JP2712463B2 - Inner lead bonder - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an inner lead bonder for bonding an IC chip to inner leads of a film carrier.

2. Description of the Related Art In a conventional inner lead bonder, a bonding position can be set at an appropriate position on a film carrier transfer path, and a recognition means for recognizing a position of an inner lead to be bonded can be moved in the X-Y direction. XY direction where the IC chip mounting position is set on the side of the bonding position, the recognition means for recognizing the position of the IC chip is disposed above the IC chip mounting position, and the stage on which the IC chip is mounted is disposed. A movable XY table is provided, and the stage is reciprocated between the IC chip mounting position and the bonding position on the XY table.

In the above configuration, the IC chip is mounted on the stage at the IC chip mounting position, and then the XY table is appropriately moved in the X direction and the Y direction, so that a pair of diagonally opposite corners of the IC chip are disposed. At the bonding position, the inner lead position corresponding to the bump on the carrier film is recognized by moving the recognition means in the X and Y directions, and then the XY table is moved. The stage on which the chip is mounted is positioned below the bonding position of the carrier film, and at that time, the position of the XY table is finely adjusted in the X and Y directions to correct the displacement between the bump and the inner lead. The bumps and the inner leads are completely matched, and bonding is performed with a bonding head in that state.

The illumination for recognizing the film carrier at the bonding position is performed by irradiating illumination light from above.

SUMMARY OF THE INVENTION However, in the configuration of the inner lead bonder as described above, in order to recognize the position of the pair of bumps at the diagonal positions of the IC chip and the position of the corresponding inner lead, the X-Y
The table and the recognition means need to be moved in the X and Y directions, and then the XY table is moved in two directions, the X direction and the Y direction, in order to correct the displacement between the bump and the inner lead even when the XY table is moved. Therefore, it takes a long time to start the bonding operation, and it is difficult to speed up the bonding operation.

In addition, since the illumination for the film carrier is made from above, the image tends to have a small contrast,
Recognition at high speed may cause erroneous recognition.

An object of the present invention is to provide an inner lead bonder capable of high-speed bonding in view of the above-mentioned conventional problems.

Means for Solving the Problems In order to achieve the above object, the present invention provides a means for transferring a film carrier having an inner lead, a stage for mounting an IC chip, a stage on which this stage is arranged, and A moving table for reciprocating between a bonding position immediately below and an IC chip mounting position on a side thereof, and a predetermined table for each object disposed above the bonding position and the IC chip mounting position, respectively. In an inner lead bonder provided with a pair of recognition units having a pair of recognition units for simultaneously recognizing two places, an illuminating unit for illuminating an inner lead of a film carrier from below is arranged on the moving table.

According to the present invention, two predetermined locations of the IC chip mounted on the stage are recognized at once by the pair of recognition means at the IC chip mounting position, and at the same time, the corresponding predetermined position of the film carrier is determined at the bonding position. By recognizing the two inner leads at once with a pair of recognition means, it is possible to detect the displacement between the IC chip and the inner leads in one step, and then move the moving table linearly to move the stage to the bonding position. One operation is performed by correcting the positional deviation of the moving table in the moving direction in accordance with the detected positional deviation, and at the same time, finely adjusting the position of the film carrier by the transporting means to correct the positional deviation in the film carrier transporting direction. Can be used to match the bumps on the IC chip with the inner leads on the film carrier. It is possible to perform the operation, it is possible to achieve the speed of the bonding operation.

Further, if the film carrier is illuminated from below by arranging the illuminating means on the moving table, an image with high contrast can be obtained.

Embodiment An embodiment of the present invention will be described below with reference to FIGS.

In FIG. 2, reference numeral 1 denotes a supply unit of an IC chip 2, and a plurality of wafer rings 3 supporting a large number of IC chips 2 in a state of being arranged at intervals with each other are set on a rotary table 4, An IC chip 2 is provided on the side of the turntable 4.
Means 5 for restricting the position and posture of the IC chip 2 and a reciprocating rotation within an angle range of 90 °, and the mounting position of the IC chip 2 from the IC chip 2 and the wafer ring 3 onto the regulating means 5 and from the regulating means 5 Transfer arms 6 for supplying the transfer arms 11 respectively are arranged.

Reference numeral 7 denotes a film carrier, which is sent from a supply reel 8, transferred on a predetermined path at a predetermined pitch by a transfer means 10, bonded to the IC chip 2 at a bonding position 12, and then wound on a take-up reel 9. A straight line connecting the bonding position 12 and the IC chip mounting position 11 is orthogonal to the transport direction of the film carrier 7.

In FIGS. 1 and 2, the IC chip 2 supplied to the IC chip mounting position 11 by the transfer arm 6 is moved by a moving table.
It is mounted on a stage 14 arranged on 13. The moving table 13 is movably supported so that the stage 14 can linearly reciprocate between the IC chip mounting position 11 and the bonding position 12, and is screwed to a nut 15 fixed to the lower surface of the moving table 13. The configured ball screw 16 is rotated by a motor 17 to be driven. When the stage 14 is located at the mounting position 11 on the moving table 13, the illuminating means 18 is located at a position facing the bonding position 12.
Are arranged to illuminate the inner leads of the film carrier 7 from below.

Above the placement position 11 and the bonding position 12, recognition oil mitts 20, 21 are arranged, respectively. These recognition units 20 and 21 respectively recognize a pair of bumps located at diagonal corners of the IC chip 2 at the mounting position and a pair of inner leads of the film carrier at the bonding position 12 corresponding thereto. As shown in FIG. Further, an optical path 23 through which the images at the respective target positions are incident on the recognition camera 22 is constituted by a plurality of prisms 24 appropriately arranged. Illumination means 25 for illuminating the upper surface of the IC chip 2 is arranged below the recognition unit 20 above the IC chip mounting position 11. 26, 27
Is a recognition device of each of the recognition units 20 and 21, and a signal is input from each pair of recognition cameras 22.

Reference numeral 28 denotes a bonding head that moves from the standby position beside the bonding position 12 to the bonding-in position 12 and moves downward as shown by an arrow 30 in FIG. 3 to bond the bumps of the IC chip 2 to the inner leads. It is mounted on a movable block 29 movable between a position and a bonding position so as to be able to move up and down.

 Next, the operation will be described.

The IC chips 2 on the wafer ring 3 of the supply unit 1 are sequentially mounted on the stage 14 at the IC chip mounting position 11 by the transfer arm 6. During this time, the film carrier 7 is fed by the transfer means 10 at a predetermined pitch, and the inner lead group to which the IC chip 2 is to be bonded next is sequentially positioned at the bonding position 12. Next, at the IC chip mounting position 11, two diagonal positions of the IC chip 2 are recognized by a pair of recognition cameras of the recognition unit 20.
Recognize at once at 22. At the same time bonding position
At 12, the pair of recognition cameras 22 of the recognition unit 21 recognize two predetermined inner leads of the group of inner leads of the film carrier 7 at a time. Thus, the displacement between the bumps and the inner leads of the IC chip 2 to be bonded to each other can be detected in one step. Further, when recognizing the inner lead, the inner lead is illuminated from below by the illuminating means 18 arranged on the moving table 13, so that an image with a large contrast can be obtained, and there is no possibility of erroneous recognition even at high speed. .

After that, the moving table 13 is linearly moved and the stage 14 is moved.
Is moved to the bonding position 12, the displacement of the moving table 13 in the moving direction detected by the recognition units 20 and 21 is corrected, and at the same time, the position of the film carrier 7 is finely adjusted by the transfer means 10. By correcting the displacement in the carrier transfer direction,
The bumps of the IC chip 2 and the inner leads of the film carrier 7 can be completely matched in one operation.

Thereafter, the bonding head 28 bonds the bumps of the IC chip 2 to the inner leads of the film carrier 7.

As described above, according to the present embodiment, a plurality of locations of the IC chip and the inner lead are recognized in one process to detect the displacement, and the displacement is corrected by one operation of the moving table 13 and the transfer means 10. Since the IC chip 2 and the inner lead are aligned and immediately bonded, the speed of the bonding operation can be increased.

Instead of the bonding head 28, as shown in FIGS. 4 and 5, a bonding head 31 integrally formed of ceramics such as silicon nitride including a heating unit may be used. The bonding head 31 includes a mounting plate portion 31a to be mounted on the lower surface of the movable block 29, a connecting shaft portion 31b hanging from the lower surface, a heating portion 31c formed of a rectangular parallelepiped block, and a pressing portion 31d protruding from the lower surface. It has. Heater mounting holes 32 on both sides of the heating unit 31c,
A thermocouple mounting hole 33 is formed immediately above the pressurizing portion 31d, and a heater 34 and a thermocouple 35 for temperature detection are mounted respectively. Further, a bolt hole 36 is formed in the mounting plate portion 31a, and the bolt hole 37 is fastened and fixed to the lower surface of the movable block 29. Although the rod-shaped thermocouple 35 is illustrated in the illustrated example, a linear thermocouple may be used.

When integrally formed of ceramics as described above, a highly durable bonding head can be obtained.

Effects of the Invention According to the inner lead bonder of the present invention, the predetermined two positions corresponding to the IC chip mounting position and the bonding position respectively.
A part can be recognized at once by a pair of recognition means,
In one process, the displacement between the IC chip and the inner lead can be detected, and then the moving table is moved to move the stage to the bonding position, and the displacement of the moving table in the moving direction is corrected. By correcting the displacement in the carrier transfer direction, the bump of the IC chip and the inner lead of the film carrier can be matched in one operation, so that the speed of bonding can be increased.

Further, when the illumination means of the moving table is arranged and the film carrier is illuminated from below, an image having a large contrast can be obtained.

[Brief description of the drawings]

FIG. 1 is a side view showing a schematic configuration of an embodiment of the present invention, FIG. 2 is an overall perspective view of the same, FIG. 3 is a detailed side view at the time of a bonding operation in a portion A in FIG. 2, FIG. FIG. 5 shows another embodiment of the bonding head, FIG. 4 is a longitudinal sectional view, and FIG. 5 is an exploded perspective view. 2 ... IC chip, 7 ... Film carrier, 10 ... Transfer means, 11 ... Placement position of IC chip 2, 12 ... Bonding position, 13 ... Transfer table, 14 ... Stage, 18 ...
Illumination means, 20, 21, ... recognition unit, 22 ... recognition camera.

Claims (1)

(57) [Claims] 1. A means for transferring a film carrier having inner leads, a stage on which an IC chip is mounted, and a stage on which the stage is disposed and which is mounted on a bonding position immediately below the film carrier and an IC chip mounting side of the bonding position. A moving table for reciprocating between a mounting position and a pair of recognition means disposed above the bonding position and the IC chip mounting position, and a pair of recognizing means for simultaneously recognizing predetermined two places of each object. An illumination device for illuminating an inner lead of a film carrier from below is provided on the moving table.