CN112017992A - Joining device - Google Patents
Joining device Download PDFInfo
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- CN112017992A CN112017992A CN202010343680.2A CN202010343680A CN112017992A CN 112017992 A CN112017992 A CN 112017992A CN 202010343680 A CN202010343680 A CN 202010343680A CN 112017992 A CN112017992 A CN 112017992A
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- chip
- bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
Abstract
The invention aims to provide a jointing device (3) which can reduce the movement error and mechanical error caused by a moving unit as much as possible and can operate efficiently. A bonding device (3) according to the present invention is provided with: a substrate supply unit (6) for supplying the substrate (2) to the bonding stage (4); a chip supply unit (7) for supplying the chip (1) to the relay station (5); and a bonding head (8) for bonding the chip (1) to the substrate (2) on the bonding stage (4). A guide member (9) is provided in a horizontal 1 st direction (X direction), the substrate supply unit (6), the chip supply unit (7), and the bonding head (8) are arranged along the guide member (9), and the bonding stage and the relay stage are moved along the guide member by a bonding stage moving unit and a relay stage moving unit.
Description
Technical Field
The present invention relates to a bonding apparatus, and more particularly, to a bonding apparatus for bonding a chip to a substrate.
Background
Conventionally, as a bonding apparatus for bonding a chip to a substrate, there is known a bonding apparatus including: a bonding stage on which a substrate is placed; a relay station on which the chip is mounted; a substrate supply unit for supplying a substrate to the bonding stage; a chip supply unit for supplying chips to the relay station; and a bonding head for bonding the chip to the substrate.
In the above configuration, the substrate or the chip is transferred to the bonding head by moving the bonding stage and the relay stage by the moving means, respectively.
Here, in order to correctly join the substrate and the chip, it is necessary to correctly perform the movement of the substrate or the chip by the moving means, but in practice, adjustment is necessary due to a movement error or a mechanical error of the moving means.
Therefore, it is known that, for example, the relay station and the bonding station are integrally moved to reduce a movement error or a mechanical error (patent document 1).
Documents of the prior art
Patent document
Patent document 1 Japanese patent application laid-open No. 2010-238974
Disclosure of Invention
Problems to be solved by the invention
However, in the configuration of patent document 1, since the relay station and the bonding station are integrally formed, it is difficult to separately perform the operation on the bonding station and the operation on the relay station, and the layout of the chip supply unit or the substrate supply unit is also limited.
In view of the above, the present invention is directed to a joint apparatus capable of reducing a movement error or a mechanical error caused by a moving unit as much as possible and performing an efficient operation.
Means for solving the problems
That is, the joining device according to the invention of claim 1 is characterized by comprising: a bonding stage on which a substrate is placed; a bonding stage moving unit for moving the bonding stage; a relay station on which a chip is mounted; a relay station moving unit that moves the relay station; a substrate supply unit configured to supply the substrate to the bonding stage; a chip supply unit configured to supply the chip to the relay station; and a bonding head which takes out the chip from the relay stage and bonds the chip to the substrate on the bonding stage;
a guide member provided in a horizontal 1 st direction, and the substrate supply unit, the chip supply unit, and the bonding head are arranged along the guide member;
the bonding stage moving means and the relay stage moving means move the bonding stage and the relay stage along the guide member.
The invention of claim 2 is the bonding apparatus of claim 1, wherein the bonding head has a structure capable of performing the following bonding: a face-down bonding step of holding the chip with the main surface of the chip facing downward and bonding the main surface to the substrate; and a face-up bonding step of holding the chip with the main surface of the chip facing upward and bonding the chip to the substrate with the main surface facing upward,
along the above-mentioned guide member are provided: a substrate imaging unit configured to image a substrate placed on the bonding stage from above; and a chip top surface imaging unit for imaging the main surface of the chip loaded on the relay station from above when bonding the chip in a face-up manner,
there are also provided in a movable manner along the above-mentioned guide member: and a chip bottom surface imaging unit which images the main surface of the chip held by the bonding head from below when the chip is bonded in a face-down manner.
The invention according to claim 3 is characterized in that the bonding apparatus according to claim 2 includes a target mark for performing alignment work of the substrate imaging unit, the chip top surface imaging unit, and the chip bottom surface imaging unit, the target mark being provided so as to be movable along the guide member,
when the substrate imaging unit and the chip bottom surface imaging unit are aligned for the face-down bonding,
the target mark is positioned above the chip bottom surface shooting unit and below the substrate shooting unit, and the target mark is shot by the chip bottom surface shooting unit and the substrate shooting unit,
when the substrate shooting unit and the chip top shooting unit are calibrated for the upward bonding,
and the target mark is positioned below the chip top surface shooting unit and the substrate shooting unit, and the target mark is shot by the chip top surface shooting unit and the substrate shooting unit.
Effects of the invention
According to the invention of claim 1, the substrate supply unit, the chip supply unit, and the bonding head are provided along the guide member, and the bonding stage and the relay stage can move in the 1 st direction along the guide member.
That is, since the bonding stage and the relay stage move in the 1 st direction along the shared guide member, a mechanical error in the 1 st direction between the bonding stage and the relay stage is less likely to occur.
On the other hand, since the bonding station and the relay station can be moved by the bonding station moving means and the relay station moving means, respectively, the work for the bonding station and the relay station can be independently performed, and efficient bonding can be performed.
According to the invention of claim 2, the bonding can be performed both for the face-up bonding and the face-down bonding, and the invention of claim 3 enables the alignment operation of the imaging unit provided in the bonding apparatus capable of performing both for the face-up bonding and the face-down bonding.
Drawings
FIG. 1 is a structural view of a bonding apparatus of the present embodiment.
Fig. 2 is a plan view of the bonding stage and an explanatory view of the operation of the target mark.
Fig. 3 is an example of a captured image of the target symbol.
Fig. 4 is an explanatory diagram of an operation in the case of downward facing engagement.
Fig. 5 is an explanatory diagram of an operation in the case of downward facing engagement.
Fig. 6 is an explanatory diagram of an operation in the case of downward facing engagement.
Fig. 7 is an explanatory diagram of an operation in the case of downward facing engagement.
Fig. 8 is an explanatory view of the operation when the face-up bonding is performed.
Fig. 9 is an explanatory view of the operation when the face-up bonding is performed.
Fig. 10 is an explanatory diagram of an operation performed when the calibration operation is performed.
Fig. 11 is an explanatory diagram of an operation performed when the calibration operation is performed.
Description of the reference numerals
1, chip;
2 a substrate;
3a joining device;
4a bonding station;
5 relay station;
6 a substrate supply unit;
7 a chip supply unit;
8, a joint head;
9 a first guide member;
10a bonding stage moving unit;
11 relay station mobile unit;
41 a substrate photographing unit;
42 chip bottom shooting unit;
43 chip top surface shooting unit;
51 target mark.
Detailed Description
Hereinafter, description will be made with respect to the illustrated embodiment, fig. 1 shows a configuration diagram of a bonding apparatus 3 for bonding a chip 1 to a substrate 2, and electrodes, a light emitting portion of an LED, a circuit pattern, and the like are formed on either surface of the chip 1, and in the following description, such a surface on which the electrodes and the like are formed is referred to as a main surface of the chip 1.
In addition, the joining apparatus 3 of the present embodiment may perform: face-up bonding in which the chip 1 is bonded to the substrate 2 with its main surface facing upward; and face-down bonding, in which the chip 1 is bonded to the substrate 2 with its main surface facing downward.
The joining device 3 includes: a bonding stage 4 on which the substrate 2 is placed; a relay station 5 on which the chip 1 is mounted; a substrate supply unit 6 configured to supply the substrate 2 to the bonding stage 4; a chip supply unit 7 for supplying the chip 1 to the relay station 5; and a bonding head 8 for bonding the chip 1 to the substrate 2.
In the following description, the X direction as the 1 st direction of the present invention is shown as the left-right direction in fig. 1, the Y direction as the 2 nd direction is shown as the depth direction of the drawing sheet in fig. 1, and the up-down direction in the drawing is described as the Z direction.
In the bonding apparatus 3 of the present embodiment, the 1 st guide member 9 is provided in the X direction, and the substrate supply unit 6 is disposed at each end on the right side of the drawing of the 1 st guide member 9; a bonding head 8 is disposed at the center; at the left end, the chip supply unit 7 is disposed.
The bonding stage 4 and the relay stage 5 are movable along the 1 st guide member 9 by the bonding stage moving means 10 and the relay stage moving means 11, respectively.
The bonding apparatus 3 having such a configuration can be switched between the face-up bonding and the face-down bonding by setting in advance under the control of the control unit 12.
The bonding stage 4 has a structure in which the substrate 2 is sucked and held by a suction mechanism, not shown, when the substrate 2 is placed on the top surface thereof, and the substrate 2 can be heated by a heater, not shown, at the time of bonding.
Fig. 2 is a plan view of the joining table 4, and the joining table is provided so as to straddle the 1 st guide member 9 formed of a pair of rails provided in parallel in the X direction.
The bonding stage moving unit 10 includes an X slider 10a that moves in the X direction along the 1 st guide member 9, 1 pair of Y direction guide members 10b provided on the top surface of the X slider 10a in the Y direction, and a Y slider 10c that moves in the Y direction along the Y direction guide members 10b, and the bonding stage 4 is fixed to the upper portion of the Y slider 10 c.
The substrate 2 shown in fig. 2 has a structure in which one chip 1 is bonded, but a substrate 2 to which a plurality of chips 1 can be bonded may be used.
The relay stage 5 has a structure in which the chip 1 is sucked and held by a suction mechanism, not shown, when the chip 1 is mounted on the top surface thereof, similarly to the bonding stage 4, and holds the chip 1 in a state in which the main surface of the chip 1 faces upward when the bonding is performed with the face up, and holds the chip 1 in a state in which the main surface of the chip 1 faces downward when the bonding is performed with the face down.
The relay station moving means 11 also includes an X slider 11a that moves in the X direction along the 1 st guide member 9, a Y direction guide member 11b provided on the top surface of the X slider 11a in the Y direction, and a Y slider 11c that moves in the Y direction along the Y direction guide member 10b, and the relay station 5 is fixed to the upper portion of the Y slider 11 c.
The substrate supply unit 6 includes: a substrate storage magazine 21 for storing the substrate 2 before bonding the chips 1; a product storage warehouse 22 for storing the substrate 2 to which the chip 1 is bonded and which is produced; a substrate holding head 23 for holding the substrate 2; and a substrate holding head moving unit 24 for moving the substrate holding head 23.
The substrate holding head 23 has a structure for sucking and holding the top surface of the substrate 2, and the substrate holding head moving unit 24 includes a 2 nd guide member 24a provided above the 1 st guide member 9 in the X direction, and a mechanism for moving the substrate holding head 23 in the X direction along the 2 nd guide member 24a and raising and lowering the substrate holding head in the Z direction.
The substrate stocker 21 and the product stocker 22 are arranged below the 2 nd guide member 24a in the X direction, and the end portion on the left side in the drawing of the 2 nd guide member 24a is provided so as to overlap the end portion on the right side in the drawing of the 1 st guide member 9.
In addition, a substrate supply position a where the bonding stage 4 and the substrate holding head 23 stop and deliver the substrate 2 is set in a portion where the 2 nd guide member 24a overlaps the 1 st guide member 9.
Further, the substrate holding head 23 may be configured to be movable in the Y direction, and the substrate stocker 21 and the product stocker 22 may be arranged in the Y direction, and 2 substrate holding heads 23 may be provided, one of which is used to transfer the substrate 2 to and from the bonding stage 4, and the other of which is used to take out the substrate 2 from the bonding stage 4.
The chip supply unit 7 includes: a chip supply unit 31 for supplying the chip 1; a chip holding head 32 for holding the chip 1 of the chip supply unit 31; a chip holding head moving unit 33 for moving the chip holding head 32; and a chip flipping unit 34 for flipping the chip 1.
The chips 1 are supplied to the chip supply portion 31 in a state of being accommodated in a wafer ring (wafer ring) or a tray (tray), and the chips 1 are supplied with their main surfaces facing upward regardless of whether they are bonded face-up or face-down.
The chip holding head 32 is configured to suck and hold the top surface of the chip 1 supplied to the chip supply portion 31, and the chip holding head moving unit 33 includes a 3 rd guide member 33a provided above the 1 st guide member 9 in the X direction, and is configured to move the chip holding head 32 in the X direction along the 3 rd guide member 33a and to move up and down in the Z direction.
The chip supply portion 31 and the chip inverting unit 34 are provided below the 3 rd guide member 33a, and the end portion on the right side in the drawing of the 3 rd guide member 33a is provided so as to overlap the end portion on the left side in the drawing of the 1 st guide member 9.
The chip flipping unit 34 is configured to: when the face-down bonding is performed, the bottom surface of the chip 1 sucked and held by the chip holding head 32 is sucked and held, and further lifted and lowered along the 4 th guide member 34a provided in the Z direction, and rotated by 180 ° by a rotation mechanism not shown.
In addition, in the portion where the 3 rd guide member 33a overlaps the 1 st guide member 9, there are set: a 1 st chip supply position B1 where the chip inverting unit 34 is provided, and a 2 nd chip supply position B2 where the relay stage 5 and the chip holding head 32 stop and deliver the chip 1.
Further, as the chip reversing unit 34, it is also possible to arrange the suction portions for sucking the chips 1 at opposite positions, and when the rotation mechanism is operated in a state where one suction portion sucks and holds the chip 1, the suction portion for sucking the chip 1 is directed downward and the other suction portion is directed upward, so that a new chip 1 can be sucked.
The bonding head 8 is provided along the 1 st guide member 9, and has a mechanism for heating the held chip 1 by sucking and holding the top surface of the chip 1.
The bonding head 8 is provided with a mechanism that moves up and down in the Z direction and rotates the held chip 1 in the horizontal plane (around the Z axis). In other words, the bonding head is not provided with a mechanism for moving in the horizontal direction.
A dispenser (not shown) for supplying a bonding auxiliary agent (an adhesive such as a thermosetting resin, an antioxidant such as flux) to the bottom surface of the chip 1 or the top surface of the substrate 2 is provided at a position adjacent to the bonding head 8.
Further, a bonding position C at which the bonding stage 4 and the relay stage 5 are stopped is set at a position where the bonding head 8 is provided, and the bonding head 8 takes out the chip 1 from the relay stage 5 stopped at the bonding position C and bonds the chip 1 to the substrate 2 of the bonding stage 4 stopped at the bonding position C.
At this time, in order to correctly bond the chip 1 to the substrate 2, it is necessary to correct the positional deviation and the inclination deviation between the chip 1 held by the bonding head 8 and the substrate 2 placed on the bonding stage 4.
Therefore, at the bonding position C, the bonding stage moving unit 10 moves the substrate 2 by moving the bonding stage 4 in the X direction and the Y direction, thereby correcting the positions of the chip 1 and the substrate 2. On the other hand, the bonding head 8 corrects the positions of the chip 1 and the substrate 2 by rotating the chip 1 in a horizontal plane.
The technique of bonding the substrate 2 and the chip 1 by the bonding head 8 is known per se, and therefore, a detailed description thereof is omitted.
Next, as described above, when the chip 1 is bonded to the substrate 2 by the bonding head 8, the positional deviation and the inclination deviation between the chip 1 and the substrate 2 are corrected, and therefore, it is necessary to recognize the position and the inclination of the chip 1 and the position and the inclination of the substrate 2 in advance.
Thus, the joining device 3 of the present embodiment includes: a substrate imaging unit 41 for imaging the substrate 2 on the bonding stage 4; a chip bottom surface imaging unit 42 that images the bottom surface of the chip 1 held by the bonding head 8 when the face-down bonding is performed; and a chip top surface imaging unit 43 for imaging the top surface of the chip 1 mounted on the relay station 5 when the bonding is performed in the face-up bonding.
The control unit 12 is provided with an image recognition unit for recognizing the images captured by the imaging units 41 to 43 and recognizing the position and inclination of the chip 1 or the substrate 2.
A specific image recognition method is conventionally known, and therefore, a detailed description thereof is omitted, and an alignment mark is provided in advance on the main surface of the chip 1 or the top surface of the substrate 2, and the image processing unit can recognize the center of the chip 1 or the center of the mounting position on the substrate 2, or the inclination thereof, based on the alignment mark. In addition, the position and the inclination of the chip 1 may be recognized by recognizing a component or a wiring pattern formed on the chip 1 in a predetermined shape, for example, without necessarily providing an alignment mark for recognizing the position and the inclination of the chip 1.
The substrate imaging unit 41 is positioned between the bonding head 8 and the substrate supply unit 6, and the bonding stage 4 is stopped at a substrate imaging position D set below the substrate imaging unit 41, and the substrate 2 placed on the bonding stage 4 can be imaged from above.
The chip top surface imaging unit 43 is positioned between the bonding head 8 and the chip supply unit 7, and the relay stage 5 stops at the chip top surface imaging position E set below the chip top surface imaging unit 43, and can image the chip 1 placed on the relay stage 5 with its main surface facing upward from above.
On the other hand, as shown in fig. 2, the chip bottom surface imaging unit 42 is provided in the bonding stage moving unit 10 that moves the bonding stage 4, and the bonding stage 4 and the chip bottom surface imaging unit 42 are configured to move integrally.
The chip bottom surface imaging unit 42 is moved in the X direction by the X slider 10a of the bonding stage moving unit 10 and moved in the Y direction by the Y slider 10C, and stops at the bonding position C set below the bonding head 8, thereby being capable of imaging the chip 1 whose main surface is attracted downward by the bonding head 8 from below.
Further, when the chip bottom surface imaging unit 42 is provided so as to be aligned in the X direction with respect to the bonding stage 4, it is unnecessary to move the Y slider 10c in the Y direction when imaging the chip 1 sucked by the bonding head 8.
In this way, in the bonding apparatus 3 of the present embodiment, the positional deviation and the inclination deviation of the chip 1 and the substrate 2 are recognized by using the imaging units 41 to 43.
However, mechanical errors and displacement of the entire apparatus occur due to changes over time caused by the use of the joining apparatus 3, and particularly in the imaging units 41 to 43, there is a case where the imaging position is displaced due to displacement, deformation, or the like of the mounting position.
Such positional displacement of the imaging units 41 to 43 affects the recognition result obtained by the image recognition unit, and therefore, correct bonding cannot be performed, and therefore, a calibration operation for correcting the displacement of the imaging units 41 to 43 is necessary.
In this embodiment, the following calibration operation can be performed: a calibration operation of the substrate imaging unit 41 and the chip bottom surface imaging unit 42 used in the face-down bonding; and a calibration operation of the substrate imaging unit 41 and the chip top surface imaging unit 43 used in the face-up bonding.
In order to perform the above-described alignment work, the bonding apparatus of the present embodiment uses the target mark 51 provided adjacent to the bonding stage 4 as shown in fig. 2.
The target mark 51 is a plate-like member in which cross-shaped marks are formed on a main body made of a transparent material so as to be photographed from the front and back surfaces, respectively, and is movable integrally with the bonding stage 4 and the chip bottom surface photographing unit 42 by the bonding stage moving unit 10.
The target mark 51 is provided to be movable forward and backward by a moving mechanism 52 of a Y slider 10c provided in the bonding stage moving unit 10, and is movable to a retreated position (a) retreated outside the imaging range of the chip bottom surface imaging unit 42 and a projected position (b) projected into the imaging range.
In this way, the target mark 51 is located at the retracted position when the bonding is performed, and is located at the protruding position when the alignment operation is performed.
With this configuration, by positioning the target mark 51 at the projected position, the target mark 51 can be imaged by the chip bottom surface imaging unit 42, and by stopping the target mark 51 at the substrate imaging position D and the chip top surface imaging position E by the bonding stage moving unit 10, the target mark 51 can be imaged by the substrate imaging unit 41 and the chip top surface imaging unit 43.
Fig. 3 is a schematic diagram showing the result of imaging the target mark 51 by the substrate imaging unit 41, the chip bottom surface imaging unit 42, and the chip top surface imaging unit 43.
Specifically, the image recognition unit recognizes the position and inclination of the target mark 51 with respect to the imaging center 41c of the substrate imaging unit 41, and recognizes this as the shift amount 41g of the substrate imaging unit 41.
Similarly, the image recognition unit may recognize the shift amount 42g of the imaging center 42c with respect to the chip bottom surface imaging unit 42, or may recognize the shift amount 43g of the imaging center 43c with respect to the chip top surface imaging unit 43.
When the offset amounts 41g to 43g of the respective imaging units 41 to 43 are recognized in this manner, the calibration operation can be performed as follows.
First, the sequence of the 1 st calibration operation will be described. Initially, the calibration amounts of the substrate imaging unit 41 and the chip bottom surface imaging unit 42 used for the face-down bonding can be calculated by adding the identified offset amount 41g of the substrate imaging unit 41 and the offset amount 42g of the chip bottom surface imaging unit 42.
Next, the calibration amounts of the substrate capture unit 41 and the chip top surface capture unit 43 used for the face-up bonding can be calculated by adding the identified offset amount 41g of the substrate capture unit 41 and the offset amount 43g of the chip top surface capture unit 43.
In contrast, the following method is considered in the sequence of the 2 nd calibration operation.
First, the calibration amounts of the substrate imaging unit 41 and the chip bottom surface imaging unit 42 used for the face-down bonding are added to the offset amount 41g of the substrate imaging unit 41 and the offset amount 42g of the chip bottom surface imaging unit 42 in the same manner as in the method 1.
Next, in order to perform the calibration operation of the substrate imaging unit 41 and the chip top surface imaging unit 43 used for the face-up bonding, first, the offset amount 43g of the chip top surface imaging unit 43 and the offset amount 42g of the chip bottom surface imaging unit 42 are added.
Then, the difference between the added offset amount 43g and offset amount 42g and the previously calculated calibration amount for face-up bonding, which is the offset amount 41g and offset amount 42g, is obtained.
The operation of the joining device 3 having the above-described configuration will be described below with reference to fig. 4 to 8. Fig. 4 to 7 show the operation of joining the surfaces downward; fig. 8 and 9 show the operation of the upward bonding.
Fig. 4 shows the operation of supplying the substrate 2 to the bonding stage 4 and supplying the chip 1 having a downward main surface to the relay stage 5.
First, the bonding stage 4 is moved in the X direction along the 1 st guide member 9 by the bonding stage moving unit 10, and is stopped at the substrate supply position a.
Thereafter, in the substrate supply unit 6, the substrate holding head 23 moves up and down at the position of the substrate stocker 21 to hold the substrates in the stocker 21, and then moves down at the substrate supply position a to place the substrate 2 on the bonding stage 4.
On the other hand, the relay station 5 is moved in the X direction along the 1 st guide member 9 by the relay station moving unit 11, and is stopped at the 1 st chip supply position B1.
Thereafter, in the chip supply unit 7, the chip holding head 32 moves up and down at the position of the chip supply portion 31 to hold the chip 1 with its main surface facing upward, then moves upward of the chip reversing unit 34 provided at the 1 st chip supply position B1, and then moves down to transfer the chip 1 to the suction portion of the chip reversing unit 34.
Next, the chip reversing unit 34 rotates the suction portion by 180 ° by the rotation mechanism so that the main surface of the chip 1 faces downward, and in this state, the suction portion is lowered, and the chip 1 is placed on the relay stage 5.
Next, fig. 5 shows an operation of recognizing the position of the substrate 2 on the bonding stage 4 and delivering the chip 1 of the relay stage 5 to the bonding head 8.
First, the bonding stage 4 is moved in the X direction along the 1 st guide member 9 by the bonding stage moving unit 10, and is stopped at the substrate imaging position D.
Thereafter, the substrate photographing unit 41 photographs the substrate 2 on the bonding stage 4, and the image recognizing unit recognizes the position and inclination of the substrate 2 in the bonding stage 4.
On the other hand, the relay station 5 is moved in the X direction along the 1 st guide member 9 by the relay station moving unit 11, and is stopped at the above-described engagement position C.
After that, the bonding head 8 is raised and lowered in the Z direction to suction-hold the chip 1 on the relay stage 5.
Next, fig. 6 shows an operation of recognizing the position of the chip 1 held by the bonding head 8 and moving the relay station 5 to the chip supply unit 7.
First, the chip bottom surface imaging unit 42 provided integrally with the bonding stage 4 is moved in the X direction along the 1 st guide member 9 by the bonding stage moving unit 10 and stopped at the bonding position C.
Then, the chip bottom surface imaging unit 42 images the chip 1 attached to the bonding head 8 from below, and the image recognition unit recognizes the position and the inclination of the chip 1 attached to the bonding head 8.
On the other hand, the relay station 5 is moved in the X direction along the 1 st guide member 9 by the relay station moving unit 11, and stops at the 1 st chip supply position B1.
In the chip supply unit 7, the chip holding head 32 sucks and holds the chip 1 having the upward main surface in the chip supply portion 31, and moves the chip 1 to a position above the chip reversing unit 34 located at the 1 st chip supply position B1.
Fig. 7 shows an operation in which the bonding head 8 bonds the chip 1 to the substrate 2 and the chip supply unit 7 supplies the chip 1 to the relay stage 5.
First, the bonding stage 4 is moved in the X direction along the 1 st guide member 9 by the bonding stage moving unit 10, and is stopped at the bonding position C.
On the other hand, the image recognition unit calculates the amount of positional deviation and the amount of inclination deviation between the substrate 2 placed on the bonding stage 4 and the chip 1 held by the bonding head 8, based on the position and the inclination of the substrate 2 imaged by the substrate imaging unit 41 and the position and the inclination of the chip 1 imaged by the chip bottom surface imaging unit 42.
Thereafter, the control unit 12 controls the bonding stage moving unit 10 to move the bonding stage 4 in the X direction and the Y direction so as to cancel the positional deviation between the substrate 2 and the chip 1. At this time, when the above calibration work is performed, the calibration amount is also added and moved.
Further, the control unit 12 controls the rotation mechanism of the bonding head 8 to rotate the bonding head 8 in a horizontal plane so as to cancel the inclination deviation between the substrate 2 and the chip 1. In this case, when the calibration operation is performed, the calibration amount may be added and rotated.
In this state, the bonding head 8 is lowered in the Z direction, and when the chip 1 with its principal surface facing downward abuts on the top surface of the substrate 2, the heated chip 1 is bonded to the substrate 2 by the bonding head 8 and the bonding stage 4.
On the other hand, in the chip supply unit 7, the chip holding head 32 is lowered to transfer the chip 1 to the suction portion facing upward in the chip reversing unit 34.
Thereafter, when the bonding head 8 having completed bonding is retreated above the bonding stage 4, the bonding stage 4 is moved to the substrate supply position a by the bonding stage moving unit 10.
Thereafter, the substrate holding head 23 of the substrate supply unit 6 holds the substrate 2 to which the chip 1 is bonded from the bonding stage 4, and then stores the substrate 2 in the product stocker 22.
Thereafter, the substrate supply unit 6 takes out a new substrate 2 from the substrate stocker 21 by the substrate holding head 23, and supplies the new substrate 2 onto the bonding stage 4.
Next, an operation when performing the face-up bonding will be described with reference to fig. 8 and 9. Note that the operations common to the face-down bonding are not described.
Fig. 8 shows a procedure corresponding to the procedure described in fig. 4, in which the substrate 2 is supplied to the bonding stage 4 and the chip 1 is supplied to the relay stage 5.
In the operation of supplying the substrate 2 to the bonding stage 4, the substrate 2 is placed on the bonding stage 4 by the substrate supply unit 6 in the same manner as in the case of performing the face-down bonding.
On the other hand, in the operation of supplying the chip 1 to the relay station 5, the relay station moving means 11 stops the relay station 5 at the 2 nd chip supply position B2.
Next, in the chip supply unit 7, the chip holding head 32 directly places the chip 1 taken out from the chip supply section 31 on the relay stage 5, thereby placing the chip 1 on the relay stage 5 with the main surface facing upward.
Fig. 9 shows a work corresponding to the work described in fig. 5, in which the position of the substrate 2 on the bonding stage 4 is recognized and the position of the chip 1 on the relay stage 5 is recognized.
In the operation of recognizing the position of the substrate 2 on the bonding stage 4, the bonding stage 4 is moved to the substrate imaging position D, and the substrate 2 on the bonding stage 4 is imaged by the substrate imaging unit 41, in the same manner as in the case of performing the face-down bonding.
On the other hand, in the work of identifying the position of the chip 1 on the relay station 5, first, the relay station moving means 11 moves the relay station 5 to the chip top surface imaging position E.
After that, the above-described chip top surface photographing unit 43 photographs the chip 1 on the relay stage 5.
The subsequent operations are performed in the same manner as the face-down bonding except for the imaging by the chip bottom surface imaging unit 42, such as the operation of positioning the relay stage 5 at the bonding position C and sucking the chip 1 by the bonding head 8 as shown in fig. 5, and the operation of bonding the chip 1 to the substrate 2 while correcting the positional shift and the inclination shift between the substrate 2 and the chip 1 as shown in fig. 7.
Thereby, the chip 1 having the main surface facing upward is bonded to the substrate 2.
As described above, according to the bonding apparatus 3 of the present embodiment, the bonding stage 4 on which the substrate 2 is placed and the relay stage 5 on which the chip 1 is placed can be moved in the X direction along the 1 st guide member 9.
In addition, a substrate supply unit 6 for supplying the substrate 2, a chip supply unit 7 for supplying the chip 1, and a bonding head 8 are provided so as to be aligned in the X direction along the 1 st guide member 9.
That is, since the bonding stage 4 and the relay stage 5 are relatively moved in the X direction along one 1 st guide member 9, the movement in the Y direction is relatively reduced, and the mechanical error in the Y direction is less likely to occur compared to the case where the bonding stage 4 and the relay stage 5 are moved along different guide members.
As described above, the engaging device 3 of the present embodiment can have a structure capable of reducing the movement error or mechanical error caused by the moving unit as much as possible.
In the present embodiment, the bonding stage 4 and the relay stage 5 are movable by the bonding stage moving means 10 and the relay stage moving means 11, respectively, and the bonding stage 4 and the relay stage 5 can be operated during the bonding operation.
In contrast, when the bonding stage and the relay stage are integrated as in patent document 1, if the substrate supply unit 6 and the chip supply unit 7 are separated as in the present embodiment, the integrated bonding stage and the relay stage need to be frequently moved, which makes the bonding operation inefficient.
As described above, the bonding apparatus 3 of the present embodiment can be configured to operate efficiently, and particularly, the bonding apparatus 3 of the present embodiment can be configured to perform downward bonding and upward bonding in a dual-purpose manner, and thus can be configured to be more efficient.
Next, the operations of the substrate imaging unit 41, the chip bottom surface imaging unit 42, and the chip top surface imaging unit 43 during the calibration operation will be described with reference to fig. 10 and 11.
Fig. 10 is a diagram illustrating the calibration operation of the substrate imaging unit 41 and the chip bottom surface imaging unit 42 for face-down bonding.
Here, in order to perform the alignment operation, as shown in fig. 2, the target mark 51 is moved from the retracted state to the projected state, and the target mark 51 is positioned above the chip bottom surface imaging unit 42.
In this state, the bonding stage moving means 10 moves the target mark 51 to the substrate imaging position D together with the bonding stage 4 and the chip bottom surface imaging means 42.
Then, the substrate imaging unit 41 images the target mark 51 from above, and the chip bottom surface imaging unit 42 images the target mark 51 from below.
The image recognition unit calculates and stores the amount of positional shift or the amount of inclination shift between the substrate imaging unit 41 and the chip bottom surface imaging unit 42 based on the image of the target mark 51 imaged by the substrate imaging unit 41 and the image of the target mark 51 imaged by the chip bottom surface imaging unit 42 as described above.
In addition, the chip bottom surface imaging unit 42 does not necessarily have to perform imaging of the target mark 51 at the substrate imaging position D, and imaging at an arbitrary position may be performed.
Next, fig. 11 is a diagram showing the alignment operation of the substrate imaging unit 41 and the chip top surface imaging unit 43 for the above-described face-up bonding.
First, as shown in fig. 10, the bonding stage moving means 10 moves the target mark 51 to the substrate imaging position D together with the bonding stage 4, and the substrate imaging means 41 images the target mark 51 from above.
Thereafter, as shown in fig. 11, the bonding stage moving means 10 moves the target mark 51 to the chip top surface imaging position E, and the chip top surface imaging means 43 images the target mark 51 from above.
The image recognition unit calculates and stores the positional shift amount or the inclination shift amount between the substrate imaging unit 41 and the chip top surface imaging unit 43 based on the image of the target mark 51 imaged by the substrate imaging unit 41 and the image of the target mark 51 imaged by the chip top surface imaging unit 43 as described above.
Thus, according to the present embodiment, in the bonding apparatus 3 which can bond both downward and upward, the calibration operation of the imaging units 41 to 43 can be performed.
In this case, since the bonding stage 4 moves in the X direction along the 1 st guide member 9, the mechanical error in the Y direction can be suppressed as much as possible.
In the above embodiment, the chip bottom surface imaging unit 42 and the target mark 51 are configured to move integrally with the bonding stage 4, but may be configured to move integrally with the relay stage 5 by the relay stage moving unit 11. Further, the chip bottom surface imaging unit 42 and the target mark 51 may be configured to be movable along the 1 st guide member 9.
In fig. 1, the substrate supply unit 6 and the chip supply unit 7 in the above embodiment supply the substrate 2 and the chip 1 by moving the substrate holding head 23 and the chip holding head 32 in the X direction, similarly to the 1 st guide member 9, but these holding heads 23 and 32 may be moved in the Y direction, and the layout may be variously changed.
Claims (4)
1. An engagement device, comprising:
a bonding stage on which a substrate is placed;
a bonding stage moving unit for moving the bonding stage;
a relay station on which a chip is mounted;
a relay station moving unit that moves the relay station;
a substrate supply unit configured to supply the substrate to the bonding stage;
a chip supply unit configured to supply the chip to the relay station; and
a bonding head which takes out the chip from the relay stage and bonds the chip to the substrate on the bonding stage;
the bonding apparatus is provided with a guide member disposed toward a horizontal 1 st direction, and the substrate supply unit, the chip supply unit, and the bonding head are arranged along the guide member;
the bonding stage moving means and the relay stage moving means move the bonding stage and the relay stage along the guide member.
2. The joining device of claim 1,
the bonding head has a structure capable of performing the following bonding: a face-down bonding step of holding the chip with the main surface of the chip facing downward and bonding the main surface to the substrate; and face-up bonding, holding the chip with the main surface of the chip facing upward, and bonding the chip to the substrate with the main surface facing upward,
along the guide member are provided: a substrate imaging unit that images a substrate placed on the bonding stage from above; and a chip top surface imaging unit for imaging the main surface of the chip loaded on the relay station from above when bonding the chip in a face-up manner,
there is also movably disposed along the guide member: and a chip bottom surface imaging unit which images the main surface of the chip held by the bonding head from below when the bonding head is bonded to the substrate.
3. The joining device of claim 2,
the substrate imaging device further comprises a target mark for performing calibration work of the substrate imaging unit, the chip top surface imaging unit and the chip bottom surface imaging unit, wherein the target mark is movably arranged along the guide member;
when the alignment operation of the substrate imaging unit and the chip bottom surface imaging unit is performed for the face-down bonding,
enabling the target mark to be located above the chip bottom shooting unit and below the substrate shooting unit, and shooting the target mark through the chip bottom shooting unit and the substrate shooting unit;
when the alignment operation of the substrate photographing unit and the chip top surface photographing unit is performed for the face-up bonding,
and enabling the target mark to be positioned below the chip top surface shooting unit and the substrate shooting unit, and shooting the target mark through the chip top surface shooting unit and the substrate shooting unit.
4. The joining device of claim 3,
the chip bottom surface imaging unit and the target mark are provided so as to be movable integrally with the bonding stage by the bonding stage moving unit,
the target mark further includes a moving mechanism that moves the target mark to a projecting position projecting into a shooting range performed by the chip bottom surface shooting unit and to a retracted position retracted from the shooting range.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2019-099794 | 2019-05-28 | ||
| JP2019099794A JP7307323B2 (en) | 2019-05-28 | 2019-05-28 | bonding equipment |
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| CN112017992A true CN112017992A (en) | 2020-12-01 |
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| JP (1) | JP7307323B2 (en) |
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| TW (1) | TWI811539B (en) |
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| JP7450429B2 (en) | 2020-03-26 | 2024-03-15 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment |
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| JP2906094B2 (en) * | 1991-08-01 | 1999-06-14 | 東京エレクトロン株式会社 | Probe device |
| JPH07142537A (en) * | 1993-09-20 | 1995-06-02 | Ibiden Co Ltd | Method for aligning outer lead and method and device for bonding outer lead |
| JP4838095B2 (en) | 2006-10-27 | 2011-12-14 | 東レエンジニアリング株式会社 | Semiconductor chip mounting apparatus and mounting method |
| JP5024209B2 (en) | 2008-07-17 | 2012-09-12 | パナソニック株式会社 | Mounting head and component mounting machine |
| JP5344145B2 (en) | 2008-12-25 | 2013-11-20 | 澁谷工業株式会社 | Method for aligning electronic component and substrate in bonding apparatus |
| US20100162955A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Systems and methods for substrate processing |
| JP2010238974A (en) | 2009-03-31 | 2010-10-21 | Shibaura Mechatronics Corp | Mounting apparatus and mounting method for electronic component |
| JP2015111613A (en) | 2013-12-06 | 2015-06-18 | 株式会社リコー | Article transfer device, electronic component mounting device, article transfer method, electronic component mounting method, and electronic component mounting body |
| TWI671827B (en) * | 2017-03-30 | 2019-09-11 | 日商新川股份有限公司 | Bonding device and joining method |
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| JP7307323B2 (en) | 2023-07-12 |
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