JP3397127B2 - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for mounting electronic component, with which mounting unit time can be shortened and mounting accuracy can be secured. SOLUTION: A chip 5 is temporarily placed on a mount part 20 arranged between a supply part 1 for the chip 5 and a substrate holding table 40, the image of the chip 5 on a transparent mount stage 23 is picked up from the downside, and the image of a substrate 44 is picked up by a substrate recognizing camera 39 to be moved together with a loading head 30. Based on the image pickup result of the chip 5, the position deviation of the chip 5 is corrected and afterwards, the chip 5 is picked up by the loading head 30 and mounted on the substrate 44. Thus, the time required for conveyance is shortened by shortening a conveyance stroke per cycle for mounting, the time required for recognizing the positions of the chip 5 and the substrate 44 is shortened and the mounting unit time can be shortened. At the same time, the mounting accuracy can be secured by holding the chip 5 in the proper attitude without any position deviation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and method for mounting an electronic component such as a flip chip on a substrate.

[0002]

2. Description of the Related Art With the advancement of required positional accuracy when mounting electronic components on a substrate, a method of correcting a positional deviation between the electronic component and the substrate during mounting by image recognition has been widely used. This method captures an image of a board or an electronic component with a camera prior to mounting the electronic component, detects the position of the board or the electronic component based on the obtained image data, and corrects the position during mounting based on the detection result. It is a thing.

By the way, in the case where a bump is formed on the lower surface of an electronic component such as a flip chip and the bump is bonded to the electrode of the substrate, it is necessary to obtain the position of the bump when correcting the position during mounting. For this reason, it is necessary to image the upper surface of the substrate and the lower surface of the electronic component for image recognition, and in the conventional mounting method of the electronic component, the substrate and the electronic component are imaged by the method described below.

First of all, one method is to move a mounting head picking up an electronic component from a supply section of the electronic component to a position above a camera for picking up an image of the electronic component, and image the lower surface of the electronic component held by the mounting head. After detecting the position of the electronic component, move the camera for board recognition to the mounting point on the board to detect the position of the mounting point on the board, and then align the mounting head with the mounting point. is there. As a second method, the mounting head holding the electronic component is positioned above the mounting point of the substrate in a stopped state, and an optical head capable of image pickup in both up and down directions is advanced between the electronic component and the substrate to move downward. A method of picking up an image of the board and the electronic parts above and retracting the optical head from the board after picking up the image has been used.

[0005]

However, in the above-mentioned first method, that is, the method of individually photographing the electronic component and the substrate by the two cameras and detecting the respective positions, the tact time can be shortened. There was a problem that it was difficult. This is because after the electronic components are picked up from the supply unit, the imaging is individually performed twice before reaching the mounting point, and as a result, this imaging requires time. Further, in the second method in which the optical head is advanced between the electronic component and the substrate and both upper and lower sides are imaged, it is difficult to shorten the tact time and the accuracy of position correction is ensured for the following reasons. There was a problem that it was difficult.

That is, since it is necessary to position the optical head midway between the electronic component and the substrate, the height position of the electronic component at the time of imaging is unavoidably the height position of the upper surface of the substrate on which the electronic component is mounted. It does not match. Therefore, even if the position correction amount is obtained based on the result of imaging in a state in which the mounting head is located above the substrate by the above-mentioned difference, the mounting head is lowered by the above-mentioned difference in height, which causes a positional deviation in the horizontal direction. The electronic components are not correctly position-corrected when mounted on the top surface. Also in this method, there is a limit to the reduction of the tact time because the optical head provided with the camera needs time to advance to the middle of the electronic component and the substrate and to retreat.

As described above, in the conventional electronic component mounting method, it is difficult to reduce the tact time of the mounting for detecting the positions of the electronic component and the board, and the position correction accuracy is improved to secure the mounting accuracy. There was a problem that it was difficult to do.

Therefore, an object of the present invention is to provide a mounting apparatus and a mounting method for an electronic component which can reduce the tact time of mounting and improve the mounting accuracy.

[0009]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus, an electronic component supply unit, a substrate holding unit for holding a substrate on which the electronic component is mounted, the substrate holding unit and the supply unit. And a transfer unit for transferring the electronic component from the supply unit onto the mounting stage, and a transfer unit for mounting the electronic component on the mounting stage. A mounting head that picks up a component and mounts it on the substrate, a moving member that moves the mounting head from the placing unit to above the substrate holding unit, and the mounting head with respect to the substrate on the substrate holding unit. Positioning means for relatively positioning, electronic part image pickup means for picking up an image of the electronic part on the mounting stage from below, and electronic part for detecting positional deviation of the electronic part based on the image pickup result by the electronic part image pickup means. Misalignment detection means, board imaging means arranged on the moving member for imaging the board on the board holding part, space changing means for changing the space between the board imaging means and the mounting head, and the board imaging means Board position deviation detecting means for detecting the position deviation of the board based on the imaging result of the electronic parts, and mounting the electronic parts on the board based on the position deviation detection results of the board and the electronic parts position deviation detection results. And a position shift correction means for correcting the position shift at time.

According to another aspect of the present invention, there is provided an electronic component mounting apparatus, which includes an electronic component supply unit, a substrate holding unit for holding a substrate on which the electronic component is mounted, and a transparent mounting stage. Part, a transfer means for transferring electronic components from the supply part onto the mounting stage, a mounting head for picking up and mounting the electronic components of the mounting stage on the substrate, and a mounting head on the substrate holding part. Positioning means for relatively positioning the mounting head with respect to the substrate, electronic part image pickup means for picking up an image of the electronic part on the mounting stage from below, and the electronic part based on the image pickup result by the electronic part image pickup means. Position deviation detecting means for detecting the position deviation of the electronic parts, and an electronic part when the mounting head picks up the electronic parts on the mounting stage based on the position deviation detection result of the electronic parts. First positional deviation correcting means for correcting the positional deviation of the substrate, a board imaging means for imaging the board on the board holding table, and a board position for detecting the positional deviation of the board based on the imaging result by the board imaging means. A displacement detecting means and a second displacement correcting means for correcting the displacement when the electronic component is mounted on the substrate based on the displacement detection result of the board and the displacement detection result of the electronic component. Prepared

According to a third aspect of the present invention, there is provided an electronic component mounting method, wherein the electronic component is transferred from the electronic component supply section to a substrate holding section for holding a substrate on which the electronic component is mounted and the supply section. The step of transferring onto the transparent mounting stage of the disposed mounting section, the step of picking up the electronic component on the mounting stage by the mounting head, and the electronic component imaging means when picking up the electronic component. A step of capturing an image of the electronic component from below, a step of detecting a position shift of the electronic component based on an image capturing result of the electronic component capturing means, a step of disposing the mounting head on a moving member mounted in advance, A step of capturing an image of the substrate held by the substrate holding part by the substrate image capturing means in which the distance from the mounting head is set by the changing means; and the substrate based on the image capturing result of the substrate image capturing means. A step of detecting a positional deviation, a step of moving the moving member to move the mounting head from the placing section onto the substrate, a detection result of the positional deviation of the substrate, and a detection of a positional deviation of the electronic component. And a step of correcting the positional deviation when the electronic component is mounted on the substrate based on the result.

According to a fourth aspect of the present invention, there is provided a mounting method of an electronic component, which comprises a step of transferring the electronic component from a supply part of the electronic component to a mounting part provided with a transparent mounting stage by a transfer means, and the mounting stage described above. A step of capturing an image of the upper electronic component from below with an electronic component image capturing means, a step of detecting a positional shift of the electronic component based on the image capturing result, and a first positional shift correcting means based on the positional shift detection result. A step of correcting the positional deviation by means of picking up the electronic component by the mounting head, and re-imaging the electronic component held by the mounting head after pickup by the electronic component imaging means,
The step of detecting the positional deviation of the electronic component, the step of detecting the positional deviation of the substrate by imaging the substrate held by the substrate holding unit by the substrate imaging means, the result of detecting the positional deviation of the substrate, and the electronic component The step of correcting the positional deviation when the electronic component is mounted on the substrate by the second positional deviation correcting means based on the positional deviation detection result at the time of re-imaging.

An electronic component mounting method according to a fifth aspect is the electronic component mounting method according to the fourth aspect, wherein the height position of the electronic component is re-imaged when the electronic component is re-imaged. It was held at the mounting height position on the substrate held by.

According to the first and third aspects of the present invention, the mounting portion disposed between the electronic component supply portion and the substrate holding table is provided separately from the mounting head for mounting the electronic component on the substrate. Electronic parts are transferred by the transfer means provided and once mounted, and the electronic parts on the transparent mounting stage provided in the mounting part are imaged from below and at the moving part for moving the mounting head. By imaging the board with the board imaging means provided, it is possible to shorten the transfer stroke of the electronic component per cycle and shorten the time required for the transfer, and also to image the electronic component and the board simultaneously in parallel. The time required for position recognition can be shortened, and thus the overall mounting tact time can be shortened.

According to the second and fourth aspects of the present invention, the electronic component is once mounted on the mounting portion by the transfer means provided separately from the mounting head for mounting the electronic component on the substrate, and then mounted. The electronic component on the transparent mounting stage provided in the mounting portion is imaged from below, the positional displacement of the electronic component is corrected by the first positional displacement correcting means based on the imaged result, and the electronic component is held by the mounting head. By mounting the same on the substrate, the position correction accuracy can be improved and the mounting accuracy can be ensured.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus, and FIG. 3 is a portion of the electronic component mounting apparatus. It is a front view.

First, the structure of an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a first XY table 2 is arranged in an electronic component supply unit 1, and a first XY table is provided.
A wafer 4 is held by a holder 3 mounted on the table 2. The wafer 4 has a large number of chips 5 which are electronic components. A first chip recognition camera 6 is arranged above the first XY table 2. The first chip recognition camera 6 images the chip 5.

A rotary head unit 7 is disposed on the side of the first XY table 2. The rotary head unit 7 includes a turning table 8 and a reverse suction nozzle 9. The position of the chip 5 is detected by the image pickup result of the first chip recognition camera 6, and the position of the chip 5 corrected by driving the first XY table 2 is picked up by the reverse suction nozzle 9. Then, the turning table 8 is turned (arrow a), and then the reversal suction nozzle 9 is reversed (arrow b), whereby the chip 5 is held at the delivery position to the transfer head 10 described below.

Next, the transfer head 10 as transfer means will be described. The Y-axis table 1 includes a Y-axis slider 1
2 is mounted slidably in the Y direction. The Y-axis table 11 and the Y-axis slider 12 are the first linear motor 13
Make up. The Y-axis slider 12 has a Z-axis motor 14a.
The Z-axis table 14 provided with is attached, and the suction nozzle 15 is attached to the Z-axis table 14 so as to be vertically movable. While the Y-axis slider 12 is moved to the transfer position of the chip 5, the Z-axis motor 14a is driven to move the suction nozzle 15 up and down, whereby the suction nozzle 15 is moved.
Picks up the chip 5 held at the transfer position by the vacuum suction nozzle 9 by vacuum suction.

On the side of the rotary head unit 7, a mounting portion 20 for the chip 5 is arranged. The mounting portion 20 is the second
The XY table 21 is provided, and the mounting stage 23 is attached to the second XY table 21 by the holder 22. The mounting stage 23 has a plate 24 made of a transparent material, and the lower surface of the chip 4 mounted on the plate 24 is an electronic component image pickup means arranged below the mounting stage 23. 2 chip recognition camera 2
It is possible to pick up an image by using 5. Therefore, the position of the chip 5 is detected based on the imaging result of the second chip recognition camera 25, and the second XY table 21 is driven based on the detection result, so that the chip 5
The position in the XY direction can be corrected.

Next, the mounting head 30 will be described. Y
The axis table 11 has a Y-axis slider 31 as a moving member.
Is mounted slidably in the Y direction. Y-axis table 1
The 1-axis and Y-axis sliders 31 form a second linear motor 32. A Z-axis table 33 having a Z-axis motor 33a is mounted on the Y-axis slider 31. A suction nozzle 34 is mounted on the Z-axis table 33 so as to be vertically movable, and a suction tool 35 at the lower end of the suction nozzle 34 is rotatable by a θ-axis motor 36 in the θ direction. Therefore, the Y-axis slider 31 is moved to position the suction tool 35 on the mounting stage 23, and the second XY table 2 is moved.
The suction tool 35 is lowered onto the chip 5 whose position is corrected in the XY directions by 1 to pick up the chip 5, and then the θ-axis motor 36 is driven to correct the position in the θ direction. XY direction and θ
The chip 5 can be held in a state where the position is corrected in both directions. Therefore, the second XY table 2
1, the mounting stage 23, and the mounting stage 30 serve as a first positional deviation correcting unit.

A substrate holding portion 40 is arranged on the side of the mounting portion 20. The substrate holding unit 40 includes an X-axis motor 41a.
The holder 43 is mounted on the X-axis table 41 provided with, and the substrate 44 held by the holder 43 moves in the X direction by driving the X-axis motor 41a. Therefore, the X-axis table 41 and the Y-axis slider 31
By combining the above operations, the mounting head 30 can be positioned relatively to the substrate 44 held by the substrate holder 40. That is, the X-axis table 41
And Y-axis slider 31 (second linear motor 32)
Is a positioning means.

On the Y-axis slider 31, a Y-axis table 37 equipped with a camera Y-axis motor 38 is provided.
It is arranged so as to be located above 0. On the Y-axis table 37, a board recognition camera 39, which is a board imaging means,
Is installed. The board recognition camera 39 images the board 44 on the board holding table 40 below.

By driving the camera Y-axis motor 38 to change the distance from the mounting head 30, the mounting head 30
Is in a position to pick up the chip 5 on the mounting stage 23, the substrate 44 is detected by the substrate recognition camera 39.
An arbitrary mounting point of can be imaged. That is, the camera Y-axis motor 38 and the Y-axis table 37 serve as an interval changing unit that changes the interval between the board recognition camera 39 and the mounting head 30.

In this way, by disposing the board recognition camera 39 on the same moving part on which the mounting head 30 is mounted, the interval changing means which requires only a small load and low speed operation is additionally arranged. Since only this is sufficient, the drive mechanism of the board recognition camera 39 can be simplified.

Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 2, the chip position detection unit 50 detects the position of the chip 5 on the wafer 4 based on the image data captured by the first chip recognition camera 6. The first XY table drive unit 51 drives the first XY table 2, and at this time, based on the positional deviation amount of the chip 5 detected by the chip position detection unit 50, a command from a main control unit 57, which will be described later, gives this chip. Correct the displacement of position 5.

The chip position deviation detecting section 53, which is an electronic part position deviation detecting means, performs image processing on the image data of the chip 5 on the mounting table 23 captured by the second chip recognition camera 25 to perform the position of the chip 5. Detect the deviation. The second X
The Y-table driving unit 54 drives the second XY table 21, and based on the positional displacement amount of the chip 5 detected by the chip-position displacement detecting unit 53 at this time, the mounting stage is also instructed by the main control unit 57. The displacement of the upper chip 5 is corrected.

The reversing head drive section 52 drives the reversing head unit 7. The main control unit 57 controls the respective control elements of the supply unit 1, the transfer head 10, and the reversing head unit 7 (see the respective elements within the ranges 58, 59, and 60 surrounded by chain lines). . Further, the position data of the chip 5 detected by the chip position deviation detecting unit 53 is sent to the main control unit 57 as mounting position correction data.

The motor controller 55 controls the Z of the transfer head 10.
Axis motor 14a, first linear motor 13, Z-axis motor 33a of mounting head 30, second linear motor 32, θ
The axis motor 36, the camera Y-axis motor 38, and the X-axis motor 41a of the substrate holding unit 40 are controlled. The board position shift detection unit 56 detects the position shift of the board 44 based on the image data of the board 44 captured by the board recognition camera 39, and sends the detection result to the main control unit 57 as position correction data at the time of mounting.

The main controller 57 controls the overall operation of each of the above-mentioned parts, and also mounts it based on the position data of the chip 5 and the board 44 sent from the chip position deviation detector 53 and the board position deviation detector 56. The positional deviation correction amount at time is calculated. Then, the mounting head 30, the second linear motor 32, and the X-axis table 41 are adjusted in accordance with the positional deviation correction amount.
Is controlled to correct the positional deviation when the chip 5 is mounted on the substrate 44. That is, the main controller 57, the mounting head 30, the second linear motor 32, the X-axis table 4
Reference numeral 1 is a second positional deviation correcting means.

This electronic component mounting apparatus is configured as described above, and its operation will be described below. In FIG.
Chips 5 are sequentially picked up by the reverse suction nozzle 9 from the wafer 4 held on the holder 3. At this time,
Of the chip 5 based on the imaging result of the chip recognition camera 6 of
Is driven to drive the first XY table 2 to correct the position in the XY directions. Therefore, the reverse suction nozzle 9 accurately sucks and picks up the center of the chip 5.

Thereafter, the swivel table 8 swivels and the reverse suction nozzle 9 is reversed, so that the chip 5 is held at the delivery position to the transfer head 10. Next, the suction nozzle 15 waiting above the transfer position moves up and down to suck and pick up the chip 5, and moves it onto the mounting stage 23. Then, the suction nozzle 15 again moves up and down to mount the chip 5 on the mounting stage 23.
It is transferred onto the transparent plate 24 of.

When the transfer head 10 is withdrawn from the mounting stage 23, the mounting head 30 is positioned above the mounting stage 23. At this time, the lower surface of the chip 5 on the plate 24 is imaged by the second chip recognition camera 25. The plate 24 is transparent and does not interfere with imaging from below. Then, the position of the chip 5 is detected by the chip position deviation detection unit 53 based on the image data of the lower surface of the chip 5, and the position deviation in the XY direction and the θ direction is detected.

Next, the mounting head 3 is attached to the chip 5.
The suction tool 35 of 0 is lowered and picked up,
At this time, the positional displacement of the chip 5 is corrected by driving the second XY table 21 for positional displacement in the XY directions, and by driving the θ-axis motor 36 before suctioning for the positional displacement in the θ direction. To be done. Therefore, the suction tool 35
Can correctly adsorb and hold the center of the chip 5 without displacement or inclination of the posture.

Next, when the suction tool 35 vacuum-sucks the chip 5, as shown in FIG. 3, the lower surface of the chip 5 is raised with the nozzle 34 slightly elevated (a minute gap c) from the mounting stage 23. Re-image. Since this gap c is set so that the chip 5 is within the depth of focus range of the second chip recognition camera 25, a good image can be obtained even when the chip 5 is picked up and imaged.

At this time, the holding position is set so that the height position of the held chip 5 coincides with the height position of the chip 5 mounted on the substrate 44 as shown in FIG. . As a result, the lower surface of the chip 5 can be imaged in a state in which the positional displacement in the horizontal direction due to the vertical movement of the nozzle 34 of the mounting head 30 is completely eliminated, and the error caused by the difference in height at the time of imaging can be eliminated. It is possible to obtain highly accurate position correction data. And the chip 5 obtained here
Is sent to the main controller 57 (see FIG. 2).

Further, in parallel with the timing when the mounting head 30 performs the above-mentioned operation on the mounting portion 20, the substrate recognition camera 39 captures an image of the substrate 44. At this time, the mounting head 30 is always at a fixed position on the mounting stage 23, but the range to be imaged on the substrate 44 is the chip 5 concerned.
The board recognition camera 39 is positioned above the mounting point every time the chip 5 is mounted, since the mounting point depends on the mounting point. In this operation, the motor 38 is driven as necessary to change the distance between the board recognition camera 39 and the mounting head 30, and the Y
This is performed by aligning the position in the direction and driving the X-axis motor 41a to align the position in the X direction.

As a result, when the chip 5 is picked up by the mounting stage 23, the displacement of the chip 5 is detected,
Since the positional deviation of the mounting point of the board 44 is detected simultaneously in parallel, the time required for the positional deviation can be shortened as compared with the conventional method of detecting the positional deviation twice at individual timing.

After that, the mounting head 30 picking up the chip 5 moves onto the substrate 44, and the suction tool 35 is lowered to mount the chip 5 on the mounting point of the substrate 44. At this time, the main control unit 57 calculates the positional deviation correction amount for correcting the positional deviation between the chip 5 and the substrate 44, and the positional adjustment is performed by adding this positional deviation correction amount. Is performed at the height position where the chip 5 is mounted on the substrate 44, the suction tool 3
The error caused by the vertical movement of 5 can be eliminated, and highly accurate positional deviation correction can be performed. Further, since the suction tool 35 is mounted by pressing it against the substrate 44 while holding the center of the chip 5 in a correct posture, the mounting accuracy is ensured and the suction tool 3 is secured.
No mounting defect such as inclination of the chip 5 due to relative displacement between the chip 5 and the chip 5 occurs, and therefore good and uniform crimping quality can be obtained.

In addition, as shown in this embodiment, the mounting portion 2
0 is provided between the supply unit 1 and the substrate holding unit 40, and the supply unit 1
When the chips 5 transferred from the mounting unit 20 are once mounted on the mounting stage 23 of the mounting unit 20, the transfer head 10 and the mounting head 30 move in each cycle in the stroke of moving the chips 5 to the supply unit 1. Compared with the method of transferring directly from the substrate to the substrate 44, the number is about half. Therefore, the time required to convey the chip 5 for each cycle is shortened, and this is combined with the effect of shortening the time required for detecting the positional deviation described above.
The tact time can be greatly reduced and productivity can be improved.

[0041]

According to the present invention, an electronic component mounting portion is provided at an intermediate position between the electronic component supply portion and the substrate holding table,
Since the electronic component is imaged from below in a state where the electronic component is placed on the transparent mounting stage of the mounting unit, and the substrate is recognized by the substrate recognition camera at the same time, the electronic component and the substrate can be imaged. It is possible to simultaneously perform imaging for detecting the positional deviation of the electronic components, and it is possible to halve the stroke in which the electronic components are transported in each cycle, thus greatly reducing the cycle time for mounting electronic components. It is possible to improve productivity. Also,
Since the mounting portion is provided with the electronic component position deviation correcting means and the electronic head is held by the mounting head in a state where the position deviation is corrected, the center of the electronic component can be correctly held even in the case of a small electronic component. Since it can be pressure-bonded to the substrate, mounting accuracy can be ensured, and good and uniform pressure-bonding quality can be obtained without misalignment or posture inclination.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 3 is a partial front view of an electronic component mounting apparatus according to an embodiment of the present invention.

[Explanation of symbols]

1 supply section 5 chips 6 First chip recognition camera 10 Transfer head 11 Y-axis table 20 Placement section 21 Second XY table 23 Placement stage 25 Second chip recognition camera 30 mounting heads 38 Camera Y-axis motor 39 board recognition camera 40 substrate holder 44 substrate 57 Main control unit

─────────────────────────────────────────────────── --Continued from the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 H01L 21/52 H05K 3/32 H05K 13/00

Claims (5)

(57) [Claims] 1. An electronic device including an electronic component supply unit, a substrate holding unit for holding a substrate on which the electronic component is mounted, and a transparent mounting stage arranged between the substrate holding unit and the supply unit. A mounting portion for components, a transfer means for transferring electronic components from the supply unit onto the mounting stage, a mounting head for picking up the electronic components of the mounting stage and mounting them on the substrate, and the mounting head. A moving member that moves the head from the mounting unit to above the substrate holding unit, a positioning unit that relatively positions the mounting head with respect to the substrate on the substrate holding unit, and an electronic device on the mounting stage. Electronic component image pickup means for picking up an image of the component from below, electronic component position shift detection means for detecting the position shift of the electronic component based on the image pickup result by the electronic component image pickup means, and the substrate holder arranged on the moving member. A board image pickup means for picking up an image of a board on a part, a distance changing means for changing a distance between the board image pickup means and the mounting head, and a board position for detecting a positional deviation of the board based on an image pickup result by the board image pickup means A deviation detecting means; and a positional deviation correcting means for correcting the positional deviation when the electronic component is mounted on the substrate based on the positional deviation detection result of the board and the positional deviation detection result of the electronic component. A characteristic electronic component mounting device. 2. An electronic component supply unit, a substrate holding unit for holding a substrate on which the electronic component is mounted, an electronic component mounting unit provided with a transparent mounting stage, and the electronic component mounting unit on the mounting stage. Transfer means for transferring electronic components from the supply unit, a mounting head for picking up the electronic components of the mounting stage and mounting them on the substrate, and the mounting head relative to the substrate on the substrate holding unit. Positioning means for positioning the electronic parts on the mounting stage, electronic part imaging means for imaging the electronic parts on the mounting stage from below, and electronic part positional deviation for detecting the positional deviation of the electronic parts based on the imaging result by the electronic part imaging means. A first position shift that corrects the position shift of the electronic component when the mounting head picks up the electronic component on the mounting stage based on the detection means and the position shift detection result of the electronic component. Correcting means, board image pickup means for picking up an image of the board on the board holding table, board position deviation detection means for detecting the position deviation of the board based on the imaging result by the board imaging means, and position deviation detection of the board A second positional correction is performed when the electronic component is mounted on the substrate based on the result and the positional shift detection result of the electronic component.
And an electronic component mounting apparatus. 3. A transparent mounting of a mounting portion arranged between the substrate holding portion for holding a substrate on which the electronic component is mounted and the feeding portion by means of a transfer means for transferring the electronic component from the electronic component supplying portion. A step of transferring the electronic component on the mounting stage, a step of picking up the electronic component on the mounting stage by a mounting head, and a step of imaging the electronic component from below by an electronic component imaging means when picking up the electronic component. A step of detecting a positional deviation of the electronic component based on the image pickup result of the electronic component image pickup means, and a step of arranging the mounting head on the moving member in advance so that the distance between the mounting head and the mounting head is changed. A step of capturing an image of the substrate held by the substrate holding portion by the set substrate capturing means; a step of detecting a positional deviation of the substrate based on an image capturing result of the substrate capturing means; A step of moving the material to move the mounting head from the placing section onto the substrate, and the positional deviation correction means based on the positional deviation detection result of the substrate and the positional deviation detection result of the electronic component. And a step of correcting a positional deviation when the electronic component is mounted on the substrate. 4. A step of transferring an electronic component from a supply part of the electronic component to a mounting part provided with a transparent mounting stage by a transfer means, and the electronic component on the mounting stage is imaged from below from the electronic part. Means for detecting the positional deviation of the electronic component based on the imaging result, and the mounting head for correcting the positional deviation by the first positional deviation correcting means based on the positional deviation detection result. The step of picking up the electronic component, the step of re-imaging the electronic component held by the mounting head after the pick-up by the electronic component image pickup means to detect the positional deviation of the electronic component, and the step of holding the electronic component Based on the step of detecting the positional deviation of the board by imaging the board by the board imaging means, the positional deviation detection result of the board and the positional deviation detection result at the time of re-imaging the electronic component. Mounting method of electronic components, which comprises a step of correcting the positional deviation at the time of mounting to the substrate of the electronic component by the second positional deviation correcting means are. 5. The height position of the electronic component is held at the mounting height position on the substrate held by the substrate holding table when re-imaging the electronic component. Electronic component mounting method.