JP2009170524A - Component mounting method, and surface mounting machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively improve production efficiency of a board while preventing interference between components sucked by a plurality of suction heads. <P>SOLUTION: When sucked components may interfere with each other, the following control operation is executed. First, a component C of a first sucking group comprising a predetermined number of components to be sucked in advance is sucked by a predetermined suction head 20, and thereafter the component C of the first suction group is imaged by a scan unit 8 while a head unit 6 moves to the next supply location in a component supply part 4. A component C of a second suction group to be sucked next is sucked by another suction head 20 offset on a relatively lower side as compared with the predetermined suction heat 20, and is imaged by the scan unit 8. Finally, the components C are mounted on respective mounting points on a board 3 while considering suction states of the components C imaged by the scan unit 8. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention includes a movable head unit that takes out a component from a component supply unit by a plurality of suction heads that can suck the component and mounts the component on a substrate, and is attached to the head unit and sucked by the plurality of suction heads The present invention relates to a method of mounting a component on a substrate using a surface mounting machine including a moving image pickup unit that picks up an image while moving the component along a row of the head, and a surface mounting machine.

  Conventionally, as shown in the following Patent Document 1, in a surface mounter that takes out components from a component supply unit by a head unit having a plurality of suction heads for picking up components in a row and mounts them on a substrate, the plurality of suction heads If the components are held at the same height, if the component sucked by at least one suction head interferes with the adjacent component, the suction head to suck these components will be offset up and down. While controlling the drive of the suction head, the optical detection means consisting of a laser unit or the like attached to the head unit is used to check the suction state of the parts sucked by the suction heads, and based on the results, The position control is performed.

According to the surface mounter disclosed in this Patent Document 1, the adjacent suction heads are offset up and down to prevent interference between the parts sucked by these suction heads, and the optical detection means can be used to check. There is an advantage that the component can be appropriately mounted on the board based on the mounted state of the component.
JP 2000-165093 A

  However, since the surface mounting machine disclosed in Patent Document 1 is configured such that the component detection operation is performed by the optical detection unit after the component is adsorbed to all the adsorption heads, When the time required for the head unit that has been sucked to transport the component to the substrate is relatively short, the recognition operation of the component by the optical detection means may be terminated during the movement of the head unit. There is a possibility that an additional time loss may occur due to waiting for the recognition operation because it cannot be performed (that is, the component cannot be mounted immediately after the head unit reaches the substrate).

  In particular, as in the above-mentioned Patent Document 1, in a surface mounter configured such that the suction head is offset up and down to prevent interference between components, the component sucked by the upper suction head and the lower suction head are arranged. Since it is necessary to recognize the sucked parts in order (shifted) by the optical detection means, it takes time to recognize the parts, and more time loss as described above occurs. May decrease.

  The present invention has been made in view of the above circumstances, and in a surface mounter that takes out a component from a component supply unit and mounts it on a substrate by a plurality of suction heads for component suction, It is an object to effectively improve the production efficiency of a substrate while preventing interference between adsorbed components.

  In order to solve the above problems, the invention according to claim 1 of the present invention is a movable head unit that takes out a component from a component supply unit and mounts it on a substrate by a plurality of suction heads that can suck the component. The component is mounted on the substrate using a surface mounter that is attached to the head unit and includes a moving imaging unit that images the component adsorbed by the plurality of adsorption heads while moving along the row of the heads. A determination step for determining whether or not there is a possibility of interference between components when the plurality of suction heads pick up the component, and it is determined that there is a possibility that the component may interfere in this determination step. The first suction step of sucking the parts of the first suction group consisting of a predetermined number of parts to be sucked in advance by a predetermined suction head, and after the first suction step, A first imaging step of imaging the parts of the first suction group by moving the moving imaging means relative to the head unit while the head unit moves to the next supply location in the component supply unit; After the first imaging step, the second suction group component to be sucked next to the first suction group component is sucked by another suction head that is offset downward relative to the predetermined suction head. A second suction step, and after the second suction step, the second imaging step of moving the moving imaging means relative to the head unit to pick up images of the parts of the second suction group, and the first and second And a mounting step of mounting the component at each mounting point on the board in consideration of the suction state of the component imaged in the imaging step.

  According to a second aspect of the present invention, there is provided a movable head unit that takes out a component from a component supply unit by a plurality of suction heads capable of sucking the component and mounts the component on a substrate, and is attached to the head unit. A surface mounting machine comprising: a moving image pickup means for picking up an image while moving a part sucked by the suction head along the row of the head; and a control means for comprehensively controlling the operation of each part. A means for determining whether or not there is a possibility of interference between the components when the plurality of suction heads pick up the components, and the determination processing means determines that the components may interfere with each other. The first suction processing means for sucking the parts of the first suction group consisting of a predetermined number of parts to be sucked in advance by a predetermined suction head, and the first suction processing. After the processing by the above, during the movement of the head unit to the next supply location in the component supply unit, the moving imaging means is moved with respect to the head unit to image the components of the first suction group. After the processing by the imaging processing means and the first imaging processing means, the second suction group component to be suctioned next to the first suction group component is lower than the predetermined suction head. A second suction processing means for sucking by another suction head offset to the second suction processing means, and after the processing by the second suction processing means, the moving imaging means is moved relative to the head unit to pick up the parts of the second suction group. The component is mounted at each mounting point on the board in consideration of the suction state of the component imaged by the second imaging processing unit and the processing by the first and second imaging processing units. It is characterized in that a instrumentation processing means.

  According to the first and second aspects of the present invention, when there is a possibility of interference between parts in a state where the parts are sucked by the plurality of suction heads provided in the head unit, the parts to be picked up are separated into two suction groups. Since these components are divided into (first and second suction groups) and are picked up by the picked-up heads that are offset up and down, and mounted on the board respectively, it is appropriate to effectively prevent interference between the picked-up components. It is possible to mount the component.

  In addition, after sucking the parts of the first suction group to be sucked in advance among the above groups, the head unit moves to the next part supply place (that is, the place where the parts of the second suction group are supplied). In the meantime, since the parts of the first suction group are picked up by the moving image pickup means attached to the head unit, a certain number of parts are already transferred before the head unit completes the suction operation of the parts. It is possible to recognize the image by moving the image pickup means and check the suction state. Therefore, when the head unit that has sucked all the components moves to the substrate, only the components of the second suction group that have not been picked up at that time are picked up by the moving image pickup means and the images thereof. Since it is only necessary to determine the suction state based on the processing, it is possible to effectively suppress the occurrence of an extra waiting time without completing the above series of processing until the component is transported to the substrate, The production efficiency of the substrate can be effectively improved.

  Such effects can be obtained in the invention according to claim 3 or 4 described below.

  According to a third aspect of the present invention, there is provided a movable head unit that takes out a component from a component supply unit by a plurality of suction heads that can suck the component and mounts the component on a substrate, and the plurality of suction heads attached to the head unit. A surface mounting machine comprising: a moving image pickup means for picking up an image of the component adsorbed on the head while moving along the row of the head; and a fixed image pickup device for picking up an image of the component adsorbed on the suction head from a predetermined fixed position. A method of mounting a component on a board using a determination step for determining whether there is a possibility of interference between components when the plurality of suction heads suck the component; When it is determined that there is a possibility of interference, the first suction group that sucks the parts of the first suction group including the predetermined number of parts to be sucked in advance by the predetermined suction head. After the step and the first suction step, while the head unit moves to the next supply location in the component supply unit, the first imaging means by one of the moving imaging means and the fixed imaging means. A first imaging step for imaging the suction group components, and after the first imaging step, the second suction group components to be suctioned next to the first suction group components are more than the predetermined suction head. A second suction step for suctioning by another suction head that is relatively offset downward, and after the second suction step, the second suction group by the other imaging means of the moving imaging means and the fixed imaging means. A second imaging step of imaging the component, and a mounting step of mounting the component at each mounting point on the substrate in consideration of the suction state of the component imaged in the first and second imaging steps. It is an feature.

  According to a fourth aspect of the present invention, there is provided a movable head unit that takes out a component from a component supply unit by a plurality of suction heads that can suck the component and mounts the component on a substrate, and is attached to the head unit. A moving image pickup means for picking up an image of the component sucked by the suction head while moving along the row of the head, a fixed image pickup means for picking up an image of the component sucked by the suction head from a predetermined fixed position, and operations of these parts And a control means for comprehensively controlling the control device, wherein the control means determines whether or not there is a possibility of interference between the components when the plurality of suction heads pick up the components. And a first suction group comprising a predetermined number of parts to be suctioned in advance when it is determined by the determination processing means that there is a possibility that the parts may interfere with each other. A first suction processing means for picking up the parts of the tape by a predetermined suction head, and after the processing by the first suction processing means, the head unit is moved to the next supply location in the parts supply section. First imaging processing means for imaging the component of the first suction group by one imaging means of the moving imaging means and the fixed imaging means, and the component of the first suction group after processing by the first imaging processing means A second suction processing means for sucking a part of the second suction group to be picked up next by another suction head that is offset downward relative to the predetermined suction head, and the second suction processing. After the processing, the second imaging processing means for imaging the parts of the second suction group by the other imaging means of the moving imaging means and the fixed imaging means, and the first and second imaging Is characterized in that a mounting process means for mounting components on each of the mounting points on the board while considering the adsorption state of the components captured by the by the processing processor.

  As described above, according to the present invention, in a surface mounter that takes out components from a component supply unit by a plurality of suction heads for component suction and mounts them on a substrate, the components sucked by the plurality of suction heads It is possible to effectively improve the production efficiency of the substrate while preventing the interference.

  1 and 2 are views showing an example of a surface mounter for realizing the component mounting method according to the present invention. A conveyor 2 is arranged on a base 10 of the surface mounter 1 shown in these drawings, and a printed circuit board 3 (hereinafter simply referred to as a board 3) is conveyed by the conveyor 2 to a predetermined mounting work position (FIG. The substrate 3 stopped at that position is positioned and held by a clamping mechanism (not shown). In the following description, the conveyance direction of the substrate 3 by the conveyor 2 is the X-axis direction, the direction orthogonal to the X-axis on the horizontal plane is the Y-axis direction, and the direction orthogonal to the X-axis and Y-axis (that is, the vertical direction). The description will proceed with the Z-axis direction.

  Component supply units 4 for supplying components are respectively provided on both sides of the base 10 in the Y direction, and each of these component supply units 4 is a multi-row tape arranged side by side in the X-axis direction. A feeder 5 is used. Each tape feeder 5 has a tape in which small pieces such as ICs, transistors, capacitors, resistors and the like are stored at predetermined intervals (supply pitch), a reel for deriving the tape, and the like. The reel is configured to intermittently feed out the tape as the components in the tape are picked up by the head unit 6.

  Above the base 10, a head unit 6 for conveying parts is provided. The head unit 6 is supported on the base 10 so as to be movable in the X-axis direction and the Y-axis direction, and can freely move over the substrate 3 positioned at the mounting work position and the component supply unit 4. It is configured as follows.

  That is, a pair of fixed rails 9 extending in the Y-axis direction and a ball screw shaft 14 that is rotationally driven by a Y-axis servo motor 15 are disposed on the base 10 to support the head unit 6. The support member 7 is supported so as to be movable in the Y-axis direction along the fixed rail 9, and a nut portion 16 provided in the support member 7 is screwed with the ball screw shaft 14. The support member 7 is provided with a guide member 13 extending in the X-axis direction and a ball screw shaft 12 that is rotationally driven by the X-axis servo motor 11, and a nut portion that is screwed with the ball screw shaft 12. The head unit 6 having (not shown) is supported so as to be movable along the guide member 13 in the X-axis direction. Then, when the Y-axis servo motor 15 is operated and the ball screw shaft 14 is rotationally driven, the support member 7 is screw-fed to move integrally with the head unit 6 in the Y-axis direction, and the X-axis servo motor. The head unit 6 is configured to move in the X-axis direction with respect to the support member 7 when the ball screw shaft 12 is rotationally driven by operating 11.

  The head unit 6 is equipped with a plurality of suction heads 20 for sucking and holding the components. In this embodiment, the four suction heads 20 are arranged in a line in the X-axis direction. It is installed.

  These suction heads 20 are supported so as to be able to move in the Z-axis direction and rotate around the R-axis (head central axis) with respect to the main body of the head unit 6, and use a servo motor (not shown) as a drive source. The elevating drive mechanism and the rotary drive mechanism are respectively driven in the above directions.

  At the lower end of each of the suction heads 20, a component suction nozzle (not shown) is provided. Each nozzle is connected to a negative pressure supply means (not shown), and when taking out the component from the component supply section 4, the negative pressure is supplied from the negative pressure supply means to the tip of the nozzle, thereby attracting the component. Is to be done.

  The head unit 6 is attached with a scan unit 8 (corresponding to the moving imaging means according to the present invention) as a scanning imaging means that can move along the arrangement direction (X-axis direction) of the suction head 20. The scanning unit 8 picks up an image of the parts sucked by the suction heads 20 during the conveyance. 3 and 4 are diagrams showing a specific configuration of the scan unit 8. As shown in FIG. As shown in these drawings, the scan unit 8 includes, as main components, a camera body 25, a prism group 30 for guiding an image of the suction component C to the camera body 25, and illumination of the suction component C. It has the 1st and 2nd illumination body 41 and 43 for irradiating light, and the supporting member 40 for supporting these camera main bodies 25, the prism group 30, and the illumination bodies 41 and 43. As shown in FIG.

  The camera body 25 is constituted by a camera (one-dimensional camera) provided with a line sensor composed of a one-dimensional CCD image sensor or the like. Then, by moving the camera body 25 in the X-axis direction with respect to the head unit 6 together with the support member 40 in accordance with the driving of a servo motor 47 described later, a plurality of the suction holes 20 adsorbed to each of the suction heads 20. The parts can be sequentially imaged non-stop. It should be noted that imaging of the suction component by the camera body 25 can be performed when the scan unit 8 is moved in either the + X direction or the −X direction with respect to the head unit 6. 3 and 4, reference numeral 27 denotes a condenser lens of the camera body 25, and reference numeral 29 denotes a light receiving unit including a line sensor or the like.

  The support member 40 is attached to the head unit 6 via a mounting bracket 40a shown in FIG. A ball screw shaft 45 extending in the X-axis direction is disposed on the back side (+ Y side) of the head unit 6, and a nut portion (not shown) provided at the upper end of the mounting bracket 40 a is the ball screw shaft 45. Are screwed together. Then, as the ball screw shaft 45 is rotationally driven by a servo motor 47 for scanning operation (see FIG. 7), the entire scan unit 8 including the support member 40 is moved with respect to the head unit 6 in the X axis. It is designed to move in the direction. Note that the scan units 8 indicated by the solid line and the two-dot chain line in FIG. 2 indicate the scan units 8 at the end portions on one side and the other side of the movable range, respectively. When the scan unit 8 is driven between both ends of the movable range, the scan unit 8 can be moved over the installation portions of all the suction heads 20.

  The prism group 30 includes three prisms including a first prism 31, a second prism 33, and a third prism 35, and each of these prisms is a support member positioned below the suction head 20. 40 are arranged so as to be aligned in the X-axis direction at the −Y side end.

  The first prism 31 is disposed so as to face the condenser lens 27 of the camera body 25, and reflects reflected images from the other second and third prisms 33 and 35 to the camera body 25. Light guide.

  The second prism 33 is disposed at a position offset by a predetermined distance in the −X direction with respect to the first prism 31, and reflects an image of the lower surface of the component C sucked by the suction head 20, as shown in FIG. Then, the light is guided to the first prism 31. That is, when the first illumination body 41 is turned on in a state where the second prism 33 is disposed below the suction head 20, the lower surface of the component C sucked by the lower end portion of the suction head 20 is turned on. The image is emitted to the second prism 33 positioned below the image, and the image of the component C reflected by the second prism 33 is taken into the camera body 25 via the first prism 31. (Refer to the optical path V1 indicated by the one-dot chain line in the figure).

  The third prism 35 is disposed between the first prism 31 and the second prism 33, and reflects the image of the side surface of the component C sucked by the suction head 20, as shown in FIG. The light is guided to the prism 31. That is, when the second illuminating body 43 is turned on in a state where the third prism 35 is arranged on the side of the suction head 20 on the −Y side, the component sucked to the lower end portion of the suction head 20 The projected image of the side surface of C is emitted to the third prism 35 located on the side, and the image of the component C reflected twice by the third prism 35 is passed through the first prism 31 to the camera body 25. (Refer to the optical path V2 indicated by the one-dot chain line in the figure).

  Then, when the scan unit 8 is driven by the servo motor 47 and moves relative to the head unit 6, the first illumination body 41 or the second illumination body 43 is turned on as described above, and the lower surface or side surface of the component C is turned on. The operation of taking an image into the camera body 25 is sequentially executed corresponding to the position of each suction head 20 in the head unit 6 so that all the parts C sucked by each suction head 20 are imaged. It has become.

  Next, the control system of the surface mounter 1 configured as described above will be described with reference to the block diagram of FIG. As shown in FIG. 7, the surface mounter 1 incorporates a control unit 50 (corresponding to the control means according to the present invention) for comprehensively controlling the operation of each part. The control unit 50 includes a well-known CPU, various memories (RAM and ROM), and the main functional elements include a main control unit 51, an image processing unit 52, a camera control unit 53, and an illumination control unit 54. And an axis control unit 55 and the like.

  The axis controller 55 controls the operation of the X-axis servo motor 11 and the Y-axis servo motor 15 for driving the head unit 6 and the servo motor 47 for driving the scan unit 8. .

  The illumination controller 54 controls operations such as lighting and extinguishing of the illuminators 41 and 43 provided in the scan unit 8.

  The camera control unit 53 controls the image capturing operation of the camera body 25 in the scan unit 8, and the image processing unit 52 captures an image captured by the camera body 25 and applies the image to the image. Predetermined image processing is performed.

  The main control unit 51 is responsible for the central function of the control unit 50 and executes various operations while exchanging various data with other functional elements (52, 53, 54, 55). Thus, the operations of the head unit 6 and the scan unit 8 are controlled in an integrated manner.

  Under the control of the control unit 50 configured as described above, the surface mounter 1 performs a component mounting operation, for example, as follows.

  When the mounting operation is started, first, the substrate 3 is carried to the mounting work position shown in FIG. Next, the head unit 6 moves above the component supply unit 4, and the component C is adsorbed and taken out by the respective adsorption heads 20 of the head unit 6 from a predetermined tape feeder 5 in the component supply unit 4. At this time, depending on the size or the like of the component C to be sucked, when all the suction heads 20 of the head unit 6 hold the component C at the same height, the components C may interfere with each other. Therefore, when picking up the component C, it is determined in advance whether or not there is a possibility of the interference of the component C based on the size of the component C to be picked up. If the determination is made, for example, as shown in FIG. 14 and the like, the component C is sucked with the respective suction heads 20 being vertically offset (hereinafter, such suction is referred to as step suction). The interference of the part C is avoided. If there is no possibility of interference between the parts C sucked by all the suction heads 20, the step suction as described above is not performed, and the parts C sucked by the suction heads 20 are held at the same height. Is done.

  When the suction of the component C from the component supply unit 4 is completed as described above, the head unit 6 moves toward the substrate 3, and each suction head 20 of the head unit 6 above each mounting point of the substrate 3. The component C adsorbed on the lower end portion thereof is mounted on the substrate 3 by moving up and down.

  Here, the scan unit 8 that captures an image of the component C adsorbed by each of the adsorption heads 20 is supplied while the head unit 6 moves between different supply locations in the component supply unit 4 or the head unit 6 supplies the components. Each part C is configured to operate while moving from the unit 4 to the substrate 3. The mounting of each component C on the substrate 3 as described above is performed in consideration of the adsorption deviation of each component C obtained by analyzing the image captured by the scan unit 8. That is, when the head unit 6 moves toward each mounting point on the substrate 3, the suction displacement of each component C examined in advance based on the captured image of the scan unit 8 (that is, sucked by each suction head 20). The amount of movement of the head unit 6 is appropriately corrected in accordance with the displacement of the component C from the normal position), etc., so that each component C is mounted on the substrate 3 appropriately.

  Next, specific contents of the control operation by the control unit 50 will be described with reference to the flowchart of FIG. When this flowchart is started, the control unit 50 first performs control to operate the conveyor 2 to carry the substrate 3 to the mounting work position shown in FIG. 1 and position it (step S1).

  Next, the control unit 50 starts control to move the head unit 6 toward the component supply unit 4 so as to take out the component C from the component supply unit 4 by each suction head 20 of the head unit 6 (step S3). At this time, the control unit 50 executes control for determining whether or not there is a possibility of interference between the components C in a state where the components C are attracted to the respective suction heads 20 (step S5). That is, assuming that all the parts C to be picked up are held at the same height by the suction heads 20, it is determined whether there are parts C that may interfere with each other in that state.

  Specifically, in step S5, it is determined whether or not the following equation (1) using the dimensions S1, S2, and P shown in FIG. Based on the result, the presence or absence of interference between the components C is determined.

S1 + S2 ≧ P (1)
Here, S1 and S2 are values obtained by dividing the size of the target suction component C by adding an error of the expected suction deviation and dividing by two; {(component size) + (suction deviation margin)} / 2 (the two-dot chain line at both ends of the component C in FIG. 10 indicates a margin of adsorption displacement), and P is a separation distance (head pitch) between the respective adsorption heads 20 that have adsorbed the target component C. It is.

  Note that FIG. 10 illustrates a case where S1 + S2 <P. In such a case, since the above equation (1) is not established, it is determined that the interference of the component C does not occur. Such calculation processing is executed in the same manner for other sets of suction heads 20, whereby the presence or absence of interference of the part C is determined for all sets of adjacent suction heads 20. The determination process as described above (step S5) is performed by arithmetic processing in the main control unit 51 based on various data relating to the suction head 20 and the part C stored in a storage unit (not shown) in the control unit 50. . That is, in the present embodiment, the main control unit 51 constitutes a determination processing unit according to the present invention that determines the presence or absence of interference of the component C.

  When it is determined NO in the processing of step S5 as described above and it is confirmed that the interference of the component C does not occur for all the adjacent suction heads 20, the control unit 50 performs the component C by the normal suction operation. (Step S9), and control for mounting the sucked component C on the substrate 3 is executed (step S11). That is, when the component C is sucked from the component supply unit 4 by each suction head 20 of the head unit 6, as shown in FIG. 10, the suction heads 20 are arranged at the same height (that is, as described above). The components C are held (without step suction), and these components C are transported to the substrate 3 and mounted on the mounting points on the upper surface thereof.

  On the other hand, if it is determined as YES in step S5 and it is confirmed that there is a possibility of interference of the component C, the control unit 50 moves the suction heads 20 of the head unit 6 up and down as shown in FIG. In step S7, a step suction for picking up the component C is performed in a state where the component C is offset, and the component C sucked in the step is mounted on the substrate 3 (step suction and component mounting control).

  Although omitted in the flowchart of FIG. 8, there is a part that is larger in size than the part C shown in FIG. There are cases where it is not possible. For example, when the following expression (2) using the dimensions S and P ′ shown in FIG. 18 is established, the component C may interfere with the adjacent suction head 20 even if the step suction is performed.

S ≧ P ′ (2)
Here, S is a value obtained by {(part size) + (adsorption deviation margin)} / 2, as in S1 and S2 of the above-described formula (1), and P ′ is the pitch ( A value obtained by subtracting the shaft radius of the adjacent suction head 20 from the head pitch P) shown in FIG. 10; (head pitch) − (shaft radius).

  In the situation where the above equation (2) holds, interference of the part C cannot be avoided even if the step suction is performed. In such a case, for example, as shown in FIG. 19, the part C may be sucked without using a part of the suction head 20. In this way, although the number of parts C that can be picked up at a time is reduced, large parts can be picked up and held properly while reliably avoiding interference of the parts C.

  Next, the specific content of the above-described control in step S7 (step suction & component mounting control) will be described. FIG. 9 is a subroutine showing specific contents of the step suction & component mounting control. When this subroutine starts, first, the control unit 50 performs control for sucking the parts C of the first suction group consisting of a predetermined number of parts to be sucked in advance by the predetermined suction head 20, as shown in FIG. Execute (Step S31). Specifically, in FIG. 11, the part C of the first suction group composed of two parts is sucked from the predetermined tape feeder 5 in the part supply unit 4 by the first and third suction heads 20 from the left. The removed state is shown. At this time, if possible, the component C is simultaneously sucked and taken out from different tape feeders 5 by the two suction heads 20. On the other hand, when the simultaneous suction of the components C is impossible, for example, when the components C are continuously taken out from the same tape feeder 5, the removal of the components C by the two suction heads 20 is sequentially performed one by one. To be done.

  The process of sucking the part C of the first suction group (step S31) includes the shaft controller 55 for controlling the servo motors 11 and 15 for driving the head unit 6 and the suction heads 20, and the suction. This is performed based on commands from a negative pressure control unit (not shown) for controlling negative pressure supply means (not shown) for supplying negative pressure to the head 20 and a main control unit 51 for overall control thereof. This also applies to the adsorption process (step S39) of the second adsorption group. That is, in the present embodiment, the first and second embodiments according to the present invention in which the shaft controller 55, the negative pressure controller, and the main controller 51 perform the process of sucking the parts C of the first and second suction groups. Two adsorption processing means are configured.

  Next, the control unit 50 starts control to move the head unit 6 toward the next supply location in the component supply unit 4 (that is, the tape feeder 5 in which a component C of the second suction group described later is stored). (Step S33) As shown in FIG. 12, the scanning unit 8 is moved with respect to the head unit 6 to execute control for imaging the part C of the first suction group (Step S35). Thereby, imaging of some components C is completed while the head unit 6 moves to the next supply location in the component supply unit 4.

  Note that the process of imaging the part C of the first suction group (step S35) includes an axis control unit 55 that controls the servo motor 47 for driving the scan unit 8, a camera control unit 53 that controls the camera body 25, and a camera body. 25 is performed based on commands from the image processing unit 52 that processes the image picked up in 25 and the main control unit 51 that performs overall control thereof. This also applies to the second suction group imaging process (step S43) described later. That is, in the present embodiment, the present invention performs processing for imaging the parts C of the first and second suction groups by the axis control unit 55, the camera control unit 53, the image processing unit 52, and the main control unit 51. Such first and second imaging processing means are configured.

  When the imaging of the first suction group in step S35 is completed, the control unit 50 raises the suction head 20 that sucks the component C of the group as shown in FIG. 13 (step S37), and FIG. As shown in the figure, the remaining suction heads 20 (second and fourth suction heads 20 from the left in the figure) control the part C of the second suction group consisting of a predetermined number of parts to be suctioned next. Is executed (step S39).

  When the suction of a total of four parts C composed of the first and second suction groups is completed as described above, the control unit 50 starts control for moving the head unit 6 toward the substrate 3 (step S41). In the middle of the movement, the scanning unit 8 is moved with respect to the head unit 6 as shown in FIG. 15, thereby executing the control for imaging the second group of parts C that have not been imaged (step S43). ). Thereby, the imaging of all the parts C sucked by the four suction heads 20 is completed.

  When the head unit 6 reaches above the substrate 3, the control unit 50 mounts the component C of the second suction group that is sucked later among all the suction components C on the substrate 3 as shown in FIG. 16. The control to perform is executed (step S45). That is, the two suction heads 20 to which the parts C of the second suction group are sucked are appropriately moved up and down above the corresponding mounting points on the substrate 3, so that the parts C of the second suction group are Install sequentially at the mounting points. At this time, the mounting of the component C of the second suction group is performed in consideration of the suction state of the group component imaged by the scan unit 8 in step S43. In FIG. 16, of the two suction heads 20 (second and fourth suction heads 20 from the left) on which the part C of the second suction group is sucked, the part C is moved by the fourth suction head 20 from the left. The state where is implemented is shown.

  Next, as shown in FIG. 17, the control unit 50 performs control to mount the remaining component C of the first suction group on the board 3 (step S47). At this time, the component C of the first suction group is mounted in consideration of the suction state of the group component imaged by the scan unit 8 in step S35. In FIG. 17, of the two suction heads 20 (first and third suction heads 20 from the left) on which the part C of the first suction group is suctioned, the part C is moved by the third suction head 20 from the left. The state where is implemented is shown. When the component C sucked by the other suction head 20 (first suction head 20 from the left) is similarly mounted and the processing in step S47 is completed, the subroutine shown in FIG. Control by the unit 50 returns to the main flow of FIG.

  The process of mounting the parts C of the first and second suction groups on the substrate 3 (steps S45 and S47) is the same as the process (steps S31 and S39) for sucking these parts C. This is performed based on commands from an axis control unit 55 that controls the operation of the unit 6 and the like, a negative pressure control unit that controls negative pressure supply means (not shown), and a main control unit 51 that performs overall control thereof. That is, in the present embodiment, the mounting processing means according to the present invention for performing processing for mounting the parts C of the first and second suction groups by the shaft control unit 55, the negative pressure control unit, and the main control unit 51 is provided. It is configured.

  By the way, as shown in FIGS. 11 to 17, in the explanation of the operation of the above-described subroutine, an example has been described in which the set of all adjacent suction heads 20 is vertically offset and the component C is sucked. As shown in FIG. 20, there is naturally a case in which it is not necessary to perform the step suction as described above for some of the suction heads 20. Specifically, in FIG. 20, since the size of the part C sucked by the fourth suction head 20 from the left is sufficiently small, the step suction is performed between it and the third suction head 20 adjacent to the left. Even if not, there is no interference between the components C, and the suction head 20 that sucks the small components as described above (that is, the fourth suction head 20 from the left) is in the order of suction and mounting of the component C. There are no particular restrictions. Therefore, when such a suction head 20 exists, the suction and mounting timing of the component C by the suction head 20 should be set to any of the suction and mounting timings of the first and second suction groups. Is also possible.

  Returning to the main flow of FIG. 8 again, the description will be continued. When the step suction and component mounting control in step S7 is completed, or the component suction and mounting in steps S9 and S11 are completed, the component C sucked by each suction head 20 is placed on the substrate 3, respectively. When the mounting is completed, the control unit 50 determines whether or not all the components to be mounted on the entire board 3 are mounted (step S13). Here, it is determined as YES and all the components are mounted. Is confirmed, control is performed to operate the conveyor 2 and carry the substrate 3 out of the apparatus (step S15). On the other hand, if it is determined NO in step S13 and it is confirmed that the component C to be mounted still remains, the process returns to the processing in step S3 and subsequent steps, and a new component C is taken out from the component supply unit 4. The same process is repeated until all components are mounted on the board 3.

  In addition, after the unloading process of the substrate 3 in step S15 is completed, the control unit 50 determines whether or not the cumulative production number up to the substrate 3 produced this time has reached a predetermined production scheduled number. (Step S17) When it is determined YES here and it is confirmed that the planned production number has been reached, the series of control flow is ended. On the other hand, if it is determined NO in step S17 and it is confirmed that the substrate 3 to be produced still remains, the process returns to the processing after step S1 and the same mounting as described above is performed on the new substrate 3. Repeat the process.

  8 and 9 described above, step S5 corresponds to the determination step according to the present invention, step S31 corresponds to the first adsorption step according to the present invention, and step S35 corresponds to the first adsorption step according to the present invention. Step S39 corresponds to the second imaging step according to the present invention, Step S43 corresponds to the second imaging step according to the present invention, and Steps S45 and S47 correspond to the mounting step according to the present invention. To do.

  As described above, the surface mounter 1 of the above embodiment includes the movable head unit 6 that takes out components from the component supply unit 4 and mounts them on the substrate 3 by the plurality of suction heads 20 that can suck the components C. The scan unit 8 attached to the head unit 6 and picked up by moving the component C adsorbed by the plurality of adsorbing heads 20 along the row of the heads 20 and the operations of these units are comprehensively controlled. And a process for determining whether or not there is a possibility of interference between the components when the plurality of suction heads 20 suck the component C under the control of the control unit 50 (step S5). ) And a first number of parts that are to be sucked in advance when it is determined that there is a possibility that the parts may interfere in the process of step S5. A process (step S31) for sucking the component C of the landing group by the predetermined suction head 20 and a process of moving the head unit 6 to the next supply location in the component supply unit 4 after the process of step S31. In addition, the process of moving the scan unit 8 relative to the head unit 6 to image the part C of the first suction group (step S35), and after the process of step S35, the predetermined suction head 20 (that is, The second suction group to be sucked next to the part C of the first suction group by the other suction head 20 which is offset relatively downward by the head sucking the first suction group retracted upward. After the process of sucking the part C (step S39) and the process of step S39, the scan unit 8 is attached to the head unit 6. The component at each mounting point on the substrate 3 in consideration of the process of moving and imaging the part C of the second suction group (step S43) and the suction state of the part C imaged in the processes of steps S35 and S43. Since the control operation including the process of mounting C (steps S45 and S47) is performed, the production efficiency of the substrate 3 while preventing interference between the components C sucked by the plurality of suction heads 20 is achieved. There is an advantage that can be improved effectively.

  That is, in the above embodiment, when there is a possibility of interference between the components C in a state where the components C are attracted by the plurality of suction heads 20 provided in the head unit 6, the components C to be attracted are separated into two suction groups ( Since the components C are divided into the first and second suction groups and are sucked by the suction heads 20 offset in the vertical direction and mounted on the substrate 3 respectively, interference between the suction components C is effectively prevented. However, the component C can be properly mounted.

  Moreover, after the component C of the first suction group to be sucked in advance among the above groups, the head unit 6 is the next component supply location (that is, the location where the component C of the second suction group is supplied). Since the part C of the first suction group is picked up by the scan unit 8 attached to the head unit 6 while moving to the head unit 6, the head unit 6 has already made some progress before completing the part suction operation. The number of parts C can be image-recognized by the scan unit 8 and their suction states can be checked. Therefore, when the head unit 6 that has sucked all the components C moves to the substrate 3, the scan unit 8 captures only the components of the second suction group that have not been imaged at that time. Since it is sufficient to determine the suction state based on the image processing and the like, the above-described series of processing is not completed until the part C is transported to the substrate 3, and an unnecessary waiting time is effectively suppressed. And the production efficiency of the substrate 3 can be effectively improved.

  In the above embodiment, the camera body 25 of the scan unit 8 is configured by a one-dimensional camera provided with a line sensor or the like. However, the camera body 25 may be a two-dimensional camera provided with a CCD area sensor or the like. In this case, it is possible to take non-stop images of the parts C sucked by the suction heads 20 by adopting the strobe lighting that instantaneously illuminates the parts C, as in the above embodiment. .

  In the above embodiment, the scan unit 8 is configured so that both the lower surface and the side surface of the suction component C can be imaged. However, the scan unit 8 may be capable of imaging only one of them.

  Moreover, in the said embodiment, although imaging of the components C adsorb | sucked by the adsorption | suction head 20 was performed only by the scan unit 8 (moving imaging means) attached so that the movement to the head unit 6 was carried out, for example, the above-mentioned In the case where the surface mounter 1 includes means for imaging the suction component C from a predetermined fixed position (fixed imaging means), a part of the suction component C may be imaged by the fixed imaging means. FIG. 21 is a diagram for explaining a specific example in the case of such a configuration. The surface mounter 100 shown in this figure is provided with a fixed camera 102 as the fixed imaging means at a predetermined location on the base 10. In the illustrated example, the component supply unit 4 is divided near the center in the X-axis direction, and the fixed camera 102 is installed in the divided part. Further, in the surface mounter 100 shown in the figure, the configuration other than the fixed camera 102 is the same as that of the surface mounter 1 described in the above embodiment.

  The fixed camera 102 is configured by a camera (one-dimensional camera) including a line sensor composed of a one-dimensional CCD image sensor or the like, like the camera body 25 of the scan unit 8. Further, the fixed camera 102 incorporates an illuminating body and the like for illuminating the part C sucked by the suction head 20 from below. Then, by moving the head unit 6 in the X-axis direction and passing over the fixed camera 102, the components C sucked by the suction heads 20 of the head unit 6 can be sequentially imaged non-stop. ing. It should be noted that the fixed camera 102 can naturally be constituted by a two-dimensional camera equipped with a CCD area sensor or the like, similarly to the description relating to the scan unit 8 described above.

  As described above, in the surface mounter 100 according to the example of FIG. 21, two types of imaging means including the scan unit 8 and the fixed camera 102 are provided as means for imaging the component C attracted by the plurality of suction heads 20. ing. In such a configuration, in order to avoid interference of the component C during suction, the component C is divided into two suction groups (first suction group and second suction group) by the suction head 20 offset vertically. In the case of suction, each of the group parts can be imaged using the two types of imaging means. For example, after the component C of the first suction group is sucked from the component supply unit 4, the head unit 6 moves in the component supply unit 4 in order to suck the component C of the next second suction group. The part C of the first suction group that has been picked up is imaged by the fixed camera 102, and the remaining part C of the second suction group is scanned while the head unit 6 that has picked up all the parts moves to the substrate 3. It is conceivable to take an image with the unit 8. Even in this case, the production efficiency of the substrate 3 can be effectively improved while preventing the interference of the component C as in the above embodiment. The part C of the first suction group may be imaged by the scan unit 8 and the part C of the second suction group may be captured by the fixed camera 102.

It is a top view which shows roughly the surface mounting machine concerning one Embodiment of this invention. It is a front view of the surface mounter. It is a side view which shows schematic structure of a scan camera unit. It is a perspective view of the scan camera unit. It is a figure for demonstrating the advancing state of the optical path when the lower surface of an adsorption | suction component is imaged with the said scan camera unit. It is a figure for demonstrating the advancing state of the optical path when imaging the side surface of an adsorption | suction component with the said scan camera unit. It is a block diagram which shows the control system of the said surface mounting machine. It is a flowchart for demonstrating control operation | movement of the said surface mounting machine. It is a subroutine which shows the specific content of the level | step difference adsorption | suction & component mounting control performed in the said flowchart. It is a figure for demonstrating how to determine the presence or absence of interference of components. It is a figure for demonstrating the operation | movement which adsorb | sucks the components of a 1st adsorption | suction group. It is a figure for demonstrating the operation | movement which images the components of a 1st adsorption | suction group with a scanning unit. It is a figure showing the place where the adsorption head which adsorbed the parts of the 1st adsorption group rose. It is a figure for demonstrating the operation | movement which adsorb | sucks the components of a 2nd adsorption | suction group. It is a figure for demonstrating the operation | movement which images the components of a 2nd adsorption | suction group with a scanning unit. It is a figure for demonstrating the operation | movement which mounts the components of a 1st adsorption | suction group on a board | substrate. It is a figure for demonstrating the operation | movement which mounts the components of a 2nd adsorption | suction group on a board | substrate. It is a figure for demonstrating the case where the interference avoidance of the components by level | step difference adsorption | suction is impossible. It is a figure which shows the specific example at the time of attracting | sucking components, without using some adsorption heads. It is a figure for demonstrating the example in which the components which do not require level | step difference adsorption | suction are mixed. It is a figure for demonstrating other embodiment of this invention.

Explanation of symbols

1,100 Surface mounter 3 Printed circuit board (board)
4 Component supply unit 6 Head unit 8 Scan unit (moving imaging means)
20 Suction head 50 Control unit (control means)
102 Fixed camera (fixed imaging means)
C parts

Claims (4)

A movable head unit that takes out a component from a component supply unit by a plurality of suction heads capable of sucking the component and mounts the component on a substrate, and a component attached to the head unit and sucked by the plurality of suction heads. A method of mounting a component on a board using a surface mounter equipped with a moving imaging means for imaging while moving along a row of
A determination step of determining whether there is a possibility of interference between components when the plurality of suction heads suck the component;
A first suction step of sucking, by a predetermined suction head, parts of a first suction group consisting of a predetermined number of parts to be sucked in advance when it is determined in this determination step that the parts may interfere with each other; ,
After the first suction step, while the head unit moves to the next supply location in the component supply unit, the moving imaging means is moved relative to the head unit to pick up the components of the first suction group. A first imaging step,
After this first imaging step, the second suction group component to be suctioned next to the first suction group component is moved by another suction head that is offset relatively downward from the predetermined suction head. A second adsorption step to adsorb,
After the second suction step, the second imaging step of moving the moving imaging means with respect to the head unit and picking up images of the parts of the second suction group;
And a mounting step of mounting the component at each mounting point on the substrate in consideration of the suction state of the component imaged in the first and second imaging steps. A movable head unit that takes out a component from a component supply unit by a plurality of suction heads capable of sucking the component and mounts the component on a substrate, and a component attached to the head unit and sucked by the plurality of suction heads. A surface mounting machine comprising a moving image pickup means for picking up an image while moving along a row of the above and a control means for comprehensively controlling the operation of each of these parts,
The control means includes
Determination processing means for determining whether or not there is a possibility of interference between components when the plurality of suction heads suck the components;
When the determination processing means determines that there is a possibility that the components interfere with each other, a first suction process of sucking, by a predetermined suction head, the components of the first suction group composed of a predetermined number of components to be suctioned in advance. Means,
After the processing by the first suction processing, while the head unit moves to the next supply location in the component supply section, the moving imaging means is moved with respect to the head unit, and the components of the first suction group First imaging processing means for imaging
After the processing by the first imaging processing means, the second suction group component to be sucked next to the first suction group component is offset to the lower side relative to the predetermined suction head. A second suction processing means for suction by the suction head;
After the processing by the second suction processing means, the second imaging processing means for moving the moving imaging means relative to the head unit and imaging the parts of the second suction group;
A surface mounting machine comprising: mounting processing means for mounting components on each mounting point on the substrate in consideration of the suction state of the components imaged by the processing by the first and second imaging processing means. . A movable head unit that takes out a component from a component supply unit by a plurality of suction heads capable of sucking the component and mounts the component on a substrate, and a component attached to the head unit and sucked by the plurality of suction heads. A component is mounted on a substrate using a surface mounting machine that includes a moving imaging unit that captures an image while moving along a row of the image sensor and a fixed imaging unit that captures an image of the component adsorbed by the adsorption head from a predetermined fixed position. A method,
A determination step of determining whether there is a possibility of interference between components when the plurality of suction heads suck the component;
A first suction step of sucking, by a predetermined suction head, parts of a first suction group consisting of a predetermined number of parts to be sucked in advance when it is determined in this determination step that the parts may interfere with each other; ,
After the first suction step, while the head unit moves to the next supply place in the component supply unit, one of the moving image pickup means and the fixed image pickup means is used for the first pickup group. A first imaging step of imaging a component;
After this first imaging step, the second suction group component to be suctioned next to the first suction group component is moved by another suction head that is offset relatively downward from the predetermined suction head. A second adsorption step to adsorb,
After this second suction step, a second imaging step of picking up images of the parts of the second suction group by the other imaging means of the moving imaging means and the fixed imaging means;
And a mounting step of mounting the component at each mounting point on the substrate in consideration of the suction state of the component imaged in the first and second imaging steps. A movable head unit that takes out a component from a component supply unit by a plurality of suction heads capable of sucking the component and mounts the component on a substrate, and a component attached to the head unit and sucked by the plurality of suction heads. A moving image pickup means for picking up an image while moving along the line, a fixed image pickup means for picking up an image of a component sucked by the pick-up head from a predetermined fixed position, and a control means for comprehensively controlling the operation of each section. A surface mount machine equipped with,
The control means includes
Determination processing means for determining whether or not there is a possibility of interference between components when the plurality of suction heads suck the components;
When the determination processing means determines that there is a possibility that the components interfere with each other, a first suction process of sucking, by a predetermined suction head, the components of the first suction group composed of a predetermined number of components to be suctioned in advance. Means,
After the processing by the first suction processing means, while the head unit moves to the next supply location in the component supply unit, the first imaging means by one of the moving imaging means and the fixed imaging means. First imaging processing means for imaging the components of the suction group;
After the processing by the first imaging processing means, the second suction group component to be sucked next to the first suction group component is offset to the lower side relative to the predetermined suction head. A second suction processing means for suction by the suction head;
After the processing by the second suction processing, second imaging processing means for imaging the parts of the second suction group by the other imaging means of the moving imaging means and the fixed imaging means;
A surface mounting machine comprising: mounting processing means for mounting components on each mounting point on the substrate in consideration of the suction state of the components imaged by the processing by the first and second imaging processing means. .

Images