JP4859705B2 - Implementation method - Google Patents

Description

  The present invention relates to a mounting method for mounting a chip component such as an electronic component on a workpiece made of a glass, resin, and metal substrate. In particular, the invention is suitable when the substrate is large.

  A conventional mounting apparatus, for example, horizontally arranges a head for holding a chip component by vacuum suction, a mechanism for moving the head up and down, a substrate holding stage for mounting and holding a substrate on which the chip component is mounted, and a substrate holding stage. And a two-field camera provided in a space between the head and the substrate holding stage and capable of moving back and forth and capable of simultaneously imaging the head side and the substrate holding stage side. In this mounting apparatus, a two-field camera is entered into the space, and the alignment mark written on the chip component held by the head and the alignment mark written on the substrate are simultaneously read, and the chip component is based on the read information. Is aligned with the mounting position on the board. Then, after retracting the two-view camera, the head is lowered to join the chip component to the mounting position on the substrate (for example, refer to Patent Document 1).

Japanese Patent No. 3838561

  In recent years, the size of a substrate tends to increase for the purpose of increasing mass production efficiency, and a substrate that requires high-density mounting has also been targeted. For example, the following method is effective when the mounting apparatus described above is adapted to a large substrate and chip components are mounted on the entire substrate with a head. That is, the mounting operation is performed while moving both the head and the two-field camera simultaneously and in the same direction by a horizontal driving member such as a guide rail.

  By the way, when the above-described method is used, the longer the guide rail, the longer the guide rail is required. And the longer the guide rail, the greater the error (swell) in the parallelism of the guide rail, which generally affects the mounting accuracy. The inconvenience when the guide rail has undulation will be described with reference to FIGS.

  It is assumed that the guide rail has pitching, that is, undulation in the Z-axis direction. For example, as shown in FIG. 12B, it is assumed that the guide rail 24 is inclined downward by a minute angle θ from the X-axis direction. In this case, since the head 17 descends in the axial direction tilted by a slight angle θ with respect to the Z-axis, the head 17 moves away from the planned mounting position P1 on the substrate W as compared to the case where there is no tilt (FIG. 12A). Since the position P1 ′ is reached by ΔX = h × tan θ in the X-axis direction, high-precision mounting is impossible.

  Further, it is assumed that the guide rail has yawing, that is, undulation in the Y-axis direction. For example, as shown in FIG. 13B, it is assumed that the guide rail 24 is inclined to the side by a minute angle ψ from the X-axis direction. In this case, the head 17 descends from a position shifted by ΔY = d × tan Ψ in the Y-axis direction with respect to the X-axis. Since it reaches the side position P2 ′ by ΔY = d × tan Ψ in the axial direction, it cannot be mounted with high accuracy.

  The above inconvenience can be overcome by improving the processing accuracy and mounting accuracy of the guide rail 24, but the cost of the apparatus increases.

  The present invention has been made in view of such circumstances, and prevents a decrease in mounting accuracy caused by undulation of a horizontal drive member for horizontally moving the head, that is, pitching or rolling. The purpose is to provide a possible implementation method.

  In order to achieve the above object, the mounting method according to claim 1 is characterized in that the three axes of the orthogonal coordinate system are X, Y, and Z, the XY plane is the horizontal plane, the Z-axis direction is the vertical direction, and the chip component (11). The workpiece holding stage (14) for mounting and holding the workpiece (W) to be mounted, and the chip component (11) provided above the workpiece holding stage (14) can be sucked and held and moved up and down in the Z-axis direction. A mounting method using a mounting device including a head (17) and an elongated horizontal driving member (24) that enables the head (17) to be driven and arranged at a plurality of positions along the X-axis direction, XY direction position of the head (17) when the head (17) is disposed at the upper position (UX), and XY direction position of the head (17) when the head (17) is disposed at the lower position (DX) Error (ΔX, ΔY) to the horizontal drive member (24) Steps (110 to 165) for each of a plurality of measurement positions (HX1 to HX5) and a step for obtaining a correlation function representing the correlation between the X direction position of the horizontal drive member (24) and the error (ΔX, ΔY). (170) and an error (ΔX, ΔY) corresponding to the position of the head (17) at the time of mounting in the horizontal drive member (24) is obtained from the above correlation function, and the head (17) is found by the obtained error (ΔX, ΔY). And a step (330, 335) of lowering the head (17) after offsetting the relative positional relationship between the workpiece and the workpiece holding stage (14).

  In the mounting method according to claim 2, when the head (17) is arranged at the upper position (UX), the position of the head (17) in the XY direction and when the head (17) is arranged at the lower position (DX). The position of the head (17) in the XY direction means that the head (17) and the work holding stage (14) are provided so as to be able to advance and retreat in the space between the head (17) and the work holding stage (14). The image is obtained by reading the target mark (R3) provided on the head (17) using a two-field camera (37) capable of imaging simultaneously.

  In the mounting method according to claim 3, the correlation function associates the deformation amount of the horizontal drive member (24) with the temperature, and the temperature of the horizontal drive member (24) measured by the temperature sensor (252). The error (ΔX, ΔY) is determined based on the correlation function.

  In the mounting method according to the fourth aspect, air blow is performed toward the horizontal driving member (24) according to the temperature of the horizontal driving member (24) measured by the temperature sensor (252).

  In addition, the code | symbol of the parentheses attached | subjected to each component in each column of the means for solving a claim and a subject shows the correspondence with the specific means as described in embodiment mentioned later.

  According to the present invention, it is possible to prevent a decrease in mounting accuracy caused by undulation of a horizontal driving member for moving the head horizontally, that is, pitching or rolling.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a mounting apparatus according to the embodiment, FIG. 2 is a front view illustrating a schematic configuration of a mounting unit, FIG. 3 is a plan view illustrating a configuration of a link mechanism, and FIG. 4 is a side view illustrating a schematic configuration of a recognition unit. 5 is a plan view showing a schematic configuration of the projection unit, FIG. 6 is a diagram showing an image projected on the CCD camera, and FIG. 7 is a plan view showing a target mark provided on the suction unit.

  In the present embodiment, a case where an electronic component with a bump is mounted on a substrate as a chip component will be described as an example. As the chip component, all other forms on the side to be bonded to the substrate are shown regardless of the type and size of, for example, an IC chip, a semiconductor chip, an optical element, a surface mount component, a wafer, and the like. Moreover, as a board | substrate, all the forms of the side joined to chip components, such as a resin substrate, a glass substrate, a film substrate, a metal substrate (for example, copper substrate), are shown, for example.

  As shown in FIG. 1, the mounting apparatus according to this embodiment is roughly divided into an apparatus base 1, a substrate supply unit 2 disposed on the front side (left end in FIG. 1) of the apparatus base 1, The mounting unit 3 is disposed on the back side of the device base 1 and the chip component supply unit 4 is disposed on the left side of the mounting unit 3.

  The substrate supply unit 2 is a box-like body having an openable / closable door 5 at the top, and includes a placement table 6 and a transport mechanism 7 therein.

  The placement table 6 is configured to be able to place a substrate W as a workpiece. On the surface, positioning pins 8 for inserting into positioning holes formed in the substrate W are erected at a predetermined interval.

  The transport mechanism 7 is configured to suck and hold the substrate W placed on the placement table 6 from the surface and transport it to the substrate holding stage 14 provided on the movable table 15 on the mounting unit 3 side. Specifically, the transport mechanism 7 includes a suction plate 9 that can suck the surface of the substrate W. The suction plate 9 can move in the uniaxial (Y) direction above the mounting table 6 and above the substrate holding stage 14 and can be moved up and down at a position where the mounting table 6 and the substrate holding stage 14 face each other. (Z-axis direction). The suction plate 9 is connected to a pump through a pipe (not shown).

  As shown in FIGS. 1 and 2, the mounting unit 3 includes a holding unit 10 that holds the substrate W transported by the transport mechanism 7, a crimping unit 12 that holds the chip component 11 by suction and mounts it on the substrate W, The recognition unit 13 is configured to recognize an alignment mark provided in advance on the substrate W and the chip component 11 and a target mark provided on a part of the head 17.

  The holding unit 10 includes a substrate holding stage 14 that holds and holds the substrate W, the surface of which is sucked and held by the suction plate 9 of the transfer mechanism 7, in a horizontal posture, and the substrate holding stage 14 in the horizontal uniaxial (Y) direction. The movable table 15 is movable. The movable table 15 moves in the front-rear direction by feeding a screw along the guide rail 16 by driving a motor (not shown) forward and reverse. The holding unit 10 may be a linear table.

  A heater (not shown) is built in the lower part of the substrate holding stage 14 so that the substrate W can be heated from the back surface.

  The crimping unit 12 includes a head 17 that holds the chip component 11 by suction, a horizontal drive mechanism 18 that moves the head 17 in the horizontal one axis (X) direction, and a lift drive mechanism 19 that moves the head 17 in the vertical (Z) direction. And a rotational drive mechanism 20 that rotates the head 17 around the Z axis (Ω).

  The head 17 includes a frame body 21 having an inverted concave shape and a suction portion 22 made of a transparent glass plate attached to an opening at the bottom of the frame body. The suction part 22 is formed with a flow path that communicates an opening formed at the center of the lower surface with an opening formed at the side, and is connected to a pump (not shown) via a hose. That is, the opening of the lower surface acts as a suction hole by the operation of the pump, and holds the chip component 11 by suction. Note that an attachment made of a transparent glass plate or the like corresponding to the shape of the chip component 11 may be attached to the lower surface of the suction portion 22. In addition, a target mark R3 (see FIG. 7) is provided at the center of a portion 221 that extends laterally in the suction portion 22.

  The horizontal drive mechanism 18 includes a guide rail 24 disposed along the X-axis direction, a movable base 25 slidably provided on the guide rail 24, a ball screw mechanism 251 for driving the movable base 25, A motor M1 that rotates the ball screw mechanism 251 in the forward / reverse direction is driven, and the motor M1 is driven in the forward / reverse rotation, so that the movable base 25 is reciprocated in the horizontal (X) direction along the guide rail 24. The horizontal drive mechanism 18 may be a linear table.

  The elevating drive mechanism 19 is an actuator composed of a cylinder 26 arranged with the Z-axis direction as a central axis, a piston 27 that moves in the cylinder 26, and a rod 28 that extends from the tip of the piston 27. The piston 27 and the rod 28 are rotatable around the axis within the cylinder 26. Further, a flow path for supplying or exhausting fluid is formed in the pressure chamber between the cylinder 26 and the piston 27, and supply and exhaust of gas from the pump can be controlled by the control unit 29A. The head 17 is attached to the movable base 25 via the lifting drive mechanism 19.

  The rotary drive mechanism 20 is connected to the rotary shaft of the motor M2 through the rod guide G and the rod 28 of the actuator, with the motor M2 mounted on the left side in FIG. And a link mechanism 32.

  As shown in FIG. 3, the link mechanism 32 includes a telescopic guide 34 at the connecting portion of the two link bars 33a and 33b, the tip of one link bar 33a being the motor M2, and the tip of the other link bar 33b being the tip. The actuator is connected to the rod guide G of the rod 28 of the actuator. That is, as the motor M2 is driven forward / reversely, both link bars 33a and 33b are swung left and right, the rotational power is transmitted to the rod 28, and the piston 27 rotates in the cylinder. When the link bars 33a and 33b swing, the telescopic guide 34 extends and contracts so as to follow the change in the distance between the rotation shaft of the motor M2 and the rod 28. Further, the link bar 33b is configured to maintain a constant height without following the advance / retreat of the rod 28 by the rod guide G.

  Further, a fan-shaped scale 35 is attached to the rod 28, and the memory on the side surface of the scale is read by an encoder 36 disposed in the vicinity. That is, the rotation angle of the piston 27 can be read, and the rotation angle of the head 17 around the Z axis can be read from the result.

  As shown in FIGS. 4 to 6, the recognition unit 13 includes two CCD cameras 37 and a horizontal drive mechanism 60 that moves the two CCD cameras 37 in the horizontal one axis (X) direction.

  A projection unit 38 is provided at the tip of the two CCD cameras 37. The projection unit 38 projects the first mirror 39a that reflects the alignment marks R1 and R2 and the target mark R3, and the alignment marks R1 and R2 and the target mark R3 that appear on the first mirror 39a. 37 and a second mirror 39b projected onto 37. The projection unit 38 is configured to be movable back and forth (movable in the Y-axis direction) along the guide rail 40 provided on the lower surface of the movable table 62 by forward / reverse driving of the motor M3. That is, the projection unit 38 is configured to advance and retract within the opening of the head 17 (the space between the head 17 and the substrate holding stage 14) and outside the opening. At the time of a calibration operation to be described later, target marks R3 of the head 17 selectively disposed at the upper position UX and the lower position DX are captured and projected onto the CCD camera 37. Further, at the time of this operation, which will be described later, the alignment mark R2 of the chip component 11 and the alignment mark R1 of the substrate W held by the head 17 are simultaneously captured and projected onto the CCD camera 37.

  The horizontal drive mechanism 60 includes a guide rail 61 disposed along the X-axis direction, a movable base 62 slidably provided on the guide rail 61, a ball screw mechanism 621 for driving the movable base 62, And a motor M4 that drives the ball screw mechanism 621 to rotate forward and backward. By driving the motor M4 to rotate forward and backward, the movable table 62 is reciprocated in the horizontal (X) direction along the guide rail 61. Yes. The horizontal drive mechanism 60 may be a linear table. Two CCD cameras 37 are attached to the movable table 62.

  The chip component supply unit 4 includes a mounting table 41, a chip component transport mechanism 42, a relay unit 50, and a slide table 43.

  The mounting table 41 is a chip tray in which a plurality of chip components 11 in a face-down state are arranged and accommodated, or a semiconductor wafer diced into the plurality of chip components 11 in a face-down state is a ring-shaped frame. The holding body held in (1) can be placed.

  The chip part transport mechanism 42 is a part that sucks and holds the chip part 11 and transports the chip part 11. The chip part transport mechanism 42 can move back and forth on a guide rail 44 extending in the Y-axis direction of the apparatus base 1, and the movable frame 45. And a movable base 47 movable in the horizontal (Y) direction along the guide rail 46 directed to the front surface of the head, and a suction head 48 capable of sucking and holding the chip component 11 on the movable base 47 is vertically movable. Have deployed. That is, the chip component 11 at a predetermined position placed on the placement table 41 is sucked and held by the suction head 48, delivered to the relay unit 50, and further delivered to the slide table 43.

  The relay unit 50 is a part that receives the conveyed chip component 11 and relays delivery to the head 17.

  The slide table 43 is movable in the horizontal (Y) direction of the frame erected on the apparatus base 1 and is configured to receive the chip component 11 conveyed to the relay unit 50 by the chip component conveying mechanism 42. Has been. The slide table 43 conveys the chip component 11 to a position where the head 17 can be sucked.

  Next, the operation of the mounting apparatus having the above-described configuration will be described with reference to FIGS.

  FIG. 8 is a flowchart showing an outline of the mounting operation of the mounting apparatus according to the embodiment, FIG. 9 is a flowchart showing the process of the first correction data acquisition operation, and FIG. 10 is a diagram for specifically explaining the first correction data acquisition operation. FIG. 11, FIG. 11 is a flowchart showing the processing of this mounting operation, FIG. 12 is a diagram for explaining the principle of correction processing for waviness in the Z-axis direction, and FIG. 13 shows the principle of correction processing for waviness in the Y-axis direction. It is a figure for demonstrating.

  In the present embodiment, a case where a chip tray in which a plurality of chip components 11 are arranged and accommodated is placed on a placement table is taken as an example. Each chip component 11 is in a state where the bump electrode is on the back surface, that is, in a face-down state, and a case where a plurality of these chip components 11 are mounted on a sheet-like resin substrate will be described as an example. In this case, a thermosetting adhesive material is previously transferred to the back surface of the chip component 11.

  First, in step 100, a first correction data acquisition operation is performed. In the first correction data acquisition operation, as shown in FIG. 10, the head 17 is first arranged at the first measurement position HX <b> 1 by driving the horizontal drive mechanism 18. More specifically, when the movable base 25 moves along the guide rail 24, the head 17 moves to the first measurement position HX1 (step 110). On the other hand, the CCD camera 37 is arranged at the first imaging position CX1 by driving of the horizontal driving mechanism 60. More specifically, when the movable table 62 moves along the guide rail 61, the CCD camera 37 moves to the first imaging position CX1 (step 115). At the first measurement position HX1, the head 17 is disposed at the upper position UX1 by driving of the lifting drive mechanism 19 (step 120).

  When the head 17 is disposed at the upper position UX1, the projection unit 38 enters the opening of the head 17 by driving the motor M3 (step 125). The projection unit 38 that has entered the opening of the head 17 projects the target mark R3 provided on the suction unit 22 on the pair of left and right first and second mirrors 39a and 39b, and projects them onto the CCD camera 37. The CCD camera 37 reads the XY position of the target mark R3 in the head 17. The data is sent to and stored in the control unit 29B (step 130).

  When the reading and storage of the target mark R3 when the head 17 is at the upper position UX1 is completed, the projection unit 38 is retracted from the opening of the head 17 to the outside of the opening by driving the motor M3 (step 135). Then, the head 17 is disposed at the lower position DX1 by driving of the elevating drive mechanism 19 (step 140).

  When the head 17 is disposed at the lower position DX1, the projection unit 38 again enters the opening of the head 17 by driving the motor M3 (step 145). The projection unit 38 that has entered the opening of the head 17 projects the target mark R3 provided on the suction unit 22 on the pair of left and right first and second mirrors 39a and 39b, and projects them onto the CCD camera 37. The CCD camera 37 reads the XY position of the target mark R3 in the head 17. The data is sent to and stored in the control unit 29B (step 140). When the reading and storing of the target mark R3 when the head 17 is at the lower position DX1 is finished, the projection unit 38 is retracted from the opening of the head 17 to the outside of the opening by driving the motor M3 (step 155).

  The processing from step 110 to step 155 described above, that is, the CCD camera 37 reads the target mark R3 in the head 17 in which the X direction position is arranged at the first measurement position HX1 and the Z direction position is arranged at the upper position UX1. Processing for storing the XY position, and the CCD camera 37 reads the target mark R3 in the head 17 in which the X direction position is arranged at the first measurement position HX1 and the Z direction position is arranged at the lower position DX1, and the XY position is read. When the storing process is completed, the head 17 is arranged at the second measurement position HX2 by driving of the horizontal driving mechanism 18. The CCD camera 37 is disposed at the second imaging position CX2 by driving of the horizontal drive mechanism 60. Then, the same processing as in Step 110 to Step 155 described above is performed.

  The same processing is performed for the third measurement position HX3, the fourth measurement position HX4, and the fifth measurement position HX5. When the processing for the fifth measurement position HX5 is completed (Yes in Step 165), the control unit 29B performs the following process. Perform the process. That is, first, errors ΔX and ΔY between the XY direction position of the head 17 when the head 17 is disposed at the upper position UX and the XY direction position of the head 17 when the head 17 is disposed at the lower position DX are guide rails. 24 for each of the five first to fifth measurement positions HX1 to HX5. Subsequently, a correlation function representing the correlation between the X-direction position of the guide rail 24 and the errors ΔX and ΔY is used by interpolating the errors ΔX and ΔY for the first to fifth measurement positions HX1 to HX5. Ask. This correlation function is stored in the control unit 20B as the first correlation function.

  Next, in step 200, a second correction data acquisition operation is performed. In the second correction data acquisition operation, first, before placing the substrate K to be mounted on the mounting table 6 of the substrate supply unit 2, a master substrate engraved with a reference scale associated with the mounting portion of the substrate W is removed. It is mounted on the mounting table 6 and is aligned by the pins 9. Subsequently, the master substrate is transported by the transport mechanism 7 and placed on the substrate holding stage 14 of the mounting unit 3, and the mounting unit 3 and the recognizing unit 13 are operated and the projection unit 38 fed into the opening of the head 17. The reference scale on the master substrate is displayed in order, and the image data is captured from the CCD camera 37. Subsequently, the CCD camera 37 and each axis are determined from the coordinates of each drive axis (X, Y, Z) such as the CCD camera 37 and the substrate holding stage 14 and each drive axis (X, Y, Z) coordinate obtained from the image data. Is obtained as a second correlation function. The second correlation function is stored in the control unit 29B.

  Next, in step 300, this mounting operation is performed. In this mounting operation, first, a chip tray is set on the mounting table 41 of the chip component supply unit 4. In the chip tray, a plurality of chip parts 11 are accommodated in a face-down state. Thereafter, the open / close door 5 of the substrate supply unit 2 is opened, the substrate W is aligned and placed on the placement table 6, and the open / close door 5 is closed. When the open / close door 5 is closed, the suction plate 9 operates, descends at a position facing the substrate W, sucks and holds the substrate W from the surface, and transports it to the substrate holding stage 14.

  When the suction plate 9 moves above the substrate holding stage 14, the suction plate 9 descends, the back surface of the substrate W is brought into contact with the substrate holding stage 14, and thereafter the suction on the suction plate 9 side is released. The suction plate 9 that has released the suction returns to the standby position. Simultaneously with the release of the suction of the suction plate 9, the suction of the substrate holding stage 14 is activated to hold the substrate W by suction.

  At the same time when the substrate W is transported to the substrate holding stage 14, the chip component 11 is transferred from the chip component supply unit 4 to the head 17 of the mounting unit 3. Specifically, the movable frame 45 and the movable table 47 on which the suction head 48 is mounted move in the horizontal (X, Y) direction, and hold the predetermined chip component 11 in a face-up state. The suction head 48 that sucks and holds the chip component 11 is moved to the right end in the figure by the movable base 47 and delivers the chip component 11 to the relay unit 50, so that the relay unit 50 places the chip component 11 on the slide table 43. Deliver.

  The slide table 43 that has received the chip component 11 moves to a position where the chip component 11 is delivered to the head 17 along the guide rail.

  The head 17 moves along the guide rail 24 to the position where the chip component 11 is mounted by the movement of the movable base 25. The head 17 sucks and holds the chip component 11 conveyed to the mounting position by the slide table 43 (step 310).

  The CCD camera 37 is moved to the X direction position corresponding to the X direction position of the head 17 by the driving of the horizontal drive mechanism 60 (step 315).

  The projection unit 38 enters the opening of the head 17 by driving the motor M3. As shown in FIG. 6, the projection unit 38 in the opening of the head 17, with the alignment mark R <b> 1 written on the substrate W and the two bumps R <b> 2 at the diagonal positions of the chip component 11, The image is projected on the first and second mirrors 39a and 39b, and the alignment mark R1 on the right side of the substrate W in the drawing is projected onto one CCD camera 37, and the alignment mark R1 on the left side of the substrate W in the drawing is projected onto the other CCD camera 37. In this example, two bumps R2 are used as alignment marks. Next, the alignment mark R2 on the right side of the chip component 11 in the figure is projected onto one CCD camera 37, and the alignment mark R2 on the left side of the chip part 11 in the figure is projected onto the CCD camera 37 (step 320).

  The control unit 29B compares the positions of both alignment marks acquired by the CCD camera 37 with a previously stored reference position. If a positional deviation occurs as a result of the comparison, a correction value is calculated using the second correlation function acquired by the master substrate. Thereafter, the control unit 29B rotates (Ω) the movable table 15 in the horizontal (Y) direction, the movable base 25 in the horizontal (X) direction, and the head 17 around the Z axis based on the correction value. Then, alignment is performed (step 325).

  Further, the control unit 29B uses the first correlation function obtained in step 170 to correct the positional deviation in the horizontal axis direction caused by the deviation between the actual elevation direction of the head 17 and the Z axis direction. An offset value in the axial direction and the Y-axis direction is calculated. Thereafter, the controller 29B rotates (Ω) the movable table 15 in the horizontal (Y) direction, the movable base 25 in the horizontal (X) direction, and the head 17 around the Z axis based on the offset value. Then, an offset is applied (step 330). Specifically, the offset amount in the X-axis direction can be represented by a value obtained by inverting the sign of the deviation amount ΔX in FIG. 12B, and the offset amount in the Y-axis direction is represented by the deviation in FIG. 13B. The amount ΔY can be represented by a value obtained by reversing the sign.

  Here, FIG. 12A shows mounting at the mounting position when the guide rail 24 has no undulation in the Z-axis direction, and FIG. 12B shows when the guide rail 24 has undulation in the Z-axis direction. The mounting at the mounting position is shown. As shown in FIG. 12B, the guide rail 24 has a undulation in the Z-axis direction, the inclination angle of the guide rail 24 with respect to the horizontal axis J1 is θ, and the distance difference between the uppermost position and the lowermost position of the head 17 is expressed. When h is assumed, the head 17 descends with an axis inclined by an angle θ with respect to the vertical line J1 during mounting, so that the head 17 moves to a position P1 ′ shifted by ΔX = h · tan θ from the original mounting position P1. The chip component 11 is mounted.

  FIG. 13A shows mounting at the mounting position when the guide rail 24 has no undulation in the Y-axis direction, and FIG. 13B shows the mounting position when the guide rail 24 has undulation in the Y-axis direction. The implementation in is shown. As shown in FIG. 13B, if the guide rail 24 has a undulation in the Y-axis direction, the inclination angle of the guide rail 24 with respect to the horizontal axis J1 is ψ, and the movement distance of the head 17 in the X-axis direction is d. During mounting, the head 17 descends with an axis inclined by an angle θ with respect to the vertical line J1 as a lifting axis, so that the chip component 11 is positioned at a position P2 ′ shifted by ΔY = d · tan Ψ from the mounting position P2 to be originally mounted. Will be implemented.

  When the above alignment and offset setting are completed, the actuator is operated to lower the head 17 and press the chip component 11 against the mounting portion of the substrate W (step 335). At this time, since the pressure in the pressure chamber of the cylinder is kept constant by the control unit 29A, a predetermined pressure is applied to the chip component 11. Simultaneously with this pressing, the pressure sensitive adhesive on the back surface of the chip component 11 is heated by the heater built in the substrate holding stage 14 to promote the polymerization reaction. Then, when the polymerization reaction of the adhesive is completed, the head 17 returns to the upper standby position (step 340). When the polymerization reaction is completed, the chip component 11 is fixed to the substrate W.

  In this mounting apparatus, before the head 17 is lowered, the head 17 and the substrate holding stage 14 are driven relative to each other by using −ΔX and −ΔY as offset amounts. It can be lowered toward the mounting position P1 or P2.

  After this series of operations is performed for all the mounting positions of the chip component 11 on the substrate W (Yes in step 350), the suction plate 9 is actuated to move toward the substrate holding stage 14, and the chip component 11 is mounted. The held substrate W is sucked and held and transferred to the mounting table 6 of the substrate supply unit 2. When the substrate W is taken out from the substrate supply unit 2, a series of processes for mounting the chip component 11 on the substrate W is completed.

  According to this mounting apparatus, first, an error ΔX between the XY direction position of the head 17 when the head 17 is disposed at the upper position UXm and the XY direction position of the head 17 when the head 17 is disposed at the lower position DXm. ΔY is obtained for each of a plurality of mth measurement positions HXm in the guide rail 24 (110 to 165). In this example, the number of measurement points was 5 (m = 1 to 5). Subsequently, a first correlation function representing a correlation between the X-direction position of the guide rail 24 and the errors ΔX and ΔY is obtained. Subsequently, errors ΔX and ΔY corresponding to the position of the head 17 at the time of mounting on the guide rail 24 are obtained from the correlation function, and the relative positional relationship between the head 17 and the substrate holding stage 14 is offset by the obtained errors ΔX and ΔY. After that, the head 17 is lowered. The offset is applied by rotating (Ω) the movable table 15 in the horizontal (Y) direction, the movable table 25 in the horizontal (X) direction, and the head 17 around the Z axis. Further, this offset corrects a positional deviation in the horizontal axis direction caused by a deviation between the actual raising / lowering direction of the head 17 and the Z-axis direction, or the actual Y-direction position and the X-axis position (Y = The positional deviation in the Y-axis direction caused by the deviation from the zero position is corrected. Therefore, even when the guide rail 24 has undulations in the Z-axis direction and the Y-axis direction, the head 17 can accurately press the original mounting position, and mounting with excellent mounting accuracy is achieved.

  In addition, it can also be set as the structure which considered the thermal influence to the guide rail 24. FIG. For example, as shown in FIG. 4, a temperature sensor 252 is attached to the movable base 25, and its output terminal is electrically connected to the control unit 29B by a lead wire. On the other hand, the deformation amount of the guide rail 24 due to temperature is stored in advance in the control unit 20B. Then, the first correlation function described above is obtained in association with the deformation amount of the guide rail 24 due to the temperature, and when the offset is set, the temperature of the guide rail 24 is detected by the temperature sensor 252 and the first correlation function is obtained. An offset amount corresponding to the detected temperature is obtained by a function. This makes it possible to implement mounting with extremely high accuracy even when the temperature during mounting changes.

  Moreover, in order to further suppress the thermal influence on the guide rail 24, as illustrated in FIG. 6, air blow means 70 that blows air on the movable base 25 can be provided. Even when the air blowing by the air blowing means 70 causes a fluctuation phenomenon to occur in this portion due to, for example, heating by a heater provided on the head 17 side, the occurrence can be appropriately prevented. The undulation of the rail 24 can be prevented appropriately. Note that the same configuration means as in the guide rail 24 can be applied to the guide rail 61.

  As mentioned above, although embodiment of this invention was described, embodiment disclosed above is an illustration to the last, Comprising: The scope of the present invention is not limited to this embodiment. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims. For example, in the above-described embodiment, the waviness of the guide rail 24 is the pitch and the yaw. However, the guide rail 24 may be configured to be applicable to rolls, that is, waviness (twisting) around the X axis. it can.

It is a perspective view of the mounting apparatus which concerns on embodiment. It is the front view which showed schematic structure of the mounting unit. It is a top view which shows the structure of a link mechanism. It is a side surface which shows schematic structure of a recognition part. It is a top view which shows schematic structure of a projection part. It is a figure which shows the image projected on a CCD camera. It is a top view which shows the target mark provided in the adsorption | suction part. It is a flowchart which shows the outline of mounting operation | movement of a mounting apparatus. It is a flowchart which shows the operation | movement which calculates | requires a 1st correlation function. It is a figure for demonstrating the operation | movement which calculates | requires a 1st correlation function concretely. It is a flowchart which shows mounting operation. It is a front view for demonstrating the principle of the correction process about the wave | undulation of a Z-axis direction. It is a top view for demonstrating the principle of the correction process about the wave | undulation of a Y-axis direction.

Explanation of symbols

11 Chip parts 14 Substrate holding stage (work holding stage)
17 head 24 guide rail (horizontal drive member)
37 CCD camera (2-field camera)
110 to 170 Step 252 Temperature sensor 330 Step 335 Step DX Lower position ΔX error ΔY Error HX1 to HX5 Measurement position UX Upper position W Substrate (workpiece)

Claims (4)

The three axes of the Cartesian coordinate system are X, Y, and Z, the XY plane is the horizontal plane, the Z-axis direction is the vertical direction,
A workpiece holding stage (14) for placing and holding the workpiece (W) to be mounted on the chip component (11), and a Z-axis by sucking and holding the chip component (11) provided above the workpiece holding stage (14). Mounting using a mounting device comprising a head (17) that can be moved up and down in a direction, and a long horizontal driving member (24) that can drive and arrange the head (17) at a plurality of positions along the X-axis direction. A method,
XY direction position of the head (17) when the head (17) is disposed at the upper position (UX), and XY direction position of the head (17) when the head (17) is disposed at the lower position (DX) (ΔX, ΔY) for each of a plurality of measurement positions (HX1 to HX5) in the horizontal drive member (24) (110 to 165);
A step (170) of obtaining a correlation function representing a correlation between the X-direction position of the horizontal drive member (24) and the error (ΔX, ΔY);
Errors (ΔX, ΔY) corresponding to the position of the head (17) at the time of mounting on the horizontal drive member (24) are obtained from the above correlation function, and the head (17) and the work holding stage ( And a step (330, 335) of lowering the head (17) after offsetting the relative positional relationship with 14).   XY direction position of the head (17) when the head (17) is disposed at the upper position (UX), and XY direction position of the head (17) when the head (17) is disposed at the lower position (DX) Is a two-view camera (37) provided so as to be able to advance and retreat in the space between the head (17) and the work holding stage (14) and capable of simultaneously imaging the head (17) side and the work holding stage (14) side. The mounting method according to claim 1, wherein the target mark (R3) provided on the head (17) is obtained by reading the target mark.   The correlation function associates the deformation amount of the horizontal driving member (24) with the temperature, and the error (ΔX,) is determined by the temperature of the horizontal driving member (24) measured by the temperature sensor (252) and the correlation function. The mounting method according to claim 1, wherein ΔY) is determined.   The mounting method according to any one of claims 1 to 3, wherein air blow is performed toward the horizontal drive member (24) in accordance with the temperature of the horizontal drive member (24) measured by the temperature sensor (252).

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