JP4319095B2 - Surface mount machine - Google Patents

Description

  The present invention relates to a surface mounter having a movable head unit on which a mounting head is mounted, and picking up a component from a component supply unit by the head unit and transporting and mounting the component on a substrate.

  Conventionally, a head unit on which a mounting head is mounted is provided so as to be movable on the XY plane, and a chip component such as an IC is sucked from the component supply section onto the printed circuit board and conveyed to a predetermined position on the printed circuit board. Surface mounters configured for mounting are generally known.

This type of surface mounting machine is required to mount components accurately and efficiently. For example, Patent Document 1 discloses that a plurality of mounting heads are mounted on a head unit and a plurality of mounting heads are mounted at once. Proposed to pick up and carry parts, and to pick up the parts picked up by each mounting head using a camera mounted on the head unit during this transfer and to recognize the image and correct the picking deviation Has been. More specifically, a suction component imaging unit (referred to as an imaging unit) equipped with a camera is provided in the head unit. After the component suction, after the mounting head is set at a predetermined height position, The imaging unit is configured to continuously image the components adsorbed to each mounting head by moving in the arrangement direction of the mounting heads below the mounting head.
JP-A-8-32299

  In the surface mounter according to Patent Document 1 as described above, there is a problem in that the up-and-down stroke of the mounting head becomes large because the imaging unit may be moved between the mounting head and the substrate. That is, the imaging unit needs to move a position higher than the component having the maximum height among the mounted components in order to avoid interference with the components mounted on the substrate. A space corresponding to at least the height of the component (the component having the maximum height) and the thickness (height) of the imaging unit is required between the mounting head end. Accordingly, there is a tendency that the elevation stroke of the mounting head from the component recognition position to the mounting surface tends to be large, and there is a problem that, for example, an eccentric error or the like accompanying the elevation of the mounting head tends to occur during component mounting.

  In addition, there is a problem that the head unit is easily increased in weight and it is difficult to drive the head unit at a high speed. That is, since the image pickup unit is mounted on the head unit and a mechanism for moving the image pickup unit needs to be mounted on the head unit, the head unit tends to increase in weight. Such weight increase of the head unit is disadvantageous in driving the head unit at high speed because it increases inertial force, and is a negative factor in shortening the takt time.

  The present invention has been made in view of the circumstances as described above, and aims to improve the mounting accuracy of components while efficiently performing a series of component mounting operations including image recognition of suction components. Yes.

In order to solve the above-described problem, a surface mounter according to claim 1 of the present invention has a movable head unit on which a mounting head is mounted, and a component that supplies a component to a movable region of the head unit. and mounting work unit to place the supply part and the mounting substrate is provided, as well as implemented conveyed to be mounted on a substrate by adsorbing components from the component supply unit by the mounting head of the head unit, in this mounting operation In a surface mounter that picks up the suction component from the lower side by the imaging means and recognizes the suction state, it is disposed above the mounting work unit and the component supply unit, and at least the mounting work unit is covered on a horizontal plane. The head unit support member is provided so as to be movable relative to the mounting substrate, and the head unit is supported on the head unit support member so as to be movable. Is, the imaging unit, the provided on the head unit support member, and a movable region of the head unit in the head unit supporting member, the head with the relative movement of the head unit support member relative to the mount board wherein a unit supporting member in which a target mounting board is disposed in overlap with et no part component when viewed from the direction perpendicular to the horizontal plane.

According to this surface mounter, after the component is picked up, the head unit moves with respect to the head unit support member while the component is being transported, and the head unit moves relative to the image pickup means, whereby the picked-up component is moved by the image pickup means. It will be imaged. In this configuration, the head unit support member and the mounted substrate do not overlap when viewed from the direction orthogonal to the horizontal plane in association with the relative movement of the head unit support member with respect to the mounted substrate in the movable region of the head unit in the head unit support member. As a result of the image pickup means being provided in the part, there is no possibility of interference between the image pickup means and the mounted substrate. For example, the height position of the lower surface of the image pickup means is mounted on the mounted substrate arranged in the mounting work section. parts with maximum height is a part is that by is set to be lower than the height position of the component when it is mounted on the target mounting substrate (claim 2), the suction part Can be imaged at a position closer to the mounting surface of the substrate to be mounted. That is, it is possible to reduce the elevation stroke of the mounting head from the component recognition position to the mounting surface. Further, since the imaging unit is provided on the head unit support member, the head unit can be reduced in weight.

In the surface mounter as described above, it has a transport unit that transports the object to be mounted board in the same direction as the moving direction of the head unit with respect to the head unit supporting member, the mounting and the mounting substrate along the conveying section When configured to be carried in from one side of the working unit and carried out to the opposite side, the imaging means is upstream of the mounting working unit in the carrying direction of the substrate to be mounted by the carrying unit. Preferably, it is provided (Claim 3).

  According to this configuration, it is possible to reliably avoid the interference between the imaging unit and the mounted component when the mounted substrate is unloaded from the mounting work position after the mounting is completed.

In the surface mounter as described above, the imaging unit, the head unit of the movable region of the head unit in the support member, the head unit support member and the component due to the relative movement of the head unit support member relative to the mount board more preferably the supply portion is provided in a heavy an et no part component when viewed from the direction perpendicular to the horizontal plane (claims 4).

  According to such a configuration, it is possible to avoid interference between the component supply unit and the imaging unit, and thus the configuration of the component supply unit is not limited in relation to the imaging unit. That is, it is possible to increase the degree of freedom in the configuration of the component supply unit.

In the surface mounter as described above, wherein the imaging means is movable relative to the head unit support member further control means are provided for driving and controlling the image pickup means, the control means, after component suction at the component supply section, wherein among the movable area of the head unit in the head unit supporting member, and the head unit supporting member and the object mounting substrate with the relative movement of the head unit support member relative to the mounting board horizontal plane preferably drives and controls the imaging means so as to place the imaging means overlap with et no part component when viewed from the direction perpendicular to (claim 5).

  According to such a configuration, after picking up the component, it is possible to image the picked-up component in the vicinity of the substrate according to the size of the mounted substrate, so that the image recognition processing of the picked-up component can be performed more quickly. It becomes. In particular, it is possible to image the suction component more quickly by driving and moving both the head unit and the imaging means relative to each other in the head unit support member.

  In the surface mounting machine as described above, the imaging unit includes a line sensor that sequentially captures component images adsorbed on each mounting head as the head unit moves relative to the imaging unit. (Claim 6).

  According to this configuration, it is possible to image the suction component while moving the head unit relative to the imaging unit in a non-stop manner, so that the suction component can be efficiently imaged. In this case, if a plurality of mounting heads are arranged side by side in the moving direction of the head unit relative to the head unit support member as a mounting head, a plurality of components can be conveyed simultaneously and image recognition of the components is also efficient. This is suitable for reducing the tact time.

  According to the surface mounter according to each of the above claims, after the component is sucked, the head unit with respect to the image pickup means provided on the head unit support member in the middle of transferring the sucked component to the mounted substrate by moving the head unit support member Since the suction part is imaged by relatively moving the suction part, the image recognition of the suction part can be performed efficiently.

Moreover, since the image pickup means is provided at a position not to interfere with the mounted substrate, it is possible to reduce the elevation stroke of the mounting head from the part products recognized position to the mounting surface and Do Ri, the mounting head The mounting accuracy can be increased by reducing the influence on the mounting accuracy due to the eccentricity error or the like due to the elevation. Further, since the head unit support member is provided with the imaging means, the weight of the head unit can be reduced, so that the head unit can be driven at a higher speed and the tact time can be shortened through this. .

  The best mode for carrying out the present invention will be described with reference to the drawings.

  1 and 2 schematically show a first embodiment of a surface mounter (hereinafter abbreviated as a mounter) according to the present invention. As shown in the figure, a transport path 2 for transporting a printed circuit board is disposed on a base 1 of the mounting machine, and the printed circuit board 3 is transported on a conveyor provided in the transport path 2 to perform a predetermined mounting operation. It is stopped at the position (mounting work section; the position of the printed circuit board shown in FIG. 1). In the present embodiment, the printed circuit board 3 is carried in from the right side of FIGS. 1 and 2 and carried out to the left side. The conveyance path 2 covers a conveyor (not shown) extending in the X-axis direction, and covers the conveyor, and guides the end of the printed circuit board 3 from above and from the side, so that the printed circuit board 3 being conveyed is removed from the conveyor. It has a pair of guide members 2a having an L-shaped cross section that prevents it from falling off.

  A lift-up mechanism for positioning the printed circuit board 3 is provided at the mounting work position. Although not shown, this lift-up mechanism has a lift-up table with support pins that can be raised and lowered. When the printed circuit board 3 is carried into the mounting work position, the lift-up table is raised and printed. The board 3 is lifted and positioned by pressing the printed board 3 against the guide member 2a from below.

  On both sides of the conveyor 2, component supply units 4 (component supply regions) are arranged. In these component supply units 4, for example, multiple rows of tape feeders 4a are arranged in the X-axis direction. Each tape feeder 4a accommodates small chip components such as ICs, transistors, capacitors, etc. at predetermined intervals, and the cover tape is peeled off so that the held tape is drawn out from the reel and the components can be taken out. The components are intermittently drawn out as the components are taken out by the head unit 6 described later. In the present embodiment, the pick-up height position of the component in each tape feeder 4a (the suction component immediately after the tip of the suction nozzle 16a descends to the vicinity of the upper surface of the tape from which the cover tape has been peeled and sucks the component. The lower surface or the height position of the upper surface of the tape after the cover tape is peeled off is set to a height position substantially the same as the mounting surface of the printed circuit board 3 positioned at the working height position by the lift-up mechanism. Also, the tape feeder 4a for supplying components is not set in a specific area in the X-axis direction of each component supply unit 4, specifically, an area corresponding to the imaging unit 20 described later. This is because it is impossible to take out parts in the area due to the presence of the imaging unit 20, and this will be described in detail later.

  Above the base 1, a head unit 6 for component mounting is provided. The head unit 6 is movable across the component supply unit 4 and the mounting work position where the printed circuit board 3 is located, and is orthogonal to the X axis in the X axis direction (direction of the conveyance path 2) and the Y axis direction (horizontal plane). Direction).

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member 11 ( (Hereinafter abbreviated as support member 11) is arranged, and a nut portion 12 provided on the support member 11 is screwed into the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The head unit 6 is provided with a plurality of mounting heads 16 configured in an axial shape. In this embodiment, the six mounting heads 16 are arranged in a line at equal intervals in the X-axis direction. It is mounted in the state.

  These mounting heads 16 can be moved in the Z-axis direction and rotated around the R-axis (nozzle center axis) with respect to the frame of the head unit 6, respectively, and ascending / descending drive means using a servo motor as a drive source and rotation It is driven by driving means. Each mounting head 16 is provided with a suction nozzle 16a at its tip (lower end), and negative pressure is supplied to the tip of the suction nozzle from a negative pressure supply means (not shown). Parts are attracted by suction force.

  The support member 11 is provided with an imaging unit 20 for recognizing an image of a component adsorbed by each mounting head 16 prior to mounting after component adsorption.

  The imaging unit 20 is fixedly provided on the support member 11. Specifically, as shown in FIG. 3, the support unit 11 extends downward from its lower surface, and further moves from the lower end to the front side (left side in FIG. 3, lower side in FIG. 1) of the head unit 6. An inverted L-shaped frame 21 extending downward is provided, and a camera 22, a lighting device 23, and a total reflection mirror 24 are integrally provided on the frame 21. More specifically, an image capturing window is provided at the tip of the frame 21, and the mirror 24 is fixed below the window at an angle of approximately 45 ° with respect to a horizontal plane with its reflecting surface facing upward. Has been. An illumination device 23 is disposed at the window portion, and the camera 22 is fixed sideways on the rear side (right side in FIG. 3) of the mirror 24 so as to be directed to the reflection surface.

  The illuminating device 23 has a plurality of LEDs 23a which are arranged around the window and fixed to the frame 21 in a state of being directed upward. On the other hand, the camera 22 has a CCD area sensor, an imaging lens, and the like, and is fixed to the frame 21 with the light receiving surface of the area sensor directed to the mirror 24 (see FIG. 3).

  That is, when the head unit 6 is moved relative to the imaging unit 20 with the illumination device 23 turned on, the illumination light emitted from the LED 23 a is applied to the lower surface of the component adsorbed by the mounting head 16. The reflected light is reflected by the mirror 24 and is incident on the CCD area sensor of the camera 22. As a result, the lower surface image (directly below image) of the suction component is captured by the camera 22. .

  As shown in FIG. 3, the imaging unit 20 is provided so that the lower end of the imaging unit 20 is above the upper surface of the guide member 2 a of the transport path 2, and is further supported as shown in FIGS. 1 and 2. The member 11 is provided at a portion outside the mounting work position in the X-axis direction (on the right side of the mounting work position end position X1 (board loading side)).

  Although not shown in the drawings, the mounting machine described above is a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU, and various data temporarily during operation of the apparatus. A control device configured by a RAM or the like that performs a predetermined mounting operation for mounting the components supplied in the component supply unit 4 on the printed circuit board 3 in accordance with a program stored in advance. Therefore, the servo motors 9, 15 and the like are configured to be comprehensively controlled by this control device. Hereinafter, the mounting operation of the mounting machine based on the control of the control device will be described.

  When the mounting operation is started, first, the printed circuit board 3 is carried into the mounting work position along the transport path 2 and positioned by the lift-up mechanism. At this time, the lower end of the image pickup unit 20 is located above the upper surface of the guide member 2a of the transport path 2, and the printed circuit board 3 is in an unmounted state, so that the printed circuit board 3 interferes with the image pickup unit 20. It is carried into the mounting work position without waking up.

  When the printed circuit board 3 is positioned at the mounting work position, the head unit 6 moves to the component supply unit 4. During this movement, the image pickup unit 20 passes above the transport path 2. In this case as well, the lower end of the image pickup unit 20 is located above the upper surface of the guide member 2 a, so that the guide member 2 a and the image pickup unit 20 do not interfere with each other. Absent. After the movement, the components are sequentially picked up by the mounting heads 16. Specifically, after the mounting head 16 is disposed above the target tape feeder 4a, the tape feeder is moved in a state where the mounting head 16 is lowered and raised so that the components in the tape are sucked by the suction nozzle 16a. Remove from 4a. At this time, if possible, the components are simultaneously sucked by the pair of mounting heads 16 arranged in the X-axis direction among the mounting heads 16 mounted on the head unit 6.

  If the head unit 6 is in a position corresponding to the imaging unit 20 during component suction, the suction nozzle 16a and the imaging unit 20 interfere while the mounting head 16 is lowered. Therefore, in the present embodiment, an area corresponding to the imaging unit 20 in the component supply unit 4 (an area corresponding to the position between the X-axis direction end positions X3 and X4 of the imaging unit 20; see FIG. 1), that is, in effect, The tape feeder 4a is set in a portion other than the area where the component can not be picked up by the mounting head 16, and at the time of picking up the component, the substrate loading side or the unloading side from the image pickup unit 20 (outside the image pickup unit both end positions X3 and X4) ), The head unit 6 is driven and controlled so that the component suction operation by the head unit 6 is performed. In this embodiment, the tape feeder 4a is not provided in the area corresponding to the position between the imaging unit both end positions X3 and X4 as described above, but this area may be used as a storage area for the tape feeder 4a. Good. That is, for example, the spare tape feeder 4a and the like may be continuously arranged in the same manner as the other tape feeders 4a without being interrupted in the X-axis direction. Also in this case, the head unit 6 is driven and controlled so that the mounting head 6 does not move up and down between the positions X3 and X4 of the imaging unit.

  When the component suction is completed, each mounting head 16 is maintained at a predetermined imaging height position, specifically, a height position that does not interfere with the imaging unit 20 as shown in FIG. Starts moving in the Y-axis direction toward the mounting work position. Further, the head unit 6 starts moving in the X-axis direction from the component suction completion position on the support member 11 toward the imaging unit 20, and the illumination device 23 is turned on in synchronization with this. As a result, the head unit 6 moves relative to the imaging unit 20, and during this movement, the suction parts of the mounting heads 16 are sequentially imaged by the camera 22.

  When imaging of each suction component is completed by the head unit 6 passing through the imaging unit 20, the head unit 6 is immediately reversed and moved to the board carry-in side, and component suction is performed based on the captured suction component image. The state is checked, and if a suction error has occurred, the target position is reset for each part. The head unit 6 is arranged at the first mounting position on the printed circuit board 3 by the combined movement of the head unit 6 and the support member 11. At this time, the support member 11 is disposed above the printed circuit board 3 or just to the side of the printed circuit board 3, but the imaging unit 20 is located outside the mounting work position in the X-axis direction (from the end position X1 of the mounting work position). In this case, the image pickup unit 20 and the mounted component 3a on the printed circuit board 3 do not interfere with each other (see FIGS. 2 and 3).

  When the head unit 6 reaches the printed circuit board 3, the first component is mounted on the printed circuit board 3 in accordance with the raising / lowering operation, and thereafter, the head unit 6 is intermittently moved to the mounting position, and the remaining suction components are sequentially removed. Mounted on the printed circuit board 3.

  When all the components are mounted on the printed circuit board 3 in this way, the head unit 6 is reset on the component supply unit 4, and thereafter the head unit 6 moves back and forth between the component supply unit 4 and the printed circuit board 3. A predetermined number of components are mounted on the printed circuit board 3.

  According to the mounting machine according to the present invention as described above, the imaging unit 20 is provided on the support member 11. After the component adsorption, the component supply unit 4 moves toward the printed circuit board 3 as the support member 11 moves. While the head unit 6 is moved in the Y-axis direction, the head unit 6 is moved relative to the imaging unit 20 in the meantime, and thereby the suction component is imaged. Recognition can be performed.

  In addition, since the up / down stroke of the mounting head 16 from the component recognition position to the mounting surface can be made smaller than that of the conventional mounting machine of this type, the mounting accuracy due to the eccentricity error etc. accompanying the up / down of the mounting head 16 can be improved. There is an advantage that the influence can be reduced. That is, in this type of conventional mounting machine in which the imaging unit is mounted on the head unit, a position higher than the component having the maximum height among the mounted components is avoided in order to avoid interference with the components mounted on the substrate. It is necessary to move the space between the mounting surface of the board and the tip of the mounting head during imaging of the component, at least the height of the component (the component having the maximum height) + the thickness (height) of the imaging unit Is required. On the other hand, in the mounting machine of the above embodiment, the imaging unit 20 is fixed to a portion of the support member 11 outside the mounting work position in the X-axis direction, and the substrate is carried into the support member 11 from the mounting work position. By providing the imaging unit 20 on the side, the printed circuit board 3 can be carried out without causing interference between the mounted component 3a and the imaging unit 20 regardless of the position of the support member 11 in the Y-axis direction. Therefore, as shown in FIG. 3, the imaging unit 20 is provided at a height position approaching the printed circuit board 3 positioned at the work height position, and the mounting head 16 is moved up and down from the component recognition position to the mounting surface. The stroke h can be remarkably reduced as compared with the conventional mounting machine. Therefore, as compared with the conventional mounting machine, it is possible to reduce the influence on the mounting accuracy due to the eccentricity error or the like accompanying the elevation of the mounting head 16. In other words, the reliability of the image recognition of the suction component can be improved, and as a result, there is an advantage that the component can be mounted on the printed circuit board 3 more accurately. As shown in FIGS. 1 and 2, the imaging unit 20 is provided at a portion outside the mounting work position in the X-axis direction, and is taped in a location other than the area corresponding to the imaging unit 20 in the component supply unit 4. Since the feeder 4a is disposed, the printed circuit board 3, the suction nozzle 16a, and the imaging unit 20 do not interfere with each other.

  Further, since the imaging unit 20 for imaging the suction component is provided on the support member 11, the head unit 6 can be significantly reduced in weight as compared with the conventional device in which the imaging unit is provided in the head unit itself. Therefore, since the influence of the inertial force at the time of driving the head unit can be reduced, the head unit 6 can be driven at a higher speed, and the tact time can be shortened through this. is there.

  In this embodiment, the imaging unit 20 is provided on the support member 11 on the right side of the mounting work position (the board loading side of the end position X1 of the mounting work position). The imaging unit 20 may be provided on the left side (the board carry-out side from the end position X2 of the mounting work position (see FIG. 1)). However, in this case, if the imaging unit 20 is present in the transport path 2, the imaging unit 20 and the mounted components on the printed board 3 may interfere with each other when the printed board 3 is unloaded. Therefore, in the case of this configuration, the support member 11 may be driven and controlled so that the imaging unit 20 is disposed outside the transport path 2 (outside in the Y-axis direction) when the printed circuit board 3 is unloaded.

  Next, a second embodiment of the mounting machine according to the present invention will be described with reference to FIGS. Since the basic configuration of the mounting machine of the second embodiment is common to that of the mounting machine of the first embodiment, the same reference numerals as those of the first embodiment are used for the parts common to the first embodiment. A description thereof will be omitted, and differences from the first embodiment will be described in detail below.

  In the second embodiment, the guide member 2a of the transport path 2 is composed of a central portion 201 corresponding to the mounting work position of the printed circuit board 3 and side portions 202 on both sides in the X-axis direction. The height position of the part 201 is set higher than the side part 202 by a predetermined height. Moreover, the tape feeder 4a is continuously arrange | positioned in the components supply part 4 over all the areas.

  Further, the height of the imaging unit 20 is set so that the lower end of the imaging unit 20 is above the upper surface of the side portion 202 of the guide member 2a and below the central portion 201, and further the support member 11, an imaging unit 20 is provided so as to be movable in the X-axis direction. That is, as shown in FIGS. 4 to 6, the lower surface of the support member 11 is provided with a fixed rail 25 extending in the X-axis direction and a ball screw shaft 27 in the X-axis direction that is rotationally driven by a servo motor 28. The image pickup unit 20 (frame 21) is mounted on the fixed rail 25 so as to be movable outside the printed circuit board 3 at the mounting work position in the X-axis direction, and the ball screw shaft 27 is screwed into the image pickup unit 20. ing. With this configuration, the imaging unit 20 is configured to move in the X-axis direction along the fixed rail 25 when the servo motor 28 is operated.

  During the mounting operation, the servo motor 28 is driven and controlled by the control device based on a signal from a position detection unit such as an encoder built in the servo motor 28 so that the imaging unit 20 moves to a predetermined position. It is configured.

  More specifically, when the head unit 6 moves to the component supply unit 4 and the components are picked up by the mounting heads 16, the imaging unit 20 is moved and arranged outside the component supply unit 4 in the X-axis direction. Thus, the interference between the imaging unit 20 and the tape feeder 4a is avoided, and the interference between the mounting head 16 and the imaging unit 20 due to the lifting and lowering operation of the mounting head 16 during component suction is avoided. It has become. When the head unit 6 moves from the component supply unit 4 onto the printed circuit board 3 after picking up the components, the imaging unit 20 moves to the vicinity of the printed circuit board 3 as shown in FIG. It is configured so that the image recognition of the suction component can be performed at a position close to.

  According to the surface mounter of the second embodiment as described above, the tape feeder 4a can be arranged in the entire area of the component supply unit 4 as described above, and the components can be adsorbed from all the tape feeders 4a. There are advantages. That is, in this embodiment, as a result of the imaging unit 20 being movably provided as described above, when the component is picked up, the imaging unit 20 moves to a position deviating from the component suction position, thereby picking up the image with the tape feeder 4a. Interference with the unit 20 and interference between the mounting head 16a and the imaging unit 20 are avoided. Therefore, as described above, the tape feeder 4a can be arranged in all areas of the component supply unit 4 and the components can be sucked from all the tape feeders 4a. Further, at the time of component mounting, the imaging unit 20 is arranged at a position close to the printed circuit board 3 according to the size of the printed circuit board 3 while avoiding interference between the printed circuit board 3 and the imaging unit 20, and picks up the suction component. There is an advantage that you can.

  In addition, since the imaging unit 20 is movably provided, if the suction unit is imaged by moving the head unit 6 and the imaging unit 20 in the opposite directions in the support member 11, a plurality of suction components is obtained. Imaging can be performed more quickly, and sufficient time for subsequent image processing can be secured.

  By the way, the mounting machine according to the first and second embodiments described above is the best embodiment of the surface mounting machine according to the present invention, and the specific configuration thereof is appropriately changed without departing from the gist of the present invention. Is possible.

  For example, the same configuration as that of the transport path 2 of the second embodiment may be adopted as the configuration of the transport path 2 of the first embodiment. In this case, the lower end of the imaging unit 20 fixed to the support member 11 is located above the upper surface of the side portion 202 and below the upper surface of the central portion 201 in the guide member 2 a of the transport path 2. The height position of the imaging unit 20 may be set so as to do so. In this case, in order to avoid interference between the imaging unit 20 and the tape feeder 4a due to the movement of the head unit 6 to the component supply unit 4 (movement of the support member 11 in the Y-axis direction), the tape feeder 4a is provided with the component supply unit 4. Of these, it may be set in a portion other than the area corresponding to the imaging unit 20 (outside of both ends X3 and X4 of the imaging unit).

  In the mounting machines of the first and second embodiments, the support member 11 is moved in the Y-axis direction with respect to the base 1, and the head unit 6 is moved in the X-axis direction with respect to the support member 11. The head unit 6 is configured to move two-dimensionally with respect to the printed circuit board 3 by the combined operation of the member 11 and the head unit 6, but the support member 11 is fixedly provided to the base 1. The printed circuit board 3 is supported on the base 1 so as to be movable in the Y-axis direction, so that the head unit 6 moves in the X-axis direction and the printed circuit board 3 moves in the Y-axis direction. The unit 6 may be configured to move two-dimensionally. In this case, the printed circuit board 3 is transported in the Y-axis direction on the base 1, while the mounting work position and the component supply unit 4 are provided side by side in the X-axis direction, and the head unit 6 is mounted above the component supply unit 4. It is configured to reciprocate between the work positions. The imaging unit 20 is fixed to the mounting work position and the component supply unit 4 on the outer side of the support member 11 in the X-axis direction, or provided so as to be movable in the X-axis direction with respect to the support member 11, and at least the imaging unit 20 is moved In the case where it is possible to provide, if the height of the imaging unit 20 is set so that the lower end of the imaging unit 20 is positioned above the component supply unit 4, the mounting head 16a and the imaging unit 20 at the time of component suction mounting Interference can be avoided. Further, when the imaging unit 20 is fixed to the support member 11 and the height position of the imaging unit 20 is set so that the lower end of the imaging unit 20 is located above the component supply unit 4, Can be used as a storage position for the spare tape feeder 4a and the like. On the other hand, when the height position of the imaging unit 20 is set so that the lower end of the imaging unit 20 is positioned below the component supply unit 4, the component supply unit 4 has both sides (X-axis direction both sides) of the imaging unit 20. The tape feeders 4a may be arranged. According to such a configuration, as in the first and second embodiments, the height position of the lower end of the imaging unit 20 can be lowered, and accordingly, the head unit 6 and the support member 11 in the Z-axis direction. As well as the weight of the head unit 6 can be reduced.

  Further, the imaging unit 20 of the first and second embodiments is configured such that the suction component of the mounting head 16 is once reflected on the total reflection mirror 24 (reflected by the mirror 24) and imaged by the camera 22. However, of course, the imaging unit 20 may be configured such that the mirror 24 is omitted, and the component adsorbed by the mounting head 16 is directly imaged by the camera 22 from below.

  In the imaging units 20 of the first and second embodiments, a camera with a built-in CCD area sensor is used as the camera 22, but of course, a camera with a built-in CCD line sensor can be used as the camera 22. is there. In the first and second embodiments using a camera with a built-in CCD area sensor, it is necessary to stop the relative movement between the imaging unit 20 and the head unit 6 during imaging, or to reduce the relative movement speed to a speed at which no image blurring occurs. However, when imaging with a camera having a built-in CCD line sensor, there is no need to reduce the relative movement speed during imaging, so that mounting can be performed efficiently.

  Further, in the imaging unit 20 of the first and second embodiments, the total reflection mirror 24 is applied as an optical member for reflecting (reflecting) the component adsorbed on the mounting head 16. An optical member such as a half mirror or a prism can also be applied.

It is a top view which shows the surface mounting machine (1st Embodiment) which concerns on this invention. It is a front view which shows the structure of a head unit. It is a schematic side view (partial cross-sectional view) showing the configuration of the head unit and the imaging unit. It is a top view which shows the surface mounting machine (2nd Embodiment) which concerns on this invention. It is a front view which shows the structure of a head unit. It is a schematic side view (partial cross-sectional view) showing the configuration of the head unit and the imaging unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Printed circuit board 4 Component supply part 4a Tape feeder 6 Head unit 16 Mounting head 16a Mounting head 20 Imaging unit 22 Camera 23 Illumination device 24 Mirror

Claims (6)

A movable head unit having a mounting head mounted thereon is provided, and a component supply unit for supplying components and a mounting operation unit for arranging a substrate to be mounted are provided in a movable region of the head unit. The surface that picks up the component from the component supply unit by the mounting head, conveys it onto the substrate to be mounted, mounts it, and picks up the suction component from the lower side by the imaging means prior to this mounting, and recognizes the suction state image In the mounting machine,
The head unit support member is disposed above the mounting operation unit and the component supply unit, and is provided so as to be movable relative to at least the mounting substrate of the mounting operation unit on a horizontal plane. The head unit is supported so as to be movable,
The imaging means, the provided on the head unit support member, and a movable region of the head unit in the head unit supporting member, the head unit with the relative movement of the head unit support member relative to the mounting substrate support surface mounter, wherein the member and the mounting substrate is characterized in that it is arranged to overlap with et no part component when viewed from the direction perpendicular to the horizontal plane. In the surface mounting machine according to claim 1,
The imaging means is a component that is mounted on a mounted substrate having a height position on the lower surface thereof mounted on the mounting work unit and has a maximum height when mounted on the mounted substrate. A surface mounter characterized by being set to be lower than a height position of the component . In claim 1 or a surface mounting apparatus according to 2,
Has a conveyance unit for conveying the object to be mounted board in the same direction as the moving direction of the head unit with respect to the head unit supporting member, is carried from one side of the mounting work unit the mounting substrate along the conveying section Configured to be carried to the opposite side,
The surface mounting machine, wherein the imaging unit is provided on the upstream side of the mounting operation unit in the transport direction of the substrate to be mounted by the transport unit. In the surface mounter according to any one of claims 1 to 3,
Said imaging means, said of the movable region of the head unit in the head unit supporting member, the direction in which the said head unit supporting member and the component supply unit with the relative movement of the head unit support member relative to the mounting substrate is perpendicular to the horizontal plane surface mounter, characterized in that provided in the overlap with et no part component viewed from. In the surface mounting machine according to any one of claims 1 to 4,
The imaging means is provided movably with respect to the head unit supporting member,
Furthermore, a control means for driving and controlling the imaging means is provided,
The control means, after the component suction at the component supply section, of the movable area of the head unit in the head unit supporting member, said with the head unit supporting member with the relative movement of the head unit support member relative to the mounting substrate to be surface mounting machine and the mounting board, characterized in that the drive control of the imaging means in order to place the imaging means overlap with et no part component when viewed from the direction perpendicular to the horizontal plane. In the surface mounter according to any one of claims 1 to 5,
The imaging means is a surface mounting machine, characterized in that it comprises a line sensor for imaging the component image which is adsorbed to the mounting head with the relative movement of the head unit with respect to the imaging unit.

Images