JP6475165B2 - Mounting device - Google Patents

Description

  The present invention relates to a mounting apparatus.

  2. Description of the Related Art Conventionally, as a mounting apparatus, an apparatus that mounts a component on a substrate after correcting a positional deviation between the substrate and the component is known. For example, the mounting apparatus disclosed in Patent Document 1 recognizes an image of a component alignment mark and a substrate alignment mark with a two-view camera, and a bonding stage that holds the substrate based on the image recognition in the X and Y directions (horizontal directions). Then, after correcting the position in the θ direction (rotation direction), the component is mounted on the board.

  As a mounting apparatus, an apparatus that detects the height of a component mounting position on a substrate is also known. For example, the mounting apparatus described in Patent Document 2 includes a head that picks up components, a camera, and two arms having a plane mirror that is inclined with respect to a vertical line. In this mounting apparatus, two arms are arranged directly below the camera and directly below the head, respectively, and the components picked up by the head are imaged by the camera to perform component recognition. Also, this mounting apparatus detects the height of the component mounting position by imaging the component mounting position on the board with the camera in a state where the arm is shifted from directly under the camera to the side.

Japanese Patent Laid-Open No. 2007-12802 JP-A-6-244594

  However, in the mounting apparatus described in Patent Document 1, information regarding the height of the substrate surface is not acquired, and correction for the deviation in the height direction of the substrate surface is not performed. Therefore, when there is a deviation in the height of the substrate surface due to, for example, the substrate being warped, the mounting accuracy may not be increased due to an excess or deficiency of the load when the component is pressed against the substrate. Further, in the mounting apparatus described in Patent Document 2, although the height of the component mounting position can be detected, it is necessary to move the arm when switching between component recognition and height detection, which increases the time required for the mounting process. End up.

  The present invention has been made in view of such problems, and has as its main object to mount components with higher accuracy while further suppressing an increase in time required for mounting processing.

The mounting apparatus of the present invention is
A mounting head for holding the component, transporting the component and mounting the component on the substrate;
A first imaging unit that images a component held by the mounting head; a second imaging unit that images a facing region of the substrate surface facing the held component; and a substrate height of the facing region of the substrate A height-related information acquisition unit that acquires height-related information related to height, and an imaging unit,
While maintaining the relative positions of the first imaging unit, the second imaging unit, and the height-related information acquisition unit, the position between the component held by the mounting head and the facing region is the first An imaging moving means capable of moving the imaging means to an imaging position where imaging by the imaging unit and the second imaging unit and acquisition of the height-related information are possible;
It is equipped with.

  The mounting apparatus according to the present invention includes a component and a substrate that are held by the mounting head, and have an imaging means having them while maintaining the relative positions of the first imaging unit, the second imaging unit, and the height-related information acquisition unit. It is possible to move to an imaging position which is a position between the surface and a facing region facing the component. Then, in the state of moving to this imaging position, the first imaging unit images the component held by the mounting head, the second imaging unit images the opposing area, and the height related information acquisition unit is the board height of the opposing area. Get height related information about height. By doing so, the imaging and height of the component and the board can be performed without interposing the movement of one or more of the first imaging unit, the second imaging unit, and the height-related information acquisition unit and the movement of other mechanisms. Related information can be acquired. Therefore, an increase in time required for the mounting process can be further suppressed. Then, by performing imaging of the component and the substrate and acquiring height-related information, for example, based on the obtained information, a deviation in the substrate height direction of the substrate surface with respect to the component or a deviation in the direction orthogonal to the substrate height direction In consideration of the above, the component can be mounted on the substrate. Therefore, components can be mounted with higher accuracy. Here, the “substrate surface” may be a surface on a substrate on which a component is to be mounted, and includes, for example, the surface of another component that has been mounted. The “height-related information” may be information that can derive the substrate height of the opposing region, and may be information that directly represents the substrate height of the opposing region, or may be information that is indirectly represented. Good. The information that indirectly represents the substrate height of the opposing region includes information that can be regarded as the substrate height of the opposing region, such as information that represents the substrate height around (in the vicinity of) the opposing region of the substrate surface. In addition, as information that is indirectly represented, for example, information used for deriving the substrate height of the opposing region, such as image data, can be cited.

  The mounting apparatus of the present invention is a component held by the mounting head based on component image data captured and acquired by the first imaging unit and board image data captured and acquired by the second imaging unit. And a first correction unit that corrects a positional deviation in a direction perpendicular to the board height direction between the mounting position of the component on the board and the height-related information acquired by the height-related information acquisition unit. The mounting head may include second correction means for correcting a movement distance of the component in the substrate height direction when the component is mounted on the substrate. The first correction unit may perform the correction by changing one or more positions of the mounting head and the substrate. The first correction unit may perform the correction in consideration of the substrate height of the counter area based on the height related information acquired by the height related information acquisition unit.

  In the mounting apparatus according to the aspect of the invention, the mounting head includes a plurality of holding units that are arranged in a predetermined arrangement direction and can hold the component, and the imaging moving unit includes the first imaging unit and the second imaging unit. The imaging unit may be movable to the imaging position of each of the plurality of holding units while maintaining a relative position between the height-related information acquisition unit and the height-related information acquisition unit. In this way, it is easier to simplify the configuration of the mounting apparatus than in the case where the imaging means is provided for each of the plurality of holding units. In this case, the holding unit may be a suction nozzle that sucks and holds the component.

  The mounting apparatus of the present invention includes a head moving unit capable of moving the mounting head and the imaging unit while maintaining a relative position of each other, and the imaging moving unit is a relative position of the imaging unit with respect to the mounting head. The position may be changed. In this case, since the imaging unit moves with the movement of the mounting head, the imaging moving unit only needs to change the relative position of the imaging unit with respect to the mounting head, and the configuration of the imaging moving unit can be easily simplified. In this case, the mounting head includes a plurality of holding units that are arranged in a predetermined arrangement direction and can hold the component, and the imaging movement unit moves the imaging unit in the arrangement direction, thereby The imaging unit may be movable to the imaging position of each of the plurality of holding units and to a standby position that does not hinder the mounting of the components held by the plurality of holding units. In this case, the imaging moving unit only needs to be able to move the imaging unit in the arrangement direction, and thus the configuration of the imaging moving unit can be more easily simplified.

  In the mounting apparatus of the present invention, the height-related information acquisition unit includes a spot light source that irradiates spot light on the substrate surface, an optical system, and imaging that receives reflected light of the spot light through the optical system. And image data obtained by imaging the surface of the substrate including the spot light by the imaging element may be acquired as the height-related information. In this way, if the position of the substrate surface in the height direction changes, the position of the spot light in the image data also changes. Therefore, based on the position of the spot light in the image data, the substrate height of the counter area Can be detected relatively easily. The spot light source may irradiate the spot light in the facing area.

  In the mounting apparatus of the present invention in which the height related information acquisition unit images the surface of the substrate, the second imaging unit includes an optical system common to the height related information acquisition unit, and the height related information acquisition unit. A common imaging device, and the imaging device captures the opposing region, and the height-related information acquisition unit captures image data obtained by capturing the opposing region including the spot light by the imaging device. You may acquire as height related information. By doing so, the configuration of the imaging means can be simplified by sharing the optical system and the imaging device. Note that at least one of the optical system and the image sensor of the height-related information acquisition unit may be common to the second imaging unit.

  In the mounting apparatus according to the aspect of the invention, the imaging unit includes an imaging main body unit to which the first imaging unit, the second imaging unit, and the height-related information acquisition unit are fixed. The imaging main body may be moved. This makes it easier to simplify the configuration of the imaging movement unit than when the first imaging unit, the second imaging unit, and the height-related information acquisition unit are moved separately.

It is a block diagram which shows the outline of a structure of the mounting apparatus 10 which is one Embodiment of this invention. 3 is a block diagram illustrating an electrical connection relationship of a control device 90. FIG. It is the perspective view which looked at the camera unit 70 from the upper right. It is the perspective view which looked at the camera unit 70 from the lower right. It is a flowchart which shows an example of a component mounting process routine. It is explanatory drawing which shows the state which moved the camera unit 70 to the imaging position when components P1 is set to the mounting object component. 6 is a conceptual diagram showing a relationship between a substrate height in a facing area F and spot light from a spot light source 83. FIG. It is explanatory drawing which shows the state which moved the camera unit 70 to the imaging position when the components P2 is set to the mounting object component.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram showing an outline of a configuration of a mounting apparatus 10 according to an embodiment of the present invention, and FIG. 2 is a block diagram showing an electrical connection relationship of a control apparatus 90.

  As shown in FIG. 1, the mounting apparatus 10 backs up a component supply device 20 that supplies electronic components (hereinafter referred to as “component P”), a substrate transport device 30 that transports the substrate 16, and the transported substrate 16. A backup device 40 for mounting, a component mounting device 50 for mounting the component supplied by the component supply device 20 on the substrate 16 backed up by the backup device 40, and a control device 90 (see FIG. 2) for controlling the entire mounting device. Provided (see FIG. 3 to be described later for the component P). The substrate transfer device 30, the backup device 40, and the component mounting device 50 are accommodated in a housing 12 that is placed on the base 14 in a replaceable manner. Although only one component mounter 10 is shown in FIG. 1, a plurality of component mounters are arranged side by side in the component mounting line, and the control device of each component mounter manages these components. Management computer 100 (see FIG. 2). In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG. “Mounting” includes placing, mounting, inserting, joining, and adhering the component P on the substrate 16.

  The component supply device 20 includes a tape feeder 22 detachably attached to the front side of the housing 12. The tape feeder 22 includes a reel 22a around which a tape is wound, and components P are attached to the tape surface at predetermined intervals. These parts P are protected by a film covering the surface of the tape, and when the tape is pulled out from the reel 22a, the film is peeled off at the feeder portion 22b and supplied.

  The substrate transfer device 30 includes a pair of support plates 32a and 32b provided at a predetermined interval in the Y-axis direction on the lower side of the housing 12, and a pair of conveyors provided on surfaces of the support plates 32a and 32b facing each other. Belts 34a and 34b. The pair of support plates 32a and 32b are configured as rectangular members whose longitudinal direction is the X-axis direction, and driving wheels and driven wheels are provided at both ends in the longitudinal direction. The conveyor belts 34a and 34b are stretched over driving wheels and driven wheels provided on the support plates 32a and 32b, and the driving wheels are driven by a driving motor (not shown), so that the substrate 16 is moved from the left in FIG. Transport to the right.

  The backup device 40 includes a backup plate 42 that can be moved up and down by a lifting device (not shown), and a base plate 44 that is mounted on the upper surface of the backup plate 42. The base plate 44 is provided with a plurality of backup pins 46 for backing up the substrate 16 from the back side.

  The component mounting apparatus 50 includes an X-axis slider 52 that is moved in the X-axis direction by driving the X-axis motor 51, a Y-axis slider 54 that is moved in the Y-axis direction by driving the Y-axis motor 53, and the X-axis slider 52. The head 60 attached to the head 60, the suction nozzle 62 that can be attached to the head 60 and can suck the component P so as to be able to move in the Z-axis direction and rotate around the Z-axis, and the component P sucked by the suction nozzle 62 Parts camera 58, a nozzle stocker 59 that stocks a plurality of types of suction nozzles that can be mounted on the head 60, a component P attached to the lower side of the X-axis slider 52 and sucked by the suction nozzle 62, the substrate 16, and the like And a camera unit 70 for capturing the image.

  The X-axis slider 52 is attached to a guide rail 55 provided along the X-axis direction on the front surface of the Y-axis slider 54 and is slidable in the X-axis direction while being guided by the guide rail 55. The Y-axis slider 54 is attached to a guide rail 56 provided along the Y-axis direction at the top of the housing 12, and is slidable in the Y-axis direction while being guided by the guide rail 56. The X-axis slider 52 and the Y-axis slider 54 enable the head 60 to move in the XY direction.

  The parts camera 58 is disposed on the front side of the substrate transfer apparatus 30. The imaging range of the parts camera 58 is above the parts camera 58. When the suction nozzle 62 that sucks the component P passes above the part camera 58, the parts camera 58 captures the state of the sucked component P and outputs the image to the control device 90. The control device 90 determines whether or not the component P is normally sucked by comparing the image picked up by the parts camera 58 with an image in a normal sucking state stored in advance.

  The head 60 includes a plurality of suction nozzles as the suction nozzles 62 as shown in the enlarged portion of FIG. In the present embodiment, the head 60 includes the suction nozzles 62 a and 62 b as the suction nozzle 62. The plurality of suction nozzles 62 (suction nozzles 62a and 62b) are arranged side by side in a predetermined arrangement direction (Y-axis direction in the present embodiment). The suction nozzle 62a is disposed on the front side of the suction nozzle 62b. The head 60 includes a nozzle holder (not shown) configured as a cylindrical member having an internal passage and holding the suction nozzles 62a and 62b. The suction nozzles 62a and 62b are configured to be attachable to and detachable from the nozzle holder, and can be replaced with ones suitable for the shape and size of the part P to be sucked. The internal passages (not shown) of the suction nozzles 62a and 62b communicate with the internal passage of the nozzle holder, and a pipe (not shown) is connected through the internal passage. When adsorbing the component P to the tips of the suction nozzles 62a and 62b, a negative pressure is supplied to the nozzle tip via the piping, and when separating the component P adsorbing at the tip, it is positively applied to the nozzle tip via the piping. Supply pressure.

  The head 60 includes Z-axis motors 66a and 66b and θ-axis motors 68a and 68b. The suction nozzle 62a can be moved in the Z-axis direction by a Z-axis motor 66a, and can be rotated around the Z-axis by a θ-axis motor 68a. Similarly, the suction nozzle 62b can be moved in the Z-axis direction by the Z-axis motor 66b, and can be rotated around the Z-axis by the θ-axis motor 68b.

  The camera unit 70 has an upper field of view camera 71 that captures the upper direction, a lower field of view camera 72 that captures the lower direction, and a high image data that captures the lower direction and measures the substrate height of the substrate 16. This is a unit in which the length sensor 73 is built in a substantially rectangular parallelepiped main body 74 (see FIG. 2). The camera unit 70 is supported by a support member 69 attached to the lower side of the X-axis slider 52. When the head 60 is moved by the X-axis slider 52 and the Y-axis slider 54, the camera unit 70 moves in the XY directions. To do. In addition, a camera moving unit 76 configured as a slider that is moved in the Y-axis direction by driving of a camera moving motor 75 (see FIG. 2) is attached to the camera unit 70. The camera moving unit 76 is attached to a guide rail (not shown) provided along the Y-axis direction on the left and right side surfaces in the lower opening of the support member 69, and can slide in the Y-axis direction while being guided by the guide rail. It has become. The camera moving unit 76 allows the camera unit 70 to move in the Y-axis direction. Since the camera unit 70 is connected to the head 60 via the support member 69 and the X-axis slider 52, the relative position of the camera unit 70 with respect to the head 60 is changed by the camera moving unit 76.

  The upper field camera 71, the lower field camera 72, and the height sensor 73 included in the camera unit 70 will be described in detail. FIG. 3 is a perspective view of the camera unit 70 as viewed from the upper right. FIG. 4 is a perspective view of the camera unit 70 as viewed from the lower right.

  As shown in FIG. 3, the upper visual field camera 71 can image the upper portion of the main body 74 and captures the component P sucked by the suction nozzle 62 of the head 60 to acquire component image data. The upper visual field camera 71 includes an upper incident port 77 that is an opening formed in front of the upper surface of the main body 74, and an upper illumination unit 81 that is disposed so as to surround the upper incident port 77 on the upper surface of the main body 74. It is equipped with. The upper incident port 77 can enter light into the main body 74 from the upper side of the camera unit 70. The upper incident port 77 is closed with a light-transmitting material such as a cover glass. The upper illumination unit 81 emits light upward, and can irradiate light to the lower surface of the component P existing above the upper entrance port 77 when the upper visual field camera 71 captures an image.

  Further, as shown in FIG. 2, the upper-field camera 71 includes an optical system 84 a, an image sensor 87 a, and an image processing unit 88 a inside the main body 74. The optical system 84a includes a plurality of mirrors and lenses including a mirror 85a (see FIG. 7 described later) that is disposed below the upper incident port 77 and reflects light from the outside. The image sensor 87a is configured by a CCD, a CMOS, or the like, and generates charges by receiving light through the upper incident port 77 and the optical system 84a, and outputs the generated charges to the image processing unit 88a. The image processing unit 88a generates component image data based on the charge input from the image sensor 87a. As shown in FIG. 3, the upper-field camera 71 is attracted to the suction nozzle 62 when the imaging element 87 a performs imaging in a state where the component P sucked by the suction nozzle 62 a exists directly above the upper incident port 77. The component image data obtained by imaging the region including the component P is acquired.

  As shown in FIG. 4, the lower visual field camera 72 can image the lower part of the main body 74, and images the facing region F of the substrate 16 facing the component P sucked by the suction nozzle 62 of the substrate 16. The substrate image data is acquired. In FIG. 4, the facing region F is shown as being transmitted from the back side of the substrate 16. The lower visual field camera 72 includes a lower incident port 78 that is an opening formed in front of the lower surface of the main body 74, and a lower illumination unit 82 that is disposed so as to surround the lower incident port 78 on the lower surface of the main body 74. It is equipped with. The lower incident port 78 is located directly below the upper incident port 77, and light can enter the main body 74 from the lower side of the camera unit 70. The lower entrance 78 is closed with a light-transmitting material such as a cover glass. The lower illumination unit 82 emits light downward, and can irradiate light to the substrate 16 existing below the lower incident port 78 when imaged by the lower visual field camera 72.

  As shown in FIG. 2, the lower-field camera 72 includes an optical system 84 b, an image sensor 87 b, and an image processing unit 88 b inside the main body 74. The optical system 84b includes a plurality of mirrors and lenses including the mirror 85a. In the optical system 84b, the mirror 85a is common to the optical system 84a of the upper-field camera 71. The imaging element 87b is configured by a CCD, a CMOS, or the like, and generates charges by receiving light through the lower incident port 78 and the optical system 84b, and outputs the generated charges to the image processing unit 88b. The image processing unit 88b generates substrate image data based on the charge input from the image sensor 87b. As shown in FIG. 4, the imaging device 87 b performs imaging in a state where the substrate 16 is present directly below the lower incident port 78, so that the lower field-of-view camera 72 is adsorbed by the adsorption nozzle 62 on the surface of the substrate 16. Board image data obtained by imaging the facing area F (area immediately below the part P) facing the part P is acquired.

  The height sensor 73 is capable of capturing an image below the main body 74, captures the facing area F of the substrate 16, and acquires height-related image data used for detecting the substrate height of the facing area F. . The height sensor 73 includes a lower incident port 78, a spot light source 83 disposed behind the lower incident port 78 on the lower surface of the main body 74, an optical system 84b, an image sensor 87b, an image processing unit 88b, It has. In the height sensor 73, the lower incident port 78, the optical system 84 b, the image sensor 87 b, and the image processing unit 88 b are common to the lower field camera 72. The spot light source 83 irradiates the directional spot light in a direction inclined from the lower direction, and can irradiate a part of the facing region F of the substrate 16 existing below the lower incident port 78 with the spot light. It has become. In this embodiment, the spot light source 83 emits the spot light in a direction inclined 45 ° forward from the lower direction. The height sensor 73 captures the facing area F in the state where the spot light source 83 irradiates the facing area F of the substrate 16 with the spot light and acquires the height-related image data in the same manner as the lower-field camera 72. For this reason, the image represented by the height-related image data includes (images), for example, a circular region of the surface of the substrate 16 that is irradiated with the spot light.

  As shown in FIG. 2, the control device 90 is configured as a microprocessor centered on a CPU 91, and includes a ROM 92 that stores a processing program, an HDD 93 that stores various data, a RAM 94 that is used as a work area, an external device, and an electrical device. An input / output interface 95 for exchanging signals is provided, and these are connected via a bus 96. The control device 90 includes a substrate transfer device 30, a backup device 40, an X-axis motor 51, a Y-axis motor 53, a parts camera 58, Z-axis motors 66a and 66b, θ-axis motors 68a and 68b, an upper illumination unit 81, and a lower illumination. Drive signals to the unit 82, the spot light source 83, the image sensors 87a and 87b, the camera moving motor 75, and the like are output via the input / output interface 95. Further, the control device 90 inputs image data from the parts camera 58 and the image processing units 88 a and 88 b through the input / output interface 95.

  As shown in FIG. 2, the management computer 100 is configured as a microprocessor centered on a CPU 101, and includes a ROM 102 for storing processing programs, an HDD 103 for storing various data, a RAM 104 used as a work area, an external device and an electric device. An input / output interface 105 for exchanging signals is provided, and these are connected via a bus 106. Further, the management computer 100 can input signals from an input device 112 typified by a mouse and a keyboard via the input / output interface 105, and is connected to the display 114 so that various images can be output. The HDD 103 of the management computer 100 stores mounting condition information used for mounting in the mounting apparatus 10. The mounting condition information includes information such as the mounting order of the components P, the component type, the component size, and the mounting position on the board 16. The mounting position information is, for example, information representing the XY coordinates of the center of the component P.

  Next, the operation of the mounting apparatus 10 of the present embodiment configured as described above, in particular, the process of mounting the component P on the substrate 16 while correcting the positional deviation of the component P with respect to the substrate 16 will be described. FIG. 5 is a flowchart illustrating an example of a component mounting process routine executed by the CPU 91 of the control device 90. This routine is stored in the HDD 93 of the mounting apparatus 10 and is executed, for example, when a start instruction is input by an operator or when the substrate 16 is conveyed by the substrate conveying device 30 and backed up to the backup device 40.

  When this routine is started, the CPU 91 of the control device 90 first acquires mounting condition information from the management computer 100 and stores it in the HDD 93 (step S100). Next, the CPU 91 causes the suction nozzle 62 to suck the component P to be mounted next based on the acquired mounting condition information (step S110). The CPU 91 determines a component P to be mounted next based on information such as the mounting order and component type included in the mounting condition information acquired in step S100. Further, the CPU 91 drives and controls the X-axis motor 51 and the Y-axis motor 53 so as to move the head 60 to the component extraction position of the tape feeder 22 in which the corresponding component is stored. Then, the CPU 91 drives and controls the Z-axis motor 66a to lower the suction nozzle 62a and apply a negative pressure to the suction nozzle 62a to cause the suction nozzle 62a to suck the component P. When there are two or more components P to be mounted next, the CPU 91 similarly performs the suction of the component P to the suction nozzle 62b, and sucks the two components P to the suction nozzles 62a and 62b, respectively. Hereinafter, the part P sucked by the suction nozzle 62a is referred to as a part P1, and the part P sucked by the suction nozzle 62ab is referred to as a part P2.

  Next, the CPU 91 sets one mounting target component to be mounted next among the components P sucked by the suction nozzle 62 (step S120). In the present embodiment, the component P sucked by the suction nozzle 62a is first set as a mounting target component, and after mounting the component P, the component P sucked by the suction nozzle 62b is set as a mounting target component. did. Subsequently, the CPU 91 moves the component P set as the mounting target component to the mounting position on the substrate 16 (step S130). The movement of the component P is performed by the CPU 91 moving the head 60 by driving and controlling the X-axis motor 51 and the Y-axis motor 53. The mounting position (XY coordinate) of the component P is acquired by the CPU 91 based on the mounting position information included in the mounting condition information acquired in step S100. Further, the CPU 91 moves the head 60 so that the suction nozzle 62 moves toward the mounting position after passing over the parts camera 58. At this time, the parts camera 58 captures the part P sucked by the suction nozzle 62 and acquires a picked-up image. The CPU 91 determines whether or not the component P is normally sucked by comparing the image picked up by the parts camera 58 with an image in a normal sucking state stored in advance.

  When the component P is moved to the mounting position, the CPU 91 can acquire a component image by the upper visual field camera 71, acquire a substrate image by the lower visual field camera 72, and acquire height-related image data by the height sensor 73. The camera unit 70 is moved to the position (step S140). FIG. 6 is an explanatory diagram illustrating a state in which the camera unit 70 is moved to the imaging position when the component P1 sucked by the suction nozzle 62a is set as a component to be mounted. FIG. 6 shows a state seen from the right side. As shown in the drawing, at this imaging position, the upper incident port 77 is located directly below the component P1 (suction nozzle 62a), and the lower incident port 78 is located directly above the facing region F1 of the component P1. That is, the upper incident port 77 and the lower incident port 78 of the camera unit 70 are located between the component P1 and the facing region F1. The CPU 91 moves the camera unit 70 to this imaging position by driving and controlling the camera moving motor 75 to move the camera unit 70 in the Y-axis direction.

  Next, the CPU 91 controls the upper visual field camera 71 and the lower visual field camera 72 so as to perform imaging at the imaging position moved in step S140, and acquires component image data and board image data (step S150). Specifically, the CPU 91 controls the upper illumination unit 81 to emit light and the image sensor 87a performs imaging, and acquires component image data obtained by imaging from the image processing unit 88a. Similarly, the CPU 91 controls the lower illumination unit 82 to emit light and the image sensor 87b to perform imaging, and obtains substrate image data obtained by imaging from the image processing unit 88b. In the present embodiment, the imaging range (field of view) of the upper-field camera 71 is an area directly above the upper entrance port 77. As shown in FIG. 6, the part P1 is within this photographing range, and the part image data includes an image of the entire lower surface of the part P1. Similarly, in the present embodiment, the imaging range of the lower field-of-view camera 72 is an area directly below the lower incident port 78. As shown in FIG. 6, the facing area F1 is within this imaging range, and the substrate image data includes an image of the entire facing area F1.

  Subsequently, the CPU 91 controls the height sensor 73 to perform imaging at the imaging position moved in step S140, and acquires height-related image data (step S160). Specifically, the CPU 91 controls the spot light source 83 to emit light and the image sensor 87b to perform imaging, and obtains height-related image data obtained by imaging from the image processing unit 88b. Note that the height sensor 73 and the lower-field camera 72 have the same lower incident port 78 and optical system 84b, and therefore the shooting range of the height sensor 73 is the same as that of the lower-field camera 72. However, unlike the case of shooting with the lower-field camera 72, the spot light source 83 irradiates the spot light toward the facing area F (the facing area F1 in FIG. 6) (see the thick arrow in FIG. 6). The height-related image data includes an image of an area irradiated with spot light.

  Next, the CPU 91 derives the substrate height of the facing area F based on the acquired height related image data (step S170). The CPU 91 derives the substrate height of the facing area F based on the position of the spot light in the height related image data. In the present embodiment, the substrate height is a position in the Z-axis direction (Z coordinate). FIG. 7 is a conceptual diagram showing the relationship between the substrate height in the facing area F and the spot light from the spot light source 83. In FIG. 7, the substrate 16 and the spot light when the substrate height of the counter area F is low are indicated by solid lines, and the substrate 16 and the spot light when the counter height of the counter area F is high are indicated by broken lines. As shown in the figure, since the spot light from the spot light source 83 is inclined from the vertical direction and is applied to the opposing region F, if the substrate height of the opposing region F changes due to, for example, warpage of the substrate 16, The position irradiated with the spot light will change. Therefore, when the substrate height in the facing area F changes, the position of the spot light in the image represented by the height-related image data acquired by the height sensor 73 changes. The CPU 91 performs image processing such as extracting a pixel having the highest brightness on the height-related image data, detects the position of the spot light in the image, and based on the detected position, the counter area F The height of the substrate is derived. The HDD 93 stores a correspondence relationship between the position of the spot light measured in advance by an experiment or the like and the substrate height of the facing area F, and the CPU 91 stores the position of the spot light in the height-related image data acquired this time. Based on this correspondence, the substrate height of the facing region F is derived. FIG. 7 shows a case where the substrate 16 is warped upward and the substrate height of the opposing region F is changed. For example, when the substrate 16 is warped downward or the entire height of the substrate 16 is changed. Similarly, the substrate height of the facing region F can be derived based on the position of the spot light in the height-related image data.

  Subsequently, the CPU 91 corrects the positional deviation in the XY direction between the mounting target component and the mounting position on the substrate 16 based on the component image data and the substrate image data acquired in step S150 (step S180). This process is performed as follows, for example. First, the CPU 91 detects the positions of bumps and marks on the lower surface of the component P in the image represented by the component image data, and based on the detected position, the position of the component P in the image (for example, using the center of the image as a reference). The center position of the part P) is derived. Note that it is only necessary to be able to derive the position of the component P in the image. For example, the position of the component P in the image may be derived based on the contour of the component P in the image. Further, the CPU 91 detects the position of the wiring pattern on the board 16 in the image represented by the board image data, and based on the detected position, the mounting position of the component P in the image (for example, the position based on the center of the image) ) Is derived. The positional relationship between the wiring pattern and the mounting position is stored, for example, in the HDD 103 of the management computer 100, and is acquired from the management computer 100 by the CPU 91. It should be noted that the mounting position of the component P in the image can be derived. For example, a mark for specifying the mounting position is attached on the substrate 16, and the CPU 91 determines the component in the image based on the position of the mark in the image. The mounting position of P may be derived. Then, the CPU 91 derives a shift between the parts 60 based on the position of the component P in the image in the component image data and the mounting position of the component P in the image in the board image data, and eliminates the shift. Is moved in the X and Y directions, and the positional deviation in the X and Y directions between the component P and the mounting position on the substrate 16 is corrected. Here, in this embodiment, it is assumed that the optical axis incident from the upper incident port 77 and the optical axis incident from the lower incident port 78 are coaxial. Therefore, if the position in the XY direction of the component P moved in step S170 matches the mounting position in the XY direction of the component P on the substrate 16, the position of the component P in the image of the component image data and the substrate image The mounting position in the data image matches. Therefore, the CPU 91 derives a shift (shift amount and shift direction) between the position of the component P in the image of the component image data and the mounting position in the image of the board image data, and moves the head in such a direction that the shift is eliminated. It is possible to correct the positional deviation in the X and Y directions between the position of the component P and the mounting position on the substrate 16 by moving 60. Even if the optical axis incident from the upper incident port 77 and the optical axis incident from the lower incident port 78 are not coaxial, if the deviation in the X and Y directions of both optical axes is measured in advance, the CPU 91 performs this measurement. In addition, misalignment can be similarly corrected.

  Next, the CPU 91 derives a corrected travel distance that is a travel distance in the Z-axis direction of the suction nozzle 62 when mounting the component to be mounted on the substrate 16 based on the substrate height derived in step S170 (step S170). S190). When the component P is mounted on the substrate 16, the suction nozzle 62 is moved in the Z-axis direction (downward) to press the component P against the substrate 16. The initial value of the movement distance in the Z-axis direction at this time is determined in advance according to the appropriate value of the pressing load, the thickness of the board 16 and the component P, and the mounting condition information acquired by the CPU 91 in step S100, for example. Included. For example, based on the substrate height of the facing region F derived in step S170, the CPU 91 performs correction such as subtracting the value from the initial value if the substrate height is high. The CPU 91 performs such correction and derives a corrected travel distance so that the load when pressing the component P against the board 16 becomes an appropriate value.

  Next, the CPU 91 moves the camera unit 70 to a standby position that does not hinder the mounting of the component P by the suction nozzle 62 (step S200). The standby position is, for example, the rearmost position in the range in which the camera unit 70 can move in the Y-axis direction. Note that the CPU 91 may be moved to a position where the camera unit 70 does not exist directly under the suction nozzle 62 that sucks the component to be mounted. For example, when it is the suction nozzle 62a that sucks the component to be mounted, there is no problem even if the camera unit 70 exists just below the suction nozzle 62b. Then, the CPU 91 moves the suction nozzle 62 in the Z-axis direction based on the corrected movement distance derived in step S190, and mounts the mounting target component on the substrate 16 (step S210). For example, when the component P1 sucked by the suction nozzle 62a is a component to be mounted, the CPU 91 drives and controls the Z-axis motor 66a to lower the suction nozzle 62a and apply a positive pressure to the suction nozzle 62a, thereby causing the component P1. Is mounted on the substrate 16.

  When the mounting target component is mounted, the CPU 91 determines whether or not there is an unmounted component that has been suctioned to the suction nozzle 62 (step S220). When there is an unmounted component that has been picked up, the CPU 91 executes the processing after step S120. For example, if the mounting of the component P1 sucked by the suction nozzle 62a is completed and the component P2 sucked by the suction nozzle 62b is not mounted, the CPU 91 sets the component P2 as a mounting target component in step S120 and sets the component P2 of the component P2. The component P2 is mounted on the substrate 16 after moving to the mounting position and moving to the imaging position of the camera unit 70 and performing imaging and correction by the camera unit 70. FIG. 8 is an explanatory diagram illustrating a state in which the camera unit 70 is moved to the imaging position when the component P2 is set as a mounting target component. As shown in the drawing, at this imaging position, the upper incident port 77 is positioned directly below the component P2 (suction nozzle 62b), and the lower incident port 78 is positioned directly above the facing region F2 of the component P2. That is, the upper incident port 77 and the lower incident port 78 of the camera unit 70 are located between the component P2 and the facing region F2.

  If it is determined in step S220 that there is no unmounted component that has been sucked into the suction nozzle 62, the CPU 91 determines whether there is an unmounted component that has not been sucked (step S230). When there is an unmounted component that has not been picked up, the CPU 91 executes the processing after step S110. That is, the components P to be mounted next are sucked by the suction nozzle 62, the sucked components P are set as mounting target components one by one, and the components P are mounted on the substrate 16. If there is no unsucked unmounted component in step S230, the CPU 91 ends this routine.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The head 60 of the present embodiment corresponds to the mounting head of the present invention, the upper visual field camera 71 corresponds to the first imaging unit, the lower visual field camera 72 corresponds to the second imaging unit, and the height sensor 73 is related to the height. It corresponds to an information acquisition unit, the camera unit 70 corresponds to an imaging unit, and the camera movement motor 75 and the camera movement unit 76 correspond to an imaging movement unit. The suction nozzle 62 corresponds to a holding unit, the X-axis motor 51, the X-axis slider 52, the Y-axis motor 53, and the Y-axis slider 54 correspond to head moving means, and the main body 74 corresponds to an imaging main body. The control device 90 corresponds to a first correction unit and a second correction unit.

  According to the mounting apparatus 10 described above, the camera moving motor 75 and the camera moving unit 76 maintain the relative positions of the upper-field camera 71, the lower-field camera 72, and the height sensor 73, and the camera unit 70 having them. Can be moved to an imaging position, which is a position between the component P held by the head 60 and the facing region F facing the component P on the surface of the substrate 16. And in the state moved to this imaging position, the upper visual field camera 71 images the component P held by the head 60, the lower visual field camera 72 images the opposing region F, and the height sensor 73 is the substrate of the opposing region F. Get height-related image data related to height. By doing so, the imaging and height of the component P and the substrate 16 can be performed without interposing the movement of any one or more of the upper-field camera 71, the lower-field camera 72, and the height sensor 73 and the movement of other mechanisms. Related image data can be acquired. Therefore, an increase in time required for the mounting process can be further suppressed. Then, by performing imaging of the component P and the substrate 16 and acquisition of height-related image data, based on the obtained information, for example, the deviation in the substrate height direction of the surface of the substrate 16 with respect to the component P or the substrate height direction The component P can be mounted on the substrate 16 in consideration of the shift in the XY direction orthogonal to the XY direction. Therefore, components can be mounted with higher accuracy.

  The head 60 has a plurality of suction nozzles 62 arranged side by side in the Y direction and capable of holding the component P. The camera moving motor 75 and the camera moving unit 76 include an upper field camera 71, a lower field camera 72, and a height sensor. The camera unit 70 can be moved to the respective imaging positions of the plurality of suction nozzles 62 while maintaining the relative position with respect to 73. Therefore, it is easier to simplify the configuration of the mounting apparatus 10 than when a camera unit is provided for each of the plurality of suction nozzles 62.

  The mounting apparatus 10 further includes an X-axis motor 51, an X-axis slider 52, a Y-axis motor 53, and a Y-axis slider 54 that can move the head 60 and the camera unit 70 while maintaining their relative positions. The moving motor 75 and the camera moving unit 76 change the relative position of the camera unit 70 with respect to the head 60. Therefore, since the camera unit 70 moves with the movement of the head 60, the camera moving motor 75 and the camera moving unit 76 need only change the relative position of the camera unit 70 with respect to the head 60, and the mechanism for moving the camera unit 70. Easy to simplify. Moreover, since the suction nozzles 62a and 62b are arranged side by side in the Y-axis direction, it is only necessary that the relative position of the camera unit 70 with respect to the head 60 can be moved in the Y-axis direction by the camera moving motor 75 and the camera moving unit 76. It is easy to simplify the mechanism for moving the camera unit 70.

  Furthermore, the height sensor 73 includes a spot light source 83 that irradiates the surface of the substrate 16 with spot light, an optical system 84b, and an image sensor 87b that receives reflected light of the spot light via the optical system 84b. And height-related image data obtained by imaging the surface of the substrate 16 including spot light by the image sensor 87b. Therefore, if the position of the surface of the substrate 16 in the height direction changes, the position of the spot light in the height-related image data also changes. Therefore, based on the position of the spot light in the image data, the facing region F The substrate height can be detected relatively easily.

  The lower-field camera 72 has an optical system 84b and an image sensor 87b that are common to the height sensor 73, and images the opposing region F by the image sensor 87b. The height sensor 73 acquires height-related image data obtained by imaging the facing area F including spot light by the image sensor 87b. Therefore, the configuration of the camera unit 70 can be simplified by sharing the optical system 84b and the image sensor 87b.

  The camera unit 70 has a main body 74 to which an upper-field camera 71, a lower-field camera 72, and a height sensor 73 are fixed. The camera moving motor 75 and the camera moving unit 76 move the main body 74. Let Therefore, it is easier to simplify the configuration of the mechanism for moving the camera unit 70 than when the upper-field camera 71, the lower-field camera 72, and the height sensor 73 are moved separately.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the upper-field camera 71 and the lower-field camera 72 share a part of the optical system (mirror 85a), and the lower-field camera 72 and the height sensor 73 have the lower incident port 78 and the optical system. Although the system 84b, the image sensor 87b, and the image processing unit 88b are common, one or more of these may not be common.

  In the embodiment described above, the height sensor 73 irradiates the spot region F with spot light and images the surface of the substrate 16 including the counter region F. However, the height sensor 73 irradiates spot light other than the counter region F. The reflected light may be imaged. That is, the imaging area may be different between the lower-field camera 72 and the height sensor 73. In this case, for example, based on the image data captured by the height sensor 73, the CPU 91 may derive the substrate height in the vicinity of the facing area F in the substrate 16, and the CPU 91 may regard this as the substrate height of the facing area F. .

  In the embodiment described above, the height sensor 73 irradiates spot light and acquires height-related image data including the reflected light. However, the height sensor 73 acquires information that can derive the substrate height of the facing region F. If it is a thing, the height sensor 73 is not restricted to this. For example, the height sensor 73 may acquire a three-dimensional image of the substrate surface with a plurality of cameras. Further, the height sensor 73 may acquire the amount of change in the focal length of the lens of the optical system, and the CPU 91 may derive the substrate height based on this amount of change. Or the height sensor 73 is good also as what acquires the information which can derive | lead-out the board | substrate height of the opposing area | region F by methods other than imaging.

  In the above-described embodiment, the upper-view camera 71, the lower-view camera 72, and the height sensor 73 are fixed to the main body 74, and these move together. The mounting apparatus 10 may include a moving means that can move.

  In the embodiment described above, the head 60 and the camera unit 70 are connected via the X-axis slider 52 and the support member 69, so that the X-axis motor 51, the X-axis slider 52, the Y-axis motor 53, and the Y-axis slider are connected. Although 54 enables the head 60 and the camera unit 70 to be moved while maintaining the relative position, the present invention is not limited to this. For example, the mounting apparatus 10 may include a slider and a motor that move the head 60 in the X and Y directions, and a slider and a motor that move the camera unit 70 in the X and Y directions, respectively.

  In the embodiment described above, the suction nozzles 62a and 62b are arranged side by side in the Y-axis direction, but may be arranged side by side in the X-axis direction. Further, when there are a plurality of rows of suction nozzles 62, there may be suction nozzles 62 arranged in a direction other than the predetermined arrangement direction. Even in this case, for example, the mounting apparatus 10 may include a mechanism for moving the camera unit 70 in the XY directions with respect to the head 60. Alternatively, the mounting apparatus 10 may include a plurality of camera units corresponding to one or more suction nozzles.

  In the above-described embodiment, the spot light source 83 irradiates the spot light while being inclined from the Z-axis direction. However, the spot light source 83 may irradiate the spot light along (directly below) the Z-axis direction. Even in this case, if the height sensor 73 captures an image of a region on the surface of the substrate 16 including the region irradiated with the spot light from a position shifted in the XY direction instead of from directly above, an image is obtained as in the present embodiment. The substrate height can be derived based on the position of the spotlight in the inside.

  In the above-described embodiment, the CPU 91 corrects the positional deviation by moving the head 60 in the XY directions in step S180. However, in addition to or instead of this, the substrate 16 may be moved. Further, the CPU 91 may correct the orientation of the component P by rotating the component P by the θ-axis motors 68a and 68b.

  In the above-described embodiment, the CPU 91 corrects the positional deviation in the XY direction between the component P and the mounting position on the board 16 based on the part image data and the board image data in step S180. The positional deviation in the X and Y directions may be corrected in consideration of the substrate height of the facing area F derived in (1). For example, the CPU 91 may correct the positional deviation in the XY directions in consideration of the positional deviation of the component P in the component image data and the positional deviation of the mounting position in the board image data due to the change in the board height.

  In the above-described embodiment, the CPU 91 moves the head 60 to the mounting position in step S130 and then moves the camera unit 70 to the imaging position in step S140. However, these may be performed in parallel. Moreover, although CPU91 shall perform step S160 after step S150, you may perform step S160 previously. Alternatively, the CPU 91 may perform the acquisition of height-related image data in step S160 and the processing in step S180 after correcting the positional deviation between the mounting target component and the mounting position on the board in step S180.

  In the above-described embodiment, the image processing units 88 a and 88 b are built in the camera unit 70, but may be configured differently from the camera unit 70. In this case, the electric charge imaged by the image sensor 87b of the height sensor 73 and output to the image processing unit corresponds to image data (height related information) acquired by the height related information acquisition unit of the present invention. For example, the control device 90 may also serve as the image processing unit.

  In the above-described embodiment, the imaging range of the upper-field camera 71 is an area immediately above the upper entrance 77, and the imaging range of the lower-field camera 72 is an area just below the lower entrance 78, but is not limited thereto. . The imaging range of the upper-field camera 71 may be determined in advance so that, for example, various components P that can be attracted by the suction nozzle 62 are within the imaging range. Note that when the CPU 91 derives the position of the component P in the image by using a bump, a mark, or the like instead of the contour of the component P, the entire component P may not be within the imaging range. Similarly, the shooting range of the lower field-of-view camera 72 may be determined in advance so that objects (wiring patterns, marks, etc.) used for deriving the mounting position of the component P in the image are within the shooting range.

  In the above-described embodiment, the mounting apparatus 10 includes one height sensor 73, but may include a plurality of height sensors 73. In this case, even if the plurality of height sensors 73 capture height-related image data at a plurality of locations on the substrate and the CPU 91 measures the inclination of the facing region F of the substrate 16 based on the plurality of height-related image data. Good.

  In the above-described embodiment, the mounting apparatus 10 performs the imaging by the camera unit 70 and the correction based on the imaging in the component mounting process for all the components. However, for the components that need to be mounted with higher accuracy. You may only go. Examples of components that need to be mounted with higher accuracy include components that are further stacked on other components already mounted on the substrate 16. Whether the component needs to be mounted with higher accuracy may be determined by the CPU 91 based on the acquired mounting condition information, for example.

  In the above-described embodiment, the suction nozzle 62 of the head 60 sucks the component P. However, if the head 60 holds the component P, the head 60 is not limited to the sucking component. For example, the head 60 may be configured to hook and hold the component P on the grip portion.

  In the above-described embodiment, the mounting inspection apparatus 40 having the function of the present invention has been described. However, the present invention is not particularly limited thereto, and a mounting inspection method or a program form thereof may be used.

  The present invention can be used in the technical field of mounting components on a board.

  DESCRIPTION OF SYMBOLS 10 mounting apparatus, 12 housing | casing, 14 base, 16 board | substrate, 20 component supply apparatus, 22 tape feeder, 22a reel, 22b feeder part, 30 board | substrate conveyance apparatus, 32a, 32b support plate, 34a, 34b conveyor belt, 40 backup Device, 42 Backup plate, 44 Base plate, 46 Backup pin, 50 Component mounting device, 51 X-axis motor, 52 X-axis slider, 53 Y-axis motor, 54 Y-axis slider, 55, 56 Guide rail, 58 Parts camera, 59 Nozzle Stocker, 60 heads, 62, 62a, 62b Suction nozzle, 66a, 66b Z-axis motor, 68a, 68b θ-axis motor, 69 Support member, 70 Camera unit, 71 Upper field camera, 72 Lower field camera, 73 Height sensor, 74 body, 75 Mera moving motor, 76 Camera moving unit, 77 Upper incident port, 78 Lower incident port, 81 Upper illumination unit, 82 Lower illumination unit, 83 Spot light source, 84a, 84b Optical system, 87a, 87b Image sensor, 88a, 88b Image processing Section, 90 control device, 91 CPU, 92 ROM, 93 HDD, 94 RAM, 95 I / O interface, 96 bus, 100 management computer, 101 CPU, 102 ROM, 103 HDD, 104 RAM, 105 I / O interface, 106 bus, 112 Input device, 114 display, F facing area, P component.

Claims (6)

A mounting head for holding the component, transporting the component and mounting the component on the substrate;
A first imaging unit that captures an image of a component held by the mounting head; and a second imaging that captures an entire facing area that is an area of the substrate surface that faces the held component and includes a mounting position of the component. A height-related information acquisition unit that acquires a height-related information related to a substrate height of the counter area of the substrate,
While maintaining the relative positions of the first imaging unit, the second imaging unit, and the height-related information acquisition unit, the position between the component held by the mounting head and the facing region is the first An imaging moving means capable of moving the imaging means to an imaging position where imaging by the imaging unit and the second imaging unit and acquisition of the height-related information are possible;
With
Said height-related information acquiring unit, as the information about the substrate height in the imaging range of the second image pickup unit of the substrate to obtain the height-related information,
The height-related information acquisition unit includes a spot light source that irradiates spot light within an imaging range of the second imaging unit on the substrate surface, an optical system, and reflected light of the spot light through the optical system. An image sensor for receiving light, and acquiring, as the height-related information, image data obtained by imaging the surface of the substrate including the spot light by the image sensor.
Mounting device. The second imaging unit includes an optical system that is common to the height-related information acquisition unit, and an imaging element that is common to the height-related information acquisition unit, and images the entire facing region by the imaging element. ,
The height-related information acquisition unit acquires, as the height-related information, image data obtained by imaging the entire facing area including the spot light by the imaging element.
The mounting apparatus according to claim 1 . The height related information acquisition unit acquires image data obtained by imaging the entire facing area as the height related information.
The mounting apparatus according to claim 1 or 2 . The mounting head has a plurality of holding portions that are arranged in a predetermined arrangement direction and can hold the component,
The imaging movement means maintains the relative positions of the first imaging section, the second imaging section, and the height-related information acquisition section, and moves the imaging means to each imaging position of the plurality of holding sections. Is movable,
The mounting apparatus of any one of Claims 1-3. The mounting apparatus according to any one of claims 1 to 4 ,
Head moving means capable of moving the mounting head and the imaging means while maintaining their relative positions;
With
The imaging moving means changes a relative position of the imaging means with respect to the mounting head;
Mounting device. The imaging unit includes an imaging main body unit to which the first imaging unit, the second imaging unit, and the height-related information acquisition unit are fixed.
The imaging movement means moves the imaging main body;
The mounting apparatus of any one of Claims 1-5 .

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