JPH11219974A - Chip recognizing device and chip mounting device comprising the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip recognizing device and a chip mounting device comprising it, wherein the position of a semiconductor chip and the position of a substrate to which it is bonded are accurately recognized in a short time. SOLUTION: Relating to a chip recognizing device provided with an imaging means for imaging between a semiconductor chip C sucked to a collet and a substrate B prior to bonding, a chip mark Mc of the semiconductor chip C and a substrate mark Mb of the substrate B, and a detection means for detecting displacement of the semiconductor chip C based on the imaged chip mark Mc and the substrate mark Mb, the imaging means comprises prisms 46 and 50 for taking in images of two chip marks Mc of the semiconductor chip C and images of two substrate marks Mb of the substrate B, two chip imaging cameras 45 for imaging the images of two chip marks Mc from the prisms 46 and 50, respectively, and two substrate imaging cameras 49 for imaging images of two substrate marks Mb, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip recognizing device for recognizing a positioning mark of a semiconductor chip and a positioning mark of a substrate, in order to mainly bond a flip-chip type semiconductor chip accurately on a substrate, and to a chip recognizing device. The present invention relates to a chip mounting apparatus provided.

[0002]

2. Description of the Related Art On the surface (pattern surface) of a semiconductor chip, positioning marks are added to effective areas such as four corners thereof, and correspondingly, effective areas such as diagonal lines are provided at bonding positions on a substrate. On the other hand, two or more positioning marks are printed, and by bonding these two positioning marks together, accurate bonding of the semiconductor chip becomes possible. For this reason, in the conventional chip recognition device, the imaging device faces the substrate between the semiconductor chip and the substrate that has been conveyed (downward) immediately above the bonding position.
Each positioning mark is imaged, and the position of the semiconductor chip is corrected based on the imaging result so as to match the bonding position. At the front end of the imaging device, a prism group including an upper prism for capturing the positioning mark of the semiconductor chip and a lower prism for capturing the positioning mark of the substrate is incorporated. And the positioning mark of the substrate are respectively imaged by two imaging cameras. Also, the mark does not go through the prism,
There is also a case where an image is taken by a dedicated imaging device facing downward.

In this case, the position correction element (position shift element) of the semiconductor chip has a rotation angle θ direction in addition to an X direction and a Y direction orthogonal to the horizontal plane. Therefore, it is necessary to recognize two positioning marks, that is, a total of four positioning marks in the semiconductor chip positioning mark and the substrate positioning mark. Therefore, in the conventional chip recognition device, after recognizing the positioning marks at each of the upper and lower locations (semiconductor chip and substrate), the imaging device is moved to recognize the other positioning marks at the upper and lower locations, and the moving distance is determined. In addition, the two positioning marks, two in each case, are recognized in total.

[0004]

In such a conventional chip recognizing device, two types of positioning marks are recognized.
Since the movement of the imaging device accompanies, there has been a problem that the position recognition accuracy is deteriorated due to the movement error of the moving device. Also,
Since the movement time of the imaging camera is added to the tact time in bonding, there has been a problem that the tact time becomes longer. Of course, it is also possible to simultaneously capture two necessary positioning marks in the field of view of each imaging camera. In such a case, there is no need to move the imaging camera. However, in this case, the resolution of the image cannot be increased, and, for example, in the bonding of a multi-pin semiconductor chip, the positional accuracy of the bonding is rather deteriorated.

It is an object of the present invention to provide a chip recognizing device capable of accurately recognizing a position of a semiconductor chip and a position of a substrate to which the semiconductor chip is bonded in a short time and a chip mounting device provided with the same. The purpose is.

[0006]

SUMMARY OF THE INVENTION A chip recognition device according to the present invention, prior to bonding of a semiconductor chip to a substrate, faces a position between the semiconductor chip and a substrate adsorbed by a bonding collet. Imaging means for imaging a chip mark for use and a substrate mark for positioning provided on a substrate, and detection means for detecting a displacement of a semiconductor chip with respect to the substrate based on the chip mark and the substrate mark imaged by the imaging means. In the chip recognizing device provided with the image pickup device, the image pickup means includes: a prism group that simultaneously captures an image of two chip marks of the semiconductor chip and an image of two substrate marks of the substrate; and an image of two chip marks from the prism group. Chip imaging cameras that respectively capture images of two substrates, and two substrate images that respectively capture images of two substrate marks And having a camera.

According to this structure, the images of the two chip marks required for the position recognition of the semiconductor chip are respectively imaged by the two chip imaging cameras via the prism group, and at the same time, the position recognition of the substrate is performed. The images of the two substrate marks required for the above are respectively captured by the two substrate imaging cameras via the prism group. That is, a total of four marks necessary for bonding the semiconductor chip to the substrate can be simultaneously imaged by the four imaging cameras. Therefore, it is not necessary to move the chip imaging camera and the substrate imaging camera in order to image the chip mark and the substrate mark. The displacement of the chip can be recognized. In addition, since each imaging camera images one chip mark or substrate mark, each mark can be reliably captured in the field of view even when the resolution is increased.

In this case, the prism group includes an upper prism group for guiding the images of the two chip marks to the two chip imaging cameras and a lower prism group for guiding the images of the two substrate marks to the two board imaging cameras. It is preferable to provide

According to this configuration, the images of the two chip marks captured through the upper prism group are captured by the two chip imaging cameras, and the images of the two substrate marks captured through the lower prism group are captured. The image is captured by two board imaging cameras. As described above, by dividing the prism group into the upper prism group and the lower prism group, the distance between the upper and lower prism groups or the reflection angle is appropriately adjusted, so that the chip imaging camera and the substrate imaging camera can be mutually connected. And can be arranged at an appropriate position without interference.

In this case, the upper prism group includes an upper prism for capturing the images of the two chip marks and an upper prism for distributing the images of the two chip marks from the upper prism to the left and right toward two chip imaging cameras. Having a separating prism,
The lower prism group includes a lower prism that captures the images of the two substrate marks and a lower prism that captures the images of the two substrate marks from the lower prism.
It is preferable to have a lower separation prism for distributing right and left toward the board imaging camera.

According to this configuration, the images of the two chip marks captured by the upper prism are divided right and left by the upper separation prism and imaged by the two chip imaging cameras. Even if the distance between the marks in the left-right direction is short, it is not necessary to arrange two chip imaging cameras close to each other and side by side. Similarly, since the images of the two substrate marks captured by the lower prism are sorted by the lower separation prism and imaged by the two substrate imaging cameras, for example, even if the separation distance between the two substrate marks is short, Accordingly, there is no need to arrange two board imaging cameras close to each other and side by side. That is, the positions of the two chip marks and the two substrate marks in the left-right direction directly affect the positions of the two chip imaging cameras and the two substrate imaging cameras. There is no.

In these cases, a chip system holding member for holding the upper prism group and the two chip imaging cameras, a substrate system holding member for holding the lower prism group and the two substrate imaging cameras, and a chip system holding member are provided. It is preferable to further include an imaging system moving mechanism for relatively moving the substrate system holding member forward and backward in the front-rear direction.

According to this configuration, at the start of the work, for example, the positions before and after the substrate mark are captured at the center of the visual field of the substrate imaging camera, and the upper prism is moved by the imaging system moving mechanism via the chip system holding member. If the group and the two chip imaging camera chips are moved, the position before and after the chip mark can be captured at the center of the field of view of each chip imaging camera, and fine adjustment of the camera field of view in the front-back direction becomes possible. In particular, it works effectively when increasing the resolution.

In these cases, a chip camera moving mechanism for holding the two chip imaging cameras and moving them forward and backward, and holding the two substrate imaging cameras and moving them back and forth. It is preferable to further include a substrate camera moving mechanism.

As described above, the images of the two chip marks captured by the upper prism are distributed to the left and right by the pair of upper separation prisms. Upper prism at center 2
When facing two chip marks, this corresponds to the front-back position of the two chip imaging cameras. Therefore, if the two chip imaging cameras can be moved forward and backward by the chip camera moving mechanism, even if the distance between the two chip marks is long or short, the movement of each chip imaging camera can be achieved. Each chip mark can be captured at the center in the left-right direction of the field of view. In exactly the same way, each board mark can be captured at the center in the left-right direction of the field of view of each board imaging camera. That is, fine adjustment of the camera field of view in the left-right direction is possible, and this function is effective particularly when the resolution is increased.

The chip camera moving mechanism has a left moving mechanism for moving the left chip imaging camera back and forth and a right moving mechanism for moving the right chip imaging camera back and forth. Preferably has a left moving mechanism for moving the left substrate imaging camera forward and backward and a right moving mechanism for moving the right substrate imaging camera forward and backward.

According to this configuration, even if the upper prism is shifted left and right at the center of the left and right centers of the two chip marks, the right and left chip imaging cameras are moved in the front and rear directions by the left and right moving mechanisms. By doing so, each chip mark can be captured at the center of the field of view of each chip imaging camera. Similarly, by moving the left and right board imaging cameras in the front-rear direction by the left and right moving mechanisms, respectively, the respective board marks can be captured at the center of the field of view of each board imaging camera.

On the other hand, a chip mounting apparatus according to the present invention calculates a position correction value of a semiconductor chip with respect to a substrate by inputting a detection result of a chip recognition apparatus according to any one of claims 1 to 5 and a detection result. It is characterized by comprising a controller that outputs a correction signal based on a position correction value, and position correction means that corrects the position of the semiconductor chip with respect to the substrate based on the correction signal from the controller.

According to this configuration, even if the resolution is increased, the two positions required for recognizing the positions of the semiconductor chip and the substrate can be instantaneously and accurately recognized. Thus, bonding of the semiconductor chip can be performed accurately in a short time.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a chip mounting apparatus provided with a chip recognition device according to an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a side view of a bonding section of the chip mounting apparatus, and FIGS. 2 and 3 are structural views of a chip recognition section of the chip mounting apparatus. As shown in these figures, the chip mounting apparatus 1 includes a bonding section 2 for adsorbing a semiconductor chip C and bonding the semiconductor chip C to a substrate B;
Recognition unit (imaging means) 3 for detecting positional deviation from
And a position correction unit (position correction unit) 4 that corrects the position of the semiconductor chip C based on the detection result of the chip recognition unit 3.

As shown in FIG. 1, the bonding section 2
A lifting device 12 supported by a frame 11;
2, a head unit 13 composed of a unit body 14 and two bonding heads 15, 15, an engagement position for engaging the two bonding heads 15, 15 with the unit body 14, and a semiconductor chip. C
And a head transfer device 16 that turns and conveys the liquid to and from a suction position where the liquid is sucked. When the semiconductor chip C is supplied to the bonding section 2, the collet 17 of the bonding head 15 turned to the suction position sucks the semiconductor chip C. Subsequently, the bonding head 15 is transported to the engagement position by the head transport device 16, and the unit body 1
4 is engaged. Here, the lifting / lowering device 12 is driven to lower the head unit 13 to bond the sucked semiconductor chip C onto the substrate B. This semiconductor chip C
It is a so-called flip-chip type, on the surface of which a number of bumps are formed and connected to lands (bonding positions) of a substrate B described later. Therefore, the collet 17 sucks the surface of the semiconductor chip C on which the bump is not formed.

The position correcting section 4 comprises an XY moving device 5 for moving the bonding section 2 together with the frame 11 in the XY directions, and the above-described head transport device 16 (see FIG. 2). XY in the horizontal plane of the semiconductor chip C
The position correction of the direction is performed by the XY moving device 5, and the position correction of the angle (θ direction) of the semiconductor chip C in the horizontal plane is performed by the rotation of the head transfer device 16.

As shown in FIGS. 2 and 3, the chip recognizing unit 3 comprises a semiconductor chip C and a substrate B prior to bonding.
And a moving device 7 that allows the chip recognizing device 6 to face between the semiconductor chip C and the substrate B. In addition, the moving device 7 includes the base 2
1, a forward / backward moving mechanism 22 mounted on the machine base 21 for moving the chip recognizing device 6 forward and backward, and a lifting / lowering moving mechanism 23 mounted on the forward / backward moving mechanism 22 for raising and lowering the chip recognizing device 6. The forward / backward movement mechanism 22 causes the tip of the chip recognition device 6 to face between the substrate B and the semiconductor chip C that has descended (stopped) to a predetermined position prior to bonding, while the elevation movement mechanism 23 includes In order to image C and substrate B as close as possible,
The height position of the chip recognition device 6 is adjusted according to the thickness.

The forward / backward moving mechanism 22 includes a forward / backward motor 25,
An advance / retreat ball screw 26 connected to the advance / retreat motor 25 and an advance / retreat block 27 into which the advance / retreat ball screw 26 is screwed. The reciprocating block 27 is mounted on the machine base 21 so as to be able to reciprocate in the front-rear direction, and reciprocates in the front-rear direction via the reciprocating ball screw 26 with the forward / reverse rotation of the reciprocating motor 25. A guide rail 28 is fixed to a side end of the advance / retreat block 27, and an elevating movement mechanism 23 is attached to the guide rail 28 so as to be able to move up and down.

The lifting / lowering moving mechanism 23 includes a lifting / lowering motor 31
An elevating ball screw 32 connected to an elevating motor 31, a mounting stage 33 on which the elevating ball screw 32 is screwed, and a guide block which is suspended from the mounting stage 33 and slidably engages with the guide rail 28. 34. The elevating motor 31 is fixed to a side end of the guide rail 28, and the mounting stage 33 is guided by the guide rail 28 to move up and down by the forward / reverse rotation of the elevating motor 31. The chip recognizing device 6 is mounted and fixed on the mounting stage 33. The chip recognizing device 6 is moved up and down by the elevating and lowering mechanism 23, and moves forward and backward together with the elevating and lowering mechanism 23 by the forward and backward moving mechanism 22.

As shown in FIGS. 4 and 5, the chip recognizing device 6 is mounted on a fixed base (substrate holding member) 42 fixed on a mounting stage 33 and mounted on the fixed base 42 so as to be able to advance and retreat. And a movable base (chip holding member) 43. At the front of the movable base 43, a pair of left and right chip imaging cameras 45, 45 via an upper camera holder 44.
Are mounted, and an upper prism group 46 for guiding an image of the semiconductor chip C to the two-chip imaging cameras 45, 45, and an upper lighting device 47 are mounted. Similarly, a pair of left and right board imaging cameras 49, 49 are attached to a front portion of the fixed base 42 via a lower camera holder 48, and a lower prism group that guides the image of the board B to both board imaging cameras 49, 49. 50 and a lower lighting fixture 51 are attached.

Upper camera holder (chip camera moving mechanism)
Reference numeral 44 is attached to the movable base 43 so as to be movable forward and backward, and is advanced and retracted by a chip-side micro head (chip camera moving mechanism) 52 fixed to the movable base 43. That is, the pair of left and right chip imaging cameras 45, 45 held by the upper camera holder 44 are configured to be slightly movable in the front-rear direction with respect to the upper prism group 46. Similarly, the lower camera holder (board camera moving mechanism) 48 is
2 is mounted on the base 2 so as to be able to move forward and backward, and is fixed to the fixed base 42.
It is advanced and retreated by 53. That is, the lower camera holder 48
The pair of left and right substrate imaging cameras 49 are configured to be finely movable in the front-rear direction with respect to the lower prism group 50. Reference numerals 54 and 55 in the figure denote a return spring of the upper camera holder 44 provided corresponding to the chip-side microhead 52 and a substrate-side microhead 53, respectively.
Is a return spring of the lower camera holder 48 provided correspondingly to.

On the other hand, the whole micro head (imaging system moving mechanism) 56 is fixed to the rear part of the fixed base 42, and the tip of the whole micro head 56 is attached to the movable base 43.
The movable base 43 is moved forward and backward by contacting the protrusion 43a of the movable base 43. That is, the chip imaging camera 45 mounted on the movable base 43, the upper prism group 46, and the upper lighting device 47
Is a board imaging camera 49 mounted on the fixed base 42,
The lower prism group 50 and the lower lighting device 51 are configured to be able to move slightly in the front-rear direction. Reference numeral 57 in the drawing denotes a return spring of the movable base 43 provided corresponding to the overall microhead 56.

A pair of left and right chip imaging cameras 45, 45 and a pair of left and right substrate imaging cameras 49, 49 are disposed so as to be vertically overlapped, respectively, and both are camera main bodies 61.
And a lens unit 62. The image of the semiconductor chip C is taken by the camera body 61 from the upper prism group 46 via the lens unit 62 of the chip imaging camera 45, and the image of the substrate B is taken from the lower prism group 50 by the lens unit of the substrate imaging camera 49. An image is taken by the camera body 61 via 62. And two chip imaging cameras 45, 45
And the two board imaging cameras 49, 49
(See FIG. 2), and the detection device 8 is further connected to the position correction unit 4 via the controller 9.

As will be described in detail later, two chip marks Mc, Mc of the semiconductor chip C are respectively imaged by the two chip imaging cameras 45, 45, and the substrate B is imaged by the two substrate imaging cameras 49, 49. The two substrate marks Mb and Mb are respectively imaged, and the detection device 8 detects a positional shift between the two based on the imaging results. Then, the position correction unit 4 is driven via the controller 9 to position the semiconductor chip C so that the two chip marks Mc, Mc of the semiconductor chip C match the two substrate marks Mb, Mb of the substrate B. to correct.

The upper lighting device 47 and the lower lighting device 51
A lamp array 64 in which a plurality of tungsten lamps and the like are arranged in a row, and a diffusion plate 65 for diffusing light of the lamp array 64 are provided. For imaging, the semiconductor chip C and the substrate B are irradiated with uniform light. Light each one.

Next, the upper prism group 46 and the lower prism group 50 constituting the prism group will be described with reference to FIG. As shown in the figure, four chip marks Mc for positioning are added to the four corners of the surface on which no bumps are formed on the semiconductor chip C, and correspondingly, the bonding positions of the substrate B are Has four substrate marks Mb added. The position of the semiconductor chip C in the horizontal plane is recognized by imaging two chip marks Mc, Mc of the four chip marks Mc. Similarly, the bonding position is two of the four substrate marks Mb. It is recognized by imaging the substrate marks Mb, Mb. Therefore, in this embodiment, two chip marks Mc, Mc
Are imaged by two chip imaging cameras 45, 45, respectively, and two substrate marks Mb, Mb are imaged by the two substrate imaging cameras 49, 49, respectively.

An upper prism group 46 for guiding the images of the two chip marks Mc, Mc to the two chip imaging cameras 45, 45
The upper chip 71 captures the images of the two chip marks Mc, Mc at the same time, and the images of the two chip marks Mc, Mc from the upper prism 71 are distributed to the left and right, and the two chip imaging cameras 45, 45 And an upper separating prism 72 that guides the light to each other. Left and right two chip marks M
The images of c and Mc are respectively reflected backward by the upper prism 71 arranged in a horizontal posture, and then reflected to the left and right by an upper separation prism 72 arranged in a vertical posture. , 45 respectively.

Similarly, the lower prism group 50 that guides the images of the two substrate marks Mb and Mb to the two substrate imaging cameras 49 and 49 includes a lower prism 73 that simultaneously captures the images of the two substrate marks Mb and Mb. And a lower separation prism 74 that distributes the images of the two substrate marks Mb, Mb from the lower prism 73 to the left and right and guides them to the two substrate imaging cameras 49, 49, respectively. Left and right two board marks Mb,
The image of Mb is reflected rearward by the lower prism 73 and then left and right by the lower separation prism 74, and guided to the two board imaging cameras 49 and 49, respectively. Note that the upper separation prism 72 and the lower separation prism 74 may be formed integrally, respectively.
As shown in the figure, it is preferable that the prism is formed by two prisms integrated with a light shielding plate therebetween.

By the way, in this embodiment, the image pickup 2
Chip marks Mc, Mc and two substrate marks M
b and Mb, the chip recognizing device 6 is set so that the upper prism group 46 and the lower prism group 50 are at the center.
However, in consideration of imaging each mark Mc, Mb with a higher resolution, it is preferable to adjust the marks Mc, Mb so that each mark Mc, Mb is located at the center of the field of view of each camera 45, 49. Therefore, the chip-side micro head 52 can slightly move the chip imaging camera 45 back and forth so that the center of each chip mark Mc in the left-right direction can be aligned with the center of the field of view of each chip imaging camera 45. I have. Similarly, the substrate-side microhead 53 allows the substrate imaging camera 49 to be slightly moved back and forth to align the center of each substrate mark Mb in the left-right direction with the center of the field of view of each substrate imaging camera 49. ing.

When the center of each board mark Mb in the front-rear direction is aligned with the center of the field of view of each board imaging camera 49 by the above-mentioned advance / retreat movement mechanism 22, each board is aligned with the center of the field of view of each board imaging camera 49. The mark Mb can be captured. Further, in this state, the chip imaging cameras 45, 45 and the upper lens group (and the upper lighting device 47) 46 are integrally and minutely moved back and forth by the overall micro head 56, whereby each chip imaging camera 45 is moved.
Each chip mark Mc can be captured at the center of the field of view. This prevents the chip mark Mc and the substrate mark Mb from deviating from the field of view of each of the cameras 45 and 49 even when the semiconductor chip C and the substrate B are imaged with an increased resolution.

As described above, the two chip marks Mc,
Mc and two board marks Mb, Mb, for a total of four marks Mc, Mb, are combined with two chip imaging cameras 45, 45 and two board imaging cameras 49, 49 for a total of four imaging cameras 45, 49. , The images are respectively taken, so that the imaging cameras 45 and 49 do not move,
Two chip marks Mc, Mc and two board marks Mb, Mb required for alignment can be imaged simultaneously and at the center of the field of view. Therefore, prior to the bonding, the displacement of the semiconductor chip C with respect to the bonding position of the substrate B can be accurately recognized, and the position of the semiconductor chip C can be accurately corrected based on the recognition result. Therefore, even a multi-pin semiconductor chip (flip chip) C can be bonded accurately and at high speed.

Next, a chip recognition device 6 according to a second embodiment of the present invention will be described with reference to FIGS. In the chip recognition device 6 of this embodiment, the upper camera holder 44 includes a left camera holder 44a that holds the left chip imaging camera 45a, and a right chip imaging camera 45.
and a right camera holder 44b that holds the camera b.
Similarly, the lower camera holder 48 is divided into a left camera holder 48a holding the left substrate imaging camera 49a and a right camera holder 48b holding the right chip imaging camera 49b, and each is divided in the front-back direction. It is configured to be able to move back and forth.

The left camera holder 44a of the upper camera holder 44 is attached to the movable base 43 so as to be movable forward and backward, and is advanced and retracted by the chip-side left micro head 52a fixed to the movable base 43. The right camera holder 44b is attached to the movable base 43 so as to be movable forward and backward, and is moved forward and backward by a chip-side right micro head 52b fixed to the movable base 43. That is, the pair of left and right chip imaging cameras 45a and 45b
In contrast, each is configured to be able to move slightly in the front-rear direction.

Similarly, the left camera holder 48a of the lower camera holder 48 is attached to the fixed base 42 so as to be able to move forward and backward, and is moved forward and backward by the substrate-side left micro head 53a fixed to the fixed base 42. The right camera holder 48b is attached to the fixed base 42 so as to be able to move forward and backward, and is moved forward and backward by the substrate-side right micro head 53b fixed to the fixed base 42. That is, the pair of left and right substrate imaging cameras 49a and 49b are configured to be slightly movable in the front-rear direction with respect to the lower prism group 50, respectively. Note that reference numerals 54a, 54b and 55a, 5
5b is a chip-side microhead 52a, 5b, respectively.
2b, the upper camera holder 44 (44a, 4
4b) return spring and substrate side micro head 53
a, 53b, the lower camera holder 48 (48
a, 48b).

In such a configuration, two chip marks Mc, Mc and two board marks Mb, Mb to be imaged are provided.
On the other hand, a pair of left and right chip imaging cameras 45 can be set so that the upper prism group 46 and the lower prism group 50 are centered on the left and right without facing the chip recognition device 6.
a, 45b, and a pair of left and right board imaging cameras 49a,
By moving smile 49b in the front-rear direction, respectively, the center in the left-right direction of each chip mark Mc can be aligned with the center of the field of view of each chip imaging camera 45a, 45b, and each board imaging camera 49a, The center in the left-right direction of each substrate mark Mb can be aligned with the center of the field of view of 49b.

[0042]

As described above, according to the chip recognizing device of the present invention and the chip mounting device provided with the same, since a total of four marks are imaged by a total of four cameras, respectively, the semiconductor chip And the position of the substrate to which this is bonded can be accurately recognized in a short time. Therefore, bonding failure can be suppressed, and the tact time in bonding can be reduced.

[Brief description of the drawings]

FIG. 1 is a side view of a bonding portion of a chip mounting device according to an embodiment of the present invention.

FIG. 2 is a side view of a chip recognition unit and a position correction unit of the chip mounting apparatus according to the embodiment.

FIG. 3 is a plan view of a chip recognition unit of the chip mounting apparatus according to the embodiment.

FIG. 4 is a plan view of the chip recognition device according to the embodiment.

FIG. 5 is a side view of the chip recognition device according to the embodiment.

FIG. 6 is a perspective view around a prism group of the chip recognition device according to the embodiment.

FIG. 7 is a plan view of a chip recognition device according to a second embodiment.

FIG. 8 is a side view of a chip recognition device according to a second embodiment.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 chip mounting device 2 bonding unit 3 chip recognition unit 4 position correction unit 5 XY moving device 6 chip recognition device 7 moving device 8 detection device 9 controller 17 collet 42 fixed base 43 movable base 44 upper camera holder 45 chip imaging camera 46 upper prism Group 48 Lower camera holder 49 Substrate imaging camera 50 Lower prism group 52 Chip side microhead 53 Substrate side microhead 54 Overall microhead 71 Upper prism 72 Upper separation prism 73 Lower prism 74 Lower separation prism B Substrate C Semiconductor chip Mb Substrate mark Mc chip mark

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Haruhiko Yamaguchi 2-5-1-5 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd.

Claims (7)

[Claims] 1. Prior to bonding a semiconductor chip to a substrate, a chip mark for positioning provided on the semiconductor chip and a positioning mark provided on the substrate are provided between the substrate and the semiconductor chip adsorbed by the bonding collet. A chip recognizing device comprising: an image pickup unit for picking up an image of a substrate mark; and a detection unit for detecting a displacement of a semiconductor chip with respect to a substrate based on the chip mark and the substrate mark picked up by the image pickup unit. An imaging unit that captures an image of the two chip marks on the semiconductor chip and an image of the two substrate marks on the substrate at the same time, and captures an image of the two chip marks from the prism group; Two chip imaging cameras, and 2
A chip recognizing device comprising: two substrate imaging cameras for capturing images of substrate marks, respectively. 2. The prism group includes an upper prism group that guides the images of the two chip marks to the two chip imaging cameras, and an image of the two substrate marks to the two substrate imaging cameras. The chip recognition device according to claim 1, further comprising a lower prism group for guiding. 3. The upper prism group includes an upper prism that captures the images of the two chip marks, and an image of the two chip marks from the upper prism, which is moved right and left toward the two chip imaging cameras. An upper separation prism for allocating the two substrate marks to the two substrate marks; and a lower prism group that captures the images of the two substrate marks, and an image of the two substrate marks from the lower prism. The chip recognition device according to claim 2, further comprising a lower separation prism that sorts the camera left and right. 4. A chip system holding member for holding the upper prism group and the two chip imaging cameras; a substrate system holding member for holding the lower prism group and the two substrate imaging cameras; 4. The chip recognition device according to claim 2, further comprising an imaging system moving mechanism that relatively moves the holding member and the substrate-based holding member forward and backward in the front-rear direction. 5. 5. A chip camera moving mechanism for holding the two chip imaging cameras and moving it back and forth, and a board for holding the two substrate imaging cameras and moving it back and forth. The chip recognition device according to claim 3, further comprising a camera moving mechanism. 6. The chip camera moving mechanism includes a left moving mechanism for moving the left chip imaging camera forward and backward, and a right moving mechanism for moving the right chip imaging camera forward and backward. The board camera moving mechanism includes a left moving mechanism for moving the left board imaging camera forward and backward, and a right moving mechanism for moving the right board imaging camera forward and backward. The chip recognition device according to claim 5, wherein: 7. A chip recognition device according to claim 1, wherein a detection result of said detection means is input, a position correction value of the semiconductor chip with respect to the substrate is calculated, and correction is performed based on the calculated position correction value. A chip mounting apparatus comprising: a controller that outputs a signal; and a position correction unit that corrects a position of a semiconductor chip with respect to a substrate based on a correction signal from the controller.