JP5620807B2 - Three-dimensional shape measuring device, component transfer device, and three-dimensional shape measuring method - Google Patents

Description

  The present invention relates to a three-dimensional shape measurement device, a component transfer device, and a three-dimensional shape measurement method, and more particularly, includes an illumination unit that projects pattern light having a sinusoidal light intensity distribution onto a moving measurement object. The present invention relates to a three-dimensional shape measuring device, a component transfer device, and a three-dimensional shape measuring method.

  2. Description of the Related Art Conventionally, a three-dimensional shape measuring method including an illumination unit that projects pattern light having a sinusoidal light intensity distribution on a moving measurement object is known (see, for example, Patent Document 1).

  Patent Document 1 discloses a continuous moving object shape measuring method for measuring the shape of a moving object using a lattice projection device and a line sensor. In this continuous moving object shape measurement method, the illumination light whose light intensity distribution (brightness pattern) is adjusted to a cosine wave shape is projected onto the moving measurement object, and is arranged along the moving direction of the measurement object. The measurement object is sequentially imaged through the four line sensors, and then the phase analysis based on the imaged line image (linear image) is performed, so that the shape (height information) of the measurement object is obtained. Have gained.

Japanese Patent No. 3629532

  However, in the continuously moving object shape measuring method described in Patent Document 1, a moving object is imaged using a line sensor (line-shaped imaging region), so that each line image has a sufficient density value. There is a risk of being acquired without being able to do so. That is, when a moving measurement object is imaged, one line sensor of N pixels receives compared to the amount of light (N × M) received by a two-dimensional sensor camera spread in a plane of N pixels × M rows. The amount of light (N) decreases in proportion to the ratio of the exposure area (N) of the line sensor to the exposure area (N × M) of the two-dimensional sensor camera (1 / M times). Therefore, image data obtained by imaging a moving measurement object with a single line sensor (line-shaped imaging region) has a density value (pixel brightness) comparable to that of image data obtained by a two-dimensional sensor camera. Therefore, it is necessary to set the illumination light to a higher luminance (M times). For this reason, there is a problem that illumination light having a higher luminance than that of conventionally used illumination light is required.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to perform imaging of a moving measurement object using a linear (linear) imaging region. Another object is to provide a three-dimensional shape measuring device, a component transfer device, and a three-dimensional shape measuring method capable of acquiring a bright image without using high-intensity illumination light.

Means for Solving the Problems and Effects of the Invention

  In order to achieve the above object, a three-dimensional shape measuring apparatus according to a first aspect of the present invention includes a plurality of imaging regions that are arranged in a first direction and extend in a line shape in a second direction orthogonal to the first direction. An imaging unit that images the measurement object, and an illumination unit that projects illumination light having a sinusoidal light intensity distribution toward the measurement object that moves relative to the imaging unit in the first direction; When the imaging unit sequentially captures the same part of the measurement object moving in the first direction using each line-shaped imaging region, the image signal of the same part of the measurement object has a cycle of the illumination light. And a control unit that performs control for integration within a range of ½ or less.

  In the three-dimensional shape measuring apparatus according to the first aspect of the present invention, as described above, the imaging unit including a plurality of imaging regions extending in a line shape, and the imaging unit uses the respective imaging regions to When the same part of the measurement object that moves relatively in one direction is sequentially imaged, the image data after completion of the integration is provided by a control unit that performs control to integrate image signals of the same part of the measurement object. Is a state of image data in which the image signals of the same part received by the individual line-shaped imaging areas are integrated by the number of line-shaped imaging areas. Thereby, the density value (brightness) of the integrated image data is integrated (added) compared to the density value (brightness) of the image data received by only one line-shaped imaging region. Minutes can have larger values. That is, it is possible to avoid acquiring image data that does not have a sufficient density value (brightness) due to insufficient light reception. As a result, a bright image can be acquired without using high-intensity illumination light when imaging a measurement object that moves using a linear (linear) imaging region. In addition, even if the speed of moving in the first direction is increased, the brightness of the image data is suppressed from decreasing due to the integration process, so when using illumination light having the same luminance, Thus, the three-dimensional shape measurement of the measurement object moving in the first direction at a higher speed can be performed.

  In the three-dimensional shape measuring apparatus according to the first aspect, the imaging unit sequentially captures the same portion of the measurement object that moves relative to the imaging unit in the first direction using each linear imaging region. In this case, by providing a control unit that performs control to integrate the image signal of the same part of the measurement object in a range of ½ or less of the period of the illumination light, each linear imaging region receives light. The effect of the integrated image signal processing can be appropriately obtained. Here, when integrating individual image signals that have received sinusoidal illumination light applied to the measurement object, the integration range from the start of integration to the end of integration is one-half of the period of the illumination light. In some cases, the largest density value (brightness) can be obtained. That is, it means that the integral value (concentration value) obtained by integrating the sine wave in an integration interval of π radians (1/2 cycle) from an arbitrary integration start point is the largest value. Therefore, the integration effect can be maximized by sequentially integrating the image signals by setting the integration interval to one half of the cycle of the illumination light. Even when the integration interval is shorter than half the illumination light cycle (less than π radians), an image having a sufficient density value can be easily obtained by integration.

  In the three-dimensional shape measurement apparatus according to the first aspect described above, preferably, the control unit synchronizes with the moving speed of the measurement object relative to the imaging unit in the first direction, and each line shape of the imaging unit is included. The same part of the measurement object is sequentially imaged along the first direction using the imaging region of the image, and the image signal of the same part of the measurement object is integrated within a range of ½ or less of the period of the illumination light. It is configured to perform control. If comprised in this way, the same part of a measurement object can be reliably light-received to the pixel area of the substantially same position of each line-shaped imaging area. Thereby, an image having a sufficient density value (brightness) can be reliably acquired after integration in a range of ½ or less of the period of illumination light.

  In the three-dimensional shape measuring apparatus according to the first aspect described above, preferably, the imaging unit includes a plurality of imaging parts having a plurality of line-shaped imaging regions, and each imaging part images a period of illumination light. Arranged along the first direction for each interval divided by the number of portions, the control unit obtains the image signals by integrating the image signals in a range of half or less of the period of the illumination light in each imaging portion. By performing phase analysis based on the obtained image data, it is configured to perform control for acquiring height information of the measurement object. If comprised in this way, a phase analysis can be performed using the image data from which the density value (brightness) was appropriately obtained in each imaging part. Thereby, the height information of the measurement object can be obtained with high accuracy.

  In the three-dimensional shape measuring apparatus according to the first aspect, preferably, the imaging unit is a two-dimensional image sensor configured to be able to cut out an image signal corresponding to each linear imaging region, and the control unit After sequentially capturing the same part of the measurement object using a two-dimensional image sensor, an image signal in which the same part of the measurement object is imaged is cut out, and the image signal is within a half or less of the period of the illumination light It is comprised so that the control which integrates by may be performed. As described above, even when a two-dimensional image sensor having a two-dimensional spread is used, an image signal integration process can be performed by appropriately controlling an imaging operation for the two-dimensional image sensor. Therefore, for example, even when the light intensity is insufficient in the illumination unit, it is possible to acquire image data having a sufficient density value (brightness).

  In the three-dimensional shape measuring apparatus according to the first aspect, preferably, the imaging unit is a TDI type sensor having a plurality of line-shaped imaging regions, and the control unit is a line-shaped sensor for each of the TDI type sensors. The same part of the measurement object is sequentially imaged using the imaging area, and the image signals of the same part received by the individual line-shaped imaging areas are sequentially integrated within a range of ½ or less of the period of the illumination light. It is configured to perform control. As described above, even when a TDI line sensor is used, the image signal integration processing can be easily performed by appropriately controlling the imaging operation of the plurality of line-shaped imaging regions.

  In the three-dimensional shape measuring apparatus according to the first aspect, the illumination light is preferably configured to be projected onto the measurement object in a state where the sinusoidal light intensity distribution is inclined by a predetermined angle from the second direction. The control unit illuminates the image projected at a predetermined angle when the imaging unit sequentially images the same part of the measurement object that moves relatively in the first direction using each imaging region. It is configured to perform control for integrating the image signals within a range of half or less of the period of light. If comprised in this way, compared with the case where illumination light is projected along a 2nd direction without having a predetermined angle, it will project on a measurement object by the part in which illumination light is inclined only a predetermined angle from a 2nd direction. The period of the illumination light (brightness / darkness / brightness pattern) can be extended in the first direction in which the measurement object moves. As a result, a large number of line-shaped imaging regions can be allocated to the range to be integrated as the luminance change period becomes longer, so the shape measurement (measurement target object) The accuracy of height detection can be further improved.

  A component transfer apparatus according to a second aspect of the present invention includes a head unit for transferring components, and a plurality of components arranged in a first direction and extending in a line in a second direction orthogonal to the first direction. An imaging unit including an imaging region and imaging a component; and an illumination unit that projects illumination light having a sinusoidal light intensity distribution toward a component that moves relative to the imaging unit in the first direction by the head unit; When the imaging unit sequentially captures the same part of the component that moves relatively in the first direction using each line-shaped imaging region, the image signal of the same part of the component has a cycle of the illumination light. And a control unit that performs control for integration within a range of ½ or less.

  In the component transfer apparatus according to the second aspect of the present invention, as described above, the imaging unit including a plurality of imaging regions extending in a line shape, and the imaging unit is first with respect to the imaging unit using each imaging region. When the same part of the measurement object that moves relative to the direction is sequentially imaged, the image data after the completion of the integration is provided with a control unit that performs control to integrate image signals of the same part of the measurement object. The image data of the same portion received by each line-shaped imaging region is in a state of image data obtained by integrating the number of the line-shaped imaging regions. Thereby, the density value (brightness) of the integrated image data is integrated (added) compared to the density value (brightness) of the image data received by only one line-shaped imaging region. Minutes can have larger values. That is, it is possible to avoid acquiring image data that does not have a sufficient density value (brightness) due to insufficient light reception. As a result, a component transfer apparatus capable of acquiring a bright image without using high-intensity illumination light even when imaging a measurement object that moves using a linear (linear) imaging region. Can be realized. Further, even if the speed of moving in the first direction is increased, the brightness of the image data is suppressed from decreasing due to the integration process. Therefore, when illumination light having the same luminance is used, component transfer is performed. It is possible to measure a three-dimensional shape of a part moving in the first direction at a higher speed than the apparatus.

  In the component transfer apparatus according to the second aspect, the imaging unit sequentially images the same portion of the measurement object that moves relative to the imaging unit in the first direction using each linear imaging region. In some cases, each line-shaped imaging region receives light by including a control unit that performs control to integrate the image signal of the same part of the measurement object in a range of ½ or less of the period of the illumination light. The effect of the image signal integration process can be obtained appropriately.

  A three-dimensional shape measurement method according to a third aspect of the present invention uses a step of projecting illumination light having a sinusoidal light intensity distribution toward a measurement object, and each of a plurality of imaging regions extending in a line shape. When sequentially imaging the same part of the measurement object that moves relative to the imaging region in a predetermined direction, the image signal of the same part of the measurement object is a range that is less than or equal to one-half of the period of the illumination light. And a step of accumulating.

  In the three-dimensional shape measurement method according to the third aspect of the present invention, as described above, the measurement object that moves relative to the imaging region in a predetermined direction using each of the plurality of imaging regions extending in a line shape. When sequentially imaging the same portion, the image data of the same portion of the measurement object is integrated, so that the image data after the integration is the image signal of the same portion received by each linear imaging region Is the state of the image data integrated by the number of line-shaped imaging regions. Thereby, the density value (brightness) of the integrated image data is integrated (added) compared to the density value (brightness) of the image data received by only one line-shaped imaging region. Minutes can have larger values. That is, it is possible to avoid acquiring image data that does not have a sufficient density value (brightness) due to insufficient light reception. As a result, three-dimensional shape measurement that can acquire a bright image without using high-intensity illumination light even when imaging a measurement object that moves using a linear (linear) imaging region A method can be realized. Even if the speed of movement in a predetermined direction is increased, the brightness of the image data is suppressed from decreasing due to the integration process. Therefore, when using illumination light having the same luminance, the speed is higher. The three-dimensional shape measurement of the moving measurement object can be performed. Also, by integrating the image signal of the same portion of the measurement object within a range of ½ or less of the period of the illumination light, the integration process of the image signals received by the individual line-shaped imaging regions is provided. The effect of can be acquired appropriately.

It is the top view which showed the structure of the surface mounter by 1st Embodiment of this invention. It is a side view at the time of seeing the surface mounting machine in FIG. 1 along the Y2 direction. It is the block diagram which showed the structure on the control of the surface mounter by 1st Embodiment of this invention. It is a figure for demonstrating the structure of the component imaging device of the surface mounter by 1st Embodiment of this invention. It is the schematic diagram which showed the pattern light projected on a component by the illumination part, when a component imaging device images in the surface mount machine by 1st Embodiment of this invention. It is a figure for demonstrating the detailed structure of the two-dimensional image sensor provided in the component imaging device in the surface mounter by 1st Embodiment of this invention. It is a figure for demonstrating the operation | movement at the time of imaging components using the two-dimensional image sensor shown in FIG. It is a figure for demonstrating the relationship between the integration area (integration range) at the time of integrating a sine wave, and an integral value. It is a flowchart for demonstrating the processing flow at the time of a component imaging device imaging in the surface mounter by 1st Embodiment of this invention. It is a figure for demonstrating in detail the method of integrating | accumulating image data in the processing flow shown in FIG. It is a figure for demonstrating the detailed structure of the TDI sensor which comprises the imaging part provided in the component imaging device in the surface mounter by 2nd Embodiment of this invention. It is a conceptual diagram for demonstrating the function of the TDI sensor which comprises the imaging part shown in FIG. It is a figure for demonstrating in detail the usage method of a memory area when a TDI sensor performs TDI in the surface mounter by 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
First, the structure of the surface mounter 100 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 8 and FIG. The surface mounter 100 is an example of the “component transfer device” in the present invention.

  The surface mounter 100 is a device for mounting a component 120 on a printed circuit board (wiring board) 110 as shown in FIGS. 1 and 2. As shown in FIG. 1, the surface mounter 100 includes a base 1, a pair of conveyors 10 provided on the base 1 (front side of the paper), and an XY plane (paper surface) above the pair of conveyors 10. ) And a head unit 20 movable along the head. A plurality of tape feeders 130 for supplying the parts 120 are arranged on both sides (Y1 side, Y2 side) of the conveyor 10. The head unit 20 has a function of acquiring the component 120 from the tape feeder 130 and mounting the component 120 on the printed circuit board 110 on the conveyor 10. The component 120 is an example of the “measurement object” in the present invention.

  As shown in FIG. 3, the surface mounter 100 incorporates a control device 70 composed of a CPU and a substrate circuit in order to control the operation of each unit described below. The control device 70 is mainly configured by a main control unit 71, an axis control unit 72, an imaging control unit 73, an image processing unit 74, and an illumination control unit 75. The imaging control unit 73 is an example of the “control unit” in the present invention.

  The pair of conveyors 10 has a function of transporting the printed circuit board 110 in the horizontal direction (X direction). Further, the conveyor 10 is configured to be able to hold the printed circuit board 110 being conveyed in a state of being stopped at the mounting work position.

  The tape feeder 130 holds a reel (not shown) around which a tape holding a plurality of components 120 at a predetermined interval is wound. The tape feeder 130 is configured to supply the component 120 from the tip of the tape feeder 130 by feeding a tape that holds the component 120 by rotating the reel. Here, the component 120 is a small electronic component such as an IC, a transistor, a capacitor, and a resistor.

  The head unit 20 is configured to be movable in the X direction along the support portion 30. Specifically, the support unit 30 includes a ball screw shaft 31, a servo motor 32 that rotates the ball screw shaft 31, and a guide rail (not shown) extending in the X direction. Thereby, the head unit 20 is moved in the X direction together with the ball nut 21 to which the ball screw shaft 31 is screwed.

  Further, the support portion 30 is configured to be movable in the Y direction orthogonal to the X direction along a pair of rail portions 40 fixed on the base 1. Specifically, the rail portion 40 includes a guide rail 41 that supports both end portions (X direction) of the support portion 30 so as to be movable in the Y direction, a ball screw shaft 42 (see FIG. 1) extending in the Y direction, and a ball screw shaft. And a servo motor 43 (see FIG. 1) for rotating 42. Further, the support portion 30 is provided with a ball nut 33 (see FIG. 1) to which the ball screw shaft 42 is screwed. Thereby, the head unit 20 can be moved to any position along the XY plane on the base 1.

  Further, on the lower surface side (Z1 side in FIG. 2) of the head unit 20, six suction nozzles 22 arranged in a row along the X direction are arranged with the tip portion directed downward. Each suction nozzle 22 is configured to be able to suck and hold the component 120 supplied from the tape feeder 130 by the negative pressure generated at the nozzle tip by a negative pressure generator (not shown). Yes.

  As shown in FIG. 2, each suction nozzle 22 is configured to be movable in the vertical direction (Z direction) with respect to the head unit 20 by a servo motor 23 (see FIG. 3) and a lifting mechanism (not shown). Yes. The surface mounter 100 conveys the component 120 with the suction nozzle 22 moved to the raised position, and sucks the component 120 from the tape feeder 130 with the suction nozzle 22 moved to the lowered position. An operation for mounting on the printed circuit board 110 is performed. The suction nozzle 22 is configured such that the suction nozzle 22 itself can rotate in the XY plane about the nozzle axis (Z axis) by a servo motor 24 (see FIG. 3) and a rotation mechanism (not shown). Thereby, the attitude | position (direction in an XY plane) of the components 120 hold | maintained at the front-end | tip part of the suction nozzle 22 is adjusted in detail.

  In addition, the component imaging device 50 and the component imaging device 60 are fixedly installed on the upper surface of the base 1. The component imaging device 60 has a function of imaging the lower surface side of the component 120 sucked by the suction nozzle 22 from below. Thereby, when the component 120 moves together with the head unit 20 in the X1 direction in the XY plane with respect to the base 1, the height of the component 120 is determined from the shape of the lower surface of the component 120 imaged by the component imaging device 60. It is configured to obtain information. In addition to the head unit 20, a head detection sensor (not shown) is fixedly provided on the upper surface of the base 1. The head detection sensor is disposed on the movement path (X direction) of the head unit 20, and the imaging of the component 120 by the component imaging device 60 is performed based on the result of detection of the movement status of the head unit 20 by the head detection sensor. The start timing of the operation (image capturing) is configured. In the surface mounter 100, the quality of the shape of the component 120 is determined based on the height information obtained by the component imaging device 60, and the quality of the suction position of the suction nozzle 22 with respect to the component 120 is determined. The component imaging device 60 is an example of the “three-dimensional shape measuring device” in the present invention. The X1 direction is an example of the “first direction” in the present invention.

  As shown in FIG. 4, the component imaging device 60 includes an illumination unit 61 that irradiates the component 120 with illumination light, and a two-dimensional image sensor (area sensor) that captures the component 120 by receiving reflected light of the illumination light from the component 120. 63). The two-dimensional image sensor 63 is composed of, for example, a CMOS image sensor that can cut out an image of an arbitrary imaging portion.

Here, in the first embodiment, the illumination unit 61 is configured to be able to irradiate illumination light having a sinusoidal light intensity distribution. Specifically, the illumination unit 61 includes a light source 61a point by LED, and the film 61c for imparting a sinusoidal fringe pattern into a parallel light after being converted into emitted light parallel light from the point light source 61a, stripes It includes a cylindrical lens 61d that collects parallel light in a pattern and irradiates the component 120 with it. Thereby, a sinusoidal (stripe) pattern light G whose light intensity changes at a predetermined period L is projected onto the component 120. Here, the period L of the pattern light G indicates the distance in the X direction from one bright part of the stripe to the adjacent bright part across the dark part, as shown in FIG. The pattern light G is parallel light that does not spread in the moving direction (X direction) of the component 120 by adjusting the optical system (always the period of the striped pattern is L). It is comprised so that it may spread in the orthogonal direction (Y direction). Further, as shown in FIG. 4, the illumination unit 61 is inclined with respect to the measurement surface (lower surface) of the component 120 in order to avoid overlapping with the optical axis 65 of the two-dimensional image sensor (area sensor) 63. The pattern light G is projected from below.

Further, in the first embodiment, as shown in FIG. 5, the pattern light G irradiated by the illumination unit 61 is configured to be projected onto the component 120 by being inclined by an angle α from the Y direction when seen in a plan view. Has been. That is, the period L of the pattern light G projected at an angle α from the Y direction and the pattern light G shown as the “comparative example” in FIG. 5 are projected along the Y direction (angle α = 0). Degree) period L ₀ , it is possible to obtain a relationship of L> L ₀ . Thus, the pattern light G, by tilted from the Y-direction by an angle alpha, is projected in a state of being stretched from the period L ₀ to the period L to the lower surface of component 120. FIG. 5 schematically shows the pattern light G projected on the lower surface of the component 120. Here, the angle α is preferably in the range of 45 degrees or less. The angle α is an example of the “predetermined angle” in the present invention.

  As shown in FIG. 6, the two-dimensional image sensor 63 is an area sensor in which individual imaging pixels are arranged in a matrix in a direction orthogonal to each other, and an imaging region is formed in a rectangular shape. Further, the two-dimensional image sensor 63 is arranged in the component imaging device 60 (see FIG. 4) in a state where one side of the rectangular shape is parallel to the moving direction (X1 direction) of the component 120. Accordingly, the two-dimensional image sensor 63 is configured such that the sides spread in a plane along the moving direction (X1 direction) of the component 120 and the direction (Y2 (Y) direction) orthogonal to the moving direction. . The Y2 (Y) direction is an example of the “second direction” in the present invention.

  As shown in FIG. 3, in the component imaging device 60, the imaging control unit 73 provided in the control device 70 divides the two-dimensional image sensor 63 into a plurality of imaging parts and images for each imaging part. It can be cut out. Specifically, as illustrated in FIG. 6, the two-dimensional image sensor 63 includes three imaging portions A, B, and C that acquire an image and two imaging portions D that do not acquire an image by a control operation. It is possible to cut out images individually. The two-dimensional image sensor 63 is connected in the order of the imaging part A, the imaging part D, the imaging part B, the imaging part D, and the imaging part C from the X2 side (upstream side) to the X1 side (downstream side). Each part is arranged. In addition, the imaging portions A to C in the two-dimensional image sensor 63 have an interval (= L / 3) obtained by dividing the period (pitch) L of the pattern light G (see FIG. 5) by the number of imaging regions (three). And disposed along the X1 direction (the moving direction of the component 120). The two-dimensional image sensor 63 is an example of the “imaging unit” in the present invention.

  Therefore, when imaging the part 120 moving in the X1 direction, first, when the part 120 passes over the imaging part A arranged on the most upstream side (X2 side), the region P1 of the part 120 is caused by the imaging part A. Imaged. Thereafter, whenever the part 120 passes over the imaging part B and the imaging part C in this order, the same region P1 of the part 120 is repeatedly imaged. Here, the region P1 indicates one imaging region when the component 120 is equally divided into strips along the X direction. The region P1 has one pixel in the X1 direction and extends in the Y2 (Y) direction, and corresponds to a region that can be imaged by a line-shaped imaging region described later. In addition, similarly to the area P1, the areas P2, P3, and P4 to the area PM sequentially arranged next to the area P1 (X2 side) are sequentially imaged. Accordingly, the phase calculation unit 74a (see FIG. 3) can perform phase analysis based on the image data A0 (B0 and C0 (see FIG. 10)) acquired in each of the imaging portions A to C, and the components It is possible to acquire height information of 120 areas P1 to PM and the like. For example, as in the example shown in FIG. 10, the image data A0 is configured by connecting image data A1 to AM (in this case, AM = A4) captured for each line. Although not shown, the image data B0 and C0 are also configured by connecting the image data B1 to BM and C1 to CM captured for each line. That is, the image data A1 (B1, C1) is an image signal corresponding to the area P1 of the component 120 that is imaged at a predetermined timing, and the image data A2 (B2, C2) is different from the image data A1. This is an image signal corresponding to a region P2 imaged at a predetermined timing. Each of the image data AM (BM, CM) corresponding to the area PM is similarly configured. Each of the regions P1 to PM is an example of “the same part of the measurement object” in the present invention.

  In the first embodiment, the imaging portions A, B, and C included in the two-dimensional image sensor 63 are configured such that each imaging operation is further finely controlled. With respect to specific control contents by the imaging control unit 73, the region P1 of the component 120 is taken as a representative example, and how the region P1 is imaged will be described by taking the imaging portion A as an example.

  As shown in FIG. 6, the imaging part A is configured by six line-shaped imaging regions 63a to 63f. Each imaging region is a region having one pixel in the X1 direction and N pixels in the Y2 direction and extending in a line shape (straight shape) in the Y direction. When imaging the part 120 moving in the X1 direction, the imaging part A is synchronized with the speed of the part 120 (area P1) from the linear imaging area 63a disposed on the most upstream side (X2 side) in the imaging part A. The moving area P1 is sequentially imaged in each line-shaped imaging area up to the line-shaped imaging area 63f arranged on the most downstream side (X1 side). In the first embodiment, the line-shaped imaging areas 63a to 63f (imaging part A) simultaneously perform imaging at the timing when the area P1 passes directly above each of the line-shaped imaging area 63f from the line-shaped imaging area 63a. Each time, the image signal (image data) received by the imaging portion A is cut out from the two-dimensional image sensor 63 and added to a predetermined memory area in a RAM 78 (described later) in the main control unit 71. The processing is performed. The line-shaped imaging regions 63a to 63f are examples of the “line-shaped imaging region” in the present invention.

  Data processing is performed by the imaging control unit 73 in which the image signals (image data) of the areas P1 obtained by the linear imaging areas 63a to 63f in the RAM 78 are sequentially integrated (added six times in the first embodiment). Thus, one image data A1 (see FIG. 10) of the region P1 is generated. The purpose of this data processing is to obtain a TDI effect by applying a processing method generally called a TDI (Time Delay Integration) method. In this case, since the number of integrations is 6, the number of stages in TDI is regarded as “6 stages”.

  In the first embodiment, an area obtained by applying the TDI method to an image signal obtained by the two-dimensional image sensor 63 (image data of the area P1 captured by the line-shaped imaging areas 63a to 63f individually at each timing). One image data A1 of P1 is acquired. Thereby, even when the density values (luminance data (brightness)) of the images received by each of the line-shaped imaging regions 63a to 63f are not sufficiently obtained, the individual images are sufficiently added. It is possible to obtain image data A1 having a high density value (brightness). Here, the image data A1 has a phase value φ of 0π.

  In the first embodiment, the imaging control unit 73 is configured to appropriately set the TDI integration range. In this case, the imaging control unit 73 can sequentially integrate the image signal of the region P1 of the component 120 in an integration range d (see FIG. 8) that is less than or equal to ½ of the period L of the pattern light G. Has been.

  More specifically, with reference to FIG. 7, when the region P1 moves in the X1 direction, the imaging control unit 73 synchronizes with the movement of the region P1, and the six linear imaging regions (for example, the imaging part) The imaging operation of A) is repeated 6 times. At this time, by performing control to sequentially capture image signals (image data) at a timing when the region P1 passes through each of the line-shaped image pickup regions 63a to 63f in the X1 direction, the moving region P1 is individually line-shaped imaged. Images are sequentially picked up using regions.

  Here, as shown in FIG. 8, as is apparent from an integral value obtained by integrating the luminance f (x) described by the sine wave equation (see the equation of the image output signal I (x) by TDI), When the integration range d is ½ of the cycle L (2π) of the pattern light G (when d = π), the integration value becomes maximum (maximum). If the integration range d is less than ½ of the period L, the image data A1, which is the integration result, can obtain a sufficient density value (brightness) by integrating the six line-shaped imaging regions. . On the other hand, when the integration range d is a range larger than ½ of the cycle L and less than or equal to the cycle L (when d ≦ 2π), the integration effect is small. As described above, in the first embodiment, by appropriately setting the integration range d based on the period L of the pattern light G, a measurement method (imaging method) that maximizes the effect of the image signal integration processing by the TDI method. ) Is applied. In the above description, the imaging of the region P1 has been described. However, the same processing is performed for the operation in which the imaging part A images each of the regions P2 to PM.

  In the above description, the control contents during imaging related to the imaging part A have been described. However, the same technique as the imaging part A (image signal integration processing by the TDI method) is applied to the imaging parts B and C (see FIG. 7). Applicable. However, the imaging part B moves to each linear imaging area from the linear imaging area 63h to the linear imaging area 63m at a timing one-third cycle (2 / 3π) after the imaging part A. The region P1 of the inner part 120 is configured to be sequentially imaged. In addition, for the imaging part C, each line-shaped imaging area from the line-shaped imaging area 63o to the line-shaped imaging area 63t is further delayed by a third cycle (2 / 3π) after the imaging part B. The region P1 of the moving part 120 is sequentially imaged. That is, with respect to the imaging portion B, the line-shaped imaging regions 63h to 63m capture images at the same time at the timing when the region P1 passes immediately above each of the line-shaped imaging region 63m from the line-shaped imaging region 63h. An image signal of the entire portion B is cut out from the two-dimensional image sensor 63 and added to a predetermined memory area in the RAM 78. As for the imaging portion C, the line-shaped imaging regions 63o to 63t simultaneously capture images at the timing when the region P1 passes directly above each of the line-shaped imaging region 63t from the line-shaped imaging region 63o. An image signal of the entire portion C is cut out from the two-dimensional image sensor 63 and added to a predetermined memory area in the RAM 78. Thereby, the image data B1 by the imaging part B and the image data C1 by the imaging part C are acquired under each phase condition. The line-shaped imaging areas 63h to 63m and the line-shaped imaging areas 63o to 63t are examples of the “line-shaped imaging area” in the present invention.

  Further, as shown in FIG. 3, the operation of the surface mounter 100 is controlled by a control device 70. The main controller 71 includes a CPU 76, a ROM 77 (Read Only Memory), a RAM 78 (Random Access Memory), and the like. The CPU 76 has a function of executing a logical operation. The ROM 77 stores a program for controlling the CPU 76 and the like. The RAM 78 temporarily stores various data generated during the operation of the surface mounter 100. The main control unit 71 controls the driving of the illumination unit 61, the two-dimensional image sensor 63, and the following servo motors via the axis control unit 72 and the imaging control unit 73 based on a program stored in the ROM 77. It is configured.

  The axis control unit 72 is configured based on the control signal output from the main control unit 71. Each servo motor of the surface mounter 100 (the servo motor 43 (see FIG. 1) that moves the support unit 30 in the Y direction), the head unit 20. The servo motor 32 (see FIG. 1) for moving the suction nozzle 22 in the X direction, the servo motor 23 for moving the suction nozzle 22 in the vertical direction, and the servo motor 24 for rotating the suction nozzle 22 around the nozzle axis). It is configured. Further, the axis controller 72 determines the position in the XY plane of the head unit 20, the height position and the rotational position of the suction nozzle 22 based on signals from the encoders 32a, 43a, 23a and 24a of each servo motor. It is configured to be recognizable.

  Based on the control signal output from the main control unit 71, the imaging control unit 73 outputs a control signal to the illumination control unit 75 so that the light emitting element 62 such as an LED provided in the illumination unit 61 is turned on at a predetermined timing. Is configured to do.

  The image processing unit 74 reads out an image signal (image data) from the two-dimensional image sensor 63 at a predetermined timing based on a control signal output from the main control unit 71 and outputs a predetermined image to the read image signal. By performing the processing, image data suitable for recognizing the component 120 is generated. The ROM 77 stores a table (not shown) for associating the phase value φ of the pattern light G with the spatial coordinates (X, Y, and Z positions) in advance. Thereby, the image processing unit 74 acquires the height information (height position) of each part of the component 120 based on collating the phase analysis result based on the image data of the captured component 120 with the table. It is configured to be able to.

  The illumination control unit 75 is configured to perform control to turn on the illumination unit 61 based on a control signal output from the imaging control unit 73. In this way, the surface mounter 100 is configured.

  Next, a control flow related to an imaging operation performed by the component imaging device 60 in the surface mounter 100 will be described with reference to FIGS. 1, 3, 5, and 7 to 10. In the following description, it is assumed that the component 120 is sucked by the suction nozzle 22 and passes above the component imaging device 60 in the X1 direction. In order to simplify the description, the inspection area of the measurement object (imaging size of the component 120) is M pixels (= 6 pixels: X direction) × N pixels (Y direction) as shown in FIG. Of what is set as. In addition, it is assumed that dummy areas 310 and 320 and an addition area 350 are secured in advance in the RAM 78 as storage areas used for data processing relating to the imaging portion A. Accordingly, the case where the four areas from the areas P1 to P4 of the component 120 are imaged and the image data A0 (phase value 0π), B0 (phase value 2 / 3π), and C0 (phase value 4 / 3π) is acquired. Will be explained.

  As shown in FIG. 9, first, in step S1, unnecessary image data remaining in the RAM 78 (see FIG. 3) is erased by the imaging control unit 73 (see FIG. 3). As a result, the storage areas (dummy areas 310 and 320 and the addition area 350 in FIG. 10) used when capturing the image data in the RAM 78 are made empty.

  Next, in step S2, it is determined whether or not a “component image capture start signal” is detected, and this determination is repeated until a “component image capture start signal” is detected. Specifically, first, when the head unit 20 with the component 120 adsorbed moves in the X1 direction, a head detection sensor (not shown) provided on the upper surface of the base 1 immediately before the component imaging device 60. The head unit 20 that has moved up to is detected. Then, using the detection of the head unit 20 by the head detection sensor as a trigger, the above-described “component image capture start signal” is output from the main control unit 71. In step S2, when the imaging control unit 73 determines that this “component image capture start signal” has been detected, irradiation of the pattern light G by the illumination unit 61 is started in step S3. As a result, the pattern light G in which the light intensity distribution as shown in FIG. 5 is adjusted to a sine wave shape is irradiated toward the movement path of the component 120.

  Thereafter, in step S4, it is determined whether or not a “capture timing signal” relating to the timing for executing one imaging routine is generated, and the determination is repeated until this “capture timing signal” is generated. . This “take-in timing signal” is determined in advance based on the speed of the component 120 moving in the X1 direction and the cycle L of the pattern light G.

  If it is determined in step S4 that the “capture timing signal” for executing the first imaging routine has been generated, the current imaging count W is determined by the imaging control unit 73 in step S5. If it is determined in step S5 that the current number W of imaging has not reached the predetermined number, the process proceeds to the next step S6 and subsequent steps. Here, the number of times of imaging W indicates the number of times that a series of processes (imaging routines) of step S6 and step S7 described below are executed based on one “capture timing signal”. ing.

  When it is determined in step S5 that the number of times of imaging W has reached a predetermined number (11 in this example), the process (imaging routine) after step S6 is skipped and a phase analysis process (described later) ( After performing step S9), this control flow is terminated.

  If it is determined in step S5 that the current number of times of imaging W is equal to or less than a predetermined number (11 times), in step S6, the two-dimensional image sensor 63 performs imaging of the component 120. In the first embodiment, as the component 120 moves in the X1 direction, the imaging portions A, B, and C of the two-dimensional image sensor 63 are sequentially driven in this order to perform an imaging operation.

  At this time, with respect to the imaging portion A, as shown in FIG. 7, the line-shaped imaging regions 63 a to 63 f configuring the imaging portion A simultaneously image at the timing when the “capture timing signal” is detected. In step S 7, the image signal (image data) received by the imaging portion A is cut out from the two-dimensional image sensor 63 and immediately transferred to a predetermined memory area in the RAM 78. Thereafter, the process returns to step S4 and waits until the next “capture timing signal” is detected. Based on the next detected “take-in timing signal”, the determinations and operations from Steps S5 to S7 are repeated. Hereinafter, the imaging operation in step S6 and the transfer operation of the image signal to the RAM 78 in step S7 in the first embodiment will be described in detail.

  First, as shown in FIG. 10, the image signal G1 (image data included in the line-shaped imaging regions 63a to 63f) captured by the imaging part A at the timing T1 as the first imaging operation is stored in the RAM 78. Transferred to areas 301 to 305 and 351. At this time, the image signal of the line-shaped imaging area 63 a is transferred to the memory area 351, and the image signal of the line-shaped imaging area 63 f is transferred to the memory area 301. The image signal G1 is data in which the component 120 is not shown at all.

  Then, as the second imaging operation, the timing T2 after the time ＴT corresponding to the integration range d (see FIG. 8) has elapsed (the region P1 of the component 120 corresponds to the line-shaped imaging region 63b). The image signal G2 picked up in synchronization with the timing (moved to the position where the image signal is moved) is transferred to the memory areas 302 to 305, 351 and 352 shifted by one from the image signal G1. Then, as the third imaging operation, the timing T3 after the lapse of (ΔT / 6) × 2 from the timing T1 (the region P1 of the component 120 moves to a position corresponding to the line-shaped imaging region 63c). The image signal G3 picked up in synchronization with the image timing is transferred to the memory areas 303 to 305 and 351 to 353 shifted by one from the image signal G2. At this time, the image signal obtained by imaging the area P1 is added to the memory area 352 twice.

  Thereafter, the image signal G4 captured at the timing T4 after ΔT / 6 as the fourth imaging operation is transferred to the memory areas 304, 305, and 351 to 354. As a result, the image signal obtained by imaging the area P1 is added to the memory area 352 three times. Further, the memory area 353 is added twice with the image signal obtained by imaging the area P2. Then, the image signal G5 imaged at the timing T5 after ΔT / 6 as the fifth imaging operation is transferred to the memory areas 305 and 351 to 355. As a result, the image signal obtained by imaging the area P1 is added four times to the memory area 352, the image signal obtained by imaging the area P2 is added three times to the memory area 352, and the area P3 is added to the memory area 354. The captured image signal is added twice.

  In the first embodiment, the above imaging operation is sequentially repeated. That is, in the eleventh imaging operation at timing T11, data in which the regions P1 to P4 of the component 120 completely pass through the imaging portion A and nothing is captured is acquired as the image signal G11. At this time, each time interval from timing T1 to T11 (at least each time interval from timing T2 to T10) is set to 1/6 time of time ΔT corresponding to the integration range d shown in FIG. ing. As a result, as shown in FIG. 10, the memory area 352 stores the image data A1 obtained by imaging the area P1 and adding the image signal G six times. The memory area 353 stores the image data A2 obtained by imaging the area P2 and adding the image signal G six times. The memory area 354 stores image data A3 obtained by imaging the area P3 and adding the image signal G six times. The memory area 355 stores image data A4 obtained by imaging the area P4 and adding the image signal G for six times. In addition, in the memory areas 351 and 356, addition processing is performed, but there is no image data. In this way, one piece of image data A0 connected to the memory areas 352 to 355 of the addition area 350 is generated. In the first embodiment, the image pickup control unit 73 appropriately uses the memory area of the RAM 78 to perform image signal integration processing, thereby obtaining a processing result similar to the integration processing using a general TDI line sensor. Is going to get.

  In the first embodiment, in order to perform such data processing on the imaging portion A, the RAM 78 has a memory area (M + (2 × Z) −2) × N pixels (as the dummy area 310). Memory areas 301 to 305, memory areas 351 to 356 as addition areas 350, and memory areas 321 to 325 as dummy areas 320) are used. Note that M in the above-described formula: M + (2 × Z) −2 is the number of pixels in the X direction of the inspection area of the measurement object, and Z is the number of TDI stages (the linear imaging area of the imaging part A). Column number).

  For the imaging part B, the timing (component 120) after elapse of time (L / V) / 3 from the timing T1 (where V is the speed of the component 120 in the X1 direction). Of the above-described steps S6 and S7, starting from the timing when the area P1 is moved to a position corresponding to the linear imaging area (imaging part D) immediately before (upstream) the linear imaging area 63h. The action is executed. That is, the imaging part B (line-shaped imaging areas 63h to 63m) is repeatedly received at intervals of ΔT / 6, and each time (W = 11 times), the image signal is cut out from the two-dimensional image sensor 63 and stored in the RAM 78. Processing to be added to a predetermined memory area is performed. Further, regarding the imaging part C, the timing after the time of ((L / V) / 3) × 2 has elapsed from the timing T1 (the area P1 of the component 120 is one line before the line-shaped imaging area 63o (upstream). The operation of steps S6 and S7 is executed with the start point as the starting point of the linear image pickup area (image pickup portion D). That is, the imaging part C (line-shaped imaging areas 63o to 63t) is repeatedly received at intervals of ΔT / 6, and each time (W = 11 times), the image signal is cut out from the two-dimensional image sensor 63 and stored in the RAM 78. Processing to be added to a predetermined memory area is performed. As a result, as in the case of the image data A0, the image data B0 having the phase value φ of 2 / 3π is generated in the memory area corresponding to the addition area 350 for the imaging part B, and the imaging data for the imaging part C is generated. Image data C 0 having a phase value φ of 4 / 3π is generated in the memory area corresponding to the addition area 350. In this way, image data A0, B0, and C0 (three types) obtained by imaging the image size of M × N pixels and each image data imaged under the conditions of phase values 0π, 2 / 3π, and 4 / 3π. And are held in the memory areas (three locations) of the RAM 78, respectively.

  If it is determined in step S5 that the number of times of imaging W has reached a predetermined number (W = 11), irradiation of the pattern light G by the illumination unit 61 is stopped in step S8. Finally, in step S9, the image processing unit 74 performs phase analysis processing based on the three types of image data. As a result, the shape (height information) of the entire component 120 is acquired, and the imaging operation by the component imaging device 60 is terminated.

  Next, the mounting operation of the component 120 on the printed board 110 by the surface mounter 100 will be described with reference to FIGS. 1 and 4.

  First, as shown in FIG. 1, the printed circuit board 110 placed on the conveyor 10 is transported in the X1 direction to the mounting work position provided at the center of the base 1.

  In parallel with the loading operation of the printed circuit board 110, the component 120 to be mounted is taken out from the tape feeder 130 by the head unit 20. Specifically, when the head unit 20 is moved above a predetermined tape feeder 130, the suction nozzle 22 of the head unit 20 is disposed above the component 120 held by the tape feeder 130.

  Thereafter, the suction nozzle 22 is lowered and a negative pressure is supplied to the tip of the suction nozzle 22. Thereby, the component 120 on the tape feeder 130 is sucked and held by the suction nozzle 22.

  Thereafter, the head unit 20 passes above the component imaging device 60 while holding the component 120. At this time, as shown in FIG. 4, the component 120 held by the suction nozzle 22 is imaged by the component imaging device 60 while moving the head unit 20 along the X1 direction. Then, the suction position of the component 120 is recognized based on the captured image, and the quality of the component 120 is determined by acquiring the height information of the component 120. Specifically, when the height positions of the plurality of electrode portions 120a of the component 120 are not within a predetermined range, a connection failure between the printed circuit board 110 and the component 120 may occur. It is determined that When it is determined that the part 120 is defective based on the height information of the part 120, the part 120 is discarded.

  Further, based on the image of the component 120, the amount of deviation of the suction position of the component 120 from the correct suction position is calculated. Then, the head unit 20 moves and the suction nozzle 22 rotates based on the calculated deviation amount, and the mounting position of the component 120 is corrected. The correction processing of the mounting position of the component 120 described above is performed in parallel with the operation in which the head unit 20 moves from the tape feeder 130 to the mounting position of the printed circuit board 110.

  As shown in FIG. 1, after the head unit 20 is moved to a predetermined mounting position in the printed circuit board 110, the suction nozzle 22 is lowered and the component 120 is mounted on the printed circuit board 110. By repeatedly performing the above operation, mounting of the plurality of components 120 on the printed circuit board 110 is performed. In addition, the printed circuit board 110 on which the mounting of the component 120 is completed moves on the conveyor 10 in the X1 direction and is carried out of the base 1. In this way, the mounting operation of the component 120 by the surface mounter 100 is completed.

  In the first embodiment, as described above, each of the two-dimensional image sensor 63 including the linear imaging regions 63a to 63f and the linear imaging regions 63a to 63f included in the imaging part A by controlling the two-dimensional image sensor 63. Are used to sequentially image the region P1 of the component 120 moving in the X1 direction with respect to the component imaging device 60, and then transferred to the image signal (memory region 352 (see FIG. 10) of the region P1 of the component 120 captured in the RAM 78. Image pickup control unit 73 that performs control for sequentially integrating the image signals). As a result, the image data A1 after completion of integration is in the state of image data obtained by integrating the image signals of the area P1 received by each of the line-shaped imaging areas 63a to 63f by the number of line-shaped imaging areas (six). . Therefore, the density value (brightness) of the accumulated image data A1 is compared with the density value (brightness) of the image signal received by only one line-shaped imaging region (for example, the line-shaped imaging region 63a). , A larger value can be obtained by the addition (addition). That is, it is possible to avoid acquiring image data that does not have a sufficient density value (brightness) due to insufficient light reception. As a result, it is possible to acquire bright image data A1 without using the high-intensity pattern light G even when imaging the component 120 that moves in the X1 direction using the linear (linear) imaging region. . Even if the moving speed in the X1 direction is increased, the brightness of the image data A1 is suppressed from being reduced by the integration process. Therefore, when the pattern light G having the same luminance is used, component imaging is performed. The three-dimensional shape measurement of the component 120 moving in the X1 direction at a higher speed than the apparatus 60 can be performed.

  In the first embodiment, when the imaging control unit 73 sequentially captures the region P1 moving in the X1 direction with respect to the imaging part A, the imaging control unit 73 has an integration range d that is a half of the period L of the pattern light G. Control is performed to sequentially receive light from the line-shaped imaging region 63a to the line-shaped imaging region 63f at a timing obtained by dividing the corresponding time by six. Then, control is performed so as to integrate the image signals received at each timing (individual image signals taken into the memory area 352 of the RAM 78) to acquire the image data A1. The same control is performed for the imaging portions B and C. Thereby, the effect of the integration process of the image signals received by each of the six line-shaped imaging regions in each imaging part can be appropriately obtained. In this case, the integration effect can be maximized by the amount that the image signal is integrated by setting the integration interval to one half of the cycle L of the pattern light G.

  In the first embodiment, the imaging control unit 73 synchronizes with the speed of the component 120 in the X1 direction, and uses the linear imaging regions 63a to 63f to move the region P1 of the component 120 along the X1 direction. In addition to sequentially capturing images, control is performed to integrate the image signal of the region P1 acquired by each linear imaging region in an integration range d that is less than or equal to one half of the period L of the pattern light G. Thereby, the area P1 of the component 120 can be surely received by the pixel area at substantially the same position in each of the line-shaped imaging areas 63a to 63f. As a result, the image data A1 having a sufficient density value (brightness) can be reliably acquired after integration in the integration range d that is less than or equal to one half of the period L of the pattern light G.

  In the first embodiment, the two-dimensional image sensor 63 is provided with imaging portions A, B, and C each having six linear imaging regions. In addition, the imaging portions A, B, and C are arranged along the X1 direction at intervals (= L / 3) obtained by dividing the period L of the pattern light G by the number of imaging regions (= 3). Yes. Then, the imaging control unit 73 sequentially obtains the image data A1, B1 obtained by sequentially integrating the image signals in an integration range d that is less than or equal to one half of the period L of the pattern light G in each two-dimensional image sensor 63. By performing a phase analysis based on C1, control is performed to acquire height information of the region P1 of the component 120. As a result, image data A0, B0, and C0 (see FIG. 10) in which the magnitude of the density value (brightness) is appropriately obtained in each of the imaging portions A, B, and C in the two-dimensional image sensor 63 are used. Phase analysis. Thereby, the height information of the component 120 can be obtained with high accuracy.

  In the first embodiment, the pattern light G is configured to be projected onto the component 120 in a state where the sinusoidal light intensity distribution is inclined by the angle α from the Y direction. Then, the image signal is integrated within an integration range d corresponding to a half of the period L with reference to the period L of the pattern light G projected by being inclined by the angle α. Thereby, compared with the case where the pattern light G is projected along the Y2 direction without the angle α (comparative example of FIG. 5), the pattern light G is inclined by the angle α from the Y2 direction. The period L (brightness / darkness / brightness pattern of brightness) of the projected pattern light G can be extended in the X1 direction in which the component 120 moves. As a result, a large number of line-shaped imaging regions can be assigned to the integration range d to be integrated as the luminance change period becomes longer, so that the height of the component 120 is increased by the amount of image signals to be integrated. The detection accuracy can be further improved.

(Second Embodiment)
Next, a second embodiment will be described with reference to FIGS. 1, 3, 5, 8 and 10 to 13. In the surface mounter 200 according to the second embodiment, instead of the two-dimensional image sensor 63 applied to the component imaging device 60 of the surface mounter 100 in the first embodiment, three units each composed of a plurality of line sensors. The component imaging device 260 is configured using the imaging unit 263 configured by the TDI sensors 264a to 264c. In the drawing, the same reference numerals as those in the first embodiment are attached to the same components as those in the first embodiment. The surface mounter 200 is an example of the “component transfer device” in the present invention, and the component imaging device 260 is an example of the “three-dimensional shape measuring device” in the present invention. The TDI sensors 264a to 264c are examples of the “imaging unit” and “TDI sensor” of the present invention.

  As shown in FIG. 11, the imaging unit 263 includes one imaging part A configured by a TDI sensor 264 a including six line sensors 64 a to 64 f and a TDI sensor including another six line sensors 64 h to 64 m. One imaging portion B configured by H.264b and an imaging portion C configured by TDI sensor 264c including six other line sensors 64o to 64t are provided. Also in this case, the imaging control unit 73 (see FIG. 3) is arranged on the most upstream side (X2 side) in each of the TDI sensors 264a to 264c (imaging portions A to C) in synchronization with the movement of the component 120. The region P1 of the component 120 is obtained by executing control for imaging one column at a time from the line sensor 64a (64h and 64o) toward the line sensor 64f (64m and 64t) arranged on the most downstream side (X1 side). Can be sequentially imaged using each line sensor. The line sensors 64a to 64f, the line sensors 64h to 64m, and the line sensors 64o to 64t are examples of the “line-shaped imaging region” in the present invention.

  Also in the second embodiment, the TDI sensor 264a (imaging part A), the TDI sensor 264b (imaging part B), and the TDI sensor 264c (imaging part C) have a period (pitch) that the pattern light G (see FIG. 5) has. ) It is arranged along the X1 direction (the moving direction of the component 120) with an interval (= L / 3) obtained by dividing L by the number of imaging regions (3).

  In the second embodiment, using the TDI sensor 264a (264b and 264c), TDI processing from imaging of the region P1 (acquisition of image signals) to generation of image data A1 (B1 and C1) will be described below. It is done as follows. Here, the TDI sensor 264a (imaging part A) will be described as an example.

  Specifically, as shown in FIG. 12, first, the imaging control unit 73 images the region P1 of the component 120 moving in the X1 direction by the first-stage line sensor 64a. As a result, the line sensor 64a holds the electric charge 6a serving as an image signal. Then, the timing after the lapse of 1/6 of the time ΔT corresponding to the integration range d (see FIG. 8) from the first stage imaging timing T1 (the position where the region P1 of the component 120 corresponds to the line sensor 64b). The charge 6a held by the line sensor 64a is transferred to the second-stage line sensor 64b, and the line sensor 64b holds the charge 6a while the line sensor 64b holds the charge 6a. Imaging is performed. As a result, the line sensor 64b holds a charge 7b obtained by adding the charge 6a and the charge 6b received by the line sensor 64b as an image signal.

  Then, it is synchronized with the timing after the time (ΔT / 6) × 2 has elapsed from the timing T1 of the first stage imaging (the timing when the region P1 of the component 120 has moved to the position corresponding to the line sensor 64c). Then, the electric charge 7b held by the line sensor 64b is transferred to the third-stage line sensor 64c, and the area P1 is imaged by the line sensor 64c while the line sensor 64c holds the electric charge 7b. As a result, the line sensor 64c holds a charge 7c obtained by adding the charge 7b and the charge 6c obtained by receiving light from the line sensor 64c as an image signal. In the TDI sensor 264a, this operation is sequentially repeated from the line sensors 64a to 64f, whereby the charge 7f is finally held in the line sensor 64f after receiving light. That is, the charge 7f is equal to the charge amount obtained by adding the charge 6a, the charge 6b, the charge 6c, the charge 6d, the charge 6e, and the charge 6f.

  Then, as shown in FIG. 13, image data A1 acquired by one imaging operation and TDI in the TDI sensor 264a (imaging part A) is stored in the memory area 521 of the RAM 78. Similarly, the image data A2 of the area P2 acquired by the second imaging operation and TDI is stored in the memory area 522. The above TDI is repeated a plurality of times at a predetermined timing (for example, when the inspection area of the measurement object is M pixels (X direction) × N pixels (Y direction)), the image data A1 to AM are sequentially stored in the memory area 520, and one piece of image data A0 (M × N pixels) is acquired. Similar operation processing is performed for the TDI sensor 264b (imaging part B) and the TDI sensor 264c (imaging part C). Thus, the image data B1 to BM are stored in the memory area 620 of the RAM 78, and the image data C1 to CM are stored in the memory area 720.

  In the second embodiment, as described above, the imaging control unit 73 sequentially images the region P1 of the component 120 using each of the line sensors 64a to 64t constituting the TDI sensors 264a to 264c, and each line sensor. Control is performed so that the image signals (image data) of the region P1 received by 64a to 64f are sequentially integrated within an integration range d that is a half of the period L of the pattern light G. Thereby, the image signal integration process (TDI) can be easily performed by appropriately controlling the imaging operations of the plurality of line sensors 64a to 64t. In addition, since the image pickup unit 263 performs a process of sequentially adding image signals in synchronization with the image pickup operation of each line sensor, only the image data A1 to AM (B1 to BM and C1 to CM) after integration are stored in the RAM 78. Is stored. Therefore, the memory area is saved because it is not necessary to secure a memory area for image signal integration processing or the like in the RAM 78 as in the first embodiment (the dummy areas 310 and 320 shown in FIG. 10 are unnecessary). be able to.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first and second embodiments, the “three-dimensional shape measuring apparatus” of the present invention is applied to the surface mounter 100. However, the present invention is not limited to this. For example, the “three-dimensional shape measuring apparatus” of the present invention can be applied to a component testing apparatus (IC handler). Further, the “three-dimensional shape measuring apparatus” of the present invention can be widely applied to devices and apparatuses other than surface mounters and component testing apparatuses. The IC handler is an example of the “component transfer device” in the present invention.

  Further, in the first and second embodiments, when the imaging control unit 73 sequentially images the region P1 of the component 120 moving in the X1 direction, the period L of the pattern light G for each imaging part is divided into two. Although the example in which the control for sequentially imaging the six line-shaped imaging regions at the imaging timing obtained by dividing the time corresponding to one integration range d into six is shown, the present invention is not limited to this. That is, you may make it light-receive six line-shaped imaging areas sequentially in the time corresponding to the integration range smaller than 1/2 of the period L which the pattern light G has. Thus, even when the integration interval is shorter than half the cycle of the pattern light G (less than π radians), image data having a sufficient density value can be easily obtained by integration. be able to. Further, the number of the line-shaped imaging regions constituting one imaging part may be other than six.

  Moreover, in the said 1st Embodiment, after acquiring the image signal G for 6 linear imaging areas collectively in each imaging part (A, B, and C) of the two-dimensional image sensor 63 (step S6 of FIG. 9). The integration (addition) processing is performed while collectively taking in the 11 image signals G1 to G11 (see FIG. 10) into the RAM 78 (step S7 in FIG. 9), but the present invention is not limited to this. For example, like the TDI sensor shown in the second embodiment, only the image signals received by the individual line-shaped imaging regions in each imaging portion are cut out from the imaging portions in the order in which the line-shaped imaging regions receive light, and sequentially stored in the RAM 78. It may be configured to transfer to a predetermined memory area and perform addition processing for each area (for each area P1 to PM of the component 120).

  In the first and second embodiments, the example in which the height information of the component 120 is obtained by performing the phase analysis based on the three image data A1, A2, and A3 shifted in phase by 2 / 3π is shown. However, the present invention is not limited to this. For example, component height information may be acquired based on four images whose phases are shifted by ½π. In this case, the imaging unit is composed of four imaging areas arranged at equal intervals. Similarly, component height information may be acquired based on five or more images.

  In the first and second embodiments, the example in which the present invention is applied to the component imaging device 60 fixedly provided on the base 1 has been described. However, the present invention is not limited to this. For example, the present invention may be applied to a component imaging device attached to the head unit 20 so as to be movable with respect to the suction nozzle 22.

  In the first and second embodiments, the present invention is applied to the three-dimensional shape measurement method when the component 120 moves in the X1 direction above the component imaging device 60 fixedly provided on the base 1. However, the present invention is not limited to this. For example, the present invention can also be applied to a measurement system configured such that the imaging unit side moves in the first direction with respect to a measurement object that does not move. In this case, both the imaging unit and the illumination unit are configured to move in the first direction with respect to the measurement target.

  In the first and second embodiments, the two-dimensional image sensor 63 or the TDI sensors 264a to 264c are configured with the so-called TDI stage number set to 6 (the number of lines in the line-shaped imaging area constituting one imaging part). However, the present invention is not limited to this. The number of stages in the TDI system may be other than six. Moreover, although the number (stage number) of the line-shaped imaging areas in each imaging part is configured to be the same number (six stages), the present invention is not limited to this. The number of line-shaped imaging regions (number of stages) in each imaging part may be different from each other.

  In the second embodiment, the three TDI sensors 264a, 264b, and 264c are arranged along the X1 direction at an interval (= L / 3) of the period L of the pattern light G. However, the present invention is not limited to this. That is, depending on the size of the TDI sensor or the size (smallness) of the period L of the pattern light G, there may be a case where the three TDI sensors cannot be physically arranged in the X1 direction at the interval L / 3. In such a case, by devising the optical system of the component imaging device 60, each TDI sensor can receive the reflected light reflected from the component 120 at intervals of L / 3. It may be configured. If the optical path of the reflected light from the component 120 is appropriately configured, the reflected light from the component 120 can be received regardless of the order in which the three TDI sensors are arranged. Therefore, the effect of the present invention can be effectively obtained also in this configuration.

20 Head unit 60, 260 Component imaging device (three-dimensional shape measuring device)
61 Illumination unit 63 Two-dimensional image sensor (imaging unit)
63a to 63f, 63h to 63m, 63o to 63t Line-shaped imaging area (line-shaped imaging area)
64a to 64f, 64h to 64m, 64o to 64t Line sensor (line-shaped imaging region)
73 Imaging Control Unit (Control Unit)
100, 200 Surface mounter (component transfer equipment)
120 parts (objects to be measured)
H.264a, 264b, 264c TDI sensor (imaging unit, TDI type sensor)

Claims (8)

An imaging unit that includes a plurality of imaging regions that are arranged in a first direction and extend in a line in a second direction orthogonal to the first direction, and that images a measurement object;
An illumination unit that projects illumination light having a sinusoidal light intensity distribution toward a measurement object that moves relative to the imaging unit in a first direction;
When the imaging unit sequentially captures the same part of the measurement object that moves relative to the first direction using the linear imaging regions, the image of the same part of the measurement object A three-dimensional shape measuring apparatus comprising: a control unit that performs control to integrate signals within a range of ½ or less of the period of the illumination light.   The control unit uses the line-shaped imaging regions of the imaging unit to synchronize with the moving speed of the measurement target in the first direction relative to the imaging unit. The same part is sequentially imaged along the first direction, and control is performed to integrate the image signal of the same part of the measurement object within a range of ½ or less of the period of the illumination light. The three-dimensional shape measuring apparatus according to claim 1, which is configured as follows. The imaging unit includes a plurality of imaging parts having a plurality of linear imaging regions,
Each of the imaging parts is arranged along the first direction for each interval obtained by dividing the period of the illumination light by the number of the imaging parts.
The control unit performs the phase analysis based on the image data obtained by integrating the image signals in a range equal to or less than one half of the cycle of the illumination light in each of the imaging portions. The three-dimensional shape measurement apparatus according to claim 1, wherein the three-dimensional shape measurement apparatus is configured to perform control for acquiring height information of a measurement object. The imaging unit is a two-dimensional image sensor configured to be able to cut out an image signal corresponding to each linear imaging region,
The control unit sequentially images the same portion of the measurement object using the two-dimensional image sensor, and then cuts out the image signal in which the same portion of the measurement object is imaged, and converts the image signal into the image signal. The three-dimensional shape measuring apparatus according to any one of claims 1 to 3, wherein the three-dimensional shape measuring apparatus is configured to perform control for integration within a range of ½ or less of the period of illumination light. The imaging unit is a TDI type sensor having a plurality of the linear imaging regions,
The control unit sequentially images the same portion of the measurement object using the line-shaped imaging region of each of the TDI type sensors, and each of the line-shaped imaging regions receives the same portion received by the line-shaped imaging region. The three-dimensional shape measurement according to any one of claims 1 to 3, wherein the three-dimensional shape measurement is configured to sequentially integrate the image signal within a range of ½ or less of the period of the illumination light. apparatus. The illumination light is configured to be projected onto the measurement object in a state where the light intensity distribution in a sine wave shape is inclined by a predetermined angle from the second direction,
The controller is inclined and projected by the predetermined angle when the imaging unit sequentially images the same part of the measurement object that moves relatively in the first direction using each of the imaging regions. The three-dimensional shape measurement according to any one of claims 1 to 5, wherein the three-dimensional shape measurement is configured to perform control for integrating the image signals in a range of ½ or less of a period of the illumination light. apparatus. A head unit for transferring parts;
An imaging unit that includes a plurality of imaging regions that are arranged in a first direction and extend in a line shape in a second direction orthogonal to the first direction, and that images a component;
An illumination unit that projects illumination light having a sinusoidal light intensity distribution toward the component that moves relative to the imaging unit in the first direction by the head unit;
When the imaging unit sequentially images the same part of the component that moves relatively in the first direction using the linear imaging regions, the image signal of the same part of the component is A component transfer apparatus comprising: a control unit that performs control for integration within a range of ½ or less of a period of illumination light. Projecting illumination light having a sinusoidal light intensity distribution toward the measurement object;
When sequentially imaging the same portion of the measurement object that moves relative to the imaging region in a predetermined direction using each of a plurality of imaging regions extending in a line shape, the same portion of the measurement object A three-dimensional shape measuring method comprising: integrating an image signal in a range equal to or less than a half of a period of the illumination light.

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