JP2009212373A - Component mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting apparatus which can shorten a time required for the mounting work of an electronic component, and to provide a packaging apparatus. <P>SOLUTION: The component mounting apparatus comprises an imaging apparatus control means 42 for identifying a plurality of heads 21 as working heads 21A each picking up an electronic component 2 and dummy heads 21B which do not pick up electronic components 2 based on data stored in a component data storage device 43, and moving an imaging apparatus 31 in a direction approaching the working head 21A while the working head 21A performs the pick-up operation of the electronic component 2 if there is a dummy head 21B between the imaging apparatus 31 and a working head 21A located at a position closest to the imaging apparatus 31 among the identified working heads 21A. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus for mounting an electronic component on a mounting portion.

  2. Description of the Related Art Generally, a surface component mounter that mounts an electronic component on a substrate is known as one of component mounting apparatuses that pick up an electronic component such as an IC, a transistor, and a capacitor by a head unit and mount the electronic component on a mounting portion. This surface component mounting machine has a head unit that moves between an upper part of a component supply unit that supplies electronic parts and an upper side of a substrate on which the electronic parts are mounted. In the head unit, a plurality of heads that can pick up an electronic component from the component supply unit and mount the electronic component on a substrate are mounted in parallel.

  The surface component mounting machine has an imaging device that captures an image of the electronic component picked up by each head, and whether each electronic component is picked up in a correct posture based on the image of the electronic component obtained by the imaging Recognize If the electronic component is not picked up in the correct posture, correct the posture before mounting it on the board, etc. It is preventing.

For example, in the surface component mounting machine described in Patent Document 1, the imaging device is mounted on the head unit. The imaging device is movable from one end of the head unit to the other end (from one end to the other end in the parallel direction of the heads), and when the head unit picks up a predetermined electronic component group and moves onto the substrate, the imaging device Moves from one end to the other to take an image of the electronic component. This surface component mounter can move the head unit and take images of electronic components at the same time, so the time required for mounting electronic components can be reduced compared to when they are performed at different timings. Can be planned.
JP 2006-59881 A

  However, in the surface component mounter as described above, when the moving distance of the head unit (distance from the component supply unit to the substrate) is short, the imaging operation is performed even though the head unit is positioned above the substrate. May not finish. In such a case, the movement of the head and the head unit is stopped and waits until the imaging operation is completed. Here, in the surface component mounting machine, a series of operations of picking up electronic components and mounting them on a substrate are repeated many times, and there is a demand for reducing the waiting time as much as possible and reducing the time. .

  The present invention has been completed based on the above circumstances, and an object of the present invention is to provide a component mounting apparatus capable of reducing the time required for mounting an electronic component.

  The component mounting apparatus of the present invention has a plurality of heads for picking up an electronic component, and is provided between the upper portion of the component supply portion to which the electronic component is supplied and the upper portion of the mounting portion for mounting the electronic component. A moving head unit; and an imaging device attached to the head unit so as to be movable between one end and the other end in the parallel direction of the heads, and capable of capturing an image of the electronic component picked up by the head; Picking up the plurality of heads and the electronic component based on the storage of the component data storage device and the component data storage device storing which of the plurality of heads the electronic component is picked up by And an empty head that does not pick up the electronic component, and is located closest to the imaging device among the operating heads When the empty head is between the working head and the imaging device, the imaging device is moved in a direction approaching the working head before all the working heads finish the pickup operation of the electronic component. And imaging device control means.

  According to such a configuration, when an image of the electronic component is captured, the movement of the imaging device starts from a position close to the operating head. Therefore, as compared with the conventional case where the imaging device always moves from one end of the head unit to the other end (that is, to the empty head), the time required for the imaging operation can be shortened. The time required for the mounting work can be shortened.

The imaging device control means recognizes an operating head located farthest from the imaging device among the operating heads, and if the empty head is further away from the operating head, the image of the electronic component is displayed. The imaging device that has finished imaging may be stopped before reaching one end or the other end of the head unit.
According to such a configuration, the time required for the imaging operation can be shortened compared with the case where the imaging apparatus always ends the operation after reaching one end or the other end of the head unit, and thus the mounting work of the electronic component It is possible to reduce the time required for

  The component data storage device stores a component size of the electronic component, and the imaging device control means determines the component size of the electronic component to be picked up by the operating head from information stored in the component data storage device. It is good also as what acquires and stops the movement of the said imaging device in the position which does not contact this electronic component. Accordingly, the imaging device can be moved to a position where the electronic component is not in contact with the electronic component depending on the size of the electronic component picked up by the operating head.

  The component data storage device stores the order in which the electronic components are picked up by the head, and the imaging device control means includes an operation reservation head for picking up the electronic components in the next step, and the step in the next step. An empty reservation head that does not pick up an electronic component is identified, and the empty reservation head is between the operation reservation head that is closest to the imaging device among the operation reservation heads and the imaging device, and the empty reservation head When the head is the empty head, the imaging device may be moved in a direction approaching the operation reservation head while the operation head performs the mounting operation of the electronic component.

  ADVANTAGE OF THE INVENTION According to this invention, the component mounting apparatus which can aim at shortening of the time concerning the mounting | wearing operation | work of an electronic component can be provided.

Hereinafter, embodiments of the present invention will be described with reference to FIGS.
A component mounting apparatus 1 according to the present embodiment is a surface component mounter (hereinafter simply referred to as a mounter 1) that mounts an electronic component 2 on a substrate 3, and picks up the electronic component 2 from the component supply unit 12 to obtain a substrate. 3 is equipped with a head unit 20 that can be mounted on the vehicle. In the following, each component will be described with the lower side in FIG. 1 as the front, the upper side as the rear, the upper side in FIG. 2 as the upper side, and the lower side as the lower side.

  The component supply units 12 are arranged on both sides (upper and lower sides in FIG. 1) of a pair of conveyors 11 installed on the base 10 of each mounting machine 1, and each component supply unit 12 includes a number of tape feeders. 12A is set. Each tape feeder 12A is provided with a tape on which electronic parts 2 such as ICs, transistors, capacitors, etc. are attached at regular intervals by being wound around a tape reel, and the electronic parts are fed out intermittently. 2 are sequentially supplied.

  The base 10 is provided with a pair of fixed rails 13 extending in the Y-axis direction (the X-axis direction is parallel to the transport direction of the substrate 3 and the Y-axis direction is perpendicular to the X-axis direction). A head unit support member 14 is suspended on the pair of fixed rails 13 in the X-axis direction. Further, the base 10 is provided with a Y-direction ball screw shaft 15A that is rotationally driven by a Y-axis servo motor 15. The Y-direction ball screw shaft 15A is provided with a ball nut (see FIG. (Not shown) are screwed together. The head unit support member 14 moves in the Y-axis direction with respect to the base 10 by the operation of the Y-axis servomotor 15.

  The head unit support member 14 has an X-direction ball screw shaft 16A driven by an X-axis servomotor 16. The X-direction ball screw shaft 16A has a ball nut (not shown) provided on the head unit 20. Z) are screwed together. The head unit 20 moves in the X-axis direction with respect to the head unit support member 14 by the operation of the X-axis servomotor 16.

  The X-axis servo motor 16 and the Y-axis servo motor 15 are controlled by the head control means 41, whereby the head unit 20 is provided above the component supply unit 12 that supplies the electronic component 2 and the board 3 on which the electronic component 2 is mounted. It moves in the X-axis direction and the Y-axis direction from above. The Y-axis servo motor 15 and the X-axis servo motor 16 are provided with encoders 15B and 16B, respectively, so that the position of the head unit 20 is detected.

  The head unit 20 is provided with a plurality of (six in this embodiment) heads 21 in parallel that can pick up the electronic component 2 from the component supply unit 12 and mount the electronic component 2 on the substrate 3. . The six heads 21 are provided in a line at substantially equal intervals in the extending direction (X-axis direction) of the conveyor 11 (see FIG. 2).

  A suction nozzle 22 is provided at the lower end (tip) of each head 21 (see FIGS. 3 and 4). Each suction nozzle 22 is connected to a negative pressure generator (not shown), and can hold the electronic component 2 detachably by the negative pressure suction force.

  Each head 21 is moved in the Z-axis direction (vertical direction) and rotated around the R-axis (nozzle central axis) by an elevating drive unit and a rotary drive unit using a Z-axis servo motor and an R-axis servo motor (not shown) as drive sources. Is possible. The Z-axis servo motor and the R-axis servo motor are controlled by the head control means 41, whereby each head 21 is moved to the lowered position where the electronic component 2 can be picked up and mounted, and the head unit 20 moves. In order to mount the electronic component 2 on the substrate 3 in a predetermined orientation, the electronic component 2 is rotated as necessary.

  The head unit 20 includes an imaging device 31 that captures an image of the electronic component 2 picked up by the head 21. As shown in FIG. 3, the imaging device 31 includes a frame 32 attached to the head unit 20, and the frame 32 is arranged below the head 21 at the raised position (the imaging device 31 is attached to the electronic component 2). And a shape that extends in the front-rear direction and is spaced apart from each other so that an image of the electronic component 2 can be taken.

  A joint portion between the frame 32 and the head unit 20 is provided with a scanning direction ball screw shaft 33 extending in the parallel direction of the head 21 (X-axis direction). A ball nut (not shown) provided on the frame 32 is screwed onto the scan direction ball screw shaft 33, and the scan direction ball screw shaft 33 is driven to rotate forward and backward by the operation of a scan shaft motor (not shown). The device 31 slides in the direction in which the heads 21 are arranged (scan direction). The scan shaft motor is controlled by the image pickup device control means 42, whereby the image pickup device 31 is stopped and restarted at an arbitrary position between one end and the other end of the head unit 20, and the position is detected. The One end and the other end of the head unit 20 are positions outside the heads 21 disposed at both ends of the head unit 20, and overlap with the heads 21 disposed at both ends in the front-rear direction (Y-axis direction). It is a position that must not be.

  A component camera 34 that captures the lower surface image and the side surface image of the electronic component 2 is mounted on the frame 32 (see FIGS. 3 and 4). The component camera 34 is integrally provided with a CCD line sensor 34A, an imaging lens 34B, and the like. The frame 32 includes a first light source 35 that illuminates the lower surface of the electronic component 2 picked up by the head 21 and a second light source 36 that illuminates the side surface of the electronic component 2. The 1st light source 35 and the 2nd light source 36 are comprised by LED. The frame 32 includes three reflecting members (a first reflecting member 37, a second reflecting member 38, and a third reflecting member) that reflect the light from the first light source 35 and the light from the second light source to the component camera 34 side. 39). The light from the first light source 35 is reflected on the lower surface of the electronic component 2, and the reflected light is guided to the component camera 34 side by the first reflecting member 37 and the third reflecting member 39. The light from the second light source 36 projects the electronic component 2 to the side and is guided to the component camera 34 side by the second reflecting member 38 and the third reflecting member 39. In this way, the imaging device 31 can capture the lower surface image and the side surface image of the electronic component 2 with one component camera 34.

  The imaging device 31 is controlled by the imaging device control means 42 and can selectively capture only the lower surface image, only the side image, and both the lower surface image and the side image of the electronic component 2. The imaging device control means 42 turns on the first light source 35 and the second light source 36 at predetermined timings, reads the imaging signal from the component camera 34, and performs predetermined processing on the readout imaging signal. Data of the lower surface image and the side surface image of the electronic component 2 suitable for recognition is generated.

  And the mounting machine 1 has the control part 40 which functions as the head control means 41 which controls operation | movement of the head unit 20, and the imaging device control means 42 which controls operation | movement of the imaging device 31 (refer FIG. 5). .

  In addition, the mounting machine 1 includes a component data storage device 43 that stores component data of the electronic component 2. The component data includes various data regarding the electronic component 2 mounted on the board 3, specifically the component size of the electronic component 2, the set position coordinates of the tape feeder 12 </ b> A provided with the electronic component 2 (the electronic in the component supply unit 12 The component 2 supply position coordinates), the mounting position coordinates of the electronic component 2 on the substrate 3, the identification code of the head 21 that picks up the electronic component 2 (the electronic component 2 is picked up by any of the six heads 21) And the order in which the electronic component 2 is picked up by the head unit 20 is recorded in advance corresponding to each electronic component 2. The heads 21 for picking up each electronic component 2 and the order thereof are determined in consideration of the performance and the like of each head 21 (the size and weight of the electronic component 2 that can be picked up by the head 21).

  Further, the component data storage device 43 stores in advance whether or not a take-out check is performed in mounting the electronic component 2 on each board 3. The take-out check means that after the operation of mounting the electronic component 2 on the substrate 3 is performed, that is, after the head 21 is lowered and raised on the substrate 3, the lower end of the head 21 is imaged by the imaging device 31. This is to check whether or not the electronic component 2 adsorbed by the head 21 is surely mounted on the substrate 3. If the electronic component 2 is not captured in the image obtained by the imaging, it is confirmed that the electronic component 2 is mounted on the substrate 3, and when the electronic component 2 is captured, the electronic component 2 is mounted on the substrate for some reason. It is confirmed that the suction nozzle 22 is not mounted on the suction nozzle 22 and remains sucked.

Next, the mounting operation of the electronic component 2 on the board 3 by the mounting machine 1 and the operation of the control unit 40 will be described together.
When the worker selects the type of board 3 to be produced on the mounting line, the mounting work routine shown in FIG. 6 is started.

  First, the control unit 40 determines the data of the electronic component 2 associated with the type of the board 3 (component size, the tape feeder 12A to which each electronic component 2 is attached) from the component data stored in the component data storage device 43. The set position coordinates, the mounting position coordinates on the substrate 3, the identification code of the head 21, the order in which the head unit 20 is picked up, etc.) are extracted (S101).

  Next, the control unit 40 extracts data of an electronic component group (hereinafter referred to as electronic component 2A) that is first picked up by the head unit 20 from the data of the electronic component 2 extracted in S101 (S102). .

  Next, the head control means 41 of the control unit 40 starts the operation of sequentially picking up the electronic components 2A (S103). Specifically, the head control means 41 moves the head unit 20 to a position above the tape feeder 12A based on the set position coordinates of the tape feeder 12A to which each electronic component 2A is attached, and moves each electronic component 2A. Based on the identification code of the head 21 to be picked up, the head 21 is lowered and the electronic component 2 is adsorbed by the adsorbing nozzle 22. The head control means 41 continues the operation until all the electronic components 2A extracted in S102 have been picked up by the head unit 20.

  Further, the imaging device control means 42 of the control unit 40 determines whether or not to move the imaging device 31 in preparation for component recognition while the head unit 20 sequentially picks up the electronic components 2A (S104). . Specifically, the imaging device control unit 42 includes, for the six heads 21, the operating head 21 </ b> A that picks up the electronic component 2 </ b> A and the empty head 21 </ b> B that does not pick up the electronic component 2 based on the data extracted in S <b> 102. Identify (see FIG. 7). When the empty head 21 </ b> B exists between the operating head 21 </ b> A located closest to the imaging device 31 among the operating heads 21 </ b> A and the imaging device 31, the imaging device 31 is moved in the direction of approaching the operating head 21. It is determined to be moved. If there is no empty head 21B between the operating head 21 and the imaging device 31, it is determined that the imaging device 31 is not moved. In this embodiment, at this time, the imaging device 31 is at the right end of the head unit 20 (indicated by a two-dot chain line in FIG. 7), and two empty heads 21B are provided between the imaging device 31 and the operating head 21A. Therefore, it is determined that the imaging device 31 is moved.

  If it is determined that the image pickup device 31 is to be moved (Yes in S104), the image pickup device control means 42 moves the image pickup device 31 in a direction approaching the working head 21A (left direction in FIG. 7) (S105). Thereafter, the movement of the imaging device 31 is stopped and waited (S106). At this time, the imaging device control means 42 acquires the component size of the electronic component 2 picked up by the operating head 21A from the storage of the component data storage device 43, and picks up the position that does not contact the electronic component 2 (the electronic component 2 is picked up). The movement of the imaging device 31 is stopped at a position slightly closer to the side of the operating head 21A than the position just behind the empty head 21B adjacent to the operating head 21A. Specifically, the imaging device control means 42 is picked up from the data extracted in S102 by the head 21 (the third operating head 21A from the right in FIG. 7) that is closest to the imaging device 31 among the operating heads 21. If the electronic component 2 is a large component, a moving distance to a position where the electronic component 2 does not contact the electronic component 2 is calculated. Then, the imaging device control unit 42 moves the imaging device 31 based on the calculated movement distance. When the electronic component 2 is not a large component, the imaging device control unit 42 positions the position almost immediately behind the adjacent head 21 (the central position of the imaging device 31 and the head 21 in the X-axis direction is the Y-axis direction). The imaging device 31 is moved to a position that substantially matches. Note that the large component referred to here is, for example, a size in which the imaging device 31 is in contact with the imaging device 31 when the electronic device 2 is picked up by the head 21 and the imaging device 31 is disposed immediately behind the adjacent head 21. It is.

  If it is determined not to move the imaging device 31 (No in S104), the imaging device control means 42 waits at that position without moving the imaging device 31 (S106).

  Next, the head control means 41 of the control unit 40 determines whether or not all the electronic components 2A have been picked up (S107). Specifically, the head control unit 41 determines that the pickup is completed when all the heads 21 that pick up the electronic component 2A (that is, the operating head 21A) have finished the lowering and raising operations on the component supply unit 12. If it has not been completed, it is determined that it has not been completed. If the pickup of the electronic component 2A has not been completed (No in S107), the pickup operation continues until completion, and the imaging device 31 continues to wait during that time.

  When the pickup of the electronic component 2A is completed (Yes in S107), the head control unit 41 starts moving the head unit 20 above the substrate 3, and the imaging device control unit 42 of the control unit 40 The movement of the imaging device 31 is started, and an image of the electronic component 2A is captured to recognize the suction posture (S108). Then, the imaging device control unit 42 stops the imaging device 31 when the imaging device 31 finishes taking the image of the electronic component 2A and moves to the back end of the head unit 20 (see FIG. 8).

  Then, based on the result of component recognition in S108, the head control means 41 lowers the operating head 21A after performing a measure such as correcting the posture of the electronic component 2 when the suction posture is incorrect. The operation of mounting the electronic component 2A on the substrate 3 is started (S109).

  Here, when the component data storage device 43 is set to perform a take-out check in the mounting operation of the electronic component 2 on the board 3 (Yes in S110), the imaging device control unit 42 While the unit 20 is performing the mounting operation of the electronic component 2, it is determined whether to move the imaging device 31 in preparation for a take-out check (S111). Specifically, when the empty head 21 </ b> B exists between the operating head 21 </ b> A at the position closest to the imaging device 31 that has finished imaging and stopped among the operating heads 21 </ b> A, the imaging device 31. Is moved in the direction approaching the operating head 21A, and when there is no empty head 21B, it is determined that the imaging device 31 is not moved. In the present embodiment, as shown in FIG. 8, since there is one empty head 21B between the imaging device 31 and the operating head 21A, it is determined that the imaging device 31 is to be moved.

  If it is determined that the image pickup device 31 is to be moved (Yes in S111), the image pickup device control means 42 moves the image pickup device 31 (S112) and is almost directly behind the empty head 21B adjacent to the operating head 21A. At the position (see FIG. 9), the imaging device 31 is stopped and waited (S113). If it is determined not to move the imaging device 31 (No in S111), the imaging device control means 42 waits at that position without moving the imaging device 31 (S113).

  Next, the head control means 41 of the control unit 40 determines whether or not the mounting of all the electronic components 2A on the board 3 has been completed (S114). Specifically, the head control means 41, as in S107, when all the heads 21 that have picked up the electronic component 2A (that is, the operating head 21A) have finished the lowering and raising operations on the substrate 3, It is determined that the mounting operation has been completed. If it has not been completed, it is determined that the mounting operation has not been completed. If the mounting operation of the electronic component 2A has not been completed (No in S114), the mounting operation is continued until it is completed, and the imaging device 31 continues to wait during that time.

  When the head 21 completes the mounting operation (Yes in S114), the control unit 40 sends the data of the electronic component 2 associated with the board 3 extracted in S101 to the head unit 20 at the next stage. It is determined whether there is a group of electronic components to be picked up (hereinafter referred to as electronic component 2B) (S115).

  When the electronic component 2B to be picked up is present (Yes in S115), the control unit 40 picks up the electronic component to be picked up by the head unit 20 in the next stage from the data of the electronic component 2 extracted in S101. Data relating to 2B is extracted (S116).

  Then, the head control means 41 moves the head unit 20 above the tape feeder 12A to which each electronic component 2B is attached, and the imaging device control means 42 starts to move the imaging device 31 and the head 21. An image of the lower end of the image is taken and checked for take-away (S117).

  Next, based on the result of the take-out check in S119, the control unit 40 performs a predetermined treatment when there is an electronic component 2A that has not been mounted on the substrate 3, and the electronic component 2A has been mounted on the substrate 3. If confirmed, the head control means 41 of the control unit 40 starts the operation of picking up the electronic components 2B in order (S103).

  If there is no electronic component 2B to be picked up in the next stage (No in S115), the imaging device control means 42 of the control unit 40 starts moving the imaging device 31 and images of the lower end of the head 21. And take-out check is performed (S118). Then, based on the result of the take-out check in S118, the control unit 40 performs a predetermined treatment when there is an electronic component 2A that is not mounted on the substrate 3, and the electronic component 2A is mounted on the substrate 3. If it is confirmed, the mounting work routine ends.

  On the other hand, when the setting for performing the take-out check in the mounting operation of the electronic component 2 on the board 3 is not made in the component data storage device 43 (No in S110), the control unit 40 is extracted in S101. It is determined from the data of the electronic component 2 whether there is an electronic component 2B to be picked up by the head unit 20 in the next stage (S120).

  If there is an electronic component 2B to be picked up (Yes in S120), the control unit 40 extracts data related to the electronic component 2B from the data of the electronic component 2 extracted in S101 (S121).

  Next, the imaging device control means 42 of the control unit 40 determines whether or not to move the imaging device 31 in preparation for component recognition of the electronic component 2B while the head unit 20 is performing the mounting operation of the electronic component 2A. (S122). Specifically, the imaging device control means 42, based on the data extracted in S121, for the six heads 21, the operation reservation head 21C that picks up the electronic component 2B at the next stage, and the electronic component at the next stage The empty reservation head 21D that does not pick up 2B is identified (see FIG. 10). And among the operation reservation heads 21C, there is an empty reservation head 21D between the operation reservation head 21C at the position closest to the imaging device 31 that has stopped imaging and the imaging device 31, and that When the empty reservation head 21D is the empty head 21B at this stage, it is determined that the imaging device 31 is moved in a direction approaching the operation reservation head 21C. Further, when there is no empty reservation head 21D between the operation reservation head 21C and the imaging device 31, and even if there is an empty reservation head 21D, if the head 21D is the operation head 21A at this stage, imaging is performed. It is determined that the device 31 is not moved. In this embodiment, there is an empty reservation head 21D between the imaging device 31 (shown by a two-dot chain line in FIG. 10) and the operation reservation head 21C, and the empty reservation head 21D is an empty head at this stage. Since it is 21B, it is determined that the imaging device 31 is moved.

  If it is determined that the imaging device 31 is to be moved (Yes in S122), the imaging device control means 42 moves the imaging device 31 (S123) and is directly behind the empty reservation head 21D adjacent to the operation reservation head 21C. The image pickup apparatus 31 is stopped at the position (see FIG. 10) and waits (S124). If it is determined not to move the imaging device 31 (No in S123), the imaging device control means 42 waits at that position without moving the imaging device 31 (S124).

Next, the head control means 41 of the control unit 40 determines whether or not the mounting of all the electronic components 2A on the substrate 3 has been completed, similarly to S114 (S125).
When the mounting operation of the electronic component 2A is completed (Yes in S125), the head control unit 41 of the control unit 40 moves the head unit 20 onto the component supply unit 12 based on the data extracted in S121, In the next stage, an operation of sequentially picking up the electronic components 2B to be mounted on the board 3 is started (S126). Then, the head control means 41 of the control unit 40 determines whether or not the pickup of all the electronic components 2B has been completed (S107). If the pickup of the electronic components 2B has been completed (Yes in S107), the head control is performed. The means 41 moves the head unit 20 above the substrate 3, and the imaging device control means 42 of the control unit 40 starts moving the imaging device 31, picks up an image of the electronic component 2 </ b> B, and sucks it. Is recognized (S108), and the operation of mounting the electronic component 2B on the board 3 is started as described above.

  On the other hand, when there is no electronic component 2B to be picked up (No in S120), the head control means 41 of the control unit 40 determines whether or not the mounting of all the electronic components 2B on the substrate 3 has been completed ( S127) If the mounting operation of the electronic component 2A is not completed (No in S127), the mounting operation is continued, and if the mounting operation of the electronic component 2A is completed (Yes in S127), the mounting work routine is finish.

According to the present embodiment configured as described above, the following effects can be obtained.
Based on the storage of the component data storage device 43, the imaging device control means 42 identifies the plurality of heads 21 as an operating head 21A that picks up the electronic component 2 and an empty head 21B that does not pick up the electronic component 2. When there is an empty head 21B between the imaging head 31 and the operating head 21A closest to the imaging device 31 among the heads 21A, while the operating head 21A performs the pickup operation of the electronic component 2A, The imaging device 31 is moved in a direction approaching the working head 21A.

  That is, when the empty head 21B exists in the plurality of heads 21 and there is a space in which the imaging device 31 can move in a direction approaching the operating head 21A, the operating head 21A has the electronic component 2A. It moves in advance during the pickup operation. When the working head 21A finishes the pickup operation and takes an image of the electronic component 2A, the movement of the imaging device 31 starts from a position close to the working head 21A. Therefore, as compared with the conventional case, after the head 21 finishes the pick-up operation, the image pickup apparatus 31 is in an image pickup operation as compared with the case where the image pickup device 31 always moves from one end of the head unit 20 to the other end (that is, up to the empty head 21B). Such time can be shortened. That is, the work time required for the imaging operation can be shortened by the amount of movement of the imaging device 31 in advance while the operating head 21A is performing the pickup operation. Thereby, the movement of the head 21 and the head unit 20 is stopped because the imaging operation by the imaging device 31 is not completed even though the head unit 20 picking up the electronic component 2 has reached the upper position of the substrate 3. The situation of waiting is difficult to occur. For this reason, since the waiting time of the head unit 20 can be reduced in a series of operations repeatedly performed when the electronic component 2 is mounted on the substrate 3, the time required for the mounting operation of the electronic component 2 can be reduced. Can do.

  Further, the imaging device control means 42 acquires the component size of the electronic component 2 picked up by the operating head 21 </ b> A, and stops the movement of the imaging device 31 at a position where it does not contact the electronic component 2. Thereby, the imaging device 31 can be moved to a position close to the electronic component 2 as much as possible in accordance with the size of the electronic component 2 picked up by the operating head 21A, thereby reducing the work time required for the imaging operation. can do.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

  (1) In the above embodiment, the present invention is applied to the mounting machine 1 that mounts the electronic component 2 on the substrate 3. However, the present invention is not limited to this. Can be applied to various devices such as an inspection machine that inspects electronic components by being picked up and placed on a socket (corresponding to the mounting portion of the present invention).

  (2) In the above embodiment, the component data storage device 43 is provided in the mounting machine 1, but is not limited thereto, and may be provided in, for example, a management computer provided separately from the mounting machine.

  (3) In the above embodiment, when the electronic component 2 is a large component, the imaging device control means 42 is located closer to the side slightly away from the operating head 21A than the position immediately behind the adjacent empty head 21B. However, the present invention is not limited to this. For example, when the electronic component 2 is a small component, the position can be as close as possible to the small component (adjacent to the head 21 for picking up the small component). The imaging device 31 may be moved to a position beyond the position just behind the head. Thereby, further shortening of the time concerning the mounting work of the electronic component 2 can be aimed at.

  (4) In the above embodiment, when there is no take-out check (No in S120), the imaging device control means 42 prepares for component recognition of the electronic component 2B to be picked up in the next stage, and the head 21A is in this stage. While the electronic component 2A is being mounted, the image pickup apparatus 31 is moved to the vicinity of the operation reservation head 21C. However, the present invention is not limited to this. While the electronic component 2B is being picked up, the imaging device 31 may be moved.

  (5) In the above embodiment, the imaging device control means 42 stops the imaging device 31 that has finished component recognition at the other end of the head unit 20 (the left end in FIG. 8). The device 31 may be stopped before reaching the other end of the head unit 20. Specifically, the imaging device control means 42 is the operating head located farthest from the imaging device 31 (the imaging device before starting the component recognition and indicated by a two-dot chain line in FIG. 8) in the operating head 21A. 21A (second head 21 from the left in FIG. 8) is recognized, and an image of the electronic component 2 is taken when there is an empty head 21B (the leftmost head 21 in FIG. 8) farther than this working head 21A. The imaging device 31 that has been finished may be stopped at a position before reaching the other end of the head unit 20 (a position almost directly behind the empty head 21B). As a result, the time required for the imaging operation can be shortened as in the above embodiment. Similarly to moving the imaging device 31 in preparation for component recognition, the imaging device control unit 42 stops the movement of the imaging device 31 in consideration of the component size of the electronic component 2 picked up by the operating head 21A. It may be.

Plan view of mounting machine in this embodiment Front view Side view showing schematic configuration of imaging apparatus Same perspective view Block diagram showing the electrical configuration of the mounting machine Flow chart showing the flow of mounting work Conceptual diagram showing how the imaging device has moved for component recognition Conceptual diagram showing how the imaging device stopped after completing component recognition Conceptual diagram showing how the imaging device has moved for take-out checks Conceptual diagram showing how the imaging device has moved for the next stage of component recognition

Explanation of symbols

1 ... Mounting machine (component mounting device)
DESCRIPTION OF SYMBOLS 2 ... Electronic component 3 ... Board | substrate 12 ... Component supply part 20 ... Head unit 21 ... Head 21A ... Working head 21B ... Empty head 21C ... Working reservation head 21D ... Empty reservation head 31 ... Imaging device 42 ... Imaging device control means 43 ... Component Data storage device

Claims (4)

A head unit that has a plurality of heads for picking up electronic components, and moves between an upper portion of a component supply portion to which the electronic components are supplied and an upper portion of a mounting portion for mounting the electronic components;
An imaging device attached to the head unit so as to be movable between one end and the other end in the parallel direction of the heads, and capable of capturing an image of the electronic component picked up by the head;
A component data storage device storing which one of the plurality of heads the electronic component is picked up;
Based on the storage of the component data storage device, the plurality of heads are identified as an operating head that picks up the electronic component and an empty head that does not pick up the electronic component. When the empty head is between the operating head at a close position and the imaging device, the imaging device approaches the operating head before all the operating heads finish the pickup operation of the electronic component. An image pickup apparatus control means for moving in a direction. The imaging device control means recognizes an operating head located farthest from the imaging device among the operating heads, and if the empty head is further away from the operating head, the image of the electronic component is displayed. The component mounting apparatus according to claim 1, wherein the imaging device that has finished imaging is stopped before reaching one end or the other end of the head unit. The component data storage device stores a component size of the electronic component,
The imaging device control means acquires the component size of the electronic component picked up by the operating head from the information stored in the component data storage device, and stops the movement of the imaging device at a position where it does not contact the electronic component. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is a component mounting apparatus. The component data storage device stores the order in which the electronic components are picked up by the head,
The imaging device control means identifies an operation reservation head that picks up the electronic component in the next step, and an empty reservation head that does not pick up the electronic component in the next step,
If there is the empty reservation head between the operation reservation head closest to the imaging device among the operation reservation heads and the imaging device, and the empty reservation head is the empty head, the operation 4. The apparatus according to claim 1, wherein the imaging device is moved in a direction approaching the operation reservation head while the head performs the mounting operation of the electronic component. 5. Component mounting device.

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