JP4308588B2 - Surface mount machine - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface mounter that adsorbs an electronic component such as an IC from a component supply unit by a movable head unit including a mounting head, and transfers the electronic component onto a substrate such as a printed circuit board. It is.
[0002]
[Prior art]
Conventionally, a movable head unit equipped with a mounting head with a suction nozzle at the tip is used to pick up electronic components such as ICs from the component supply unit, transfer them onto the printed circuit board, and mount them at a predetermined position on the printed circuit board. A surface mounter (hereinafter, abbreviated as a mounter) is known.
[0003]
In this type of mounting machine, in order to prevent the mounting of defective parts, mounting misalignment, mounting errors (not mounted), etc., it was installed on the base after mounting the components and prior to mounting on the printed circuit board. In general, it is common practice to pick up a picked-up component using an image pickup means such as a CCD area sensor and recognize the image of the picked-up state of the component, etc. In order to improve the recognition accuracy at this time, for example, a mark is provided on the head unit. Then, by picking up the mark and the picked-up component within the same angle of view, the position of the nozzle center is accurately obtained using the position of the mark on the image as a clue to recognize the picked-up state of the component ( For example, Patent Document 1).
[0004]
[Patent Document 1]
Japanese Patent Publication No.8-31715
[0005]
[Problems to be solved by the invention]
In a mounting machine that recognizes an image of a suction component, the illumination device irradiates the suction component with illumination light provided on the base side (the side where the imaging device is disposed), and the reflected light reflected by the suction component is received by the imaging device. In general, when picking up the suction component and the mark within the same angle of view as in the above publication, the mark is usually provided in the vicinity of the mounting head and the common illumination is used. The suction part and the mark are imaged under.
[0006]
However, in recent years, in order to more accurately recognize the mounted components, the illumination direction and illuminance are switched according to the size and shape of the suction component. In the case of simultaneous imaging, as a result of switching the illumination direction and illuminance depending on the part, the image state of the mark is deteriorated depending on the illumination direction and the like, which has a detrimental effect on the part recognition. Therefore, it is desired to improve this point.
[0007]
The present invention has been made to solve the above-described problem, and an object thereof is to make it possible to more accurately recognize the suction state of a component.
[0008]
[Means for Solving the Problems]
  In order to solve the above problems, the present inventionArticleA head unit capable of moving between the supply unit and the substrate;A mounting head supported by the head unit so as to be movable up and down, and a component illumination means for providing component imaging illumination, and are arranged at a predetermined imaging height positionAccording to the mounting headadsorptionPartGoodsImaging means for imaging;A mark provided on the head unit so as to be located within the depth of field of the imaging means,Prior to component mounting,The suction part and the markBy the imaging meansSameIn surface mounters that sometimes pick up images and recognize the adsorption state of components,The imaging means images the suction component by irradiating the suction component with illumination light and receiving the reflected light, and irradiates the suction component with illumination light from different directions as the component illumination unit. And having a plurality of lighting devicesMark illuminating means for providing transmission illumination to the mark from the opposite side of the imaging means with the mark as a boundary;The mark illumination means and a control means for controlling the illumination state of each of the illumination devices are further provided, and the control means is based on illumination conditions predetermined for each component when the image of the suction component is recognized. Control each of the lighting devices and control the mark illumination means to provide transmitted illumination to the mark.Is.
[0009]
  According to this configuration, the mark stands out by so-called backlight illumination, and the mark can be imaged clearly without being affected by the component imaging illumination. Therefore, even when the illumination conditions for component imaging illumination are changed according to the type of suction component, it is possible to always capture both the suction component and the mark clearly, and as a result, the suction state of the component can be more accurately determined. Be able to recognize.
  In this configuration, it is preferable that the control means changes an illuminance of the mark illumination means in accordance with the illumination condition for each component.
[0012]
In the configuration as described above, it is possible to improve the recognition accuracy by providing a plurality of marks on the head unit, recognizing the images of the plurality of marks, and recognizing the suction state of the component from their relative positional relationship. In this case, it is more preferable to provide a mark illumination means for each mark. That is, it is possible to provide a common mark illuminating means in which the light source is made common to all the marks or some of the plurality of marks, but in this case, the sharpness between the marks due to the difference in distance from the light source. It is possible that there will be a difference. On the other hand, according to the configuration in which the mark illumination means is individually provided for each mark as described above, it is possible to image each mark with uniform definition.
[0013]
Note that in a mounting machine in which a plurality of mounting heads are mounted on the head unit, it is preferable to provide a mark at a close position with respect to each mounting head.
[0014]
  In addition, when providing a mark illumination means for each mark,The control means isLighting control for each mark illumination means based on individual illumination conditionsStuffMore preferably.
[0015]
According to this configuration, for example, by controlling lighting of each mark based on different illumination conditions according to the illumination conditions (illumination direction, illuminance, etc.) of the component imaging illumination, the marks can be displayed in a more optimal state (clear state). Imaging can be performed.
[0016]
In this case, the control means can be configured to turn off the mark illuminating means other than the mark illuminating means of the mark to be imaged when the picked-up component is imaged by the imaging means.
[0017]
According to this configuration, it is possible to reduce the influence on the component recognition by marks other than the mark optimal for component recognition (the mark to be imaged). For example, when a plurality of marks fall within the same angle of view of the image pickup means and an unnecessary mark is located near the outer edge of the suction component, the mark illumination means for this mark is turned off By picking up an image of the part, it is possible to prevent a situation in which the mark is clearly picked up and affects the outline recognition of the picked-up part.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings.
[0019]
1 and 2 schematically show a surface mounter according to the present invention. In the figure, the X axis, the Y axis, and the Z axis are shown to clarify the direction.
[0020]
As shown in the figure, on a base 1 of a surface mounter (hereinafter abbreviated as a mounter), a conveyer 2 for conveying a printed circuit board is arranged in the X-axis direction, and the printed circuit board 3 is placed on the conveyor 2. It is transported and stopped at a predetermined mounting work position.
[0021]
A component supply unit 4 is disposed on the side of the conveyor 2. The component supply unit 4 is provided with a component supply feeder. For example, a plurality of tape feeders 4a are installed in parallel in the X-axis direction.
[0022]
Each tape feeder 4a accommodates small pieces of IC, transistors, capacitors, etc. at predetermined intervals, leads out the held tape from the reel, and intermittently removes the tape as the head unit 5 removes the parts. It is configured to pay out automatically.
[0023]
Above the base 1, a head unit 5 for mounting components is further provided. The head unit 5 is movable over the component supply unit 4 and the mounting work position where the printed circuit board 3 is located, and can move in the X-axis direction and the Y-axis direction.
[0024]
That is, on the base 1, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 provided in parallel to the Y-axis servo motor 9 and driven to rotate are disposed. A head unit support member 11 is disposed on the rail 7, and the ball screw shaft 8 is screwed into a nut portion 12 provided on the support member 11. The support member 11 is provided with a guide member 13 extending in the X-axis direction and a ball screw shaft 14 provided in parallel with the guide member 13 and driven by an X-axis servo motor 15. The head unit 5 is movably held, and the ball screw shaft 14 is screwed into a nut portion (not shown) provided in the head unit 5. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, while the head unit 5 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. The head unit 5 can be moved to an arbitrary position in the XY axis direction.
[0025]
As shown in FIGS. 2 to 4, the head unit 5 is provided with a plurality of mounting heads 20 provided with component suction nozzles (referred to as suction nozzles 20 a) at their tips. In this embodiment, six mounting heads 20 are provided in a state of being arranged in a line in the X-axis direction.
[0026]
These mounting heads 20 can be moved up and down (moved in the Z-axis direction) and rotated around the nozzle center axis with respect to the frame 5a of the head unit 5, and are operated by a lift drive mechanism and a rotation drive mechanism (not shown). It has come to be.
[0027]
A camera 21 for recognizing the printed circuit board 3 is mounted on a side portion of the head unit 5 in the arrangement direction of the mounting heads 20. The camera 21 is a camera provided with a CCD area sensor, for example, and is provided downward to capture a fiducial mark marked on the printed circuit board 3.
[0028]
Further, the head unit 5 is provided with component recognition marks 25 corresponding to the respective mounting heads 20.
[0029]
As shown in FIGS. 3 and 4, these marks 25 are respectively provided on the lower end surface of the mark mounting portion 24 that hangs downward from the head unit 5 on the rear side of the mounting head 20 (right side in FIG. 4). It is provided in a state of being arranged on the side (Y-axis direction side) of the corresponding mounting head 20. Each mark 25 is provided within the depth of field of an imaging unit 17 described later provided on the base 1. Specifically, in this embodiment, as shown in FIG. 4, the height position when the mounting head 20 is set at the rising end position of the lifting stroke is the imaging height position of the suction component by the imaging unit 17. Therefore, as shown in the figure, the mark 25 is at the same height position as the tip of the mounting head 20 (suction nozzle 20a) when set at the rising end position, or at a height position close thereto. Is provided. As a result, the component adsorbed by the mounting head 20 and the mark 25 can be simultaneously imaged by the imaging unit 17 in a focused state.
[0030]
Each mark 25 is provided downward and is configured to be illuminated downward by backlight illumination. More specifically, the mark mounting portion 24 has a light guide hole bent in an L-shape having a width in the X-axis direction that communicates the rear side surface (right side surface in FIG. 4) and the lower end surface of the mark mounting portion 24. 24a is formed. An elongated glass substrate 26 is fitted in the opening portion of the light guide hole 24 a on the lower end surface side of the mark mounting portion 24 in the X-axis direction, and a mark 25 is marked on the lower surface of the glass substrate 26. On the other hand, an LED 27 serving as a light source is fitted in the opening portion of the light guide hole 24a on the rear side surface of the mark mounting portion 24 in a state of being aligned with the mark 25 in the X-axis direction at equal intervals. Since the mirror 28 is installed at the bent portion of the light guide hole 24a, when the LED 27 is turned on, the light is reflected by the mirror 28 and irradiated downward from the upper side of the mark 25. As a result, the mark 25 is Illuminated downwards. That is, in this embodiment, the light guide hole 24a, the glass substrate 26, the LED 27, the mirror 28, and the like constitute the mark illumination means of the present invention.
[0031]
In this embodiment, the mark 25 is marked on the lower surface of the glass substrate 26 by chromium vapor deposition, and a low reflection layer made of an oxide film is further formed on the surface. Thereby, the illumination light by the post-illumination unit 31 of the imaging unit 17 is configured to be difficult to be reflected by the mark 25.
[0032]
In the space between the component supply units 4 and the conveyor 2 on the base 1, the components adsorbed by the mounting heads 20 of the head unit 5 are further recognized prior to mounting on the printed circuit board 3. The imaging unit 17 is disposed.
[0033]
The imaging unit 17 is fixedly disposed on the base 1 and, as shown in FIG. 5, a camera 30 for imaging a component (indicated by reference symbol C) adsorbed by the mounting head 20 and for component imaging. And an illumination unit 31 that provides the illumination.
[0034]
The camera 30 is a camera having a CCD linear sensor (commonly called a line sensor) in which a plurality of image sensors are arranged in a line. The camera 30 is arranged on the base 1 so that the image sensors are arranged in the Y-axis direction. By moving the head unit 5 in a direction (sub-scanning direction; X-axis direction) orthogonal to the direction (main scanning direction), the components adsorbed on each mounting head 20 are imaged from below. ing. The camera 30 is previously focused so that the suction component can be imaged in a state where the mounting head 20 is set at the rising end position.
[0035]
  The illumination unit 31 is provided above the camera 30, and includes a main illumination device 32 a disposed in the upper center of the unit 31, a coaxial illumination device 32 b disposed inside the unit 31, and an upper portion of the unit 31. Thus, there are provided three types of lighting devices, a side lighting device 32c arranged outside the main lighting device 32a.In this embodiment, these illumination devices correspond to the component illumination means of the present invention.
[0036]
As shown in the figure, the main lighting device 32a includes a plurality of LEDs 33 on the inner surface of an inverted dome-shaped frame having an opening in the center. It is comprised so that illumination light may be irradiated in the diagonal direction from the lower side.
[0037]
The coaxial illumination device 32b is disposed below the main illumination device 32a, and includes a plurality of LEDs 34 and a half mirror 35 arranged side by side as a light source. Then, the light from the LED 34 is refracted by 90 ° by the half mirror 35 to irradiate the suction component above the unit 17 with illumination light from directly below.
[0038]
The side illumination device 32c is provided with a plurality of LEDs 36 inward so as to surround the main illumination device 32a. By lighting these LEDs 36, the illumination light from the side of the suction component C above the unit 17 is provided. It is comprised so that it may irradiate.
[0039]
By the way, although not shown in the above-described mounting machine, a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU, and various data temporarily during operation of the apparatus. Control means comprising a RAM and the like for storing is provided, and the servo motors 9 and 15, the camera 21 for recognizing the printed circuit board 3, the imaging unit 17 and the LED 27 for backlight illumination of the mark 25 are all in this control. Electrically connected to the means. In the mounting operation, the servo motor 9 and the like are comprehensively controlled by this control means, so that a series of component mounting operations are executed according to a program stored in advance.
[0040]
Hereinafter, according to the flowchart of FIG. 6, an example of the mounting operation of the mounting machine based on the control of the control means will be described.
[0041]
When the mounting operation is started, first, the head unit 5 moves to the component supply unit 4 and the components are sucked from the tape feeder 4a by each mounting head 20 (steps S1 and S2). The components are sucked in order for each mounting head 20 and simultaneously by a plurality of mounting heads 20 if possible.
[0042]
Then, it is determined whether or not all parts have been sucked (step S3). If it is determined that all parts have been picked up, the process proceeds to step S4. On the other hand, if it is determined that there are other parts to be picked up, the process returns to step S1 and the picking up operation of the parts is continued.
[0043]
In step S4, imaging of the component and the mark 25 that are attracted to each mounting head 20 is performed in order to recognize the attracted state of the component. Specifically, after each component is picked up, each mounting head 20 is set at the rising end position, and then the head unit 5 moves above the imaging unit 17 at a constant speed from one side to the other side in the X-axis direction. To do. As a result of this movement, as shown in FIG. 7, the components (symbol C in FIG. 7) adsorbed to each mounting head 20 of the head unit 5 and the corresponding marks 25 are sequentially imaged by the imaging unit 17 (camera 30). Is done.
[0044]
At the time of component imaging, the illumination state by the illumination unit 31 is individually switched and controlled by the control means according to the type (size, shape, etc.) of the component. That is, in the storage unit in the control device, illumination conditions (illumination direction, illuminance, etc.) optimum for recognition are stored in advance for each type of component, and illumination of each suction component is performed at the time of component imaging in step S4. The conditions are read out, and an illuminating device that matches the conditions for each suction component is selected from the illuminating devices 32a to 32c, and its illuminance and the like are controlled by the control means. As a result, a clear image that is optimal for component recognition is acquired for each suction component.
[0045]
At the time of component imaging in step S4, the LED 27 is controlled to be lit so that backlight illumination is performed for the mark 25 corresponding to the imaging component. As a result, the mark 25 is clearly imaged together with each suction component. That is, since the illumination direction, illuminance, and the like at the time of component imaging are changed for each component as described above, for example, when the mark 25 is imaged only by component illumination by the illumination unit 31, the above-described difference in illumination conditions Thus, depending on the conditions, the mark 25 may not be clearly imaged. On the other hand, when backlight illumination is performed on the mark 25 as described above, the mark 25 is in a prominent state, so that the mark 25 can always be clearly imaged regardless of the illumination conditions of the suction component. It becomes.
[0046]
When imaging of the suction component is completed, the head unit 5 starts moving to the mounting work position to mount each suction component on the printed circuit board 3, and the suction state of the component is checked based on the image data acquired in step S4. Thus, a correction value related to the mounting position is obtained (steps S5 to S8). Specifically, the center of the component on the image and the position of the mark 25 are calculated, and the movement error of the head unit 5 (movement error due to thermal expansion or the like) is obtained from the position of the mark 25, and based on this movement error Thus, a reference position is obtained, and the correction value is obtained from the reference position and the part center position. At this time, the rotation direction correction value is also obtained by obtaining the rotation direction error of the component (rotation around the central axis of the nozzle).
[0047]
Then, it is determined whether or not all image recognition has been completed (step S9), that is, whether or not correction values have been obtained for all suction components. If it is determined that the correction has been completed, the process proceeds to step S10. Is done. On the other hand, if it is determined that the image recognition has not ended, the process returns to step S7 and the suction state recognition process is repeated.
[0048]
In step S10, the head unit 5 is driven and controlled based on the correction values obtained in the processes in steps S6 to S8, so that the component to be mounted first is arranged on the printed circuit board 3. Then, the components are mounted on the printed circuit board 3 by moving the mounting head 20 up and down and rotating the mounting head 20 as necessary (step S11).
[0049]
Then, in step S12, it is determined whether or not all the components have been mounted. If it is determined that the mounting has ended, this flowchart ends. On the other hand, if it is determined that the process has not been completed, the process returns to step S10, and the mounting process for the remaining components is repeated.
[0050]
As described above, in this mounting machine, by picking up the image of the component attracted by the mounting head 20 and the mark 25 at the same time, the center position of the component can be obtained from the position of the mark 25 on the image. In addition, at the time of component imaging, the component recognition is performed based on the optimal image corresponding to the component by imaging the suction component based on the illumination conditions (illumination direction, illuminance, etc.) predetermined for each suction component. Therefore, it is possible to accurately recognize the suction state of the component.
[0051]
In addition, in this mounting machine, since the mark 25 is provided with backlight illumination so that the mark 25 is imaged in a conspicuous state, as described above, the illumination condition (illumination) of the illumination unit 31 is set. The mark 25 can always be clearly imaged without being influenced by the direction, illuminance, and the like. Therefore, unlike the conventional mounting machine of this type that images both the suction component and the mark with a common illumination from the camera side, the mark image is not blurred due to the difference in illumination conditions during component imaging, Both the suction component and the mark 25 can be clearly imaged. As a result of performing the component recognition processing based on such a clear image, there is an advantage that the component adsorption state by the mounting head 20 can be recognized more accurately. In particular, in this mounting machine, since a low reflection layer made of an oxide film is formed on the surface of the mark 25, the illumination light for component imaging by the illumination unit 31 is not easily reflected by the mark 25. In this respect, there is an advantage that the mark 25 can be imaged without being affected by the illumination conditions of the component imaging illumination.
[0052]
Further, in this mounting machine, while the backlight is provided on the mark 25 as described above, the structure (that is, the structure of the illumination means for the mark) is provided with the light guide hole 24a in the mark mounting portion 24, and the mark 25 is provided here. Since the glass substrate 26 marked with is inserted and illumination light is irradiated from the rear side (upper side in FIG. 4), the backlight illumination of the mark 25 does not affect the imaging of the suction component. That is, according to this configuration, the illumination light (backlight) of the LED 27 is irradiated to the mounting head 20 side by the side wall (indicated by reference numeral 24b in FIG. 4) of the light guide hole 24a functioning as a light shielding member (light shielding means). It will not be done. Therefore, there is an advantage that there is no adverse effect that the suction component image is affected by providing the backlight illumination of the mark 25.
[0053]
The mounting machine described above is an embodiment of the surface mounting machine of the present invention, and the specific contents thereof can be appropriately changed without departing from the gist of the present invention. For example, it is possible to adopt the following aspects.
(1) In the embodiment, a configuration in which the LED 27 (light source) is provided for each mark 25 is used as the backlight illumination configuration of the mark 25, that is, as the mark illumination means of the present invention. For example, a configuration in which the LEDs 27 are shared with respect to 25 or some of the marks 25 may be employed. According to this, a rational and inexpensive configuration in which the LEDs 27 are made common to the plurality of marks 25 is obtained. However, in this case, due to the difference in the distance from the LED 27 to each mark 25, it may be considered that each mark 25 may not necessarily be imaged with uniform definition. Therefore, in order to capture all the marks 25 clearly, it is preferable to employ the configuration of the above embodiment in which the LEDs 27 are provided for each mark 25.
{Circle around (2)} Based on the control of the control means, the LED 27 corresponding to each mark 25 may be turned on based on individual illumination conditions. For example, you may comprise so that the illumination intensity etc. of a backlight illumination may be changed according to the illumination conditions of the components imaging illumination.
(3) In the embodiment, only the mark 25 corresponding to the imaging component is illuminated with the backlight (LED 27 is turned on) and the other LEDs 27 are turned off. For example, all the LEDs 27 are kept on. You may make it image an adsorption | suction component. However, when a small chip component or the like is imaged, the backlight of the mark 25 adjacent to the mark 25 corresponding to the component may be affected. Therefore, for more accurate component recognition, it is preferable to perform backlight illumination only for the mark 25 corresponding to the imaging target component as in the embodiment.
[0054]
Note that, as in the embodiment, in a mounting machine having a plurality (six) of mounting heads 20, a large component may be mounted using some of the mounting heads 20. In this case, it is considered that the influence on the component recognition is less when the parts other than the necessary mark 25 are inconspicuous. For example, when the mark 25 is located in the vicinity of the outer edge of the suction component, if the backlight illumination is performed on the mark 25, it is considered that the contour recognition of the component is affected. Therefore, the backlight illumination is performed only for the mark 25 (mark 25 optimum for recognition) corresponding to the imaging target component not only when imaging a microchip component but also when imaging a large component. preferable.
(4) In the embodiment, the configuration of the mark illumination means for each mark 25 is partially shared. Specifically, the mark 25 is marked on a common glass substrate 26 and this is shared with a common light guide hole. The glass substrate 26 and the light guide hole 24a are made common by fitting into 24a, but of course, by marking each mark 25 on an individual glass substrate and fitting these glass substrates into independent light guide holes, respectively. You may comprise the mark illumination means completely independent for every mark 25. FIG. However, if the configuration of the mark illumination means for each mark 25 is partially shared as in the embodiment, there is an advantage that productivity is improved and maintenance is improved.
(5) The mark illuminating means of the embodiment has a configuration in which the glass substrate 26 and the LED 27 marked with the mark 25 are fitted into the light guide hole 24a provided in the mark mounting portion 24 of the head unit 5. The specific configuration of the illumination means is not limited to that of the embodiment, and an optimal configuration corresponding to the specific configuration of the head unit 5 may be adopted. For example, the mark 25 and the LED 27 may be directly provided to each mounting head 20 by an appropriate method. In this case, it is preferable to provide a suitable light shielding member so as to shield the backlight illumination so that the component image is not affected by the backlight illumination of the mark 25.
(6) In the embodiment, the mark 25 and the mark illuminating means are provided corresponding to each mounting head 20. For example, a common mark 25 for a pair of adjacent mounting heads 20, etc. May be provided. Conversely, a plurality of marks 25 and the like may be provided for one mounting head 20.
(7) In the embodiment, the camera 30 having a linear sensor is applied to the imaging unit 17, but of course, an area sensor may be applied as the camera 30. In this case, it is necessary to provide the mark 25 for the mounting head 20 so as to be within the angle of view of the camera 30.
[0055]
【The invention's effect】
  As described above, according to the present invention, prior to mounting of a component, the surface mounter recognizes an image of the suction state of the component by simultaneously imaging the component provided by the mounting head and the mark provided on the head unit by the imaging unit. A mark illuminating means for providing transmission illumination to the mark from the opposite side of the imaging means is provided from the opposite side of the imaging means so that the imaging means can take an image in a state where the mark is conspicuous by so-called backlight illumination.ingTherefore, the mark can always be clearly imaged without being affected by the illumination conditions (illumination direction, illuminance, etc.) of the component imaging illumination. Therefore, change the illumination conditions for component imaging illumination according to the type of component.While doingHowever, it is always possible to clearly pick up both the suction component and the mark, and as a result, the suction state of the component can be recognized more accurately.
[Brief description of the drawings]
FIG. 1 is a plan view showing a surface mounter according to the present invention.
FIG. 2 is a front view showing a surface mounter (mainly a head unit) according to the present invention.
FIG. 3 is a schematic view showing a state in which the head unit is viewed from the base side.
FIG. 4 is a side view (partially sectional view) showing the head unit.
FIG. 5 is a schematic cross-sectional view illustrating a configuration of an imaging unit.
FIG. 6 is a flowchart for explaining an example of the mounting operation of the surface mounter based on the control of the control means.
FIG. 7 is a diagram schematically showing a suction component image captured by an imaging unit.
[Explanation of symbols]
3 Printed circuit board
4 Parts supply section
5 Head unit
17 Imaging unit
20 Mounting head
20a Suction nozzle
24 Mark mounting part
24a Light guide hole
25 mark
26 Glass substrate
27 LED

Claims (6)

A head unit movable between parts Shinakyo supply unit and the substrate, the mounting heads vertically movably supported on the head unit includes a component illumination means for providing illumination component imaging and predetermined imaging comprising imaging means for imaging the suction part article by being disposed at a height position the mounting head, and a mark provided on the head unit so as to be positioned within the depth of field of the imaging means, mounted parts in the prior, the suction part and the image recognizes surface mounter suction state of the part of the mark is simultaneously captured Ri by said image pickup means,
The imaging means images the suction component by irradiating the suction component with illumination light and receiving the reflected light, and irradiates the suction component with illumination light from different directions as the component illumination unit. And having a plurality of lighting devices
A mark illuminating unit that provides transmission illumination to the mark from the opposite side of the imaging unit with the mark as a boundary, and a control unit that controls the illumination state of the mark illuminating unit and each of the illumination devices;
The control means controls the illumination devices based on the illumination conditions predetermined for each component during image recognition of the suction component and controls the mark illumination means to provide transmitted illumination to the mark. A surface mounting machine characterized by that. In the surface mounting machine according to claim 1,
Wherein, a surface mounter which is characterized that you change the illumination of the mark lighting means in accordance with the illumination condition for each component. In the surface mounting machine according to claim 1 or 2,
A surface mounting machine, wherein the head unit is provided with a plurality of marks, and the mark illumination means are individually provided corresponding to each mark. In the surface mounting machine according to claim 3,
A surface mounting machine, wherein a plurality of the mounting heads are mounted on the head unit, and the marks are provided in proximity to the mounting heads. In the surface mounting machine according to claim 3 or 4,
Wherein, a surface mounter, wherein each of the Turkey to lighting control based on the individual lighting conditions the illumination means for the marks. In the surface mounting machine according to claim 5,
The surface mounting machine characterized in that the control means turns off the mark illumination means other than the mark illumination means of the mark to be imaged when the suction part is imaged by the imaging means.

Images