WO2016143059A1

WO2016143059A1 - Mounting device, image processing method and imaging unit

Info

Publication number: WO2016143059A1
Application number: PCT/JP2015/056957
Authority: WO
Inventors: 雅史天野
Original assignee: 富士機械製造株式会社
Priority date: 2015-03-10
Filing date: 2015-03-10
Publication date: 2016-09-15
Also published as: JPWO2016143059A1; JP6612845B2

Abstract

In this mounting device (11), during movement in which a mounting head (22) picks up a component and mounts the same on a substrate S, a first image is captured, under a first imaging condition, that includes a first reference mark and the component picked up by the mounting head (22), and a second image is captured, under a second imaging condition, that includes a second reference mark and the component, and prescribed processing is carried out using the first image and the second image. As the prescribed processing using the first image and the second image, the mounting device 11 optionally carries out processing for determining one or more of: the component direction, the component shape, and the component position.

Description

Mounting apparatus, imaging processing method, and imaging unit

The present invention relates to a mounting apparatus, an imaging processing method, and an imaging unit.

Conventionally, as an imaging processing method, a method has been proposed in which a plurality of images including positional deviation are acquired, a plurality of images are aligned, and an interpolation image is generated by interpolation processing based on the plurality of images (for example, Patent Document 1). In this method, an image to be used for generating a composite image is selected by an optimization process in which the alignment accuracy is weighted.

JP 2012-003469 A

By the way, as an apparatus that employs such an image processing method, a mounting apparatus that includes a mounting head for collecting components and mounts the components on a substrate by the mounting head can be cited. In such a mounting apparatus, it is conceivable to capture a plurality of images including the component collected by the mounting head and perform image processing of the component using the plurality of images. However, in the above-described image processing method, imaging of components under a plurality of imaging conditions has not been considered. For this reason, in the above-described image processing method, for example, it may be necessary to repeat the process of re-collecting components according to the imaging conditions, or temporarily stopping the mounting head to perform imaging, which may reduce productivity. It was.

The present invention has been made in view of such problems, and a main object thereof is to provide a mounting apparatus, an imaging processing method, and an imaging unit that can further improve the productivity in the mounting process.

The present invention adopts the following means in order to achieve the main object described above.

The mounting apparatus of the present invention is
A mounting head having one or more reference marks and a sampling member for sampling the component, and moving the sampled component onto the substrate;
An imaging unit that captures an image;
While the mounting head collects the component and mounts it on the substrate, the imaging unit captures a first image including the component collected by the mounting head and the reference mark under a first imaging condition, A second image including the component collected by the mounting head and the reference mark is captured by the imaging unit under a second imaging condition different from the first imaging condition, and the first image and the second image are captured. A control unit for performing a predetermined process using,
It is equipped with.

In this mounting apparatus, while the mounting head picks up the component and mounts it on the substrate, the first image including the component picked up by the mounting head and the reference mark is picked up under the first imaging condition, and the component and the reference mark are picked up. A second image including the second image is captured under the second imaging condition, and a predetermined process is performed using the first image and the second image. Since the mounting apparatus captures a plurality of images including the reference mark and the component, for example, the position of the component is clarified by the reference mark in the first image and the second image captured under different conditions. For this reason, in this mounting apparatus, it is possible to capture a plurality of images while collecting the components and mounting them on the substrate without collecting the components again according to the imaging conditions. Alternatively, it is possible to capture a plurality of images while continuing to move the mounting head without temporarily stopping the mounting head and capturing an image. Therefore, in this mounting apparatus, productivity in the mounting process can be further improved.

1 is a schematic explanatory diagram illustrating an example of a mounting system 10. FIG. Explanatory drawing of the mounting head 22 and the imaging unit 30. FIG. The block diagram showing the structure of the mounting apparatus. The flowchart showing an example of an imaging process routine. Explanatory drawing of the mounting head 22 which extract | collected the component 60. FIG. Explanatory drawing of the 1st image 71 and the 2nd image 72. FIG. Explanatory drawing of the moving speed of the mounting head 22, and the imaging order of an imaging target. The conceptual diagram of the process which recognizes the positional relationship of the 1st image 71 and the 2nd image 72. FIG. Explanatory drawing of the mounting head 22 which extract | collected the

components

64 and 66. FIG. Explanatory drawing of the 1st image 73 and the 2nd image 74. FIG. Explanatory drawing of the mounting head 22B. Explanatory drawing of the mounting head 22C. Explanatory drawing which images the image from which the imaging height of components differs as imaging conditions.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram illustrating an example of the mounting system 10. FIG. 2 is an explanatory diagram of the mounting head 22 and the imaging unit 30. FIG. 3 is a block diagram illustrating the configuration of the mounting apparatus 11. The mounting system 10 is a system that executes a mounting process related to a process of mounting a component on the board S, for example. The mounting system 10 includes a mounting device 11 and a management computer 50. In the mounting system 10, a plurality of mounting apparatuses 11 that perform a mounting process for mounting components on a substrate S are arranged from upstream to downstream. In FIG. 1, only one mounting apparatus 11 is shown for convenience of explanation. The mounting process includes a process of placing, mounting, inserting, joining, and bonding components on the substrate S. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.

As shown in FIGS. 1 and 3, the mounting apparatus 11 includes a board transfer unit 12, a mounting unit 13, a component supply unit 14, an imaging unit 30, and a control device 40. The substrate transport unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position. The substrate transport unit 12 has a pair of conveyor belts provided at intervals in the front-rear direction of FIG. 1 and spanned in the left-right direction. The board | substrate S is conveyed by this conveyor belt.

The mounting unit 13 collects components from the component supply unit 14 and arranges them on the substrate S fixed to the substrate transport unit 12. The mounting unit 13 includes a head moving unit 20, a mounting head 22, and a suction nozzle 24. The head moving unit 20 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider. The mounting head 22 is detachably mounted on the slider and is moved in the XY direction by the head moving unit 20. One or more suction nozzles 24 are detachably mounted on the lower surface of the mounting head 22. Here, the case where the mounting head 22 is mounted with four nozzles of the suction nozzles 24a to 24d will be mainly described (FIG. 2). Here, the suction nozzles 24a to 24d are collectively referred to as the suction nozzle 24. The suction nozzle 24 collects parts using negative pressure and is detachably mounted on the mounting head 22. The mounting head 22 incorporates a Z-axis motor 23, and the height of the suction nozzle 24 is adjusted along the Z-axis by the Z-axis motor. Further, the mounting head 22 includes a rotating device that rotates (spins) the suction nozzle 24 by a drive motor (not shown), and can adjust the angle of the component collected (sucked) by the suction nozzle 24.

As shown in FIG. 2, the mounting head 22 has a

first reference mark

25a, 25b and a

second reference mark

26a, 26b, which serve as a reference for the position of the collected components, on the lower surface side of the mounting head 22 so that they can be removed and replaced. It is installed. Here, the first reference marks 25a and 25b are collectively referred to as the first reference mark 25, and the second reference marks 26a and 26b are collectively referred to as the second reference mark 26. The mounting head 22 is provided with a first reference mark 25 and a second reference mark 26 on the outer peripheral side with respect to the suction nozzle 24. The first reference mark 25 and the second reference mark 26 are arranged at the corner of the mounting head 22, that is, at the corner of the imaging range of the imaging unit 30. The mounting head 22 has first reference marks 25a and 25b arranged diagonally among the four corners of the mounting head 22, and second reference marks 26a and 26b arranged on the remaining diagonals. The first reference mark 25 and the second reference mark 26 include a support column and a disk-shaped mark member disposed at the tip of the support column. The mark member of the first reference mark 25 is different in optical characteristics from the mark member of the second reference mark 26. Here, it is assumed that the mark member of the first reference mark 25 is different from the mark member of the second reference mark 26 in terms of optical characteristics. For example, the mark member of the first fiducial mark 25 has a relatively high reflectance including the imaging surface imaged by the imaging unit 30 and is white. On the other hand, the mark member of the second reference mark 26 has an achromatic color (gray) having a relatively low reflectance including the imaging surface imaged by the imaging unit 30. Here, the “optical characteristics” are, for example, characteristics according to light at the time of imaging, and may refer to characteristics that affect the captured image, and reflectivity, luminance, color, and imaging surface to be imaged. One or more of these angles are included. The first reference mark 25a is disposed at a predetermined positional relationship with the second reference marks 26a and 26b, for example, at predetermined distances L1 and L2. The first reference mark 25b is arranged in a predetermined positional relationship (predetermined distances L2 and L1) with the second reference marks 26a and 26b. Since the suction nozzles 24a to 24d have a predetermined positional relationship (distance and arrangement position) with the first reference mark 25 and the second reference mark 26, any one position of the first reference mark 25 and the second reference mark 26 is used. Can be recognized, each position can be recognized.

The component supply unit 14 includes a plurality of reels and is detachably attached to the front side of the mounting apparatus 11. A tape is wound around each reel, and a plurality of parts are held on the surface of the tape along the longitudinal direction of the tape. This tape is unwound from the reel toward the rear, and is sent out by the feeder unit to a sampling position where the tape is sucked by the suction nozzle 24 with the components exposed. The component supply unit 14 includes a tray unit having a tray on which a plurality of components are arranged and placed. This tray unit includes a moving mechanism that fixes the tray to a pallet, pulls it out from a magazine cassette (not shown), and moves the tray to a predetermined collection position. A large number of rectangular pockets are formed in the tray, and parts are accommodated in the pockets. The components accommodated in the tray are larger in height and size than the components accommodated in the reel.

The image pickup unit 30 picks up an image, and is a unit for picking up an image of the parts adsorbed by the mounting head 22 and the first reference mark 25 and the second reference mark 26 of the mounting head 22. The imaging unit 30 is disposed between the component supply unit 14 and the board transport unit 12. The imaging range of the imaging unit 30 is above the imaging unit 30. The imaging unit 30 includes an illumination unit 31, an illumination control unit 32, an image sensor 33, and an image processing unit 34. The illumination unit 31 is configured to be able to irradiate light in a plurality of illumination states with respect to components and reference marks that are irradiated with light upward and are held by the mounting head 22. The illumination unit 31 includes, for example, lamps arranged in the upper, middle, and lower stages, and an epi-illumination lamp (not shown). The brightness (light quantity) of light applied to the components sucked by the suction nozzle 24, It is a light source capable of adjusting the wavelength and the irradiation position of light. The illumination unit 31 emits light from the side when the upper lamp is turned on (side illumination), emits light from the side and below when the lower lamp is turned on, and emits light from the whole when all lamps are turned on. Irradiate (full lighting). The illumination control unit 32 controls the illumination unit 31 based on a predetermined illumination condition so that the illumination state according to the component sucked by the suction nozzle 24 is achieved. The imaging element 33 is an element that generates charges by receiving light and outputs the generated charges. The image sensor 33 may be a CMOS image sensor capable of performing high-speed continuous capture processing by overlapping the charge transfer processing after exposure and the exposure processing of the next image. The image processing unit 34 performs processing for generating image data based on the input charges. The imaging unit 30 captures a plurality of images and outputs captured image data to the control device 40 when the suction nozzle 24 that has suctioned the component 60 passes above the imaging unit 30.

As shown in FIG. 3, the control device 40 is configured as a microprocessor centered on a CPU 41, and includes a ROM 42 that stores a processing program, an HDD 43 that stores various data, a RAM 44 that is used as a work area, an external device and an electrical device. An input / output interface 45 for exchanging signals is provided, and these are connected via a bus 46. The control device 40 outputs control signals to the substrate transport unit 12, the mounting unit 13, the component supply unit 14, and the imaging unit 30, and inputs signals from the mounting unit 13, the component supply unit 14, and the imaging unit 30.

The management computer 50 is a computer that manages information of each device of the mounting system 10. The management computer 50 includes an input device 52 such as a keyboard and a mouse for an operator to input various commands, and a display 54 for displaying various information.

Next, the operation of the mounting system 10 of this embodiment configured as described above, specifically, the mounting process of the mounting apparatus 11 will be described. When the mounting process is started, the CPU 41 of the control device 40 controls the mounting unit 13 so that, for example, the suction nozzle 24 corresponding to the component to be collected is mounted on the mounting head 22 and the component is collected from the component supply unit 14. Next, the CPU 41 moves the mounting head 22 to the arrangement position on the substrate S. At this time, the CPU 41 moves the mounting head 22 so as to pass above the imaging unit 30. Further, the imaging unit 30 images the mounting head 22 that moves upward a plurality of times (for example, twice). The CPU 41 uses this captured image to check whether there is a defect, such as whether there is a mistake in the direction of the sucked part, whether the picking position deviation of the part is within an allowable range, or whether there is an abnormality in the shape of the part. judge. Next, when the component moves to the arrangement position on the substrate S, the CPU 41 lowers the suction nozzle 24 and arranges the component on the substrate S when there is no defect in the component. Note that the time required from the plurality of imaging processes to the determination process is sufficiently shorter than the time required for picking up and moving the component to the mounting position. For this reason, in the mounting apparatus 11, a plurality of imaging processes can be performed while moving the mounting head 22. The CPU 41 repeats such processing until all the components are placed on the board S.

Next, an imaging process executed by the imaging unit 30 in this mounting process will be described. FIG. 4 is a flowchart illustrating an example of an imaging process routine executed by the CPU 41 of the control device 40. This routine is stored in the HDD 43 of the control device 40, and is executed when a component is collected by the mounting head 22 and moved from the component supply unit 14 to the substrate transport unit 12 side in the mounting process. Here, first, a case where the component 60 (FIG. 5) is mounted on the substrate S will be described as a specific example. FIG. 5 is an explanatory diagram of the mounting head 22 from which the component 60 is collected. For example, as shown in FIG. 5, the component 60 is a BGA component including a large number of bumps 61 arranged at the lower portion of a relatively large plate-shaped main body. For a part whose shape is the target, such as the part 60, up and down or left and right, the direction of the part cannot be determined from the part shape. For this reason, for the purpose of discriminating the direction of the part, an identification mark is often attached so that the part shape becomes asymmetric. An identification mark 62 for recognizing the direction of the component 60 is attached to the lower surface of the component 60. Here, the case where the identification mark 62 is in the front left of the apparatus (lower right in FIG. 5) is assumed to be a normal arrangement direction. As shown in FIG. 5, when a relatively large component 60 is sucked and held, a large area is occupied in the region of the mounting head 22. In this suction process, one or more components 60 may be sucked by the suction nozzles 24a to 24d. The components 60 have a relatively large outer shape, and are arranged on the tray of the tray unit in the component supply unit 14. When the operator places the component 60 on the tray, the arrangement direction may be wrong. Therefore, in the imaging process in the mounting process, a process for confirming the direction of the component 60 is performed. In this imaging processing routine, the CPU 41 performs imaging to determine the position of the bump 61 of the component 60 under imaging conditions that clearly include the first reference mark 25 and recognize the shape related to the component 60 (for example, the outer shape and the shape of the bump 61). After that, imaging for confirming the position of the identification mark 62 is performed under an imaging condition that clearly includes the second reference mark 26 and recognizes the identification mark 62.

This imaging processing routine is executed while the mounting head 22 picks up and moves the component 60, and is repeatedly executed every time the picking and moving of the component 60 is repeated. When this routine is started, the CPU 41 of the control device 40 first determines whether or not the timing for capturing the first image has been reached (step S100). If the timing for capturing the first image has not been reached, the CPU 41 stands by. When the timing for capturing one image is reached, the first image is captured under the first imaging condition (step S110). The imaging timing of the first image is set to a timing at which, for example, all the parts 60 collected by the suction nozzles 24a to 24d are in the same imaging range, and at least the first reference mark 25a enters the imaging range of the imaging unit 30. Also good. For example, the CPU 41 may cause the imaging unit 30 to capture the first image 71 before the first reference mark 25b enters the imaging range and after the component 60 and the first reference mark 25a enter the same imaging range. Good. FIG. 6 is an explanatory diagram of an imaging process for imaging a plurality of times. FIG. 6A is an explanatory diagram of the first image 71, and FIG. Here, the first image 71 is set so as to capture the positioning image of the bump 61 under the side illumination condition. When imaging is performed at this imaging timing, the imaging unit 30 is caused to capture the first image 71 clearly including the entire bump 61 of the component 60 collected by the mounting head 22 and the first reference mark 25a while the mounting head 22 is moving. (FIG. 6A).

Next, the CPU 41 determines whether or not the timing for capturing the second image has been reached (step S120). If the timing for capturing the second image has not been reached, the CPU 41 stands by, and when the timing for capturing the second image has been reached. Then, the second image is captured under a second imaging condition different from the first imaging condition (step S130). Here, the second image 72 is set so as to capture a mark check image of the identification mark 62 under all lighting conditions. The imaging timing of the second image may be, for example, the timing after the image sensor 33 performs the exposure processing of the first image and the charge transfer after the exposure, and the exposure of the second image is completed. Alternatively, the imaging timing of the second image is set to a timing at which, for example, all the parts 60 collected by the suction nozzles 24a to 24d are in the same imaging range, and at least the second reference mark 26a enters the imaging range of the imaging unit 30. It may be. For example, the CPU 41 may cause the imaging unit 30 to capture the second image 72 after the second reference mark 26b is out of the imaging range and the collected component 60 and the second reference mark 26a are in the same imaging range. . When imaging is performed at this imaging timing, the second image 72 including the component 60 and the second reference mark 26 collected by the mounting head 22 can be captured by the imaging unit 30 while the mounting head 22 is moving (FIG. 6). (B)). Each imaging timing does not exclude the case where the first reference mark 25b and the second reference mark 26a are included in the first image 71, and the first reference mark 25a and the second reference mark are included in the second image 72. The case where 26b is included is not excluded.

Here, imaging of the first image and the second image will be described. In the imaging of the component 60, in the imaging of the positioning image, which is the first image, the bumps 61 have a protruding shape, so that the side illumination is suitable. In the imaging of the mark check image, which is the second image, the identification mark 62 is not used. All-illumination lighting is suitable because of the projection shape. For this reason, in an imaging process, the process which images a some image on different imaging conditions is performed. FIG. 7 is an explanatory diagram of the moving speed of the mounting head 22 and the imaging order of the imaging target. Since the mounting head 22 moves to the arrangement position after collecting the component 60, the moving speed gradually increases and tends to be constant at the highest speed, as shown in FIG. On the other hand, in the imaging process, for example, imaging conditions such as a difference in illumination and a difference in exposure time are different for a plurality of images. In the positioning image and the mark check image, the exposure time of the camera may be different depending on the difference in the optical characteristics of the components and the difference in the light amount of the illumination device. Either the positioning image or the mark check image can be imaged first. However, the faster the moving speed of the imaging target, the more likely that imaging blur will occur, so the exposure time must also be shortened. Here, if the exposure time of the imaging condition for the positioning image is short and the exposure time of the imaging condition for the mark check image is long, a mark check image that is an imaging condition with a long exposure time is captured as the first image, and the exposure time A positioning image having a short imaging condition is captured as the second image. According to this imaging process, imaging blur can be further reduced, and thus an image with better image quality can be obtained.

Subsequently, the CPU 41 uses the first image 71 and the second image 72 based on the positional relationship between the first reference mark 25 and the second reference mark 26 to identify the identification mark 62 (the suction direction of the component 60). Is detected) (step S140). In the identification process of the identification mark 62, the CPU 41 detects the position of the first reference mark 25 in the first image 71, for example, and determines the position of the component 60 based on the positional relationship between the first reference mark 25 and the suction nozzle 24. The position of the component 60 in the second image 72 is determined based on the positional relationship between the first reference mark 25 and the second reference mark 26, and the identification mark 62 will be present depending on the outer shape of the component 60. Image processing is performed on the area, and the presence position of the identification mark 62 in the second image 72 is recognized. FIG. 8 is a conceptual diagram of processing for recognizing the positional relationship between the first image 71 and the second image 72. Note that FIG. 8 shows the concept of superimposing images, but the actual processing does not need to superimpose images, and based on the positions of the first reference mark 25, the component 60, etc. in the first image 71, Processing for grasping the positional relationship between the component 60 and the identification mark 62 in the two images 72 is performed. In the first image 71, the identification mark 62 is not necessarily identifiable by image processing, but the first reference mark 25, the outer shape of the component 60, and the position of the bump 61 are identifiable images. In the second image 72, the outer shape of the component 60 and the position of the bump 61 are not necessarily identifiable by image processing, but the identification mark 62 and the second reference mark 26 are identifiable images. If at least the first reference mark 25a and the bump 61 are captured in the first image, and at least the second reference mark 26a is captured in the second image, the CPU 41 determines a predetermined positional relationship (for example, XY coordinates) of each reference mark. Accordingly, the position of the imaging target (component 60) in the second image 72 can be accurately grasped. In general, when the moving mounting head is imaged, the position of the mounting head may be shifted. Therefore, the CPU temporarily stops the mounting head above the imaging unit and captures a plurality of images with different imaging conditions. Sometimes. Here, since the positional deviation of the mounting head 22 can be taken into account by using the first reference mark 25 and the second reference mark 26, a plurality of images with different imaging conditions are captured while moving the mounting head 22. And productivity can be improved.

After step S140, the CPU 41 detects the shape of the component 60 collected by the mounting head 22 and the suction position deviation amount using the captured first image 71 (step S150). In this process, an image of the component 60 whose position is specified using the first reference mark 25 in step S140 is used. In the shape identification, for example, the CPU 41 performs matching between the captured image of the component 60 and the reference image of the component 60, and performs a process of obtaining a matching degree based on, for example, the defect or deformation of the bump 61. The amount of suction position deviation is, for example, the X-axis between the center position of the component 60 and the center position of the suction nozzle 24 based on the positional relationship of the center coordinates of the first reference mark 25, the second reference mark 26, and the suction nozzle 24. , And the difference between the coordinate values of the Y axis. Here, the positions of the first reference mark 25 and the second reference mark 26 will be described. In the mounting apparatus 11, a component 60 having a relatively large outer shape and a relatively small component (bump 61) disposed on the component may be mounted. In this case, in order to determine whether the component 60 is normal, a defect or deformation of the bump 61 may be detected. Further, in the mounting head 22, when a plurality of components having a relatively large outer shape, such as the component 60, are picked up, it is difficult to place the reference mark on the center side of the mounting head 22 in consideration of sucking deviation and rotation (FIG. reference). For example, when the reference mark is disposed on the outer peripheral side with respect to the suction nozzle, if the component 60 collected by the mounting head 22 is included in the imaging range of the imaging unit 30, the reference mark is likely to be out of the imaging range. (See FIG. 6). In this mounting apparatus 11, any one of reference marks (first reference marks 25 a and 25 b or second reference marks 26 a and 26 b) having a clear positional relationship is used depending on the captured image, and the reference mark is out of the imaging range. It solves easy problems.

Next, the CPU 41 determines whether or not the direction of the component 60 is correct based on the result in step S140 (step S160). If the direction of the component 60 is incorrect, an error is output (step S170). This routine is terminated. The error may be displayed and output on a display unit of an operation panel (not shown), for example. Since the possibility of human error is high when the direction of the component 60 is not appropriate, this error output may include, for example, a message confirming the direction of the component 60 placed on the tray. On the other hand, if the direction of the component 60 is correct in step S160, the CPU 41 determines whether or not the detected suction position deviation amount is within an allowable range (step S180). This allowable range is set to this range, for example, by empirically obtaining a range of misalignment in which the component 60 can be properly placed on the substrate S. When the suction position deviation amount is within the allowable range, the CPU 41 determines whether or not the shape of the component 60 is within the allowable range (step S190). This determination can be performed based on, for example, matching between the image of the component 60 and the reference image, for example, whether the matching degree based on the defect or deformation of the bump 61 is within a predetermined allowable range.

When it is determined in step S180 or step S190 that the amount of positional deviation or the difference in shape is not within the allowable range, the CPU 41 causes the mounting unit 13 to perform disposal processing assuming that the component 60 is a defective component (step S200), this routine is finished as it is. On the other hand, when the shape of the component is within the allowable range in step S190, the CPU 41 outputs that the arrangement of the component 60 is permitted (step S210), and this routine is ended as it is. Thereafter, the CPU 41 causes the mounting unit 13 to perform a process of placing the component 60 at a predetermined mounting position. In this way, the mounting apparatus 11 includes the bumps 61 and the identification marks 62 and performs the mounting process by moving the mounting head 22 while performing the imaging process of the component 60 that needs to be imaged under different imaging conditions. .

Next, an imaging process when two or more parts having different suitable imaging conditions are attracted to the mounting head 22 will be described. In this processing, the same processing as described above is performed except that the processing (identification mark identification processing) of steps S140, S160, and S170 of the imaging processing routine of FIG. 4 is omitted. FIG. 9 is an explanatory diagram of the mounting head 22 from which the

parts

64 and 66 are collected. Here, the case where the component 64 imaged on all lighting conditions and the component 66 imaged on side illumination conditions is imaged mainly. Also in the

parts

64 and 66, a part (part 64) under an imaging condition with a shorter exposure time is imaged as the second image. The CPU 41 starts this routine when the

components

64 and 66 are attracted to and moved by the mounting head 22.

When this routine is started, the CPU 41 waits until the imaging timing of the first image in step S100, and when the imaging timing is reached, causes the first image under the first imaging condition to be captured in step S110. The first imaging condition is side illumination and is a condition with a relatively long exposure time. Next, the CPU 41 waits until the second image capturing timing in step S120, and when the imaging timing is reached, causes the second image under the second imaging condition to be captured in step S130. The second imaging condition is a fully lit illumination and a condition with a relatively short exposure time. FIG. 10 is an explanatory diagram of an imaging process for imaging a plurality of times. FIG. 10A is an explanatory diagram of the first image 73 and FIG. 10B is an explanatory diagram of the second image 74. Due to the difference in imaging conditions, the first image 73 is not necessarily clear in the component 64, but the first reference mark 25 and the component 66 are clear images. In the second image 74, the component 66 is not necessarily clear, but the second reference mark 26 and the component 64 are clear images. At this time, the CPU 41 captures the first image 73 after the first reference mark 25a and the component 66 enter the same imaging range before the second reference mark 26a enters the imaging range, and then the first reference mark The second image 74 may be picked up after 25a is out of the imaging range and the second reference mark 26a and the component 64 are in the same imaging range. Further, the CPU 41 may capture the first image 73 and the second image 74 at the timing when the plurality of types of

components

64 and 66 having different optical characteristics are in the same imaging range.

Next, in step S150, the CPU 41 detects the shape of the component 60 collected by the mounting head 22 and the amount of suction position deviation. In this process, the position of the component 66 is obtained based on the position of the first reference mark 25 in the first image 73, and the position of the component 64 is obtained based on the position of the second reference mark 26 in the second image 74. . In the shape identification, the CPU 41 performs processing for matching the captured image of the component 66 of the first image 73 with the reference image of the component 66 and obtaining the matching degree of the component 66. Similarly, the CPU 41 identifies the shape of the component 64 using the second image 74. Further, with respect to the suction position deviation amount, the CPU 41 shifts the position of the component 66 based on the first reference mark 25 of the first image 73, the position of the component 66, and the position of the suction nozzle 24 in a predetermined positional relationship. Find the amount. Similarly, the CPU 41 calculates the positional deviation amount of the component 64 from the second image 74.

Subsequently, the CPU 41 determines whether or not the positional deviation amount is within an allowable range at step S180, and determines whether or not the shape is within an allowable range at step S190. The CPU 41 controls the mounting unit 13 to discard the defective part in step S200 when any of them is not within the allowable range, and permits the component placement when any of them is within the allowable range. Exit. In general, when mounting components with different imaging conditions, when imaging under multiple imaging conditions, the mounting head is stopped to capture multiple images, or only the components with the same imaging conditions are attracted to the mounting head. Therefore, the productivity was reduced. Here, the position of each component can be specified using the first reference mark 25 and the second reference mark 26 corresponding to the imaging conditions. For this reason, the positional deviation of the mounting head 22 can be taken into consideration, and a plurality of images with different imaging conditions can be imaged while moving the mounting head 22, and productivity can be improved.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The suction nozzle 24 of this embodiment corresponds to the sampling member of the present invention, the mounting head 22 corresponds to the mounting head, the imaging unit 30 corresponds to the imaging unit, and the control device 40 corresponds to the control unit. The first reference marks 25, 25a, and 25b correspond to the first reference marks, and the second reference marks 26, 26a, and 26b correspond to the second reference marks. The first reference mark 25 corresponds to a first condition reference mark determined according to the imaging condition and a first position reference mark serving as a position reference, and the second reference mark 26 is determined according to the imaging condition. This corresponds to the second condition reference mark and the second position reference mark serving as a position reference. In the present embodiment, an example of the imaging processing method of the present invention is also clarified by describing the operation of the mounting apparatus 11.

In the mounting apparatus 11 according to the embodiment described above, the first image including the component collected by the mounting head 22 and the first reference mark 25 during the movement in which the mounting head 22 collects the component and mounts it on the substrate S is displayed in the first image. An image is captured under one imaging condition, a second image including the component and the second reference mark 26 is captured under the second imaging condition, and a predetermined process is performed using the first image and the second image. Since the mounting apparatus captures a plurality of images including the reference mark and the component, for example, the position of the component is clarified by the reference mark in the first image and the second image captured under different conditions. For this reason, in the mounting apparatus 11, a plurality of images can be captured while the components are collected and mounted on the substrate S without collecting the components again according to the imaging conditions. Alternatively, it is possible to capture a plurality of images while continuing the movement of the mounting head 22 without temporarily stopping the mounting head 22 and capturing an image. Therefore, the mounting apparatus 11 can improve productivity in the mounting process.

Further, since the CPU 41 captures a plurality of images having different illumination conditions and exposure conditions as imaging conditions, it is possible to improve productivity when capturing images having different illumination conditions and exposure conditions. Further, an identification mark 62 is formed on the component 60, and the CPU 41 captures the first image 71 under the first imaging condition for recognizing the shape related to the component 60 while the mounting head 22 is moving, and for identification. The second image 72 is imaged under the second imaging condition for recognizing the mark 62, and a process for determining the direction of the component is performed as a predetermined process. The component 60 to which the identification mark 62 is attached may have different imaging conditions for its shape recognition and identification mark recognition. In the mounting apparatus 11, productivity can be improved in the mounting process of the component 60 with the identification mark 62. Furthermore, the CPU 41 performs a process of determining one or more of the component direction, the component shape, and the component position as a predetermined process using the first image and the second image. In the mounting apparatus 11, productivity can be improved by determining the direction of the component, the component shape, and the component position using images captured under different imaging conditions.

In addition, after the first image is captured, the CPU 41 causes the second image to be captured as a second imaging condition under a condition with a shorter exposure time than the first imaging condition. In the mounting apparatus 11, generally, the mounting head 22 gradually accelerates and then reaches a relatively high moving speed. The mounting apparatus 11 captures an image with a long exposure time when the speed of the mounting head 22 is slower, and captures an image with a short exposure time when the speed of the mounting head 22 is faster. For this reason, in this mounting apparatus 11, the image which reduced the blurring at the time of imaging can be obtained. Further, the mounting head 22 includes two or more suction nozzles 24 (collecting members), and the CPU 41 performs the first image and the second image at the timing when the components collected by the two or more suction nozzles 24 are in the same imaging range. The image is picked up by the image pickup unit 30. In this mounting apparatus 11, since a plurality of components are captured in the same image, the imaging efficiency is good. Furthermore, the CPU 41 causes the imaging unit 30 to capture the first image and the second image at a timing at which a plurality of types of components with different optical characteristics collected by the two or more suction nozzles 24 fall within the same imaging range. In the mounting apparatus 11, a plurality of components having different optical characteristics are imaged in the same image, so that the imaging efficiency is good.

The mounting head 22 has a first reference mark 25 used in the first imaging condition and a second reference mark 26 used in the second imaging condition. The CPU 41 is sampled by the mounting head 22. The component and the first reference mark 25 are imaged under the first imaging condition, and the component and the second reference mark 26 collected by the mounting head 22 are imaged under the second imaging condition. Since the mounting apparatus 11 uses the reference mark that matches the imaging conditions, an image that can more reliably recognize the positional relationship between the component and the reference mark can be obtained. Furthermore, the mounting head 22 includes two or more suction nozzles 24 for collecting the first component and the second component having different optical characteristics from the first component, and the first component adapted to the optical characteristics of the first component. It has the 1st reference mark 25 used on imaging conditions, and the 2nd reference mark 26 used on the 2nd imaging conditions adapted to the optical characteristic of the 2nd part. At this time, the CPU 41 causes the component picked up by the mounting head 22 and the first reference mark 25 to be imaged under the first imaging condition, and the component picked up by the mounting head and the second reference mark 26 are subjected to the second imaging. Make an image under conditions. In the mounting apparatus 11, a more suitable image can be taken according to the optical characteristics of the component.

The mounting head 22 includes a first reference mark 25 and a second reference mark 26 having a predetermined positional relationship with the first reference mark 25. The CPU 41 moves the mounting head 22 while the mounting head 22 is moving. The first image including the component collected in 22 and the first reference mark 25 is imaged by the imaging unit under the first imaging condition, while the first image including the component collected in the mounting head 22 and the second reference mark 26 is included. Two images are imaged by the imaging unit under the second imaging condition, and predetermined processing is performed using the first image and the second image based on the positional relationship between the first reference mark 25 and the second reference mark 26. In the mounting apparatus 11, the positional relationship between the first image and the second image is clarified using the positional relationship between the first reference mark 25 and the second reference mark 26. For this reason, in this mounting apparatus 11, the imaging range can be further expanded to a range including any one of the reference marks, and the components picked up by the mounting head can be imaged while further stopping the movement of the mounting head. .

Furthermore, the CPU 41 causes the imaging unit 30 to capture the first image after the first reference mark 25a and the component enter the same imaging range before the second reference mark 26a enters the imaging range. After the reference mark 25a is out of the imaging range and the second reference mark 26a and the component are in the same imaging range, the imaging unit 30 is caused to capture the second image. In the mounting apparatus 11, since either the first reference mark 25 or the second reference mark 26 can be used, the imaging range can be further expanded. Furthermore, the mounting head 22 is provided with a reference mark on the outer peripheral side with respect to the suction nozzle 24. In the mounting apparatus 11, for example, when there are two or more reference marks, the positions of the reference marks and the reference marks can be further separated, and a plurality of images can be obtained by further widening the imaging range. Can be imaged in one movement of the mounting head. The mounting head 22 is provided with reference marks on the front side and the rear side in the main movement direction of the mounting head 22. In this mounting apparatus 11, even if the mounting head 22 moves, any one of the reference marks easily enters the imaging range, and it is easy to capture a plurality of images in one movement of the mounting head by further expanding the imaging range.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the mounting head 22 has the four reference marks of the first reference marks 25a and 25b and the second reference marks 26a and 26b, but is not particularly limited thereto. FIG. 11 is an explanatory diagram of a mounting head 22B having one first reference mark 25B and one second reference mark 26B. As shown in FIG. 11, for example, if the mounting head 22B can keep the mounting head 22 parallel to the longitudinal direction of the apparatus, the first reference mark 25B and the second reference mark 26B are each one. can do. Alternatively, the mounting head 22 may have three reference marks arranged in an L shape such as the first reference marks 25a and 25b and the second reference mark 26a.

In the above-described embodiment, the mounting head 22 has four reference marks, the first reference marks 25a and 25b and the second reference marks 26a and 26b, arranged diagonally, but is not particularly limited thereto. For example, the first reference mark 25b may be disposed at any position of the second reference marks 26a and 26b. The same applies to the second reference mark 26. Even in this case, the mounting apparatus can improve productivity in the mounting process.

In the above-described embodiment, the mounting head 22 is provided with the reference mark on the outer peripheral side with respect to the suction nozzle 24, but is not particularly limited, and the reference mark is on the inner peripheral side with respect to the suction nozzle 24. It is good also as what is arrange | positioned. FIG. 12 is an explanatory diagram of the mounting head 22C in which the first reference mark 25C and the second reference mark 26C are disposed on the inner peripheral side. This mounting head 22C can also improve productivity in the mounting process. When the number of reference marks is increased, the reference marks are preferably disposed on the outer peripheral side of the suction nozzle 24.

In the above-described embodiment, the mounting head 22 is provided with a plurality of types of reference marks. However, for example, if one that can be used under a plurality of imaging conditions is used, one type of reference mark is used. It is good.

In the above-described embodiment, the imaging condition includes the illumination condition and the exposure condition, but other conditions may be used. Illumination conditions include side-lighting, full lighting, epi-illumination, etc. In addition to this, for example, it may be simply a difference in light quantity, a difference in wavelength, or illumination and light quantity in the upper, middle, and lower stages. Or a combination of wavelengths. For example, the imaging conditions may include the imaging height of the component. FIG. 13 is an explanatory diagram for capturing images with different imaging heights of components as imaging conditions. In the mounting apparatus 11, the imaging unit 30 captures the component 67 sucked by the suction nozzle 24 at the first imaging height while the mounting head 22 is moving, and then a second different from the first imaging height. Imaging at the imaging height. The component 67 includes a lead 68 having a horizontal portion at the same height as the bottom surface of the main body, and an insertion pin 69 whose tip is located below the bottom surface of the main body. Since the lead 68 and the insertion pin 69 are fixed to the substrate S, it is necessary to determine their shapes. Further, the lead 68 and the insertion pin 69 have different heights, and therefore have different heights for focusing. Here, the CPU 41 raises and lowers the suction nozzle 24 above the imaging unit 30 and images the lead 68 with full lighting illumination and the insertion pin 69 with side illumination. In this way, the mounting apparatus 11 captures a plurality of images while continuing the movement of the mounting head 22 without temporarily stopping the mounting head 22 and capturing an image with respect to the components 67 having different heights of the imaging regions. Can do. Therefore, the mounting apparatus 11 can improve productivity in the mounting process. At this time, the CPU 41 may take the first image and then take the second image as the second imaging condition under the condition that the imaging height of the component is lower than the first imaging condition. Good. In this mounting apparatus 11, since the component 67 approaches the substrate S when the second image is captured, the vertical movement efficiency when arranging the component 67 is good, and the productivity in the mounting process can be improved. Note that the mounting apparatus 11 may use imaging conditions in which one or more of illumination conditions, exposure conditions, and imaging height conditions of components are appropriately combined.

In the above-described embodiment, the processing performed using a plurality of images has been described as the processing for determining the direction of the component, the shape of the component, and the position of the component. However, the present invention is not particularly limited thereto. It is also possible to perform processing for displaying and outputting the information obtained in this way.

In the above-described embodiment, imaging is first performed under an imaging condition with a long exposure time, and then imaging is performed under an imaging condition with a short exposure time. However, the present invention is not particularly limited thereto. Note that, from the viewpoint of suppressing imaging blur due to exposure conditions, it is preferable that the imaging order be captured from images with imaging conditions having a long exposure time.

In the above-described embodiment, the first image and the second image are captured at the timing when all the components sucked by the mounting head 22 are in the same imaging range while the mounting head 22 is moving. Alternatively, at least one or more images of the first image and the second image may be captured at the timing when a part of the component sucked by the mounting head 22 is captured. If the parts are imaged while moving the mounting head 22 without stopping, the productivity in the mounting process can be improved.

In the above-described embodiment, the case where the first image 71 and the second image 72 are imaged while moving the mounting head 22 in the front-rear direction of the apparatus has been mainly described, but the front-rear direction and the left-right direction, that is, on the imaging unit 30 are described. The first image and the second image may be captured when moving obliquely.

In the above-described embodiment, two images are captured under two types of imaging conditions. However, the present invention is not particularly limited as long as a plurality of images are captured under a plurality of imaging conditions. Three or more images may be picked up under the image pickup conditions. In the above-described embodiment, two types of

components

64 and 66 are attracted to the mounting head 22 and imaged under two types of imaging conditions. However, for example, three or more types of components are attracted to the mounting head 22. It is good also as what is imaged on 2 or 3 or more types of imaging conditions. At this time, the mounting head 22 may be provided with three or more types of reference marks. The mounting head 22 is not particularly limited as long as one or two or more suction nozzles 24 can be mounted. The mounting head 22 may be mounted with 12 suction nozzles 24 or 16 mounting nozzles. In the above-described embodiment, a plurality of image data is output from the imaging unit 30 while the mounting head 22 is moving, and the determination processing in steps S160 to S210 is completed before the component reaches the mounting position. .

In the above-described embodiment, the first reference mark 25 and the second reference mark 26 have the functions of the first and second position reference marks having a predetermined positional relationship with the functions of the first and second conditional reference marks having different optical characteristics. However, it may have one of the functions.

In the above-described embodiment, the sampling member is described as the suction nozzle 24. However, the sampling member is not particularly limited as long as the component is collected. For example, a mechanical chuck that mechanically clamps and collects the component may be used. .

In the above-described embodiment, the present invention has been described as the mounting apparatus 11. However, for example, the imaging unit 30 may be used, or an imaging processing method or a control method for the imaging unit 30 may be used. It may be a program.

The present invention can be used for an apparatus for performing a mounting process in which components are arranged on a substrate.

10 mounting system, 11 mounting device, 12 substrate transport unit, 13 mounting unit, 14 component supply unit, 20 head moving unit, 22, 22B, 22C mounting head, 23 Z-axis motor, 24, 24a to 24d suction nozzle, 25, 25a, 25b, 25B, 25C 1st reference mark, 26, 26a, 26b, 26B, 26C 2nd reference mark, 30 imaging unit, 31 illumination unit, 32 illumination control unit, 33 imaging element, 34 image processing unit, 40 control Device, 41 CPU, 42 ROM, 43 HDD, 44 RAM, 45 I / O interface, 46 bus, 50 management computer, 52 input device, 54 display, 60 parts, 61 bump, 62 identification mark, 64, 66, 67 parts , 68 leads, 69 Input pins, 71 and 73 the first image, 72 and 74 second image, S substrate.

Claims

A mounting head having one or more reference marks and a sampling member for sampling the component, and moving the sampled component onto the substrate;
An imaging unit that captures an image;
While the mounting head collects the component and mounts it on the substrate, the imaging unit captures a first image including the component collected by the mounting head and the reference mark under a first imaging condition, A second image including the component collected by the mounting head and the reference mark is captured by the imaging unit under a second imaging condition different from the first imaging condition, and the first image and the second image are captured. A control unit for performing a predetermined process using,
Mounting device.
2. The mounting apparatus according to claim 1, wherein the control unit causes the second image to differ in one or more of an illumination condition, an exposure condition, and a component imaging height condition as the imaging condition.
An identification mark is formed on the part,
The control unit causes the first image to be captured under a condition for recognizing a shape related to the component as the first imaging condition while the mounting head is moving, and the identification mark is used as the second imaging condition. The mounting apparatus according to claim 1, wherein the second image is captured under a recognition condition, and a process of determining a direction of the component is performed as the predetermined process.
The said control part performs the process which determines 1 or more among the direction of the said component, the shape of the said component, and the position of the said component as said predetermined process using the said 1st image and the said 2nd image. 4. The mounting apparatus according to any one of 1 to 3.
The said control part makes the said 2nd image be imaged on the conditions of short exposure time compared with the said 1st imaging condition as a said 2nd imaging condition after imaging the said 1st image. 5. The mounting apparatus according to any one of 1 to 4.
The mounting head has two or more sampling members,
6. The control unit according to claim 1, wherein the control unit causes the imaging unit to capture the first image and the second image at a timing at which components collected by two or more of the sampling members are in the same imaging range. The mounting apparatus according to Item 1.
The mounting head has two or more sampling members,
The control unit causes the imaging unit to capture the first image and the second image at a timing at which a plurality of types of components with different optical characteristics collected in the two or more sampling members are in the same imaging range. The mounting apparatus according to any one of claims 1 to 6.
The mounting head has a first condition reference mark used in the first imaging condition and a second condition reference mark used in the second imaging condition,
The control unit causes the component collected by the mounting head and the first condition reference mark to be imaged under the first imaging condition, and the component collected by the mounting head and the second condition reference mark are The mounting apparatus according to any one of claims 1 to 7, wherein imaging is performed under a second imaging condition.
The mounting head adapts to the optical characteristics of the first component and the two or more sampling members that respectively sample the first component and the second component having different optical characteristics from the first component. A first condition reference mark used in the first imaging condition; and a second condition reference mark used in the second imaging condition adapted to the optical characteristics of the second component;
The control unit causes the component collected by the mounting head and the first condition reference mark to be imaged under the first imaging condition, and the component collected by the mounting head and the second condition reference mark are The mounting apparatus according to any one of claims 1 to 8, wherein imaging is performed under a second imaging condition.
The mounting head includes a first position reference mark and a second position reference mark having a predetermined positional relationship with the first position reference mark,
While the control unit moves the mounting head, the control unit causes the imaging unit to capture a first image including a component collected by the mounting head and the first position reference mark under the first imaging condition. A second image including the component collected by the mounting head and the second position reference mark is imaged by the imaging unit under the second imaging condition, and the first position reference mark, the second position reference mark, The mounting apparatus according to claim 1, wherein the predetermined process is performed using the first image and the second image based on the positional relationship.
The mounting head has two or more fiducial marks,
The control unit captures the first image before another reference mark enters the imaging range and after a specific reference mark other than the other reference mark and the component enter the same imaging range. The image is picked up by the image capturing unit, and then the second image is captured by the image capturing unit after the specific reference mark is out of the image capturing range and the other reference mark and the component are in the same image capturing range. 11. The mounting apparatus according to any one of 1 to 10.
After the first image is captured, the control unit causes the second image to be captured as a second imaging condition under a condition of an imaging height of a component lower than that of the first imaging condition. The mounting apparatus according to any one of claims 1 to 11.
The mounting apparatus according to any one of claims 1 to 12, wherein the reference mark is disposed on an outer peripheral side of the mounting member with respect to the sampling member.
The mounting apparatus according to any one of claims 1 to 13, wherein the mounting head is provided with the reference marks on a front side and a rear side in a moving direction of the mounting head.
Imaging processing in a mounting apparatus that includes one or more reference marks and a sampling member that samples components, a mounting head that moves the collected components onto a substrate, and an imaging unit that captures an image A method,
(A) While the mounting head picks up the component and mounts it on the substrate, the first image including the component picked up by the mounting head and the reference mark is picked up by the image pickup unit under a first image pickup condition. And causing the imaging unit to image a second image including the component collected by the mounting head and the reference mark under a second imaging condition different from the first imaging condition;
(B) performing a predetermined process using the first image and the second image;
An imaging processing method including:
An imaging unit used in a mounting apparatus having a mounting head that includes one or more reference marks and a sampling member for sampling a component and moves the sampled component onto a substrate,
An imaging unit that captures an image;
While the mounting head collects the component and mounts it on the substrate, the imaging unit captures a first image including the component collected by the mounting head and the reference mark under a first imaging condition, A second image including the component collected by the mounting head and the reference mark is captured by the imaging unit under a second imaging condition different from the first imaging condition, and the first image and the second image are captured. A control unit for performing a predetermined process using,
An imaging unit comprising