JPS63293403A - Recognizing device for chip component - Google Patents

Abstract

PURPOSE:To recognize the position shift and inclination of a chip component and to perform flip chip bonding with high accuracy by picking up an image of the package surface of the chip component and finding the position of a bump. CONSTITUTION:An IC chip 12 is sucked by a mount head 11 from an IC chip supply part and moves onto a chip component recognizing device 1 with the surface of the bump 13 down, an optical system 14 projects a vertical parallel light beam 16 on the package surface of the chip 12, and a camera 15 picks up its image. Here, the optical axis of the camera 15 is adjusted and aligned with the optical axis of the light beam 16 and the center axis of the head 11, and the picked-up image is converted by an image processor with a proper threshold value into a binary signal so that the part of the bump 13 is black and other parts are white. Here, the image processor finds the position and inclination correction quantity at the time of the flip chip bonding of the chip 12 to a circuit board 12 from the relation among the position coordinates of the centers of gravity of three bumps 81, 82, and 83 among 16 bumps.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention is applied to a chip component mounting apparatus that performs flip-chip bonding of chip components to a circuit board. The present invention relates to a chip component recognition device that recognizes misalignment and inclination of components.

[Summary of the invention]

The present invention provides a chip component recognition device that recognizes positional deviation and inclination of the chip component during transportation in a chip component mounting device that performs flip-chip bonding of the chip component to a circuit board. The positional shift and inclination of the chip component are recognized by capturing an image using an imaging device, processing the obtained image information, and recognizing the position of the bump on the chip component.

[Conventional technology]

A conventional chip component recognition device that recognizes the positional deviation and inclination of a chip component during transportation in order to correct the position and inclination of the chip component, as shown in FIG. The component 22 is attached and moved onto an imaging device 21 such as a camera, and the illumination 23 is irradiated from above the chip component 22 as shown in the figure. The image was captured as a silhouette image 31. The obtained silhouette image 31 is then image-processed to create the silhouette image 3.
1, position recognition is performed to determine the center of gravity position of the chip component 22 and its inclination based on the principal axis of inertia.

On the other hand, as a device for correcting the position and inclination of a chip component without using an optical recognition device, adjusting claws 4a, 4b, 4c, and 4d as shown in FIG. 4 are used to apply mechanical force. Devices that perform position correction are also known.

[Problem that the invention seeks to solve]

However, in the conventional device for recognizing the position and inclination of a chip component, recognition of the position and inclination of the chip component is performed based on the external shape. On the other hand, in chip components mounted on a circuit board by flip chip bonding, the positional relationship between the chip component's external shape and the bumps is not necessarily manufactured with high precision. It is not suitable for flip chip bonding, which directly connects the upper pattern to the bumps on the chip component. Therefore, according to such a recognition device, it is necessary to manufacture chip components with high accuracy based on the external shape, and there is a limit to the process capacity.

Additionally, if the pitch between the bumps is coarse and the shape of the bumps is large, it is possible to use flip-chip bonding for mounting, but as densification continues to advance, the pitch between the bumps will become finer and the shape of the bumps will become minute. In this case, it is no longer possible to implement flip-chip bonding based on external dimensions.

Therefore, in order to solve these conventional drawbacks, the present invention recognizes the position and inclination based on bumps instead of recognizing the position and inclination based on the external shape. The purpose is to provide a parts recognition device.

[Means for solving problems]

In order to solve the above problems, the present invention captures an image of the mounting surface of a chip component to be flip-chip bonded using an imaging device such as a camera, and determines the position of the bump on the chip component by using the reflection between the bump and other parts. The position and inclination of the chip component can be recognized by recognizing the difference in rate.

Furthermore, irradiating a parallel light beam perpendicular to the mounting surface of the chip component is used as an auxiliary means for recognizing the position of the bump in order to recognize the position and inclination of the chip component.

[Effect]

If the position of the bump on the chip component to be flip-chip bonded is recognized as described above, the position and tilt of the chip component can be determined based on the bump.

Furthermore, when a parallel light beam perpendicular to the mounting surface of the chip component is irradiated, the parallel light beam hits the mounting surface of the chip component and bounces off perpendicularly to areas other than the bumps, as shown in Figure 5, and the light beam to the bumps hits the bump surface. Diffusely reflected. Therefore, since the amount of light reaching an imaging device such as a camera from the bump and the part other than the bump of the chip component is different, the image becomes an image with good contrast as shown in Fig. 6, and the shape of the bump is clear, and the image processing This allows for even more accurate bump position recognition.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

FIG. 1 is a side view showing the main parts of an embodiment of the chip component recognition device according to the present invention together with the chip components being transported. In FIG. It is then attracted by the mounting head 11 and moved onto the chip component recognition device 1 as shown in the figure. Further, the IC chip 12 is held with the mounting surface, that is, the bumps 13 facing downward. An optical system 14 for irradiating parallel light rays 16 perpendicular to the mounting surface of the IC chip 12 is held in the center of the chip component recognition device 1 by a holding means (not shown). The optical system 14 includes two cylindrical lenses 1a and 1b, a beam splinter IC, and a halogen lamp 1d. Further, a camera 15 is held by a holding means (not shown) below the chip component recognition section, and is connected to an image processing device (not shown). Also, as shown in the figure, the optical axis of the camera 15.

The optical axis of the parallel light beam 16 and the center of the mounting head 11 are adjusted to coincide with each other. Mounted head 11 is camera 1
It is designed to move up and down so that it can be brought into focus with 5.

Next, the position and inclination of the chip component by the apparatus of the present invention having the above-described structure will be explained.

FIG. 7 shows the shape of the IC chip component 12 and the arrangement of bumps 13, which will be explained below. The bumps 13 are solder bumps, and as shown in the figure, 16 solder bumps are arranged symmetrically, five each, on the mounting surface.

When the image captured by the camera 15 with the configuration shown in FIG. 1 is binarized using an appropriate threshold value using the image processing device,
The image will be as shown in Figure 8. The bump 12 portion is black, and the other portions are white.

Here, the coordinates of the position of the center of gravity of the black portion, that is, the bump, are determined from this image by the image processing device.

Next, of the 16 bumps in Figure 8, 81.82.83
The three center of gravity position coordinates in the part are (XI, Yl)
, (X2. Y2).

(X3.Y3), the center position (X, Y) of the IC chip based on the bump on the image is (X, Y) - ((X1+X3)/2. (Y1+Y3) due to the relationship between these three points.
/2), and θ around f is tan-'θ-(Yl-Y
2)/(χ1-X2). Using this information, it is possible to determine the amount of correction for the position and inclination when flip-chip bonding the IC chi-knob.

In addition, in the case shown in Figure 8, the bump positions are vertically and horizontally symmetrical, so the center position of the IC chip was determined using the method described above. cannot be determined, but by performing arithmetic calculations similar to those shown in Figure 8 for the positional relationship of the bumps, it is possible to determine the displacement and inclination of any reference position on the IC chip, and from that information the flip IC for chip bonding
It is clear that the amount of correction for the position and tilt of the chip can be determined.

〔Effect of the invention〕

As described above, the present invention recognizes the positional deviation and inclination of the chip component by determining the position of the bump on the chip component, so it is possible to perform flip chip bonding with high precision compared to the conventional recognition based on external shape. There is an effect that it can be done. In addition, since there is no need to manufacture chip components with high accuracy in terms of the external shape and the position of bumps, there is also the effect that chip components can be supplied at low cost.

[Brief explanation of the drawing]

FIG. 1 is a side view showing a main part of an embodiment of a chip component recognition device according to the present invention together with an IC chip, FIG. 2 is a side view showing a main part of a conventional chip component recognition device together with a chip component, and FIG. is a diagram showing an image of a chip component by a conventional recognition device, FIG. 4 is a diagram showing mechanical position correction of a chip component, FIG. 5 is a trajectory diagram of parallel rays explaining the present invention in detail, and FIG. , FIG. 8 is an image diagram of the bump portion on the chip component of the recognition device according to the embodiment of the present invention, and FIGS. 7 and 9 are schematic diagrams of the bump arrangement of the chip component used in the embodiment of the present invention. . ■...Chip component recognition device 11...Mounting head 12...IC chip 13...Bump 14...Optical system 15...Camera and above Applicant Seiko Electronic Industries Co., Ltd. Figure 3 Figure 4 Figure 5

Claims (2)

[Claims] (1) In a chip component recognition device of a chip component mounting apparatus that attaches chip components supplied from a chip component supply section to a mounting head, sequentially conveys them, and performs flip-chip bonding to predetermined positions on a circuit board, the chip components are The mounting surface of the component is imaged using an imaging device such as a camera, and the obtained image information is image-processed to recognize the position of the bump on the chip component, and the positional shift and inclination of the chip component are recognized using this information. A chip component recognition device characterized by recognizing. (2) In recognizing the position of the bump on the chip component, when capturing an image of the mounting surface of the chip component using an imaging device such as a camera, a parallel light beam perpendicular to the mounting surface is irradiated. A chip component recognition device according to claim 1.