JP6139833B2 - Component mounting apparatus and method for assigning components to head in component mounting apparatus - Google Patents

Description

  The present invention relates to a component mounting apparatus and a method for allocating components to a head portion in the component mounting apparatus, and more particularly, to a component mounting apparatus including an imaging unit that images a component adsorbed by the head unit and to the head unit in the component mounting apparatus. It is related with the part allocation method.

  2. Description of the Related Art Conventionally, a component mounting apparatus including an imaging unit that captures an image of a component sucked by a head unit is known (see, for example, Patent Document 1).

  In Patent Document 1, a mounting head that sucks components through a plurality of nozzles arranged in a staggered pattern (two rows), and a nozzle at the tip of the mounting head while relatively moving the mounting head in the nozzle arrangement direction There is disclosed a component mounter (component mounter) including a shutter camera that sequentially captures components adsorbed on the component. In this component mounter, the brightness of the illumination light emitted by each component held by each nozzle is switched with the imaging center of the shutter camera (imaging unit) arranged between the nozzle columns. However, it is configured such that images are taken alternately (offset imaging) in one scanning operation.

JP 2010-16115 A

  However, in the component mounter described in Patent Document 1, when the components in each column are alternately imaged while switching the brightness of the illumination light, the size and image of the illumination light with respect to the size (shape) of each component When imaging conditions such as an offset amount with respect to a part (camera) are not appropriate, an appropriate imaging result cannot be obtained, leading to a reduction in accuracy of component recognition. For this reason, for parts where it is difficult to obtain component recognition accuracy, such as ball components such as BGA, recognition accuracy is applied by applying camera center imaging, in which the imaging center of the imaging unit and the nozzle center are approximately matched, instead of offset imaging. The need to maintain However, in such a case, since it is necessary to perform the camera center imaging for each part in each row, it is not possible to image all the parts by one scanning operation, and as a result, the imaging time of the parts ( (Tact time of imaging operation) is increased.

  The present invention has been made to solve the above-described problems, and one object of the present invention is component mounting capable of shortening the imaging time of a component while maintaining the recognition accuracy of the component. An apparatus and a method for assigning components to a head portion in a component mounting apparatus are provided.

In order to achieve the above object, a component mounting apparatus according to a first aspect of the present invention includes a head unit to which a plurality of nozzles are attached, and a component adsorbed via the plurality of nozzles can be mounted on a substrate. An image pickup unit that picks up the picked-up component and a control unit that performs control for picking up the component by the image pickup unit are included. A first component having a relatively low recognition accuracy, and a second component having a relatively high component recognition accuracy due to a relatively sharp outer shape in the captured image as compared with the first component. The first component to the head unit so that the first component is aligned on one imaging line in which the imaging center of the imaging unit and the center of the nozzle substantially coincide among the plurality of imaging lines extending in the first direction. There line the allocation of less In allocating the row name Tsu was state of the second component on the imaging lines other than one captured line are arranged on a plurality of image pickup lines while the head portion is relatively moved in a first direction with respect to the imaging unit The first part and the second part are configured to perform control for imaging.

In the component mounting apparatus according to the first aspect of the present invention, as described above, the imaging center of the imaging unit and the center of the nozzle are substantially coincident among the plurality of imaging lines in which the first component extends along the first direction. in the first part allocates state like went in to the head portion so as to be aligned on the imaging lines, disposed on a plurality of image pickup lines while the head portion is relatively moved in a first direction with respect to the imaging unit By configuring the control unit to perform control for imaging the first component and the second component, the first components with relatively low component recognition accuracy are collected and grouped on a specific imaging line. In addition to imaging, a second component having a relatively high component recognition accuracy is arranged on the same imaging line as the grouped first component or on another imaging line, and the same sequence as the imaging of the first component (for example, One scan operation In can be captured. In other words, even when components with different component recognition accuracy are mixed in the component group to be imaged, individual components (based on imaging conditions that can appropriately capture each component in a common imaging sequence ( 1st part and 2nd part) can be imaged and each can be recognized accurately. Thereby, the imaging time of a component can be shortened while maintaining the recognition accuracy of the component.

  In the component mounting apparatus according to the first aspect described above, preferably, the control unit performs control to image the first component and the second component arranged on the plurality of imaging lines by one imaging operation by the imaging unit. Configured to do. As described above, even if components (first component and second component) having different component recognition accuracy are arranged over a plurality of imaging lines, each can be imaged by one imaging operation. While maintaining the recognition accuracy, it is possible to reliably reduce the imaging time of the parts.

The first part is allocated to the head part so that the imaging center of the imaging part and the center of the nozzle are substantially aligned with each other, and the second part is placed on an imaging line other than at least one imaging line. in the state of performing the allocation, preferably, the imaging unit includes a first imaging region including the imaging center of the imaging unit, and a second imaging region outside the first imaging area, the control section of the image pickup unit At the same time that the first part arranged on the predetermined imaging line is imaged in the first imaging area in a state where the imaging center and the center of the nozzle are substantially coincident with each other, the imaging center of the imaging unit and the center of the nozzle are predetermined. Control of imaging the first component and the second component arranged on the plurality of imaging lines by one imaging operation by the imaging unit by imaging the second component in the second imaging area in a state where the distance is offset. Is configured to do. If comprised in this way, the 2nd imaging away from the imaging center of an imaging part simultaneously with the 1st imaging area (imaging center of an imaging part) picking up accurately the 1st component for which higher recognition accuracy is requested | required The region can be effectively used to appropriately image the second part. Thereby, the recognition precision based on the imaging result of all the components imaged can be maintained highly.

The first part is allocated to the head part so that the imaging center of the imaging part and the center of the nozzle are substantially aligned with each other, and the second part is placed on an imaging line other than at least one imaging line. in the state of performing the allocation, preferably, the head portion is a rotary head in which a plurality of nozzles are arranged in a circumferential shape in a plan view, the control unit, the diameter of the first component passing through the center of rotation of the rotary head The first components sucked by the nozzles facing each other along the direction and arranged by the nozzles are arranged along the first direction on an imaging line where the imaging center of the imaging unit and the center of the nozzle substantially coincide with each other. With the rotary head rotated as described above, the first component and the second component disposed on the plurality of imaging lines while moving the rotary head relative to the imaging unit in the first direction And it is configured to perform control of the imaging by one imaging operation.
In order to achieve the above object, a component mounting apparatus according to a second aspect of the present invention includes a head unit to which a plurality of nozzles are attached, and a component adsorbed via the plurality of nozzles can be mounted on a substrate. An image pickup unit that picks up the picked-up component and a control unit that performs control for picking up the component by the image pickup unit are included. A first component having a relatively low recognition accuracy, and a second component having a relatively high component recognition accuracy due to a relatively sharp outer shape in the captured image as compared with the first component. The first component to the head unit so that the imaging center of the imaging unit and the center of the nozzle are aligned with each other on the other imaging lines among the plurality of imaging lines extending along the first direction. Allocation of In the state where the second part is assigned to the imaging line other than the other imaging line, the illumination light adjusted for each of the first part and the second part is switched and applied to image the head part. The first part and the second part arranged on a plurality of imaging lines are controlled to be imaged while being relatively moved in the first direction with respect to the part.
In the component mounting apparatus according to the second aspect of the present invention, as described above, the imaging center of the imaging unit and the center of the nozzle substantially coincide with each other among the plurality of imaging lines in which the first component extends along the first direction. The first component and the first component are arranged in a state in which the first component is allocated to the head unit so as to be aligned on the other imaging line, and at least the second component is allocated on the imaging line other than the other imaging line. By switching and irradiating the adjusted illumination light to each of the two parts, the first part with relatively low part recognition accuracy is collected on a specific imaging line and imaged in a grouped state, A second component with relatively high component recognition accuracy is arranged on the same imaging line as the grouped first component or on another imaging line, and the same sequence as the imaging of the first component (for example, one scan). Can be imaged by the catcher down operation). In other words, even when components with different component recognition accuracy are mixed in the component group to be imaged, individual components (based on imaging conditions that can appropriately capture each component in a common imaging sequence ( 1st part and 2nd part) can be imaged and each can be recognized accurately. Thereby, the imaging time of a component can be shortened while maintaining the recognition accuracy of the component.

The first part is allocated to the head part so that the imaging center of the imaging part and the center of the nozzle are substantially aligned with each other, and the second part is placed on an imaging line other than at least one imaging line. Or the first part is arranged on another imaging line in which the imaging center of the imaging unit and the center of the nozzle do not substantially match among the plurality of imaging lines extending in the first direction. In the configuration in which the first part is assigned to the head part and the second part is assigned to at least the imaging line other than the imaging line , the plurality of nozzles are preferably arranged in the first direction. The first row nozzle group disposed along the first row nozzle group and the first row nozzle group disposed along the first direction in a state shifted from the first row nozzle group in a second direction substantially orthogonal to the first direction in plan view. A second row nozzle group, The control unit adsorbs the first component to either the first row nozzle group or the second row nozzle group, and adsorbs the second component to either one of the first row nozzle group or the second row nozzle group or the other. In this state, the first component and the second component are controlled to be imaged by one imaging operation. With this configuration, the first component can be easily moved along the imaging line on the nozzle row in a state where the first component is collected in either the first row nozzle group or the second row nozzle group. And the second part is collected along one or the other nozzle row of the first row nozzle group or the second row nozzle group, along the imaging line on the nozzle row. A part can be easily imaged. That is, in the component mounting apparatus having a tandem head in which a plurality of nozzle rows are arranged in parallel in one head portion, it is possible to easily obtain the effect of the present invention that shortens imaging time while maintaining component recognition accuracy. it can.

Among the plurality of imaging lines in which the first component extends along the first direction, the first component to the head unit so that the imaging center of the imaging unit and the center of the nozzle are aligned on other imaging lines that do not substantially coincide with each other. In the configuration in which the second component is assigned to at least an imaging line other than the other imaging lines , the plurality of nozzles are preferably arranged in the first direction. A row nozzle group, and a second row nozzle group arranged along the first direction in a state shifted from the first row nozzle group in a second direction substantially orthogonal to the first direction in plan view. An illumination unit configured to be switchable between the illumination condition of the illumination light to the first component and the illumination condition of the illumination light to the second component during imaging, and the imaging unit is predetermined in the first direction. An imaging region having a width and extending in a line in the second direction Therefore, the control unit moves the first component to either the first row nozzle group or the second row nozzle group so that the first component and the second component adjacent to each other are separated by a predetermined width or more along the first direction. The first direction with respect to the imaging region extending in a line shape in a state where the second part is adsorbed to either one of the first row nozzle group and the second row nozzle group or the other. The first component and the second component are controlled to be imaged in a single imaging operation while switching the illumination light irradiation conditions for the first component and the second component. If comprised in this way, by devising allocation to the head part (each nozzle) of the 1st parts and the 2nd parts, between the 1st parts and the 2nd parts which mutually adjoin in the 1st direction. Since a gap (space) larger than the imaging region width of the imaging unit can be secured, the first component and the second component do not overlap in the imaging line direction (first direction). That is, the illumination light when the first component is imaged along the imaging line on the nozzle row in a state where the first component is collected in either the first row nozzle group or the second row nozzle group. The second component is imaged along the imaging line on the nozzle row in a state where the second component is collected in either the first row nozzle group or the second row nozzle group or the other nozzle row. Each of the components can be imaged by switching the illumination light irradiation conditions for each component passing on the imaging unit (imaging region extending in a line shape) reliably. Therefore, each part (the first part and the second part) can be accurately imaged by one imaging operation, and the imaging time can be shortened.

In the component mounting apparatus according to the third aspect of the present invention, the component allocating method to the head unit is performed along the first direction while relatively moving the head unit of the component mounting apparatus in the first direction with respect to the imaging unit. When imaging components arranged on a plurality of extending imaging lines, a first component having relatively low component recognition accuracy based on the imaging result and a second component having relatively higher component recognition accuracy than the first component Of the plurality of imaging lines are arranged on one imaging line in which the imaging center of the imaging unit and the center of the nozzle substantially coincide with each other to the head unit. wherein the first component without line allocation, comprising the step of performing assignment of the second component in at least the one on the imaging lines other than the imaging lines.

In the method of allocating components to the head portion in the component mounting apparatus according to the third aspect of the present invention, when imaging a component, the first component among the components including the first component and the second component is a plurality of components . Of the imaging lines, the first part is allocated to the head unit so that the imaging center of the imaging unit and the center of the nozzle are substantially aligned on the imaging line, and on the imaging line other than at least one imaging line. The step of allocating the second component to the first component is performed by collecting the first component with relatively low component recognition accuracy on a certain imaging line and grouping them together. A second component with relatively high component recognition accuracy is arranged on the same imaging line as the component or on another imaging line, and in the same sequence as the imaging of the first component (for example, one scanning operation). It is possible to image. In other words, even when components with different component recognition accuracy are mixed in the component group to be imaged, individual components (based on imaging conditions that can appropriately capture each component in a common imaging sequence ( 1st part and 2nd part) can be imaged and each can be recognized accurately. Thereby, at the time of component imaging in the component mounting apparatus, the imaging time can be shortened while maintaining the recognition accuracy of the component.
In the component mounting apparatus according to the fourth aspect of the present invention, the component allocating method to the head unit is performed along the first direction while moving the head unit of the component mounting apparatus relative to the imaging unit in the first direction. A first component having a relatively low component recognition accuracy based on an imaging result due to a relatively unclear outer shape in the captured image when imaging components arranged on a plurality of extending imaging lines; The first component of the components including the second component having a relatively high component recognition accuracy due to the relatively clear outer shape in the captured image as compared with the one component is captured in the plurality of imaging lines. The first part is allocated to the head part so that the imaging center of the part and the center of the nozzle are aligned on other imaging lines that do not substantially coincide with each other, and at least the second part is placed on the imaging line other than the other imaging lines. Assign State, comprising the step of irradiating by switching while relatively moving in a first direction relative to the imaging unit of the head portion, the illumination light is adjusted for each of the first component and second component.
In the component mounting apparatus according to the fourth aspect of the present invention, as described above, the imaging center of the imaging unit and the center of the nozzle substantially coincide with each other among the plurality of imaging lines in which the first component extends along the first direction. The first component and the first component are arranged in a state in which the first component is allocated to the head unit so as to be aligned on the other imaging line, and at least the second component is allocated on the imaging line other than the other imaging line. By switching and irradiating the adjusted illumination light to each of the two parts, the first part with relatively low part recognition accuracy is collected on a specific imaging line and imaged in a grouped state, A second component with relatively high component recognition accuracy is arranged on the same imaging line as the grouped first component or on another imaging line, and the same sequence as the imaging of the first component (for example, one scan). Can be imaged by the catcher down operation). In other words, even when components with different component recognition accuracy are mixed in the component group to be imaged, individual components (based on imaging conditions that can appropriately capture each component in a common imaging sequence ( 1st part and 2nd part) can be imaged and each can be recognized accurately. Thereby, the imaging time of a component can be shortened while maintaining the recognition accuracy of the component.

  According to the present invention, as described above, the imaging time of a component can be shortened while maintaining the recognition accuracy of the component.

1 is a plan view schematically showing an overall configuration of a component mounting apparatus according to a first embodiment of the present invention. 1 is a front view schematically showing an overall configuration of a component mounting apparatus according to a first embodiment of the present invention. It is a top view for demonstrating the detailed structure (positional relationship at the time of component imaging) of the head unit and imaging unit in the component mounting apparatus by 1st Embodiment of this invention. It is a side view for demonstrating the detailed structure (positional relationship at the time of component imaging) of the head unit and imaging unit in the component mounting apparatus by 1st Embodiment of this invention. It is the block diagram which showed the structure on the control of the component mounting apparatus by 1st Embodiment of this invention. It is the top view which showed roughly the whole structure of the component mounting apparatus by 2nd Embodiment of this invention. It is a top view for demonstrating the detailed structure (positional relationship at the time of component imaging) of the rotary head and imaging unit in the component mounting apparatus by 2nd Embodiment of this invention. It is a top view for demonstrating the detailed structure (positional relationship at the time of component imaging) of the head unit and imaging unit in the component mounting apparatus by 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
With reference to FIGS. 1-5, the component mounting apparatus 100 by 1st Embodiment of this invention is demonstrated. Hereinafter, first, each component of the component mounting apparatus 100 will be described, and then, characteristic operation contents included in the mounting operation of the component mounting apparatus 100 will be described.

  As shown in FIG. 1, the component mounting apparatus 100 according to the first embodiment of the present invention places a component 2 on a substrate 1 printed with cream solder (not shown) at a high speed using a head unit 50 described later. It is a device for mounting (mounting). The head unit 50 is an example of the “head portion” in the present invention.

  As shown in FIG. 1, the component mounting apparatus 100 includes a base 10, a board transport unit 20 provided on the base 10 (front side of the paper surface), and both sides (Y1 side and Y2 side) of the board transport unit 20. The component supply units 30 and 40 arranged on the head, the head unit 50 that can be moved along the XY plane above the substrate transport unit 20 (the front side in the drawing), and imaging for imaging the state of the component 2 before mounting A unit 60 and a control device 70 (see FIG. 5) are provided.

  The substrate transport unit 20 has a pair of conveyors 21 extending in the transport direction (X direction) of the substrate 1. The pair of conveyors 21 has a function of receiving the substrate 1 from one side (X1 side) and transporting it to the mounting work position and holding the substrate 1 at the mounting work position. The pair of conveyors 21 also has a function of carrying out the mounted substrate 1 to the other side (X2 side) after completion of component mounting.

  A plurality of tape feeders 31 arranged in the X direction are arranged in the component supply unit 30 arranged on the rear side (Y1 side) of the substrate transport unit 20. Each tape feeder 31 holds a reel (not shown) around which a tape (not shown) holding a plurality of chip parts (components 2) at a predetermined interval is wound. And the component supply part 30 is comprised so that the chip components on a tape may be supplied to the component supply position of the board | substrate conveyance part 20 vicinity by paying out a tape intermittently from each tape feeder 31. FIG. Here, the chip component refers to a small electronic component such as an LSI, IC, transistor, capacitor, or resistor. The chip component is an example of the “component” in the present invention.

  In addition, trays 41 and 42 are arranged at a predetermined interval in the X direction in the component supply unit 40 arranged on the front side (Y2 side) of the board conveyance unit 20. Large tray parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array) are arranged and placed on the trays 41 and 42 so that the head unit 50 can take them out. The package part is an example of the “component” in the present invention.

  As shown in FIGS. 1 and 2, the head unit 50 transfers the component 2 supplied from the component supply units 30 and 40 to a predetermined position on the substrate 1 while temporarily sucking / holding the component 2, and at that position. It has a function of mounting the component 2 on the substrate 1. Specifically, six mounting heads 51 are attached to the lower surface of the head unit 50. Each mounting head 51 is provided with a component suction nozzle 5 whose tip is directed downward (Z1 direction). Thus, during the component mounting operation, the component 2 is attracted by the negative pressure generated at the tip (lower end) of the nozzle 5 by the negative pressure generator (not shown) provided in the component mounting apparatus 100. It is configured.

  Further, the head unit 50 including the six mounting heads 51 is supported so as to be movable on the base 10 via a support portion 52 extending in the X direction. The head unit 50 is moved in the X direction when the ball screw shaft 54 is rotated by an X-axis servomotor 53 provided in the support portion 52. A pair of elevated frames 11 extending in the Y direction are disposed on the upper surface of the base 10, and the elevated frame 11 is provided with a Y-axis servo motor 13 and a ball screw shaft 14. Here, the support portion 52 straddles the elevated frame 11 in the X direction via the pair of fixed rails 12. The support portion 52 is moved in the Y direction on the elevated frame 11 when the ball screw shaft 14 is rotated by the Y-axis servomotor 13. As a result, the head unit 50 is configured such that the ball screw shafts 54 and 14 are rotated to move to an arbitrary position in the XY plane on the base 10.

  Here, in the first embodiment, as shown in FIG. 3, the head unit 50 has a pair of nozzle groups 5 a and 5 b that are arranged along the X direction. Specifically, the nozzle group 5a is composed of the nozzles 5 below the three mounting heads 51 (see FIG. 1) arranged in a line along the X direction, and the nozzle group 5b corresponds to the nozzle group 5a. It consists of the nozzles 5 below the other three mounting heads 51 (see FIG. 1) arranged in a line along the X direction in a state shifted in the Y1 direction substantially orthogonal to the X direction in plan view. That is, among the six nozzles 5, the three nozzles 5 (nozzle group 5 a) on the front row side and the three nozzles 5 (nozzle group 5 b) on the rear row side are mutually in the Y direction on the basis of the center between the nozzles 5. Are separated by a distance D1. Further, when the nozzle group 5a and the nozzle group 5b are viewed along the X direction, the nozzle group 5b is located at a position separated in the Y1 direction by a distance D1 at a substantially intermediate position between two adjacent nozzles 5 in the nozzle group 5a. One nozzle 5 is arranged, and the six nozzles 5 are arranged in a staggered manner as a whole. The X direction and the Y direction are examples of the “first direction” and the “second direction” in the present invention, respectively. The nozzle groups 5a and 5b are examples of the “first row nozzle group” and the “second row nozzle group” of the present invention, respectively. Although details will be described later, a line connecting the three nozzles 5 constituting the nozzle group 5a corresponds to the imaging line A in FIG. 3, and a line connecting the three nozzles 5 constituting the nozzle group 5b is shown in FIG. Corresponds to the imaging line B in FIG. The distance D1 is an example of the “predetermined distance” in the present invention.

  Further, as shown in FIG. 4, each mounting head 51 can move up and down in the Z direction, and rotates in the horizontal direction (R direction) with a vertical axis (Z direction) passing through the center of the nozzle 5 as a rotation center. It is configured to be moved. Accordingly, the holding state (suction state) of the component 2 in the XY plane is adjusted in a state where the component 2 is attracted to the nozzle 5.

  As shown in FIG. 1, the imaging unit 60 is provided on the base 10 and is fixedly installed between the tray 41 and the tray 42 in plan view. Further, as shown in FIG. 4, the imaging unit 60 removes the component 2 immediately before mounting taken out from the component supply units 30 and 40 (see FIG. 1) by the head unit 50 (see FIG. 2) from the lower surface side (Z1 side). ). More specifically, the imaging unit 60 changes the shape of the lower surface side of the component 2 while the head unit 50 moves relative to the X direction (direction perpendicular to the paper surface) above the imaging unit 60 (Z2 side). It is configured to take an image. In this case, as shown in FIG. 3, the plurality of (maximum six) parts 2 are adsorbed by the three nozzles 5 of the nozzle group 5a and the three nozzles 5 of the nozzle group 5b, respectively, When the component 2 crosses the image unit 60 together with the head unit 50 in the X1 direction, the shape of the lower surface side of each component 2 is imaged. Accordingly, the component mounting apparatus 100 (see FIG. 1) recognizes the holding (suction) state of the component 2 immediately before mounting with respect to the nozzle 5.

  As shown in FIG. 4, the imaging unit 60 includes a camera unit 61, a case main body 62 that houses the camera unit 61, and an illumination unit 63 provided on the case main body 62. In addition, the camera unit 61 includes a linear sensor 65 in which an imaging region (imaging element) extends in a line shape in the Y direction, a slit 66, and an optical lens 67. Here, the linear sensor 65 includes an imaging region 65a corresponding to the center of the optical lens 67, and an imaging region 65b outside the imaging region 65a (on both sides in the Y direction). That is, as shown in FIGS. 3 and 4, the imaging region 65 a in the linear sensor 65 is configured to be the imaging center of the camera unit 61. The camera unit 61 is an example of the “imaging unit” in the present invention. The imaging areas 65a and 65b of the linear sensor 65 are examples of the “first imaging area” and the “second imaging area” in the present invention, respectively.

  The illumination parts 63 are arranged on both sides in the X direction of slit-like light guide windows 62a that are short in the X direction and long in the Y direction provided in the case body 62 in plan view (see FIG. 3). LEDs are arranged over the entire circumference in a flat illumination section 63a in which a plurality of (diodes) are arranged in the Y direction and a substantially bowl-shaped inner peripheral inclined section 62b above (in the Z2 direction) above the light guide window 62a. And an inclined illumination part 63b. Therefore, as shown in FIG. 4, when illumination light for imaging (indicated by a broken line) is irradiated from the illumination unit 63 onto the component 2 held by the nozzle 5, reflected light in the Z1 direction from the component 2 is guided. After passing through the optical window 62a, it passes through the optical lens 67 and the linear slit 66 (width W1: see FIG. 3) and forms an image on the image pickup elements in the image pickup regions 65a and 65b in the camera unit 61.

  As shown in FIG. 5, the control device 70 controls the overall operation related to the component mounting operation of the component mounting apparatus 100. Specifically, the control device 70 includes a main control unit 71 composed of a CPU, a storage unit 72, a camera control unit 73, an image processing unit 74, and a drive control unit 75. The main control unit 71 is an example of the “control unit” in the present invention.

  The main control unit 71 has a function of comprehensively controlling each drive mechanism (the board transport unit 20 and the head unit 50) of the component mounting apparatus 100 via the drive control unit 75 according to the mounting program stored in the storage unit 72. Have. The storage unit 72 stores “component information” including information that can identify individual components such as the component name, component number, and component shape of the component 2 to be mounted. Such component information is input to an input device (PC terminal) (not shown) when the operator performs a setup operation for replenishing various components 2 to the tape feeder 31 (see FIG. 1), the trays 41 and 42 (see FIG. 1), and the like. ) To be registered in advance in the component mounting apparatus 100 (storage unit 72).

  Further, the main control unit 71 performs a control operation of the component mounting apparatus 100 according to the component 2 to be mounted based on the mounting program and the component information stored in the storage unit 72. The image processing unit 74 has a function of performing predetermined image processing on image data acquired by the camera unit 61 (linear sensor 65). Then, the main control unit 71 recognizes the holding state of the component 2 (see FIG. 4) sucked by the head unit 50 through the nozzle 5 based on the image processing result (imaging result) by the image processing unit 74. It is configured. Thus, the component mounting apparatus 100 in 1st Embodiment is comprised.

  Next, with reference to FIGS. 1 to 5, the mounting operation of the component 2 that is executed based on the control of the main control unit 71 in the component mounting apparatus 100 will be described.

  First, based on the mounting program, the head unit 50 (see FIG. 1) is sequentially moved from the initial position onto the component supply unit 30 and onto the component supply unit 40, and the component is placed at the tip (lower end) of each nozzle 5. 2 (see FIG. 2) is adsorbed. Then, after a maximum of six parts 2 are adsorbed to each nozzle 5, as shown in FIGS. 3 and 4, the head unit 50 (see FIG. 3) passes over the imaging unit 60 in the X1 direction. . At this time, the illumination unit 63 starts to light at the timing immediately before each component 2 to be imaged reaches above the imaging unit 60, until all the components 2 have passed above the imaging unit 60. Lighting of the illumination unit 63 is continued. During this period, the holding state (suction state) of each component 2 immediately before mounting with respect to the nozzle 5 is sequentially imaged by the camera unit 61 (linear sensor 65).

  Here, in the first embodiment, the following characteristic method (method of assigning the component 2 to the head unit 50) is applied to the imaging method of the component 2 attracted to each nozzle 5.

  Specifically, the component 2 has a component recognition accuracy that is relatively higher than the component 2a (see FIG. 3) that belongs to a component whose component recognition accuracy is relatively low based on the imaging result of the imaging unit 60. In the case where the component 2b (see FIG. 3) belonging to the components is included, the component 2a is moved before imaging (when the head unit 50 is moved and the component 2 is attracted to the tip of each nozzle 5). An allocation operation is performed on the head unit 50 such that the component 2a is attracted to the nozzle 5 on the nozzle group 5a side so as to be aligned on the imaging line A of the two imaging lines A and B extending along the X direction. Make it. For the component 2b, the head unit 50 is operated so that the component 2a is attracted to the nozzle 5 (nozzle group 5a and / or nozzle group 5b) to which the component 2a is not attracted. Here, in the example shown in FIG. 3, two parts 2a and one part 2b are adsorbed to the nozzle group 5a, and three parts 2b are adsorbed to the nozzle group 5b. Yes. The head unit 50 is arranged on the imaging line A while moving the head unit 50 in the X1 direction with respect to the imaging unit 60 in a state where the two parts 2a are arranged on the nozzle group 5a side so as to be aligned on the imaging line A. The two parts 2a and a total of four parts 2b in which one on the imaging line A and three on the imaging line B are arranged are imaged by the camera unit 61. The component 2a and the component 2b are examples of the “first component” and the “second component” in the present invention, respectively. Further, the imaging line A and the imaging line B are examples of “a plurality of imaging lines” in the present invention, and the imaging line A is an example of “predetermined imaging lines” in the present invention.

  Note that the imaging lines A and B shown in FIG. 3 do not actually have a linear (line-shaped) structure. In the first embodiment, a line connecting the positions where the three nozzles 5 constituting the nozzle group 5a are aligned in the X direction is defined as an imaging line A for convenience, and the three nozzles 5 constituting the nozzle group 5b are defined in the X direction. For convenience, the line connecting the positions aligned with each other is defined as an imaging line B. That is, there are two virtual imaging lines in the head unit 50 in which the six nozzles 5 are arranged in tandem three by three.

  Further, as the component 2a, a component including a curved portion such as a rounded corner in the outer shape of the electronic component, such as a component including a ball-shaped (hemispherical) portion such as a melf chip or a BGA, corresponds. As shown in FIG. 4, when the component 2a is imaged from the lower surface side by the camera unit 61, the illumination unit 63 irradiates the illumination light with a positional strength on the light intensity of the flat illumination unit 63a and the inclined illumination unit 63b. Even if the condition (imaging condition) is devised, the captured image remains unclear due to the rounded outer shape of the component 2a, and the component recognition accuracy based on the imaging result is lowered. On the other hand, as the component 2b, a component having a clear tip shape (outer shape of the component) such as a resistor chip component or a QFP component is applicable. When the part 2b is imaged from the lower surface side by the camera unit 61, since the outer shape (contour) is obtained as a sharp captured image, the component recognition accuracy based on the imaging result is higher than that of the component 2a.

  Therefore, in the first embodiment, when the component 2 is attracted to the nozzle 5 from the component supply units 30 and 40 according to the mounting program, the component 2a (maximum of three) having relatively low component recognition accuracy is always captured by the imaging line A. The component 2a is attracted to the nozzle group 5a so as to be lined up, and the component 2b having relatively higher component recognition accuracy than the component 2a is the remaining nozzle 5 in the nozzle group 5a to which the component 2a is not attracted. Or the operation | movement made to adsorb | suck to each nozzle 5 by the side of the nozzle group 5b is performed based on the instruction | command of the main control part 71 (refer FIG. 5). Then, as shown in FIG. 3, the two components 2a and the four components 2b are subjected to one imaging operation (scanning) while moving the head unit 50 in the X1 direction with respect to the imaging unit 60 along the imaging line A. (Operation). In the single suction operation (suction operation of the six components 2) by the head unit 50, the “component information” of each component 2 is registered in advance in the storage unit 72 (see FIG. 5). The head unit 50 is driven so that 2a is preferentially sucked by the nozzle group 5a and the component 2b is sucked by the nozzle group 5b.

  In the first embodiment, when the imaging (scanning operation) of the component 2 is performed, the imaging center of the camera unit 61 (linear sensor 65) and the center of the nozzle 5 are substantially aligned with each other on the imaging line A. The component 2b is imaged in the imaging region 65b in a state where the imaging center of the camera unit 61 and the center of the nozzle 5 are offset by a distance D1 simultaneously with imaging of the arranged component 2a in the imaging region 65a of the linear sensor 65. Thereby, the operation of imaging the component 2a and the component 2b arranged on the imaging lines A and B by one imaging operation by the camera unit 61 is executed based on a command from the main control unit 71 (see FIG. 5). It is configured to be.

  That is, in the component mounting apparatus 100, in one imaging operation by the camera unit 61, the camera center imaging of the component 2a adsorbed by the nozzle 5 (the imaging center of the camera unit 61 and the center of each nozzle 5 in the Y direction are substantially omitted). In this state, the head unit 50 is moved in the X1 direction with respect to the camera unit 61 while imaging the component 2a), and the offset imaging of the component 2b adsorbed by the nozzle 5 (imaging of the camera unit 61 in the Y direction). It is possible to simultaneously perform the operation of imaging the component 2b while moving the head unit 50 in the X1 direction with respect to the camera unit 61 with the center and the center of each nozzle 5 being shifted in the Y1 direction by the distance D1. It is configured. In this case, the component 2a that tends to have low (or inferior) component recognition accuracy is imaged in the imaging region 65a including the central portion of the linear sensor 65, so that the illumination condition of the illumination light by the illumination unit 63 can be easily made axially symmetric ( Irradiation conditions such that the intensity of light from each LED is isotropic from the imaging center) can be obtained, and a clearer captured image can be obtained. On the other hand, for the three components 2b on the imaging line B, a captured image that does not affect the component recognition accuracy is obtained even with offset imaging.

  More specifically, as shown in FIG. 4, the illumination light (broken arrows) from the inclined illumination unit 63b is above the center of the light guide window 62a formed so as to coincide with the imaging center of the camera unit 61 (Z2). Illuminating light (broken arrows) from the flat illumination portions 63a on both sides in the X direction of the light guide window 62a are also irradiated toward the upper center of the light guide window 62a in the Y direction. As a result, the brightness increases above the center of the light guide window 62a. Therefore, in the camera center imaging, the component 2a passing in the X direction above the center of the light guide window 62a extends from the lower side and the lower side to the entire region. Receiving illumination light almost evenly. Therefore, an accurate image of the component 2a is obtained with the center of the nozzle 5 as a reference, and the component recognition accuracy is maintained. On the other hand, for example, when the component 2a is attracted to a position corresponding to the imaging line B (nozzle group 5b side), the intensity of the illumination light irradiated on the lower surface of the component 2a is asymmetric along the Y direction. As a result, only a blurred image can be obtained due to the rounded outer shape of the component 2a. That is, the component mounting apparatus 100 is premised on an operation configuration in which the component 2a with relatively low component recognition accuracy is always imaged by camera center imaging.

  As described above, in the first embodiment, even when the components 2a and 2b having different component recognition accuracy are mixed, individual components (components 2a) based on imaging conditions suitable for the components in the common imaging sequence. In addition, it is possible to accurately recognize each of the components 2b) by imaging.

  Further, when the imaging of the component 2 (component 2a and component 2b) by the imaging unit 60 is completed, the suction state of the component 2 (the state of each component 2 relative to the mounting head 51) based on the imaging result of each component imaged by the imaging unit 60. The main control unit 71 (see FIG. 5) recognizes whether there is a defect in the X direction, the Y direction, and the R direction, or whether the component 2 is defective. If there is a defective part or a part in which the suction position cannot be corrected in the imaged part 2, the part is registered as data to be discarded, and the normal parts other than the target to be discarded are registered. Components 2 (see FIG. 1) are sequentially mounted on the substrate 1. At this time, based on the recognition result of the component 2, the position of the head unit 50 (X direction, Y direction) and the rotation angle (R direction) of each mounting head 51 so that the component 2 is mounted at an appropriate position. The main control unit 71 (see FIG. 5) performs control for correcting the above. In this way, one cycle of the mounting operation is completed, and thereafter, the above operation is repeated based on the mounting program.

  Further, the component mounting apparatus 100 can image six components 2 at a time. In this case, in the example shown in FIG. 3, by collecting the components 2a in one nozzle row (nozzle group 5a), the two components 2a and the four components 2b are imaged at the same time (one imaging ( Scan operation). Further, the camera center imaging for the component 2a and the offset imaging for the component 2b are simultaneously performed. On the other hand, for example, when the component 2a is interspersed with the nozzle row on one side (nozzle group 5a) and the nozzle row on the other side (nozzle group 5b) without applying the present invention, the component recognition accuracy In order to maintain the above, the center-of-camera imaging of the component 2a is repeated in each nozzle row (a scan operation in the camera-center imaging along the imaging line A and a scan operation in the camera-center imaging along the imaging line B). Need to perform the imaging operation). Thus, in the case where the present invention is applied as compared to the case where the present invention is not applied, the number of imaging sequences for one suction group (maximum of six parts 2) is reduced to half the number of times of conventional (from two times). 1), and the tact time of the imaging operation can be surely reduced.

  In the first embodiment, as described above, the head unit 50 is arranged in the imaging unit 60 in a state where the component 2a is allocated to the head unit 50 so that the component 2a is aligned on the imaging line A extending in the X direction. By configuring the main control unit 71 to control the imaging of the components 2a and 2b arranged on the imaging lines A and B while moving in the X1 direction with respect to the (camera unit 61), the head unit By devising the adsorption order (assignment) of the components 2 to 50 (each nozzle 5), the components 2a having relatively low component recognition accuracy are collected on a specific imaging line A and imaged in a grouped state. The component 2b having relatively high component recognition accuracy is arranged on the same imaging line A as the grouped component 2a or on the parallel imaging line B, and imaging of the component 2a is performed. May be both captured in one sequence (one scanning operation). In other words, even when the components 2a and 2b having different component recognition accuracy are mixed in the components 2 to be imaged, the components are based on the imaging conditions capable of appropriately capturing each component in the common imaging sequence. 2a and the component 2b can be individually imaged and recognized accurately. Thereby, the imaging time of the component 2 (component 2a and component 2b) can be shortened, maintaining the recognition accuracy of the component 2 (component 2a and component 2b).

  In the first embodiment, the main control is performed so as to perform control of imaging the component 2a and the component 2b arranged on the imaging lines A and B by one imaging operation by the imaging unit 60 (camera unit 61). Part 71 is configured. In this way, even if the components 2 (component 2a and component 2b) having different component recognition accuracy are arranged across the imaging lines A and B, each can be imaged by one imaging operation. 2 (part 2a and part 2b) can be reliably shortened while maintaining the recognition accuracy.

  In the first embodiment, the camera unit 61 (imaging unit 60) includes an imaging region 65a including the imaging center of the camera unit 61 and imaging regions 65b on both outer sides of the imaging region 65a. The two parts 2a arranged on the imaging line A in the state where the imaging center of the sensor 65) and the center of the nozzle 5 are substantially matched are imaged in the imaging area 65a, and at the same time, the imaging center of the camera unit 61 By imaging the three components 2b in the imaging region 65b with the center of the nozzle 5 being offset in the Y1 direction by a distance D1, the components 2a and 2b arranged on the imaging lines A and B are captured by the camera. The main control unit 71 is configured to perform control of imaging with one imaging operation by the unit 61 (imaging unit 60). As a result, the component 2a requiring higher recognition accuracy can be accurately imaged in the imaging region 65a (imaging center of the camera unit 61), and at the same time, the imaging region 65b far from the imaging center of the camera unit 61 can be used effectively. Thus, the part 2b can be appropriately imaged. Therefore, the recognition accuracy based on the imaging result of all the components 2 (component 2a and component 2b) to be imaged can be maintained high.

  In the first embodiment, the plurality of (six) nozzles 5 are displaced in the Y1 direction, which is arranged in the X direction, and in the Y1 direction substantially orthogonal to the X direction in plan view with respect to the nozzle group 5a. And a nozzle group 5b arranged along the X direction. Then, in a state where the two components 2a are attracted to the nozzle group 5a and the four components 2b are attracted to the nozzle group 5a (one) and the nozzle group 5b (three), the components 2a and 2b are The main control unit 71 is configured to perform control for imaging with one imaging operation. As a result, the two components 2a can be easily imaged along the imaging line A on the nozzle row in a state where the two components 2a are collected in the nozzle group 5a, and three of the four components 2b. The component 2b can be easily imaged along the imaging line B on the nozzle row in a state where the individual components 2b are collected in the nozzle group 5b. That is, in the component mounting apparatus 100 including a tandem head in which two nozzle rows (nozzle group 5a and nozzle group 5b) are arranged in parallel in one head unit 50, the component 2 (component 2a and component 2b) is recognized. The effect of shortening the imaging time while maintaining accuracy can be easily obtained.

(Second Embodiment)
Next, a second embodiment will be described with reference to FIG. 1, FIG. 6, and FIG. In the second embodiment, an example in which the present invention is applied to a component mounting operation of a component mounting apparatus 200 including two rotary heads 255 will be described. In the figure, components similar to those in the first embodiment are denoted by the same reference numerals as those in the first embodiment.

  In the component mounting apparatus 200 according to the second embodiment of the present invention, as shown in FIG. 6, two rotary heads 255 are attached to the lower surface side of the head unit 250 side by side in the X direction. In each rotary head 255, a plurality of (eight) nozzles 6 (see FIG. 7) are arranged circumferentially in plan view via the mounting head 256. The nozzles 6 are arranged at intervals of about 45 degrees along the rotation direction R of the rotary head 255, and the positions of the nozzles 6 are freely moved (adjusted) along the circumferential direction. ing. The head unit 250 is an example of the “head portion” in the present invention.

  Also in the component mounting apparatus 200, the component 2 immediately before mounting taken out from the component supply units 30 and 40 by the head unit 250 (rotary head 255) is used for the imaging unit 60 as in the component mounting apparatus 100 (see FIG. 1). And is configured to be imaged from the lower surface side (Z1 side).

  Here, in the second embodiment, the following characteristic method (the operation content of the rotary head 255) is applied to the imaging method of the component 2 adsorbed to each nozzle 6.

  Specifically, as shown in FIG. 7, the nozzles 6 that face each other along the diametrical direction passing through the rotation center P of the rotary head 255 are applied to the components 2 a belonging to components with relatively low component recognition accuracy based on the imaging result. The operation of rotating the rotary head 255 so that the component 2a attracted to the nozzle 5 and disposed on the imaging line C along the X direction is executed based on a command from the main control unit 71. Further, the rotary head 255 is operated so that the component 2b belonging to the components with relatively high component recognition accuracy is adsorbed to the nozzle 6 on which the component 2a is not adsorbed. In this case, the rotational position where the component 2a is attracted by the rotary head 255 on the X1 side in FIG. 7 and the rotational position where the component 2a is attracted by the rotary head 255 on the X2 side are both arranged on the imaging line C. Each rotary head 255 is rotated and stopped. That is, in FIG. 7, a state is formed in which four components 2a are arranged in a line in the X direction along the imaging line C. Here, the imaging line C corresponds to a straight line passing through the rotation center P of the rotary head 255 in the X direction.

  In this state, the four components 2a arranged on the imaging line C while moving the head unit 250 (rotary head 255) in the X1 direction with respect to the camera unit 61 (imaging unit 60), and the imaging line B1 , B2, B3, and B4 are configured so that the twelve components 2b arranged in one imaging operation by the camera unit 61 are executed based on a command from the main control unit 71. Yes. The imaging lines B1 to B4 and the imaging line C are examples of “a plurality of imaging lines” in the present invention, and the imaging line C is an example of “predetermined imaging lines” in the present invention.

  That is, in the component mounting apparatus 200, in one imaging operation by the camera unit 61, the camera center imaging for the four components 2a adsorbed by the nozzle 6 (the imaging center of the camera unit 61 and the center of each nozzle 6 in the Y direction). With the head unit 250 moved in the X1 direction with respect to the camera unit 61) and offset imaging (12 directions) for the twelve components 2b adsorbed by the nozzle 6. In this example, the rotary head 255 is moved in the X1 direction with respect to the camera unit 61 while the imaging center of the camera unit 61 and the center of each nozzle 6 are shifted by a distance D2 and a distance D2 + D3). It can be performed simultaneously.

  In the example shown in FIG. 7, the components 2 a are arranged only on the imaging line C, and all (16 pieces) are obtained in one imaging operation in a state where the components 2 b are attracted to the nozzles 6 corresponding to the other imaging lines. However, depending on the mounting process, two or more (three to a maximum of eight) parts 2a may be attracted to one rotary head 255. Even in such a case, in each rotary head 255, the pair of components 2a are adsorbed as much as possible to the nozzles 6 facing each other at 180 degrees with respect to the rotation center P, and the nozzles 6 that have always adsorbed the unimaged components 2a It is preferable to take an image every time after controlling the operation of the head unit 250 so that the two rotary heads 255 are arranged in a line on the imaging line C. Other configurations of the component mounting apparatus 200 are the same as those in the first embodiment.

  In the second embodiment, as described above, the component mounting apparatus 200 includes the two rotary heads 255 in which the plurality of nozzles 6 are arranged circumferentially in plan view. Then, the component 2a is adsorbed by the nozzles 6 facing each other along the diameter direction passing through the rotation center P of each rotary head 255, and the component 2a adsorbed by the nozzle 6 is arranged on the imaging line C along the X direction. In the state where each rotary head 255 is rotated, the head unit 250 (rotary head 255) is arranged on the imaging line C and the imaging lines B1 to B4 while moving the head unit 250 (rotary head 255) in the X1 direction with respect to the imaging unit 60. The main control unit 71 is configured to perform control for imaging the component 2a and the component 2b by one imaging operation. Thus, the component 2a can be easily moved along the imaging line C passing through the two nozzles 6 in a state where the component 2a is adsorbed by the two nozzles 6 facing each other in the diametrical direction in each rotary head 255. In addition to being able to image, the component 2b can be easily imaged together with the component 2a in a state where the twelve components 2b are attracted to the nozzles 6 other than the two nozzles 6. That is, in the component mounting apparatus 200 including the rotary head 255 in which a plurality of nozzles 6 are arranged in a circle, the effect of shortening the imaging time while maintaining the recognition accuracy of the component 2 (component 2a and component 2b) is achieved. Can be easily obtained. The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

(Third embodiment)
Next, a third embodiment will be described with reference to FIGS. 1 and 8. In the third embodiment, in the component mounting apparatus 105 including the head unit 50 configured in the same manner as in the first embodiment, the component 2 (component 2a and component 2b) is captured by an imaging operation different from that in the first embodiment. An example in which imaging is performed will be described. In the figure, components similar to those in the first embodiment are denoted by the same reference numerals as those in the first embodiment.

  In the component mounting apparatus 105 (see FIG. 1) according to the third embodiment of the present invention, as shown in FIG. 8, an intermediate position between the nozzle group 5a and the nozzle group 5b separated from each other by a distance D4 in the Y direction (both 2 adsorbed to the nozzle group 5a side in a state in which the center line E along the distance D4 (= D1 / 2) from the nozzle 5 and the imaging center of the camera unit 61 (linear sensor 65) are substantially matched. Each component 2a and the four components 2b sucked on the nozzle group 5a side and the nozzle group 5b side are configured to take an image by one scanning operation. That is, the two components 2a (and one component 2b) are arranged on the imaging line F that is offset by a distance D4 in the Y2 direction with respect to the center line E, and are arranged on the Y2 side of the linear sensor 65. The offset image is captured in the imaging region 65b, and the three components 2b are arranged on the imaging line G that is offset by a distance D4 in the Y1 direction with respect to the center line E, on the Y1 side of the linear sensor 65. Offset imaging is performed in the imaging area 65b. The imaging line F and the imaging line G are examples of the “plurality of imaging lines” in the present invention, and the imaging line F is an example of the “predetermined imaging line” in the present invention. "

  At this time, in the third embodiment, the illumination unit 63 has an illumination light irradiation condition for the component 2a when imaging the component 2a and an illumination light irradiation condition for the component 2b when imaging the component 2b. It is configured to be switchable. That is, when the component 2a passes over the imaging region 65b on the Y2 side, illumination light adjusted so as to capture the component 2a most clearly is irradiated, and the component 2b passes over the imaging region 65b on the Y1 side. In this case, the illumination light adjusted so that the part 2b is imaged most clearly is irradiated. Note that one component 2b on the nozzle group 5a side is appropriately imaged at a level that does not affect the component recognition accuracy even under the illumination light irradiation conditions for the component 2a in the same nozzle row. That is, in the component mounting apparatus 105, component recognition is performed by devising illumination light irradiation conditions (imaging conditions) by the illumination unit 63 by adding positional strength to the light intensities of the flat illumination unit 63a and the inclined illumination unit 63b. It is assumed that the component 2a having relatively low accuracy can be appropriately imaged by offset imaging.

  In the third embodiment, when the linear sensor 65 has a width W1 (the width of the imaging region 65b) in the X direction, the components adjacent to each other in the assignment operation of the component 2 by the head unit 50 before imaging. The operation of adsorbing the component 2a to the nozzle group 5a and adsorbing the component 2b to the nozzle group 5b is performed so that 2a and the component 2b are separated from each other by a width W1 or more along the X direction. That is, as shown in FIG. 8, when the allocation state of the component 2 to the head unit 50 is viewed in order from the X1 side to the X2 side, the first component (most X1 side) 2a and the second (second) component are displayed. The component 2b is attracted to each other with a distance W2 (W2> W1), and the component 2b and the next (third) component 2a are attracted to each other with a distance W3 (W3> W1). . Similarly, the third component 2a and the fourth component 2b are separated from each other by a distance W4 (W4> W1), and the fourth component 2b and the fifth component 2b are separated from each other by a distance W5 (W5). > W1) apart and adsorbed to each other. The fifth part 2b and the sixth (most X2 side) part 2b are separated from each other by a distance W6 (W6> W1). Under such an assigned state, the head unit 50 is moved in the X1 direction with respect to the imaging region 65b of the linear sensor 65 extending in a line, and the illumination light irradiation conditions for the component 2a and the component 2b are alternately switched. However, it is configured to perform control for imaging the component 2a and the component 2b by one imaging operation. In FIG. 8, in order to clearly show that the distance between parts (width W <b> 2 to width W <b> 6) is larger than the width W <b> 1 of the linear sensor 65 when the head unit 50 moves onto the linear sensor 65. A state in which the outer shape of the sensor 65 (shown by a broken line) is arranged between components is illustrated.

  Thus, by devising the allocation of the component 2a and the component 2b to the head unit 50 (each nozzle 5), the imaging region 65b of the imaging unit is provided between the component 2a and the component 2b adjacent to each other in the X direction. Since the gaps (widths W2 to W6) having the width W1 or more are secured, the component 2a and the component 2b do not overlap with the direction of the imaging line F (X direction). In other words, the illumination light irradiation condition when imaging the component 2a along the imaging line F on the nozzle row in a state where the component 2a is collected in the nozzle group 5a, and the component 2b are collected in the nozzle row of the nozzle group 5b. In this state, the illumination light irradiation conditions when imaging the component 2b along the imaging line G on the nozzle row are switched reliably for each component passing on the linear sensor 65 (imaging region 65b). It is configured so that it is possible to image the parts.

  Unlike the above-described third embodiment, if the adjacent part 2a and the part 2b are in an assigned state in which there is an overlapping part in the X direction, the part 2a (or part 2b) Since a situation occurs in which a part of the component 2b (or the component 2a) is imaged under the irradiation conditions, each component 2 cannot be imaged with high definition. Therefore, the imaging operation and its effect in the third embodiment cannot be properly obtained unless an allocation state is ensured in which the distance between adjacent parts is secured to the width W1 or more of the imaging region 65b.

  In the third embodiment, as described above, the illumination unit 63 configured to be able to switch between the illumination condition of the illumination light to the component 2a and the illumination condition of the illumination light to the component 2b at the time of imaging is provided. The linear sensor 65 includes an imaging region 65b having a width W1 in the X direction and extending in a line shape in the Y direction. Then, in a state where the component 2a is adsorbed to the nozzle group 5a and the component 2b is adsorbed to the nozzle group 5b so that the adjacent components 2a and 2b are separated from each other by a width W1 or more along the X direction. 50 is moved in the X1 direction with respect to the imaging region 65b extending in a line shape, and control is performed for imaging the component 2a and the component 2b in one imaging operation while switching the illumination light irradiation conditions for the component 2a and the component 2b. The main control unit 71 is configured to perform this. Thereby, by devising the allocation of the component 2a and the component 2b to the head unit 50 (each nozzle), the imaging region width W1 or more of the imaging unit 60 is between the component 2a and the component 2b adjacent to each other in the X direction. Therefore, the component 2a and the component 2b do not overlap with the direction of the imaging line A (X direction). That is, the illumination light irradiation condition when imaging the component 2a along the imaging line F on the nozzle row in a state where the component 2a is collected in the nozzle group 5a, and the state where the component 2b is collected in the nozzle group 5b Thus, the irradiation condition of the illumination light when imaging the component 2b along the imaging line G on the nozzle row is reliably switched for each component 2 passing on the imaging unit 60 (imaging region extending in a line shape). Each component 2 can be imaged. Therefore, each component 2 (component 2a and component 2b) can be accurately imaged by one imaging operation, and the imaging time can be shortened. The remaining effects of the third embodiment are similar to those of the aforementioned first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first embodiment, the example in which the allocation operation for attracting the component 2a to the nozzle 5 on the nozzle group 5a side corresponding to the imaging line A is shown, but the present invention is not limited to this. Absent. That is, an allocation operation is performed such that the component 2a is attracted to the nozzle 5 on the nozzle group 5b side corresponding to the imaging line B, and for the component 2b, the nozzle 5 (nozzle group 5b and The component 2a arranged on the imaging line B and the component 2b arranged on the imaging line B and / or the imaging line A are picked up by the camera unit 61 in a state of being adsorbed to the nozzle group 5a). May be. In this case, the component 2a and the component 2b can be captured in a single imaging operation in a state where the imaging center of the camera unit 61 (linear sensor 65) and the center of the nozzle 5 on the nozzle group 5b side that attracts the component 2a are substantially matched. It is preferable to image. In this case, the imaging line B is an example of the “predetermined imaging line” in the present invention.

  In the first and third embodiments, an example in which the head unit 50 in which two nozzle rows (nozzle groups 5a and 5b) are arranged in tandem is applied to the component mounting apparatus 100 (105) has been described. The invention is not limited to this. That is, the present invention may be applied to a component mounting apparatus including a head unit in which three or more nozzle rows are arranged in tandem.

  In the first and third embodiments, the example in which each of the nozzle groups 5a and 5b is configured by the three nozzles 5 has been described. However, the present invention is not limited to this. Each of the nozzle groups 5a and 5b may be constituted by two or four or more nozzles 5. Moreover, in the said 2nd Embodiment, although the example which comprised one rotary head 255 by the eight nozzles 6 was shown, this invention is not limited to this. One rotary head 255 may be constituted by a plurality of nozzles 6 other than eight.

  In the second embodiment, the example in which the head unit 250 including the two rotary heads 255 is applied to the component mounting apparatus 200 has been described. However, the present invention is not limited to this. That is, the present invention may be applied to a component mounting apparatus that includes three or more rotary heads.

  Moreover, in the said 1st Embodiment, although shown about the example in which each nozzle 5 in the head unit 50 was arrange | positioned in zigzag form, this invention is not limited to this. That is, the present invention may also be applied to the operation control of the head unit in which the nozzle group 5a and the nozzle group 5b are arranged in a grid (a grid pattern) even in the same tandem arrangement.

  Moreover, in the said 1st-3rd embodiment, although shown about the example which comprised the camera part 61 using the linear sensor 65, this invention is not limited to this. The camera unit 61 may be configured using, for example, a two-dimensional image sensor (CCD area sensor) other than the linear sensor. Since the camera unit 61 having a two-dimensional image sensor has an electronic shutter function, at each imaging timing when the component 2 adsorbed to each nozzle 5 is positioned above the imaging unit 60 in the X direction by setting the shutter speed. However, since it is possible to perform imaging without reducing the moving speed of the head unit 50, the time for recognizing the plurality of components 2 can be shortened.

  In the first to third embodiments, the component 2 sucked by the nozzle 5 (6) is moved while moving the head unit 50 (250) in the X1 direction with respect to the imaging unit 60 fixed to the base 10. Although an example in which the component mounting apparatus 100 (105, 200) is configured to capture an image is shown, the present invention is not limited to this. That is, the part 2 adsorbed by the nozzle 5 (6) may be imaged while moving the head unit 50 (250) in the X2 direction with respect to the imaging unit 60.

  In the first to third embodiments, the component 2 sucked by the nozzle 5 (6) is moved while moving the head unit 50 (250) in the X1 direction with respect to the imaging unit 60 fixed to the base 10. Although an example in which the component mounting apparatus 100 (105, 200) is configured to capture an image is shown, the present invention is not limited to this. For example, the component 2 adsorbed by the nozzle 5 is imaged while the imaging unit 60 configured to be movable on the base 10 is relatively moved in the X direction with respect to the head unit 50 stationary at a predetermined position. The component mounting apparatus 100 may be configured.

1 substrate 2 component 2a component (first component)
2b Parts (second parts)
5, 6 Nozzle 5a (Nozzle group) First row nozzle group 5b (Nozzle group) Second row nozzle group 50, 250 Head unit (head portion)
61 Camera unit (imaging unit)
63 Illuminator 65a Imaging area (first imaging area)
65b Imaging area (second imaging area)
71 Main control unit (control unit)
100, 105, 200 Component mounting device 255 Rotary head

Claims (9)

A plurality of nozzles are attached, and a head unit capable of mounting a component sucked through the plurality of nozzles on a substrate;
An imaging unit for imaging the component adsorbed by the head unit;
A control unit that performs control of imaging the component by the imaging unit,
The component has a relatively unclear outer shape in the captured image, so that the component recognition accuracy based on the imaging result is relatively low, and the outer shape in the captured image is relative to the first component. And the second component having a relatively high component recognition accuracy due to being clear,
The control unit is arranged such that the imaging center of the imaging unit and the center of the nozzle are aligned on one imaging line among the plurality of imaging lines in which the first component extends in the first direction. The first part is assigned to the head part, and at least the second part is assigned on an imaging line other than the one imaging line, the head part is placed on the imaging part with the first part. A component mounting apparatus configured to perform control of imaging the first component and the second component arranged on the plurality of imaging lines while relatively moving in the direction of 1.   The control unit is configured to perform control of imaging the first component and the second component arranged on the plurality of imaging lines by one imaging operation by the imaging unit. Item 2. The component mounting apparatus according to Item 1. The imaging unit includes a first imaging region including an imaging center of the imaging unit, and a second imaging region outside the first imaging region,
The control unit captures an image of the imaging unit at the same time as imaging the first component arranged on an imaging line in which an imaging center of the imaging unit and a center of the nozzle substantially coincide with each other. The first component and the second component arranged on the plurality of imaging lines by imaging the second component in the second imaging region in a state where the center and the center of the nozzle are offset by a predetermined distance. 3. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is configured to perform control for capturing the image with one imaging operation by the imaging unit. The head portion is a rotary head in which the plurality of nozzles are arranged circumferentially in a plan view.
Wherein, said first component sucked to the nozzle together with the first component is adsorbed to the nozzle facing each other along a diameter direction passing through the rotation center of the rotary head along the first direction Then, the rotary head is rotated with respect to the imaging unit in a state where the rotary head is rotated so that the imaging center of the imaging unit and the center of the nozzle are arranged on substantially the same imaging line. It is comprised so that the control which images the said 1st components and the said 2nd components arrange | positioned on the said several imaging line may be image | photographed by one imaging operation | movement, making it relatively move in this direction. 4. The component mounting apparatus according to any one of 3 above. A plurality of nozzles are attached, and a head unit capable of mounting a component sucked through the plurality of nozzles on a substrate;
An imaging unit for imaging the component adsorbed by the head unit;
A control unit that performs control of imaging the component by the imaging unit,
The component has a relatively unclear outer shape in the captured image, so that the component recognition accuracy based on the imaging result is relatively low, and the outer shape in the captured image is relative to the first component. And the second component having a relatively high component recognition accuracy due to being clear,
The control unit is arranged such that the imaging center of the imaging unit and the center of the nozzle are arranged on another imaging line in which the first component extends among the plurality of imaging lines extending in the first direction. It performs assignment of the first component to said head portion, in a state of performing the allocation to the second component at least on the other on the imaging lines other than the image pickup lines, each of said first component and said second component irradiated by switching the irradiation bright light tailored to the and the head portion in the first direction to the first component disposed on the plurality of image pickup lines while relatively moving with respect to the imaging unit A component mounting apparatus configured to perform control for imaging a second component. The plurality of nozzles are arranged in a first row nozzle group arranged along the first direction, and in a second direction substantially orthogonal to the first direction in plan view with respect to the first row nozzle group. A second row nozzle group disposed along the first direction in a shifted state,
The controller causes the first part to be attracted to either the first row nozzle group or the second row nozzle group, and the second part is attached to the first row nozzle group or the second row nozzle group. 6. Any one of claims 1 to 3 and 5, wherein the first part and the second part are controlled to be imaged by one imaging operation in a state of being attracted to either one or the other. The component mounting apparatus according to claim 1. The plurality of nozzles are arranged in a first row nozzle group arranged along the first direction, and in a second direction substantially orthogonal to the first direction in plan view with respect to the first row nozzle group. A second row nozzle group arranged along the first direction in a shifted state,
Further comprising the said illumination unit and the irradiation condition of the illumination light is configured to be switchable irradiation conditions of the illumination light to the second component to the first component at the time of imaging,
The imaging unit includes an imaging region having a predetermined width in the first direction and extending in a line shape in the second direction,
The control unit is in a state in which the first part is allocated to the head unit so that the imaging center of the imaging unit and the center of the nozzle are aligned on the other imaging line that does not substantially match, and The first part is arranged in the first row nozzle group or the second row nozzle group so that the first part and the second part adjacent to each other are separated by the predetermined width or more along the first direction. In the state where the second part is attracted to either one or the other of the first row nozzle group or the second row nozzle group while being attracted to any one of them, the head portion is moved to the imaging region extending in the line shape In contrast, the first component and the second component are imaged in a single imaging operation while being relatively moved in the first direction and switching the illumination light irradiation conditions for the first component and the second component. Control It is configured Migihitsuji component mounting apparatus according to claim 5. When imaging components arranged on a plurality of imaging lines extending along the first direction while moving the head portion of the component mounting apparatus relative to the imaging unit in the first direction, The first part having a relatively low outline shape and relatively low component recognition accuracy based on the imaging result, and the external form in the captured image being relatively clearer than the first part one component recognition accuracy is the first part of said parts including a relatively high second part, in which the center of the imaging center and Bruno nozzle of the imaging unit of the plurality of imaging lines substantially coincide In the component mounting apparatus, comprising: allocating the first component to the head unit so as to be aligned on the imaging line, and allocating the second component on an imaging line other than at least the one imaging line. Parts of the allocation method to the head part. When imaging components arranged on a plurality of imaging lines extending along the first direction while moving the head portion of the component mounting apparatus relative to the imaging unit in the first direction, The first part having a relatively low outline shape and relatively low component recognition accuracy based on the imaging result, and the external form in the captured image being relatively clearer than the first part other first component of said parts, where the center of the imaging center and Bruno nozzle of the imaging unit of the plurality of imaging lines do not substantially match the component recognition accuracy and a relatively high second component The first component is allocated to the head portion so as to be aligned on the imaging line, and at least the second component is allocated on the imaging line other than the other imaging line. Imaging the part While relatively moving in the first direction with respect to, comprising the step of irradiating switching the irradiation bright light that is adjusted for each of the first component and the second component, to the head unit in the component mounting apparatus The part assignment method.

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