JP2013115229A - Component mounting method and component mounting system - Google Patents

Component mounting method and component mounting system Download PDF

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Publication number
JP2013115229A
JP2013115229A JP2011259948A JP2011259948A JP2013115229A JP 2013115229 A JP2013115229 A JP 2013115229A JP 2011259948 A JP2011259948 A JP 2011259948A JP 2011259948 A JP2011259948 A JP 2011259948A JP 2013115229 A JP2013115229 A JP 2013115229A
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Japan
Prior art keywords
component
substrate
mounting
suction nozzle
pin
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JP2011259948A
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Japanese (ja)
Inventor
Yasuyuki Ishitani
泰行 石谷
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Panasonic Corp
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Panasonic Corp
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Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2011259948A priority Critical patent/JP2013115229A/en
Priority to PCT/JP2012/005760 priority patent/WO2013080408A1/en
Priority to US14/361,160 priority patent/US9699945B2/en
Priority to CN201280058671.2A priority patent/CN103959932B/en
Publication of JP2013115229A publication Critical patent/JP2013115229A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting method which can prevent a component from being mounted on a substrate in an abnormal posture due to insertion pins that cannot sufficiently enter pin insertion holes, and to provide a component mounting system.SOLUTION: The component mounting method includes: a component mounting step of aligning a plurality of insertion pins 3a provided on a component 3 with a plurality of pin insertion holes 2a of a substrate 2 side, pressing the component 3 to the substrate 2 side with a suction nozzle 26, making each of the insertion pins 3a provided on the component 3 enter the corresponding pin insertion holes 2a of the substrate 2, and mounting the component 3 on the substrate 2; and a component push-in step of pressing the component 3 to the substrate 2 side again so that each of the insertion pins 3a of the component 3 is pushed in the corresponding pin insertion holes 2a of the substrate 2, after mounting the component 3 on the substrate 2.

Description

本発明は、吸着ノズルによりピン挿入型の部品を吸着して基板に装着する部品実装方法及び部品実装システムに関するものである。   The present invention relates to a component mounting method and a component mounting system in which a pin insertion type component is sucked and mounted on a substrate by a suction nozzle.

従来、下方に延びた複数の挿入ピンを備えた部品（ピン挿入型の部品）を基板に装着する部品実装装置として、部品をチャックにより挟んだうえで部品が備える複数の挿入ピンと基板側の複数のピン挿入孔との位置合わせをし、部品の挿入ピンが基板側のピン挿入孔に挿入されるように部品を基板側へ押し付けて部品の装着を行う部品実装装置が知られている（例えば、特許文献１）。このようなタイプの部品実装装置では、部品をチャックにより、しっかりと固定した状態で基板への挿入ができることから、部品を一度基板側へ押し付けただけで確実に部品を基板に装着することができる。   2. Description of the Related Art Conventionally, as a component mounting apparatus for mounting a component (a pin insertion type component) having a plurality of insertion pins extending downward to a substrate, the component is sandwiched between chucks and the component has a plurality of insertion pins and a plurality of substrate side There is known a component mounting apparatus that aligns with a pin insertion hole of the component and mounts the component by pressing the component against the substrate side so that the component insertion pin is inserted into the pin insertion hole on the substrate side (for example, Patent Document 1). In this type of component mounting device, since the component can be inserted into the board while being firmly fixed by the chuck, the component can be securely mounted on the substrate only by pressing the component to the substrate side once. .

また、近年では部品実装装置の汎用化等の観点から、部品を吸着ノズルによって吸着したうえで、部品に設けられた端子部を基板上に設けられた電極に載せるようにして部品の装着を行う部品実装装置（いわゆる表面実装装置）を用いてピン挿入型の部品の基板への装着を行うようになってきている。   Also, in recent years, from the viewpoint of generalization of component mounting apparatuses, the components are mounted by adsorbing the components with the suction nozzle and placing the terminal portions provided on the components on the electrodes provided on the substrate. 2. Description of the Related Art A pin insertion type component is mounted on a board using a component mounting device (so-called surface mounting device).

特開平４−３５４１９８号公報JP-A-4-354198

しかしながら、上記のように、ピン挿入型の部品を吸着ノズルによって吸着して基板に装着するタイプの部品実装装置では、部品に対する吸着ノズルの位置ずれが大きかった場合等、部品の基板への装着時における部品の押し込み力が全ての挿入ピンに均等に作用しなかったときには、全部又は一部の挿入ピンがピン挿入孔に十分に入り込めずに非正常な姿勢（例えば部品が基板に対して傾いた姿勢）で装着されてしまうケースが起り得た。   However, as described above, in the component mounting apparatus of the type in which the pin insertion type component is sucked by the suction nozzle and mounted on the substrate, when the position of the suction nozzle relative to the component is large, the component is mounted on the substrate. If the pushing force of the parts does not act evenly on all the insertion pins, all or some of the insertion pins do not fully enter the pin insertion holes and the posture is abnormal (for example, the parts are inclined with respect to the board). In some cases, the case may be worn in a different posture.

そこで本発明は、挿入ピンがピン挿入孔に十分に入り込めずに部品が非正常な姿勢で基板に装着されてしまうことを防止できるようにした部品実装方法及び部品実装システムを提供することを目的とする。   Therefore, the present invention provides a component mounting method and a component mounting system that can prevent a component from being mounted on a board in an abnormal posture because the insertion pin does not sufficiently enter the pin insertion hole. Objective.

請求項１に記載の部品実装方法は、下方に延びた複数の挿入ピンを有する部品を吸着ノズルによって吸着し、その吸着した部品の複数の挿入ピンが基板に設けられたピン挿入孔に挿入されるように吸着ノズルを移動させて部品の基板への装着を行う部品実装方法であって、部品が備える複数の挿入ピンと基板側の複数のピン挿入孔との位置合わせを行ったうえで吸着ノズルによって部品を基板側に押圧し、部品が備える各挿入ピンが対応する基板のピン挿入孔に入り込むようにして部品を基板に装着する部品装着工程と、部品を基板に装着した後、部品を再度基板側に押圧して部品の各挿入ピンが対応する基板のピン挿入孔に押し込まれるようにする部品押し込み工程とを含む。   In the component mounting method according to claim 1, a component having a plurality of insertion pins extending downward is sucked by a suction nozzle, and the plurality of insertion pins of the sucked component are inserted into pin insertion holes provided on the substrate. The component mounting method is to mount the component on the board by moving the suction nozzle so that the plurality of insertion pins included in the component are aligned with the plurality of pin insertion holes on the board side. The component is pressed to the board side, and the component mounting process for mounting the component on the board so that each insertion pin of the component enters the corresponding board pin insertion hole, and after mounting the component on the board, And a component pushing process in which each insertion pin of the component is pushed into the corresponding pin insertion hole of the substrate by pressing toward the board side.

請求項２に記載の部品実装方法は、請求項１に記載の部品実装方法であって、前記部品押し込み工程において押圧する部品上の位置は、部品装着工程において吸着ノズルが部品を吸着していた位置とは異なる。   The component mounting method according to claim 2 is the component mounting method according to claim 1, wherein a position on the component to be pressed in the component pressing step is picked up by the suction nozzle in the component mounting step. Different from position.

請求項３に記載の部品実装方法は、請求項１又は２に記載の部品実装方法であって、前記部品押し込み工程を、前記部品装着工程で用いた吸着ノズルで実行する。   A component mounting method according to a third aspect is the component mounting method according to the first or second aspect, wherein the component pushing-in step is executed by the suction nozzle used in the component mounting step.

請求項４に記載の部品実装方法は、請求項１又は２に記載の部品実装方法であって、前記部品押し込み工程を、前記部品装着工程で用いた吸着ノズル以外の吸着ノズルで実行する。   A component mounting method according to a fourth aspect is the component mounting method according to the first or second aspect, wherein the component pushing step is executed by a suction nozzle other than the suction nozzle used in the component mounting step.

請求項５に記載の部品実装方法は、請求項１乃至４の何れかに記載の部品実装方法であって、前記部品装着工程の後、基板に対する部品の装着姿勢の検査を行う検査工程を実行し、前記部品押し込み工程を、前記検査工程で基板に対する装着姿勢が非正常であると判断された部品についてのみ実行する。   The component mounting method according to claim 5 is the component mounting method according to any one of claims 1 to 4, wherein after the component mounting step, an inspection step of inspecting a mounting posture of the component on the board is executed. Then, the component pushing process is executed only for components for which the mounting posture with respect to the substrate is determined to be abnormal in the inspection step.

請求項６に記載の部品実装システムは、下方に延びた複数の挿入ピンを有する部品を吸着ノズルによって吸着し、その吸着した部品の複数の挿入ピンが基板に設けられたピン挿入孔に挿入されるように吸着ノズルを作動させて部品の基板への装着を行う装着ヘッドと、部品が備える複数の挿入ピンと基板側の複数のピン挿入孔との位置合わせを行ったうえで吸着ノズルによって部品を基板側に押圧し、部品が備える各挿入ピンが対応する基板のピン挿入孔に入り込むようにして部品を基板に装着した後、その部品を基板に装着した吸着ノズル又はその吸着ノズル以外の吸着ノズルにより部品を再度基板側に押圧して部品の各挿入ピンが対応する基板のピン挿入孔に押し込まれるように装着ヘッドを作動させる装着ヘッド作動制御手段とを備えた。   In the component mounting system according to claim 6, a component having a plurality of insertion pins extending downward is adsorbed by an adsorption nozzle, and the plurality of insertion pins of the adsorbed component are inserted into pin insertion holes provided on the substrate. After aligning the mounting head that operates the suction nozzle so that the component is mounted on the substrate and the plurality of insertion pins provided on the component and the plurality of pin insertion holes on the substrate, the component is removed by the suction nozzle. After the component is mounted on the substrate so that each insertion pin included in the component enters the corresponding pin insertion hole of the substrate by pressing toward the substrate side, the suction nozzle that mounts the component on the substrate or a suction nozzle other than the suction nozzle And a mounting head operation control means for operating the mounting head so that each component insertion pin is pressed into the corresponding pin insertion hole of the substrate by pressing the component again to the board side by .

本発明では、部品を基板に装着した後、部品を再度基板側に押圧することで部品の各挿入ピンが基板のピン挿入孔内に押し込まれるようにしており、最初の部品の押圧時（部品装着工程）においてピン挿入孔に十分に入り込ませることができなかった挿入ピンがあった場合であっても、その挿入ピンを次の部品の押圧時（部品押し込み工程）にはピン挿入孔に十分に入り込ませることができるので、部品が非正常な姿勢で基板に装着されてしまうことを防止することができる。   In the present invention, after the component is mounted on the substrate, each component insertion pin is pressed into the pin insertion hole of the substrate by pressing the component again toward the substrate side. Even if there is an insertion pin that could not fully enter the pin insertion hole in the mounting process), the insertion pin is sufficient for the pin insertion hole when the next part is pressed (part pushing process). Therefore, it is possible to prevent the component from being mounted on the board in an abnormal posture.

本発明の一実施の形態における部品実装システムの構成図The block diagram of the component mounting system in one embodiment of this invention 本発明の一実施の形態における基板と部品の斜視図The perspective view of the board | substrate and components in one embodiment of this invention （ａ）（ｂ）（ｃ）本発明の一実施の形態における部品押し込みパターンの例を示す図(A) (b) (c) The figure which shows the example of the component pushing pattern in one embodiment of this invention （ａ）（ｂ）（ｃ）本発明の一実施の形態における部品押し込みパターンの例を示す図(A) (b) (c) The figure which shows the example of the component pushing pattern in one embodiment of this invention （ａ）〜（ｆ）本発明の一実施の形態における部品押し込みパターンの例を示す図(A)-(f) The figure which shows the example of the component pushing pattern in one embodiment of this invention

以下、図面を参照して本発明の実施の形態について説明する。図１において部品実装システム１は、基板２に部品３を装着する第１の部品実装装置１１、第１の部品実装装置１１によって部品３が装着された基板２の検査を行う検査装置１２及び検査装置１２によって検査が行われた基板２に部品３を装着する第２の部品実装装置１３が基板２の搬送方向（Ｘ軸方向とする）にこの順で並んで成り、これら第１の部品実装装置１１、検査装置１２及び第２の部品実装装置１３が共通の制御装置４により制御されるようになっている。   Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, a component mounting system 1 includes a first component mounting device 11 that mounts a component 3 on a substrate 2, an inspection device 12 that inspects the substrate 2 on which the component 3 is mounted by the first component mounting device 11, and an inspection. A second component mounting apparatus 13 for mounting the component 3 on the board 2 inspected by the apparatus 12 is arranged in this order in the transport direction (X-axis direction) of the board 2, and these first component mounting The apparatus 11, the inspection apparatus 12, and the second component mounting apparatus 13 are controlled by a common control apparatus 4.

第１の部品実装装置１１は、基台２１上に基板２の搬送及び所定位置への位置決めを行うコンベア２２、コンベア２２の側方に設けられて部品３の供給を行うトレイフィーダ等の部品供給部２３及び直交座標系ロボット等から成るヘッド移動機構２４を備え、ヘッド移動機構２４によって装着ヘッド２５が移動されるようになっている。装着ヘッド２５は下方延びて昇降及び上下軸回りの回転が自在な複数の吸着ノズル２６を備えており、装着ヘッド２５には撮像視野を下方に向けた基板カメラ２７が設けられている。また、基台２１上のコンベア２２と部品供給部２３との間には撮像視野を上方に向けた部品カメラ２８が設けられている。   The first component mounting apparatus 11 is configured to supply components such as a conveyor 22 that conveys the substrate 2 on the base 21 and positions the substrate 2 at a predetermined position, and a tray feeder that is provided on the side of the conveyor 22 and supplies components 3. The head moving mechanism 24 including a unit 23 and a Cartesian coordinate system robot is provided, and the mounting head 25 is moved by the head moving mechanism 24. The mounting head 25 is provided with a plurality of suction nozzles 26 that extend downward and can freely move up and down and rotate around a vertical axis. The mounting head 25 is provided with a substrate camera 27 with the imaging field of view facing downward. In addition, a component camera 28 is provided between the conveyor 22 on the base 21 and the component supply unit 23 with the imaging field of view facing upward.

図１において、制御装置４は、コンベア２２の作動制御を行って基板２の搬送及び位置決めを行い、ヘッド移動機構２４の作動制御を行って装着ヘッド２５及び基板カメラ２７を水平面内で移動させる。また、制御装置４は、装着ヘッド２５における各吸着ノズル２６の昇降及び上下軸回りの回転作動制御と各吸着ノズル２６による部品供給部２３からの部品３の吸着作動制御を行い、基板カメラ２７による基板２の撮像動作と部品カメラ２８による装着ヘッド２５（吸着ノズル２６）により吸着された部品３の撮像動作の制御を行う。基板カメラ２７の撮像動作によって得られた画像データ及び部品カメラ２８の撮像動作によって得られた画像データはともに制御装置４に送られ、制御装置４はこれらの画像データに基づく画像認識処理を行う。   In FIG. 1, the control device 4 controls the operation of the conveyor 22 to carry and position the substrate 2, and controls the operation of the head moving mechanism 24 to move the mounting head 25 and the substrate camera 27 in the horizontal plane. Further, the control device 4 controls the lifting and lowering of each suction nozzle 26 in the mounting head 25 and the rotation operation around the vertical axis and the suction operation control of the component 3 from the component supply unit 23 by each suction nozzle 26. The imaging operation of the substrate 2 and the imaging operation of the component 3 sucked by the mounting head 25 (suction nozzle 26) by the component camera 28 are controlled. Both the image data obtained by the imaging operation of the board camera 27 and the image data obtained by the imaging operation of the component camera 28 are sent to the control device 4, and the control device 4 performs image recognition processing based on these image data.

図２において、部品３は下面から下方に延びた複数の挿入ピン３ａを有したピン挿入型の部品から成り、基板２には各部品３に対応してその部品３が備える挿入ピン３ａが挿入される複数のピン挿入孔２ａが設けられている。このため、部品３に設けられた各挿入ピン３ａが対応する基板２のピン挿入孔２ａの上方に位置するようにした状態で部品３を基板２に対して相対的に下降させれば、各挿入ピン３ａを対応するピン挿入孔２ａ内に入り込ませることができる。   In FIG. 2, the component 3 is composed of a pin insertion type component having a plurality of insertion pins 3 a extending downward from the lower surface, and an insertion pin 3 a included in the component 3 corresponding to each component 3 is inserted into the substrate 2. A plurality of pin insertion holes 2a are provided. For this reason, if the component 3 is lowered relative to the substrate 2 in a state where each insertion pin 3a provided in the component 3 is positioned above the corresponding pin insertion hole 2a of the substrate 2, The insertion pin 3a can be inserted into the corresponding pin insertion hole 2a.

次に、第１の部品実装装置１１により基板２に部品３を装着する部品実装作業の実行手順を説明する。この部品実装作業では、制御装置４は先ず、コンベア２２を作動させることにより、図示しない上流工程側の他の装置から送られてきた基板２を受け取って搬入し、所定の作業位置（図１に示す位置）に位置決めする。そして、ヘッド移動機構２４の作動制御を行って、装着ヘッド２５を部品供給部２３の上方に移動させ、吸着ノズル２６によって部品３を真空吸着して部品３の吸着（ピックアップ）を行う（部品吸着工程）。   Next, an execution procedure of a component mounting operation for mounting the component 3 on the board 2 by the first component mounting apparatus 11 will be described. In this component mounting operation, first, the control device 4 operates the conveyor 22 to receive and carry in the board 2 sent from another device on the upstream process side (not shown), and at a predetermined work position (see FIG. 1). Position). Then, the operation control of the head moving mechanism 24 is performed, the mounting head 25 is moved above the component supply unit 23, and the component 3 is vacuum-sucked by the suction nozzle 26 to suck (pick up) the component 3 (component suction). Process).

制御装置４は、吸着ノズル２６による部品３の吸着を行ったら、ヘッド移動機構２４を作動させ、吸着ノズル２６によって吸着した部品３が部品カメラ２８の上方を通過するように装着ヘッド２５を移動させつつ、その部品３を部品カメラ２８により下方から撮像させ、得られた画像に基づいて、部品３が備える複数の挿入ピン３ａそれぞれの位置を検出する（挿入ピン位置検出工程）。   When the control device 4 performs suction of the component 3 by the suction nozzle 26, the head moving mechanism 24 is operated to move the mounting head 25 so that the component 3 sucked by the suction nozzle 26 passes above the component camera 28. On the other hand, the component 3 is imaged from below by the component camera 28, and the positions of the plurality of insertion pins 3a included in the component 3 are detected based on the obtained image (insertion pin position detection step).

制御装置４は、部品３が備える複数の挿入ピン３ａそれぞれの位置を検出したら、コンベア２２により位置決めした基板２の上方に装着ヘッド２５を移動させる。そして、基板カメラ２７により、これから部品３の装着を行おうとしている基板２上の領域を上方から撮像し、得られた画像に基づいて、部品３の挿入ピン３ａが挿入される各ピン挿入孔２ａの位置を検出する（ピン挿入孔位置検出工程）。   When detecting the position of each of the plurality of insertion pins 3 a included in the component 3, the control device 4 moves the mounting head 25 above the substrate 2 positioned by the conveyor 22. Then, the board camera 27 images from above the area on the board 2 on which the component 3 is to be mounted, and each pin insertion hole into which the insertion pin 3a of the part 3 is inserted based on the obtained image. The position of 2a is detected (pin insertion hole position detection step).

制御装置４は、基板２の各ピン挿入孔２ａの位置を検出したら、挿入ピン位置検出工程で検出した各挿入ピン３ａの位置とピン挿入孔位置検出工程で検出した各ピン挿入孔２ａの位置とに基づいて、各挿入ピン３ａがそれぞれ対応するピン挿入孔２ａの直上に位置するように（対応する挿入ピン３ａとピン挿入孔２ａが上下に合致するように）装着ヘッド２５を移動させたうえで吸着ノズル２６を下降させ、部品３の各挿入ピン３ａが対応する基板２のピン挿入孔２ａに上方から挿入されるようにして、部品３を基板２に装着する（部品装着工程）。   When the controller 4 detects the position of each pin insertion hole 2a of the substrate 2, the position of each insertion pin 3a detected in the insertion pin position detection step and the position of each pin insertion hole 2a detected in the pin insertion hole position detection step Based on the above, the mounting head 25 is moved so that each insertion pin 3a is positioned immediately above the corresponding pin insertion hole 2a (so that the corresponding insertion pin 3a and the pin insertion hole 2a are aligned vertically). Then, the suction nozzle 26 is lowered, and the component 3 is mounted on the substrate 2 so that each insertion pin 3a of the component 3 is inserted into the corresponding pin insertion hole 2a of the substrate 2 from above (component mounting step).

制御装置４は、部品３を基板２に装着し、吸着ノズル２６の下端が部品３から上方に離間するように吸着ノズル２６を装着ヘッド２５に対して上昇させたら、装着ヘッド２５を微小量水平移動させたうえで、吸着ノズル２６によって部品３を再度基板２側に押圧する（部品押し込み工程）。これにより部品３の各挿入ピン３ａが対応する基板２のピン挿入孔２ａに改めて押し込まれるので、最初の部品３の押圧時（部品装着工程）においてピン挿入孔２ａに十分に入り込ませることができなかった挿入ピン３ａがあった場合であっても、その挿入ピン３ａを次の部品の押圧時（部品押し込み工程）にピン挿入孔２ａに十分に入り込ませることができる。   When the control device 4 mounts the component 3 on the substrate 2 and raises the suction nozzle 26 with respect to the mounting head 25 so that the lower end of the suction nozzle 26 is separated from the component 3 upward, the control device 4 moves the mounting head 25 by a minute amount. After the movement, the component 3 is pressed again to the substrate 2 side by the suction nozzle 26 (component pushing step). As a result, each insertion pin 3a of the component 3 is pushed again into the corresponding pin insertion hole 2a of the board 2, so that it can sufficiently enter the pin insertion hole 2a when the component 3 is first pressed (component mounting step). Even when there is a missing insertion pin 3a, the insertion pin 3a can sufficiently enter the pin insertion hole 2a when the next component is pressed (component pushing step).

なお、この部品押し込み工程における部品３の押圧パターンとしては、例えば、図３（ａ）→（ｂ）→（ｃ）のように、吸着ノズル２６によって部品３を吸着していた位置と同一の部品３上の位置を吸着ノズル２６によって再度押圧するパターンや、図４（ａ）→（ｂ）→（ｃ）のように、吸着ノズル２６によって部品３を吸着していた位置とは異なる部品３上の位置を吸着ノズル２６によって再度押圧するパターン等があり、これらのパターンを単独或いは複合（連続）して行う。前者のパターンでは部品３が備える全部の挿入ピン３ａのピン挿入孔２ａへの入り込み量が不十分であった場合（この場合、図３（ａ）に示すように部品３は基板２に対して傾いた姿勢となっていない）に、再度同一の位置を押し込むことで部品３を基板２にしっかりと装着することができる。一方、後者のパターンでは、部品３が備える一部の挿入ピン３ａのピン挿入孔２ａへの入り込み量が不十分であった場合（この場合、図４（ａ）に示すように部品３は基板２に対して傾いた姿勢となっている）に、部品３の装着姿勢を正常なものとすることができる。   In addition, as a pressing pattern of the component 3 in this component pushing-in process, for example, the same component as the position where the component 3 is sucked by the suction nozzle 26 as shown in FIGS. 3 on the part 3 that is different from the position where the part 3 is sucked by the suction nozzle 26 as shown in FIG. 4A → (b) → (c). The pattern is pressed again by the suction nozzle 26, and these patterns are performed individually or in combination (continuous). In the former pattern, when the amount of insertion of all the insertion pins 3a included in the component 3 into the pin insertion hole 2a is insufficient (in this case, the component 3 is located on the substrate 2 as shown in FIG. 3A). The component 3 can be firmly attached to the board 2 by pushing the same position again into the inclined position). On the other hand, in the latter pattern, when the insertion amount of some insertion pins 3a included in the component 3 into the pin insertion hole 2a is insufficient (in this case, the component 3 is a substrate as shown in FIG. 4A). 2), the mounting posture of the component 3 can be made normal.

また、吸着ノズル２６によって部品３を吸着していた位置とは異なる部品３上の位置を吸着ノズル２６によって再度押圧する後者のパターンとして、部品３上の複数の異なる位置を吸着ノズル２６によって押圧するようにしてもよい。この場合、部品３の傾き姿勢が不明である場合にも対応できるよう、図５（ａ）→（ｂ）→（ｃ）→（ｄ）→（ｅ）→（ｆ）のように部品３の四隅をそれぞれ押圧するパターンのほか、部品３の四辺それぞれの中間部を押圧するパターンが考えられる。   Further, a plurality of different positions on the component 3 are pressed by the suction nozzle 26 as the latter pattern in which the position on the component 3 different from the position where the component 3 is sucked by the suction nozzle 26 is pressed again by the suction nozzle 26. You may do it. In this case, in order to cope with the case where the inclination posture of the component 3 is unknown, the component 3 is changed as shown in FIG. 5A → (b) → (c) → (d) → (e) → (f). In addition to the pattern of pressing the four corners, a pattern of pressing the middle part of each of the four sides of the component 3 can be considered.

制御装置４は、部品３の基板２への装着の後、その部品３を再度基板２に押圧して押し込んだら、現在、部品３の装着を行っている基板２に装着すべき全ての部品３の装着が終了したかどうかの判断を行う（判断工程）。その結果、現在、部品３の装着を行っている基板２に装着すべき全ての部品３の装着が終了していなかった場合には、前述の部品吸着工程に戻って新たに部品３の吸着を行い、現在、部品３の装着を行っている基板２に装着すべき全ての部品３の装着が終了していた場合には、基板２への部品実装作業を終了して基板２を下流工程側の検査装置１２に搬出する。   After the component 3 is mounted on the substrate 2, the control device 4 presses and pushes the component 3 against the substrate 2 again, and then all the components 3 to be mounted on the substrate 2 on which the component 3 is currently mounted. Judgment is made as to whether or not the mounting of the device is finished (determination step). As a result, if the mounting of all the components 3 to be mounted on the board 2 on which the components 3 are currently mounted has not been completed, the process returns to the component suction step described above to newly suck the components 3. If all the components 3 to be mounted on the substrate 2 on which the component 3 is currently mounted have been mounted, the component mounting operation on the substrate 2 is terminated and the substrate 2 is moved to the downstream process side. To the inspection device 12.

図１において、検査装置１２は、制御装置４からの作動制御によって、第１の部品実装装置１１から搬出された基板２を基台３１上に設けられたコンベア３２によって受け取って所定の作業位置に位置決めし、基台３１上に設けられた直交座標系ロボット等から成るカメラ移動機構３３によって撮像視野を下方に向けた検査カメラ３４を水平面内で移動させて、基板２に対する部品３の装着姿勢の検査を行う（検査工程）。検査装置１２は、検査工程が終了したら、コンベア３２を作動させて基板２を下流工程側の第２の部品実装装置１３に搬出する。   In FIG. 1, the inspection device 12 receives the board 2 carried out from the first component mounting device 11 by the conveyor 32 provided on the base 31 by the operation control from the control device 4 and puts it in a predetermined work position. Positioning and moving the inspection camera 34 with the imaging field of view downward in a horizontal plane by a camera moving mechanism 33 comprising a Cartesian coordinate system robot or the like provided on the base 31, the mounting posture of the component 3 with respect to the substrate 2 is changed. Inspect (inspection process). When the inspection process is completed, the inspection apparatus 12 operates the conveyor 32 to carry the board 2 to the second component mounting apparatus 13 on the downstream process side.

図１において、第２の部品実装装置１３の構成は第１の部品実装装置１１の構成と同様であり、したがって、第１の部品実装装置１１と同様の構成要素については第１の部品実装装置１１の説明で使用した符号を付してある。第２の部品実装装置１３は、検査装置１２から搬出された基板２について、第２の部品実装装置１３に割り当てられた（第１の部品実装装置１１が装着しなかった基板２上の箇所への）部品３の装着作業を実行し、部品装着作業が終了したら、コンベア２２によって図示しない下流工程側の他の装置へ基板２を搬出する。   In FIG. 1, the configuration of the second component mounting apparatus 13 is the same as that of the first component mounting apparatus 11, and therefore the same components as those of the first component mounting apparatus 11 are the first component mounting apparatus. Reference numerals used in the description of 11 are given. The second component mounting apparatus 13 is assigned to the second component mounting apparatus 13 for the board 2 carried out from the inspection apparatus 12 (to the place on the board 2 where the first component mounting apparatus 11 is not mounted). The mounting operation of the component 3 is executed, and when the component mounting operation is completed, the substrate 2 is unloaded by the conveyor 22 to another apparatus on the downstream process side (not shown).

このように、本実施の形態における部品実装システム１は、下方に延びた複数の挿入ピン３ａを有する部品３を吸着ノズル２６によって吸着し、その吸着した部品３の複数の挿入ピン３ａが基板２に設けられたピン挿入孔２ａに挿入されるように吸着ノズル２６を作動させて部品３の基板２への装着を行う装着ヘッド２５と、部品３が備える複数の挿入ピン３ａと基板２側の複数のピン挿入孔２ａとの位置合わせを行ったうえで吸着ノズル２６によって部品３を基板２側に押圧し、部品３が備える各挿入ピン３ａが対応する基板２のピン挿入孔２ａに入り込むようにして部品３を基板２に装着した後、吸着ノズル２６により部品３を再度基板２側に押圧して部品３の各挿入ピン３ａが対応する基板２のピン挿入孔２ａに押し込まれるように装着ヘッド２５を作動させる装着ヘッド作動制御手段としての制御装置４を備えたものとなっている。   As described above, in the component mounting system 1 according to the present embodiment, the component 3 having the plurality of insertion pins 3 a extending downward is sucked by the suction nozzle 26, and the plurality of insertion pins 3 a of the sucked component 3 are replaced by the substrate 2. A mounting head 25 for mounting the component 3 on the substrate 2 by operating the suction nozzle 26 so that the suction nozzle 26 is inserted into the pin insertion hole 2a provided on the component 3, and a plurality of insertion pins 3a provided on the component 3 and the substrate 2 side After aligning with the plurality of pin insertion holes 2a, the component 3 is pressed toward the substrate 2 by the suction nozzle 26 so that each insertion pin 3a included in the component 3 enters the pin insertion hole 2a of the corresponding substrate 2. After mounting the component 3 on the substrate 2, the component 3 is again pressed against the substrate 2 by the suction nozzle 26 so that each insertion pin 3a of the component 3 is pushed into the corresponding pin insertion hole 2a of the substrate 2. It has become one with the control device 4 as a mounting head actuation control means for actuating the head 25.

また、本実施の形態における部品実装システム１による部品実装方法は、部品３が備える複数の挿入ピン３ａと基板２側の複数のピン挿入孔２ａとの位置合わせを行ったうえで吸着ノズル２６によって部品３を基板２側に押圧し、部品３が備える各挿入ピン３ａが対応する基板２のピン挿入孔２ａに入り込むようにして部品３を基板２に装着する工程（部品装着工程）と、部品３を基板２に装着した後、部品３を再度基板２側に押圧して部品３の各挿入ピン３ａが対応する基板２のピン挿入孔２ａに押し込まれるようにする工程（部品押し込み工程）を含むものとなっている。   In addition, the component mounting method by the component mounting system 1 in the present embodiment is performed by the suction nozzle 26 after aligning the plurality of insertion pins 3a included in the component 3 and the plurality of pin insertion holes 2a on the board 2 side. A step of mounting the component 3 on the substrate 2 by pressing the component 3 toward the substrate 2 so that each insertion pin 3a included in the component 3 enters the pin insertion hole 2a of the corresponding substrate 2 (component mounting step); After mounting 3 on the substrate 2, the component 3 is pressed again to the substrate 2 side so that each insertion pin 3a of the component 3 is pushed into the corresponding pin insertion hole 2a of the substrate 2 (component pushing step). It is included.

このように、本実施の形態における部品実装システム１及び部品実装方法では、部品３を基板２に装着した後、部品３を再度基板２側に押圧することで部品３の各挿入ピン３ａが基板２のピン挿入孔２ａ内に押し込まれるようにしており、最初の部品３の押圧時（部品装着工程）においてピン挿入孔２ａに十分に入り込ませることができなかった挿入ピン３ａがあった場合であっても、その挿入ピン３ａを次の部品３の押圧時（部品押し込み工程）にはピン挿入孔２ａに十分に入り込ませることができるので、部品３が非正常な姿勢で基板２に装着されてしまうことを防止することができる。   As described above, in the component mounting system 1 and the component mounting method according to the present embodiment, after the component 3 is mounted on the substrate 2, the component 3 is pressed again toward the substrate 2 so that the insertion pins 3a of the component 3 are connected to the substrate. In the case where there is an insertion pin 3a that cannot be sufficiently inserted into the pin insertion hole 2a when the first component 3 is pressed (component mounting step). Even in such a case, the insertion pin 3a can be sufficiently inserted into the pin insertion hole 2a when the next component 3 is pressed (component pressing step), so that the component 3 is mounted on the board 2 in an abnormal posture. Can be prevented.

なお、上述の実施の形態では、第１の部品実装装置１１によって部品装着工程を行った後、同じ第１の部品実装装置１１によって部品押し込み工程を行うようになっていたが、第１の部品実装装置１１によって部品装着工程を行った後、その下流工程側の第２の部品実装装置１３によって部品押し込み工程を行うようにしてもよい。すなわち、部品押し込み工程は、部品実装工程で用いた吸着ノズル（第１の部品実装装置１１が備える吸着ノズル２６）で実行するほか、部品実装工程で用いた吸着ノズル以外の吸着ノズル（第２の部品実装装置１３が備える吸着ノズル２６）で実行することができる。下流工程側の装置はここでは吸着ノズルを備えた部品実装装置（第２の部品実装装置１３）であるが、吸着ノズルを備えない他の装置が吸着ノズル以外の押圧手段で部品押圧工程を行うようにしてもよい。また、第１の部品実装装置１１によって部品装着工程を行った後、その下流工程側の第２の部品実装装置１３によって部品押し込み工程を行う場合には、検査装置１２による検査工程によって基板２に対する装着姿勢が非正常であると判断された部品３についてのみ、部品３の非正常な姿勢を矯正し得る箇所を押圧するようにしてもよい。   In the above-described embodiment, after the component mounting process is performed by the first component mounting apparatus 11, the component pushing process is performed by the same first component mounting apparatus 11. After the component mounting process is performed by the mounting apparatus 11, the component pushing process may be performed by the second component mounting apparatus 13 on the downstream process side. That is, the component pushing-in process is executed by the suction nozzle (the suction nozzle 26 provided in the first component mounting apparatus 11) used in the component mounting process, and the suction nozzles (second second) other than the suction nozzle used in the component mounting process. It can be executed by the suction nozzle 26) provided in the component mounting apparatus 13. The apparatus on the downstream process side is a component mounting apparatus (second component mounting apparatus 13) provided with a suction nozzle here, but another apparatus that does not include the suction nozzle performs a component pressing process with a pressing means other than the suction nozzle. You may do it. Further, after the component mounting process is performed by the first component mounting apparatus 11, when the component pushing process is performed by the second component mounting apparatus 13 on the downstream process side, the inspection process by the inspection apparatus 12 is performed on the substrate 2. Only a part 3 for which the mounting posture is determined to be abnormal may be pressed at a location where the abnormal posture of the component 3 can be corrected.

挿入ピンがピン挿入孔に十分に入り込めずに部品が非正常な姿勢で基板に装着されてしまうことを防止できるようにした部品実装方法及び部品実装システムを提供する。   Provided are a component mounting method and a component mounting system which can prevent a component from being mounted on a substrate in an abnormal posture because an insertion pin does not sufficiently enter a pin insertion hole.

１ 部品実装システム
２ 基板
２ａ ピン挿入孔
３ 部品
３ａ 挿入ピン
４ 制御装置（装着ヘッド作動制御手段）
２５ 装着ヘッド
２６ 吸着ノズル DESCRIPTION OF SYMBOLS 1 Component mounting system 2 Board | substrate 2a Pin insertion hole 3 Component 3a Insertion pin 4 Control apparatus (mounting head operation control means)
25 Mounting head 26 Suction nozzle

Claims (6)

下方に延びた複数の挿入ピンを有する部品を吸着ノズルによって吸着し、その吸着した部品の複数の挿入ピンが基板に設けられたピン挿入孔に挿入されるように吸着ノズルを移動させて部品の基板への装着を行う部品実装方法であって、
部品が備える複数の挿入ピンと基板側の複数のピン挿入孔との位置合わせを行ったうえで吸着ノズルによって部品を基板側に押圧し、部品が備える各挿入ピンが対応する基板のピン挿入孔に入り込むようにして部品を基板に装着する部品装着工程と、
部品を基板に装着した後、部品を再度基板側に押圧して部品の各挿入ピンが対応する基板のピン挿入孔に押し込まれるようにする部品押し込み工程とを含むことを特徴とする部品実装方法。 A component having a plurality of insertion pins extending downward is adsorbed by an adsorption nozzle, and the adsorption nozzle is moved so that the plurality of insertion pins of the adsorbed component are inserted into pin insertion holes provided in the substrate. A component mounting method for mounting on a board,
After aligning the plurality of insertion pins included in the component and the plurality of pin insertion holes on the board side, the component is pressed against the board side by the suction nozzle, and each insertion pin included in the component is inserted into the corresponding pin insertion hole of the board. A component mounting process for mounting the component on the board as if entering,
A component mounting method comprising: a component pressing step of pressing a component again to the substrate side after the component is mounted on the substrate so that each insertion pin of the component is pressed into a corresponding pin insertion hole of the substrate . 前記部品押し込み工程において押圧する部品上の位置は、部品装着工程において吸着ノズルが部品を吸着していた位置とは異なることを特徴とする請求項１に記載の部品実装方法。   The component mounting method according to claim 1, wherein a position on the component to be pressed in the component pushing step is different from a position at which the suction nozzle is sucking the component in the component mounting step. 前記部品押し込み工程を、前記部品装着工程で用いた吸着ノズルで実行することを特徴とする請求項１又は２に記載の部品実装方法。   The component mounting method according to claim 1, wherein the component pushing-in process is executed by a suction nozzle used in the component mounting process. 前記部品押し込み工程を、前記部品装着工程で用いた吸着ノズル以外の吸着ノズルで実行することを特徴とする請求項１又は２に記載の部品実装方法。   The component mounting method according to claim 1, wherein the component pushing step is executed by a suction nozzle other than the suction nozzle used in the component mounting step. 前記部品装着工程の後、基板に対する部品の装着姿勢の検査を行う検査工程を実行し、前記部品押し込み工程を、前記検査工程で基板に対する装着姿勢が非正常であると判断された部品についてのみ実行することを特徴とする請求項１乃至４の何れかに記載の部品実装方法。   After the component mounting step, an inspection step for inspecting the mounting posture of the component with respect to the board is executed, and the component pushing step is executed only for components for which the mounting posture with respect to the board is determined to be abnormal in the inspection step. The component mounting method according to claim 1, wherein the component mounting method is a component mounting method. 下方に延びた複数の挿入ピンを有する部品を吸着ノズルによって吸着し、その吸着した部品の複数の挿入ピンが基板に設けられたピン挿入孔に挿入されるように吸着ノズルを作動させて部品の基板への装着を行う装着ヘッドと、
部品が備える複数の挿入ピンと基板側の複数のピン挿入孔との位置合わせを行ったうえで吸着ノズルによって部品を基板側に押圧し、部品が備える各挿入ピンが対応する基板のピン挿入孔に入り込むようにして部品を基板に装着した後、その部品を基板に装着した吸着ノズル又はその吸着ノズル以外の吸着ノズルにより部品を再度基板側に押圧して部品の各挿入ピンが対応する基板のピン挿入孔に押し込まれるように装着ヘッドを作動させる装着ヘッド作動制御手段とを備えたことを特徴とする部品実装システム。 A component having a plurality of insertion pins extending downward is sucked by a suction nozzle, and the suction nozzle is operated so that the plurality of insertion pins of the sucked component are inserted into pin insertion holes provided on the substrate. A mounting head for mounting on a substrate;
After aligning the plurality of insertion pins included in the component and the plurality of pin insertion holes on the board side, the component is pressed against the board side by the suction nozzle, and each insertion pin included in the component is inserted into the corresponding pin insertion hole of the board. After the component is mounted on the board so as to enter, the component is pressed again to the board side by the suction nozzle that mounted the component on the substrate or a suction nozzle other than the suction nozzle, and each insertion pin of the component corresponds to the corresponding pin of the board A component mounting system comprising: mounting head operation control means for operating the mounting head to be pushed into the insertion hole.
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