JP4401792B2 - Component recognition method, apparatus and surface mounter - Google Patents

Description

  The present invention relates to a component recognition method and apparatus for recognizing an electronic component adsorbed by a movable head unit having a plurality of mounting heads prior to mounting, and the apparatus, in which the head unit is incorporated. The present invention relates to a surface mounter that picks up electronic components and automatically mounts them on a substrate such as a printed board.

  2. Description of the Related Art Conventionally, a surface mounter (hereinafter referred to as an IC) that takes out an electronic component such as an IC (hereinafter abbreviated as a component) from a component supply unit by a movable head unit having a plurality of mounting heads and mounts it on a printed circuit board Is abbreviated as mounting machine).

  In this type of mounting machine, in order to prevent mounting of defective parts and to prevent misalignment at the time of mounting, the suction parts in the middle of conveyance are image-recognized prior to mounting of the parts, and based on the recognition results. Thus, defective parts are selected and mounting positions are corrected.

  The main part of component recognition is to pick up one surface (mainly the lower surface) of the suction component. However, in recent years, the suction component can be detected from a plurality of different directions in order to detect lead breakage more accurately. For example, a component is recognized by forming a three-dimensional image by imaging and synthesizing the obtained images (for example, Patent Document 1). In addition, a line sensor (linear sensor) is used as means for imaging the suction component, and thereby, the suction component is image-recognized without interrupting (temporarily stopping) the conveyance of the component.

By the way, the image required for component recognition differs depending on the type of suction component.For example, in the case of a simple shape component such as a square chip resistor, there is almost no defective component that can be judged on the appearance, and there is a displacement in mounting. Since it is only necessary to prevent it, it is possible to sufficiently cope with only a two-dimensional image (hereinafter, a component that requires acquisition of the two-dimensional image is referred to as a 2D recognition component). On the other hand, for example, in package parts having leads around, it is necessary to acquire a three-dimensional image in addition to a two-dimensional image in order to prevent misalignment during mounting and to accurately detect defects such as uneven leads and floating. There is a part (hereinafter, a part that needs to acquire a three-dimensional image is called a 3D recognition part). By the way, since the heights of the 2D recognition component and the 3D recognition component are generally different, these 2D and 3D recognition components are mounted by a head unit that does not have an individual lifting function that can finely adjust the height of the mounting head. In this case, in order to focus the image pickup means on each recognition component, the image is picked up and picked up by the head unit in a separate process, and component recognition is performed based on this high resolution image.
JP-A-7-151522

  However, since the image required for component recognition depends on the shape characteristics and purpose of the component, it is necessary to uniformly acquire high-resolution images focusing on each component for accurate component recognition. However, if such a high-resolution image is uniformly acquired for each component, the efficient mounting of the component is hindered. Therefore, in order to reliably and efficiently mount a component, it is desired to select an image that is reasonably acquired in relation to the type of component and its resolution.

  That is, for example, in the conventional mounting machine, since the imaging by the line sensor is focused on both the 2D and 3D recognition components, different types of components are sucked and mounted on the head unit all at once. However, the head unit is reciprocated between the component supply unit and the printed board for each type of component, and there is room for improvement in terms of efficient component mounting.

  The present invention has been made to solve the above-described problems, and recognizes a part using a head unit that cannot individually raise and lower the mounting head in order to finely adjust the height of the mounting head. The purpose of this invention is to provide a component recognition method and apparatus capable of performing efficient mounting while maintaining accurate component recognition in relation to the type of component, and a surface mounter in which the apparatus is incorporated. Yes.

In order to solve the above-mentioned problem, in the component recognition method according to claim 1 of the present invention, a plurality of imaging means for imaging the suction component sucked by the head unit from different directions are arranged in the component recognition unit, and the head When the unit passes through the component recognition unit, the pick-up part is picked up by the image pickup means, and at this time, two-dimensional recognition based on an image picked up by one image pickup means and three based on images picked up by a plurality of image pickup means. A component recognition method for selecting dimension recognition according to the type of a suction component, wherein a plurality of suction components are sucked by a plurality of mounting heads provided in the head unit, and the two-dimensional recognition is performed. By including the recognition component and the 3D recognition component to be three-dimensionally recognized in the suction component, the 2D recognition component and the 3D recognition component are mixed in the head unit. Together to wear, but which is adapted to image the 2D and 3D recognition component by the first and the plurality of image pickup means in a state focused on the 3D recognition component.

  In this case, as the plurality of imaging means, the first imaging means that faces the surface opposite to the suction surface of the suction component and the second imaging means that images from a different direction are used. Preferred (claim 2).

On the other hand, a component recognition apparatus according to a third aspect of the present invention includes a head unit having a plurality of mounting heads that can adsorb components in parallel, and a plurality of imaging units that image the adsorption components adsorbed thereto from different directions. And a drive means for moving the head unit to cause the head unit to adsorb a component and to pass the component recognition unit in which the imaging means is disposed, and when the head unit passes through the component recognition unit. An image pickup control means for controlling the image pickup means to pick up the picked-up suction component, and a two-dimensional recognition based on an image picked up by one image pickup means and a three-dimensional recognition based on an image picked up by a plurality of image pickup means are picked up. A component recognition apparatus for a surface mounter, comprising component recognition means for selecting and recognizing according to the type of component, the 2D recognition unit for two-dimensional recognition And the 2D recognition component and 3D recognition components are mixed adsorbed to the head unit by including the 3D recognition component to recognize the said three-dimensional to the suction part, and the state focused on the 3D recognition component The apparatus further includes control means for controlling the driving means and the imaging control means so that the 2D and 3D recognition components are imaged by one and a plurality of imaging means.

  Further, in this case, the plurality of imaging means include a first imaging means that faces the surface opposite to the suction surface of the suction component, and a second imaging means that images from a different direction. Preferred (claim 4).

  Furthermore, it is preferable that the imaging unit is a line sensor in which a plurality of imaging elements are arranged in the main scanning direction, and the driving unit passes the head unit in a direction perpendicular to the main scanning direction with respect to the line sensor ( Claim 5).

  Further, the control unit may be configured to execute only control for mixing and adsorbing both recognition components of 2D and 3D recognition components to the head unit, but only the 2D recognition component is applied to the head unit. A 2D recognition mode in which the 2D recognition component is focused, and a 3D recognition mode in which only the 3D recognition component is attracted to the head unit, and the 3D recognition component is focused on the head unit. It is preferable that 2D and 3D recognition components are mixedly adsorbed and switched to a mixed recognition mode for focusing on the 3D recognition components.

In this case, it is preferable that the control means causes the one imaging means to image the 2D recognition component in the 2D recognition mode.

  Further, the surface mounting machine of the present invention is a surface mounting machine in which an electronic component is sucked and mounted at a predetermined position on a substrate by a movable head unit having a plurality of mounting heads. The component recognition apparatus according to any one of the above, a component supply unit that supplies a 3D recognition component, and a component supply unit that supplies a 2D recognition component (Claim 8).

  According to the invention concerning Claim 1 and Claim 3, components can be mounted efficiently, maintaining the mounting precision which satisfy | fills a request | requirement.

  That is, two-dimensional recognition of a component used for calculation of a correction amount related to the mounting position does not require a high-resolution image, and if there is an image from one direction that can determine the orientation of the component, accurate calculation, etc. It was found that this is possible. On the other hand, when components are recognized three-dimensionally, a high-resolution image is required for each image before combining in order to combine a plurality of images.

Therefore, if 2D and 3D recognition components are mixedly adsorbed to the head unit as described above, and 2D and 3D recognition components are imaged by one and a plurality of imaging means in a state where the 3D recognition component is focused, 2D and 3D recognition is performed. An image satisfying the requirements for component recognition can be acquired for the component, and 2D and 3D recognition components are mixedly adsorbed to the head unit. For example, a corner of a 3D recognition component such as a QFP (Quad Flat Package) A 2D recognition component such as a chip resistor can be transported from the component supply unit to the printed circuit board all at once, and a series of time for mounting can be shortened.

  According to the second and fourth aspects of the invention, the outer edge of the 2D recognition component whose image resolution is slightly inferior to that of the 3D recognition component can be determined relatively clearly because the image is not focused. This makes it possible to recognize parts for more accurate 2D recognition parts.

  According to the fifth aspect of the present invention, the image can be captured while moving the head unit in a direction orthogonal to the main scanning direction of the line sensor, so that the mounting can be performed more quickly. Further improvement.

  According to the sixth aspect of the present invention, it is possible to cope with the situation by switching each recognition mode, and it is possible to perform more accurate component recognition adapted to each recognition mode while maintaining the mounting efficiency at a high level.

According to the seventh aspect of the present invention, it is possible to change the moving path of the head unit, and the components are mounted in a shorter time by omitting the path for imaging by the remaining imaging means among the plurality of imaging means. be able to.

  According to the surface mounter of the invention according to claim 8, the component recognition apparatus as described above, a component supply unit that supplies the 3D recognition component, and a component supply unit that supplies the 2D recognition component are provided. Thus, the 3D recognition component and the 2D recognition component can be mounted at a time with a head unit having a plurality of mounting heads, and the component mounting efficiency can be greatly increased.

  Embodiments of the present invention will be described with reference to the drawings.

  1 and 2 schematically show a surface mounter to which a component recognition apparatus according to the present invention is applied. In these drawings, the X axis, the Y axis, and the Z axis are shown to clarify the direction.

  As shown in the figure, on the base 1 of the mounting machine, a printed circuit board conveying conveyor 2 is arranged in the X-axis direction, and the printed circuit board 3 is conveyed on the conveyor 2 at a predetermined mounting work position. It is supposed to be stopped. Component supply units 4A and 4B are arranged on both sides of the conveyor 2, respectively. Each of the component supply units 4A and 4B includes multiple rows of tape feeders. Each tape feeder is configured such that small chip components such as ICs, transistors, capacitors, etc. are stored at predetermined intervals, and the held tape is led out from the reel. It is configured to intermittently feed out parts as it is taken out. Each component supply unit 4A, 4B is composed of unit supply units 4A-1, 4A-2 and 4B-1, 4B-2 divided in the X-axis direction, and each unit supply unit 4A-1, 4A-. Tape feeders are disposed at 2, 4B-1 and 4B-2, respectively.

  In the mounting machine of the present embodiment, a component supply device 50 is installed on the side of the base 1 (side of the conveying direction of the conveyor 2) separately from these component supply units 4A and 4B. The component supply device 50 is disposed in the main body and includes a tray storage portion 51 that stores a plurality of trays on which a large number of components are placed, and a component take-out portion 52 that is disposed on the side of the tray storage portion 51. A rail 53 extending between the unit supply unit 4A-1 and the conveyor 2 from the side of the component extraction unit 52 and a pair of shuttles 54 reciprocating along the rail 53 are provided. Then, the tray is pulled out from the tray storage unit 51 by a tray pulling device (not shown) and set in the component picking unit 52, and the components of the tray set in the component picking unit 52 are transferred to the shuttle 54 by a component transfer device (not shown). The component is carried by the shuttle 54 to a predetermined position near the component supply unit 4A.

  These component supply units 4A and 4B and the component supply device 50 are configured to supply a plurality of types of components. This component includes a component having a simple shape such as a square chip resistor that can be recognized only by a two-dimensional image captured by the imaging unit 21 described later (2D recognition component), and leads around the QFP and the like. And a component that needs to be recognized by a three-dimensional image captured and synthesized by a plurality of imaging units 21 and 22 described later (3D recognition component). In particular, in this embodiment, 2D recognition components are mainly mounted on the unit supply units 4A and 4B, and 3D recognition components are mainly mounted on the component supply device 50. And components are taken out from each component supply part 4A, 4B and the shuttle 54, and are mounted in a printed circuit board.

  On the other hand, a head unit 5 for mounting components is provided above the base 1. The head unit 5 is movable over the component supply units 4A and 4B and the shuttle 54 moved to the base 1 side and the component mounting unit on which the printed circuit board 3 is located. In this embodiment, the head unit 5 is movable in the X-axis direction and the Y-axis. It can move in the direction (direction perpendicular to the X axis on the horizontal plane).

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servomotor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. And a nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 5 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 5 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 5 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The Y-axis servo motor 9 and the X-axis servo motor 15 are respectively provided with rotary encoders 10 and 16 so that the moving position of the head unit 5 can be detected.

  As shown in FIG. 2, the head unit 5 is provided with a mounting head 20 having a component suction nozzle 20a at its tip, and in this embodiment, eight mounting heads 20 are provided side by side in the X-axis direction. It has been. Each mounting head 20 can be moved up and down and rotated around the central axis of the nozzle with respect to the frame of the head unit 5, and is driven by a lift drive mechanism or a rotation drive mechanism. The lifting drive mechanism includes an entire lifting servo motor 17 that moves the mounting heads 20 up and down simultaneously, and a predetermined number (eight) of air cylinders (not shown) that individually lift and lower the mounting heads 20 by a fixed stroke. ) And using them together, the mounting heads 20 are moved up and down between a predetermined raised position and a lowered position. Therefore, in the head unit 5, the height of the mounting head 20 cannot be finely adjusted individually, and the air cylinder is operated while adjusting the height adjustment by the entire lifting / lowering servomotor 17, and each mounting unit 20 is mounted. Components are attracted to the head 20, or components are mounted for each mounting head. The rotation drive mechanism is composed of one rotation servo motor 19a and a transmission mechanism that transmits the rotation of the servo motor 19a to each head. The overall lift servomotor 17 and each rotation servomotor 19a are provided with rotary encoders 18 and 19b, respectively, so that the position of the mounting head 20 can be detected.

  In addition, on both sides of the conveyor 2, component recognition units that are regions for recognizing components sucked by the mounting heads 20 of the head unit 5 before mounting on the printed circuit board 3 are provided. Are provided with imaging units 21 and 22 for imaging the components. Specifically, the first imaging unit 21 and the second imaging unit 22 are arranged on one side (the lower side in FIG. 1) of the conveyor 2, and only the first imaging unit 21 is arranged on the other side (the upper side in FIG. 1). Is arranged. Here, the description will focus on the image pickup units 21 and 22 arranged on the lower side of FIG. 1, but the first image pickup unit 21 arranged on the upper side of FIG. 1 is also arranged on the lower side. It is configured in the same way. In addition, you may comprise so that the 1st and 2nd imaging units 21 and 22 may be arrange | positioned at the both sides of the conveyor 2, respectively.

  As shown in the figure, the imaging units 21 and 22 are provided close to the X-axis direction and slightly offset in the Y-axis direction. Specifically, as shown in FIG. 1, the first imaging unit 21 is arranged in a state of being slightly protruded to the conveyor 2 side between the unit supply units 4A-1 and 4A-2 constituting the component supply unit 4A. The second imaging unit 22 is disposed between the unit supply unit 4A-2 on one side and the conveyor 2 so as to be adjacent to the first imaging unit 21.

  As shown in FIG. 2, the imaging units 21 and 22 each include a camera 23 that images a component (suction component) sucked by the mounting head 20 and a lighting device 24 that provides illumination for component imaging. Yes.

  Each camera 23 is a camera provided with a line sensor (linear sensor) in which a plurality of imaging elements are arranged in the Y-axis direction, and is orthogonal to the arrangement direction (main scanning direction; Y-axis direction) of each line sensor element ( By moving the head unit 5 in the sub-scanning direction (X-axis direction), the images in the main scanning direction of the components sucked by the mounting heads 20 by the cameras 23 are sequentially taken in the sub-scanning direction. .

Each camera 23 of the imaging units 21 and 22 is provided so as to image the suction component from different directions. More specifically, as shown in FIG. 3, the camera 23 of the first image pickup unit 21 (first image pickup means) is arranged so that the upper surface faces the lower surface of the suction component sucked by the nozzle 20a. The suction component is arranged upward in the Z-axis direction so as to capture an image from directly below. On the other hand, the camera 2 3 of the second imaging unit 22 (second imaging means) is upwardly arranged in an inclined state for example 40 ° relative to the Z-axis so as to image the adsorbed component from the oblique direction.

  The illuminating device 24 includes an LED lamp as a light source. Although not shown in detail, for example, the illuminating device 24 includes a large number of LED lamps on the inner surface of a dome-shaped frame having a space for image incidence.

  FIG. 4 is a block diagram showing the control system of the mounting machine. This mounting machine includes a known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU in advance, a RAM that temporarily stores various data during operation of the apparatus, and the like. 30.

  The control device 30 includes a main control unit 31, a storage unit 32, an illumination control unit 33, a camera control unit 34 (imaging control means), an image processing unit 35, and an axis control unit 36 as functional configurations.

  The main control unit 31 controls the operation of the mounting machine in an integrated manner, and controls the drive of the servo motors 9 and 15 and the like via the axis control unit 36 so as to operate the head unit 5 and the like according to a program stored in advance. To do. Further, based on the component images picked up by the image pickup units 21 and 22, the component adsorption displacement amount (correction value related to the mounting position) by the mounting head 20 is calculated, and the quality of the component is determined. In particular, when parts are picked up by the image pickup units 21 and 22, the parts are recognized in one of the 2D recognition mode, the 3D recognition mode, and the mixed recognition mode depending on the kind of the parts attracted to the head unit 5 in one step. A control signal is output to the illumination control unit 33 and the camera control unit 34 to be executed.

  Here, the 2D recognition mode is a mode that is implemented when the mounting component conveyed in one step by the head unit 5 is only a simple shape component (2D recognition component) such as a rectangular chip component. 5 picks up only the 2D recognition component and picks up an image in a state where the camera 23 of the first image pickup unit 21 is focused on the lower surface (the surface opposite to the suction surface) of the 2D recognition component. This is a mode for recognizing a part based only on (this recognition is referred to as two-dimensional recognition). On the other hand, the 3D recognition mode is a mode that is implemented when the suction component transported in one step by the head unit 5 is only a component having a complicated shape (3D recognition component) such as a leaded component having a lead around it. Thus, only the 3D recognition component is picked up by the head unit 5 and picked up with the camera 23 of both the imaging units 21 and 22 in focus on the lower surface (the surface opposite to the suction surface) of the 3D recognition component. This is a mode for recognizing a part based on three-dimensional image data obtained by synthesizing the image data (this recognition is referred to as three-dimensional recognition). Furthermore, the mixed recognition mode is a mode that is performed when the mounted component conveyed in one step by the head unit 5 includes not only the 2D recognition component but also the 3D recognition component, and the head unit 5 has 2D and 3D. The recognition components are mixed and picked up, and the image is picked up with the camera 23 of both the imaging units 21 and 22 in focus on the lower surface (the surface opposite to the suction surface) of the 3D recognition component. In this mode, two-dimensional recognition and three-dimensional recognition are selected for each suction component in accordance with the type of the component.

  The main control unit 31 controls the drive of the servo motor 17 for raising and lowering the whole through the axis control unit 36 in order to focus the camera 23 in accordance with each recognition mode.

  Further, in the main control unit 31, when the 2D recognition mode is selected when the moving path of the head unit 5 to which the component is sucked is set differently according to the recognition mode, the head unit 5 is set to pass above the first imaging unit 21, while the 3D recognition mode or the mixed recognition mode is selected, the head unit 5 is added to the first imaging unit 21 and the second It is set so as to pass also above the imaging unit 22. Then, a control signal is output to the illumination control unit 33, the camera control unit 34, and the axis control unit 36 so that the picked-up component is imaged when the head unit 5 passes through the component recognition unit in which the imaging units 21 and 22 are arranged. .

  The storage unit 32 stores data relating to the relationship between the type of mounted component and the component recognition mode corresponding to the type, the imaging conditions of each component recognition mode, various image information obtained by the imaging, and the like.

  The illumination control unit 33 and the camera control unit 34 control the driving of the illumination device 24 and the camera 23 of the imaging units 21 and 22, respectively.

  The image processing unit 35 performs predetermined processing on the image signals output from the cameras 23 of the imaging units 21 and 22 to generate image data suitable for component recognition, and outputs the image data to the main control unit 31. .

  As for the configuration of the control device 30, the driving means of the present invention is constituted by the servo motors 15, 9, 17, 19a and the encoders 16, 10, 18, 19b, etc., and the illumination control unit 33, camera control unit. 34 is an imaging control unit, the main control unit 31 and the image processing unit 35 and the like constitute a component recognition unit of the present invention, and the main control unit 31 and the axis control unit 36 constitute a control unit of the present invention. .

  Next, a component mounting operation based on the control of the control device 30 will be described based on the flowchart of FIG.

  When the mounting operation is started, first, mounting components to be mounted on the printed circuit board 3 are allocated to a group that is transported by the head unit 5 in one step, and each group is attracted to each mounting head 20 in the head unit 5. A power part is assigned (step S1). This grouping is set so that two types of 3D recognition components having different heights are not included in one group.

  Then, according to this assignment, the head unit 5 moves to the component supply units 4A and 4B or the shuttle 54 on which the components to be sucked are mounted, and the components are sucked by the mounting heads 20 as shown in FIG. S2). FIG. 6 shows an example of the suction state of the head unit 5 in the mixed recognition mode. In this example, when the mounting head 20 at the right end is changed to the first, second, and third mounting heads 20 and the like, The 3D recognition component B2 is adsorbed to the first mounting head 20, and the 2D recognition component B1 is adsorbed to the third to eighth mounting heads 20.

  When the suction of this part is completed, it is determined which recognition mode is selected (steps S3 and S4), and if it is neither the 2D recognition mode nor the 3D recognition mode, it is determined that the mixed recognition mode is selected. Then, the X-axis and Y-axis servomotors 15 and 9 are driven to move the head unit 5 along the first path that passes above the first imaging unit 21 and the second imaging unit 22 (steps). S5). As shown in FIG. 7, this first path goes from the downstream side in the conveyance direction of the conveyor 2 to the upstream side (arrow Y1), passes through the upper side of the first imaging unit 21, and then goes to the inside (the conveyor 2 side) ( The path is such that the arrow Y2) moves from the upstream side in the transport direction of the conveyor 2 over the second imaging unit 22 (arrow Y3) to the mounting position (arrow Y4).

  Further, after the determination of the recognition mode and before imaging of the first imaging unit 21 described later, the entire lifting servo motor 17 is driven, and the lower surface of the 3D recognition component B2 adsorbed on the head unit 5 is used as a reference. The head unit 5 is moved to a height at which the imaging units 21 and 22 are in focus. That is, as shown in FIG. 6, the focal point P is focused on the lower surface of the 3D recognition component B2, and the focal point P is not focused on the 2D recognition component B1.

  Further, in this movement process, the head unit 5 moves relative to the first imaging unit 21, whereby the 2D and 3D recognition components B 1 and B 2 are imaged by the first imaging unit 21 on each mounting head 20. In step S6, a two-dimensional image (first image) obtained by imaging the suction components B1 and B2 from directly below is acquired. At this time, the suction unit is assigned so that the head unit 5 sucks the last part by the lower part supply unit 4A or the shuttle 54 in FIG. 1, and the head unit 5 sucks the last part. The drive is controlled so as to move relative to the first imaging unit 21 on the component supply unit 4A side.

  When the suction parts B1 and B2 are imaged by the first imaging unit 21, the 3D recognition part B2 among the suction parts is a coordinate for image synthesis (for example, the leading end portion of the lead) to be described later based on the first image. Is detected, and image processing is performed using an algorithm for obtaining a three-dimensional image based on the coordinates, and the data is stored in the storage unit 32 (step S7).

  In step S7, data based on the first image is also stored in the storage unit 32 for the 2D recognition component. As this data, for example, data on the center position calculated from a predetermined portion of the component detected based on the first image can be mentioned. In the mixed recognition mode, as described above, the 2D recognition component is not focused, and a two-dimensional image in a slightly defocused state is obtained. However, the simple shape 2D recognition component is slightly defocused. It has been found that sufficiently accurate recognition is performed even with a two-dimensional image in a state, and the acquisition of the data is performed based on this knowledge.

  Next, the process proceeds to step S8, and only the 3D recognition component is imaged by the second imaging unit 22. Specifically, after the head unit 5 moves in the Y-axis direction so as to correspond to the second imaging unit 22, the head unit 5 moves in a direction opposite to the moving direction at the time of imaging by the first imaging unit 21. When passing over the second imaging unit 22 (see Y3 in FIG. 7), only the 3D recognition component B2 is imaged by the second imaging unit 22 (step S8). As a result, an image (second image) obtained by capturing the 3D recognition component B2 sucked by the head unit 5 from the obliquely lower side is acquired. At this time, the head unit 5 is driven and controlled so as to move relative to the second imaging unit 22 adjacent to the first imaging unit 21 that has captured the first image.

  Then, coordinates for image synthesis are detected based on the second image, and image processing is performed by an algorithm for obtaining a three-dimensional image based on the coordinates, and the data is stored in the storage unit 32 ( Step S9). Here, the coordinates detected based on the second image are detected corresponding to the coordinates detected in the first image. Therefore, in the above example, the tip portion of the lead is detected.

  When the image processing based on the first and second images is completed, the first and second images are synthesized based on the data obtained by these image processing, and a third image that is a three-dimensional image is acquired (step S10).

  Then, the process proceeds to step S11, and when it is determined in this step S11 that the suction component is not a defective product such as a bent lead, the suction position shift, that is, the center of the nozzle, is determined based on the component recognition for the 2D and 3D recognition components. The suction displacement in the X-axis and Y-axis directions at the center of the component and the suction displacement of the component around the nozzle center are checked, and a component correction amount corresponding to the displacement is calculated (step S12). Thereafter, the head unit 5 moves onto the printed circuit board 3, and the components sucked by the respective mounting heads 20 are sequentially mounted on the printed circuit board 3 at predetermined positions (mounting positions taking corrections into account) ( Step S13). In addition, the component determined to be a defective component in step S11 is held by the mounting head 20 as it is and is discharged onto the disposal tray (step S14). This is the end of this flowchart.

  On the other hand, if it is determined in step S3 that the 2D recognition mode is selected, the X-axis and Y-axis servomotors 15 and 9 are driven, and as shown in FIG. The head unit 5 is moved along the second path that passes above (step S15). Unlike the first path, the second path does not pass over the second imaging unit 22 but instead passes through the first imaging unit 21 and then moves directly to the mounting position on the printed circuit board 3. (Arrows Y1, Y2). Therefore, the travel distance of the second route is shorter than that of the first route.

  Further, after the determination of the recognition mode and before imaging of the first imaging unit 21 to be described later, the entire lifting servo motor 17 is driven, and the lower surface of the 2D recognition component adsorbed on the head unit 5 is used as a reference. The head unit 5 is moved to a height at which the imaging units 21 and 22 are in focus.

  Then, in this movement process, the head unit 5 moves relative to the first imaging unit 21, whereby the 2D recognition component sucked by each mounting head 20 is imaged by the first imaging unit 21 ( In step S16), a 2D image (first image) obtained by imaging the 2D recognition component adsorbed by the head unit 5 from directly below is acquired, and the process proceeds to step S11. At this time, the head unit 5 is drive-controlled so as to move relative to the nearest first imaging unit 21 of the component supply unit 4A (or 4B) that sucks the last component, and thereby the first imaging unit. The imaging processing of each suction component by 21 is performed promptly.

  Returning to step S4, if it is determined that the 3D recognition mode is selected, the X-axis and Y-axis servomotors 15, 9 and the like are driven, and along the first path as in the mixed recognition mode. The head unit 5 is moved (step S17).

  Further, after the determination of the recognition mode and before imaging of the first imaging unit 21 to be described later, the entire lifting servo motor 17 is driven and the lower surface of the 3D recognition component adsorbed on the head unit 5 is used as a reference. The head unit 5 is moved to a height at which the imaging units 21 and 22 are in focus.

  Since steps S18 to S22 are the same as steps S6 to S10, the description thereof is omitted here. However, in this 3D recognition mode, a three-dimensional image is acquired for all the parts attracted to the head unit 5, and a pass / fail judgment is executed for all the parts based on the three-dimensional image (step S11).

  Here, the operation of the head unit 5 (suction component) in each recognition mode is summarized as follows. For example, when the last component is adsorbed in the component supply unit 4A (unit supply unit 4A-1), in the mixed recognition mode or the 3D recognition mode, first, as shown in FIG. The head unit 5 moves from the upstream side toward the downstream side in the transport direction of the printed circuit board 3 with respect to the first imaging unit 21 (arrow Y1 in the figure), and the second imaging unit 22 side adjacent to the first imaging unit 21 After moving the head unit 5 (arrow Y2 in the figure), the head unit 5 is moved in the direction opposite to the time when the first image pickup unit 21 is picking up (arrow Y3 in the figure) and then moved to the mounting position (same as the figure). Arrow Y4 in the figure). On the other hand, in the 2D recognition mode, as shown in FIG. 8, first, with respect to the first imaging unit 21 adjacent to the component supply unit 4A, the head is directed from the upstream side toward the downstream side in the transport direction of the printed board 3. After the unit 5 has moved (arrow Y1 in the figure), it moves substantially linearly toward the mounting position (arrow Y2 in the figure).

  According to the component recognition method and the mounting apparatus to which the apparatus according to the present invention is applied, the following effects can be obtained.

  In this mounting machine, the head unit 5 sucks components from the component supply unit 4A and the like, and transports them to the printed circuit board 3 for mounting. However, when the mixed recognition mode is adopted, the head unit 5 Since the recognition component and the three-dimensional recognition component are set to be adsorbed together, it is not necessary to reciprocate the head unit 5 between the component supply unit 4A or the like and the printed circuit board 3 for each type of adsorption component. Regardless of the type of component, the component can be transported all at once within a range that can be attracted to the head unit 5. Thereby, a series of time for mounting a plurality of types of components can be shortened.

By the way, when the 2D and 3D recognition components are mixedly adsorbed to the head unit 5 as in the present embodiment, there is a problem in which component the focusing of the imaging units 21 and 22 is focused. The first and second imaging units 21 and 22 are focused on the lower surface of the recognition component, and a three-dimensional image is acquired only for the 3D recognition component. An image can be acquired, and three-dimensional recognition such as pass / fail of an appropriate part can be performed based on the image.

  On the other hand, in the mixed recognition mode, since the 3D recognition component is focused, the two-dimensional image of the 2D recognition component imaged by the first imaging unit 21 is compared with the two-dimensional image captured of the 3D recognition component. However, there is an effect that it is possible to accurately perform the component recognition such as the displacement of the suction position even based on the two-dimensional image in the slightly blurred state.

  In other words, according to this mounting machine, the number of types of components transported in one step by the head unit 5 is increased while maintaining the mounting accuracy that satisfies the requirements by suppressing deterioration in accuracy in component recognition. Can be implemented efficiently.

In particular, in the present embodiment, a line sensor is used for each of the image pickup units 21 and 22, and the first image pickup unit 21 is disposed directly below the suction component, so that the image can be taken while moving the head unit 5. Moreover, the outer edge of the 2D recognition component can be determined as accurately as possible even when the two-dimensional image acquired by the first imaging unit 21 disposed directly below is slightly out of focus.

  In addition, since the recognition mode can be switched as appropriate according to the component to be mounted in the main control unit 31, it is possible to cope with the situation, and more suitable for each recognition mode while maintaining the mounting efficiency at a high level. Accurate component recognition is possible. In the 2D recognition mode, the movement amount of the head unit 5 can be reduced compared to the first route by changing the movement route, and components can be mounted in a shorter time.

  The mounting machine described above is an embodiment of a mounting machine to which the component recognition apparatus (method) according to the present invention is applied. The specific configuration of the component recognition apparatus (method) and the mounting machine is as follows. Modifications can be made as appropriate without departing from the scope of the present invention, and modifications will be described below.

  (1) In the above embodiment, a component with a lead is exemplified exclusively as a 3D recognition component, but for example, a component having a ball terminal such as a BGA (Ball Grid Array package) on the lower surface is mounted. Also good.

  In this case, the illumination device 24 of the first imaging unit 21 is multi-illumination. That is, the illuminating device 24 mainly provides illumination from the camera 23 side (normal illumination) to the component adsorbed by the mounting head 20 and mainly provides illumination from the side of the adsorption component ( Can be switched to the horizontal lighting), and is controlled to be switched by the main control unit 31 via the illumination control unit 33, and the state of the ball terminal can be determined from the two-dimensional image and the three-dimensional image. It is like that.

  (2) In the mounting machine of the above embodiment, a plurality of types of components including components having different heights can be adsorbed and transported all at once by the head unit 5 as 2D recognition components. On the other hand, as for the 3D recognition component, the same type of component or different types of components having substantially the same height can be adsorbed and transported all at once.

  (3) The number, arrangement, imaging angle, and the like of the imaging units are not limited to those shown in the embodiment, and may be set as appropriate so that the mounted components can be recognized more accurately.

It is a top view which shows an example of the surface mounting machine with which the components recognition apparatus (method) which concerns on this invention is applied. It is a front view which shows the said surface mounting machine. It is a schematic diagram which shows the arrangement | positioning relationship of each camera of a 1st and 2nd imaging unit. It is a block block diagram which shows the control system (part which mainly manages component recognition operation | movement) of a surface mounter. It is a flowchart explaining the operation control of mounting by the said control system. It is a schematic diagram which shows a head unit in the state which adsorb | sucked 2D and 3D recognition components. It is a schematic diagram which shows the movement path | route (1st path | route) of a head unit. It is a schematic diagram which shows the movement path | route (2nd path | route) of a head unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 3 Printed circuit board 5 Head unit 9 Y-axis servomotor 10 Rotary encoder 15 X-axis servomotor 16 Rotary encoder 17 Whole lift servomotor 18 Rotary encoder 19a Rotation servomotor 19b Rotary encoder 20 Mounting head 21 First imaging Unit 22 Second imaging unit 23 Camera 30 Controller 31 Main controller 34 Camera controller 35 Image processor 36 Axis controller B1 2D recognition component B2 3D recognition component P Focus

Claims (8)

A plurality of image pickup means for picking up the picked-up components picked up by the head unit from different directions are arranged in the component recognition section, and when the head unit passes through the component recognition section, the pick-up parts are picked up by the image pickup means, At this time, a component recognition method for selecting two-dimensional recognition based on an image captured by one imaging unit and three-dimensional recognition based on an image captured by a plurality of imaging units according to the type of suction component,
A plurality of sucking parts are picked up by a plurality of mounting heads provided in the head unit, and the 2D recognition parts for the two-dimensional recognition and the 3D recognition parts for the three-dimensional recognition are included in the suction parts. Thus, the 2D recognition component and the 3D recognition component are mixedly adsorbed to the head unit, and the 2D and 3D recognition components are imaged by the one and the plurality of imaging means in a state of being focused on the 3D recognition component. A feature recognition method. The component recognition method according to claim 1,
Component recognition using the first imaging means facing the surface opposite to the suction surface of the suction component and the second imaging means for imaging from a different direction as the plurality of imaging means Method. A head unit having a plurality of mounting heads that can adsorb components in parallel, a plurality of imaging means for imaging the adsorption components adsorbed thereto from different directions, and the imaging means that adsorbs the components to the head unit. Driving means for moving the head unit to pass through the arranged part recognition unit, and controlling the imaging unit to take an image of the suction part sucked by the head unit when the head unit passes through the part recognition unit An imaging control unit, and a component recognition unit that selects and recognizes two-dimensional recognition based on an image captured by one imaging unit and three-dimensional recognition based on an image captured by a plurality of imaging units according to the type of the suction component A component recognition device for a surface mounter equipped with
The 2D recognition component to be two-dimensionally recognized and the 3D recognition component to be three-dimensionally recognized are included in the suction component so that the 2D recognition component and the 3D recognition component are mixedly sucked to the head unit, and the 3D recognition component A component recognition apparatus further comprising control means for controlling the drive means and the imaging control means so that the one and the plurality of imaging means pick up an image of the 2D and 3D recognition parts in a focused state. In the component recognition apparatus according to claim 3,
The plurality of image pickup means includes a first image pickup means that faces the surface opposite to the suction surface of the suction part, and a second image pickup means that picks up an image from a different direction. apparatus. In the component recognition apparatus according to claim 3 or 4,
The imaging unit is a line sensor in which a plurality of imaging elements are arranged in the main scanning direction, and the driving unit passes the head unit in a direction perpendicular to the main scanning direction with respect to the line sensor. Recognition device. The component recognition apparatus according to any one of claims 3 to 5,
The control means attracts only the 2D recognition component to the head unit, focuses the 2D recognition component on the 2D recognition mode, and attracts only the 3D recognition component to the head unit. A component that is configured to be switchable between a 3D recognition mode that focuses on the 3D recognition mode, and a mixed recognition mode in which 2D and 3D recognition components are mixedly adsorbed to the head unit and focused on the 3D recognition component. Recognition device. The component device according to claim 6,
The component recognition apparatus characterized in that the control means causes the one image pickup means to image a 2D recognition component in the 2D recognition mode.   8. The component recognition according to claim 3, wherein the electronic component is picked up by a movable head unit having a plurality of mounting heads and mounted at a predetermined position on the substrate. A surface mounter comprising: an apparatus; a component supply unit that supplies a 3D recognition component; and a component supply unit that supplies a 2D recognition component.

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