JP4364678B2 - Component conveying device, surface mounter and component testing device - Google Patents

Description

  The present invention relates to a component transport apparatus configured to suck an electronic component such as an IC from a component supply position with a suction nozzle and transport it to a target position, and a surface mounter and a component test apparatus to which the apparatus is applied. Is.

  Conventionally, a movable head unit has been provided. Components are picked up by a suction nozzle provided on the head unit, and the electronic components are transported from the component supply unit to a predetermined position on the substrate by moving the head unit. Surface mounters that perform this are known. Further, in the surface mounter, in order to recognize the suction state of the component and the like, it is generally performed to image the sucked component.

  For such a surface mounter, various measures for improving the conveyance efficiency have been proposed. For example, it is known that a plurality of suction nozzles are provided at the tip of a mounting head that moves up and down for suction or the like, and a large number of electronic components can be sucked at once (for example, see Patent Document 1 and Patent Document 2).

  The apparatus shown in Patent Document 1 adopts a structure in which a plurality of suction nozzles are arranged in the vicinity of the outer periphery of a disk-shaped holding portion that rotates around an inclined vertical axis. The apparatus disclosed in Patent Document 2 employs a structure in which a plurality of suction nozzles are arranged radially on a nozzle assembly block that rotates about a horizontal axis.

Further, the apparatus disclosed in Japanese Patent Laid-Open No. 2004-228561 reduces the lifting / lowering stroke of the mounting head by lowering the position of the suction nozzle than the camera or mirror for imaging, thereby improving the conveyance efficiency.
JP-A-9-186490 Japanese Patent Laid-Open No. 2001-60796

  However, in the apparatuses shown in Patent Document 1 and Patent Document 2, it is necessary to increase the diameter of the holding unit and the nozzle assembly block as the number of suction nozzles increases, leading to an increase in the size of the entire apparatus. . Moreover, even if many electronic components are picked up at a time, there is a problem that a lot of time is taken to image them.

  The present invention has been made in view of such circumstances, and although it has a compact structure, it picks up a large number of electronic components at once and reduces the lifting stroke of the suction nozzle to increase the conveyance efficiency. It is another object of the present invention to provide a component transport device capable of shortening the imaging time of an adsorbed electronic component, and a surface mounter and a component test apparatus equipped with the device.

In order to solve the above-described problems, the present invention provides a component transport apparatus configured to suck an electronic component from a component supply position with a suction nozzle and transport the electronic component to a target position, over the component supply position and the target position. A movable head unit, a mounting head provided in the head unit, a fixing part provided at a tip of the mounting head, and a rotary unit attached to the fixing part so as to be rotatable about a horizontal axis; A nozzle assembly block that supports the base end side of the suction nozzle, a drive shaft that drives the nozzle assembly block about a horizontal axis, and an imaging unit that images the electronic component sucked by the suction nozzle; The nozzle assembly block is supported so as to be rotatable about a horizontal axis, and a plurality of the nozzle assembly blocks are provided so as to be aligned in the direction of the horizontal axis. The suction nozzle is assembled to each nozzle assembly block so that the axial direction of the suction nozzle is radial from the rotation center of the horizontal axis, During the same transport operation, the electronic device is configured to collectively image each electronic component sucked by each suction nozzle in a state where the suction nozzles of different nozzle assembly blocks are directed in the same direction. together are mounted on the head unit is movable in the direction in which the nozzle assembly blocks are aligned with respect to the head unit, to perform imaging of the electronic component while moving relative to the head unit in the direction It is configured.

According to this configuration, the suction nozzle rotates in the vertical direction around the horizontal axis. Then, a plurality of nozzle assembly blocks are provided so as to be aligned in the direction of the horizontal axis (in the present specification, this is hereinafter referred to as a double-row vertical rotary head structure). By adopting a double-row vertical rotary head structure, the total number of suction nozzles can be increased, and the conveyance efficiency can be increased.
In addition, the imaging means is mounted on the head unit, and the nozzle assembly block moves in the direction in which the nozzle assembly blocks are arranged with respect to the head unit (hereinafter, this is referred to as an on-the-fly scanning structure). Then, all the suction components can be imaged with high accuracy by one imaging means. This can reduce the number of image pickup means as compared with a fixed image pickup means provided in each nozzle assembly block.

  Further, since the total number of suction nozzles can be increased without increasing the diameter of the nozzle assembly block, a compact structure can be achieved, and the entire apparatus can be reduced in size and weight. Further, since an increase in the moment of inertia of the rotating portion (nozzle assembly block) is suppressed, the load on the motor for rotating the rotating portion can be reduced, and a small and low-load motor can be used.

  In addition, since the imaging unit images a plurality of electronic components at the same time during the same transport operation, the imaging time can be shortened. The same transporting operation here refers to a series of operations from when each suction nozzle picks up an electronic component at the component supply position until the head unit moves to the target position and the electronic component is released from the suction nozzle. Point to. Collective imaging refers to imaging a plurality of electronic components in a single imaging operation. For example, when the imaging means is a CCD area sensor or the like, it means that a plurality of electronic components are placed within one angle of view, and when the imaging means scans a CCD line sensor or the like, a plurality of images are obtained by one scan. This refers to taking images of electronic components together.

In the above configuration, each nozzle assembly block includes a plurality of suction nozzles , formed on a mating surface between the nozzle assembly block and the fixed portion, and formed concentrically corresponding to the number of the suction nozzles. An annular groove, a radial portion formed in the nozzle assembly block and extending from the annular groove to a corresponding suction nozzle, and a portion formed in the fixed portion and supplying a negative pressure independently for each annular groove; An air passage is provided, and the nozzle assembly block is rotated at the component supply position, the electronic components are sequentially adsorbed by the suction nozzles, and the adsorbed electronic components are rotated while the nozzle assembly block is rotated. By configuring so that the image pickup unit sequentially picks up an image (claim 2), it is possible to further improve the conveyance efficiency.

  Thus, by providing a plurality of suction nozzles in each nozzle assembly block, the total number of suction nozzles can be increased without increasing the number of nozzle assembly blocks. In addition, by sequentially sucking electronic components with each of the above suction nozzles while rotating the nozzle assembly block, the suction position is constant even if the suction nozzles are arranged radially (for example, the suction is always performed with the nozzle tip facing downward). ). Therefore, the movement of the suction nozzle at the time of suction can be made simple (for example, a lifting operation), and a simple structure can be achieved.

  Further, the picked-up electronic components are sequentially picked up by the image pickup means while rotating the nozzle assembly block, so that the pick-up position can be made constant even if the pick-up nozzles are arranged radially. Therefore, in the case where the image pickup means is fixed or scanned, a simple movement can be achieved, and a simple structure can be obtained.

  Further, it is preferable that the image pickup unit picks up an image of the electronic component while the nozzle assembly block is rotated by a predetermined angle after the electronic component is sucked.

  When a camera (imaging means) is placed beside or above the suction nozzle and the nozzle assembly block is imaged without rotating it from the component suction position (general conventional structure with the suction nozzle fixed downward) Since the tip of the suction nozzle faces downward, an image is taken through a mirror or the like. Accordingly, a space for arranging a mirror or the like or a lighting device below the tip of the suction nozzle is required, and the suction nozzle position at the time of imaging must be set to a relatively high position. For this reason, the raising / lowering stroke of a suction nozzle (nozzle assembly block) will become large.

  However, according to the above configuration, the camera can be directly imaged from the side or from above while the nozzle assembly block is rotated, for example, 90 ° or 180 ° from the component suction state. That is, since a space for installing a mirror or the like or an illuminating device under the suction nozzle is not necessary, the suction nozzle position at the time of imaging can be set to a minimum necessary position. Therefore, the up-and-down stroke at the time of adsorption | suction can be made small and conveyance efficiency is improved. Moreover, since the restrictions on the layout of the lighting device are relaxed, it can be enlarged and a sufficient amount of light can be secured.

  The rotation angle of the nozzle assembly block at the time of imaging is not limited to 90 ° or 180 °, and may be set as appropriate. For example, if the camera is placed at the position where the structure is the most compact in the layout, and the rotation angle of the nozzle assembly block at the time of imaging is set accordingly, it can greatly contribute to miniaturization of the entire apparatus. it can.

In the on-the-fly scanning structure as in claim 1 , when the suction nozzle faces downward during imaging, it is almost inevitably required to install a mirror or a lighting device under the suction nozzle. It was. Accordingly, when the structure of claim 3 is used in combination with the structure of claim 1 , the effect of claim 1 (all suction parts can be imaged with high accuracy by a single imaging means) is further utilized. It becomes.

  According to a fifth aspect of the present invention, there is provided a surface mounter for transporting a component supplied by a component supply unit onto a substrate positioned at a mounting work position and mounting the component at a predetermined position on the substrate. The part transporting device according to any one of claims 1 to 4 is provided as means for transporting parts.

  According to a sixth aspect of the present invention, in the component testing apparatus for carrying out various tests by conveying the component supplied in the component supply section to the test means, as means for conveying the component from the component supply section to the test means. A component conveying device according to any one of 1 to 4 is provided.

  Since these surface mounters and component testing apparatuses have improved component transport efficiency and reduced imaging time, the overall mounting efficiency and test efficiency can be increased.

  As is apparent from the above description, according to the present invention, in the component conveying apparatus, although it has a compact structure, it is possible to absorb a large number of electronic components at once, or to reduce the lifting and lowering stroke of the adsorption nozzle, thereby improving the conveyance efficiency. Further, it is possible to shorten the imaging time of the sucked electronic component. And the surface mounting machine and component testing apparatus which mount this component conveyance apparatus can improve mounting efficiency and test efficiency as a whole.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view schematically showing a surface mounter on which a component conveying apparatus of the present invention is mounted (functionally included) according to a first embodiment of the present invention. 2 is a partial front view of the same, and FIG. 3 is a side view of the same. The surface mounter of this embodiment is an on-the-fly scan type surface mounter, and electronic components C (small chip components such as ICs, transistors, capacitors, etc.) are placed on the printed circuit board P mainly by the operation of each part mechanism. It comprises a main body mechanism unit 10 to be mounted and a controller 30 (see FIG. 5) for controlling the operation thereof. A printed circuit board conveying conveyor 2 is disposed on a base 1 provided in the main body mechanism unit 10, and the printed circuit board P is conveyed on the conveyor 2 and positioned by the substrate installation unit 3 (mounting work position). It is to be installed. In FIG. 1, the printed circuit board P installed in the board | substrate installation part 3 is shown with a dashed-two dotted line.

  On both sides of the conveyor 2, component supply units 4 are arranged. These component supply units 4 are provided with multiple rows of tape feeders 4a. Each of the tape feeders 4a is configured such that the tape that holds and holds the electronic component C at predetermined intervals is led out from the reel, and the electronic component C is intermittently taken out by the head unit 6. ing.

  Above the base 1, a component mounting head unit 6 is provided. The head unit 6 is movable between the component supply unit 4 and the mounting position (target position) of the printed circuit board P installed in the substrate installation unit 3 so that it can move in the X-axis direction and the Y-axis direction. It has become.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. The nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 6 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 6 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The Y-axis servo motor 9 and the X-axis servo motor 15 are provided with encoders 9a and 15a, respectively, so that the movement position of the head unit 6 is detected.

  The head unit 6 is provided with a plurality of mounting heads 16 (six in the present embodiment; however, in order to simplify the drawing, the mounting head 16 in the central portion is omitted in FIG. 2). . The mounting head 16 can be moved up and down (moved in the Z-axis direction) with respect to the frame of the head unit 6 and rotated around the central axis (R-axis) of the downward suction nozzle (the suction nozzle 17c in the state of FIG. 3). It is actuated by a lifting drive means such as a Z-axis servo motor and a rotational drive means such as an R-axis servo motor (not shown).

  A turret 16b (nozzle assembly block) is provided at the tip of each mounting head 16 so as to be rotatable about the horizontal axis. The turret 16b is structured to rotate vertically by a turret drive motor 45 (see FIG. 5) provided individually. Therefore, the six mounting heads 16 constitute a double-row vertical rotary head structure as a whole. A plurality of (four in each embodiment) suction nozzles 17 are assembled to each turret 16b. Each suction nozzle 17 (specifically, the suction nozzles 17a, 17b, 17c, and 17d) is assembled so that the axial direction thereof is radial at intervals of 90 ° from the rotation center of the horizontal axis of the turret 16b. Therefore, when the turret 16b rotates 90 ° in the direction of the arrow from the state shown in FIG. 3 (the suction nozzle 17c faces downward), the suction nozzle 17c turns sideways, and instead, the suction nozzle 17d faces downward. The suction nozzle 17 sucks the electronic component C by negative pressure and holds the suction state while the head unit 6 is moving. The negative pressure supply structure to each suction nozzle 17 will be described in detail later.

  Furthermore, an imaging unit 20 is mounted on the head unit 6. The imaging unit 20 is a unit for imaging the electronic component C sucked by the suction nozzle 17 and includes a camera 18 and a lighting device 19.

  As shown in FIG. 3, the imaging unit 20 is provided from the back surface (left side in FIG. 3) to the lower side of the head unit 6 and supported by the head unit 6. A ball screw shaft 23 (supported by the head unit 6) extending in the X-axis direction is inserted through the upper portion of the imaging unit 20. The imaging unit 20 is provided with a nut portion (not shown) that engages with the ball screw shaft 23. The ball screw shaft 23 is rotationally driven by the imaging unit axis servo motor 22, and the imaging unit 20 is moved in the X-axis direction (the direction in which the six turrets 16 b are arranged) by the rotation. The image pickup unit axis servomotor 22 is provided with an encoder 22a so that the moving position of the image pickup unit 20 is detected.

  The imaging unit 20 is provided with a camera 18 whose lens is directed toward the turret 16b. The camera 18 is an imaging means composed of a CCD line sensor. By taking an image while moving the camera 18 in the X-axis direction, an image of the electronic component C sucked by the suction nozzle 17 (the suction nozzle 17b in the state of FIG. 3) can be obtained.

  The imaging unit 20 is provided with an illuminating device 19 made of LEDs or the like that illuminates the electronic component C to be imaged.

  4 is a cross-sectional view taken along the line III-III in FIG. 3, and shows an internal structure (mainly a negative pressure supply structure) of the mounting head 16 including the turret 16b. The front end portion of the mounting head 16 includes a fixed portion 16a integrated with the mounting head 16, and a turret 16b that rotates about the turret drive shaft 16c (horizontal axis) with respect to the fixed portion 16a.

  The fixed portion 16a includes four negative pressure supply pipes 50 (specifically, negative pressure supply pipes 50a, 50b, 50c, and the like) via a negative pressure supply valve 47 (see FIG. 5). 50d) is connected. Inside the fixed portion 16a, four air passages 51 (specifically, air passages 51a, 51b, 51c, 51d) communicating with the respective negative pressure supply pipes 50 are provided. It opens to the mating surface with the turret 16b. On the other hand, four annular grooves 52 (specifically, annular grooves 52a, 52b, 52c, 52d) are provided at positions corresponding to the openings of the air passages 51 on the mating surface of the turret 16b with the fixed portion 16a. Yes. Each annular groove 52 is a groove formed on a concentric circle of the turret drive shaft 16c, and each air passage 51 always communicates with each annular groove 52 independently of each other even when the turret 16b rotates. In the turret 16b, four air passages 53 communicating with the respective annular grooves 52 are provided. Each air passage 53 is led to each suction nozzle 17 projecting radially from the outer peripheral surface of the turret 16b, and its open end serves as a suction port for sucking the electronic component C. FIG. 4 shows an air passage 53a that communicates the annular groove 52a and the suction nozzle 17a and an air passage 53c that communicates the annular groove 52c and the suction nozzle 17c.

  With this structure, the suction nozzles 17a, 17b, 17c, and 17d are connected to the negative pressure supply pipes 50a, 50b, 50c, and 50d in a one-to-one correspondence. And even if the turret 16b rotates, on / off of the negative pressure supply to each suction nozzle 17 (on / off of suction) can be controlled independently.

  FIG. 5 is a schematic block diagram showing a control system of the surface mounter. The controller 30 is provided at an appropriate position inside the main body mechanism unit 10, and is a well-known CPU for executing logical operations, a ROM for storing various programs for controlling the CPU in advance, and various data temporarily during operation of the apparatus. It is comprised from RAM etc. which memorize | store. The controller 30 includes a main control unit 32, a drive axis control unit 34, a camera / illumination control unit 38, an image processing unit 40, a turret control unit 41, and a negative pressure supply control unit 42 as functional configurations.

  The main control unit 32 controls the operation of the surface mounter in an integrated manner, and the servo motor 9 and the drive unit 34 are operated via the drive shaft control unit 34 to operate the head unit 6 and the imaging unit 20 in accordance with a program stored in advance. While controlling the drive of 15, 22, etc., the state of the component (position, posture, component quality, etc.) by the suction nozzle 17 is recognized based on the component image captured by the camera 18. Further, the mounting position is corrected according to the recognized state of the component.

  The camera / illumination control unit 38 controls the imaging operation of the camera 18 and operates the illumination device 19 in synchronization with the imaging timing.

  The image processing unit 40 performs predetermined processing on the image signal output from the camera 18 to generate image data suitable for component recognition, and outputs the image data to the main control unit 32.

  The turret control unit 41 determines the rotation angle of the turret 16 b and sends a predetermined drive signal to the turret drive motor 45. Specifically, the rotation angle of the turret 16b is determined so that the suction nozzle 17 that should suck the electronic component C and the suction nozzle 17 that should be mounted on the printed circuit board P face downward. Further, the rotation angle of the turret 16b is determined so that the suction nozzle 17 that sucks the electronic component C to be imaged faces the lens of the camera 18.

  The negative pressure supply control unit 42 controls on / off of the negative pressure supply valve 47 in cooperation with the turret control unit 41. Specifically, when each suction nozzle 17 sucks or holds the electronic component C, the negative pressure supply valve 47 is turned on to supply negative pressure (negative pressure suction) and release the electronic component C. Sometimes the negative pressure supply valve 47 is turned off to stop the supply of negative pressure. This negative pressure supply control is performed independently for each mounting head 16 and each suction nozzle 17.

  The drive axis control unit 34 drives and controls the Y-axis servo motor 9 and the X-axis servo motor 15 while detecting the current position (X, Y) of the head unit 6 based on signals from the encoders 9a and 15a. Is moved to a predetermined position. When the head unit 6 is moved to the mounting position, the position correction calculated by the main control unit 32 is reflected. Further, the drive axis control unit 34 drives and controls the imaging unit axis servo motor 22 while detecting the current position of the imaging unit 20 with respect to the head unit 6 in the X axis direction based on a signal from the encoder 22a, thereby controlling the imaging unit 20 to a predetermined level. Move to position.

  Next, an example of the mounting operation of the surface mounter based on the control of the controller 30 will be described with reference to the flowchart of FIG.

  FIG. 6 is a schematic flowchart of the mounting operation. In the surface mounter of this embodiment, board data is prepared in which a combination of electronic components C corresponding to a printed board P to be mounted, a mounting position, and the like are grouped. Therefore, board data corresponding to the printed board P to be mounted is first selected and read (step S1). Next, the printed circuit board P is conveyed to the board installation unit 3 by the conveyor 2 and fixed (step S3).

  Next, the process proceeds to step S5, and component suction is executed. Specifically, the electronic component C is sequentially sucked by the suction nozzle 17 while rotating the turret 16 b in the component supply unit 4. FIGS. 7A and 7B are explanatory views showing the suction operation, in which FIG. 7A shows a state in which the suction nozzle 17a sucks the electronic component C, and FIG. Shows the state. As shown in FIG. 7A, when the first downward suction nozzle 17 is the suction nozzle 17a, first, the suction head 17 is moved up and down to supply a negative pressure so that the suction nozzle 17a sucks the electronic component C. Is made. When the suction to all six suction nozzles 17a arranged in the axial direction of the turret drive shaft 16c is completed, the process proceeds to step S7 in the flowchart of FIG. The In the state shown in FIG. 7A, since the suction to the suction nozzles 17b, 17c and 17d has not been made yet, the determination is NO and the process proceeds to step S9. That is, the turret 16b is rotated by 90 ° in the direction of the arrow (hereinafter, this rotational direction is referred to as the forward direction and the opposite is referred to as the reverse direction). Then, since the suction nozzle 17b is directed downward as shown in FIG. 7B, the electronic component C is sucked by the suction nozzle 17b. When the suction nozzles 17c and 17d are sequentially suctioned in this way, the suction to all the suction nozzles 17 (24 in total) is completed (YES in step S7).

  Next, the process proceeds to step S11, and imaging of the component is executed. The first imaging is performed using the time for the head unit 6 to move from the component supply unit 4 to the board installation unit 3. Specifically, the electronic components C are sequentially imaged by the camera 18 while rotating the turret 16b. FIG. 8 is an explanatory diagram showing the first imaging operation, and is a plan view of the vicinity of the mounting head 16 and the imaging unit 20 (in order to simplify the drawing, the three mounting heads 16 in the central portion are omitted). Show). When the suction by the suction nozzle 17d is completed, the suction nozzle 17c faces the camera 18 as shown in FIG. In this state, the six electronic components C sucked by the suction nozzle 17c are collectively imaged by the camera 18 while moving (scanning) the imaging unit 20 in the arrow direction.

  When this imaging is completed, the process proceeds to step S13 in the flowchart of FIG. 6, and the state of the sucked component is recognized based on the imaging screen. Here, if there is a suction misalignment or the like, the mounting position is corrected as necessary. Next, while moving the head unit 6 to the corrected mounting position, the turret 16b is rotated 90 ° in the reverse direction (or 270 ° in the forward direction), and the suction nozzle 17c is directed downward (step S14). Then, the six electronic components C sucked by the suction nozzle 17c are sequentially mounted on the mounting positions of the printed circuit board P (step S15).

  When the mounting is completed, the process proceeds to step S17, and it is determined whether or not the mounting of all the components is completed. At this time, since the electronic component C sucked by the suction nozzles 17a, 17b, and 17d is not yet mounted, the process returns to step S11, and imaging of the component that is not yet mounted is performed. At this time, since the suction nozzle 17c faces downward, the suction nozzle 17b faces the direction of the camera 18. Thus, the head unit 6 is moved to the first mounting position of the electronic component C sucked by the suction nozzle 17b, and the electronic component C sucked by the suction nozzle 17b is imaged. At this time, since the imaging unit 20 is at the position indicated by the two-dot chain line in FIG. 8, this time, imaging is performed while moving in the direction opposite to the arrow (toward the position indicated by the solid line). In this way, Steps S13 to S15 are repeated in the same manner as described above, and the electronic component C sucked by the suction nozzle 17b is mounted. Similarly, the electronic component C sucked by the suction nozzles 17a and 17d is mounted. When the mounting of the electronic component C sucked by all the suction nozzles 17 (24 in total) is completed (YES in step S17), the process returns.

  In addition, when continuing mounting of the electronic component C after step S17, the control of step S5-step S17 is repeated. When mounting on another printed circuit board P of the same type, the control in steps S3 to S17 is repeated. Further, when mounting on another type of printed circuit board P, the control of step S1 to step S17 is repeated.

  As described above, the surface mounter of this embodiment employs a double-row vertical rotary head structure, so the total number of suction nozzles is as large as 24, and a large number of electronic components C can be used at once in the component supply unit 4. Can be adsorbed. Therefore, the number of reciprocations between the component supply unit 4 and the mounting position can be reduced, and the conveyance efficiency is improved. In addition, since the number of suction nozzles 17 provided in one turret 16b is set to four, which is relatively small, so that the diameter of the turret 16b is not so large, a compact structure can be obtained, and the entire apparatus can be made compact. It is lighter.

  Further, the mounting machine of the present embodiment can take an image while the head unit 6 is moving by an on-the-fly scanning structure. Therefore, the shortest path can be taken as the moving path of the head unit 6, and time is shortened by taking an image by effectively using the moving time. In addition, since the camera 18 images the six electronic components C at once, the imaging time is shortened, and the mounting efficiency is further improved.

  Furthermore, the camera 18 is directly imaged from the side with the turret 16b rotated 90 ° from the component suction position. Therefore, it is not necessary to provide a space for installing a mirror, an illumination device, or the like further below the suction nozzle 17 facing downward, and the position of the suction nozzle 17 at the time of imaging can be set to a minimum required position. This reduces the elevation stroke of the mounting head 16 and increases the conveyance efficiency. In addition, the restrictions on the layout of the lighting device 19 are eased and the size can be easily increased, so that a sufficient amount of light can be secured.

  In this embodiment, the electronic components C are imaged and mounted in units of one row (steps S11 to S17 in the flowchart of FIG. 6), but all the electronic components C are rotated while rotating the turret 16b first. The first electronic component C may be mounted after imaging. Alternatively, imaging may be performed every time the suction by the suction nozzles 17 in one row is completed.

  Next, a modification of this embodiment will be described. FIG. 9 is an explanatory view showing a modification of the present embodiment, in which (a) is taken from above via a mirror, (b) is provided with three suction nozzles in each turret, (c) Is provided with five suction nozzles in each turret. In the following drawings, the same components as those in the above embodiment are denoted by the same reference numerals and description thereof is omitted.

  In FIG. 9A, the mirror 25 is disposed on the side of the turret 16b, and the imaging unit 20 'is disposed above the mirror 25. The camera 18 mounted on the image pickup unit 20 ′ picks up an image of the electronic component C sucked by the suction nozzle 17 facing the mirror 25 (the suction nozzle 17 c in the figure) via the mirror 25. By arranging the camera 18 in this way, the side of the turret 16b can be saved in space.

  The number of suction nozzles 17 is not limited to four for each turret 16b. As shown in FIG. 9B, three suction nozzles (17a ′, 17b ′, 17c ′) are provided for each turret 16b ′, or five for each turret 16b ″ as shown in FIG. 9C. The suction nozzles (17a ″, 17b ″, 17c ″, 17d ″, 17e) may be provided. Alternatively, it may be 2 or less or 6 or more. If the number of each suction nozzle 17 is increased, the number of electronic components C that can be suctioned at a time can be increased. If the number of each suction nozzle 17 is decreased, the internal structure of the turret 16b and the mounting head 16 can be simplified. can do.

  Further, the imaging direction (position of the camera 18) is not limited to the side or the upper side, but the image is taken from obliquely upward as shown in FIG. 9B, or is taken obliquely from below as shown in FIG. 9C. You may do it. In addition, the number may be set as appropriate according to the number of suction nozzles 17 and layout restrictions.

  FIG. 10 is an explanatory view showing a surface mounter as a second embodiment of the present invention, and is a partial front view corresponding to FIG. 8 of the first embodiment. Similarly to the first embodiment, the surface mounter of this embodiment also has a component conveying device and a camera 18 mounted on the head unit 6. However, the camera 18 of the present embodiment is composed of a CCD area sensor and is fixed to the head unit 6.

  In this embodiment, a pair of mounting heads 16 and mounting heads 16 ′ that are symmetrical with the mounting head 16 in front view form a pair, and these pairs are provided in a plurality of (for example, three pairs) head units 6. A pair of cameras 18, a lighting device 19, and a mirror 26 are provided for each pair.

  The camera 18 is provided above the mounting heads 16 and 16 ′, and the illumination device 19 and the mirror 26 are provided below the mounting heads 16 and 16 ′. In this state, it moves to the back side of the drawing). At the time of imaging, the illuminating device 19 and the mirror 26 move forward (front side of the sheet) and are arranged directly below the suction nozzle 17 facing downward (the suction nozzle 17d in the state shown in the figure). The camera 18 images the two electronic components C sucked by the suction nozzles 17d collectively through the mirror 26. In this embodiment, three cameras 18 are required to image the electronic component C sucked by the six suction nozzles 17, but a mechanism for moving the camera 18 relative to the head unit 6 is not required, and a simple structure is provided. It can be.

FIG. 11 is a plan view schematically showing a component testing apparatus as a third embodiment of the component conveying apparatus according to the present invention. This parts testing apparatus is also functionally equipped with the parts conveying apparatus of the present invention. A base 71 of the component testing apparatus 70 is provided with a cassette setting portion 73 on which cassettes 72 in which wafers Wa in which bare chips (electronic components) are diced are stored in multiple stages can be mounted. The cassette 72 attached to the cassette installation unit 73 is transported to a position below the opening 74 formed in the base 71 by a transport mechanism (not shown), and the bare chip is picked up by the head 75 at this position. The head 75 conveys the bare chip from the opening 74 to the component standby unit 77 (component supply unit) along a rail 76 extending in the Y-axis direction on the base 71. The component standby unit 77 is disposed between a pair of rails 78 extending in the X-axis direction on the base 71, and the bare chip transferred to the component standby unit 77 is driven along a pair of head units 79. , 80 to the inspection socket 81 (target position) on the base 71 , and predetermined various tests are executed by the test means.

  The head units 79 and 80 are provided with two inspection heads 79a and 80a provided with suction nozzles that can suck bare chips, respectively. These inspection heads 79a and 80a have a double-row vertical rotary head structure similar to that of the first embodiment or the second embodiment. That is, a plurality of turrets supported by a turret drive shaft provided in the X-axis direction or the Y-axis direction are provided. Then, the bare chip is sucked to all the suction nozzles while rotating the turret by the component standby unit 77.

  Further, on the base 71, imaging units 84 and 86 are provided between the component standby unit 77 and the inspection socket 81, and the head units 79 and 80 move on the imaging units 84 and 86 as the head units 79 and 80 move. The bare chip adsorbed by the head units 79 and 80 is imaged and recognized. That is, the inspection heads 79a and 80a are temporarily stopped above the image pickup units 84 and 86, and the turret is rotated to take an image of the bare chip while sequentially causing the suction nozzle to face downward. At that time, the imaging units 84 and 86 collectively image the bare chips adsorbed by the adsorption nozzles of different turrets using a camera including a CCD line sensor and a CCD area sensor.

  The imaging units 84 and 86 detect a defect (for example, bump height defect) of the bare chip conveyed from the component standby unit 77 to the inspection socket 81, and the bare chip detected as a defective product is the head unit. 79 and 80, the product is conveyed to a defective product tray 89 placed on a defective product collecting unit 88 on the base 71. In addition, the imaging units 84 and 86 detect the attitude of the bare chip with respect to the head units 79 and 80, and the bare chip detected as being displaced with respect to the head units 79 and 80 is the head. After the position correction is executed by the units 79 and 80, the unit is conveyed to the inspection socket 81.

  Then, various tests are performed by the test means in the inspection socket 81, and as a result, the bare chip determined to be a defective product is conveyed to the defective product tray 89 by the head units 79 and 80, but is a good product. The bare chip determined to be transferred to the component storage section 90 on the base 71 by the head units 79 and 80, and is stored in the base tape 91 for the tape feeder in the component storage section 90. A cover tape (not shown) is attached to the tape 91.

  When the defective product tray 89 of the defective product collection unit 88 is fully loaded, the tray 89 is transferred to the tray discharge unit 92 by a tray moving mechanism (not shown) and the tray standby adjacent to the defective product collection unit 88 is waited for. The tray 94 in the section 93 is transferred to the defective product collection section 88 by the head units 79 and 80, and the empty tray is transferred from the empty tray mounting section 95 to the tray standby section 93 by a tray moving mechanism (not shown). It has become.

  Similarly to the above-described embodiment, the component testing apparatus 70 also has a double row vertical rotary head structure for the inspection heads 79a and 80a, thereby increasing the conveyance efficiency by adsorbing many bare chips at a time at the component standby unit 77. ing. Furthermore, the imaging time is shortened by collectively imaging a plurality of sucked bare chips, thereby improving the overall test efficiency.

  As described above, the description has been given according to the first to third embodiments, but the present invention is not limited to this, and may be appropriately changed within the scope of the claims. For example, the component conveying apparatus according to the present invention is not limited to the one mounted on the surface mounting machine or the component testing apparatus, and the electronic component is adsorbed from the component supply position by the adsorption nozzle and conveyed to the target position. It also includes parts conveying devices mounted on various devices to be treated.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view schematically illustrating a surface mounter that is a first embodiment according to the present invention and is equipped with a component carrying device of the present invention. It is a front view which abbreviate | omits and shows a part of said surface mounting machine. It is a side view which abbreviate | omits and shows a part of said surface mounting machine. It is the III-III sectional view taken on the line of FIG. It is a schematic control block diagram of the said surface mounting machine. It is a schematic flowchart for mounting operation of the surface mounter. It is explanatory drawing which shows the adsorption | suction operation | movement of the said surface mounting machine. It is explanatory drawing which shows the first mounting operation | movement of the said surface mounting machine. It is explanatory drawing which shows the modification of the said surface mounter, (a) what is imaged from upper direction through a mirror, (b) is what equips each turret with three adsorption nozzles, (c) is each turret Are provided with five suction nozzles. It is 2nd Embodiment which concerns on this invention, Comprising: It is a partial front view which shows the surface mounting machine carrying the component conveying apparatus of this invention. It is 3rd Embodiment which concerns on this invention, Comprising: It is a top view which shows roughly the components test apparatus carrying the components conveying apparatus of this invention.

Explanation of symbols

3 Board installation part (mounting work position)
4 Component supply unit 6 Head unit 16b Turret (nozzle assembly block)
16c Turret drive shaft (horizontal axis)
17, 17a, 17b, 17c, 17d Suction nozzle 18 Camera (imaging means)
77 Parts standby part (parts supply part)
79 Head unit 80 Head unit 81 Inspection socket (target position)
C Electronic component P Printed circuit board

Claims (5)

In a component transport device configured to suck an electronic component from a component supply position with a suction nozzle and transport it to a target position,
A head unit movable between the component supply position and the target position;
A mounting head provided in the head unit;
A fixing portion provided at the tip of the mounting head;
A nozzle assembly block that is rotatably mounted around the horizontal axis with respect to the fixed portion and supports the proximal end side of the suction nozzle;
A drive shaft for driving the nozzle assembly block around the horizontal axis;
Imaging means for imaging the electronic component sucked by the suction nozzle, and
The nozzle assembly block is supported so as to be rotatable around the horizontal axis, and is provided in a plurality so as to be aligned in the direction of the horizontal axis.
The drive shaft supports the nozzle assembly block in a cantilever shape,
The suction nozzle is assembled to each nozzle assembly block so that its axial direction is radial from the rotation center of the horizontal axis,
The imaging means is configured to collectively image each electronic component sucked by each suction nozzle while the suction nozzles of different nozzle assembly blocks are directed in the same direction during the same transport operation. And
With the above image pickup means is mounted on the head unit is movable in the direction in which the nozzle assembly blocks are aligned with respect to the head unit, the imaging of the electronic component while moving relative to the head unit in the direction A component conveying device characterized by being configured to perform. Each nozzle assembly block includes a plurality of suction nozzles,
An annular groove formed on the mating surface of the nozzle assembly block and the fixed portion and formed concentrically corresponding to the number of the suction nozzles, and formed in the nozzle assembly block, corresponding to the annular groove. An air passage including a radial portion extending to the suction nozzle and a portion that is formed in the fixed portion and that supplies a negative pressure independently for each of the annular grooves is provided,
While rotating the nozzle assembly block at the component supply position, the electronic components are sequentially sucked by the suction nozzles,
The component conveying apparatus according to claim 1, wherein the picked-up electronic components are sequentially imaged by the imaging unit while rotating the nozzle assembly block.   3. The component according to claim 1, wherein the imaging means is configured to image the electronic component in a state where the nozzle assembly block is rotated by a predetermined angle after the electronic component is sucked. Conveying device.   In a surface mounter that transports a component supplied in a component supply unit onto a substrate positioned at a mounting work position and mounts the component on a predetermined position on the substrate, as means for conveying the component from the component supply unit onto the substrate, A surface mounter comprising the component conveying device according to any one of claims 1 to 3.   4. A component testing apparatus for carrying out various tests by conveying a component supplied in a component supply unit to a test means, as means for conveying the component from the component supply unit to the test means. A component testing apparatus comprising the component conveying device described in 1.

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