JP5830650B2 - Component mounting method and component mounting apparatus - Google Patents

Description

  The present invention relates to a component mounting method and a component mounting apparatus for mounting a component on a substrate.

  As a form of mounting an electronic component such as a semiconductor element on a substrate, the solder bump formed on the lower surface of the electronic component is landed on the electrode on the substrate, and then the solder bump is heated and melted by a reflow device to A component mounting method is known in which a substrate is soldered. In such a component mounting method, when solder bonding is performed with the surface of the electrode oxidized, the molten solder is difficult to spread evenly and may cause poor bonding. Therefore, flux or solder paste may be used to prevent this. A paste transfer part for forming a solder bonding auxiliary agent (hereinafter referred to as “paste”) such as a predetermined film thickness is provided in the apparatus, and a solder bump is brought into contact with the paste film formed in the paste transfer part from above. After the paste is transferred, solder bumps are landed on the electrodes of the substrate to perform solder bonding.

  In this way, in a component mounting apparatus that transfers a paste to a solder bump and mounts the component on the substrate, it is inspected whether or not the paste is securely attached to the solder bump before mounting the component on the substrate. It has become. As the inspection method, the lower surface of the solder bump (contact point with the electrode) is imaged by an imaging device such as a CCD camera in a state in which the illumination light is irradiated onto the solder bump from below, and the lower surface of the solder bump obtained thereby. A method for inspecting the adhesion state of the paste based on the image is known (for example, Patent Document 1).

JP 2003-60398 A

  However, in the above-described conventional method, when a paste having a transparent color is used, the following problems occur. That is, since the transparent paste has a low light absorptivity and transmits light, most of the light that was absorbed by the non-transparent paste is reflected without being absorbed. Therefore, in the captured image of the lower surface of the solder bump to which the transparent paste is attached, the solder bump and the paste are represented by substantially the same luminance level, and the two cannot be clearly distinguished. There was a problem that it was difficult to judge.

  Therefore, the present invention provides a component mounting method and a component mounting that can accurately determine whether or not the paste is attached to the bump even when a paste having a transparent color is used as the paste attached to the bump of the component. An object is to provide an apparatus.

  In the component mounting method according to the first aspect of the present invention, the component having the bump on the lower surface is taken out from the component supply unit by the component holding member and the paste is attached to the bump, and then the component is illuminated by the illumination means. A component mounting method using a component mounting apparatus that mounts a component on a board after imaging from below by an imaging means to determine the state of paste adhesion to the bump, and in which the paste is not adhered to the bump When the component is imaged from below by the imaging unit with the illumination unit illuminated, the height of the component at which the luminance level at the center of the lower surface of the bump is lower than the luminance level at the outer edge of the lower surface of the bump A reference height acquisition process for acquiring the reference height as a reference height, and a paste for attaching the paste to the bumps of the component taken out from the component supply unit by the component holding member. A strike attachment step, a reference height alignment step of aligning the component that has undergone the paste attachment step with the reference height in a state of being illuminated by the illumination means, and a component that is aligned with the reference height An imaging step of imaging from below, and a determination step of determining the paste adhesion state based on the luminance level of the central portion of the lower surface of the bump obtained by imaging by the imaging step.

  The component mounting method according to a second aspect of the present invention is the component mounting method according to the first aspect, wherein the determination in the determination step is a lower surface of a bump in an image obtained by imaging in the imaging step. The brightness level of the central portion is compared with the brightness level of the outer edge of the lower surface of the bump in the image obtained by imaging in the imaging step.

  The component mounting method according to claim 3 of the present invention is the component mounting method according to claim 1, wherein the determination in the determination step is a lower surface of a bump in an image obtained by imaging in the imaging step. The brightness level of the center is compared with the brightness level of the center of the lower surface of the bump in the image obtained when the part positioned at the reference height in the reference height acquisition step is imaged from below by the imaging means. Do it.

  In the component mounting apparatus according to claim 4 of the present invention, after the component having the bump on the lower surface is taken out from the component supply unit by the component holding member and the paste is attached to the bump, the component is illuminated by the illumination means. A component mounting apparatus that mounts a component on a substrate after the image is picked up from below by an image pickup means and judges the state of the paste attached to the bump, and the illumination means illuminates the component without the paste attached to the bump In this state, when the component is imaged from below by the imaging means, the height of the component whose luminance level at the center of the lower surface of the bump is lower than the luminance level of the outer edge of the lower surface of the bump is obtained as the reference height. And aligning the reference height with the reference height in a state where the illumination means illuminates a component that has been subjected to a process for attaching paste to the bump. Quasi-height positioning means, and judgment means for judging the adhesion state of the paste based on the luminance level at the center of the lower surface of the bump obtained by imaging the part aligned with the reference height from below by the imaging means And with.

  A component mounting apparatus according to a fifth aspect of the present invention is the component mounting apparatus according to the fourth aspect, wherein the determination in the determination means is a lower surface of a bump in an image obtained by imaging by the imaging means. The brightness level of the central portion is compared with the brightness level of the outer edge of the lower surface of the bump in the image obtained by imaging by the imaging means.

  A component mounting apparatus according to a sixth aspect of the present invention is the component mounting apparatus according to the fourth aspect, wherein the determination by the determination means is a lower surface of a bump in an image obtained by imaging by the imaging means. The brightness level of the central part is compared with the brightness level of the central part of the lower surface of the bump in the image obtained when the part positioned at the reference height in the reference height acquisition means is imaged from below by the imaging means. Do it.

  In the present invention, even if the luminance level at the center of the lower surface of the bump before the paste is attached to the bump is lower than the luminance level at the outer edge of the lower surface, if the paste adheres to that portion, the illumination light is irregularly reflected and the luminance is reduced. Using a higher level, obtain a reference height at which the brightness level at the center of the lower surface of the bump is lower than the brightness level at the outer edge of the bump when the paste is not attached to the bump. , Paste the paste on the bump, paste the component based on the brightness level at the center of the lower surface of the bump obtained by aligning the component with the reference height and imaging the aligned component from below Thus, even when a transparent paste is used, it is possible to accurately determine the state of paste adhesion.

The top view of the component mounting apparatus in one embodiment of this invention The partial side view of the component mounting apparatus in one embodiment of this invention Sectional drawing of the component recognition unit of the component mounting apparatus in one embodiment of this invention The block diagram of the control apparatus of the component mounting apparatus in one embodiment of this invention The flowchart which showed the acquisition process of the reference data in one embodiment of this invention (A) (b) Explanatory drawing which shows the reference | standard data acquisition operation | movement in one embodiment of this invention (A) (b) Explanatory drawing which shows the reference | standard data acquisition operation | movement in one embodiment of this invention The flowchart which showed the component mounting process in one embodiment of this invention (A) (b) (c) (d) (e) Explanatory drawing which shows the paste adhesion | attachment operation | movement in one embodiment of this invention. (A) (b) Explanatory drawing which shows the inspection process in one embodiment of this invention (A) (b) Explanatory drawing which shows the component mounting operation | movement in one embodiment of this invention

  First, the overall structure of the component mounting apparatus will be described with reference to FIG. The component mounting apparatus 1 conveys the substrate 2 having the electrode 2a formed on the upper surface in one direction (X direction) in a horizontal plane and positions the substrate 2 at a predetermined mounting work position, and on the electrode 2a at the position. The component 3 is mounted on the substrate 2 by contacting a plurality of spherical solder bumps 3a (hereinafter simply referred to as “bumps 3a” (FIG. 2)) formed on the lower surface 3b of the component 3 such as an electronic component. The component mounting apparatus 1 includes a base 4, a substrate transport unit 5 provided on the base 4, a plurality of tape feeders 7 as a component supply unit, a paste transfer unit 8, a mounting head 16, a component imaging unit 24, and each part It comprises a control device 28 (FIG. 4) that performs operation control.

  In FIG. 1, the board | substrate conveyance part 5 is each attached to a pair of conveyance conveyor support member 6 extended in the X direction facing the Y direction orthogonal to X direction on the base 4, and a pair of conveyance conveyor support member 6 respectively. It consists of a conveyor 6a. The substrate 2 that has finished the work in the upstream apparatus is transferred to the transport conveyor 6a, transported in the X direction while being supported from below by the transport conveyor 6a, and positioned at a predetermined mounting work position.

  In FIG. 1, each tape feeder 7 is provided at both ends of the base 4 facing the Y direction so as to be aligned in the X direction, and a component supply port having an upper opening at the upper end on the side of the conveyor support member 6. 7a is formed. The tape feeder 7 continuously supplies the component 3 to the component supply port 7a.

  1 and 2, the paste transfer portion 8 is disposed adjacent to the tape feeder 7 on one end side of the base 4 in the Y direction, and is disposed on the base portion 9 and the base portion 9 with a flux or the like on the upper surface. The transfer table 10 is supplied with a solder bonding aid (hereinafter referred to as “paste P”) such as solder paste, and the squeegee head 11 is disposed above the transfer table 10. The transfer table 10 has a smooth upper surface and can be moved in the Y direction on the base portion 9 by a built-in drive mechanism (not shown). The squeegee head 11 includes a first squeegee member 11A and a second squeegee member 11B that can be raised and lowered individually by a built-in lifting mechanism (not shown). In the present embodiment, a transparent color paste P having a high light transmittance is used.

  In FIG. 1, the head moving mechanism 12 includes a Y-axis table 13 that extends in the Y direction at one end of the base 4 in the X direction, and extends in the X direction. The X-axis table 14 is movable along the table 13, and the movable plate 15 is provided so that each X-axis table 14 is movable in the X direction. The mounting head 16 is attached to each movable plate 15. . In addition, a substrate recognition camera 17 (see also FIG. 2) having an imaging surface below is attached to each moving plate 15.

  In FIG. 2, the mounting head 16 includes a plurality of holding heads 18, and suction nozzles 19 as component holding members are mounted below the holding heads 18. The mounting head 16 includes a suction mechanism 20, which includes an actuator (not shown), an elevating mechanism 21, and a nozzle rotating mechanism 22. By these mechanisms, the suction nozzle 19 sucks and releases the component 3, and lifts (arrow a). Rotation in the horizontal direction (arrow b) is possible with the vertical direction (Z direction) as the axis.

  1 and 3, the component imaging unit 24 is provided in a housing 23 that is disposed on the base 4 between the tape feeder 7 and the transport conveyor support member 6 and that opens upward. It consists of a component recognition camera 25 having an imaging surface 25A on the upper side, and a light source 26 as illumination means disposed above the component recognition camera 25 in the housing 23.

  A plurality of light sources 26 are arranged on the inner wall of the housing 23 so as to surround the component recognition camera 25 from four sides in plan view, and the illumination light r is directed from the side of the housing 23 toward the inside (slant upward). Irradiate. In FIG. 3 and FIG. 6B, the light source 26 is partially omitted for convenience. In addition, a component collection unit 27 that collects components 3 that are determined to be unmountable as a result of recognition due to missing bumps 3a or the like is provided on the base 4 and in a position adjacent to the X direction of the housing 23. It has been.

  Next, the configuration of the control system will be described with reference to FIG. The control device 28 provided in the component mounting apparatus 1 includes a mechanism control unit 29, an imaging control unit 30, an image processing unit 31, an illumination control unit 32, a storage unit 33, a determination unit 34, a notification unit 35, and a display processing unit 36. The display processing unit 36 is connected to a display unit 37 such as a monitor. The mechanism control unit 29 controls the operation of the transport conveyor 6a to transport the substrate 2 and controls the operation of the head moving mechanism 12 to move the mounting head 16 in the X and Y directions and to control the operation of the tape feeder 7. The component 3 is supplied to the component supply port 7a, the operation of the suction mechanism 20, the lifting mechanism 21 and the nozzle rotating mechanism 22 built in the mounting head 16 is controlled to suck the component 3, release the suction, The coating film forming process of the paste P on the transfer table 10 is executed by performing the up-and-down and the horizontal rotation and the operation control of the paste transfer unit 8.

  The imaging control unit 30 performs an operation control of the board recognition camera 17 and the part recognition camera 25, and executes an imaging process for the board 2 positioned at the mounting work position and the part 3 positioned above the part recognition camera 25. Image data obtained by the board recognition camera 17 and the component recognition camera 25 is sent to the image processing unit 31 for image recognition processing. The illumination control unit 32 controls the operation of the light source 26 and executes a process of irradiating the illumination light r from the light source 26 when the component 3 is imaged by the component recognition camera 25.

  The storage unit 33 stores a mounting operation program 33a, a reference data acquisition program 33b, and an inspection program 33c. The mounting operation program 33a is a program used when the mounting operation of the component 3 targeting the board 2 is executed. The reference data acquisition program 33b is a program used when acquiring reference data, which will be described later, when inspecting the adhesion state of the paste P on the bumps 3a. The inspection program 33c is a program used when determining the adhesion state of the paste P to the bump 3a. Each mechanism constituting the component mounting apparatus 1 operates via the control device 28 based on these programs.

  The determination unit 34 determines whether or not the paste P is attached to the bump 3a based on the luminance level of the lower surface of the bump 3a described later. When the determination unit 34 determines that the paste P is not attached to the bump 3a, the notification unit 35 receives a signal from the determination unit 34 and displays a message to that effect on the display unit 37. Send a signal. The display processing unit 36 receives the signal from the notification unit 35 and executes a process for displaying the signal on the display unit 37.

  According to the component mounting apparatus 1 having the above configuration, the component 3 having the bump 3a on the lower surface 3b is taken out from the tape feeder 7 (component supply unit) by the suction nozzle 19 (component holding member), and the paste P is attached to the bump 3a. After that, the component 3 is illuminated by the light source 26 (illuminating means) and imaged from below by the component recognition camera 25 (imaging means) to determine the adhesion state of the paste P on the bump 3a and then applied to the substrate 2. Component mounting for mounting the component 3 is realized. Hereinafter, this specific operation will be described. In this embodiment, when determining the state of adhesion of the paste P to the bump 3a, an operation for obtaining reference data necessary for the determination is performed before the component mounting operation.

  The reference data acquisition operation will be described with reference to FIGS. First, the control device 28 moves the mounting head 16 above the component supply port 7a, lowers the suction nozzle 19 from that position (arrow a1), and sucks the component 3 supplied to the component supply port 7a. 19 is raised (arrow a2) to take out the part 3 (ST1 part taking-out step) (FIG. 6A). Next, the control device 28 moves the mounting head 16 so that the suction nozzle 19 is positioned above the component recognition camera 25 in plan view (ST2 suction nozzle alignment step in ST2) (FIG. 6B).

  Next, the control device 28 holds the component 3 (hereinafter referred to as “unprocessed component 3A” because the process of attaching the paste P to the bump 3a is not performed) with the illumination light r emitted from the light source 26. The lowered suction nozzle 19 is lowered (arrow a1) so that the illumination light r is irradiated from the side to the bumps 3Aa of the untreated component 3A (illumination process of ST3) (FIG. 6 ( b)).

  In FIG. 7A, the illumination light r incident on the surface of the bump 3Aa is equal to an angle (incident angle Θ1) with respect to a virtual line L connecting the center point O of the spherical bump 3Aa and the incident point Q of the illumination light r. Reflects at an angle (reflection angle Θ2). The control device 28 raises and lowers the suction nozzle 19 (arrow a), and the illumination light r reflected by the surface of the bump 3Aa is more than the region 25Aa that is located vertically below the lower surface center portion E1 of the bump 3Aa in the imaging surface 25A. The height of the unprocessed component 3A is adjusted so as to enter a large amount in the region 25Ab located vertically below the lower edge portion E2 of the lower surface of the bump 3Aa (component height adjustment step of ST4).

  That is, when the component 3 (unprocessed component 3A) in which the paste P is not attached to the bump 3a is illuminated by the light source 26, when the component 3 is imaged from below by the component recognition camera 25, the bump 3a The height of the component 3 is adjusted so that the luminance level at the center of the lower surface is lower than the luminance level at the outer edge of the lower surface of the bump 3a, and the height of the adjusted component 3 (the unprocessed component 3A relative to the imaging surface 25A) is adjusted. The height of the lower surface 3Ab) is acquired as the reference height H (ST5 reference height acquisition step). The acquired reference height H is stored in the storage unit 33 as reference data.

  FIG. 7B shows an image obtained when the unprocessed component 3A located at the reference height H is imaged from below by the component recognition camera 25, and the luminance level of the lower surface central portion E1 of the bump 3Aa is lower surface. It is shown lower (that is, darker) than the luminance level of the outer edge E2. In general, since a plurality of bumps are formed on the lower surface of the component, the luminance level of the lower surface center portion E1 of all the bumps 3Aa is not lower than the luminance level of the lower surface outer edge portion E2 when the unprocessed component 3A is imaged. The height of the processing component 3A is adjusted. Further, the height of the unprocessed part 3A may be adjusted by displaying an image of the lower surface 3Ab of the bump 3Aa on the display unit 37 and moving the suction nozzle 19 up and down while visually confirming the image.

  The reference height H of the untreated component 3A is such that the luminance level of the lower surface center portion E1 becomes lower than the luminance level of the lower surface outer edge portion E2 because the illumination light r does not enter the lower surface center portion E1 of the bump 3Aa. The height may be selected. Further, even if the illumination light r is incident on the lower surface center portion E1 of the bump 3Aa, the reflected light is not incident on the region 25Aa of the imaging surface 25A positioned vertically below the lower surface center portion E1, thereby the lower surface center of the bump 3Aa. The height of the unprocessed component 3A may be selected such that the luminance level of the portion E1 is lower than the luminance level of the lower surface outer edge portion E2. In short, the height of the unprocessed component 3A that makes the luminance level of the lower surface center portion E1 of the bump 3Aa lower than the luminance level of the lower surface outer edge portion E2 may be set as the reference height H. Further, the reference height H may be acquired in a design (geometrical) manner based on the main body size, bump size, illumination angle, and the like of the component 3.

  If the reference height H is acquired, then a component mounting operation including an inspection of the adhesion state of the paste P is performed. This component mounting operation will be described with reference to FIGS. First, the control device 28 transports and positions the substrate 2 to the mounting work position by the transport conveyor 6a (substrate transport process in ST6), moves the mounting head 16 over the positioned substrate 2, and the substrate recognition camera 17 causes the substrate to be moved. 2 is imaged from above (substrate imaging step of ST7).

  If the board | substrate 2 is imaged, the control apparatus 28 will move the mounting head 16 above the component supply port 7a of the tape feeder 7 which supplies the component 3 used as mounting object similarly to the above-mentioned (ST1), and will carry out a suction nozzle. In step 19, the part 3 is sucked and taken out (ST8 part taking-out step). Next, the control device 28 performs an operation of attaching the paste P to the bumps 3a of the component 3 taken out from the tape feeder 7 by the suction nozzle 19 (ST9 paste attaching step).

  With reference to FIG. 9, the film forming operation and the attaching operation of the paste P in the paste transfer unit 8 will be described. FIG. 9A shows that the first squeegee member 11A and the second squeegee member 11B are positioned on the end portion (right side in this example) on the transfer table 10 before the film forming operation is started, and the paste P between the squeegee members. Indicates a state of being scraped. At the start of the film forming operation, the control device 28 uses a gap g between the lower end portion of the first squeegee member 11A and the upper surface of the transfer table 10 to form an appropriate film for attaching an appropriate amount of paste P to the bumps 3a. The first squeegee member 11A is moved up and down (arrow c) so as to have a thickness t, and the second squeegee member 11B is moved up and down so as not to hinder the flow of the paste P during film formation (arrow d).

  Next, as shown in FIG. 9B, the control device 28 moves the transfer table 10 in the direction of arrow e through the drive mechanism. As a result, the paste P is spread on the transfer table 10 by the first squeegee member 11A, and a paste coating film Pa having a film thickness t is formed. Then, as shown in FIG. 9C, the control device 28 moves the suction nozzle 19 onto the paste coating film Pa, and lowers the suction nozzle 19 at this position (arrow a1) to transfer the paste P to the bump 3a. (Attach). After the paste transfer, the control device 28 raises the suction nozzle 19 (arrow a2) (FIG. 9D), and the paste P attaching operation is completed. Note that the surface of the paste P attached to the bump 3Ba is uneven (FIG. 10A).

  As the adhesion operation of the paste P is repeated, the surface of the paste coating film Pa becomes rough. In such a case, as shown in FIG. 9 (e), the control device 28 lowers the second squeegee member 11B (arrow d2) and grounds the lower end of the second squeegee member 11B on the upper surface of the transfer table 10. By moving in the direction of the arrow f, the state returns to the state where the paste P has been collected at one end (FIG. 9A). Thereafter, the paste film Pa having a desired film thickness is formed again by performing the above-described operation.

  In the adhesion operation of the paste P described above, a sufficient amount of paste P adheres to the bump 3a due to the variation in the size of the bump 3a or the adhesion operation performed in a state where the surface of the paste coating film Pa is rough. Things can happen. For this reason, in the present embodiment, the paste P adhesion state described below is inspected for the component 3 (hereinafter referred to as “processed component 3B”) that has undergone the paste P adhesion operation processing.

  First, the control device 28 moves the suction nozzle 19 holding the processed part 3B that has undergone the paste attaching process of (ST9) above the part recognition camera 25, and then lowers the suction nozzle 19 to move the processed part 3B. In the state illuminated with the light source 26, it aligns with the reference height H (reference height alignment process of ST10). Then, the processed component 3B aligned with the reference height H is imaged from below by the component recognition camera 25 (imaging process of ST11).

  Here, when the paste P exists at the position where the illumination light r is incident, the illumination light r incident on the surface of the paste P is irregularly reflected on the uneven surface as shown in FIG. It passes through the inside of P, reaches the bump 3Ba, reflects off the surface of the bump 3Ba, and exits from the surface of the paste P to the outside. At this time, due to the influence of the refractive index of the paste P when entering the paste P and when exiting the paste P, the illumination light r is reflected in a direction different from the case where the paste P is not attached, thereby recognizing the part. The light enters the imaging surface 25 </ b> A of the camera 25. In the drawing, illumination light r represented by a broken line indicates an optical path when it is assumed that the paste P is not attached to the bump 3Ba.

  When the processed part 3B positioned at the reference height H under such a situation is imaged from below, as shown in FIG. 10B, the luminance level of the lower surface center portion F1 of the bump 3Ba and the luminance of the lower surface outer edge portion F2 are obtained. The levels are substantially the same under the influence of illumination light r (random reflection light) that randomly enters the imaging surface 25A. When the component 3 (unprocessed component 3A) in which the paste P is not attached to the bump 3a is imaged from below with the component 3 positioned at the reference height H, the luminance level of the lower surface center portion E1 of the bump 3Aa is It is expressed lower than the luminance level of the lower surface outer edge E2 (FIG. 7B).

  That is, in this embodiment, the reflection direction (reflection angle) of the illumination light r toward the bump 3a of the component 3 located at the reference height H depending on whether or not the paste P is attached to the bump 3a. Due to the difference, the difference in brightness level at the center of the lower surface of the bump 3a of the component 3 is utilized to determine the state of adhesion of the paste P. That is, when the luminance level of the lower surface center portion F1 is substantially the same as the luminance level of the lower surface outer edge portion F2, the determination unit 34 determines that the paste P is attached to the bump 3Ba. On the other hand, when the luminance level of the lower surface center portion F1 is lower than the luminance level of the lower surface outer edge portion F2, the determination unit 34 determines that the paste P is not attached to the bump 3Ba.

  As described above, in this embodiment, the adhesion state of the paste P is determined based on the luminance level of the lower surface center portion F1 of the bump 3Ba obtained by imaging with the component recognition camera 25 (in ST12). Judgment process). The specific determination by the determination unit 34 is as follows. In the image obtained by imaging the luminance level of the lower surface central portion F1 of the bump 3Ba in the image obtained by imaging with the component recognition camera 25 by the component recognition camera 25. This is performed in comparison with the luminance level of the lower surface outer edge F2 of the bump 3Ba.

  Further, the following method can be used as the determination of the adhesion state of the paste P based on the luminance level at the center of the lower surface of the bump 3a. First, in the reference height acquisition step of (ST5), the unprocessed part 3A located at the reference height H is imaged from below by the part recognition camera 25, and an image of the lower surface 3Ab of the unprocessed part 3A shown in FIG. To get. Then, based on the acquired image, the luminance level (hereinafter referred to as “reference luminance level”) of the lower surface center portion E1 of the bump 3Aa is acquired, and the reference luminance level is stored as reference data in the storage unit 33.

  Next, after performing the operations (ST6) to (ST11) as the component mounting operation, the control device 28 sets the lower surface center portion F1 of the bump 3Ba of the processed component 3B in the image obtained by imaging with the component recognition camera 25. The brightness level is compared with the reference brightness level stored in the storage unit 33. Here, as described above, the luminance level of the lower surface center portion F1 of the bump 3Ba of the processed component 3B located at the reference height H imaged with the paste P attached is randomly incident on the imaging surface 25A. The bump 3Ba is higher than the luminance level (reference luminance level) of the lower surface center portion E1 of the bump 3Aa obtained by imaging the unprocessed component 3A located at the reference height H under the influence of the illumination light r. When the luminance level of the lower surface center portion F1 is higher than the reference luminance level, the determination unit 34 determines that the paste P is attached to the bump 3Ba, while the luminance level of the lower surface center portion F1 is substantially the same as the reference luminance level. If it is, it is determined that the paste P is not attached to the bump 3Ba.

  If the determination unit 34 determines that the paste P is attached to the bump 3Ba, the control device 28 moves the mounting head 16 above the substrate 2 and lowers the suction nozzle 19 (arrow a1) to mount the mounting work position. The bumps 3Ba of the processed component 3B are brought into contact with the electrode 2a of the substrate 2 positioned at (3) by the paste P (component mounting step of ST13) (FIG. 11 (a)).

  At the time of component mounting, the positional deviation correction amount of the board 2 at the mounting work position calculated based on the image of the board 2 captured by the board recognition camera 17 in (ST7), and the part recognition camera 25 in (ST11). The processed component 3B is mounted after taking into account the positional deviation correction amount of the processed component 3B with respect to the suction nozzle 19 calculated based on the captured image of the processed component 3B. Then, the substrate 2 after mounting the components is carried into a reflow device (not shown) provided downstream, and the bumps 3a are heated and melted by the device to solder the substrate 2 and the components 3 (solder of ST14). Joining process), the component mounting operation is completed.

  On the other hand, when it is determined in (ST12) that the paste P is not attached, the determination unit 34 transmits a signal to the notification unit 35, and the notification unit 35 displays that the paste P is not attached to the bump 3Ba. A signal is transmitted to the display processing unit 36 so as to be displayed. The display processing unit 36 receives the signal from the notification unit 35 and executes a process for displaying that effect on the display unit 37, and notifies the operator via the display unit 37 (notification process of ST15). ).

  At the same time, the control device 28 moves the mounting head 16 to above the component collecting unit 27, releases the suction of the processed component 3 </ b> B by the suction nozzle 19 at that position, and inputs the processed component 3 </ b> B into the component collecting unit 27. (Arrow h) (STEP component loading step ST16) (FIG. 11B). Upon receiving the notification, the operator temporarily stops the operation of the component mounting apparatus 1 and confirms the state of the coating film of the paste 3 on the collected bump 3Ba and the transfer table 10 of the processed component 3B. And when the cause of the paste adhesion mistake is found, the operation from (ST8) is executed after performing the elimination work. Alternatively, the processed component 3B may be moved above the transfer table 10 without being put into the component collection unit 27, and the paste adhering step (ST9) may be repeated.

  In the above configuration, the control device 28 illuminates the component 3 (unprocessed component 3A) in which the paste P is not attached to the bump 3a with the light source 26 (illuminating unit), and then recognizes the component recognition camera 25 (imaging unit). When the component 3 is imaged from below, the height of the component 3 at which the luminance level of the lower surface center portion E1 of the bump 3a (3Aa) is lower than the luminance level of the lower surface outer edge portion E2 of the bump 3a is the reference height. This is a reference height acquisition means for acquiring as H, and the reference height H is set in a state where the component 3 (processed component 3B) subjected to the process for attaching the paste P to the bump 3a is illuminated by the light source 26. Reference height alignment means for alignment is provided. Further, the control device 28 (determination unit 34) is based on the luminance level of the lower surface center portion F1 of the bump 3a (3Ba) obtained by imaging the component 3 aligned with the reference height H from below with the component recognition camera 25. Thus, it is a judging means for judging the adhesion state of the paste P.

  As described above, according to the present invention, the paste obtained by imaging by the imaging means is attached depending on whether or not the illumination light incident on the bump of the component located at the reference height is diffusely reflected by the influence of the paste. The paste adhesion state is determined by utilizing the difference between the luminance level of the lower surface of the bump in the state and the luminance level of the lower surface of the bump in the state where the paste is not adhered. Thereby, even if it is a case where a transparent paste is used, the adhesion state of the paste with respect to a bump can be judged with sufficient accuracy.

  The component mounting method and the component mounting method of the present invention are useful in the field of component mounting in which paste is attached to the bumps of a component and mounted on an electrode of a substrate.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 3 Component 3a Bump 7 Tape feeder (component supply part)
19 Suction nozzle (component holding member)
25 Component recognition camera (imaging means)
26 Light source (illumination means)
28 Control device (reference height acquisition means, reference height alignment means)
34 Judgment part (judgment means)
E1, F1 Bump bottom center E2, F2 Bump bottom edge P Paste

Claims (6)

After the component having the bump on the lower surface is taken out from the component supply section by the component holding member and the paste is attached to the bump, the paste is attached to the bump by imaging from below with the imaging means while the component is illuminated by the illumination means A component mounting method using a component mounting apparatus that mounts a component on a board after making the determination,
When the component having no paste attached to the bump is illuminated by the illumination unit, and the component is imaged from below by the imaging unit, the luminance level at the center of the lower surface of the bump is the outer edge of the lower surface of the bump. A reference height acquisition step of acquiring the height of a component lower than the luminance level of the reference level as a reference height;
A paste attaching step of attaching a paste to the bumps of the component taken out from the component supply unit by the component holding member;
A reference height alignment step of aligning the reference height with the part that has undergone the paste attaching step in a state of being illuminated by the illumination means;
An imaging step of imaging the component aligned with the reference height from below by the imaging means;
A component mounting method comprising: a determination step of determining an adhesion state of the paste based on a luminance level at a central portion of the lower surface of the bump obtained by imaging in the imaging step.   The determination in the determination step is the luminance level of the lower surface central portion of the bump in the image obtained by imaging in the imaging step, and the luminance level of the lower outer edge portion of the bump in the image obtained by imaging in the imaging step. The component mounting method according to claim 1, wherein the component mounting method is performed in comparison with.   The determination in the determination step includes the step of imaging the component in which the luminance level of the lower surface center portion of the bump in the image obtained by the imaging step is positioned at the reference height in the reference height acquisition step. 2. The component mounting method according to claim 1, wherein the component mounting method is performed in comparison with a luminance level of a lower surface center portion of a bump in an image obtained when imaging is performed from below. After the component having the bump on the lower surface is taken out from the component supply section by the component holding member and the paste is attached to the bump, the paste is attached to the bump by imaging from below with the imaging means while the component is illuminated by the illumination means A component mounting apparatus that mounts a component on the board after making the determination
When the component having no paste attached to the bump is illuminated by the illumination unit, and the component is imaged from below by the imaging unit, the luminance level at the center of the lower surface of the bump is the outer edge of the lower surface of the bump. A reference height acquisition means for acquiring, as a reference height, the height of a component that is lower than the luminance level of
A reference height alignment means for aligning the reference height with a component that has been subjected to a process for attaching a paste to a bump while being illuminated by the illumination means;
Judgment means for judging the adhesion state of the paste on the basis of the luminance level at the center of the lower surface of the bump obtained by imaging the component aligned with the reference height from below by the imaging means. Component mounting device.   The determination by the determination means is performed by determining the luminance level of the lower surface central portion of the bump in the image obtained by imaging by the imaging means, and the luminance level of the lower edge of the lower surface of the bump in the image obtained by imaging by the imaging means. The component mounting apparatus according to claim 4, wherein the component mounting apparatus is performed in comparison with the component mounting apparatus.   The determination in the determination means is performed by detecting a component in which the luminance level at the center of the lower surface of the bump in the image obtained by imaging by the imaging means is positioned at the reference height in the reference height acquisition means. 5. The component mounting apparatus according to claim 4, wherein the component mounting apparatus is compared with a luminance level at a central portion of a lower surface of a bump in an image obtained when imaging is performed from below.

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