JP5024209B2 - Mounting head and component mounting machine - Google Patents

Mounting head and component mounting machine Download PDF

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JP5024209B2
JP5024209B2 JP2008185543A JP2008185543A JP5024209B2 JP 5024209 B2 JP5024209 B2 JP 5024209B2 JP 2008185543 A JP2008185543 A JP 2008185543A JP 2008185543 A JP2008185543 A JP 2008185543A JP 5024209 B2 JP5024209 B2 JP 5024209B2
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component
substrate
rod
elevating
positioning
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JP2010027751A (en
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康浩 成清
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は、基板に対して相対移動されるベース部材に設けられ、下端に部品保持部を有したロッド状部材によって部品を基板に搭載させる搭載ヘッド及び部品実装機に関するものである。   The present invention relates to a mounting head and a component mounter that are provided on a base member that is relatively moved with respect to a substrate and mounts components on the substrate by a rod-shaped member having a component holding portion at the lower end.

部品実装機に備えられて基板に部品を搭載する搭載ヘッドは、基板に対して相対移動されるベース部材に設けられており、ベース部材に対して昇降される昇降部材と、昇降部材に対して上下移動自在に設けられて下端に部品保持部を有するロッド状部材を備えている。ロッド状部材は昇降部材に固定されたエアシリンダ等の付勢手段によって下方に付勢されており、昇降部材に固定して設けられた位置決め部材に上方から当接されて昇降部材に対する位置決めがなされている。   A mounting head that is provided in a component mounting machine and mounts components on a board is provided on a base member that is moved relative to the board. It is provided with a rod-like member which is provided so as to be movable up and down and has a component holding portion at the lower end. The rod-like member is urged downward by an urging means such as an air cylinder fixed to the elevating member, and is abutted from above with a positioning member fixed to the elevating member to be positioned with respect to the elevating member. ing.

この搭載ヘッドにより部品を基板に搭載するには、ロッド状部材を昇降部材に位置決めした状態で部品保持部に部品を保持させ、搭載ヘッドを基板の上方に移動させた後、部品を基板上の目標搭載位置の上方に位置合わせをして昇降部材をベース部材に対して下降させる。これによりロッド状部材が昇降部材と一体となって下降すると、部品は基板に接触し、ロッド状部材は部品を介して基板から反力を受けて位置決め部材から離間し、付勢手段の付勢力相当の押し付け力で部品を基板に押し付ける。基板上の目標搭載位置には予め半田が塗布されており、部品が基板上に押し付けられた後、部品保持部に内蔵されたヒータ等によって部品を加熱すると、基板上の半田が部品を介して加熱され、半田が溶融されて部品が基板上に接合(搭載)される(特許文献1)。
特開平11−220249号公報
In order to mount the component on the substrate by the mounting head, the component is held by the component holding portion with the rod-shaped member positioned on the lifting member, the mounting head is moved above the substrate, and then the component is mounted on the substrate. Positioning is performed above the target mounting position, and the elevating member is lowered with respect to the base member. As a result, when the rod-shaped member is lowered integrally with the elevating member, the component comes into contact with the substrate, the rod-shaped member receives a reaction force from the substrate via the component and is separated from the positioning member, and the urging force of the urging means The component is pressed against the board with a considerable pressing force. Solder is pre-applied to the target mounting position on the board, and after the component is pressed onto the board, the component is heated by a heater or the like built in the component holding unit, and the solder on the substrate passes through the component. It is heated, the solder is melted, and the component is joined (mounted) on the substrate (Patent Document 1).
JP-A-11-220249

ところで、ロッド状部材と位置決め部材は通常、双方が鉄等の磁性材料から成っており、加工時やハンドリング時等に強磁性材料からなる工具が使用された場合や、磁性を有する機器(例えばモータ等)が周辺にある場合には、その影響で上記部材が帯磁することがある。ロッド状部材と位置決め部材の少なくとも一方が帯磁すると、両部材の間には磁力による引き合い力が発生するが、この磁力による引き合い力は、部品が基板に接触してロッド状部材が昇降部材に対して押し上げられ、位置決め部材から離間したときには、ロッド状部材を部品に押し付ける方向に作用する。このため、ロッド状部材と位置決め部材を離間させるには大きな力が必要になり、その力が押し付け力として部品に加わることになることから、所望する適切な押し付け力で部品の搭載を行うことが困難になるという問題点があった。   By the way, both the rod-shaped member and the positioning member are usually made of a magnetic material such as iron. When a tool made of a ferromagnetic material is used at the time of processing or handling, a magnetic device (for example, a motor) Etc.) may be magnetized due to the influence. When at least one of the rod-shaped member and the positioning member is magnetized, an attracting force due to magnetic force is generated between the two members. This attracting force due to the magnetic force causes the component to contact the substrate and the rod-shaped member against the lifting member. When it is pushed up and separated from the positioning member, it acts in the direction of pressing the rod-shaped member against the component. For this reason, a large force is required to separate the rod-shaped member and the positioning member, and the force is applied to the component as a pressing force. Therefore, it is possible to mount the component with a desired appropriate pressing force. There was a problem that it became difficult.

そこで本発明は、常に適切な押し付け力で部品の搭載を行うことができる搭載ヘッド及び部品実装機を提供することを目的とする。   Therefore, an object of the present invention is to provide a mounting head and a component mounting machine that can always mount components with an appropriate pressing force.

請求項1に記載の搭載ヘッドは、基板に対して相対移動されるベース部材に対して昇降自在に設けられた昇降部材と、昇降部材に対して上下移動自在に設けられ、下端に部品保持部を備えたロッド状部材と、昇降部材に固定して設けられた位置決め部材と、昇降部材に固定して設けられ、ロッド状部材を下方に付勢して位置決め部材に当接させ、昇降部材に対するロッド状部材の位置決めを行う付勢手段と、ロッド状部材が位置決め部材に当接された状態で昇降部材をベース部材に対して昇降させる昇降部材昇降手段とを備え、昇降
部材昇降手段によって昇降部材をベース部材に対して下降させ、部品が基板に接触したとき、部品を介して基板から反力を受けたロッド状部材が位置決め部材から離間し、付勢手段の付勢力相当の押し付け力で部品を基板に押し付けて部品搭載を行う搭載ヘッドであって、ロッド状部材及び位置決め部材の少なくとも一方が非磁性材料から成る。
The mounting head according to claim 1 is provided with an elevating member provided so as to be movable up and down with respect to a base member relatively moved with respect to the substrate, and provided with a vertical movement with respect to the elevating member. A rod-shaped member including: a positioning member fixed to the lifting member; a fixing member fixed to the lifting member; urging the rod-shaped member downward to contact the positioning member; A biasing means for positioning the rod-shaped member; and a lifting member lifting / lowering means for lifting the lifting / lowering member with respect to the base member in a state where the rod-shaped member is in contact with the positioning member. Is lowered with respect to the base member, and when the component comes into contact with the substrate, the rod-shaped member that receives the reaction force from the substrate through the component is separated from the positioning member, and the pressing force corresponding to the urging force of the urging means is used. A mounting head for component mounting against the goods to the substrate, at least one rod-shaped member and the positioning member is made of a nonmagnetic material.

請求項2に記載の部品実装機は、基板の位置決めを行う基板位置決め部と、基板位置決め部に位置決めされた基板に対して相対移動されるベース部材と、ベース部材に取り付けられた請求項1に記載の搭載ヘッドとを備え、供給された部品を搭載ヘッドが備えるロッド状部材に保持させてその部品を基板位置決め部に位置決めされた基板に搭載させるようになっている。   According to a second aspect of the present invention, there is provided the component mounting machine according to the first aspect, wherein the substrate positioning unit that positions the substrate, the base member that is moved relative to the substrate positioned by the substrate positioning unit, and the base member are attached to the base member. The mounting component described above is provided, and the supplied component is held by a rod-shaped member included in the mounting head, and the component is mounted on the substrate positioned in the substrate positioning portion.

本発明では、ロッド状部材及び位置決め部材の少なくとも一方が非磁性材料から成っているので、これらの部材の加工時やハンドリング時等に強磁性材料から成る工具が使用された場合や、磁性を有する機器が周辺にある場合であっても、ロッド状部材と位置決め部材の間に磁力による引き合い力は生じない。このため、昇降部材がベース部材に対して下降されて部品が基板に接触し、ロッド状部材が位置決め部材から離間した後の部品の押し付け力は、付勢手段の付勢力相当の力のみとなる。このため、部品搭載時に付勢手段の付勢力を超える過剰な押し付け力が部品に作用することはなく、常に適切な押し付け力で部品の搭載を行うことができる。   In the present invention, at least one of the rod-shaped member and the positioning member is made of a non-magnetic material. Therefore, when a tool made of a ferromagnetic material is used at the time of processing or handling of these members, it has magnetism. Even when the device is in the vicinity, there is no attractive force due to the magnetic force between the rod-shaped member and the positioning member. For this reason, the pressing force of the component after the elevating member is lowered with respect to the base member, the component contacts the substrate, and the rod-shaped member is separated from the positioning member is only a force corresponding to the urging force of the urging means. . For this reason, an excessive pressing force exceeding the urging force of the urging means does not act on the component when mounting the component, and the component can always be mounted with an appropriate pressing force.

以下、図面を参照して本発明の実施の形態について説明する。図1は本発明の一実施の形態における部品実装機の要部斜視図、図2、図3及び図4は本発明の一実施の形態における搭載ヘッドの断面図、図5(a)は本発明の一実施の形態における搭載ヘッドを用いた場合の部品の押し付け力の時間変化を示すグラフ、図5(b)は比較対象搭載ヘッドを用いた場合の部品の押し付け力の時間変化を示すグラフである。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a principal part of a component mounting machine according to an embodiment of the present invention, FIGS. 2, 3 and 4 are sectional views of a mounting head according to an embodiment of the present invention, and FIG. FIG. 5B is a graph showing the time change of the component pressing force when the mounting head is used, and FIG. 5B is a graph showing the time change of the component pressing force when the comparison target mounting head is used. It is.

図1において、部品実装機1はフリップチップ型の部品実装機であり、基台2上に基板供給部3、基板移載部4、基板位置決め部5、部品供給部6、部品反転部7及び部品搭載部8を備えている。基板供給部3は基板PBを所定の位置に供給し、基板移載部4は基板供給部3が供給する基板PBを基板位置決め部5に移載する。基板位置決め部5は基板移載部4によって移載された基板PBを移動させて所定の位置に位置決めする。部品供給部6は基板PBに搭載させる部品Pを供給し、部品反転部7は、部品供給部6が供給する部品Pを吸着して、これを表裏反転させる。部品搭載部8は部品反転部7によって表裏反転された部品Pを吸着し、その部品Pを基板位置決め部5によって位置決めされた基板PBに搭載する。   In FIG. 1, a component mounting machine 1 is a flip chip type component mounting machine. On a base 2, a substrate supply unit 3, a substrate transfer unit 4, a substrate positioning unit 5, a component supply unit 6, a component reversing unit 7, A component mounting portion 8 is provided. The substrate supply unit 3 supplies the substrate PB to a predetermined position, and the substrate transfer unit 4 transfers the substrate PB supplied by the substrate supply unit 3 to the substrate positioning unit 5. The substrate positioning unit 5 moves the substrate PB transferred by the substrate transfer unit 4 and positions it at a predetermined position. The component supply unit 6 supplies the component P to be mounted on the board PB, and the component reversing unit 7 sucks the component P supplied by the component supply unit 6 and reverses it. The component mounting unit 8 sucks the component P inverted by the component reversing unit 7 and mounts the component P on the substrate PB positioned by the substrate positioning unit 5.

基板供給部3は一対の平行な基板供給コンベア3aを備えており、基板PBはこの基板供給コンベア3aによって水平方向に搬送されて所定の位置に供給される。   The substrate supply unit 3 includes a pair of parallel substrate supply conveyors 3a, and the substrate PB is transported in the horizontal direction by the substrate supply conveyor 3a and supplied to a predetermined position.

基板移載部4は下面に基板吸着部4aを有した移載ヘッド4bと、移載ヘッド4bを移動させる移載ヘッド移動機構4cを備えている。基板供給部3より供給された基板PBは、移載ヘッド4bの基板吸着部4aにおいて吸着され、移載ヘッド移動機構4cによる移載ヘッド4bの移動によって、基板位置決め部5に移載される。   The substrate transfer unit 4 includes a transfer head 4b having a substrate suction unit 4a on the lower surface, and a transfer head moving mechanism 4c for moving the transfer head 4b. The substrate PB supplied from the substrate supply unit 3 is adsorbed by the substrate adsorption unit 4a of the transfer head 4b, and transferred to the substrate positioning unit 5 by the movement of the transfer head 4b by the transfer head moving mechanism 4c.

基板位置決め部5は基台2に固定された固定ステージ5a、固定ステージ5aに対してY軸方向(水平面内の一の方向)に相対移動するY軸ステージ5b、Y軸ステージ5bに対してX軸方向(Y軸方向と直交する水平面内の方向)に相対移動するX軸ステージ5cから成り、X軸ステージ5cには基板移載部4によって基板供給部3から移載された基板
PBが載置される。X軸ステージ5cに載置された基板PBは、Y軸ステージ5bの固定ステージ5aに対するY軸方向への移動及びX軸ステージ5cのY軸ステージ5bに対するX軸方向への移動によって、所定の位置に位置決めされる。
The substrate positioning unit 5 is fixed to the base 2 and is fixed to the base 2. The Y-axis stage 5 b moves relative to the fixed stage 5 a in the Y-axis direction (one direction in the horizontal plane). The X-axis stage 5c moves relatively in the axial direction (the direction in the horizontal plane perpendicular to the Y-axis direction), and the substrate PB transferred from the substrate supply unit 3 by the substrate transfer unit 4 is mounted on the X-axis stage 5c. Placed. The substrate PB placed on the X-axis stage 5c is moved to a predetermined position by moving the Y-axis stage 5b in the Y-axis direction relative to the fixed stage 5a and moving the X-axis stage 5c in the X-axis direction relative to the Y-axis stage 5b. Is positioned.

部品供給部6は基台2に固定された固定ステージ6a、固定ステージ6aに対してY軸方向に相対移動するY軸ステージ6b、Y軸ステージ6bに対してX軸方向に相対移動するX軸ステージ6cから成り、X軸ステージ6cには基板PBに搭載すべき複数の部品Pを載せたパレット6dが載置される。X軸ステージ6cに載置されたパレット6d、すなわち部品Pは、Y軸ステージ6bの固定ステージ6aに対するY軸方向への移動及びX軸ステージ6cのY軸ステージ6bに対するX軸方向への移動によって、所定の位置に位置決めされる。   The component supply unit 6 includes a fixed stage 6a fixed to the base 2, a Y-axis stage 6b that moves relative to the fixed stage 6a in the Y-axis direction, and an X-axis that moves relative to the Y-axis stage 6b in the X-axis direction. A pallet 6d on which a plurality of parts P to be mounted on the substrate PB is placed is placed on the X-axis stage 6c. The pallet 6d placed on the X-axis stage 6c, that is, the component P is moved by moving the Y-axis stage 6b in the Y-axis direction relative to the fixed stage 6a and moving the X-axis stage 6c in the X-axis direction relative to the Y-axis stage 6b. , Is positioned at a predetermined position.

部品反転部7は、部品吸着部7aを備えた吸着反転部7bをY軸回りに回転自在に支持する反転ヘッド7cと、反転ヘッド7cを移動させる反転ヘッド移動機構7dを備えている。部品供給部6によって供給されたパレット6d内の部品Pは、吸着反転部7bの部品吸着部7aにおいて吸着され、吸着反転部7bをY軸回りに回転させることで部品Pを表裏反転させる(図1中に示す矢印A1)。反転ヘッド7cによって吸着され、表裏反転された部品Pは、反転ヘッド移動機構7dによる反転ヘッド7cの移動によって、所定の位置に位置決めされる。   The component reversing unit 7 includes a reversing head 7c that rotatably supports the suction reversing unit 7b including the component sucking unit 7a, and a reversing head moving mechanism 7d that moves the reversing head 7c. The component P in the pallet 6d supplied by the component supply unit 6 is adsorbed by the component adsorption unit 7a of the adsorption inversion unit 7b, and the component P is inverted by rotating the adsorption inversion unit 7b around the Y axis (see FIG. Arrow A1) shown in FIG. The component P sucked by the reversing head 7c and turned upside down is positioned at a predetermined position by the movement of the reversing head 7c by the reversing head moving mechanism 7d.

部品搭載部8は、搭載ヘッド10が取り付けられるベースプレートとしての移動プレート8aと、移動プレート8aを(すなわち搭載ヘッド10を)移動させる搭載ヘッド移動機構8bを備えている。部品反転部7によって表裏反転され、所定の位置に位置決めされた部品Pは、搭載ヘッド10によって吸着保持され、搭載ヘッド移動機構8bによる搭載ヘッド10の移動によって、基板位置決め部5に位置決めされた基板PBの上方へ移動され、基板PB上の目標搭載位置に搭載される。   The component mounting unit 8 includes a moving plate 8a as a base plate to which the mounting head 10 is attached, and a mounting head moving mechanism 8b that moves the moving plate 8a (that is, the mounting head 10). The component P that has been reversed upside down by the component reversing unit 7 and positioned at a predetermined position is sucked and held by the mounting head 10, and the substrate positioned by the substrate positioning unit 5 by the movement of the mounting head 10 by the mounting head moving mechanism 8b. It is moved above the PB and mounted at the target mounting position on the substrate PB.

図2、図3及び図4において、搭載ヘッド10は、移動プレート8aに固定された固定部材11、固定部材11に対して(すなわち移動プレート8aに対して)昇降自在に設けられた昇降部材12、昇降部材12に対して上下方向(Z軸方向)に移動自在に設けられ、下端に部品Pを吸着保持する部品保持部13を備えた一又は複数のロッド状部材14、昇降部材12に固定して設けられた位置決め部材15、昇降部材12に固定して設けられ、ロッド状部材14を下方に付勢して位置決め部材15に上方から当接させ、昇降部材12に対するロッド状部材14の位置決めを行う付勢手段としてのエアシリンダ16、ロッド状部材14が位置決め部材15に当接された状態で昇降部材12を固定部材11に対して(移動プレート8aに対して)昇降させる昇降部材昇降機構17を備えている。   2, 3, and 4, the mounting head 10 includes a fixed member 11 that is fixed to the moving plate 8 a, and a lifting member 12 that is movable up and down with respect to the fixed member 11 (that is, with respect to the moving plate 8 a). One or a plurality of rod-like members 14 provided with a component holding portion 13 that is provided so as to be movable in the vertical direction (Z-axis direction) with respect to the elevating member 12 and attracts and holds the component P at the lower end, and fixed to the elevating member 12 The positioning member 15 is fixed to the elevating member 12, and the rod-like member 14 is urged downward to contact the positioning member 15 from above, so that the rod-like member 14 is positioned relative to the elevating member 12. In the state where the air cylinder 16 and the rod-shaped member 14 as the urging means for abutting are in contact with the positioning member 15, the elevating member 12 is moved with respect to the fixed member 11 (with respect to the moving plate 8a). And a lifting member lifting mechanism 17 for lifting and.

図2において、固定部材11は垂直部11aと垂直部11aの上部に形成された水平部11bを有して成る。昇降部材12は垂直部12a及び上下の水平部(上側水平部12b及び下側水平部12c)を有して成る。昇降部材12の垂直部12aの背面側(固定部材11と対向する側)にはスライダ部12dが設けられており、固定部材11の垂直部11aの正面側(昇降部材12と対向する側)には昇降ガイド11cが上下方向に延びて設けられている。昇降部材12のスライダ部12dは固定部材11の昇降ガイド11cによって上下方向にスライド自在にガイドされており、昇降部材12全体が固定部材11に対して(すなわち移動プレート8aに対して)昇降できるようになっている。   In FIG. 2, the fixing member 11 includes a vertical portion 11a and a horizontal portion 11b formed on the top of the vertical portion 11a. The elevating member 12 includes a vertical portion 12a and upper and lower horizontal portions (upper horizontal portion 12b and lower horizontal portion 12c). A slider portion 12d is provided on the back side (the side facing the fixing member 11) of the vertical portion 12a of the elevating member 12, and on the front side (the side facing the elevating member 12) of the vertical portion 11a of the fixing member 11. The lift guide 11c is provided extending in the vertical direction. The slider portion 12d of the elevating member 12 is guided to be vertically slidable by the elevating guide 11c of the fixed member 11, so that the entire elevating member 12 can be moved up and down with respect to the fixed member 11 (that is, with respect to the moving plate 8a). It has become.

位置決め部材15は上下方向に延びた貫通孔15aを有したリング状の部材であり、昇降部材12の下側水平部12cの上面側に固定して設けられている。昇降部材12の下側水平部12cには、位置決め部材15の貫通孔15aと同心で、かつ貫通孔15aの内径とほぼ同じ大きさの内径を有する円形の貫通孔12eが上下方向に貫通して設けられてい
る(図2及び図4中に示す拡大図参照)。
The positioning member 15 is a ring-shaped member having a through-hole 15a extending in the vertical direction, and is fixed to the upper surface side of the lower horizontal portion 12c of the elevating member 12. In the lower horizontal portion 12c of the elevating member 12, a circular through hole 12e that is concentric with the through hole 15a of the positioning member 15 and has an inner diameter substantially the same as the inner diameter of the through hole 15a penetrates in the vertical direction. (See the enlarged views shown in FIGS. 2 and 4).

ロッド状部材14は互いに外径の異なる上半部14aと下半部14bを有しており、下半部14bの外径は上半部14aの外径よりも小さくなっている。下半部14bは昇降部材12の下側水平部12cの貫通孔12e及び位置決め部材15の貫通孔15aを上下方向に貫通しており、上半部14aと下半部14bの境の段差部の下面(この面はリング状になっている)が位置決め部材15の上面に上方から当接し得るようになっている。以下、上半部14aと下半部14bの境の段差部の下面を、ロッド状部材14の(位置決め部材15との)当接面14cと称する。また、位置決め部材15の上面を、位置決め部材15の(ロッド状部材14との)当接面15bと称する。   The rod-shaped member 14 has an upper half 14a and a lower half 14b having different outer diameters, and the outer diameter of the lower half 14b is smaller than the outer diameter of the upper half 14a. The lower half portion 14b passes through the through hole 12e of the lower horizontal portion 12c of the elevating member 12 and the through hole 15a of the positioning member 15 in the vertical direction, and the step portion at the boundary between the upper half portion 14a and the lower half portion 14b. The lower surface (this surface has a ring shape) can come into contact with the upper surface of the positioning member 15 from above. Hereinafter, the lower surface of the step portion at the boundary between the upper half portion 14a and the lower half portion 14b is referred to as a contact surface 14c (with the positioning member 15) of the rod-shaped member 14. The upper surface of the positioning member 15 is referred to as a contact surface 15b (with the rod-shaped member 14) of the positioning member 15.

ここで、ロッド状部材14及び位置決め部材15の少なくとも一方は非磁性材料(例えば、非磁性ステンレス鋼や非磁性セラミックス、非磁性チタン合金等)から成っている(図2及び図4中に示す拡大図も参照)。   Here, at least one of the rod-shaped member 14 and the positioning member 15 is made of a non-magnetic material (for example, non-magnetic stainless steel, non-magnetic ceramic, non-magnetic titanium alloy, etc.) (enlarged in FIGS. 2 and 4). (See also figure).

ロッド状部材14の上半部14aにはロッド状部材14の半径方向外側に張り出した鍔部14dが設けられており、この鍔部14dと昇降部材12の下側水平部12cの間にはリターンスプリング19が縮設されている。このリターンスプリング19により、ロッド状部材14は昇降部材12の下側水平部12cに対して常時上方に付勢され、ロッド状部材14の自重をキャンセルした状態となっている。   The upper half portion 14a of the rod-shaped member 14 is provided with a flange portion 14d protruding outward in the radial direction of the rod-shaped member 14, and a return is provided between the flange portion 14d and the lower horizontal portion 12c of the elevating member 12. The spring 19 is contracted. By this return spring 19, the rod-shaped member 14 is constantly urged upward with respect to the lower horizontal portion 12 c of the elevating member 12, and the weight of the rod-shaped member 14 is canceled.

エアシリンダ16は、昇降部材12の上側水平部12bに固定して設けられており、圧空供給口21aから圧空が供給されるシリンダ室21を内部に有したシリンダケース22、シリンダケース22の内部に収容され、シリンダ室21内に供給された圧空によって下方に付勢されるピストン23及びピストン23に連結されてシリンダケース22から下方に突出して延びたピストンロッド24を備えている。   The air cylinder 16 is fixed to the upper horizontal portion 12b of the elevating member 12, and includes a cylinder case 22 having a cylinder chamber 21 into which compressed air is supplied from a compressed air supply port 21a. A piston 23 accommodated in the cylinder chamber 21 and biased downward by compressed air supplied into the cylinder chamber 21 and a piston rod 24 connected to the piston 23 and projecting downward from the cylinder case 22 are provided.

ピストンロッド24の下端には、リターンスプリング19によって上方に付勢されたロッド状部材14の上端が下方から当接しており、シリンダ室21内でピストンが上下方向に移動すると(すなわちピストンロッド24が上下方向に移動すると)、これに従ってロッド状部材14も上下方向に移動する。圧空供給口21aからシリンダ室21内に圧空が供給されると、ピストン23はピストンロッド24を介してロッド状部材14を下方に付勢し、ロッド状部材14を位置決め部材15に上方から当接させるので、ロッド状部材14は昇降部材12に対して位置決めされる。このロッド状部材14が昇降部材12に対して位置決めされた状態(すなわち、ロッド状部材14が当接面14cを位置決め部材15の当接面15bに当接させた状態)は、ロッド状部材14の下端部に上方への押し上げ力が作用しない限り維持される。   The upper end of the rod-like member 14 urged upward by the return spring 19 is in contact with the lower end of the piston rod 24 from below, and when the piston moves in the vertical direction in the cylinder chamber 21 (that is, the piston rod 24 is In accordance with this, the rod-shaped member 14 also moves in the vertical direction. When compressed air is supplied into the cylinder chamber 21 from the compressed air supply port 21a, the piston 23 biases the rod-shaped member 14 downward via the piston rod 24, and the rod-shaped member 14 contacts the positioning member 15 from above. Therefore, the rod-shaped member 14 is positioned with respect to the elevating member 12. The rod-shaped member 14 is positioned with respect to the elevating member 12 (that is, the rod-shaped member 14 is in contact with the contact surface 15b of the positioning member 15). This is maintained as long as an upward push-up force does not act on the lower end portion of the.

昇降部材昇降機構17は、固定部材11の水平部11bに固定された昇降モータ27と、昇降部材12の垂直部12aを上下に貫通して延び、垂直部12a内の図示しない螺子溝と螺合したボール螺子28を有して成る。昇降モータ27を駆動してボール螺子28を回転させると(図2中に示す矢印A2)、ボール螺子28に螺合した昇降部材12が固定部材11に対して(移動プレート8aに対して)昇降するので、昇降部材12に位置決めされたロッド状部材14も昇降部材12と一体となって昇降する。   The elevating member elevating mechanism 17 extends vertically through the elevating motor 27 fixed to the horizontal portion 11b of the fixing member 11 and the vertical portion 12a of the elevating member 12, and is screwed into a screw groove (not shown) in the vertical portion 12a. The ball screw 28 is provided. When the elevating motor 27 is driven to rotate the ball screw 28 (arrow A2 shown in FIG. 2), the elevating member 12 screwed into the ball screw 28 moves up and down with respect to the fixed member 11 (with respect to the moving plate 8a). Therefore, the rod-shaped member 14 positioned on the lifting member 12 also moves up and down integrally with the lifting member 12.

この搭載ヘッド10により部品Pを基板PB上の目標搭載位置に搭載するには、ロッド状部材14を昇降部材12に位置決めした状態で部品保持部13に部品Pを吸着保持させ、搭載ヘッド移動機構8bによって移動プレート8aを基板PBに対して移動させて、搭載ヘッド10を基板PBの上方に移動させる。そして、更に、部品Pが基板PB上の目標搭載位置の上方に位置合わせされるように搭載ヘッド10を移動させ、昇降部材昇降機構
17によって昇降部材12を固定部材11に対して(すなわち移動プレート8aに対して)下降させる。
In order to mount the component P at the target mounting position on the substrate PB by the mounting head 10, the component P is sucked and held by the component holding portion 13 with the rod-shaped member 14 positioned on the lifting member 12, and the mounting head moving mechanism The moving plate 8a is moved relative to the substrate PB by 8b, and the mounting head 10 is moved above the substrate PB. Further, the mounting head 10 is moved so that the component P is aligned above the target mounting position on the substrate PB, and the elevating member 12 is moved relative to the fixed member 11 by the elevating member elevating mechanism 17 (that is, the moving plate). Lower (with respect to 8a).

これによりロッド状部材14が昇降部材12と一体となって下降すると、部品Pは基板PBに上方から接触し、ロッド状部材14は部品Pを介して基板PBから反力を受ける。部品Pが基板PBに接触した直後に昇降部材12の下降動作は停止されるが、部品Pが基板PBに接触した後も若干昇降部材12が下降することによって、ロッド状部材14は位置決め部材15から離間し、エアシリンダ16のピストンロッド24を介してピストン23をシリンダ室21内に押し込みながら、昇降部材12に対して相対的に上動する。そうすると、部品Pには、ロッド状部材14を介して、エアシリンダ16の付勢力相当の押し付け力が作用する。すなわちロッド状部材14は、部品Pが基板PBに接触した後、エアシリンダ16の付勢力相当の押し付け力で部品Pを基板PBに押し付ける。   As a result, when the rod-shaped member 14 is lowered integrally with the elevating member 12, the component P contacts the substrate PB from above, and the rod-shaped member 14 receives a reaction force from the substrate PB via the component P. Immediately after the component P comes into contact with the substrate PB, the lowering operation of the elevating member 12 is stopped. However, the rod-like member 14 is moved down slightly after the component P comes into contact with the substrate PB. The piston 23 is pushed upward into the cylinder chamber 21 via the piston rod 24 of the air cylinder 16 and is moved upward relative to the elevating member 12. Then, a pressing force corresponding to the urging force of the air cylinder 16 acts on the component P via the rod-shaped member 14. That is, the rod-shaped member 14 presses the component P against the substrate PB with a pressing force corresponding to the urging force of the air cylinder 16 after the component P contacts the substrate PB.

基板PB上の目標搭載位置には予め半田が塗布されており、部品Pが基板PB上の目標搭載位置に押し付けられた後、部品保持部13に内蔵されたヒータ等(図示せず)によって部品Pを加熱すると、基板PB上の半田が部品Pを介して加熱され、半田が溶融されて部品Pが基板PB上に接合(搭載)される。このとき、ロッド状部材14が部品Pを基板PBに押し付ける力(部品Pの押し付け力)は上記のように、エアシリンダ16の付勢力相当の力であるため、部品Pの押し付け力は、エアシリンダ16の付勢力を調節することによって(具体的には、シリンダ室21内に供給する圧空の圧力を調節することによって)、適切な値に設定しておくことができる。   Solder is applied in advance to the target mounting position on the substrate PB, and after the component P is pressed against the target mounting position on the substrate PB, the component is mounted by a heater or the like (not shown) built in the component holding unit 13. When P is heated, the solder on the substrate PB is heated via the component P, the solder is melted, and the component P is joined (mounted) on the substrate PB. At this time, since the force with which the rod-shaped member 14 presses the component P against the substrate PB (the pressing force of the component P) is a force equivalent to the urging force of the air cylinder 16 as described above, the pressing force of the component P is By adjusting the urging force of the cylinder 16 (specifically, by adjusting the pressure of the compressed air supplied into the cylinder chamber 21), it can be set to an appropriate value.

このように、部品実装機1が備える搭載ヘッド10は、昇降部材昇降機構17によって昇降部材12を移動プレート8aに対して下降させ、部品Pが基板PBに接触したとき、部品Pを介して基板PBから反力を受けたロッド状部材14が位置決め部材15から離間し、エアシリンダ16の付勢力相当の押し付け力で部品Pを基板PBに押し付けて部品搭載を行うようになっている。   As described above, the mounting head 10 provided in the component mounting machine 1 lowers the elevating member 12 with respect to the moving plate 8a by the elevating member elevating mechanism 17, and when the component P comes into contact with the substrate PB, the substrate P is interposed via the component P. The rod-like member 14 that has received the reaction force from the PB is separated from the positioning member 15, and the component P is pressed against the substrate PB with a pressing force corresponding to the urging force of the air cylinder 16 to mount the component.

ここで、前述のように、本実施の形態に係る搭載ヘッド10では、ロッド状部材14及び位置決め部材15の少なくとも一方は非磁性材料から成っているため、これらの部材14,15の加工時やハンドリング時等に強磁性材料から成る工具が使用された場合や、磁性を有する機器(例えばモータ等)が周辺にある場合であっても(したがって、非磁性材料でない側の部材が仮に帯磁している場合であっても)、ロッド状部材14と位置決め部材15の間に磁力による引き合い力は生じない。このため、昇降部材12が固定部材11に対して(すなわち移動プレート8aに対して)下降されて部品Pが基板PBに接触し、ロッド状部材14が昇降部材12に対して押し上げられて位置決め部材15から離間したとき、部品Pにはエアシリンダ16の付勢力相当の押し付け力のみが作用する。   Here, as described above, in the mounting head 10 according to the present embodiment, at least one of the rod-shaped member 14 and the positioning member 15 is made of a non-magnetic material. Even when a tool made of a ferromagnetic material is used at the time of handling, etc., or even when a magnetic device (such as a motor) is in the vicinity (therefore, a member that is not a non-magnetic material is temporarily magnetized). Even if it exists, the attractive force by a magnetic force does not arise between the rod-shaped member 14 and the positioning member 15. For this reason, the elevating member 12 is lowered with respect to the fixed member 11 (that is, with respect to the moving plate 8a), the component P comes into contact with the substrate PB, and the rod-like member 14 is pushed up with respect to the elevating member 12, thereby positioning member. When separated from 15, only the pressing force corresponding to the urging force of the air cylinder 16 acts on the component P.

図5(a)のグラフは、本実施の形態における部品実装機1が備える搭載ヘッド10を用いて部品搭載を行った場合の部品Pの押し付け力Rの時間変化(時間tに対する変化)を示している。また、図5(b)のグラフは、本実施の形態における部品実装機1が備える搭載ヘッド10のロッド状部材14と位置決め部材15がともに磁性材料から成って少なくとも一方が帯磁している搭載ヘッド(比較対象搭載ヘッド)を用いて部品搭載を行った場合の部品Pの押し付け力Rの時間変化を示している。ここで、図5(a),(b)中に示す部品Pの押し付け力R1はエアシリンダ16の付勢力相当の押し付け力を示しており、t1は部品Pが基板PBに接触したときの時間、t2はロッド状部材14によって部品Pを基板PBに押し付けた後、昇降部材12が固定部材11に対して(移動プレート8aに対して)上昇してロッド状部材14の下端の部品保持部13が部品Pから離間したときの時間を示している。   The graph of FIG. 5A shows a change with time (change with respect to time t) of the pressing force R of the component P when the component is mounted using the mounting head 10 provided in the component mounter 1 in the present embodiment. ing. Further, the graph of FIG. 5B shows a mounting head in which both the rod-shaped member 14 and the positioning member 15 of the mounting head 10 provided in the component mounting machine 1 according to the present embodiment are made of a magnetic material and are magnetized. The time change of the pressing force R of the component P at the time of component mounting using (comparative mounting head) is shown. Here, the pressing force R1 of the component P shown in FIGS. 5A and 5B indicates the pressing force corresponding to the urging force of the air cylinder 16, and t1 is the time when the component P contacts the substrate PB. , T2, after the component P is pressed against the substrate PB by the rod-shaped member 14, the elevating member 12 rises with respect to the fixed member 11 (relative to the moving plate 8 a), and the component holding portion 13 at the lower end of the rod-shaped member 14. Shows the time when the part is separated from the part P.

図5(a)のグラフから、本実施の形態における搭載ヘッド10のように、ロッド状部材14及び位置決め部材15の少なくとも一方が非磁性材料から成っている場合には、部品Pの押し付け力Rがエアシリンダ16の付勢力相当の押しつけ力R1を超えないことが分かる。   From the graph of FIG. 5A, when at least one of the rod-shaped member 14 and the positioning member 15 is made of a nonmagnetic material as in the mounting head 10 in the present embodiment, the pressing force R of the component P It can be seen that does not exceed the pressing force R1 corresponding to the urging force of the air cylinder 16.

また、図5(b)のグラフから、ロッド状部材14と位置決め部材15の双方が磁性材料から成って少なくとも一方が帯磁している場合には、部品Pが基板PBに接触してロッド状部材14が位置決め部材15から離間する際に、ロッド状部材14と位置決め部材15の間に発生している磁力による引き合い力の分だけ大きな衝撃力が部品Pを介して基板PBに加わることになり、ロッド状部材14と位置決め部材15が完全に離間したときに、エアシリンダ16の付勢力相当の押し付け力R1のみになることが分かる。   Further, from the graph of FIG. 5B, when both the rod-shaped member 14 and the positioning member 15 are made of a magnetic material and at least one is magnetized, the component P comes into contact with the substrate PB and the rod-shaped member. When 14 moves away from the positioning member 15, an impact force that is as large as the attractive force generated by the magnetic force generated between the rod-shaped member 14 and the positioning member 15 is applied to the substrate PB via the component P. It can be seen that when the rod-shaped member 14 and the positioning member 15 are completely separated from each other, only the pressing force R1 corresponding to the urging force of the air cylinder 16 is obtained.

以上説明したように、本実施の形態における部品実装機1が備える搭載ヘッド10では、ロッド状部材14及び位置決め部材15の少なくとも一方が非磁性材料から成っているので、これらの部材14,15の加工時やハンドリング時等に強磁性材料から成る工具が使用された場合や、磁性を有する機器が周辺にある場合であっても、ロッド状部材14と位置決め部材15の間に磁力による引き合い力は生じない。このため、昇降部材12が移動プレート8aに対して下降されて部品Pが基板PBに接触し、ロッド状部材14が位置決め部材15から離間した後の部品Pの押し付け力は、エアシリンダ16の付勢力相当の力のみとなる。このため、部品搭載時にエアシリンダ16の付勢力を超える過剰な押し付け力が部品Pに作用することはなく、常に適切な押し付け力で部品Pの搭載を行うことができる。   As described above, in the mounting head 10 provided in the component mounter 1 according to the present embodiment, at least one of the rod-shaped member 14 and the positioning member 15 is made of a nonmagnetic material. Even when a tool made of a ferromagnetic material is used at the time of processing or handling, or when a magnetic device is in the vicinity, the attractive force due to the magnetic force is between the rod-shaped member 14 and the positioning member 15. Does not occur. Therefore, the pressing force of the component P after the elevating member 12 is lowered with respect to the moving plate 8a, the component P comes into contact with the substrate PB, and the rod-shaped member 14 is separated from the positioning member 15 is applied to the air cylinder 16. Only power equivalent to power is available. For this reason, an excessive pressing force exceeding the urging force of the air cylinder 16 does not act on the component P when mounting the component, and the component P can always be mounted with an appropriate pressing force.

また、本実施の形態における部品実装機1は、基板PBの位置決めを行う基板位置決め部5、基板位置決め部5に位置決めされた基板PBに対して相対移動されるベース部材である移動プレート8a、移動プレート8aに取り付けられた搭載ヘッド10を備え、供給された部品Pを搭載ヘッド10が備えるロッド状部材14に保持させてその部品Pを基板位置決め部5に位置決めされた基板PBに搭載させるようになっており、基板PBへの部品Pの搭載に上述の搭載ヘッド10が用いられることから、部品搭載時における部品Pの押し付け力を適切な値に保持することができ、またこれにより、部品Pの押し付け力が過大となることに起因して部品Pにダメージを与えることを防止することができるので、基板PBの生産性及び品質を大きく向上させることができる。   Further, the component mounting machine 1 according to the present embodiment includes a substrate positioning unit 5 that positions the substrate PB, a moving plate 8a that is a base member that is relatively moved with respect to the substrate PB that is positioned on the substrate positioning unit 5, and movement. A mounting head 10 attached to the plate 8 a is provided, and the supplied component P is held by a rod-shaped member 14 provided in the mounting head 10 so that the component P is mounted on the substrate PB positioned by the substrate positioning portion 5. Since the mounting head 10 is used for mounting the component P on the board PB, the pressing force of the component P at the time of mounting the component can be held at an appropriate value. Since it is possible to prevent the component P from being damaged due to excessive pressing force of the substrate, the productivity and quality of the substrate PB is increased. It is possible to improve.

これまで本発明の実施の形態について説明してきたが、本発明は上述の実施の形態に示したものに限定されない。例えば、上述の実施の形態では、ロッド状部材14が位置決め部材15に当接された状態で昇降部材12を移動プレート8aに対して昇降させる昇降部材昇降手段として、昇降モータ27及びこの昇降モータ27によって駆動されるボール螺子28を有する機構(昇降部材昇降機構17)が採用されていたが、昇降部材12を移動プレート8a(ベース部材)に対して昇降させる機構は特に限定されない。また、上述の実施の形態では、位置決め部材15は昇降部材12とは別部材として昇降部材12に取り付けられたものであったが、位置決め部材15と昇降部材12は一体に形成されているのであってもよい。この場合、昇降部材12全体を非磁性材料とするようにしてもよい。   Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, in the above-described embodiment, the elevating motor 27 and the elevating motor 27 are used as the elevating member elevating means for elevating the elevating member 12 with respect to the moving plate 8a in a state where the rod-shaped member 14 is in contact with the positioning member 15. However, the mechanism for raising and lowering the elevating member 12 relative to the moving plate 8a (base member) is not particularly limited. In the above-described embodiment, the positioning member 15 is attached to the elevating member 12 as a separate member from the elevating member 12, but the positioning member 15 and the elevating member 12 are integrally formed. May be. In this case, the entire elevating member 12 may be made of a nonmagnetic material.

また、上述の実施の形態では、部品実装機がフリップチップ型の部品実装機である場合の例を示したが、本発明の部品実装機は必ずしもフリップチップ型のものに限られない。   In the above-described embodiment, an example in which the component mounter is a flip chip type component mounter has been described. However, the component mounter of the present invention is not necessarily limited to the flip chip type.

常に適切な押し付け力で部品の搭載を行うことができる搭載ヘッド及び部品実装機を提供する。   Provided is a mounting head and a component mounter that can always mount components with an appropriate pressing force.

本発明の一実施の形態における部品実装機の要部斜視図The principal part perspective view of the component mounting machine in one embodiment of this invention 本発明の一実施の形態における搭載ヘッドの断面図Sectional drawing of the mounting head in one embodiment of this invention 本発明の一実施の形態における搭載ヘッドの断面図Sectional drawing of the mounting head in one embodiment of this invention 本発明の一実施の形態における搭載ヘッドの断面図Sectional drawing of the mounting head in one embodiment of this invention (a)本発明の一実施の形態における搭載ヘッドを用いた場合の部品の押し付け力の時間変化を示すグラフ(b)比較対象搭載ヘッドを用いた場合の部品の押し付け力の時間変化を示すグラフ(A) Graph showing time change of component pressing force when using mounting head according to one embodiment of the present invention (b) Graph showing time change of component pressing force when using comparison target mounting head

符号の説明Explanation of symbols

1 部品実装機
5 基板位置決め部
8a 移動プレート(ベース部材)
10 搭載ヘッド
12 昇降部材
13 部品保持部
14 ロッド状部材
14c 当接面
15 位置決め部材
15b 当接面
16 エアシリンダ(付勢手段)
17 昇降部材昇降機構(昇降部材昇降手段)
PB 基板
P 部品
DESCRIPTION OF SYMBOLS 1 Component mounting machine 5 Board positioning part 8a Moving plate (base member)
DESCRIPTION OF SYMBOLS 10 Mounting head 12 Lifting member 13 Component holding part 14 Rod-shaped member 14c Contact surface 15 Positioning member 15b Contact surface 16 Air cylinder (biasing means)
17 Lifting member lifting mechanism (lifting member lifting mechanism)
PB board P parts

Claims (2)

基板に対して相対移動されるベース部材に対して昇降自在に設けられた昇降部材と、昇降部材に対して上下移動自在に設けられ、下端に部品保持部を備えたロッド状部材と、昇降部材に固定して設けられた位置決め部材と、昇降部材に固定して設けられ、ロッド状部材を下方に付勢して位置決め部材に当接させ、昇降部材に対するロッド状部材の位置決めを行う付勢手段と、ロッド状部材が位置決め部材に当接された状態で昇降部材をベース部材に対して昇降させる昇降部材昇降手段とを備え、昇降部材昇降手段によって昇降部材をベース部材に対して下降させ、部品が基板に接触したとき、部品を介して基板から反力を受けたロッド状部材が位置決め部材から離間し、付勢手段の付勢力相当の押し付け力で部品を基板に押し付けて部品搭載を行う搭載ヘッドであって、ロッド状部材及び位置決め部材の少なくとも一方が非磁性材料から成ることを特徴とする搭載ヘッド。   An elevating member provided so as to be movable up and down relative to a base member that is moved relative to the substrate, a rod-like member provided so as to be movable up and down relative to the elevating member, and having a component holding portion at the lower end, and an elevating member And a biasing means that is fixed to the lifting member and biases the rod-shaped member downward to abut against the positioning member to position the rod-shaped member with respect to the lifting member. And an elevating member elevating means for elevating the elevating member with respect to the base member in a state where the rod-shaped member is in contact with the positioning member, and the elevating member is lowered with respect to the base member by the elevating member elevating means. When the rod contacts the board, the rod-shaped member that receives the reaction force from the board through the part moves away from the positioning member, and the part is pressed against the board with the pressing force equivalent to the biasing force of the biasing means. A mounting head for, mounting head is characterized in that at least one rod-shaped member and the positioning member is made of a nonmagnetic material. 基板の位置決めを行う基板位置決め部と、基板位置決め部に位置決めされた基板に対して相対移動されるベース部材と、ベース部材に取り付けられた請求項1に記載の搭載ヘッドとを備え、供給された部品を搭載ヘッドが備えるロッド状部材に保持させてその部品を基板位置決め部に位置決めされた基板に搭載させるようになっていることを特徴とする部品実装機。   A substrate positioning unit that positions the substrate, a base member that is relatively moved with respect to the substrate positioned in the substrate positioning unit, and the mounting head according to claim 1 attached to the base member. A component mounting machine characterized in that a component is held by a rod-shaped member provided in a mounting head and the component is mounted on a substrate positioned by a substrate positioning portion.
JP2008185543A 2008-07-17 2008-07-17 Mounting head and component mounting machine Active JP5024209B2 (en)

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WO2014080472A1 (en) * 2012-11-21 2014-05-30 富士機械製造株式会社 Electronic-circuit-component-mounting head
CN109691257B (en) * 2016-09-21 2020-10-27 株式会社富士 Component mounting machine
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