WO2023148902A1

WO2023148902A1 - Component mounting apparatus

Info

Publication number: WO2023148902A1
Application number: PCT/JP2022/004328
Authority: WO
Inventors: 真一岡嵜
Original assignee: ヤマハ発動機株式会社
Priority date: 2022-02-03
Filing date: 2022-02-03
Publication date: 2023-08-10
Also published as: JP7542163B2; CN118633360A; JPWO2023148902A1

Abstract

This component mounting apparatus is provided with: a head that holds and mounts a component on a substrate; an imaging unit that images the component being held by the head from below the head; and an illumination apparatus including a side illumination unit that irradiates the component with illumination light laterally of the component being held by the head. The side illumination unit comprises an upper-tier light beam emission unit that emits, as the illumination light, first irradiating light that spreads at a first irradiation angle, and a lower-tier light beam emission unit that is disposed under the upper-level light beam emission unit, and emits second irradiating light that spreads at a second irradiation angle smaller than the first irradiation angle.

Description

Parts mounting device

The present invention relates to a component mounting device that mounts components on a substrate.

A component mounting device that mounts a component on a board includes a component recognition camera that captures an image of the component sucked by the suction nozzle of the head from below, and a lighting device that irradiates the component with illumination light when capturing the image. The illumination device includes a coaxial illumination unit that irradiates illumination light from below the head toward the bottom surface of the component sucked by the adsorption nozzle, and a coaxial illumination unit that irradiates illumination light from obliquely below the component toward the peripheral edge of the bottom surface of the component. A lighting device is known that includes a diffused lighting unit that emits light from the side of a component and a side lighting unit that irradiates illumination light from the side of the component toward the side surface of the component. A component recognition camera captures an image of a component illuminated by these illumination lights, and based on the obtained image, the suction state of the component, the component size, and the like are recognized (see, for example, Patent Document 1). The image created by the reflected light of the illumination light emitted by the side illumination unit contributes exclusively to the recognition of the shape of the bottom edge portion of the component.

The above-mentioned side lighting section is formed by annularly arranging a large number of point light sources so as to surround the center of illumination of the lighting device. With an in-line type head in which a plurality of suction nozzles are arranged in a straight line, if the movement of the head is controlled so that the part picked up by each nozzle passes through the illumination center, illumination light is evenly distributed on all sides of the part during imaging. can be irradiated. However, for example, in a rotary head in which a plurality of suction nozzles are arranged on the circumference, it is inevitable that the parts sucked by each nozzle are located at positions offset from the center of illumination, and the parts are photographed. sometimes not. In this case, the illumination luminous intensity of the side surface of the component farther from the point light source of the side illumination unit is insufficient, and the reflected light from the vicinity of the bottom edge of the side surface of the component is not sufficiently incident on the component recognition camera. Therefore, the part identified on the obtained image has a different shape from the actual shape, and the recognition accuracy of the part may be lowered.

JP 2014-49705 A

An object of the present invention is to provide a component mounting apparatus that can evenly irradiate the side surfaces of a component to be imaged with side illumination light even when the component is offset from the illumination center of the illumination device.

A component mounting apparatus according to one aspect of the present invention includes a head that holds a component and mounts it on a board, an imaging unit that captures an image of the component held by the head from below the head, and a a lighting device including a side lighting unit that irradiates the component with illumination light from the side of the component, wherein the side lighting unit emits, as the illumination light, a first irradiation light that spreads at a first irradiation angle. and a lower ray emitting part arranged below the upper ray emitting part and emitting second irradiation light that spreads at a second irradiation angle smaller than the first irradiation angle.

FIG. 1 is a plan view schematically showing the configuration of a component mounting apparatus according to an embodiment of the invention. FIG. 2 is a block diagram showing the electrical configuration of the component mounting apparatus. FIG. 3 is a schematic cross-sectional view of an illumination device provided in the component mounting apparatus; FIG. 4 is a diagram showing how the parts are illuminated by the illumination device. FIG. 5 is a diagram for explaining problems when using a conventional lighting device. FIG. 6 is a diagram for explaining problems when using a conventional lighting device. FIG. 7 is a diagram showing the configuration of the side illumination unit according to this embodiment. FIG. 8A is a diagram showing a setting example of the optical axis of the irradiation light of the side lighting unit, and FIG. 8B is a diagram showing the relationship between the inclination of the optical axis and the irradiation range of the side lighting light. . FIGS. 9A to 9C are diagrams showing various embodiments of the side illumination unit. FIG. 10 is a diagram showing another embodiment of the side lighting section. FIG. 11 is a diagram showing the relationship between the directivity angle of the irradiation light and the luminous intensity. FIGS. 12A and 12B are diagrams showing how reflected light enters the component recognition camera when a component is irradiated with irradiation light having an irradiation angle and parallel light, respectively. FIGS. 13A and 13B are diagrams showing how reflected light enters the component recognition camera when the component is irradiated with irradiation light having an irradiation angle and parallel light, respectively. FIGS. 14A and 14B are diagrams showing irradiation conditions of side illumination light when the component recognition camera is an area sensor. FIGS. 15A and 15B are diagrams showing irradiation conditions of side illumination light when the component recognition camera is a line sensor.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings. This embodiment shows an example in which a component mounting apparatus according to the present invention is applied to a component mounting apparatus that mounts electronic components on a printed circuit board. Electronic parts are, for example, chip parts such as chip resistors and chip capacitors, ball bump parts, package type parts such as ICs. The present invention is not limited to a component mounting apparatus, but can be applied to apparatuses for mounting various types of components on various boards.

[Overall structure of component mounter]
FIG. 1 is a plan view showing a schematic configuration of a component mounting apparatus 1. FIG. The component mounting apparatus 1 is an apparatus that mounts various electronic components 6 on a board P to produce a circuit board. In FIG. 1, the X direction indicates the transport direction of the substrate P, the Y direction indicates the direction perpendicular to the X direction in the horizontal plane, and the Z direction indicates the direction perpendicular to the X and Y directions. The component mounting apparatus 1 includes a base 10, a board transfer section 2, a component supply section 3, a head unit 4, a board recognition camera 5, an illumination device 8, and a component recognition camera 11 (imaging section).

The base 10 has a rectangular shape in a plan view and a flat top surface, and the board transfer section 2 and the component supply section 3 are assembled. The board transporter 2 transports a board P on which electronic components 6 are mounted. The board transfer section 2 has a pair of conveyors 21 and 22 for transferring the board P in the left-right direction (X direction) on the base 10 . The conveyors 21 and 22 carry the board P into the component mounting apparatus 1 from the right side, transport it leftward to a predetermined working position, here the position of the board P shown in FIG. 1, and temporarily stop it. The electronic component 6 is mounted on the board P in this working position. After the mounting work, the conveyors 21 and 22 convey the board P to the left side and carry it out of the component mounting apparatus 1 .

The component supply unit 3 supplies electronic components 6 to be mounted on the board P. The component supply units 3 are arranged in the front-rear direction (Y direction) of the board transfer unit 2 . One component supply unit 3 in the front-rear direction includes a plurality of tape feeders 31 arranged in the left-right direction. Each tape feeder 31 holds a reel wound with a tape containing electronic components 6 such as chip components 61 at predetermined intervals. The tape feeder 31 intermittently feeds the tape from the reel and supplies chip components 61 to the component supply position at the tip of the feeder. The other component supply section 3 in the front-rear direction includes a tray component supply machine 32 holding a plurality of tray components 62 .

The head unit 4 takes out electronic components 6 such as chip components 61 or tray components 62 from the component supply section 3 and mounts them on the board P. The head unit 4 is arranged above the base 10 so as to be movable in the XY directions, picks up the electronic component 6 from the component supply unit 3, and mounts the electronic component 6 on the board P at the predetermined position at the working position. A support beam 23 extending in the X direction is provided above the base 10 . The head unit 4 is movably supported on an X-axis fixed rail 24 fixed to a support beam 23 .

The head unit 4 includes a rotary head 40 in which a plurality of unit heads 41 are arranged in a ring. The rotary head 40 is rotatable around a central axis extending in the Z direction. The unit head 41 can move up and down and rotate around its own central axis. A suction nozzle 42 (see FIG. 3) is attached to the lower end of each unit head 41 . The suction nozzle 42 can suck and hold the electronic component 6 and mount it on the surface of the substrate P. FIG.

The support beam 23 is supported by a Y-axis fixed rail 25 extending in the Y direction, and is movable in the Y direction along this Y-axis fixed rail 25 . An X-axis servomotor 26 and a ball screw shaft 27 are arranged with respect to the X-axis fixed rail 24 . A Y-axis servomotor 28 and a ball screw shaft 29 are arranged with respect to the Y-axis fixed rail 25 . The head unit 4 moves in the X direction by rotating the ball screw shaft 27 by the X-axis servomotor 26 and moves in the Y direction by rotating the ball screw shaft 29 by the Y-axis servomotor 28 .

The board recognition camera 5 is mounted on the side of the head unit 4. The board recognition camera 5 takes images of various marks attached to the surface of the board P carried into the work position by the conveyors 21 and 22 . FIG. 1 shows a pair of fiducial marks FM attached on diagonal lines of a rectangular substrate P as an example of the marks. The fiducial mark FM is a mark for detecting the amount of positional deviation of the carried-in board P from the origin coordinates of the working position.

The component recognition camera 11 is a camera that is built into the base 10 and has an imaging field of view above the base 10 . The component recognition camera 11 captures an image of the electronic component 6 held by the suction nozzle 42 from below the rotary head 40 in order to image-recognize the suction state of the electronic component 6 by the suction nozzle 42 . The lighting device 8 is arranged above the component recognition camera 11 and irradiates the electronic component 6 with illumination light when the component recognition camera 11 captures an image. The illumination device 8 and the component recognition camera 11 are arranged in front of and behind the base 10 with conveyors 21 and 22 interposed therebetween. The structure of the illumination device 8 will be described later with reference to FIG.

[Electrical Configuration of Component Mounting Device]
Next, a control configuration of the component mounting apparatus 1 will be described. FIG. 2 is a block diagram showing the electrical configuration of the component mounting apparatus 1. As shown in FIG. The component mounting apparatus 1 includes a control device 7 arranged inside or outside the base 10 . The control device 7 controls the operation of each unit included in the above-described component mounting apparatus 1 by executing a predetermined program. The block diagram of FIG. 2 shows the head driving motor 4M, which is omitted in FIG.

The head drive motor 4M is a group of motors that drive various drive shafts provided in the head unit 4. The head drive motor 4M includes an N-axis servo motor that rotates the rotary head 40 around its axis, an R-axis servo motor that rotates the unit heads 41 and the suction nozzles 42 around its axis, a Z-axis linear motor that raises and lowers the unit heads 41, and a suction motor. It includes a V-axis linear motor for supplying negative pressure to the nozzle 42 and the like.

The control device 7 functionally includes an imaging control section 71 , an image processing section 72 , an illumination control section 73 , an axis control section 74 , a main control section 75 and a storage section 76 . The imaging control unit 71 controls imaging operations of various cameras provided in the component mounting apparatus 1 in addition to the board recognition camera 5 and the component recognition camera 11 . For example, the imaging control unit 71 gives a control signal that designates the timing of causing these cameras to perform imaging operations.

The image processing unit 72 applies image processing techniques such as edge detection processing and pattern recognition processing involving feature amount extraction to the image data acquired by the board recognition camera 5 and the component recognition camera 11, and extracts various images from the images. extract the information of Specifically, the image processing unit 72 performs processing for specifying the position of the fiducial mark FM based on the image data acquired by the board recognition camera 5 . Further, the image processing unit 72 performs processing for identifying the shape, suction posture, suction leakage, etc. of the electronic component 6 held by the suction nozzle 42 based on the image data acquired by the component recognition camera 11 .

The lighting control unit 73 controls the lighting operation of the lighting device 8 . The lighting control unit 73 controls the lighting device 8 so as to irradiate the electronic component 6 with illumination light at a predetermined light intensity at the timing when the component recognition camera 11 performs an imaging operation.

The axis controller 74 controls the movement of the head unit 4 in the XY directions by controlling the X-axis servomotor 26 and the Y-axis servomotor 28 . Further, the axis control section 74 controls the rotation operation of the rotary head 40, the rotation operation of the unit heads 41 and the suction nozzles 42, the lifting operation, and the like by controlling the head drive motor 4M provided in the head unit 4. FIG.

The main control unit 75 comprehensively controls various operations for the component mounting apparatus 1 . For example, the main control unit 75 supplies control signals to the imaging control unit 71, the image processing unit 72, the lighting control unit 73, and the axis control unit 74, and controls the operation of capturing an image, the operation of subjecting image data to image processing, and the illumination. The operation of lighting the device 8 and the operation of driving the head unit 4 are executed. The storage unit 76 stores various information regarding the board P and the electronic component 6, various setting values and parameters regarding the component mounting apparatus 1, control data, operation programs, and the like.

[Structure of lighting device]
Next, the detailed structure of the illumination device 8 will be described. FIG. 3 is a schematic cross-sectional view of the illumination device 8. As shown in FIG. A component recognition camera 11 is arranged below the lighting device 8 . The rotary head 40 holding the electronic component 6 moves to the component mounting position on the board P on a route passing above the lighting device 8 . FIG. 3 shows a state in which the rotary head 40 has eight unit heads 41 and the electronic component 6 is sucked by each of the suction nozzles 42 attached to the lower ends of these unit heads 41 .

The lighting device 8 includes a housing 80, and a coaxial lighting section 81, a diffuse lighting section 82 and a side lighting section 83 arranged inside the housing 80. The housing 80 has a cylindrical shape with a hollow portion through which the imaging optical axis 11A of the component recognition camera 11 passes. The center axis of the housing 80 is the illumination center 8C of the illumination light emitted by the illumination device 8 . The component recognition camera 11 is arranged so that the imaging optical axis 11A coincides with the illumination center 8C.

The housing 80 includes an upper opening 801 , a large diameter portion 802 , an inclined portion 803 and a small diameter portion 804 . The opening 801 is an opening for irradiating the electronic component 6 with illumination light from the illumination device 8 and for introducing the reflected light of the illumination light from the electronic component 6 to the component recognition camera 11 . The large diameter portion 802 is a portion with a large opening area that defines the opening 801 . The inclined portion 803 is a portion that continues to the lower end of the large diameter portion 802 and whose opening area gradually decreases downward. The small diameter portion 804 is a portion with a small opening area that continues to the lower end of the inclined portion 803 .

The coaxial illumination unit 81 is composed of a large number of point light source groups such as LEDs, and emits coaxial illumination light upward from the opening 801 from the direction coaxial with the imaging optical axis 11A. The coaxial lighting section 81 is arranged on the inner wall of the small diameter section 804 of the housing 80 . The coaxial illumination unit 81 is held by the suction nozzle 42 from vertically below the rotary head 40 above the opening 801 via a half mirror 805 arranged in the small diameter portion 804 while being inclined with respect to the imaging optical axis 11A. The coaxial illumination light is irradiated toward the bottom surface of the electronic component 6 .

The diffuse illumination unit 82 is composed of a large number of point light source groups such as LEDs, and emits diffuse illumination light directed obliquely upward toward the opening 801 . The diffused illumination part 82 is arranged on the inner wall of the inclined part 803 so as to surround the illumination center 8C. The diffused illumination unit 82 irradiates diffused illumination light from obliquely below the rotary head 40 above the opening 801 toward the peripheral edge of the bottom surface of the electronic component 6 held by the suction nozzle 42 .

The side illumination unit 83 is composed of a large number of point light source groups such as LEDs, and emits side illumination light directed toward the opening 801 obliquely upward in a nearly horizontal direction. The side illumination portion 83 is arranged on the inner wall of the large diameter portion 802 so as to surround the illumination center 8C. The side illumination unit 83 irradiates side illumination light from substantially the side of the rotary head 40 above the opening 801 toward the side surface of the electronic component 6 held by the suction nozzle 42 .

The side lighting section 83 is composed of an upper ring-shaped light source group 84 (upper light beam irradiation section) and a lower ring-shaped light source group 85 (lower light irradiation section), which are two-level point light source groups. The upper annular light source group 84 is formed by arranging a plurality of upper point light sources 84A (first point light sources) in an annular row on the inner wall of the large-diameter portion 802 near the opening 801 . The lower annular light source group 85 is a light source group arranged one step below the upper annular light source group 84, and is formed by arranging a plurality of lower point light sources 85A (second point light sources) in a row in a ring. The lower point light source 85A is arranged on the inner wall of the large diameter portion 802 so as to be adjacent to and below the upper point light source 84A. As will be described in detail later, in this embodiment, the side illumination unit 83 is composed of two upper and lower stages, an upper annular light source group 84 and a lower annular light source group 85, and emits illumination light having different irradiation angles. As a result, even if the electronic component 6 exists at any position on the opening 801, the entire side surface of the component can be evenly irradiated with the side illumination light.

FIG. 4 is a diagram showing illumination conditions of the electronic component 6 by the above-described coaxial illumination light, diffuse illumination light, and side illumination light. Here, lighting conditions by the conventional lighting device 800 are shown in consideration of the description of the comparative example described below. The illumination device 800 includes a coaxial illumination section 81, a diffusion illumination section 82, and a side illumination section 830 in the same manner as the illumination apparatus 8 of the present embodiment shown in FIG. This embodiment is different from the present embodiment in that a plurality of point light sources 830A are arranged in a row annularly.

FIG. 4 shows an example in which the electronic component 6 held by the suction nozzle 42 is irradiated with illumination light and imaged at the position of the illumination center 8C. For example, an in-line head can image the electronic component 6 at the illumination center 8C. A chip component is exemplified as the electronic component 6, and the electronic component 6 has a flat bottom surface 601, a side surface 602 perpendicular to the bottom surface 601, and an R surface 603 connecting the edge of the bottom surface 601 and the lower end of the side surface 602. and has a substantially rectangular parallelepiped shape.

The coaxial illumination light emitted from the coaxial illumination unit 81 is emitted toward the bottom surface 601 of the electronic component 6 from directly below the electronic component 6 held by the suction nozzle 42 . Here, since the bottom surface 601 is a plane orthogonal to the imaging optical axis 11A, it is specularly reflected light from the bottom surface 601 that enters the component recognition camera 11 among the reflected light of the coaxial illumination light. Therefore, as shown in block (a) of FIG. 4 , an optical image of the first area LA corresponding to the bottom surface 601 is captured by the component recognition camera 11 . The left figure of the block is a side view of the electronic component 6, and the right figure is a bottom view of the component observed as an image.

The diffused illumination light emitted from the diffused illumination unit 82 is emitted from obliquely below the electronic component 6 toward the R surface 603 of the electronic component 6 . The inclination angle of the optical axis of the diffuse illumination light with respect to the imaging optical axis 11A is, for example, 45 degrees. Among the reflected light of the diffuse illumination light, the reflected light from the area near the bottom surface 601 of the R surface 603 and the portion corresponding to the vicinity of the outer periphery of the bottom surface 601 is incident on the component recognition camera 11 . Therefore, as shown in the block (b) of FIG. 4, the part recognition camera 11 captures optical images of a region near the bottom surface 601 of the R surface 603 and a second region LB corresponding to the vicinity of the outer peripheral edge of the bottom surface 601. be.

The side illumination light emitted from the side illumination section 830 is emitted from almost right beside the electronic component 6 toward the side surface 602 of the electronic component 6 . Of the reflected light of the side illumination light, the reflected light corresponding to the vicinity of the lower end of the side surface 602 and the region of the R surface 603 near the side surface 602 is incident on the component recognition camera 11 . Therefore, as shown in block (c) of FIG. 4 , the component recognition camera 11 captures an optical image of the third region LC corresponding to the vicinity of the lower end of the side surface 602 and the region of the R surface 603 near the side surface 602 .

The side illumination light is the illumination light that illuminates the outer periphery of the electronic component 6 . When the electronic component 6 is not irradiated with the side illumination light, the optical image of the third area LC is not captured, so the size of the electronic component 6 recognized on the image is observed to be smaller than the actual size. In this case, the recognition accuracy of the electronic component 6 is lowered. Therefore, in order to acquire an image of the electronic component 6 with the actual size, it is essential to irradiate the side illumination light.

[Problem of Conventional Lighting Device]
Next, the problem of component recognition when using the conventional illumination device 800 will be described. When electronic component 6 is imaged at the position of illumination center 8C of illumination device 800, no particular problem occurs as described above. However, when it is difficult to image the electronic component 6 at the position of the illumination center 8C, such as when the rotary head 40 is used, the conventional illumination device 800 may not be able to accurately recognize the component. This point will be described with reference to FIGS. 5 and 6. FIG.

FIG. 5 shows an electronic component 6A held by one suction nozzle 42A of a rotary head 40 and an electronic component 6B held by a suction nozzle 42B opposite to the suction nozzle 42A in a conventional lighting device 800. , indicates a state in which illumination light is emitted. In the case of the rotary head 40, since a plurality of unit heads 41 are arranged on the circumference, the electronic component 6 held by each suction nozzle 42 is irradiated with the side illumination light at a position offset from the illumination center 8C. It will be. As a result, the amount of side illumination light emitted to the side surface of the electronic component 6 closer to the side illumination section 830 tends to increase, while the side surface farther from the side illumination section 830 tends to receive a smaller amount of illumination light.

FIG. 5 shows an electronic component 6A sucked by a suction nozzle 42A offset leftward from the illumination center 8C and an electronic component 6B sucked by a suction nozzle 42B offset rightward. there is The

suction nozzles

42A and 42B are nozzles positioned opposite to each other in the rotary head 40 . The left electronic component 6A receives the side illumination light exclusively from the left point light source 830A of the side illumination section 830. FIG. A side surface 602A near the point light source 830A of the electronic component 6A receives a large amount of side illumination light, so the amount of irradiation increases, but the side surface 602B far from the point light source 830A does not receive the side illumination light from the point light source 830A. The side illumination light from the right point light source 830B on the opposite side also does not sufficiently reach the side surface 602B because the distance is long by the offset. Therefore, the irradiation amount of the side illumination light for the side surface 602B is insufficient.

As a result, the irradiation state of the side illumination light to the electronic component 6A is biased toward the left side surface 602A. Therefore, the portion of the right side surface 602B is not reflected in the image L11 captured for the electronic component 6A. Therefore, the measured dimension d11 smaller than the actual dimension d1 of the electronic component 6A by the amount of decrease Δd1 due to the non-illuminating portion of the side surface 602B is derived by the image processing. Moreover, the image L11 has a tapered shape in which the width decreases from the left side surface 602A toward the right side surface 602B, and the electronic component 6A is identified as having such a component shape.

Similarly, the electronic component 6B on the right receives side illumination light exclusively from the point light source 830B on the right. The side illumination light reaches the side surface 602B near the point light source 830B of the electronic component 6B, but the side illumination light does not reach the side surface 602A far from the point light source 830B. The side illumination light from the left point light source 830A on the opposite side also does not sufficiently reach the side surface 602A because it is farther by the offset amount, so that the irradiation amount of the side illumination light for the side surface 602A is insufficient for the electronic component 6B. Therefore, the left side surface 602A is not reflected in the image L12 captured for the electronic component 6B. Therefore, a measured dimension d12 that is smaller than the actual dimension d2 of the electronic component 6B by the amount of decrease Δd2 associated with the non-illuminating portion of the side surface 602A is derived by image processing. Further, the image L12 has a tapered shape in which the width decreases from the right side surface 602B toward the left side surface 602A, and the electronic component 6B is identified as having such a component shape.

When component recognition of the

electronic components

6A and 6B is performed based on the images L11 and L12 as described above, recognition accuracy decreases. Specifically, since the component width between the side surfaces 602A and 602B is required to be smaller by Δd1 and Δd2, measurement of the component size becomes inaccurate. In addition, the measurement result of the component center position, which is referred to when mounting the component, is also inaccurate. Furthermore, since the shape of the component is also not accurately identified, there may be cases where the component pick-up posture cannot be evaluated accurately.

FIG. 6 is a diagram showing a conventional example intended to solve the problem shown in FIG. In the example of FIG. 6, when the head is the rotary head 40, the part is imaged without irradiating the side illumination light. That is, the coaxial illumination unit 81 and the diffusion illumination unit 82 are turned on, and the coaxial illumination light and the diffusion illumination light are applied to the component, but the side illumination unit 830 is turned off.

In this case, the image L21 acquired for the electronic component 6A sucked by the left sucking nozzle 42A is entirely smaller than the actual dimension d3 of the electronic component 6A because the side illumination light is omitted. The dimension d13 will be derived by image processing. Similarly, in the image L22 acquired for the electronic component 6B sucked by the right suction nozzle 42B, a measured dimension d14 that is overall smaller than the actual dimension d4 of the electronic component 6B is derived by image processing.

In the conventional example of FIG. 6, it is avoided that the side illumination light is irradiated unevenly, and in anticipation that the measured dimensions d13 and d14 of the

electronic components

6A and 6B that are overall smaller than the actual dimensions d3 and d4 are derived. parts recognition. That is, the images L21 and L22 are similar to the actual component shape, and shape deformation does not occur unlike the example of FIG. Then, the degree of divergence between the actual dimensions d3, d4 and the measured dimensions d13, d14 is obtained experimentally, and a correction coefficient for filling the divergence is set in advance. In recognizing the

electronic parts

6A and 6B, the approximate dimensions of the actual dimensions d3 and d4 are obtained by a correction calculation in which the measured dimensions d13 and d14 are multiplied by the correction coefficients.

According to the conventional example of FIG. 6, the component recognition accuracy can be improved to some extent. However, since the irradiation of the side illumination light is omitted, the peripheral portions of the

electronic components

6A and 6B are not actually illuminated, and there is a limit to the accuracy improvement. Further, since correction calculation is required for each component recognition, there is a problem that the processing load of the control device 7 is increased. This embodiment provides a lighting device 8 that can solve the problems of the conventional examples of FIGS. 5 and 6. FIG.

[Side lighting unit according to the embodiment]
FIG. 7 is a diagram showing the configuration of the side lighting section 83 according to this embodiment. The side illumination unit 83 includes the upper annular light source group 84 and the lower annular light source group 85 as described above. The upper annular light source group 84 and the lower annular light source group 85 are each formed by arranging a plurality of point light sources in a row around the illumination center 8C. In FIG. 7, among the plurality of point light sources, point

light sources

84A and 84B (first point light sources) facing each other at 180 degrees as those of the upper annular light source group 84 are assumed to be those of the lower annular light source group 85. 85A and 85B (second point light sources) are shown.

Each of the point

light sources

84A and 84B included in the upper annular light source group 84 emits the first irradiation light S1 that spreads at the first irradiation angle R1. Each of the point

light sources

85A and 85B included in the lower annular light source group 85 emits the second irradiation light S2 that spreads at the second irradiation angle R2. The second illumination angle R2 is a smaller illumination angle (R1>R2) than the first illumination light S1. For example, R2 can be selected from a range of about 1/4 to 3/4 of R1, depending on the circumferential diameter of the arrangement of the suction nozzles 42 in the rotary head 40 and the sizes of the opening 801 and the large diameter portion 802 of the housing 80 . FIG. 7 shows an example in which R2 is about 1/2 of R1.

The first irradiation light S1 has a first optical axis AX1, and the second irradiation light S2 has a second optical axis AX2. Here, the point

light sources

84A and 85A in the upper and lower two stages located near the suction nozzle 42A offset to the left with respect to the illumination center 8C are defined as a first point light source pair PA, and the suction nozzle 42B offset to the right. The upper and lower two-stage point

light sources

84B and 85B located close to are referred to as a second point light source pair PB. Seen from the first point light source pair PA, the suction nozzle 42A (first unit head) on the left is located near, and the suction nozzle 42B (second unit head) on the right is located far. On the other hand, when viewed from the second point light source pair PB, the suction nozzle 42B (first unit head) on the right is located near, and the suction nozzle 42A (second unit head) on the left is located far.

In the first point light source pair PA, the first optical axis AX1 of the first irradiation light S1 emitted by the upper point light source 84A is directed to the component holding position of the suction nozzle 42A. That is, the first optical axis AX1 points toward the outer surface of the electronic component 6A held by the suction nozzle 42A on the closer side. On the other hand, the second optical axis AX2 of the second irradiation light S2 emitted by the lower stage point light source 85A points toward the component holding position of the suction nozzle 42B. That is, the second optical axis AX2 points toward the inner surface of the electronic component 6B held by the suction nozzle 42B on the far side. The "inner side" of the

electronic components

6A, 6B is the side facing the illumination center 8C, and the "outer side" is the opposite side.

On the other hand, in the second point light source pair PB, the first optical axis AX1 of the first irradiation light S1 emitted by the upper point light source 84B is directed toward the outer surface of the electronic component 6B held by the suction nozzle 42B on the closer side. are doing. On the other hand, the second optical axis AX2 of the second irradiation light S2 emitted by the lower stage point light source 85B points toward the inner surface of the electronic component 6A held by the suction nozzle 42A on the far side.

It should be noted that there are cases where the two

suction nozzles

42A and 42B pick up electronic components 6 with different heights, that is, the heights of the bottom surfaces of the components are different. In order to cope with this, the

suction nozzles

42A and 42B hold the electronic components within the range of the depth of field Df of the component recognition camera 11 . It can also be said that the first optical axis AX1 and the second optical axis AX2 point to positions where the XY positions of the

suction nozzles

42A and 42B and the range of the depth of field Df overlap.

Since the first optical axis AX1 and the second optical axis AX2 are oriented as described above, the outer surface of the left electronic component 6A is irradiated with the first irradiation light from the upper point light source 84A of the first point light source pair PA. S1 is irradiated, and the inner surface is irradiated with the second irradiation light S2 of the lower stage point light source 85B of the second point light source pair PB. Of course, irradiation light from another pair of point light sources (not shown) included in the side illumination unit 83 is also emitted, but only the pair of point light sources PA and PB is considered here for simplification of explanation. By the irradiation of the first irradiation light S1 and the second irradiation light S2, the side illumination light spreads evenly over the entire side surface of the electronic component 6A. Therefore, when an image is captured by the component recognition camera 11, the image L1 of the outer peripheral portion of the electronic component 6A based on the reflected light of the side illumination light can be observed satisfactorily. Therefore, it is possible to acquire the measured dimension corresponding to the actual dimension dA of the electronic component 6A from the image captured by the component recognition camera 11. FIG.

Similarly, the outer surface of the right electronic component 6B is irradiated with the first irradiation light S1 of the upper point light source 84B of the second point light source pair PB, and the inner surface thereof is irradiated with the lower point light source of the first point light source pair PA. The second irradiation light S2 of 85A is irradiated. By these irradiations, the side illumination light spreads evenly over the entire side surface of the electronic component 6B, and the image L2 of the outer peripheral portion of the electronic component 6B based on the reflected light of the side illumination light can be observed satisfactorily. Therefore, it is possible to acquire the measured dimension corresponding to the actual dimension dB of the electronic component 6B.

FIG. 8A is a diagram showing a setting example of the inclination of the first optical axis AX1 of the first irradiation light S1 and the second optical axis AX2 of the second irradiation light S2. Since the side illumination light is illumination for illuminating the third area LC near the lower end of the side surface 602 of the electronic component 6 as described with reference to FIG. desirable. However, since it is necessary to irradiate the electronic component 6 passing over the housing 80 with illumination light through the opening 801, it is desirable to incline the first optical axis AX1 and the second optical axis AX2 upward to some extent.

In view of the above, the angle θ1 formed by the first optical axis AX1 with respect to the horizontal plane HS and the angle θ2 formed by the second optical axis AX2 with respect to the horizontal plane HS are set to be inclined upward within the range of 0 to 20 degrees. It is desirable that In FIG. 8A, the relationship between .theta.1 and .theta.2 is depicted as .theta.1.apprxeq..theta.2, but this is an example, and .theta.1<.theta.2 or .theta.1>.theta.2 may be satisfied. In the example of FIG. 8(A), θ1 of the first optical axis AX1 of the upper point light source 84A is the attachment position of the upper point light source 84A to the housing 80 and the part of the left suction nozzle 42A, which is the irradiation target position. It is determined by the suction position. On the other hand, θ2 of the second optical axis AX2 of the lower point light source 85A is determined by the attachment position of the lower point light source 85A to the housing 80 and the component pickup position of the right suction nozzle 42B.

FIG. 8(B) is a diagram showing a measurement example of the relationship between the inclination of the optical axes AX1 and AX2 and the irradiation range of the electronic component 6 by all the illumination light of the lighting device 8. FIG. In this measurement example, when θ1 = θ2 = 10 degrees, 99.6% of the total area (100%) from the bottom surface 601 of the electronic component 6 to the side surface 602 via the R surface 603 is covered by illumination light. was irradiated. Even when θ1=θ2=20 degrees, 98.3% of the area was irradiated with the illumination light. On the other hand, when θ1=θ2=30 degrees, only 96.2% of the area is irradiated with the illumination light, and it has been found that the reduction ratio with respect to the actual size is increased. Therefore, by setting θ1=θ2=0 to 20 degrees, the area near the side surface 602 of the R surface 603 can be illuminated, and the reflected light can be well incident on the component recognition camera 11 . Thereby, the image recognition accuracy of the electronic component 6 can be improved.

[Specific configuration example of irradiation angle setting]
Next, a specific setting example of the first irradiation angle R1 of the first irradiation light S1 and the second irradiation angle R2 of the second irradiation light S2 will be described. The irradiation angle can be set by whether or not an optical lens is arranged on the light beam exit surface of each of the point light sources provided in the upper annular light source group 84 and the lower annular light source group 85, or by the difference in the degree of convergence of the optical lens. is.

9(A) to (C) are diagrams showing various embodiments of the side illumination unit 83. FIG. Here, an example is shown in which an upper LED light source 86 and a lower LED light source 87 are used as the upper point light source 84A (first point light source) and the lower point light source 85A (second point light source). As the

LED light sources

86 and 87, for example, tape-type light sources in which a large number of LED chips are arranged in a line on a flexible tape substrate can be used.

FIG. 9A shows an example in which a lensless LED is used as the upper LED light source 86 and an LED with an integral condenser lens 91 is used as the lower LED light source 87 . That is, an example is shown in which an optical lens for condensing light is arranged only on the light emitting surface of the lower LED light source 87 . The upper stage LED light source 86 emits the first irradiation light S1 with the original light irradiation angle of the lensless LED being the first irradiation angle R1. On the other hand, the lower LED light source 87 emits the second irradiation light S2 at the second irradiation angle R2 narrowed by the condenser lens 91 from the first irradiation angle R1.

FIG. 9(B) is also an example similar to FIG. 9(A), showing an example in which a post-attached condenser lens 92 made of, for example, acrylic resin is arranged only on the light emitting surface of the lower LED light source 87. there is The condenser lens 92 emits the second irradiation light S2 at a second irradiation angle R2 narrower than the first irradiation angle R1.

FIG. 9(C) is an example in which a retrofitted lens having a condensing effect is arranged on both the light emitting surfaces of the upper LED light source 86 and the lower LED light source 87 . Here, a lens unit 93 made of acrylic resin is illustrated. The lens unit 93 includes a first condensing portion 931 arranged on the light emitting surface of the upper LED light source 86 and a second condensing portion 932 arranged on the light emitting surface of the lower LED light source 87 . Both the first light collecting portion 931 and the second light collecting portion 932 have a convex lens with a light collecting function, but the first light collecting portion 931 is a convex lens with a smaller light collecting degree than the second light collecting portion 932. . The first light condensing part 931 produces the first illumination light S1 having the required first illumination angle R1, and the second light condensing part 932 creates the second illumination light S2 having the required second illumination angle R2.

FIG. 10 is a diagram showing another embodiment of the side lighting section 83. FIG. Here, an example is shown in which the upper stage light irradiation section and the lower stage light irradiation section are configured by sharing point light sources arranged in a line. The side illumination unit 83 in the example of FIG. 10 has only a ring light source group in which LED light sources 88 as a plurality of point light sources are arranged in a row in a ring. An optical component 94 is arranged on the light exit surface of each LED light source 88 .

The optical component 94 has a first optical surface 941 (upper beam irradiation section) having a predetermined first light-condensing characteristic, and a second optical surface having a second light-condensing characteristic with a higher light-condensing degree than the first light-condensing characteristic. 942 (lower stage light irradiation unit). The first optical surface 941 consists of a plane that does not substantially have a light condensing function. The second optical surface 942 is a surface having a convex curved surface that is connected to the lower end of the first optical surface 941 and has a light condensing function. Part of the light emitted by the LED light source 88 is emitted from the first optical surface 941 and the other part is emitted from the second optical surface 942 .

The first optical surface 941 emits the first irradiation light S1 that irradiates the electronic component 6A held by the suction nozzle 42A on the proximal side. The second optical surface 942 emits the second irradiation light S2 with an irradiation angle narrower than that of the first irradiation light S1 due to its convex surface, and irradiates the electronic component 6B held by the suction nozzle 42B on the far end side. do. According to the example of FIG. 10 , one LED light source 88 is used to emit the first irradiation light S1 and the first irradiation light S1 without arranging a point light source for each of the upper and lower light emitting portions of the side illumination portion 83 . 2 irradiation light S2 can be emitted. That is, the light beam emitted by the LED light source 88 can be split by the optical component 94, and the first irradiation light S1 and the second irradiation light S2 can be emitted from the first optical surface 941 and the second optical surface 942, respectively.

[Example of luminosity adjustment]
The

electronic components

6A, 6B, . . . held by the

suction nozzles

42A, 42B, . Specifically, in the side illumination unit 83 of the present embodiment shown in FIG. 7, the first irradiation light S1 of the upper point light source 84A is emitted from the electronic component 6A held by the suction nozzle 42A (first unit head) on the proximal side. and the luminous intensity with which the electronic component 6B held by the suction nozzle 42B (second unit head) on the far end side is irradiated with the second irradiation light S2 of the lower stage point light source 85A is preferably substantially the same. . In other words, it is desirable that the first irradiation angle R1 and the second irradiation angle R2 are set so as to have such irradiation light intensity.

11(A) and (B) are diagrams showing the relationship between the directivity angle and the luminous intensity of the irradiation light. Here, as the point light sources, the lensless upper LED light source 86 shown in FIG. 9A and the lower LED light source 87 with the integrated condenser lens 91 are exemplified. FIG. 11A shows a state in which the upper LED light source 86 irradiates the first irradiation light S1 at a directivity angle E1, and FIG. ) in which the second irradiation light S2 is emitted. The directivity angle is an angle at which brightness is 50% of the brightness on the optical axis of the illumination light, and is different from the illumination angles R1 and R2 described above, which simply indicate the spread of the illumination light.

When the total luminous flux of the irradiated light is the same and the directivity angle is the same, the distance LWD from the light source to the irradiated object is inversely proportional to the luminous intensity, which indicates the intensity of the light. Specifically, if the luminous intensity at a position a distance LWD1 from the upper LED light source 86 is Cd1, the luminous intensity Cd2 at a position two times the distance LWD1 from the upper LED light source 86 is Cd1. Assume that the condensing lens 91 in FIG. 11B is a lens that makes the directivity angle E2 of the second irradiation light S2 half the directivity angle E1 of the first irradiation light S1. If the total luminous flux is the same and the directivity angle is 1/2, the luminous intensity Cd3 at the position of the distance LWD2, which is twice the distance LWD1, is the same as the luminous intensity Cd1.

It is assumed that the upper LED light source 86 and the lower LED light source 87 have the same total luminous flux and the above directivity angles E1 and E2. In this case, the electronic component 6A held by the suction nozzle 42A at the position of the distance LWD1 and the electronic component 6B held by the suction nozzle 42B at the position of the distance LWD2 may be positioned at the time of imaging. As a result, the side surfaces of the

electronic components

6A and 6B held by the

suction nozzles

42A and 42B can be irradiated with side illumination light having substantially the same luminosity.

It is also conceivable to use irradiation light that is collimated into parallel light instead of irradiation light that diffuses in proportion to the distance like the irradiation lights S1 and S2. If it is collimated light, it is possible to make the luminous intensity of the irradiation light for the

electronic components

6A and 6B different in distance LWD the same. However, the

electronic components

6A and 6B are three-dimensional objects rather than two-dimensional objects, and in order to illuminate the three-dimensional parts with side illumination light, it is necessary to use irradiation lights S1 and S2 that spread at irradiation angles R1 and R2.

FIG. 12(A) shows irradiation light SL having an irradiation angle, and FIG. 12(B) shows parallel light HL, respectively. FIG. 10 is a diagram showing incident conditions to each. The chip component 61 generally has an R surface or an inclined surface near the edge of its bottom surface. When the irradiation light SL is irradiated from the side of the chip component 61, the reflected light RSL from the edge peripheral surface of the bottom surface having various surface angles is evenly incident on the entrance pupil 11B. In contrast, with the parallel light HL, only the reflected light RHL having a specific reflection angle enters the entrance pupil 11B. For this reason, the outer peripheral shape of the chip component 61 cannot be accurately imaged.

FIGS. 13A and 13B show an example of irradiating a ball bump component having a hemispherical electrode 63 with irradiation light SL and parallel light HL. When the hemispherical electrode 63 is irradiated with the irradiation light SL having the irradiation angle shown in FIG. 13A, the reflected light RSL from each portion of the hemispherical electrode 63 enters the entrance pupil 11B. On the other hand, with the parallel light HL shown in FIG. 13B, only the reflected light RHL from one point on the hemispherical electrode 63 enters the entrance pupil 11B. Therefore, it is necessary to use irradiation light SL having a predetermined irradiation angle as the side illumination light.

[Imaging example by imaging sensor]
The illumination device 8 of the present embodiment can be used both when the imaging sensor included in the component recognition camera 11 is an area sensor or when it is a line sensor. FIGS. 14A and 14B are diagrams showing irradiation conditions of side illumination light when the component recognition camera 11 has an area sensor. The area sensor has a two-dimensional imaging range G1, and acquires an image for one frame by imaging the imaging range G1 at once. FIG. 14A shows a state in which

electronic components

6A, 6B, 6C, . showing the situation.

In this case, all the

electronic components

6A, 6B, 6C, . It receives irradiation light S2. As described above, the combined irradiation of the first irradiation light S1 and the second irradiation light S2 in two stages above and below makes it possible to evenly irradiate the side illumination light to all the side surfaces of the

electronic components

6A and 6B located at opposite positions.

On the other hand, FIG. 14(B) is an example in which only one of the eight suction nozzles 42 holds the electronic component 6C. In this case, the electronic component 6C is imaged at the position of the illumination center 8C. Even at the illumination center 8C, side illumination light can be applied to all sides of the electronic component 6C. That is, the left side surface of the electronic component 6C is irradiated with the second irradiation light S2 from the lower point light source 85A of the lower annular light source group 85 on the left. Further, the right side surface of the electronic component 6C is irradiated with the second irradiation light S2 from the lower point light source 85B of the lower annular light source group 85 on the right. The remaining two sides are similarly illuminated by another pair of lower point light sources 85A.

FIGS. 15(A) and (B) are diagrams showing illumination conditions of side illumination light when the component recognition camera 11 is equipped with a line sensor. The line sensor has a line-shaped imaging range G2 and sequentially captures images for each line while relatively moving in a predetermined imaging direction F to obtain an image for one frame.

FIG. 15(A) shows a state in which the image of the electronic component 6B at the tip in the movement direction, among the electronic components held by the eight suction nozzles 42, is being imaged. In this case, the electronic component 6B is imaged at the position of the illumination center 8C. Therefore, as in the case of FIG. 14B, the second illumination light S2 emitted by the pair of lower stage point light sources 85A arranged on opposite poles can illuminate the entire side surface of the electronic component 6B with side illumination light.

FIG. 15B shows a state in which, of the electronic components held by the eight suction nozzles 42, two

electronic components

6C and 6D positioned on an axis perpendicular to the imaging direction F are being imaged. there is In this case, the

electronic components

6C and 6D are imaged at positions offset from the illumination center 8C. At this time, as in the case of FIG. 14(B), side illumination light is applied to all side surfaces of the

electronic components

6C and 6D located at opposite positions by combined irradiation of the first irradiation light S1 and the second irradiation light S2 in the upper and lower two stages. can be emitted evenly. As described above, regardless of whether the component recognition camera 11 includes an area sensor or a line sensor, and whether the imaging position is the illumination center 8C or a position offset from the illumination center 8C, the electronic component 6 It is possible to evenly irradiate all side surfaces with side illumination light.

[Inventions included in the above embodiments]
A component mounting apparatus according to one aspect of the present invention includes a head that holds a component and mounts it on a board, an imaging unit that captures an image of the component held by the head from below the head, and a a lighting device including a side lighting unit that irradiates the component with illumination light from the side of the component, wherein the side lighting unit emits, as the illumination light, a first irradiation light that spreads at a first irradiation angle. and a lower ray emitting part arranged below the upper ray emitting part and emitting second irradiation light that spreads at a second irradiation angle smaller than the first irradiation angle.

According to this component mounting apparatus, the side lighting section is composed of the upper and lower light beam emitting sections, so that the illumination area by the first irradiation light and the illumination area by the second irradiation light are different from each other. can be set. Further, since the second irradiation light has a second irradiation angle smaller than the first irradiation angle, an area farther than the first irradiation light can be made the illumination area. Therefore, even if the part held by the head is offset from the illumination center of the lighting device, the combined irradiation of the first irradiation light and the second irradiation light uniformly illuminates the side illumination light on all sides of the part. can be irradiated to

In the component mounting apparatus described above, the upper beam emitting section and the A configuration may be employed in which the lower stage light emitting section is provided.

According to this component mounting device, it is possible to accurately irradiate the side surfaces of the component held by the head with the illumination light from the side lighting section. Therefore, the reflected light near the edge of the bottom surface of the component can be favorably incident on the imaging section, and the image recognition accuracy of the component can be improved.

In the above-described component mounting apparatus, the upper light beam emitting section is composed of an upper annular light source group in which a plurality of first point light sources are arranged in a ring, and the lower light beam emitting section includes each of the first points of the upper annular light source group. A lower annular light source group in which a plurality of second point light sources are annularly arranged so as to be adjacent to the lower side of the light source may be used.

According to this component mounting device, the upper and lower light beam exiting portions are each composed of an annular array of point light sources, so that the construction and control of the side lighting portion can be facilitated.

In the component mounting apparatus described above, the head includes a plurality of unit heads each holding a component, and includes one of the first point light sources and one of the first point light sources below and adjacent to the one of the first point light sources. A first unit head located close to a point light source pair of two point light sources and a second unit head located far away exist, and the first irradiation light emitted by one of the first point light sources is The optical axis is directed to the component holding position of the first unit head, and the optical axis of the second irradiation light emitted by one of the second point light sources is directed to the component holding position of the second unit head. Also good.

According to this component mounting apparatus, the first point light source and the second point light source of one point light source pair irradiate the side surface of the component held by the first unit head facing the first point light source with the first irradiation light. is irradiated, and the side surface of the component held by the second unit head facing the second point light source is irradiated with the second irradiation light. Since the point light source pairs are arranged in a ring, the first point light source and the second point light source of the other point light source pair positioned opposite to the one point light source pair cause the opposite side surface of the component to 1st irradiation light and 2nd irradiation light are each irradiated. Therefore, it is possible to irradiate the side illumination light onto all the side surfaces of the components respectively held by the first unit head and the second unit head.

In the component mounting apparatus described above, the light intensity with which the first irradiation light irradiates the component held by the first unit head, and the light intensity with which the second irradiation light irradiates the component held by the second unit head. It is desirable that the first irradiation angle and the second irradiation angle are set such that the .

According to this component mounting apparatus, it is possible to irradiate the side surfaces of the components held by the first unit head and the second unit head with side illumination light having substantially the same luminosity.

In the above-described component mounting apparatus, the first point light source and the second point light source are LED light sources, and the first irradiation angle and the second irradiation angle are optical elements arranged on light emitting surfaces of the LED light sources. The configuration may be set by the presence or absence of a lens, or by the difference in the degree of condensing of the optical lens.

According to this component mounting apparatus, by combining a general-purpose LED light source and an optical lens, it is possible to emit first irradiation light having an appropriate first irradiation angle and second irradiation light having an appropriate second irradiation angle.

In the above-described component mounting apparatus, the side lighting section is composed of a ring light source group in which a plurality of point light sources are arranged in a row in a ring, is arranged on the light exit surface of each of the point light sources, and has the first light collection characteristic. and a second optical surface having a second light-condensing property with a higher light-condensing degree than the first light-condensing property, wherein the upper ray exit part is the first optical The second optical surface may be set to the second optical surface, and the lower ray exit portion may be set to the second optical surface.

According to this component mounting apparatus, the first irradiation light and the second irradiation light can be emitted without arranging a point light source in each of the upper and lower light beam emitting portions. In other words, the light beam emitted by the point light source can be split by the optical component, and the first irradiation light can be emitted from the first optical surface, and the second irradiation light can be emitted from the second optical surface.

In the component mounting apparatus described above, the head may be a rotary head having a plurality of unit heads arranged in a ring.

The parts held by the rotary head do not line up in a straight line like in-line heads, but line up on a circle. Therefore, the component is illuminated with side illumination light at a position offset from the illumination center of the illumination device. Therefore, there is a great advantage in applying the side lighting section that emits the first irradiation light and the second irradiation light.

In the component mounting apparatus described above, the illumination device includes a coaxial illumination unit that irradiates illumination light from below the head toward the bottom surface of the component held by the head; If a diffusion illumination unit that irradiates illumination light toward the part is further provided, illumination light can be evenly applied to the bottom surface side of the component held by the head, and recognition accuracy can be improved.

According to the component mounting apparatus according to the present invention described above, even when the component to be imaged is offset from the illumination center of the lighting device, the side surface of the component can be uniformly irradiated with the side illumination light. be able to.

Claims

a head that holds the component and mounts it on the substrate;
an imaging unit that captures an image of a component held by the head from below the head;
a lighting device including a side lighting unit that irradiates the part held by the head with illumination light from the side of the part,
The side illumination unit includes an upper light beam emitting unit that emits, as the illumination light, first irradiation light that spreads at a first irradiation angle, and a second irradiation unit that is arranged below the upper light beam emitting unit and has a smaller irradiation angle than the first irradiation angle. A component mounting apparatus comprising: a lower stage light emitting section that emits a second irradiation light that spreads at corners.
In the component mounting apparatus according to claim 1,
The upper and lower beam emitting units are arranged such that the optical axes of the first and second irradiation beams are inclined upward with respect to a horizontal plane within a range of 0 to 20 degrees. A component mounting device installed.
In the component mounting apparatus according to claim 1 or 2,
The upper light beam emitting unit comprises an upper ring-shaped light source group in which a plurality of first point light sources are arranged in a ring,
The component mounting device, wherein the lower light beam emitting section comprises a lower annular light source group in which a plurality of second point light sources are arranged in a ring so as to be adjacent to and below each first point light source of the upper annular light source group.
In the component mounting apparatus according to claim 3,
the head comprises a plurality of unit heads each holding a component;
A first unit head located near a point light source pair of one of the first point light sources and one of the second point light sources adjacent below the one of the first point light sources, and a first unit head located far from the pair of the point light sources. and a second unit head at
an optical axis of the first irradiation light emitted by one of the first point light sources is directed to a component holding position of the first unit head;
The component mounting apparatus, wherein the optical axis of the second irradiation light emitted from one of the second point light sources is oriented toward the component holding position of the second unit head.
In the component mounting apparatus according to claim 4,
The light intensity with which the first irradiation light irradiates the component held by the first unit head and the light intensity with which the second irradiation light irradiates the component held by the second unit head are substantially the same. , the component mounting apparatus, wherein the first irradiation angle and the second irradiation angle are set.
In the component mounting apparatus according to claim 4 or 5,
The first point light source and the second point light source are LED light sources,
The component mounting apparatus, wherein the first angle of illumination and the second angle of illumination are set by the presence or absence of an optical lens arranged on the light emitting surface of each of the LED light sources, or by the difference in the degree of convergence of the optical lens.
In the component mounting apparatus according to claim 1 or 2,
The side illumination unit comprises an annular light source group in which a plurality of point light sources are arranged in a row in a ring,
A first optical surface having a first light-condensing property and a second optical surface having a second light-condensing property having a higher degree of light-condensing than the first light-condensing property, which are arranged on a light beam exit surface of each of the point light sources. further comprising an optical component comprising ,
The component mounting apparatus, wherein the upper light beam exit portion is set on the first optical surface, and the lower light beam exit portion is set on the second optical surface.
In the component mounting apparatus according to any one of claims 1 to 7,
The component mounting apparatus, wherein the head is a rotary head having a plurality of unit heads arranged in a ring.
In the component mounting apparatus according to any one of claims 1 to 8,
The illumination device includes a coaxial illumination unit that emits illumination light from below the head toward the bottom surface of the component held by the head, and an illumination light that emits illumination light from obliquely below the head toward the periphery of the bottom surface of the component. A component mounting apparatus, further comprising: a diffuse lighting unit that irradiates.