JP2007095738A - Device and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device where a substrate and a semiconductor chip are image-picked up, and cycle time at the time of mounting can be shortened based on image pickup. <P>SOLUTION: The mounting device is provided with a mounting tool mounting the semiconductor chip on an upper face of the substrate positioned by a conveyance means; a camera unit 31 which has two image pickup cameras 32 and 33 that can simultaneously image-pick up the substrate and the semiconductor chip, and which image-picks up two positioning marks arranged in the semiconductor and the semiconductor chip; and a controller 39 which image-picks up one positioning mark of the semiconductor chip or one positioning mark of the substrate by the camera unit, moves the camera unit, simultaneously image-picks up the other positioning mark of the substrate and the other positioning mark of the semiconductor chip, image-picks up one positioning mark of the semiconductor chip and one positioning mark of the substrate, calculates positions of the substrate and the semiconductor chip based on image pickup, and mounts the electronic component on the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for positioning and mounting a semiconductor chip as an electronic component on a substrate based on imaging by an imaging camera.

  When a semiconductor chip as an electronic component is mounted on a substrate, a so-called flip chip type mounting apparatus is used. This mounting apparatus includes a wafer stage. A semiconductor wafer affixed to the adhesive sheet is held on the wafer stage. This semiconductor wafer is cut into a large number of dice-shaped semiconductor chips.

  Semiconductor chips are taken out from the wafer stage one by one by a pickup tool. The pick-up tool takes out the semiconductor chip and then rotates 180 degrees in the vertical direction to invert the semiconductor chip. That is, the surface on which the bump is formed faces downward.

  The inverted semiconductor chip is delivered to a mounting tool that is driven in the X, Y, and Z directions with the surface on which the bumps are formed facing down. The mounting tool that has received the semiconductor chip is moved to a teaching position (temporary mounting position) above the substrate positioned by being conveyed by the conveying means.

  The substrate and the semiconductor chip moved above the substrate are imaged by an imaging camera as imaging means. Then, in the semiconductor chip, the deviation between the teaching position and the actual mounting position calculated based on the imaging by the imaging camera is corrected based on the position recognition by imaging the semiconductor chip and the substrate.

  The lower surface of the substrate positioned by the conveying means is supported by the mounting stage. That is, the mounting stage can be driven in the vertical direction, and when the substrate is transported to a predetermined position and positioned, it is raised and supports the lower surface thereof. Then, the semiconductor chip corrected to the actual mounting position calculated based on the imaging from the teaching position is mounted on the substrate by driving the mounting tool in the downward direction.

  The imaging camera sequentially images one alignment mark and the other alignment mark of the substrate that is transported and positioned, and then images one alignment mark and the other alignment mark of the semiconductor chip. An image signal picked up by the image pickup camera is converted into a digital signal and taken into the control device, where image processing is performed to calculate the center coordinates of the substrate and the semiconductor chip. Then, the semiconductor chip is mounted on the substrate after positioning so that the center of the semiconductor chip coincides with the center of the substrate (center of the mounting position) based on the calculation result.

  Conventionally, in order to capture an image of a substrate and a semiconductor chip with an imaging camera, the imaging camera is sequentially moved to a position where the two alignment marks on the substrate and the two alignment marks on the semiconductor chip can be imaged to manually capture images. .

  That is, the pair of alignment marks of the substrate and the semiconductor chip are imaged by moving the imaging camera to a position where each of the four alignment marks can be imaged a total of four times. For this reason, since the imaging camera is moved four times, the movement takes time, and the tact time required for mounting may be increased.

A pair of alignment marks are provided on one end and the other end of the diagonal line on the substrate and the semiconductor chip, respectively. Therefore, in order to shorten the tact time, an imaging camera having a pair of upper and lower imaging units in which one of the alignment marks of the substrate and the semiconductor chip located at one end on the diagonal is aligned with the optical axis with respect to the vertical line And simultaneously image the other alignment mark of the substrate and the semiconductor chip located at the other end on the diagonal line. Thus, Patent Document 1 discloses that the number of movements of the imaging camera is two.
JP 2004-79967 A

  When simultaneously imaging the alignment marks of the substrate and the semiconductor chip, it is possible to capture images if these alignment marks are within the field of view of the pair of upper and lower imaging units of the imaging camera. However, the substrate is larger than the semiconductor chip.

  Therefore, when the semiconductor chip is positioned at the teaching position (temporary mounting position) with respect to the substrate that has been transported and positioned at a predetermined position, the substrate alignment mark and the semiconductor chip are positioned at one end and the other end on the diagonal line. In some cases, the distance from the alignment mark is increased.

  In such a case, if the imaging camera is positioned so that one of the alignment marks of the substrate and the semiconductor chip is in the field of view, the other alignment mark will be out of the field of view range. That is, it is impossible to simultaneously image the alignment marks between the substrate and the semiconductor chip located at one end and the other end on the diagonal line.

  Therefore, in such a case, as described above, the two alignment marks of the substrate and the semiconductor chip must be separately imaged. As a result, since the imaging camera is moved four times, it takes time for the movement, and it is inevitable that the tact time required for mounting becomes long.

  In this invention, since the substrate is larger than the electronic component, if the electronic component is positioned at the teaching position, the electronic component is mounted on the substrate even when the alignment mark between the substrate and the electronic component cannot be imaged simultaneously. It is an object of the present invention to provide an electronic component mounting apparatus and mounting method capable of reducing the tact time required for the purpose.

The present invention is a mounting apparatus for mounting electronic components on a substrate,
Conveying means for conveying and positioning the substrate;
A mounting stage which is provided on the lower surface side of the substrate positioned by the conveying means and supports the lower surface of the substrate by ascending;
A mounting tool for mounting the electronic component on the upper surface of the substrate holding the electronic component and supported on the lower surface by the mounting stage;
An imaging unit having two imaging units capable of simultaneously imaging the substrate and the electronic component, and imaging two alignment marks respectively provided on the substrate and the electronic component;
The imaging means images one of the alignment mark of the electronic component and one of the alignment marks of the substrate, and then moves the imaging means to move the other alignment mark of the substrate and the electronic After imaging the other alignment mark of the component at the same time, one of the alignment mark of the electronic component and the other alignment mark of the substrate is imaged, and based on these imaging, the substrate and the above An electronic component mounting apparatus comprising: a control unit that calculates a position of the electronic component and mounts the electronic component on the substrate.

  The control unit positions the electronic component with respect to the substrate so that the other alignment mark of the substrate and the other alignment mark of the electronic component can be simultaneously imaged by the two imaging units of the imaging unit. It is preferable to do.

  The image pickup means is provided so as to be driven in the horizontal direction, and enters between the board and the electronic component located above the board to pick up an alignment mark between the board and the electronic component. It is preferable that the electronic component is positioned with respect to the substrate based on the imaging of the imaging means while the imaging is completed and the substrate and the electronic component are retracted.

This invention is a mounting method for mounting an electronic component on a substrate,
A step of conveying and positioning the substrate;
Supporting the lower surface of the positioned substrate;
Mounting the electronic component on the upper surface of the substrate on which the lower surface is supported;
Of the two alignment marks provided on the electronic component and the substrate, respectively, one of the alignment marks of the electronic component and one of the alignment marks of the substrate is imaged and then the other position of the substrate. Imaging the alignment mark and the other alignment mark of the electronic component simultaneously, and then imaging one of the alignment mark of the electronic component and one of the alignment marks of the substrate;
A step of calculating a position between the electronic component and the substrate based on imaging of each pair of alignment marks of the electronic component and the substrate and mounting the electronic component on the substrate. Is in the implementation method.

  The substrate and the electronic component are preferably positioned at a preset teaching position so that the other alignment mark can be imaged simultaneously.

  According to the present invention, when one of the pair of alignment marks of the electronic component is imaged, the electronic component is positioned with respect to the substrate, and the one alignment mark of the substrate and the electronic component are positioned. The other alignment mark of the substrate is imaged simultaneously, and then the other alignment mark of the substrate is imaged. Therefore, even when the substrate is larger than the electronic component and the alignment marks of both cannot be simultaneously accommodated in the field of view, the tact time required for imaging can be shortened.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 5 show an embodiment of the present invention. The flip-chip type mounting apparatus shown in FIG. 1 includes a wafer stage 1 as a component supply unit. The wafer stage 1 has a Y table 3, an X table 4, and a θ table 5 sequentially provided at one end of a base 2, and a wafer holder 8 holding a semiconductor wafer 7 is provided on the θ table 5. Yes.

  The X table 4 is driven in the Y direction by a Y drive source 3 a provided on the Y table 3, and the θ table 5 is driven in the X direction by an X drive source 4 a provided on the X table 4. The wafer holder 8 is driven in the rotational direction by a θ drive source 5 a provided on the θ table 5. Thereby, the wafer holder 8 can be driven in the X, Y, and θ directions.

  The semiconductor wafer 7 is divided into a large number of rectangular semiconductor chips 6 which are electronic components. The semiconductor chip 6 is taken out by a pickup tool 11 constituting a pickup device. The pickup tool 11 is L-shaped and can be driven to rotate in the direction of the arrow within a range of 180 degrees between the position indicated by the chain line and the position indicated by the solid line in FIG. Is provided with a suction nozzle 13 for vacuum suction of the semiconductor chip 6. Further, the pickup tool 11 can be driven in the X, Y direction (horizontal direction) and Z direction (vertical direction) by a driving means (not shown).

  A support 15 is provided at the other end of the base 2. On the upper surface of the support 15, a first base 16 having one end fixed to the support 15 and the other end protruding in the direction of the wafer stage 1 is provided horizontally. A stage table 17 is provided on the upper surface of the other end of the first base 16.

  The stage table 17 is provided with an X table 18, a Y table 19 provided on the X table 18 and driven in the X direction to come in contact with and away from the wafer stage 1, and the Y table 19 provided with the X table, The mounting stage 20 is driven in the Y direction.

  The X table 18 is provided with an X drive source 18a for driving the Y table 19 in the X direction, and the Y table 19 is provided with a Y drive source 19a for driving the mounting stage 20 in the Y direction. The mounting stage 20 is driven in the Z direction, which is the vertical direction, by the Z drive source 20a. That is, the mounting stage 20 can be driven in the X, Y, and Z directions.

  A conveyance guide 21 is provided above the mounting stage 20. A substrate 22 such as a lead frame on which the semiconductor chip 6 taken out from the wafer holder 8 is mounted on the transport guide 21 by a pitch as described later by the pickup tool 11 is pitch-fed in a predetermined direction, and a mounting position where the semiconductor chip 6 is mounted. It is designed to position with. That is, the transport means 23 is configured by a driving mechanism that pitch-feeds the transport guide 21 and the substrate 22.

  The mounting stage 20 includes a heater (not shown). The heater 20 heats the mounting stage 20 to, for example, 300 to 400 ° C. When the heated mounting stage 20 is driven in the upward direction, the upper surface of the mounting stage 20 supports the lower surface of the substrate 22 positioned on the transport guide 21. Thereby, the substrate 22 is heated to 300 to 400 ° C. by the mounting stage 20.

  A second base 25 is provided horizontally at one end of the first base 16 with a first spacer fixed via a first spacer 24. The second base 25 is shorter in length than the first base 16, and the other end protrudes toward the wafer stage 1.

  A camera table 26 is provided on the upper surface of the other end of the second base 25. The camera table 26 has an X table 27. On the X table 27, a Y table 28 driven in the X direction by an X drive source 27a is provided. On this Y table 28, there is provided an attachment member 29 that is driven in the Y direction by a Y drive source 28a.

  The attachment member 29 is provided with a camera unit 31 that constitutes an imaging means. The camera unit 31 has a case 31a formed in a hollow box shape as shown in FIG. 2, and the case 31a serves as an imaging unit that images the substrate 22 conveyed along the conveyance guide 21. A first camera 32 and a second camera 33 as an imaging unit that images the semiconductor chip 6 transferred from the pickup tool 11 to a suction surface 49a of a mounting tool 49 described later are provided. Each of the cameras 32 and 33 is composed of, for example, a CCD (solid state imaging device).

  Imaging windows 36 are respectively formed on the lower surface and the upper surface of the tip of the camera unit 31. A mirror 38 having two reflecting surfaces 37 inclined at an angle of 45 degrees with respect to the imaging window 36 is accommodated in the distal end portion of the camera unit 31. Light incident from the lower imaging window 36 and reflected by one reflecting surface 37 enters the first camera 32. Light incident from the upper imaging window 36 and reflected by the other reflecting surface 37 enters the second camera 33. In other words, the visual fields of the first camera 32 and the second camera 33 have their optical axes aligned vertically with respect to the vertical line.

  As shown in FIGS. 2 and 3, the image pickup signals from the cameras 32 and 33 are input to an image processing unit 40 provided in the control device 39, where they are processed and converted into digital signals. Yes. The control device 39 is provided on the support 15 as shown in FIG.

  As shown in FIG. 1, a second spacer 41 is provided on the upper surface of one end of the second base 25. The second spacer 41 is provided with a third base 42 horizontally with one end fixed. A head table 43 is provided on the upper surface of the other end of the third base 42. The head table 43 has an X table 44. On the upper surface of the X table 44, a Y table 45 driven in the X direction by an X drive source 44a is provided. An attachment body 46 that is driven in the Y direction by a Y drive source 45 a is provided on the upper surface of the Y table 45.

  A Z table 47 is provided on the front end surface of the mounting body 46, and the Z table 47 is driven by a Z drive source 47a in a Z direction perpendicular to a plane formed by the X direction and the Y direction. 48 is provided.

  At the tip of the mounting head 48, the mounting tool 49 containing a heater (not shown) having a rectangular cross section is provided by a θ table 50 so that the horizontal rotation angle can be adjusted. That is, the mounting tool 49 can be driven in the X, Y, Z, and θ directions. The mounting tool 49 is configured to heat the semiconductor chip 6 taken out from the wafer stage 1 and held by suction to, for example, about 300 to 400 ° C.

  FIG. 3 is a block diagram of the control circuit. The control device 39 includes a control unit 55, the image processing unit 40, and a drive output unit 57. The control unit 55 is connected to data input means 58 such as a touch panel and a keyboard and a data storage medium 59 such as an HDD. The data input means 58 can input mounting conditions when the semiconductor chip 6 is mounted on the substrate 22 to the control unit 55.

  Imaging signals from the first camera 32 and the second camera 33 provided in the camera unit 31 are input to the image processing unit 40. The image processing unit 40 that has captured the imaging signals from the first camera 32 and the second camera 33 converts the imaging signal into a digital signal and outputs the digital signal to the control unit 55. The imaging signals from the first and second cameras 32 and 33 can be displayed on a monitor 61 connected to the image processing unit 40.

  The control unit 55 calculates the center position of the semiconductor chip 6 held by the substrate 22 positioned on the conveyance guide 21 and the mounting tool 49 by performing image processing on the imaging signal converted into the digital signal, Based on the calculation, the mounting tool 49 is driven in the X and Y directions so that the semiconductor chip 6 is positioned at a mounting position whose center coincides with the mounting center of the substrate 22 and then mounted on the substrate 2. .

  Note that the control unit 55 captures one of the imaging signals of the first camera 32 and the second camera 33 converted into a digital signal by the image processing unit 40 and performs image processing on the substrate 22 or After calculating the center coordinates of the semiconductor chip 6, the center coordinates are calculated by capturing the other imaging signal and processing the image. That is, the control unit 55 sequentially processes image signals from the cameras 32 and 33.

  Note that the driving of the wafer stage 1, the pickup tool 11, the mounting stage 20, the transfer means 23, the camera unit 31, and the mounting tool 49 by the control unit 55 is output from the drive output unit 57 connected to the control unit 55. This is performed by a driving signal.

  Next, a procedure for mounting the semiconductor chip 6 on the substrate 22 by the mounting apparatus having the above configuration will be described.

  4 (a) and 4 (b) show the semiconductor chip 6 and the substrate 22, and the semiconductor chip 6 and the substrate 22 have a pair of alignment marks m11, m12 and m21 on one end and the other end on a diagonal line, respectively. m22 (hereinafter, a pair of alignment marks is referred to as one and the other alignment marks, respectively). In this embodiment, the semiconductor chip 6 is provided with one of the saddle-shaped alignment marks m11 and the other alignment mark m12, and the substrate 22 has the cross-shaped one alignment mark m21 and the other alignment mark. m22 is provided.

  The substrate 22 is conveyed and positioned at a predetermined teaching position by the conveying means 23, and the semiconductor chip 6 is positioned at the teaching position (temporary mounting position) by the mounting tool 49. That is, the other alignment mark m22 of the substrate 22 and the other alignment mark m12 of the semiconductor chip 6 are positioned on a substantially vertical line, and these alignment marks m22 and m12 are shown in FIG. 4 and FIG. The substrate 22 and the semiconductor chip 6 are positioned so that they can enter the visual fields V1 and V2 of the first camera 32 and the second camera 33 of the unit 31 and be able to image simultaneously.

  When the substrate 22 and the semiconductor chip 6 are positioned, the camera unit 31 is positioned so that one alignment mark m11 of the semiconductor chip 6 enters the field of view V2 of the second camera 33 as shown in FIG. Is done. The movement of the camera unit 31 at this time is the first time.

  When the camera unit 31 is positioned, one alignment mark m11 of the semiconductor chip 6 is imaged by the second camera 33, and the imaged signal is taken into the image processing unit 40 and converted into a digital signal. The image pickup signal converted into the digital signal is subjected to image processing by the control unit 55.

  Next, the camera unit 31 is moved so that the other alignment mark m22 of the substrate 22 and the other alignment mark m12 of the semiconductor chip 6 are simultaneously in the visual fields V1 and V2 of the first and second cameras 32 and 33, respectively. The camera unit 31 is positioned so as to enter. The movement of the camera unit 31 at this time is the second time.

  If the first camera 32 is positioned at a position where the other alignment mark m22 of the substrate 22 can be imaged, the X and Y coordinates of the optical axis of the first camera 32 can be obtained by the positioning. . Therefore, as described later, the camera unit 31 is moved to a position where one alignment mark m21 of the substrate 22 can be imaged by the first camera 32 with reference to the X and Y coordinates of the first camera 32. Can be positioned.

  Thus, when the camera unit 31 is positioned, the other alignment mark m12 of the semiconductor chip 6 and the other alignment mark m22 of the substrate 22 can be imaged simultaneously. These image pickup signals are converted into digital signals by the image processing unit 40.

  The control unit 55 sequentially performs image processing on the imaging signals converted into digital signals by the image processing unit 40. That is, the other alignment mark m12 of the semiconductor chip 6 and the other alignment mark m22 of the substrate 22 are simultaneously imaged by the first and second cameras 32 and 33 and converted into digital signals by the image processing unit 40. Since there is one control unit 55, the digital signal from the image processing unit 40 is sequentially subjected to image processing by the control unit 55.

  That is, the control unit 55 performs image processing on the imaging signal of the other alignment mark m12 of the semiconductor chip 6, and then performs image processing on the other alignment mark m22 of the substrate 22. When the pair of alignment marks m11 and m12 of the semiconductor chip 6 are image-processed, the coordinates and rotation angle of the center point O1 of the semiconductor chip 6 are calculated.

  When the other alignment mark m22 on the substrate 22 is imaged, the camera unit 31 is driven, and the first camera 32 can image one alignment mark m21 on the substrate 22 as shown in FIG. Positioned in the field of view V1. The movement of the camera unit 31 at this time is the third time. The first camera 32 images one of the alignment marks 21 on the substrate 22, and the image signal is converted into a digital signal by the image processing unit 40 and subjected to image processing by the control unit 55.

  When the pair of alignment marks m21 and m22 on the substrate 22 is image-processed, the coordinates of the mounting center point O2 of the substrate 22 are calculated. Accordingly, the semiconductor chip 6 is driven and positioned in the X and Y directions so that the center point 01 of the semiconductor chip 6 coincides with the center point O2 of the substrate 22 as shown by a chain line in FIG. . At this time, if the semiconductor chip 6 has a positional deviation in the θ direction, the deviation in the θ direction is also corrected.

  The positioning of the semiconductor chip 6 with respect to the substrate 22 is performed while the camera unit 31 that has entered between the substrate 22 and the semiconductor chip 6 is retracted. That is, the other alignment mark m22 of the substrate 22 and the other alignment mark m12 of the semiconductor chip 6 are imaged at the same time, and then the one alignment mark 21 of the substrate 22 is imaged. The semiconductor chip 6 can be returned to the actual mounting position based on the imaging while being retracted from between the semiconductor chip 6 and the semiconductor chip 6. Therefore, the time for returning the semiconductor chip 6 to the mounting position does not cause the tact time required for mounting to be increased.

  That is, in order to enable simultaneous imaging of the other alignment mark m12 of the semiconductor chip 6 and the other alignment mark m22 of the substrate 22, the actual mounting in which the teaching position of the semiconductor chip 6 is set based on imaging is set. Even if the position is largely deviated from the position, the tact time required for mounting does not become long in order to return the semiconductor chip 6 to the mounting position set based on the imaging.

  As described above, when the camera unit 31 is first driven and one alignment mark m11 of the semiconductor chip 6 is imaged by the second camera 33, the second camera 33 and the other alignment mark m22 on the substrate. The camera unit 31 is moved and positioned so that the other alignment mark m12 of the semiconductor chip 6 can be imaged simultaneously.

  Next, by driving the camera unit 31 to image one alignment mark m21 on the substrate 22, the center coordinates of the semiconductor chip 6 and the substrate 22 can be calculated, and these can be positioned and mounted.

  Therefore, since it is only necessary to move the camera unit 31 three times to image a total of four alignment marks, the tact time can be reduced by that amount compared to the conventional case where the camera unit 31 had to be moved four times. Can do.

  That is, when the substrate 2 is larger than the semiconductor chip 6 and the semiconductor chip 6 is positioned at the teaching position, the alignment mark between the semiconductor chip 6 and the substrate 22 is the field of view V1 of the first camera 32 of the camera unit 31. In the case where the field of view V2 of the second camera 33 is not entered at the same time, conventionally, the camera unit 31 is moved four times to image four alignment marks.

  However, according to this embodiment, since the camera unit 31 is moved three times, four alignment marks can be imaged, and the semiconductor chip 6 can be positioned and mounted with respect to the substrate 22. Can be improved.

  Further, since the other alignment mark m12 of the semiconductor chip 6 and the other alignment mark m22 of the substrate 22 are simultaneously imaged and recognized, the camera unit 31 determines the relative positions of the two alignment marks m12 and m22. The mounted camera table 26 can be obtained without moving in the X and Y directions. Therefore, since it becomes difficult to be affected by the mechanical accuracy accompanying the movement of the camera table 26, the mounting accuracy of the semiconductor chip 6 on the substrate 22 can be improved.

  FIG. 6A shows a time chart of the present invention in which the semiconductor chip 6 and the substrate 22 are imaged and image-processed, and FIG. 6B shows a conventional time chart. In the figure, D1 to D3 and d1 to d4 indicate timings when the camera unit 31 moves.

  6 (a) and 6 (b), X1 to X4 indicate the capturing (imaging) of the alignment marks of the semiconductor chip 6 and the substrate 22 by the first and second cameras 32 and 33, and Y1 to Y4 are the respective cameras. The image processing of the imaging signal imaged by 32 and 33 and converted into a digital signal is shown.

  As shown in the time chart, according to the present invention, as shown by D1 to D3 in FIG. 6A, the imaging of each pair of alignment marks on the semiconductor chip 6 and the substrate 22 is completed. The camera unit 31 may be moved three times.

  On the other hand, conventionally, as indicated by d1 to d4 in FIG. 6B, the camera unit 31 must be moved four times. As a result, according to the present invention, the tact time can be shortened by the time indicated by T in FIG. 6B, compared to the conventional case where the camera unit 31 is moved four times.

  In the above embodiment, as a procedure for positioning the semiconductor chip 6 with respect to the substrate 22, after imaging one alignment mark m 11 of the semiconductor chip 6, the other alignment mark m 12 and the other of the substrate 22 are captured. The alignment mark m22 is imaged simultaneously, and then one alignment mark m21 of the substrate 22 is imaged.

  However, the present invention is not limited to the above procedure, and after imaging one alignment mark m21 on the substrate 22, the other alignment mark m22 and the other alignment mark m12 on the semiconductor chip 6 are imaged at the same time. The semiconductor chip may be positioned and mounted with respect to the substrate 22 by imaging one alignment mark m12 of the semiconductor chip 6.

  Also, the electronic component is not limited to a semiconductor chip, and the present invention can be applied to other electronic components such as a chip-like capacitor.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows one embodiment of this invention. Sectional drawing of the camera which images a board | substrate and a semiconductor chip at the time of mounting. The block diagram which shows the apparatus controlled by a control apparatus and this control apparatus. FIGS. 4A and 4B are views showing alignment marks provided on the semiconductor chip and the field of view of the second camera. FIGS. 5A and 5B are views showing alignment marks provided on the substrate and the field of view of the first camera. FIG. 6A is a flowchart showing the timing of imaging and image processing according to the present invention, and FIG. 6B is a flowchart showing the timing of conventional imaging and image processing.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 6 ... Semiconductor chip (electronic component), 22 ... Board | substrate, 23 ... Conveyance means, 31 ... Camera unit, 32 ... 1st camera, 33 ... 2nd camera, 39 ... Control apparatus, 40 ... Image processing part, 49 ... Mounting tool, 55... Control unit.

Claims (5)

A mounting device for mounting electronic components on a substrate,
Conveying means for conveying and positioning the substrate;
A mounting stage which is provided on the lower surface side of the substrate positioned by the conveying means and supports the lower surface of the substrate by ascending;
A mounting tool for mounting the electronic component on the upper surface of the substrate holding the electronic component and supported on the lower surface by the mounting stage;
An imaging unit having two imaging units capable of simultaneously imaging the substrate and the electronic component, and imaging two alignment marks respectively provided on the substrate and the electronic component;
The imaging means images one of the alignment mark of the electronic component and one of the alignment marks of the substrate, and then moves the imaging means to move the other alignment mark of the substrate and the electronic After imaging the other alignment mark of the component at the same time, one of the alignment mark of the electronic component and the other alignment mark of the substrate is imaged, and based on these imaging, the substrate and the above An electronic component mounting apparatus comprising: control means for calculating the position of the electronic component and mounting the electronic component on the substrate.   The control unit positions the electronic component with respect to the substrate so that the other alignment mark of the substrate and the other alignment mark of the electronic component can be simultaneously imaged by the two imaging units of the imaging unit. The electronic component mounting apparatus according to claim 1, wherein:   The image pickup means is provided so as to be driven in the horizontal direction, and enters between the board and the electronic component located above the board to pick up an alignment mark between the board and the electronic component. 2. The electronic device according to claim 1, wherein the electronic component is positioned with respect to the substrate based on the imaging of the imaging means while the imaging is finished and the electronic component is retracted from between the substrate and the electronic component. Component mounting equipment. A mounting method for mounting electronic components on a substrate,
A step of conveying and positioning the substrate;
Supporting the lower surface of the positioned substrate;
Mounting the electronic component on the upper surface of the substrate on which the lower surface is supported;
Of the two alignment marks provided on the electronic component and the substrate, respectively, one of the alignment marks of the electronic component and one of the alignment marks of the substrate is imaged and then the other position of the substrate. Imaging the alignment mark and the other alignment mark of the electronic component simultaneously, and then imaging one of the alignment mark of the electronic component and one of the alignment marks of the substrate;
A step of calculating a position between the electronic component and the substrate based on imaging of each pair of alignment marks of the electronic component and the substrate and mounting the electronic component on the substrate. How to implement   5. The electronic component mounting method according to claim 4, wherein the substrate and the electronic component are positioned at a preset teaching position so that the other alignment mark can be imaged simultaneously.

Images