JP4901451B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus having an imaging unit for correcting a relative positional relationship between a component sucked by a suction nozzle and an electronic circuit board, and more specifically, the imaging unit can change an imaging magnification, In addition, the present invention relates to a component mounting apparatus that can easily correct the position of the optical axis when changing the imaging magnification and accurately grasp the imaging magnification.

  In mounting electronic parts on an electronic circuit board, it is required to accurately mount the electronic parts on the electronic circuit board and improve the mounting quality. However, in recent years, electronic components have become smaller and more diverse. Therefore, it is becoming difficult to satisfy this requirement.

  In order to cope with this, Patent Document 1 describes a component mounting device that can change an image magnification by a zoom lens and recognize a component with an optimum field of view. Since the optical axis is shifted when the position is changed, it has been difficult to apply when high accuracy is required for mounting electronic components on the electronic circuit board.

  As a technique for improving the component mounting accuracy of such a component mounting apparatus, Patent Document 2 discloses that the nozzle center position is measured every time the recognition field of view is changed, and the acquired nozzle center position data and the nozzle center position data of the current field of view are obtained. A component mounting apparatus that can calculate the relative position of the nozzle and obtain nozzle position correction data in the latest visual field is described.

  FIG. 10 shows an overall schematic diagram of the component mounting apparatus described in Patent Document 2. As shown in FIG. Reference numeral 1 denotes an electronic circuit board, 2 denotes a transport unit that carries the electronic circuit board 1 in and out, 3 and 4 denote component supply units, 5 denotes an XY robot, and 6 denotes a head unit including a nozzle that sucks and mounts electronic components. The XY robot 5 positions the head unit 6 at an arbitrary position. Reference numeral 7 denotes a component recognition camera (second image pickup means) with a zoom lens for imaging and measuring the suction posture of the electronic component, and reference numeral 8 denotes a nozzle station having a replacement nozzle tip.

  FIG. 11 is a detailed view of the electronic circuit board 1, the head unit 6, the component recognition camera 7 with a zoom lens, and the nozzle station 8 in the component mounting apparatus described in Patent Document 2. In FIG. 11, the electronic circuit board 1 is accurately arranged with respect to the land 9 for mounting the electronic component 25 (component sucked by a feeder not shown) and the position of the land 9. IC marks 10a and 10b. In FIG. 11, the head unit 6 has a nozzle 11 that can be moved up and down and positioned freely in the rotational direction, and further includes a substrate camera 12, a lens 13, and an illumination 14 on the electronic circuit board 1. A substrate recognition camera unit 27 (first imaging means) having a focus surface is provided. In FIG. 11, the component recognition camera 7 (second imaging unit) with the zoom lens includes a component camera 16, a zoom lens 17, a lens barrel 18, an illumination connection unit 26, and an illumination unit 21 including LED illumination. Become. In FIG. 11, the nozzle station 8 is provided with a nozzle tip 24 that is exchanged according to the electronic component to be mounted.

  In the component mounting apparatus described in Patent Document 2, the board recognition camera unit 27 (first imaging) in which the board marks 40 and 41 provided on the electronic circuit board 1 or the IC marks 10a and 10b are provided on the head unit 6 is provided. Means) read. The nozzle 11 provided in the head unit 6 sucks the electronic component 25 supplied from the component supply unit. The electronic component 25 adsorbed by the nozzle 11 is imaged by the component recognition camera 7 (second imaging unit) with a zoom lens, and the position of the electronic component 25 is measured. The position of the electronic component 25 measured by the component recognition camera with zoom lens 7 (second imaging means) and the board marks 40 and 41 or the IC marks 10a and 10b read by the board recognition camera unit 27 (first imaging means). From the position, the electronic component 25 or the electronic circuit board 1 is relatively moved by correction, and the electronic component 25 is mounted on the electronic circuit board 1.

  In the component mounting apparatus described in Patent Document 2, after changing the imaging field of view, there are the following two methods for acquiring the nozzle position correction data of the nozzle 11 by the component recognition camera 7 with the zoom lens (second imaging unit). is there.

(1) Fixed Comparison Method The distance from the image center position when the nozzle center position data in the standard field of view of this apparatus is acquired to the nozzle center position in the standard field of view is taken as the nozzle center offset value. Then, every time the imaging field of view is changed, the center position of the nozzle is measured by the component recognition camera 7 with the zoom lens (second imaging unit), and the nozzle center position in the standard field of view and the nozzle center position after the change of the imaging field of view Is obtained as nozzle position correction data.

(2) Sequential Comparison Method The distance from the image center position when the nozzle center position data in the standard field of view of this apparatus is acquired to the nozzle center position in the standard field of view is taken as the nozzle center offset value. Then, every time the imaging field of view is changed, the center position of the nozzle is measured by the component recognition camera 7 with the zoom lens (second imaging unit), the nozzle center position before the imaging field of view is changed, and the nozzle center after the imaging field of view is changed. The difference from the position is obtained as nozzle position correction data.

  In both of the above methods, length correction (correction of imaging magnification) is also performed based on the difference in field of view, and then stored as nozzle position correction data in the latest imaging field of view. Thereafter, until the imaging field of view is changed, the electronic component is mounted by the nozzle position correction data in the latest imaging field of view. In this way, the amount of shift of the component mounting position due to the optical axis shift that occurs when the zoom lens magnification is changed is corrected.

JP-A-2-226484 JP 2000-294996 A

  However, in the component mounting apparatus described in Patent Document 2, since the nozzle positioned by the XY robot is used to detect the amount of deviation of the optical axis of the zoom lens, the detected amount of deviation of the optical axis is determined as XY. Robot positioning error remains. In addition, in order to detect the amount of deviation of the optical axis, it is necessary to take an image only with a nozzle that does not pick up the component, and the XY robot needs to perform an operation unrelated to the component mounting operation. It will have a big negative effect on speed.

  The present invention has been made in view of such a problem, and the positioning error of the XY robot does not remain in the detection value of the optical axis deviation amount of the zoom lens, and the optical axis deviation amount is detected. Another object of the present invention is to provide a component mounting apparatus that can minimize the adverse effect on the component mounting speed.

  As a result of earnest research to solve the above problems, the present inventor, in an imaging means for imaging a component sucked by a suction nozzle, the zoom lens disposed in front of the zoom lens disposed in front of the camera facing the direction of the component. The beam splitter is arranged so as to be positioned on the optical axis of the lens, and this beam splitter allows light to enter the camera from two directions, and the light from the two directions can be switched and incident to the camera separately. We thought that the above problem could be solved by doing so and proceeded with research and development.

  And not only the reflected light from the parts sucked by the suction nozzle, but also the light for recognizing the correction mark for detecting the amount of deviation of the optical axis of the zoom lens and grasping the imaging magnification is switched to the camera. Thus, the present inventors have found that the above-mentioned problem can be solved by allowing the incident light to enter the present invention.

  In addition, the image pickup means for picking up an image of a board mark on a board or a component already mounted on the board has the same function as that of the image pickup means for picking up a component so that the position of the board mark etc. on the board can be accurately determined. And found it useful.

That is, the first aspect of the component mounting apparatus according to the present invention is for imaging a head that moves in a plane direction, a suction nozzle for suctioning a component disposed in the head, and a component sucked by the suction nozzle. Image pickup means, moving means for moving the head in a plane direction, lifting means for raising and lowering the suction nozzle, and picking up a part with the suction nozzle and mounting the part at a predetermined part mounting position, In the component mounting apparatus including the control unit for controlling the elevating unit and the moving unit, the imaging unit is a camera facing the component direction, and a zoom that is disposed in front of the camera and can change an imaging magnification. A lens, a beam splitter disposed in front of the zoom lens and on the optical axis of the zoom lens, and a correction marker for correcting the position of the optical axis and the imaging magnification. A first illumination device that illuminates the component adsorbed by the adsorption nozzle, and a second illumination device that illuminates the correction mark, and the camera includes the component and the correction mark. When the imaging magnification of the zoom lens is changed, the correction mark is imaged to obtain the position of the optical axis and the imaging magnification of the zoom lens after the imaging magnification is changed. The recognition position of the imaged part is corrected after the imaging magnification is changed.

According to a second aspect of the component mounting apparatus of the present invention, there is provided a head that moves in the horizontal direction, an imaging unit that is provided in the head and images an imaging object, and a suction nozzle for component suction disposed in the head. Moving means for moving the head in a horizontal direction; lifting means for lifting and lowering the suction nozzle; and lifting and lowering means for picking up a part by the suction nozzle and mounting the part at a predetermined part mounting position And a control unit that controls the moving means, wherein the imaging means is a camera that faces the direction of the imaging object, and a zoom that is arranged in front of the camera and that can change the imaging magnification. A lens, a beam splitter disposed in front of the zoom lens and on the optical axis of the zoom lens, and a correction mark for correcting the position of the optical axis and the imaging magnification A first illumination device that illuminates the object to be imaged, and a second illumination device that illuminates the correction mark, and the camera images the imaging object and the correction mark separately. When the imaging magnification of the zoom lens is changed, the correction mark is imaged to obtain the position of the optical axis of the zoom lens and the imaging magnification after the imaging magnification change, thereby changing the imaging magnification. The recognition position of the imaging target imaged later is corrected.

  Here, the imaging object is, for example, a substrate on which a component is mounted or a component mounted on the substrate.

  Switching between imaging of the component and the correction mark and switching of imaging of the imaging object and the correction mark can be performed by, for example, a shutter. A rotary shutter or a liquid crystal shutter can be used as the shutter.

  As the correction mark, for example, a mark composed of four circles whose centers are located at four vertices of a rectangle can be used.

  According to the component mounting device of the present invention, not only the reflected light from the component sucked by the suction nozzle or the object to be imaged, but also the correction for detecting the displacement amount of the optical axis of the zoom lens and grasping the imaging magnification. Since the transmitted light or reflected light from the plate-shaped body with the mark for switching can be switched and made incident on the camera separately, the detection value of the amount of deviation of the optical axis of the zoom lens after changing the imaging magnification is used. Therefore, no positioning error of the XY robot remains, and even if the amount of deviation of the optical axis is detected, the adverse effect on the component mounting speed can be minimized. Furthermore, since the correction mark and the image of the object can be switched instantaneously by switching the illumination, even if there is a temperature change, the deviation of the optical axis is detected and corrected in real time. be able to. Further, by using a predetermined correction mark, it is possible to grasp the imaging magnification at the same time as detecting the amount of deviation of the optical axis of the zoom lens.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing a main configuration of an example of an embodiment of a component mounting apparatus according to the present invention.

  A surface mounting apparatus 50 which is an example of an embodiment of a component mounting apparatus according to the present invention includes a base 52, a conveyance path 54, an electronic circuit board 56, a supply unit 58, a parts feeder 60, and an X-axis frame 62. And transfer head 64, Y-axis frames 66A and 66B, and component imaging means 68A and 68B.

  A transport path 54 is arranged in the X direction at the center of the base 52. The conveyance path 54 conveys the electronic circuit board 56 and also holds and positions the electronic circuit board 56 on the conveyance path 54. Therefore, the conveyance path 54 also serves as a holding unit for the electronic circuit board 56. On both sides of the conveyance path 54, electronic parts supply units 58 are disposed, and a large number of parts feeders 60 are arranged in parallel in each supply unit 58. The parts feeder 60 stores electronic components held on the tape, and sequentially supplies the electronic components by feeding the tape in the tape longitudinal direction.

  An electronic component transfer head 64 is mounted on the X-axis frame 62 so as to be movable in the X-axis direction. Both ends of the X-axis frame 62 are supported by the Y-axis frame 66A and the Y-axis frame 66B so as to be movable in the Y-axis direction. The transfer head 64 and the X-axis frame 62 are driven by an X-axis motor and a Y-axis motor (not shown), and are movable in the X-axis direction and the Y-axis direction, respectively. With such a mechanism, the transfer head 64 can be arbitrarily moved in the XY directions. Then, the suction nozzle 90 (see FIG. 2) attached to the lower end of the transfer head 64 sucks and picks up the electronic component from the pickup position of the parts feeder 60 and transfers it onto the electronic circuit board 56.

  In addition, component imaging means 68A and 68B are disposed between the electronic circuit board 56 and the supply unit 58, respectively. The component imaging means 68A and 68B include the transfer head 64, the suction nozzle 90, and the suction nozzle. It is possible to take an image of the electronic component 90 held by suction from below. The transfer head 64 moves above the component imaging means 68 </ b> A or 68 </ b> B while the electronic component is sucked and held by the suction nozzle 90. Then, the component imaging means 68A or 68B images the state where the suction nozzle 90 sucks and holds the electronic component. Whether the component imaging means 68A or 68B captures an image is selected as the moving distance of the suction nozzle 90 holding the electronic component by suction is reduced. In this way, imaging is performed, and the electronic component sucked by the suction nozzle 90 is identified and the displacement is detected.

  Next, the component imaging means 68A and 68B will be described in detail with reference to FIG. FIG. 2 is a diagram schematically showing the configuration of component imaging means 68A and 68B in an example of the embodiment of the component mounting apparatus according to the present invention. The component imaging means 68A and 68B include a component imaging camera 70 facing upward, a zoom lens 72 that can change the imaging magnification, a motor 74 that drives the zoom lens 72 to change the imaging magnification of the zoom lens 72, and an incident A beam splitter 76 disposed on the optical axis of the zoom lens 72 to divide the light into two directions, and a correction mark 78 (see FIG. 4) for correcting the optical axis of the zoom lens 72 and the imaging magnification. The plate-shaped body 80, the coaxial illumination device 82 and the transmission illumination device 84 which are arranged to face each other with the beam splitter 76 therebetween, the oblique illumination device 86 which is an auxiliary illumination device, the component imaging means 68A, 68B has a cover glass 88 that prevents dust from entering the interior of 68B.

  A diffuser plate 82A is disposed on the front surface of the coaxial illumination device 82 disposed on the left side of the beam splitter 76, scatters the coaxial LED light emitted from the coaxial illumination device 82, and uniformly irradiates the beam splitter 76 with the light. Let The light applied to the beam splitter 76 is changed in the upward direction by the beam splitter 76, passes through the cover glass 88, and is applied to the electronic component 92 sucked by the suction nozzle 90. The light irradiated and reflected on the electronic component 92 travels straight, enters the component imaging camera 70, and the electronic component 92 is imaged. The oblique illumination device 86 irradiates the electronic component 92 sucked and held by the suction nozzle 90 from below at a relatively shallow angle. A transmission illumination device 84 is disposed on the right side of the beam splitter 76, and irradiates light to the back surface of the plate-shaped body 80 disposed on the front surface thereof. The light irradiated on the back surface of the plate-shaped body 80 is transmitted through the plate-shaped body 80, and the transmitted light is turned downward by the beam splitter 76 and irradiated into the component imaging camera 70, so that the correction mark 78 (FIG. 4) is imaged.

  Imaging of the electronic component 92 and imaging of the correction mark 78 are performed separately by switching energization of the coaxial illumination device 82 and the transmission illumination device 84. Alternatively, as shown in FIG. 3, a rotary shutter 87 is provided between the cover glass 88 and the beam splitter 76 and between the transmission illumination device 84 and the beam splitter 76. The imaging and the correction mark 78 may be separately performed. Further, in place of the rotary shutter 87, a liquid crystal shutter (not shown) is provided between the cover glass 88 and the beam splitter 76, and between the transmission illumination device 84 and the beam splitter 76, so that the electronic component 92 can be imaged. The correction mark 78 may be imaged separately.

  Also, oblique illumination that irradiates the front surface of the plate-like body 80 from the left at a relatively shallow angle with respect to the normal direction of the plate-like body 80 instead of or together with the transmission illumination apparatus 84. The correction mark 78 may be imaged by illuminating with the device 89.

  Next, the correction mark will be described. As the correction mark, for example, a mark composed of four circles whose centers are located at four vertices of a rectangle can be used, but four circles 78A, 78B, 78C, 78D whose centers are located at four vertices of a square are used. The calculation process is simplified by using the correction mark 78 (see FIG. 4).

  In FIG. 2, the plate-like body 80 marked with the correction mark 78 is orthogonal to the direction toward the beam splitter 76, and the surface of the plate-like body 80 marked with the correction mark 78 is parallel to the vertical direction. is there. Therefore, in FIG. 4, a line connecting the centers of the circles 78A and 78C is a vertical line, a line connecting the centers of the circles 78B and 78D is parallel to the horizontal plane, and is directed to the beam splitter 76. It is an orthogonal line.

  When the correction mark 78 is used, the distance between the centers (centers of gravity) of two circles arranged on the diagonal of the square in the vertical direction is obtained for the image after changing the imaging magnification, and compared with the standard visual field. Thus, the vertical magnification of the image can be obtained, the distance between the centers (center of gravity) of two circles arranged in the horizontal direction is obtained for the image after the imaging magnification change, and compared with the case of the standard visual field, The horizontal magnification of the image can be obtained, and the imaging magnification can be corrected in both the vertical and horizontal directions of the image (fixed comparison method). In addition, the center of gravity position of the entire correction mark consisting of four circles (upper, lower, left and right) is obtained by calculation, and the obtained center of gravity position is corrected by the vertical and horizontal magnifications of the image, and the corrected center of gravity position is obtained in the standard visual field. Compared with the position of the center of gravity, a correction value of the optical axis position can be calculated (fixed comparison method). The correction of the imaging magnification and the correction of the optical axis position may be performed using a sequential comparison method instead of a fixed comparison method.

  Next, the transfer head 64 will be described in detail with reference to FIG. FIG. 5 is a perspective view showing a main configuration of the transfer head 64 in an example of the embodiment of the component mounting apparatus according to the present invention.

  The transfer head 64 includes a nozzle mechanism portion 64A and a substrate imaging means 64B. The nozzle mechanism portion 64A is provided with a Z-axis motor 102, a ball screw 104, and a θ-axis motor 106, and the nozzle shaft 108 is freely driven in the Z-axis direction and the θ-axis direction by these. The suction nozzle 90 is detachably engaged with the tip of the nozzle shaft 108. By connecting a vacuum generator (not shown) to the nozzle shaft 108, the electronic component is sucked and held by the suction nozzle 90.

  The board image pickup means 64B is an image pickup means for picking up and recognizing a board mark provided on the electronic circuit board 56 and electronic components already mounted, and a board image pickup camera 112 facing downward, and a zoom capable of changing an image pickup magnification. The lens 114 includes a motor 116 that drives the zoom lens 114 to change the imaging magnification of the zoom lens 114, and an illumination unit 118 that illuminates a substrate mark or the like.

  FIG. 6 is a diagram schematically showing the configuration of the board imaging means 64B. The illumination unit 118 includes a beam splitter 122 disposed on the optical axis of the zoom lens 114 in order to divide incident light into two directions, and a correction mark for correcting the optical axis and imaging magnification of the zoom lens 114 (see FIG. 4), a coaxial illumination device 126 and a transmission illumination device 128 that are arranged to face each other with the beam splitter 122 therebetween, an oblique illumination device 130 that is an auxiliary illumination device, A cover glass 132 for preventing dust from entering the illumination unit 118 and an opening 134 provided on the lower surface for allowing light to pass therethrough are provided. The cover glass 132 is provided on the upper surface of the illumination unit 118 and is provided at a position close to the lower side of the zoom lens 114. The correction mark marked on the plate-like body 124 may be the same as the correction mark 78 marked on the plate-like body 80.

  A diffusion plate 126A is disposed on the front surface of the coaxial illumination device 126 disposed on the left side of the beam splitter 122. The diffuser 126A scatters the coaxial LED light emitted from the coaxial illumination device 126 and uniformly irradiates the beam splitter 122 with the light. Let The light applied to the beam splitter 122 is changed in the downward direction by the beam splitter 122, passes through the opening 134, is applied to the electronic circuit board 56, and images a substrate mark or the like. The oblique illumination device 130 irradiates the electronic circuit board 56 with light at a relatively shallow angle. A transmission illumination device 128 is disposed on the right side of the beam splitter 122, and the transmission illumination device 128 irradiates light on the back surface of the plate-like body 124 disposed on the front surface thereof. The light irradiated on the back surface of the plate-like body 124 is transmitted through the plate-like body 124, and the transmitted light is turned upward by the beam splitter 122 and irradiated into the board imaging camera 112, and the correction mark is imaged. The

  Imaging of a substrate mark or the like on the electronic circuit board 56 and imaging of a correction mark marked on the plate-like body 124 are performed separately by switching energization of the coaxial illumination device 126 and the transmission illumination device 128. Alternatively, a shutter (not shown) is provided between the opening 134 and the beam splitter 122 and between the transmission illumination device 128 and the beam splitter 122, and an image of a substrate mark or the like on the electronic circuit board 56 is captured by this shutter. And the correction marks marked on the plate-like body 124 may be taken separately. For example, a rotary shutter or a liquid crystal shutter can be used as the shutter.

  Further, instead of the transmissive illumination device 128 or together with the transmissive illumination device 128, oblique illumination that irradiates the front surface of the plate-like body 124 from the left at a relatively shallow angle with respect to the normal direction of the plate-like body 124. The correction mark that is illuminated by the device 131 and marked on the plate-like body 124 may be imaged.

  Next, control of an example of an embodiment of the component mounting apparatus according to the present invention will be described with reference to FIG. FIG. 7 is a control block diagram for an example of an embodiment of a component mounting apparatus according to the present invention.

  The component mounting apparatus main control unit 152 reads the component data (the component data includes not only the type and size of the component but also the data of the board to be mounted), and the electronic circuit board 56 is transferred by the board transfer device 152A. In addition to carrying in a predetermined position on 54, component data is input to the illumination / zoom control unit 154. The illumination / zoom control unit 154 drives the motor 116 by the motor driver 116A based on the input component data, changes the magnification of the zoom lens 114, changes the imaging magnification by the board imaging camera 112, and then transmits the transmission illumination device. A command to energize 128 is issued to the illumination drive unit 156 to cause the board imaging camera 112 to image the correction mark marked on the plate-like body 124.

  The image of the correction mark imaged after the magnification change is processed by the image recognition processing unit 158, and the imaging magnification correction and the optical axis correction of the zoom lens 114 are performed. Specifically, when the correction mark 78 shown in FIG. 4 is used, the image recognition processing unit 158 obtains the distance between the centers (centers of gravity) of two circles arranged in the vertical direction located on the diagonal of the square. In addition to obtaining the vertical magnification of the image compared to the standard visual field, the distance between the centers (centers of gravity) of two circles arranged in the horizontal direction is obtained, and the horizontal direction of the image compared to the standard visual field. And the imaging magnification is corrected in both the vertical and horizontal directions of the image (fixed comparison method). In addition, the center of gravity of the entire correction mark consisting of four circles (upper, lower, left, and right) is obtained by calculation, and the obtained center of gravity is corrected with the magnification in the vertical and horizontal directions of the image, and the corrected center of gravity is displayed as the standard visual field. The correction value of the optical axis position is calculated in comparison with the center of gravity position at (fixed comparison method). Note that the correction of the imaging magnification and the correction of the optical axis position may be performed by the sequential comparison method instead of the fixed comparison method.

  Thereafter, after the component mounting apparatus main control unit 152 moves the transfer head 64 above the board mark of the electronic circuit board 56 by the XY drive unit 152B, the illumination / zoom control unit 154 performs the coaxial illumination unit 126 and the oblique illumination. A command to energize the device 130 is issued to the illumination driving unit 156, and the board imaging camera 112 is caused to take an image of the board mark of the electronic circuit board 56.

  The captured image of the substrate mark is processed by the image recognition processing unit 158, and the position of the substrate mark is corrected and recognized based on the previously obtained correction value of the imaging magnification and the correction value of the optical axis position. Data of the substrate position corrected based on the correction value (hereinafter referred to as substrate position correction data) is obtained.

  Next, the illumination / zoom control unit 154 drives the motor 74 with the motor driver 74A based on the input component data, changes the magnification of the zoom lens 72, and changes the imaging magnification by the component imaging camera 70. A command to energize the transmission illumination device 84 for irradiating the correction mark with light is issued to the illumination driving unit 156, and the component imaging camera 70 is caused to image the correction mark marked on the plate-like body 80.

  The image of the correction mark imaged after the magnification change is processed by the image recognition processing unit 158, and the imaging magnification is corrected and the optical axis of the zoom lens 72 is corrected. Specifically, when the correction mark 78 shown in FIG. 4 is used, the image recognition processing unit 158 obtains the distance between the centers (centers of gravity) of two circles arranged in the vertical direction located on the diagonal of the square. In addition to obtaining the vertical magnification of the image compared to the standard visual field, the distance between the centers (centers of gravity) of two circles arranged in the horizontal direction is obtained, and the horizontal direction of the image compared to the standard visual field. The imaging magnification is corrected in both the vertical and horizontal directions of the image. In addition, the center of gravity of the entire correction mark consisting of four circles (upper, lower, left, and right) is obtained by calculation, and the obtained center of gravity is corrected with the magnification in the vertical and horizontal directions of the image, and the corrected center of gravity is displayed as the standard visual field. The correction value of the optical axis position is calculated in comparison with the barycentric position at.

  After that, the component mounting apparatus main control unit 152 moves the transfer head 64 above the component stored in the corresponding feeder (included in the supply unit 58) by the XY drive unit 152B, and the component is moved by the suction nozzle 90. Further, the transfer head 64 is moved by the XY driving device 152B so that the component sucked by the suction nozzle 90 is positioned above the component imaging means 68A or 68B. Thereafter, the illumination / zoom control unit 154 issues a command to energize the coaxial illumination device 82 and the oblique illumination device 86 to the illumination drive unit 156, and causes the component imaging camera 70 to image the component adsorbed by the adsorption nozzle 90.

  The captured image of the component is processed by the image recognition processing unit 158, and the position of the component is recognized after being corrected based on the previously obtained correction value of the imaging magnification and the correction value of the optical axis position. The component position data corrected based on (hereinafter, referred to as component position correction data) is acquired.

  Next, the operation of the exemplary embodiment of the component mounting apparatus according to the present invention will be described with reference to FIG. 8 and FIG. 9 (the flowchart showing the operation of the exemplary embodiment of the component mounting apparatus according to the present invention). FIG. 8 is a flowchart showing the first half of the operation of an example of the embodiment of the component mounting apparatus according to the present invention, and FIG. 9 is a flowchart showing the second half. However, the same parts as those described with reference to FIG. 7 will be described briefly.

  First, the component mounting apparatus main control unit 152 reads the component data, and the board transfer device 152A loads the electronic circuit board 56 to a predetermined position on the transfer path 54 (step S1). The component data read to the component mounting apparatus main control unit 152 is also sent to the illumination / zoom control unit 154, and it is determined whether the imaging field of view (imaging magnification) of the board imaging unit 64B is appropriate (step S2). If appropriate, the board imaging means 64B is moved to the board mark position by the XY drive device 152B (step S5), the board mark is imaged, the board mark is recognized, and board position correction data is acquired ( Step S6). If it is not appropriate, after changing the imaging magnification of the board imaging means 64B (step S3), the imaging magnification of the board imaging means 64B and the optical axis of the zoom lens 114 are corrected (step S4). . Thereafter, the board imaging means 64B is moved to the board mark position by the XY drive device 152B (step S5), the board mark is imaged, the board mark is recognized, and board position correction data is acquired (step S6). .

  Next, the component mounting apparatus main control unit 152 reads the component data again (step S7) and sends the data to the illumination / zoom control unit 154. The illumination / zoom control unit 154 determines whether the imaging field of view (imaging magnification) of the component imaging unit 68A or 68B is appropriate based on the data (step S8).

  When the imaging field of view (imaging magnification) of the component imaging means 68A or 68B is appropriate, the component mounting apparatus main control unit 152 uses the XY drive unit 152B to transfer the transfer head 64 to the corresponding feeder (included in the supply unit 58). Is moved above the component stored in the container, the component is sucked by the suction nozzle 90 (step S11), and the transfer head 64 is moved by the XY driving device 152B. It is positioned above the component imaging means 68A or 68B (step S12). Thereafter, the component picked up by the suction nozzle 90 is imaged, the component is recognized, and component position correction data is acquired (step S13).

  If the imaging field of view (imaging magnification) of the component imaging means 68A or 68B is not appropriate, the imaging magnification of the component imaging means 68A or 68B is changed (step S9), and then the imaging magnification of the component imaging means 68A or 68B is set. Correction and correction of the optical axis of the zoom lens 72 are performed (step S10). After that, the component mounting apparatus main control unit 152 moves the transfer head 64 above the component stored in the corresponding feeder (included in the supply unit 58) by the XY drive unit 152B, and the component is moved by the suction nozzle 90. Further, the transfer head 64 is moved by the XY drive device 152B so that the component sucked by the suction nozzle 90 is positioned above the component imaging means 68A or 68B (step S12). ). Thereafter, the component picked up by the suction nozzle 90 is imaged, the component is recognized, and component position correction data is acquired (step S13).

  Next, it is determined whether or not the component is a chip component (step S14). If the component is a chip component, component mounting position correction data is obtained by calculation using the substrate position correction data and the component position correction data (step S15). .

  If the component is not a chip component but an IC, it is necessary to recognize an IC mark on the electronic circuit board 56. First, the illumination / zoom control unit 154, based on the component data, captures an imaging field of view of the substrate imaging means 64B ( It is determined whether (imaging magnification) is appropriate (step S16). If appropriate, the board imaging means 64B is moved to the target IC mark position by the XY drive device 152B (step S19), the target IC mark is imaged and the IC mark is recognized, and the IC mark position is detected. Correction data is acquired (step S20). If it is not appropriate, after changing the imaging magnification of the board imaging means 64B (step S17), the imaging magnification of the board imaging means 64B and the optical axis of the zoom lens 114 are corrected (step S18). . Thereafter, the board imaging means 64B is moved to the target IC mark position by the XY drive device 152B (step S19), the target IC mark is imaged and the IC mark is recognized, and the IC mark position correction data is stored. Obtained (step S20). Next, using the obtained IC mark position correction data and component position correction data, component mounting position correction data is obtained by calculation (step S21).

  Next, component mounting is performed based on the component mounting position correction data obtained in step S15 or step S21 (step S22). If all the parts are finished, the process is finished as it is, and if all the parts are not finished, the process returns to step 7 to continue mounting the parts (step S23).

  As described above, according to the embodiment of the present invention, not only the component attracted by the suction nozzle or the substrate mark on the electronic circuit board, the reflected light from the IC mark, but also the optical axis of the zoom lens. The transmitted light or reflected light from the plate-like body with a correction mark for detecting the amount of deviation and grasping the imaging magnification can be switched and made incident on the camera separately. It is possible to detect the amount of deviation of the optical axis of the zoom lens after changing the imaging magnification simply by switching, and even if the amount of deviation of the optical axis is detected, adverse effects on the component mounting speed can be minimized. it can. Furthermore, since the correction mark and the image of the object can be switched instantaneously by switching the illumination, even if there is a temperature change, the deviation of the optical axis is detected and corrected in real time. be able to. Further, the position of the plate-like body on which the correction mark is marked is fixed, and the positioning error of the XY robot does not remain in the detected value of the shift amount of the optical axis of the zoom lens after changing the imaging magnification. Further, by using the correction mark as shown in FIG. 4, it is possible to grasp the imaging magnification at the same time as detecting the amount of deviation of the optical axis of the zoom lens.

The perspective view which shows the main structures of an example of embodiment of the component mounting apparatus which concerns on this invention The figure which shows typically the structure of the component imaging means 68A and 68B in an example of embodiment of the component mounting apparatus which concerns on this invention. The figure which shows typically the rotary shutter 87 in component imaging means 68A, 68B. The figure which shows an example of the correction mark 78 The perspective view which shows the main structures of the transfer head 64 in an example of embodiment of the component mounting apparatus which concerns on this invention. The figure which shows typically the structure of the board | substrate imaging means 64B. The control block diagram about an example of embodiment of the component mounting apparatus which concerns on this invention The flowchart which shows the first half of the operation | movement about an example of embodiment of the components mounting apparatus which concerns on this invention The flowchart which shows the latter half part of the operation | movement about an example of embodiment of the component mounting apparatus which concerns on this invention Overall schematic diagram of component mounting apparatus described in Patent Document 2 Detailed view of the electronic circuit board 1, the head unit 6, the component recognition camera 7 with a zoom lens, and the nozzle station 8 in the component mounting apparatus described in Patent Document 2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 50 ... Component mounting apparatus 52 ... Base 54 ... Conveyance path 56 ... Electronic circuit board 58 ... Supply part 60 ... Parts feeder 62 ... X-axis frame 64 ... Transfer head 64A ... Nozzle mechanism part 64B ... Board imaging means 66A, 66B ... Y axis frame 68A, 68B ... Part imaging means 70 ... Part imaging camera 72 ... Zoom lens 74 ... Motor 74A ... Motor driver 76 ... Beam splitter 78 ... Correction mark 80 ... Plate-like body 82 ... Coaxial illumination device 82A ... Diffusion plate 84 DESCRIPTION OF SYMBOLS ... Transmission illumination device 86 ... Oblique illumination device 87 ... Rotary shutter 88 ... Cover glass 89 ... Oblique illumination device 90 ... Adsorption nozzle 92 ... Electronic component 102 ... Z axis motor 104 ... Ball screw 106 ... θ axis motor 108 ... Nozzle shaft 112 ... Substrate Imaging camera 114 ... zoom lens 116 ... motor 116A ... Motor driver 118 ... Illumination unit 122 ... Beam splitter 124 ... Plate-like body 126 ... Coaxial illumination device 126A ... Diffuser 128 ... Transmission illumination device 130 ... Oblique illumination device 131 ... Oblique illumination device 132 ... Cover glass 134 ... Opening 152 ... Components Mounting device main control unit 152A ... substrate transfer device 152B ... XY drive unit 154 ... illumination / zoom control unit 156 ... illumination drive unit 158 ... image recognition processing unit

Claims (4)

A head that moves in the plane direction, a suction nozzle for picking up components arranged in the head, an image pickup means for picking up an image of the parts sucked by the suction nozzle, and a moving means that moves the head in the plane direction And a lifting / lowering means for raising and lowering the suction nozzle, and a control unit for controlling the lifting / lowering means and the moving means for sucking the part by the suction nozzle and mounting the part at a predetermined part mounting position. In mounting equipment,
The imaging means includes a camera facing the component direction, a zoom lens arranged in front of the camera and capable of changing an imaging magnification, an optical axis of the zoom lens in front of the zoom lens A beam splitter disposed above, a correction mark for correcting the position of the optical axis and the imaging magnification, a first illumination device for illuminating a component sucked by the suction nozzle, and the correction mark A second illuminating device that illuminates, and the camera can separately capture the component and the correction mark,
When changing the imaging magnification of the zoom lens, the correction mark is imaged to determine the position and imaging magnification of the optical axis of the zoom lens after the imaging magnification change, and thereby the parts imaged after the imaging magnification change The component mounting apparatus is characterized in that the recognition position is corrected. A head that moves in the horizontal direction, an imaging unit that is provided in the head and images an imaging target, a suction nozzle for component suction arranged in the head, and a moving unit that moves the head in the horizontal direction; Component mounting comprising lifting / lowering means for lifting / lowering the suction nozzle, and a controller for controlling the lifting / lowering means and the moving means for sucking the component by the suction nozzle and mounting the component at a predetermined component mounting position In the device
The imaging means includes a camera facing the direction of the imaging object, a zoom lens arranged in front of the camera and capable of changing an imaging magnification, the front of the zoom lens, and the zoom lens. A beam splitter disposed on the optical axis, a correction mark for correcting the position of the optical axis and the imaging magnification, a first illumination device that illuminates the imaging object, and the correction mark. A second illuminating device, and the camera is capable of separately imaging the imaging object and the correction mark,
When changing the imaging magnification of the zoom lens, the correction mark is imaged to obtain the optical axis position and imaging magnification of the zoom lens after changing the imaging magnification, and thereby imaging taken after changing the imaging magnification A component mounting apparatus that corrects a recognition position of an object.   The component mounting apparatus according to claim 1, wherein imaging of the component and the correction mark is switched by a shutter.   The component mounting apparatus according to claim 1, wherein the correction mark includes four circles whose centers are located at four vertices of a rectangle.

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