JP4237718B2 - Electronic component mounting apparatus and mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component such as a semiconductor chip on a mounted member.

  Mounting methods for mounting electronic components such as chips on mounted members such as carrier tapes and lead frames include flip chip mounting and mounting where the bumps formed on the electronic components are mounted downward from the top surface of the mounted member. An inner lead mounting for mounting the electronic component on a lead provided in a device hole of a mounting member from the lower surface of the mounted member is known.

  In a conventional mounting apparatus, flip chip mounting and inner lead mounting are performed by separate mounting apparatuses. A mounting apparatus that employs either mounting method includes a stage tool positioned on the lower surface side of the mounted member and a mounting tool positioned on the upper surface side of the mounted member. It is required to accurately position the mounting member.

  On the other hand, it may be required to be able to selectively perform flip chip mounting and inner lead mounting with a single mounting apparatus. Japanese Patent Application Laid-Open No. 2004-228561 discloses a mounting measure that can selectively perform flip chip mounting and inner lead mounting.

  When flip chip mounting is performed in the mounting apparatus disclosed in Patent Document 1, if an electronic component is taken out from the component supply unit by the suction nozzle, the suction nozzle is rotated 180 degrees to reverse the electronic component.

  Next, the mounting tool sucks the inverted electronic component at its lower end surface and receives it from the suction nozzle. Next, the mounting tool moves above the mounted member, is positioned and then lowered, and mounts the electronic component on the mounted member.

  While the mounting tool receives the electronic component from the suction nozzle and moves above the mounted member, the mounting tool passes above the component camera, and the electronic component sucked and held on the lower surface of the mounting tool is imaged.

  On the other hand, the mounted member is imaged by a mounted member imaging camera disposed above the mounted member. The mounting tool is positioned so that the center coordinates of the electronic component coincide with the position where the electronic component of the mounted member is mounted based on the imaging signals of the two cameras. Therefore, in the case of flip chip mounting, the electronic component can be mounted with high accuracy at the mounting position of the mounted member.

  On the other hand, in the case of inner lead mounting, if an electronic component is taken out from the component supply unit by the suction nozzle, the suction nozzle supplies and places the electronic component on the upper surface of the stage tool. The stage tool on which the electronic component is placed is positioned at a position facing the device hole formed in the mounted member on the lower surface side of the mounted member. In this state, the mounting tool is lowered, and the electronic component is mounted on the lead protruding into the device hole.

  As described above, when the electronic component is mounted on the mounted member by the inner lead, the mounting tool is always positioned above the mounted member and is on standby. When the electronic component placed on the upper surface of the stage tool is positioned at a position facing the device hole of the mounted member, the mounting tool is lowered to mount the electronic component on the lead. .

  The mounting tool is only positioned so that the preset position, that is, the center of the lower surface coincides with the center of the device hole, and is not positioned each time the electronic component is mounted. For this reason, when the mounting tool is replaced with a different size depending on the type of electronic component, for example, the center position of the mounting tool may deviate from the center position of the device hole depending on the mounting accuracy at that time.

Therefore, in the past, when the mounting tool was replaced, a jig with Kapton tape attached to the plate was placed instead of the mounted member, and this jig was pressed with the mounting tool, and the impression was mounted. It has been performed to adjust the positional deviation by taking an image with a member imaging camera and calculating the center coordinates of the mounting tool.
JP 2002-26074 A

  However, if the mounting tool is positioned using a jig when mounting with the inner lead method, the burden placed on the operator to perform the alignment work may increase, or the mounting tool Even if the jig is pressed by this, a clear indentation may not be made on the jig, and in such a case, the positional deviation of the mounting tool may not be corrected accurately.

  When mounting the electronic component of the mounted member by the inner lead method, the mounting tool is positioned without using a jig when the mounting tool is changed according to the change of the type of the electronic component. It is an object of the present invention to provide an electronic component mounting apparatus and mounting method which can be performed easily and accurately.

The present invention is a mounting apparatus capable of mounting an electronic component on a mounted member by an inner lead method,
Conveying means for conveying and positioning the mounted member;
The electronic component is supplied and mounted on the upper surface, and the electronic component can be positioned with respect to the mounted member from the lower surface side of the mounted member; and
A mounting tool for mounting the electronic component positioned on the mounted member by being disposed above the mounted member and driven in a descending direction;
The mounting tool is provided between the mounting tool in the raised position and the mounted member so as to be movable back and forth, and the mounting tool enters between the mounting tool and the mounted member before mounting the electronic component on the lead. Imaging means for imaging the mounting tool;
The mounting tool is horizontally positioned by an image pickup signal from the image pickup means, and includes a control means for mounting the electronic component on the mounted member based on the positioning.
The imaging means images the lower surface of the mounting tool,
The control means calculates the center coordinates of the lower surface of the mounting tool based on the imaging signal from the imaging means, and the center coordinates are positioned above the mounted member when the electronic tool is mounted. The mounting apparatus is characterized in that the hand offset amount is compared with the positioning coordinates and the mounting tool is positioned based on the offset amount .

  A component supply unit that supplies the electronic component, and an electronic component that is provided so as to be rotatable in the vertical direction and is picked up and taken out from the component supply unit. It is preferable to have an adsorption tool that can be transferred to

This invention is a mounting method for mounting an electronic component on a mounted member by an inner lead method using a mounting tool,
A step of conveying and positioning the mounted member;
Supplying the electronic component to the upper surface of the stage tool;
Driving the stage tool to position the electronic component relative to the mounted member from the lower surface side of the mounted member;
Imaging the lower surface of the mounting tool by imaging means that moves back and forth between the mounting tool in the raised position and the mounted member ;
The center coordinates of the lower surface of the mounting tool are calculated based on the imaging signal from the imaging means, and the center coordinates are compared with the positioning coordinates when the mounting tool is positioned above the mounted member when the electronic component is mounted. And a step of positioning the mounting tool based on the offset amount, and a step of mounting the electronic component on the mounted member by the positioned mounting tool. It is in the implementation method.

  According to the present invention, when an electronic component is mounted on a mounted member by an inner lead method, the lower end surface of the mounting tool that stands by above the mounted member is imaged, and the mounting tool is positioned based on the imaging. Positioning can be performed easily and precisely.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a schematic configuration of a mounting apparatus according to an embodiment of the present invention, and this mounting apparatus includes a transport apparatus 2 that transports a member 1 to be mounted along a predetermined direction. The transport device 2 has a pair of guide rails 3 arranged in parallel at a predetermined interval, and the mounted member 1 is intermittently pitched along these guide rails 3. The mounted member 1 is positioned and held on the guide rail 3 every time it is pitch-fed.

  When the mounted member 1 is transported by the transport device 2, a chip 4 that is an electronic component supplied from a component supply unit 11 described later is mounted on the mounted member 1. At the position where the chip 4 of the mounted member 1 is mounted, the stage tool 5 that supports the lower surface of the mounted member 1 is horizontally moved by the first drive mechanism 6 shown in FIG. It is provided so that it can be driven in the Z direction.

  As will be described later, the mounting apparatus can mount the chip 4 on the mounted member 1 by selecting either the flip chip method or the inner lead method. In the flip-chip method, a circuit board or a lead frame is used, and in the inner lead method, a tape carrier is used.

  A mounting tool 7 for mounting the chip 4 on the substrate 1 is provided above the stage tool 5 so as to be driven in the X, Y and Z directions by the second driving mechanism 8. The component supply unit 11 has a wafer stage 12 driven in the X and Y directions by a drive source (not shown). On the wafer stage 12, a semiconductor wafer 13 divided into a large number of chips 4 is held on a wafer sheet 14.

  Of the chips 4 held on the wafer sheet 14, the chip 4 at a predetermined position is pushed up by a push-up pin (not shown). The chip 4 pushed up by the push-up pin is sucked by the suction nozzle 16. The suction nozzle 16 is attached to a rotary head 18 provided in the reversing unit 17. The rotary head 18 is rotationally driven in the vertical direction. Accordingly, the suction nozzle 16 is positioned at a position where the suction surface 16a faces downward and a position where the suction face 16a turns 180 degrees from the position and faces upward.

  The reversing unit 17 is driven along the guide rod 19. The guide rod 19 is installed horizontally from the wafer stage 12 toward the transfer device 2.

  When the chip 4 is mounted on the mounted member 1 by the flip chip method, the suction nozzle 16 that sucks the chip 4 from the wafer sheet 14 has the suction surface 16a that sucks the chip 4 upward as shown by a chain line in FIG. In this way, positioning is driven to the side of the conveying device 2. When the chip 4 is mounted on the mounted member 1 by the inner lead method, the suction nozzle 16 is positioned and driven to the side of the transport device 2 with the suction surface 16a that sucks the chip 4 down. This position is the delivery position.

  The stage tool 5 and the mounting tool 7 are each provided with a heater (not shown). Thereby, the part where the chip 4 or the chip 4 of the mounted member 1 is mounted is heated, and the chip 4 is thermocompression bonded to the mounted member 1.

  A first camera 21 that is driven in the horizontal direction by the third drive mechanism 20 is disposed above the position where the chip 4 of the mounted member 1 is mounted. The first camera 21 can be moved back and forth between the mounted member 1 and the mounting tool 7 positioned above the mounted member 1 by the third drive mechanism 20 as shown by arrows in FIG. It is designed to be driven.

  The first camera 21 has a case 25 formed in a hollow box shape as shown in FIG. 2, and in this case 25, a first imaging unit 26 that images the mounted member 1, A second imaging unit 27 that images the chip 4 delivered to the mounting tool 7 is provided. Each imaging unit 26, 27 is composed of a CCD (solid-state imaging device).

  Imaging windows 28 are respectively formed on the lower surface and the upper surface of the front end portion of the first camera 21. A mirror 30 having two reflecting surfaces 29 inclined at an angle of 45 degrees with respect to the imaging window 28 is accommodated in the distal end portion of the first camera 21. Light incident from the lower imaging window 28 and reflected by the one reflecting surface 29 enters the first imaging unit 26. Light incident from the upper imaging window 28 and reflected by the other reflecting surface 29 enters the second imaging unit 27. The imaging signals from the image forming units 26 and 27 are input to an image processing unit (not shown) provided in the control device 31, and are processed and converted into digital signals.

  When the chip 4 is mounted by the flip chip method, the mounting tool 7 receives the chip 4 from the suction nozzle 16. Above the receiving position, a second camera 32 that images the chip 4 held by the suction nozzle 16 and recognizes the position is arranged. A third camera 33 that images the chip 4 held by the mounting tool 7 and recognizes the position is disposed below the position through which the mounting tool 7 that has received the chip 4 passes.

  Imaging signals of the second and third cameras 32 and 33 are input to an image processing unit provided in the control device 31. Then, the control device 31 positions the mounting tool 7 above the mounted member 1 based on the coordinate signal of the chip 4 processed by the image processing unit.

  Next, the first camera 21 enters between the mounting tool 7 and the mounted member 1 to pick up an image of the chip 4 and the mounted member 1, and the mounting tool 7 is driven based on the imaging result. Is positioned with respect to the mounted member 1. After the positioning, when the first camera 21 is retracted from between the mounting tool 7 and the mounted member 1, the mounting tool 7 is lowered to mount the chip 4 on the mounted member 1.

  On the other hand, when the chip 4 is mounted on the mounted member 1 such as a tape carrier by the inner lead method, when the suction nozzle 16 sucks the chip 4 from the wafer stage 12, the suction nozzle 16 does not reverse and moves along the guide rod 19. Move in the direction.

  The stage tool 5 moves from the position indicated by the solid line to the position indicated by the chain line in FIG. 1 and is on standby. When the suction nozzle 16 is positioned above the stage tool 5, the stage tool 5 rises and is placed on the upper surface thereof. The chip 4 is supplied from the suction nozzle 16. The stage tool 5 that receives the chip 4 moves downward and then moves below the mounted member 1 as indicated by a solid line.

  That is, a device hole 1a is formed in the mounted member 1 as shown in FIGS. 3A and 3B, and a lead 1b on which the chip 4 is mounted protrudes from the device hole 1a. The stage tool 5 is positioned so that the center of the chip 4 held on the upper surface coincides with the center of the device hole 1a as shown in FIG. After positioning, the stage tool 5 ascends as shown in FIG. At the same time, the mounting tool 7 positioned above the mounted member 1 is lowered. Thereby, the chip 4 is mounted on the lead 1b.

  When the mounting tool 7 is replaced with a different size in accordance with the change in the type of the chip 4, the mounting tool 7 is placed above the mounted member 1 and the same position as when the chip 4 is mounted on the mounted member 1 prior to mounting. Once positioned, the first camera 21 is inserted between the mounting tool 7 and the mounted member 1. Then, the lower surface of the mounting tool 7 is imaged by the second imaging unit 27 of the first camera 21.

  The imaging signal of the second imaging unit 27 is input to the control device 31. The control device 31 processes the imaging signal of the second imaging unit 27 as follows. That is, as shown in FIG. 4, the coordinates of the four corners C1 to C4 of the rectangular image P on the lower surface of the mounting tool 7 are calculated. Next, center coordinates O1 (X1, Y1) of the image P are calculated from the coordinates of the corners C1 to C4.

  When the center coordinate O1 is calculated, the center coordinate O1 is compared with the center coordinate when the mounting tool 7 is positioned above the mounted member 1 when the chip 4 is mounted, that is, the positioning coordinate O2 (X2, Y2). The difference between these coordinates, X = (X1-X2) and Y = (Y1-Y2), is the offset amount of the mounting tool 7 when mounting by the inner lead method.

  Therefore, if the offset amount is taught by the control device 31 and the position of the mounting tool 7 is corrected based on the teaching, the mounting tool 7 may be replaced according to the change of the type of the chip 4 or the like. The center O1 can be precisely matched to the positioning coordinate O2, which is the same when positioned when the chip 4 is mounted.

  That is, when the mounting tool 7 is replaced in accordance with a change in the type of the chip 4 or the like, the positioning adjustment of the mounting tool 7 is performed by a teaching method using the first camera 21 instead of the indentation method using the conventional jig. Therefore, it is possible to facilitate positioning work and improve positioning accuracy.

  In other words, in the mounting apparatus capable of selectively mounting the flip chip method and the inner lead method, the first device used for positioning the chip 4 and the mounted member 1 when the flip chip method is mounted. When the camera 21 is mounted by the inner lead method, it can be used for positioning correction of the mounting tool 7. For this reason, even if the positioning correction of the mounting tool 7 is changed from the indentation method to the teaching method, a camera dedicated to the teaching method is not required, so that the cost is not increased and the apparatus is not complicated.

In the above-described embodiment, the mounting apparatus that can be used for both the flip chip method and the inner lead method has been described as an example. However, the present invention can be applied even to a mounting device dedicated to the inner lead method. Is possible.

  The center coordinates of the mounting tool are calculated from the coordinates of the four corners on the bottom surface of the mounting tool. However, the center of the diagonal line can be obtained from the coordinates of the two corners located in the diagonal direction as the center coordinates of the mounting tool. Good.

The side view which shows schematic structure of the mounting apparatus of one embodiment of this invention. Sectional drawing which shows schematic structure of a 1st camera. Explanatory drawing which shows the state which mounts a chip | tip in a tape carrier by an inner lead system. Explanatory drawing for calculating | requiring the offset amount of a mounting tool at the time of mounting of an inner lead system.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Mounted member, 2 ... Conveying device (conveying means), 4 ... Chip (electronic component), 5 ... Stage tool, 7 ... Mounting tool, 20 ... 3rd drive mechanism, 21 ... 1st camera (imaging means) ), 31 ... control device,

Claims (3)

A mounting device capable of mounting an electronic component on a mounted member by an inner lead method,
Conveying means for conveying and positioning the mounted member;
The electronic component is supplied and mounted on the upper surface, and the electronic component can be positioned with respect to the mounted member from the lower surface side of the mounted member; and
A mounting tool for mounting the electronic component positioned on the mounted member by being disposed above the mounted member and driven in a descending direction;
The mounting tool is provided between the mounting tool in the raised position and the mounted member so as to be movable back and forth, and the mounting tool enters between the mounting tool and the mounted member before mounting the electronic component on the lead. Imaging means for imaging the mounting tool;
The mounting tool is horizontally positioned by an image pickup signal from the image pickup means, and includes a control means for mounting the electronic component on the mounted member based on the positioning.
The imaging means images the lower surface of the mounting tool,
The control means calculates the center coordinates of the lower surface of the mounting tool based on the imaging signal from the imaging means, and the center coordinates are positioned above the mounted member when the electronic tool is mounted. A mounting apparatus characterized in that an offset amount is set in comparison with the positioning coordinates, and the mounting tool is positioned based on the offset amount .   A component supply unit that supplies the electronic component, and an electronic component that is provided so as to be rotatable in the vertical direction and is picked up and taken out from the component supply unit. The electronic component mounting apparatus according to claim 1, further comprising a suction tool that can be transferred to the electronic component. A mounting method in which an electronic component is mounted on a mounted member by an inner lead method using a mounting tool,
A step of conveying and positioning the mounted member;
Supplying the electronic component to the upper surface of the stage tool;
Driving the stage tool to position the electronic component relative to the mounted member from the lower surface side of the mounted member;
Imaging the lower surface of the mounting tool by imaging means that moves back and forth between the mounting tool in the raised position and the mounted member ;
The center coordinates of the lower surface of the mounting tool are calculated based on the imaging signal from the imaging means, and the center coordinates are compared with the positioning coordinates when the mounting tool is positioned above the mounted member when the electronic component is mounted. And a step of positioning the mounting tool based on the offset amount, and a step of mounting the electronic component on the mounted member by the positioned mounting tool. Implementation method.

Images