, makes the suction nozzle center of ejector pin mechanism and die bond final controlling element on a vertical vertical line.No longer need to shut down the position at rear manual adjustments thimble center, therefore improved production efficiency.
Particularly, as shown in Figure 1, described control device comprises following functions module: for obtaining the image collection module 210 of suction nozzle center image; Described image collection module 210 can be set to camera or the first-class photographing device of making a video recording.For obtain the image processing module 220 of the position coordinate value at suction nozzle center by calculating; Described image processing module 220 can be set to CPU.The suction nozzle center image that described image processing module 220 sends data collecting card obtains the position coordinate value at suction nozzle center by internal calculation.Described position coordinate value comprises X-axis coordinate figure and the Y-axis coordinate figure in horizontal plane.Or polar angle and the utmost point footpath in polar coordinate system in horizontal plane.Be used for the motion-control module 230 of the position coordinate value that transmits described suction nozzle center, described motion-control module 230 can be set to control card and control motor.For receiving the position coordinate value at described suction nozzle center, and control ejector pin mechanism, the driver 240 of the suction nozzle center that makes ejector pin mechanism and die bond final controlling element on a vertical vertical line.
Described driver 240 is connected on described ejector pin mechanism 250, drives described ejector pin mechanism 250 according to the position coordinate value motion at suction nozzle center.Described position coordinate value comprises X-axis coordinate figure and the Y-axis coordinate figure that in horizontal plane, rectangular coordinate is fastened.Or polar angle and the utmost point footpath in polar coordinate system in horizontal plane.The X-axis coordinate figure at described thimble center and Y-axis coordinate figure are consistent with X-axis coordinate figure and the Y-axis coordinate figure at suction nozzle center, or polar angle and utmost point footpath in the polar coordinate system at polar angle in the polar coordinate system at described thimble center and utmost point footpath and suction nozzle center is consistent.Can make described thimble center 260 and suction nozzle center indulge on vertical line at same.
Based on the system of above-mentioned real-time adjustment ejector pin mechanism, the invention also discloses a kind of ejector pin mechanism of real-time adjustment, for coordinating the system of real-time adjustment ejector pin mechanism, make the thimble center of ejector pin mechanism and the suction nozzle center of die bond final controlling element on a vertical vertical line.
As the preferred embodiments of the present invention, as shown in Figure 2, described ejector pin mechanism comprises plane motion platform and is arranged on the thimble on plane motion platform.Particularly, described plane motion platform comprises Y-axis motion platform 251, is arranged on the X-axis motion platform 252 on Y-axis motion platform 251; Described thimble module 253 is arranged on X-axis motion platform 252.The position of described Y-axis motion platform and described X-axis motion platform can exchange, and Y motion platform can be arranged on X-axis motion platform, more described thimble module 253 is arranged on Y motion platform.Described thimble module major function is getting in brilliant process, and jack-up wafer is also arranged in pairs or groups mutually with picking and placeing module, gets brilliant action to complete.Getting in brilliant process, first utilize vacuum that the blue film on wafer is held, then thimble is ejected to action with motor collocation ejecting mechanism, make wafer depart from blue film, can smoothly wafer be taken away thereby make to pick up brilliant device.This device and wherein relate to pick and place module, pick up brilliant device etc. even be conventional mechanism structure in die bond machine, be also that the conventional motion control device of industry technical staff is easy to the mode realizing, no longer set forth at this.
Described Y-axis motion platform 251 relatively can move back and forth and be arranged on base 255, moves along Y direction for controlling described thimble machine, and it comprises Y-axis drive motors 256, and described Y-axis drive motors 256 is connected with Drive Module.On described Y-axis motion platform 251, be also provided with the guide rail 257 for described X-axis motion platform 252 is installed, accordingly, on described X-axis motion platform 252, be provided with the guide-track groove 258 of adaptive described guide rail, like this, described X-axis motion platform 252 can move back and forth along described guide rail 257.Described X-axis motion platform 252 comprises X-axis drive motors 259, and described X-axis drive motors 259 is connected with Drive Module.
Described driver drives X-axis drive motors 259 and Y-axis drive motors 256 to move by the position coordinate value (described position coordinate value comprises X-axis coordinate figure and the Y-axis coordinate figure that in horizontal plane, rectangular coordinate is fastened) at the suction nozzle center that obtains.Make X-axis coordinate figure and the Y-axis coordinate figure at described thimble center 260 consistent with X-axis coordinate figure and the Y-axis coordinate figure at suction nozzle center, can make described thimble center 260 and suction nozzle center indulge on vertical line at same.
As another embodiment of the present invention, as shown in Figure 3, described plane motion platform comprises pole axis motion platform 270, is arranged on the linear motion platform 280 on pole axis motion platform 270, and described thimble module 253 is arranged on described linear motion platform 280.Described pole axis motion platform 270 is arranged on base 290 relatively rotationally, and described base 290 is preferably set to disc structure; Described pole axis motion platform 270 realizes for controlling described thimble module 253 rotation that angle is polar angle, and it comprises pole axis drive motors (not shown), and described pole axis drive motors is connected with Drive Module.On described pole axis motion platform 270, be also provided with the guide rail for described linear motion platform 280 is installed, accordingly, on described linear motion platform 280, be provided with the guide-track groove of adaptive described pole axis motion platform 270, like this, described linear motion platform 280 can move back and forth along described guide rail.
Described linear motion platform 280 comprises pole axis drive motors (not shown), and described pole axis drive motors is connected with Drive Module.Described thimble module 253 major functions are getting in brilliant process, jack-up wafer and with pick and place module and arrange in pairs or groups mutually, get brilliant action to complete, getting in brilliant process, first utilize vacuum that blue film is held, with motor collocation ejecting mechanism, thimble is ejected to action again, make wafer depart from blue film, can smoothly wafer be taken away thereby make to pick up brilliant device.This device and wherein relate to pick and place module, pick up brilliant device etc. even be conventional mechanism structure in die bond machine, be also that the conventional motion control device of industry technical staff is easy to the mode realizing, no longer set forth at this.
Described driver is by position coordinate value (described position coordinate value comprises utmost point footpath and the polar angle in polar coordinate system in horizontal plane) driving stage axis drive motor and the linear drive motor motion at the suction nozzle center that obtains.Make the polar angle at described thimble center 260 consistent with polar angle and the utmost point footpath at suction nozzle center with utmost point footpath, can make described thimble center 260 and suction nozzle center indulge on vertical line at same.
As an embodiment more of the present invention, if Fig. 4 is in conjunction with as shown in Fig. 5, described plane motion platform comprises linear platform 310 and is arranged on the pole axis platform 320 on described linear platform 310, be arranged on driving wheel 321, driven pulley 322 on pole axis platform 320, and for connecting belt 323 and the drive motors of described driving wheel 321 and driven pulley 322.Described drive motors is arranged on the bottom of described pole axis platform 320, and screw mandrel 313 tops, avoid with screw mandrel, prevents from interfering.(drive motors is not shown in the drawings).Described thimble module 253 is arranged on described driven pulley 322.Described pole axis platform 320 is relative slidably with described linear platform 310, and described linear platform 310 is to make the pole axis platform 320 being arranged on described linear platform 310 realize rectilinear motion by type of drive such as pole axis motor 311, guide rail 312, screw mandrels 313.This first motion control device is conventional plane motion controlling organization, is that industry technical staff knows and conventional rectilinear motion control mode, therefore do not elaborate.
This device rotates by the driven by motor driving wheel 321 being arranged on linear platform 310, then through belt 323 transmissions, driven pulley 322 is rotated simultaneously, thereby the thimble module 253 that makes to be arranged on driving wheel 322 is rotated.Interspersed being arranged in the centre bore of driving wheel 321 of rotating shaft of described drive motors, and by side screw, rotating shaft and driving wheel 321 are fixed together, make it to realize the control of rotating simultaneously and stopping.Described driven pulley is connected with driving wheel by belt, and described driven pulley is fixedly installed on pole axis platform 320 by rotating shaft and bearing (in figure, nothing illustrates).Like this, finally rotarily drive by rectilinear motion control device and motor that this structure planar realizes straight line and angle rotatablely moves.
Described driver drives described drive motors and linear electric motors motion by the position coordinate value (described position coordinate value comprises utmost point footpath and the polar angle in polar coordinate system in horizontal plane) at the suction nozzle center that obtains.Make the polar angle at described thimble center 260 consistent with polar angle and the utmost point footpath at suction nozzle center with utmost point footpath, can make described thimble center 260 and suction nozzle center indulge on vertical line at same.
Ejector pin mechanism based on above-mentioned real-time adjustment and system thereof, the invention discloses a kind of method of real-time adjustment ejector pin mechanism, for adjusting in real time ejector pin mechanism position, make the thimble center of ejector pin mechanism and the suction nozzle center of die bond final controlling element on a vertical vertical line, as shown in Figure 6, and comprise the following steps:
Step S110, obtain suction nozzle center image; Camera or the first-class photographing device of making a video recording are taken pictures to suction nozzle position, and the installation site of camera or the first-class photographing device of making a video recording is any, as long as can photograph suction nozzle center.
Step S120, obtain the position coordinate value at suction nozzle center by calculating; Utilize data collecting card to send the suction nozzle center image getting to image processing module, image processing module obtains the position coordinate value at suction nozzle center by internal calculation.Described position coordinate value comprises X-axis coordinate figure and the Y-axis coordinate figure in horizontal plane.Or polar angle and the utmost point footpath in polar coordinate system in horizontal plane.
Step S130, send the position coordinate value at described suction nozzle center to driver; Recycling software sends the position coordinate value at suction nozzle center to motion-control module, and motion-control module sends the position coordinate value at suction nozzle center to Drive Module.
Step S140, Drive Module control ejector pin mechanism move, and make the suction nozzle center of thimble center and die bond final controlling element on a vertical vertical line.
By introducing the method for real-time adjustment ejector pin mechanism, can be to thimble center being adjusted in real time according to the position at suction nozzle center, make the suction nozzle center of thimble center and die bond final controlling element on a vertical vertical line.No longer need to shut down the position at rear manual adjustments thimble center, therefore improved production efficiency.
As shown in Figure 7, described ejector pin mechanism 250 is arranged on the below of the suction nozzle 300 on die bond final controlling element, and described suction nozzle is used for picking up crystalline substance.Want to pick up being placed on wafer 400 on wafer disks platform and that be stained with blue film, except providing enough vacuum to suction nozzle 300, also need thimble module 253 by wafer 400 jack-up, to make wafer 400 depart from blue film.Preferably, described wafer disks platform is also set to the structure that can adjust in real time, its structure is not shown in the drawings, described Drive Module is connected with described wafer disks platform, thereby the position coordinate value at described suction nozzle center 301 is sent on described wafer disks platform, the center wafer 401 that makes the wafer 400 on described wafer disks platform with suction nozzle center 301 on a vertical vertical line.
Picking up in brilliant process, first utilize camera 500 to take in real time the position at described suction nozzle center 301.The position coordinate value that the image photographing is obtained to suction nozzle center by calculating, sends the position coordinate value at described suction nozzle center to driver; Described in described driver drives, wafer disks platform moves, and wafer 400 is transported to the below of suction nozzle 300, makes center wafer 401 and suction nozzle center 301 at a vertical vertical line.Meanwhile, ejector pin mechanism motion described in described driver Real Time Drive, make thimble center 260 with the suction nozzle center 301 of die bond final controlling element on a vertical vertical line.Like this, described thimble center 260, center wafer 401 and suction nozzle center 301 are on a vertical vertical line.While effectively having ensured die bond, wafer can not be offset, and has reached the optimum efficiency of die bond.
The ejector pin mechanism of a kind of real-time adjustment provided by the present invention and system thereof and method thereof, can adjust thimble center in real time according to the position at suction nozzle center, makes the suction nozzle center of ejector pin mechanism and die bond final controlling element on a vertical vertical line.No longer need to shut down the position at rear manual adjustments thimble center, improved production efficiency.
Should be understood that; the foregoing is only preferred embodiment of the present invention; be not sufficient to limit technical scheme of the present invention; for those of ordinary skills; within the spirit and principles in the present invention; can be increased and decreased according to the above description, replaced, converted or be improved, and all these increases and decreases, replace, conversion or improve after technical scheme, all should belong to the protection range of claims of the present invention.
Claims (10)
1. a system of adjusting in real time ejector pin mechanism, is characterized in that, comprises ejector pin mechanism, and for adjusting in real time the position of described ejector pin mechanism, makes the thimble center of ejector pin mechanism and the suction nozzle center of the die bond final controlling element control device on a vertical vertical line;
Described ejector pin mechanism comprises plane motion platform, be arranged on thimble on plane motion platform and the thimble center on thimble top;
Described control device comprises following functions module:
For obtaining the image collection module of suction nozzle center image;
For obtain the image processing module of the position coordinate value at suction nozzle center by calculating;
Be used for the motion-control module of the position coordinate value that transmits suction nozzle center;
For receiving the position coordinate value at described suction nozzle center, and control ejector pin mechanism and move, the driver of the suction nozzle center that makes ejector pin mechanism and die bond final controlling element on a vertical vertical line;
Described driver is connected on described ejector pin mechanism, drives described ejector pin mechanism according to the position coordinate value motion at suction nozzle center.
2. the system of real-time adjustment ejector pin mechanism according to claim 1, is characterized in that, described position coordinate value comprises X-axis coordinate figure and the Y-axis coordinate figure that in horizontal plane, rectangular coordinate is fastened.
3. the system of real-time adjustment ejector pin mechanism according to claim 1, is characterized in that, described position coordinate value comprises utmost point footpath and the polar angle in polar coordinate system in horizontal plane.
4. an ejector pin mechanism of adjusting in real time, it is characterized in that, for coordinating the system of real-time adjustment ejector pin mechanism, make the thimble center of ejector pin mechanism and the suction nozzle center of die bond final controlling element on a vertical vertical line, described ejector pin mechanism comprises plane motion platform, be arranged on thimble on plane motion platform and the thimble center on thimble top;
Also comprise: for receiving the position coordinate value at described suction nozzle center, and control ejector pin mechanism and move, the driver of the suction nozzle center that makes ejector pin mechanism and die bond final controlling element on a vertical vertical line;
Described driver is connected on described ejector pin mechanism, drives described ejector pin mechanism according to the position coordinate value motion at suction nozzle center.
5. ejector pin mechanism according to claim 4, it is characterized in that, described plane motion platform comprises Y-axis motion platform or X-axis motion platform, be arranged on X-axis motion platform or Y-axis motion platform on Y-axis motion platform or X-axis motion platform, described thimble is arranged on X-axis motion platform or Y-axis motion platform.
6. ejector pin mechanism according to claim 4, it is characterized in that, described plane motion platform comprises linear motion platform or pole axis motion platform, be arranged on pole axis motion platform or linear motion platform on linear motion platform or pole axis motion platform, described thimble is arranged on pole axis motion platform or linear motion platform.
7. ejector pin mechanism according to claim 4, is characterized in that, on described plane motion platform, is provided with the drive motors being connected with described driver.
8. a method of adjusting in real time ejector pin mechanism, is characterized in that, for adjusting in real time ejector pin mechanism position, makes the thimble center of ejector pin mechanism and the suction nozzle center of die bond final controlling element on a vertical vertical line, said method comprising the steps of:
A, obtain suction nozzle center image;
B, obtain the position coordinate value at suction nozzle center by calculating;
C, send the position coordinate value at described suction nozzle center to driver;
D, driver control ejector pin mechanism move, and make the suction nozzle center of thimble center and die bond final controlling element on a vertical vertical line.
9. the method for real-time adjustment ejector pin mechanism according to claim 8, is characterized in that, described position coordinate value comprises X-axis coordinate figure and the Y-axis coordinate figure that in horizontal plane, rectangular coordinate is fastened.
10. the method for real-time adjustment ejector pin mechanism according to claim 8, is characterized in that, described position coordinate value comprises polar angle and the utmost point footpath in polar coordinate system in horizontal plane.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210231232.9A CN102751218B (en) | 2012-07-05 | 2012-07-05 | Real-time regulation thimble mechanism as well as system and method thereof |
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| CN201210231232.9A CN102751218B (en) | 2012-07-05 | 2012-07-05 | Real-time regulation thimble mechanism as well as system and method thereof |
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| CN102751218B true CN102751218B (en) | 2014-09-24 |
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| CN105448780B (en) * | 2015-12-04 | 2018-02-02 | 大族激光科技产业集团股份有限公司 | Die bonder |
| CN109585355B (en) * | 2019-01-24 | 2024-07-12 | 深圳市杰普特光电股份有限公司 | Single-tube membrane stripping machine and single-tube processing system |
| CN117810154B (en) * | 2023-12-29 | 2024-09-03 | 中科长光精拓智能装备(苏州)有限公司 | Turnover tower mechanism and chip pickup method |
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