JPH11274240A - Device and method for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for mounting electronic component, with which mounting unit time can be shortened and mounting accuracy can be secured. SOLUTION: A chip 5 is temporarily placed on a mount part 20 arranged between a supply part 1 for the chip 5 and a substrate holding table 40, the image of the chip 5 on a transparent mount stage 23 is picked up from the downside, and the image of a substrate 44 is picked up by a substrate recognizing camera 39 to be moved together with a loading head 30. Based on the image pickup result of the chip 5, the position deviation of the chip 5 is corrected and afterwards, the chip 5 is picked up by the loading head 30 and mounted on the substrate 44. Thus, the time required for conveyance is shortened by shortening a conveyance stroke per cycle for mounting, the time required for recognizing the positions of the chip 5 and the substrate 44 is shortened and the mounting unit time can be shortened. At the same time, the mounting accuracy can be secured by holding the chip 5 in the proper attitude without any position deviation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and method for mounting an electronic component such as a flip chip on a substrate.

[0002]

2. Description of the Related Art With the advancement of required positional accuracy when mounting electronic components on a substrate, a method for correcting a displacement between the electronic component and the substrate during mounting by image recognition has been widely used. According to this method, a board or an electronic component is imaged by a camera prior to mounting of the electronic component, the position of the board or the electronic component is detected based on the obtained image data, and the position at the time of mounting is corrected based on the detection result. Things.

By the way, in the case where a bump is formed on the lower surface of an electronic component such as a flip chip and the bump is bonded to an electrode of a substrate, the position of the bump needs to be obtained when correcting the position during mounting. For this reason, it is necessary to image the upper surface of the substrate and the lower surface of the electronic component in image recognition. In the conventional mounting method of the electronic component, the imaging of the substrate and the electronic component is performed by the method described below.

One method is to move a mounting head picking up an electronic component from a supply section of the electronic component to a position above a camera for imaging the electronic component, and to image the lower surface of the electronic component held by the mounting head. After detecting the position of the electronic component, the camera for board recognition is moved over the mounting point on the board to detect the position of the mounting point on the board, and then the mounting head is aligned with the mounting point. is there. Further, as a second method, a mounting head holding an electronic component is positioned above a mounting point of a substrate in a stopped state, and an optical head capable of imaging in both up and down directions is advanced between the electronic component and the substrate to be moved downward. A method of taking an image of the substrate and the upper electronic component, and retracting the optical head from above the substrate after the imaging has been used.

[0005]

However, in the above-mentioned first method, that is, a method in which an electronic component and a board are individually imaged by two cameras and their respective positions are detected, the tact time can be reduced. There was a problem that it was difficult. This is because, after the electronic component is picked up from the supply unit, two imagings are performed individually before reaching the mounting point, and as a result, it takes time for this imaging. Further, in the second method in which the optical head is advanced between the electronic component and the substrate and both upper and lower images are taken, it is difficult to shorten the tact time for the following reasons, and it is necessary to secure the accuracy of position correction. There was a problem that was difficult.

That is, since it is necessary to position the optical head between the electronic component and the substrate, the height position of the electronic component at the time of imaging is inevitably equal to the height position of the upper surface of the substrate on which the electronic component is mounted. It does not match. Therefore, even if the position correction amount is obtained based on the result of imaging in a state of being located above the substrate by the above difference, horizontal displacement occurs due to the mounting head descending by the height difference, When mounted on the upper surface, the position of the electronic component is not correctly corrected. Also in this method, the optical head provided with the camera needs time to advance between the electronic component and the substrate and to retract, so that there is a limit to shortening the tact time.

As described above, in the conventional mounting method of electronic components, it is difficult to shorten the mounting takt time for detecting the positions of the electronic components and the substrate, and to secure the mounting accuracy by improving the position correction accuracy. There was a problem that it was difficult to do.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and a mounting method capable of shortening the mounting tact time and improving the mounting accuracy.

[0009]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus, comprising: an electronic component supply unit; a substrate holding unit for holding a substrate on which the electronic component is mounted; A mounting part for electronic components having a transparent mounting stage disposed between the mounting part, a transfer means for transferring the electronic component from the supply unit onto the mounting stage, and an electronic part of the mounting stage. A mounting head that picks up components and mounts the mounting head on the substrate, a moving member that moves the mounting head from the placement unit to above the substrate holding unit, and the mounting head with respect to the substrate on the substrate holding unit. Positioning means for relatively positioning, electronic component imaging means for imaging the electronic component on the mounting stage from below, and electronic component for detecting a displacement of the electronic component based on an imaging result by the electronic component imaging means Displacement detection means, board imaging means arranged on the moving member for imaging the substrate on the substrate holding portion, interval changing means for changing the interval between the substrate imaging means and the mounting head, and the substrate imaging means Board position shift detecting means for detecting the position shift of the board based on the imaging result of the electronic component, and mounting the electronic component on the board based on the board position shift detection result and the electronic component position shift detection result. And a position shift correcting means for correcting a position shift at the time.

According to a second aspect of the present invention, there is provided an electronic component mounting apparatus, comprising: an electronic component supply unit; a substrate holding unit configured to hold a substrate on which the electronic component is mounted; and a transparent mounting stage. A mounting unit for transferring electronic components from the supply unit onto the mounting stage, a mounting head for picking up the electronic components of the mounting stage and mounting the electronic components on the substrate, and a mounting head on the substrate holding unit. Positioning means for relatively positioning the mounting head with respect to the substrate; electronic component imaging means for imaging the electronic component on the mounting stage from below; and the electronic component based on an image obtained by the electronic component imaging means. Electronic component position shift detecting means for detecting the position shift of the electronic component, and an electronic part when the mounting head picks up the electronic component on the mounting stage based on the result of the position shift detection of the electronic component. First displacement correction means for correcting the displacement of the substrate, substrate imaging means for capturing an image of the substrate on the substrate holding table, and a substrate position for detecting the displacement of the substrate based on the result of imaging by the substrate imaging means A shift detecting unit, and a second position shift correcting unit that corrects a position shift when the electronic component is mounted on the substrate based on the board position shift detection result and the electronic component position shift detection result. Equipped.

According to a third aspect of the present invention, there is provided a method of mounting an electronic component, comprising: means for transferring an electronic component from a supply portion of the electronic component to a position between the substrate holding portion for holding a substrate on which the electronic component is mounted and the supply portion. A step of transferring the placed electronic component on the mounting stage to a transparent mounting stage, a step of picking up electronic components on the mounting stage by a mounting head, and an electronic component imaging unit when picking up the electronic component. A step of imaging the electronic component from below, a step of detecting a displacement of the electronic component based on an imaging result of the electronic component imaging unit, and a step of disposing the electronic component on a moving member on which the mounting head is mounted, and A step of imaging a substrate held by a substrate holding unit by a substrate imaging unit in which a distance from the mounting head is set by a change unit, and a step of imaging the substrate based on an imaging result of the substrate imaging unit A step of detecting a displacement; a step of moving the mounting member to move the mounting head from the mounting portion onto the substrate; a detection result of the displacement of the substrate and a detection of a displacement of the electronic component Correcting the electronic component when the electronic component is mounted on the substrate by using a positional error correcting means based on the result.

According to a fourth aspect of the present invention, there is provided the electronic component mounting method, wherein the electronic component is transferred from the electronic component supply section to the mounting section having the transparent mounting stage by the transfer means; A step of imaging the upper electronic component from below by an electronic component imaging means; a step of detecting a displacement of the electronic component based on the imaging result; and a first displacement correction means based on the displacement detection result A step of correcting the displacement and picking up the electronic component by the mounting head, and re-imaging the electronic component held by the mounting head by the electronic component imaging means after the pickup;
A step of detecting the displacement of the electronic component, a step of imaging the board held by the board holding unit by the board imaging means, and detecting a displacement of the board; Correcting the positional deviation of the electronic component when the electronic component is mounted on the board by the second positional deviation correcting means based on the positional deviation detection result at the time of re-imaging.

According to a fifth aspect of the present invention, there is provided the electronic component mounting method according to the fourth aspect, wherein when re-imaging the electronic component, the height position of the electronic component is determined by using a board holding table. Is held at the mounting height position on the substrate held by the device.

According to the first and third aspects of the present invention, the mounting portion for mounting the electronic component on the substrate is provided separately on the mounting portion disposed between the electronic component supply portion and the substrate holding table. The electronic component is transferred and temporarily placed by the provided transfer means, and the electronic component on the transparent mounting stage provided in the mounting portion is imaged from below and the mounting portion is moved to the moving portion for moving the mounting head. By imaging the board by the arranged board imaging means, the transfer stroke of the electronic component per cycle can be shortened to reduce the time required for transfer, and the electronic component and the board can be imaged simultaneously in parallel. The time required for position recognition can be reduced, and thus the overall mounting tact time can be reduced.

According to the second and fourth aspects of the present invention, the electronic component is once mounted on the mounting portion by the transfer means provided separately from the mounting head for mounting the electronic component on the substrate. The electronic component on the transparent mounting stage provided on the mounting portion is imaged from below, and the electronic component is displaced by the first displacement correcting means based on the imaged result, and then held by the mounting head. By mounting on the substrate, the position correction accuracy can be improved and the mounting accuracy can be ensured.

[0016]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus, and FIG. 3 is a part of the electronic component mounting apparatus. It is a front view.

First, the structure of an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a first XY table 2 is provided in an electronic component supply unit 1, and a first XY table 2 is provided.
The wafer 4 is held by the holder 3 mounted on the table 2. The wafer 4 has a large number of chips 5 as electronic components. Above the first XY table 2, a first chip recognition camera 6 is provided. The first chip recognition camera 6 captures an image of the chip 5.

A rotary head unit 7 is arranged on the side of the first XY table 2. The rotary head unit 7 includes a turning table 8 and a reverse suction nozzle 9. The position of the chip 5 is detected based on the imaging result of the first chip recognition camera 6, and the position of the chip 5 whose position is corrected by driving the first XY table 2 is picked up by the reverse suction nozzle 9. Then, by turning the turning table 8 (arrow a) and then turning the reversing suction nozzle 9 up (arrow b), the chip 5 is held at a transfer position to the transfer head 10 described below.

Next, the transfer head 10 as a transfer means will be described. The Y-axis table 11 has a Y-axis slider 1
2 is slidably mounted in the Y direction. The Y-axis table 11 and the Y-axis slider 12 include a first linear motor 13
Is configured. The Y-axis slider 12 has a Z-axis motor 14a
Is fixed, and a suction nozzle 15 is mounted on the Z-axis table 14 so as to be vertically movable. With the Y-axis slider 12 being moved to the transfer position of the chip 5, the Z-axis motor 14a is driven to cause the suction nozzle 15 to move up and down.
Picks up the chip 5 held at the transfer position by the reverse suction nozzle 9 by vacuum suction.

On the side of the rotary head unit 7, a mounting portion 20 for the chip 5 is provided. The mounting section 20 is provided with the second
The XY table 21 is provided, and a mounting stage 23 is mounted on the second XY table 21 by a holder 22. The mounting stage 23 has a plate 24 made of a transparent material, and the lower surface of the chip 4 mounted on the plate 24 is an electronic component imaging means disposed below the mounting stage 23 as an electronic component imaging means. 2 chip recognition camera 2
5 enables imaging. Therefore, the position of the chip 5 is detected based on the image pickup result of the second chip recognition camera 25, and the second XY table 21 is driven based on the detection result, whereby the chip 5
Can be corrected in the XY directions.

Next, the mounting head 30 will be described. Y
The axis table 11 has a Y-axis slider 31 as a moving member.
Are slidably mounted in the Y direction. Y axis table 1
The 1 and Y axis sliders 31 constitute a second linear motor 32. A Z-axis table 33 having a Z-axis motor 33a is mounted on the Y-axis slider 31. A suction nozzle 34 is mounted on the Z-axis table 33 so as to be vertically movable, and a suction tool 35 at the lower end of the suction nozzle 34 is rotatable in the θ direction by a θ-axis motor 36. Accordingly, the suction tool 35 is positioned on the mounting stage 23 by moving the Y-axis slider 31 and the second XY table 2
The suction tool 35 is picked up by lowering the suction tool 35 on the chip 5 whose position has been corrected in the XY directions by 1 and then the θ-axis motor 36 is driven to correct the position in the θ direction. XY direction and θ
The chip 5 can be held with the position corrected in both directions. Therefore, the second XY table 2
1. The mounting stage 23 and the mounting stage 30 serve as first positional deviation correcting means.

A substrate holding section 40 is provided on the side of the mounting section 20. The substrate holding unit 40 includes an X-axis motor 41a.
The holder 43 is mounted on an X-axis table 41 provided with the above. By driving the X-axis motor 41a, the substrate 44 held by the holder 43 moves in the X direction. Therefore, the X-axis table 41 and the Y-axis slider 31
By combining the above operations, the mounting head 30 can be positioned relatively to the substrate 44 held by the substrate holding unit 40. That is, the X-axis table 41
And Y-axis slider 31 (second linear motor 32)
Are positioning means.

A Y-axis table 37 having a camera Y-axis motor 38 is mounted on the Y-axis slider 31.
0. The Y-axis table 37 has a board recognition camera 39 as a board imaging unit.
Is installed. The board recognition camera 39 captures an image of the board 44 on the board holding table 40 below.

By driving the camera Y-axis motor 38 to change the distance from the mounting head 30, the mounting head 30
Is in a position where the chip 5 on the mounting stage 23 is picked up, and the substrate 44 is
Any mounting point can be imaged. That is, the camera Y-axis motor 38 and the Y-axis table 37 serve as interval changing means for changing the interval between the board recognition camera 39 and the mounting head 30.

As described above, by disposing the board recognition camera 39 on the same moving section on which the mounting head 30 is mounted, an interval changing means requiring only a small load and a low speed operation is additionally provided. Only the driving mechanism of the board recognizing camera 39 can be simplified.

Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 2, the chip position detection unit 50 detects the position of the chip 5 on the wafer 4 based on image data captured by the first chip recognition camera 6. The first XY table driving section 51 drives the first XY table 2, and this chip is driven by a command from a main control section 57, which will be described later, based on the amount of displacement of the chip 5 detected by the chip position detecting section 50. 5 is corrected.

The chip position shift detecting section 53, which is electronic component position shift detecting means, performs image processing of the image data of the chip 5 on the mounting table 23 taken by the second chip recognition camera 25 to perform the position of the chip 5. Detect the deviation. The second X
The Y-table driving unit 54 drives the second XY table 21. At this time, based on the positional deviation amount of the chip 5 detected by the chip positional deviation detecting unit 53, similarly, the mounting stage is instructed by the main control unit 57. The displacement of the upper chip 5 is corrected.

The reversing head driving section 52 drives the reversing head unit 7. The main control unit 57 controls the supply unit 1, the transfer head 10, and the reversing head unit 7 (see the respective elements in the ranges 58, 59, and 60 surrounded by chain lines). . Further, the position data of the chip 5 detected by the chip position shift detecting section 53 is sent to the main control section 57 as mounting position correction data.

The motor control unit 55 determines the Z of the transfer head 10
Axis motor 14a, first linear motor 13, Z-axis motor 33a of mounting head 30, second linear motor 32, θ
The axis motor 36, the camera Y-axis motor 38, and the X-axis motor 41a of the substrate holding unit 40 are controlled. The board position shift detecting section 56 detects the position shift of the board 44 based on the image data of the board 44 captured by the board recognition camera 39, and sends the detection result to the main control section 57 as position correction data at the time of mounting.

The main control unit 57 controls the overall operation of each of the above-described units and controls the mounting based on the position data of the chip 5 and the substrate 44 sent from the chip position deviation detection unit 53 and the substrate position deviation detection unit 56. The amount of displacement correction at the time is calculated. The mounting head 30, the second linear motor 32, the X-axis table 41,
Is controlled, the displacement at the time of mounting the chip 5 on the substrate 44 is corrected. That is, the main control unit 57, the mounting head 30, the second linear motor 32, the X-axis table 4
Reference numeral 1 denotes a second displacement correcting unit.

This electronic component mounting apparatus is configured as described above, and its operation will be described below. In FIG.
Chips 5 are sequentially picked up from the wafer 4 held on the holder 3 by the reverse suction nozzle 9.
Chip 5 based on the imaging result of the chip recognition camera 6 of FIG.
Is driven by the first XY table 2 to perform position correction in the XY directions. Therefore, the reverse suction nozzle 9 accurately picks up the center of the chip 5 by sucking it.

Thereafter, the chip 5 is held at the transfer position to the transfer head 10 by turning the turn table 8 and turning the reverse suction nozzle 9 to reverse. Next, the suction nozzle 15 that has been waiting above the transfer position moves up and down to suck and pick up the chip 5 and moves onto the mounting stage 23. Then, the suction nozzle 15 moves up and down again, so that the chip 5 is placed on the mounting stage 23.
Is transferred onto the transparent plate 24 of FIG.

When the transfer head 10 has retreated from the mounting stage 23, the mounting head 30 is positioned above the mounting stage 23. At this time, the lower surface of the chip 5 on the plate 24 is imaged by the second chip recognition camera 25. The plate 24 is transparent and does not hinder imaging from below. Then, based on the image data of the lower surface of the chip 5, the position of the chip 5 is detected by the chip position shift detecting unit 53, and the position shift in the XY direction and the θ direction is detected.

Next, the mounting head 3 is mounted on the chip 5.
The pickup tool 35 is lowered and picked up.
At this time, the positional deviation of the chip 5 is corrected by driving the second XY table 21 for the positional deviation in the XY directions, and by driving the θ-axis motor 36 before suctioning the positional deviation in the θ direction. Is done. Therefore, the suction tool 35
Can correctly hold the center of the chip 5 without being displaced or tilted.

Next, when the suction tool 35 sucks the chip 5 by vacuum, the lower surface of the chip 5 is lifted slightly (small gap c) from the mounting stage 23 as shown in FIG. Re-image. Since the gap c is set so that the chip 5 is within the range of the depth of focus of the second chip recognition camera 25, a good image can be obtained even when the chip 5 is raised and picked up.

At this time, the holding position is set so that the height position of the held chip 5 matches the height position when the chip 5 is mounted on the substrate 44 as shown in FIG. . Thereby, the lower surface of the chip 5 can be imaged in a state in which the horizontal displacement caused by the vertical movement of the nozzle 34 of the mounting head 30 is completely eliminated, and the error due to the difference in height at the time of imaging can be reduced. It is possible to obtain highly accurate position correction data. And the chip 5 obtained here
Is sent to the main controller 57 (see FIG. 2).

The board 44 is imaged by the board recognition camera 39 in parallel with the timing at which the mounting head 30 performs the above-described operation on the mounting section 20. At this time, the mounting head 30 is always at a fixed position on the mounting stage 23, but the area to be imaged on the substrate 44 is the chip 5
Is different depending on the mounting point at which the substrate 5 is mounted, so that each time the chip 5 is mounted, the board recognition camera 39 is positioned above the mounting point. This operation is performed by changing the distance between the board recognition camera 39 and the mounting head 30 by driving the motor 38 as necessary.
This is performed by adjusting the position in the X direction and driving the X-axis motor 41a to adjust the position in the X direction.

Thus, when the chip 5 is picked up by the mounting stage 23, the displacement of the chip 5 is detected,
The detection of the displacement of the mounting point of the board 44 is performed simultaneously and in parallel, so that the time required for the detection of the displacement can be reduced as compared with the conventional method of detecting the displacement twice at individual timing.

After that, the mounting head 30 picking up the chip 5 moves onto the substrate 44 and lowers the suction tool 35 to mount the chip 5 on the mounting point of the substrate 44. At this time, the main controller 57 calculates a position shift correction amount for correcting the position shift between the chip 5 and the substrate 44, and the alignment is performed in consideration of the position shift correction amount. Is performed at the height position at which the chip 5 is mounted on the substrate 44, so that the suction tool 3
The error caused by the vertical movement of 5 is eliminated, and highly accurate positional deviation correction can be performed. Further, since the suction tool 35 is mounted on the substrate 44 by pressing the chip 5 in a state where the center of the chip 5 is held in a correct posture, the mounting accuracy is secured and the suction tool 3 is mounted.
A mounting defect such as an inclination of the chip 5 due to a relative displacement between the chip 5 and the chip 5 does not occur, and therefore, good and uniform crimping quality can be obtained.

Further, as shown in this embodiment,
0 is provided between the supply unit 1 and the substrate holding unit 40,
Is mounted on the mounting stage 23 of the mounting unit 20 once, and the stroke in which the transfer head 10 and the mounting head 30 move in each cycle causes the chip 5 to move to the supply unit 1. Approximately half the method of transferring the image directly onto the substrate 44 from the above. Therefore, the time required for transporting the chip 5 in each cycle is reduced, and in combination with the effect of reducing the time required for detecting the positional deviation described above,
Tact time can be greatly reduced and productivity can be improved.

[0041]

According to the present invention, an electronic component mounting portion is provided at an intermediate position between the electronic component supply portion and the substrate holding table.
With the electronic component mounted on the transparent mounting stage of the mounting portion, the electronic component is imaged from below and the substrate recognition camera is used to image the substrate at the same time. Imaging can be performed simultaneously and concurrently to detect misalignment, and the stroke in which electronic components are transported in each cycle can be reduced by almost half, thus significantly reducing the cycle time for mounting electronic components. As a result, productivity can be improved. Also,
The mounting part is provided with electronic component misalignment correction means, and the electronic component is held by the mounting head with the misalignment corrected, so that even in the case of a small electronic component, the center of the electronic component can be properly held. Since it can be pressure-bonded to the substrate, mounting accuracy can be ensured, and good and uniform pressure-bonding quality without displacement or inclination of posture can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a partial front view of the electronic component mounting apparatus according to the embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 1 supply unit 5 chip 6 first chip recognition camera 10 transfer head 11 Y-axis table 20 mounting unit 21 second XY table 23 mounting stage 25 second chip recognition camera 30 mounting head 38 camera Y-axis motor 39 Board recognition camera 40 Board holding unit 44 Board 57 Main control unit

Claims (5)

[Claims] 1. An electronic device comprising: a supply section for an electronic component; a substrate holding section for holding a substrate on which the electronic component is mounted; and a transparent mounting stage disposed between the substrate holding section and the supply section. A component mounting section, a transfer means for transferring electronic components from the supply section onto the mounting stage, a mounting head for picking up the electronic components of the mounting stage and mounting the electronic components on the substrate; A moving member for moving the head from the mounting portion to above the substrate holding portion; positioning means for positioning the mounting head relative to the substrate on the substrate holding portion; Electronic component imaging means for imaging the component from below, electronic component displacement detection means for detecting a displacement of the electronic component based on an imaging result of the electronic component imaging means, and an Board imaging means for capturing an image of a board on a unit, an interval changing means for changing an interval between the board imaging means and the mounting head, and a board position for detecting a displacement of the board based on an imaging result by the board imaging means A displacement detection unit, and a displacement correction unit that corrects a displacement when the electronic component is mounted on the board based on the detection result of the displacement of the board and the detection result of the displacement of the electronic component. Characteristic electronic component mounting device. An electronic component supply unit; a substrate holding unit for holding a substrate on which the electronic component is mounted; a mounting unit for an electronic component having a transparent mounting stage; A transfer unit for transferring the electronic component from the supply unit, a mounting head for picking up the electronic component of the mounting stage and mounting the electronic component on the substrate, and a mounting head relative to the substrate on the substrate holding unit. Positioning means for positioning the electronic component on the mounting stage, electronic component imaging means for imaging the electronic component on the mounting stage from below, and electronic component displacement for detecting the displacement of the electronic component based on the result of imaging by the electronic component imaging means. Detecting means for correcting a displacement of the electronic component when the mounting head picks up the electronic component on the mounting stage based on a detection result of the displacement of the electronic component; Correction means, substrate imaging means for imaging a substrate on the substrate holding table, substrate displacement detection means for detecting a displacement of the substrate based on an image obtained by the substrate imaging means, and displacement detection of the substrate A second step of correcting the displacement of the electronic component when the electronic component is mounted on the board based on the result and the detection result of the displacement of the electronic component.
An electronic component mounting apparatus comprising: 3. A transparent mounting means for transferring an electronic component from an electronic component supply portion to a mounting portion disposed between the substrate holding portion for holding a substrate on which the electronic component is mounted and the supply portion. Transferring the electronic component on the mounting stage, picking up the electronic component on the mounting stage by the mounting head, and imaging the electronic component from below by electronic component imaging means when picking up the electronic component; Detecting a position shift of the electronic component based on an imaging result of the electronic component imaging unit; and disposing the electronic component on a moving member on which the mounting head is mounted, and setting a distance between the mounting head and the mounting head in advance by a distance changing unit. Imaging a substrate held by the substrate holding unit by the set substrate imaging unit; detecting a displacement of the substrate based on an imaging result of the substrate imaging unit; Moving the mounting head from the mounting portion to the substrate by moving the material, and the position shift correcting means based on the detection result of the position shift of the substrate and the result of the detection of the position shift of the electronic component. Correcting the displacement of the electronic component when the electronic component is mounted on the substrate. 4. A step of transferring an electronic component from a supply section of the electronic component to a mounting section provided with a transparent mounting stage by a transfer means, and imaging the electronic component on the mounting stage from below. Means for capturing an image, a step for detecting a displacement of the electronic component based on the result of the imaging, and a step for correcting the displacement by a first displacement correcting means based on the result of the displacement detection, and A step of picking up the electronic component, a step of re-imaging the electronic component held by the mounting head after the pick-up by the electronic component imaging means, and detecting a displacement of the electronic component; A step of imaging the substrate by the substrate imaging means and detecting a displacement of the substrate; and a step of detecting the displacement of the substrate and a result of the displacement when re-imaging the electronic component. Mounting method of electronic components, which comprises a step of correcting the positional deviation at the time of mounting to the substrate of the electronic component by the second positional deviation correcting means are. 5. The electronic component according to claim 4, wherein when re-imaging the electronic component, a height position of the electronic component is held at a mounting height position on a substrate held by a substrate holding table. How to mount electronic components.